A vacuum wafer heater lifting mechanism

Abstract

The present invention discloses a vacuum wafer heater lifting mechanism, comprising: a cavity; a base arranged in the cavity; a base arranged below the cavity, the base being connected to a supporting shaft of the base; a leveling device arranged between the cavity and the base; a connecting assembly connecting the base and the leveling device; the leveling device comprising a leveling plate, a vertical rod, a first vertical adjustment member and a second vertical adjustment member; the upper end of the vertical rod is connected to the lower wall of the cavity, the lower end of the vertical rod is rotatably connected to the first end of the leveling plate, the first vertical adjustment member and the second vertical adjustment member are arranged at the second end of the leveling plate, and are used to respectively adjust the distance of the second end of the leveling plate relative to the lower wall. The leveling device of the present invention adopts three-point positioning and is adjusted on one side, which is convenient for manual operation and simple to adjust.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to the field of pedestal adjustment technology for semiconductor equipment. Background Art

[0002] Semiconductor equipment is equipment for making chips. As process nodes continue to advance downward, semiconductor equipment has become the core of the downward breakthrough of advanced process chips.

[0003] In some semiconductor equipment, such as CVD, epitaxy, rapid thermal processing (RTP), etching, etc., a heater needs to be set in the base to heat the wafer during the process to provide the process temperature required for the process and finally complete the processing process.

[0004] In the prior art, with the advancement of process nodes, the wafer has higher and higher requirements for heating uniformity, airflow distribution uniformity and plasma distribution uniformity. Therefore, in order to ensure the uniformity of the above processes, the prior art generally uses a base with adjustable horizontality to support the wafer. However, the horizontal adjustment mechanism of the prior art is not easy to operate in a small space, and the steps are cumbersome, difficult to control, and the mechanism is complex. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a vacuum wafer heater lifting mechanism, which can solve the problems that the leveling device of the base is difficult to operate in a small space, the operation is cumbersome and difficult to control.

[0006] To achieve the above object, the present invention provides a vacuum wafer heater lifting mechanism, comprising:

[0007] Cavity;

[0008] A base, which is disposed in the cavity and used to carry the wafer to be processed, and a heating component is disposed in the base;

[0009] A base, the base is arranged below the cavity and connected to a support shaft of the base;

[0010] A leveling device, the leveling device is arranged between the cavity and the base, and is used to adjust the horizontality of the base;

[0011] A connecting assembly, the connecting assembly connecting the base and the leveling device;

[0012] Wherein, the leveling device includes a leveling plate, a vertical rod, a first vertical adjustment member and a second vertical adjustment member; the upper end of the vertical rod is connected to the lower wall of the cavity, and the lower end of the vertical rod is rotatably connected to the first end of the leveling plate, and the first vertical adjustment member and the second vertical adjustment member are arranged at the second end of the leveling plate, and are used to respectively adjust the distance between the second end of the leveling plate and the lower wall, and the first end and the second end are opposite.

[0013] Optionally, the adjusting plate is arranged approximately horizontally, and the first vertical adjusting member and the second vertical adjusting member are arranged close to opposite sides of the adjusting plate, respectively.

[0014] Optionally, the first vertical adjustment member and the second vertical adjustment member both include a coarse adjustment component for roughly adjusting the distance between the second end of the adjustment plate and the lower wall.

[0015] Optionally, the coarse adjustment assembly includes a rod, an elastomer and a bolt; the upper end of the rod is connected to the lower wall of the cavity, and the lower end of the rod is movably connected to the adjusting plate; the elastomer is arranged between the lower wall and the upper surface of the adjusting plate, and is used to provide a downward force to the adjusting plate; the bolt is arranged on the lower surface of the adjusting plate and is threadedly connected to the lower end of the rod, and is used to roughly adjust the distance of the second end of the adjusting plate relative to the lower wall.

[0016] Optionally, the first vertical adjustment member and the second vertical adjustment member both include a fine adjustment assembly, which is arranged between the lower surface of the adjusting plate and the bolt, and is used to fine adjust the distance between the second end of the adjusting plate and the bolt, thereby adjusting the distance between the second end of the adjusting plate and the lower wall.

[0017] Optionally, the fine adjustment assembly includes two sliders with inclined surfaces and a push rod, the inclined surfaces of the two sliders are opposite to each other, and the push rod is used to push the inclined surface of one slider to slide relative to the inclined surface of the other slider.

[0018] Optionally, the two sliders include an upper slider and a lower slider, the inclined surface of the upper slider is arranged on its lower surface, and the inclined surface of the lower slider is arranged on its upper surface; the inclined surfaces of the upper slider and the lower slider both extend along a first direction, and the first direction is the direction of a line connecting the first end and the second end of the adjusting plate.

[0019] Optionally, the upper slider includes a convex plate, which is arranged on the lower surface of the upper slider near a side surface, and the side surface is the side surface of the upper slider near the second end of the adjusting plate. The convex plate is used to facilitate the reciprocating movement of the push rod along the first direction, thereby pushing the upper slider to move relative to the lower slider along the first direction.

[0020] Optionally, the convex plate is provided with a threaded hole, the push rod is provided with a thread matching the threaded hole, and the tail end of the push rod abuts against the side surface of the lower sliding block.

[0021] Optionally, a screwing head is provided at the head end of the push rod.

[0022] Optionally, the thickness of the upper sliding block increases from the first end to the second end of the adjustment plate to form an inclined surface of the upper sliding block.

[0023] Optionally, the elastic body is a pagoda spring, and the pagoda spring is sleeved on the rod.

[0024] Optionally, an Ω-shaped groove is provided on the upper surface of the base, and a cooling pipe is provided in the groove.

[0025] Optionally, it also includes a sealed bellows, which is sleeved on the support shaft of the base, the upper end of the bellows is connected to the lower wall of the cavity, and the lower end of the bellows is connected to the upper surface of the base.

[0026] Optionally, a ball head is provided at the lower end of the vertical rod, and a hemispherical groove is provided at the middle position of the first end of the adjustment plate, and the hemispherical groove cooperates with the ball head to achieve a rotational connection.

[0027] Optionally, the ball head is rotatably fixed in the hemispherical groove by two identical pressure plates.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The leveling device of the present invention has three points to support the leveling plate, and only two points need to be adjusted, namely the first vertical adjustment member and the second vertical adjustment member, which is simple to operate, has a small number of adjustment points, and is easy to adjust. Moreover, the first vertical adjustment member and the second vertical adjustment member are both close to the second end, avoiding a narrow space, which is convenient for the user to operate; moreover, the leveling device of the present invention has a simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 It is a schematic diagram of the structure of the vacuum wafer heater lifting mechanism of the present invention;

[0032] Figure 2 It is an enlarged schematic diagram of a partial structure of the vacuum wafer heater lifting mechanism of the present invention;

[0033] Figure 3 It is a side view of the leveling device of the present invention;

[0034] Figure 4 It is an enlarged schematic diagram of the first end of the leveling device of the present invention;

[0035] Figure 5 It is an enlarged schematic diagram of the second end of the leveling device of the present invention;

[0036] Figure 6 It is a schematic diagram of the base of the present invention. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Figure 1 FIG. 2 shows a schematic diagram of the structure of the vacuum wafer heater lifting mechanism of the present invention. Figure 1 As shown, the vacuum wafer heater lifting mechanism includes: a cavity 110, a base 150, a pedestal 120, a leveling device 200, a connecting assembly 140 and a driving device 130; the base 150 is arranged in the cavity 110, and is used to carry the wafer to be processed. A heating assembly is arranged in the base, and the heating assembly is used to provide the process temperature required by the process during the process to heat the wafer; the cavity includes a lower wall 111 and multiple side surfaces, thereby forming a sealed cavity. The pedestal 120 is arranged below the cavity, and the pedestal 120 is connected to the support shaft 160 of the pedestal 150; the leveling device 200 is arranged between the cavity 110 and the pedestal 120, and is used to adjust the horizontality of the pedestal 150; the connecting assembly 140 connects the pedestal 120 and the leveling device 200, and the driving device 130 is used to drive the pedestal 120 to move relative to the connecting assembly 140, such as up and down movement. The vacuum wafer heater lifting mechanism is, for example, at least one of CVD, epitaxy, etching, and rapid thermal processing equipment. Preferably, the vacuum wafer heater lifting mechanism is PECVD.

[0039] Figure 2 FIG. 1 shows an enlarged schematic diagram of a vacuum wafer heater lifting mechanism. Figure 2As shown, the leveling device 200 includes a leveling plate, a vertical rod 220, a first vertical adjustment member 230-1 and a second vertical adjustment member 230-2; the upper end 221 of the vertical rod 220 is connected to the lower wall 111 of the cavity, and the lower end of the vertical rod is rotatably connected to the first end 211 of the leveling plate. The first vertical adjustment member and the second vertical adjustment member are arranged at the second end 212 of the leveling plate, and are used to respectively adjust the distance between the second end 212 of the leveling plate and the lower wall, and the first end 211 and the second end 212 are opposite.

[0040] Preferably, the adjustment plate is arranged roughly horizontally, the adjustment plate is arranged around the support shaft 160, the vertical rod 220, the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2 are also arranged around the support shaft 160, the vertical rod 220 is close to the first end 211 of the adjustment plate, preferably, it is arranged in the middle position of the first end 211 of the adjustment plate; the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2 are close to the second end 212 of the adjustment plate, and the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2 are respectively close to the second end and close to the side adjacent to the second end The two sides, that is, the first vertical adjustment member and the second vertical adjustment member are respectively arranged close to the opposite sides of the leveling plate, and the positions of the vertical rod 220, the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2 form a triangle. Therefore, when in use, the user only needs to approach the second end 212 to adjust the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2. Therefore, the inconvenience of adjustment caused by the small space and the need to adjust multiple points are avoided. The leveling device 200 of the present invention only needs to adjust the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2, and the operation is simple.

[0041] Further preferably, the first end 211 is located at one side of the transmission cavity (TM), so when adjusting, the user only needs to move closer to the side away from the transmission cavity (ie, the second end 212), and since the side away from the transmission cavity has a larger space, the operation is more convenient.

[0042] Optionally, the adjustment plate is a rectangular plate, which is provided with a through hole extending vertically therethrough for the support shaft 160 to pass through. The first end and the second end are respectively located at two short sides of the rectangle.

[0043] Figure 3 FIG. 4 shows a side view of a vacuum wafer heater lifting mechanism, as shown in FIG. Figure 3 As shown, the connecting component 140 is a vertically extending guide member, the upper end of which is arranged on the lower surface of the second end 212 of the adjustment plate, and the lower end of which is connected to the base 120 . The connecting component 140 is parallel to the support shaft 160 .

[0044] Figure 4-Figure 5 An enlarged view of the leveling device 200 is shown. Figure 4-Figure 5 As shown, the first vertical adjustment member 230-1 and the second vertical adjustment member 230-2 both include a coarse adjustment assembly for roughly adjusting the distance between the second end 212 of the adjustment plate and the lower wall 111. Optionally, the coarse adjustment assembly includes a rod 231, an elastic body 232 and a bolt 233; the upper end of the rod 231 is connected to the lower wall 111 of the cavity, and the lower end of the rod is movably connected to the adjustment plate, that is, the adjustment plate can move up and down relative to the rod; the elastic body 232 is arranged between the lower wall 111 and the upper surface of the adjustment plate, and is used to provide a downward force to the adjustment plate; the bolt 233 is arranged on the lower surface of the adjustment plate, and is threadedly connected to the lower end of the rod 231, and is used to roughly adjust the distance between the second end 212 of the adjustment plate and the lower wall 111.

[0045] Further, the first vertical adjustment member and the second vertical adjustment member both include a fine adjustment assembly, the fine adjustment assembly is arranged between the lower surface of the adjustment plate and the bolt, and is used to finely adjust the distance between the second end 212 of the adjustment plate and the bolt 233, thereby adjusting the distance between the second end 212 of the adjustment plate and the lower wall 111. Optionally, the fine adjustment assembly includes two sliders with inclined surfaces and a push rod 239, the inclined surfaces of the two sliders are opposite, and the push rod is used to push the inclined surface of one slider to slide relative to the inclined surface of the other slider. Preferably, the two sliders include an upper slider 236 and a lower slider 238, the inclined surface of the upper slider 236 is arranged on its lower surface, and the inclined surface of the lower slider 238 is arranged on its upper surface; the inclined surfaces of the upper slider and the lower slider both extend along the first direction S, and the first direction S is the direction of the line connecting the first end and the second end of the adjustment plate. The upper slider 236 includes a protruding plate 235, which is arranged on the lower surface of the upper slider and close to a side surface 236-1. The side surface 236-1 is the side surface of the upper slider close to the second end of the adjustment plate. The protruding plate 235 is used to facilitate the reciprocating movement of the push rod 239 along the first direction S, thereby pushing the upper slider to move along the first direction S relative to the lower slider.

[0046] Optionally, the convex plate is provided with a threaded hole, the push rod 239 is provided with a thread matching the threaded hole, the tail end of the push rod abuts against the side 238-1 of the lower sliding block, and the side 238-1 is the side of the lower sliding block close to the second end 212 of the adjustment plate.

[0047] Optionally, a screwing head is provided at the head end of the push rod, so that the user can rotate it for fine adjustment. Since the push rod is provided near the second end 212 and the screwing head exceeds the plane where the second end 212 is located, it is more convenient for the user to operate.

[0048] Optionally, the thickness of the upper slider increases from the first end 211 of the adjustment plate to the second end 212 to form an inclined surface of the upper slider, and the inclined surface of the lower slider cooperates with the inclined surface of the upper slider, that is, the thickness decreases from the first end 211 to the second end 212 of the adjustment plate.

[0049] like Figure 4 As shown, a ball head 222 is provided at the lower end of the vertical rod, and a hemispherical groove is provided at the middle position of the first end 211 of the adjustment plate, and the hemispherical groove cooperates with the ball head to achieve rotational connection. Optionally, the ball head is rotationally fixed in the hemispherical groove by two identical pressing plates 223, and a 1 / 4 ball groove is provided on the lower surface of the pressing plate, so that two pressing plates can be assembled into a hemispherical groove, and the pressing plate 223 is fixed to the adjustment plate by threads. The upper end 221 of the vertical rod 220 is fixed to the lower wall 111 of the cavity by threads. The upper end of the rod 231 is also fixed to the lower wall 111 of the cavity by threads.

[0050] Optionally, the elastic body 232 is a pagoda spring, and the pagoda spring is sleeved on the rod.

[0051] Optionally, the vacuum wafer heater lifting mechanism also includes a sealed bellows 180, which is sleeved on the support shaft 160 of the base, the upper end of the bellows 180 is connected to the lower wall 111 of the cavity, and the lower end of the bellows is connected to the upper surface of the base 120. A sealing ring is arranged between the lower end of the bellows and the upper surface of the base 120, so as to seal the cavity. Negative pressure or even a vacuum state can be formed inside the cavity, thereby ensuring the pressure required during the process.

[0052] like Figure 6 As shown, optionally, an Ω-shaped groove 121 is provided on the upper surface of the base 120, and a cooling pipe 122 is provided in the groove 121. The pipe 122 is also Ω-shaped and is used for cooling. Since a heating component is provided on the base, heat will be transferred downward along the support shaft 160, thereby causing overheating near the base 120, resulting in failure of the sealing ring, etc. The provision of the cooling pipe 122 solves this problem.

[0053] When adjusting the present invention, first adjust the bolt 233 of the coarse adjustment assembly to roughly adjust the adjustment plate to a horizontal position. Under the downward pressure of the elastic body and the tightening action of the bolt, the adjustment plate remains stable. Driven by the adjustment plate, the connecting assembly 140 is driven, and then the horizontality of the support shaft 160 and the base 150 is changed. Then operate the push rod 239 of the fine adjustment assembly, and the push rod pushes the upper slider to move relative to the lower slider, thereby slightly adjusting the horizontality of the adjustment plate to achieve the final adjustment.

[0054] The leveling device of the present invention has three points to support the leveling plate, and only two points need to be adjusted, namely the first vertical adjustment member and the second vertical adjustment member, which is simple to operate, has a small number of adjustment points, and is easy to adjust. Moreover, the first vertical adjustment member and the second vertical adjustment member are both close to the second end, avoiding a narrow space, which is convenient for the user to operate; moreover, the leveling device of the present invention has a simple structure.

[0055] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A vacuum wafer heater lifting mechanism, characterized in that: include: Cavity; A base, which is disposed in the cavity and used to carry the wafer to be processed, and a heating component is disposed in the base; A base, the base is arranged below the cavity and connected to a support shaft of the base; A leveling device, the leveling device is arranged between the cavity and the base, and is used to adjust the horizontality of the base; A connecting assembly, the connecting assembly connecting the base and the leveling device; Wherein, the leveling device comprises a leveling plate, a vertical rod, a first vertical adjustment member and a second vertical adjustment member; the upper end of the vertical rod is connected to the lower wall of the cavity, the lower end of the vertical rod is rotatably connected to the first end of the leveling plate, the first vertical adjustment member and the second vertical adjustment member are arranged at the second end of the leveling plate, and are used to respectively adjust the distance between the second end of the leveling plate and the lower wall, and the first end and the second end are opposite; The adjusting plate is a rectangular plate, the first end and the second end are respectively located at two short sides of the rectangle, and the first end is located at one side of the transmission cavity; The first vertical adjustment member and the second vertical adjustment member each include a coarse adjustment assembly for roughly adjusting the distance of the second end of the adjustment plate relative to the lower wall; The coarse adjustment assembly includes a rod, an elastic body and a bolt; the upper end of the rod is connected to the lower wall of the cavity, and the lower end of the rod is movably connected to the adjustment plate; the elastic body is arranged between the lower wall and the upper surface of the adjustment plate, and is used to provide a downward force to the adjustment plate; the bolt is arranged on the lower surface of the adjustment plate, and is threadedly connected to the lower end of the rod, and is used to roughly adjust the distance between the second end of the adjustment plate and the lower wall; The first vertical adjustment member and the second vertical adjustment member each include a fine adjustment assembly, the fine adjustment assembly being disposed between the lower surface of the adjustment plate and the bolt, and being used to finely adjust the distance between the second end of the adjustment plate and the bolt, thereby adjusting the distance between the second end of the adjustment plate and the lower wall; The adjusting plate is arranged horizontally, and the first vertical adjusting member and the second vertical adjusting member are arranged close to opposite sides of the adjusting plate respectively; The fine adjustment assembly comprises two sliders with inclined surfaces and a push rod, wherein the inclined surfaces of the two sliders are opposite to each other, and the push rod is used to push the inclined surface of one slider to slide relative to the inclined surface of the other slider; The push rod reciprocates along a first direction, thereby pushing the slider to move relatively along the first direction; the first direction is the direction of a line connecting the first end and the second end of the adjustment plate.

2. The vacuum wafer heater lifting mechanism according to claim 1, characterized in that: The two sliders include an upper slider and a lower slider. The upper slider has an inclined surface arranged on its lower surface, and the lower slider has an inclined surface arranged on its upper surface. The inclined surfaces of the upper slider and the lower slider both extend along a first direction.

3. The vacuum wafer heater lifting mechanism according to claim 2, characterized in that: The upper slider includes a convex plate, which is arranged on the lower surface of the upper slider near a side surface, and the side surface is the side surface of the upper slider near the second end of the adjustment plate. The convex plate is used to facilitate the reciprocating movement of the push rod along the first direction, thereby pushing the upper slider to move relative to the lower slider along the first direction.

4. The vacuum wafer heater lifting mechanism according to claim 3, characterized in that: The convex plate is provided with a threaded hole, the push rod is provided with a thread matched with the threaded hole, and the tail end of the push rod abuts against the side surface of the lower sliding block.

5. The vacuum wafer heater lifting mechanism according to claim 4, characterized in that: A screwing head is arranged at the head end of the push rod.

6. The vacuum wafer heater lifting mechanism according to claim 2, characterized in that: The thickness of the upper slider increases from the first end to the second end of the leveling plate to form an inclined surface of the upper slider.

7. The vacuum wafer heater lifting mechanism according to any one of claims 1 to 6, characterized in that: The elastic body is a pagoda spring, and the pagoda spring is sleeved on the rod.

8. The vacuum wafer heater lifting mechanism according to any one of claims 1 to 6, characterized in that: An Ω-shaped groove is arranged on the upper surface of the base, and a cooling pipe is arranged in the groove.

9. The vacuum wafer heater lifting mechanism according to any one of claims 1 to 6, characterized in that: It also includes a sealed bellows, which is sleeved on the supporting shaft of the base, the upper end of the bellows is connected to the lower wall of the cavity, and the lower end of the bellows is connected to the upper surface of the base.

10. The vacuum wafer heater lifting mechanism according to any one of claims 1 to 6, characterized in that: A ball head is arranged at the lower end of the vertical rod, and a hemispherical groove is arranged at the middle position of the first end of the adjustment plate. The hemispherical groove cooperates with the ball head to realize rotational connection.

11. The vacuum wafer heater lifting mechanism according to any one of claim 10, characterized in that: The ball head is rotatably fixed in the hemispherical groove by two identical pressing plates.

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