A ventilated and moisture-proof heat dissipation type power distribution cabinet

Abstract

The present invention relates to the technical field of power distribution cabinets, and in particular to a ventilated and moisture-proof heat-dissipating power distribution cabinet, which comprises a power distribution cabinet body, a heat dissipation mechanism and a guiding mechanism; by arranging the heat dissipation mechanism into a plurality of heat dissipation units, which are arranged one by one in correspondence with electronic components, the partial perception of abnormal temperature of the electronic components is made more accurate; when overheating occurs, the coolant in the corresponding heat dissipation unit evaporates, and re-condenses into liquid after heat exchange with other heat dissipation units or a shell; the liquid coolant is redistributed by the guiding mechanism to the heat dissipation units corresponding to the overheated part, thereby completing heat transfer at multiple locations in a short time and reducing the temperature of the overheated electronic components; at the same time, the flow of the coolant and its vapor makes the internal temperature of the entire power distribution cabinet tend to be consistent, thereby solving the problem that the temperature difference in the power distribution cabinet causes the intersection of cold and hot air in the installation cavity to produce condensed water, and the normal operation of the electronic components is affected by humidity.

Description

Technical Field

[0001] The invention relates to the technical field of power distribution cabinets, and in particular to a ventilated and moisture-proof heat-dissipating power distribution cabinet. Background Art

[0002] As the core of the modern energy system, smart grid is leading the power industry to develop in a more efficient, environmentally friendly and intelligent direction. By integrating advanced communication technology, information technology and control technology, it realizes real-time monitoring and optimized management of power production, transmission, distribution and power consumption, greatly promoting the realization of energy conservation and emission reduction goals. Under this framework, the intelligent upgrade of distribution cabinets, as an indispensable terminal device in smart grids, is particularly critical.

[0003] Smart distribution cabinets not only have the basic functions of traditional distribution cabinets, such as safe distribution of electric energy and protection of line equipment, but also incorporate high-tech elements such as intelligent monitoring, remote control, and data analysis. They can monitor power quality, load conditions, and fault warnings in real time, automatically adjust power supply strategies, and ensure stable operation of the power grid while effectively reducing energy waste and promoting energy conservation and emission reduction. Through the optimized configuration of smart distribution cabinets, the power system can respond more flexibly to the electricity needs of different users and achieve a balance between supply and demand, thereby reducing carbon emissions at the source and helping to build a green and low-carbon energy environment.

[0004] A large number of electrical components and equipment are integrated inside the power distribution cabinet, such as circuit breakers, contactors, transformers, etc. These devices will generate a lot of heat when working. If the heat cannot be dissipated in time, the temperature inside the power distribution cabinet will rise, which will affect the performance and life of the equipment. Therefore, the heat dissipation of the power distribution cabinet is crucial to ensure the stable operation of the power system.

[0005] There are various ways to cool the distribution cabinet, mainly including natural cooling, forced air cooling, water cooling, etc. Natural cooling refers to the natural dissipation of heat through the heat dissipation holes and air convection of the distribution cabinet shell. This method is simple and economical, but the heat dissipation effect is limited, and it is suitable for distribution cabinets with small loads and low heat generation. Forced air cooling refers to accelerating the air flow inside the distribution cabinet and improving the heat dissipation efficiency by installing a fan or blower. To this end, a water-cooled technical solution is proposed in the relevant technology, such as a water-cooled distribution cabinet disclosed in the Chinese patent document with the authorization announcement number CN219892739U, a distribution cabinet disclosed in the public announcement number CN115764635A, and a water cooling system for the distribution cabinet. The heat inside the distribution cabinet is taken away by the circulation of water or other cooling media. This method has the best heat dissipation effect. Water cooling in the prior art usually installs cooling pipes connected end to end in the distribution cabinet, and the cooling is completed by circulating the coolant therein.

[0006] However, in the traditional water cooling method, the liquid can only flow from the head end to the tail end of the cooling pipe during operation. The heat transfer mode is single, and there will be problems with untimely heat dissipation. Different components inside the distribution box generate heat differently, and there will be local overheating during operation. Because the components are densely placed, once the heat dissipation at the heat source is poor, overheating will affect the working state. In addition, the uneven heating of the components will cause temperature differences inside the distribution box. Condensation water is easily generated when cold and hot air meet, and the inside is prone to moisture, which seriously affects the normal operation of the components. Summary of the invention

[0007] In view of the shortcomings of the prior art, the present invention proposes a ventilated and moisture-proof heat-dissipating distribution cabinet, which can effectively reduce the temperature of locally overheated electronic components and make the temperature of the space where the components are located more uniform, thereby solving the problem in the prior art that condensation water affects the operation of components due to temperature differences.

[0008] A ventilated and moisture-proof heat dissipation type power distribution cabinet of the present invention adopts the following technical solution: comprising:

[0009] The power distribution cabinet body includes a shell, a partition plate and a cover. The shell opens forward and the cover is rotatably connected to the shell. The partition plate is arranged in the shell, and the shell is divided into two chambers, front and rear. The side of the partition plate facing the cover is the installation chamber, and the electronic components are located in the installation chamber and installed on the partition plate. The rear of the partition plate is the cooling chamber. The cooling chamber is in a vacuum state.

[0010] The heat dissipation mechanism is arranged in the cooling cavity, and the heat dissipation mechanism includes a plurality of heat dissipation units, which are mounted on the partition plate and arranged corresponding to the electronic components; in an initial state, each heat dissipation unit contains a preset amount of coolant; when the electronic component is overheated, the coolant contained in the corresponding heat dissipation unit evaporates;

[0011] The guiding mechanism is used to redistribute the condensed coolant to the heat dissipation unit where the coolant evaporates.

[0012] Optionally, the heat dissipation unit includes a heat dissipation plate and a micro-grid; the heat dissipation plate is rotatably mounted on the partition plate, the upper end surface of the heat dissipation plate is provided with a groove, and the groove is covered with the micro-grid; the micro-grid includes a plurality of warp tubes and a plurality of weft tubes arranged crosswise, the warp tubes and the weft tubes are connected at their intersections, and when the micro-grid contacts the liquid, the liquid is absorbed by capillary action and retained in the groove; in an initial state, the micro-grid is in a saturated state and cannot continue to absorb the liquid, and the heat dissipation plate is in a horizontal state;

[0013] The guiding mechanism includes a flow channel and a circulation component; the flow channel is vertically arranged on one side of the heat dissipation unit, the upper end of the flow channel is higher than the highest heat dissipation plate, and the lower end of the flow channel is lower than the lowest heat dissipation plate; when the amount of coolant contained on the heat dissipation plate is greater than a preset value, the heat dissipation plate rotates, and an angle appears between the heat dissipation plate and the horizontal direction; a locking member is connected to the heat dissipation plate, and the locking member is used to keep the heat dissipation plate in a horizontal state when the amount of coolant contained on the heat dissipation plate is less than or equal to a preset value; when the heat dissipation plate is in a horizontal state, one end of the micro-grid abuts against the flow channel; the circulation component is used to inject the coolant condensed at the bottom of the distribution box into the upper end of the flow channel.

[0014] Optionally, the circulation component includes a liquid storage tank, a water pump, a low-pressure nozzle and a guide plate; the liquid storage tank is tilted at the bottom of the cooling chamber, and the water inlet end of the water pump is located at the lower end of the liquid storage tank; the guide plate is fixedly installed on the partition plate and is located above the uppermost heat sink, and the guide plate is covered with micro-grids, and the micro-grids are in a saturated state in the initial state; the guide plate is tilted, and the low-pressure nozzle is installed above the higher end of the guide plate, and the lower end of the guide plate is abutted against the flow channel; the low-pressure nozzle and the water pump are connected by a pipe.

[0015] Optionally, two groups of heat dissipation mechanisms are provided, and the two groups of heat dissipation mechanisms are installed in the cooling cavity at intervals on the left and right, and are respectively arranged behind the electronic components; two flow channels and low-pressure nozzles are provided corresponding to the heat dissipation mechanisms.

[0016] Optionally, the two flow channels are respectively arranged on the left and right sides of the cooling chamber; a plurality of hinged columns and a plurality of support columns are fixedly installed on the partition plate, and the number of the hinged columns and the number of the support columns are consistent with the number of the heat sinks; each heat sink is rotatably installed on a hinged column; the support column is located at the end of the heat sink away from the flow channel; when the heat sink abuts against the support column, the heat sink is in a horizontal state; a locking member is installed on the support column, and the locking member is used to make the heat sink abut against the support column.

[0017] Optionally, the distance between the hinge column and the end of the heat sink close to the flow channel is greater than the distance between the hinge column and the end of the heat sink far from the flow channel.

[0018] Optionally, the locking piece is a locking spring, and an upwardly opening mounting groove is provided on the support column. A locking spring is installed in each mounting groove, and the two ends of the locking spring are respectively connected to the support column and the heat sink; the locking spring has a tendency to make the lower end surface of the heat sink abut against the support column.

[0019] Optionally, multiple baffles are arranged in the cooling chamber, and the sum of the number of heat sinks and guide plates is consistent with the number of baffles; baffles are arranged obliquely below the heat sink and guide plate toward one end of the flow channel, and the front and rear sides of the baffles are respectively fixedly connected to the partition plate and the outer shell; the end of the baffle close to the flow channel is lower than the end away from the flow channel, and the baffle pours the coolant into the flow channel.

[0020] Optionally, the heat dissipation plate and the guide plate are both provided with a notch at one end facing the drainage belt.

[0021] Optionally, ventilation windows are provided on the side walls on the left and right sides of the shell.

[0022] The beneficial effects of the present invention are as follows: a ventilated and moisture-proof heat-dissipating distribution cabinet of the present invention, by setting the heat dissipation mechanism as multiple heat dissipation units, which are set one by one with the electronic components, makes it possible to more accurately perceive the part of the electronic components with abnormal temperature. When overheating occurs, the coolant in the corresponding heat dissipation unit evaporates, and re-condenses into liquid after heat exchange with multiple other heat dissipation units or the shell. The liquid coolant is redistributed by the guiding mechanism to the heat dissipation unit corresponding to the overheated part, thereby completing multiple heat transfers in a short time and reducing the temperature of the overheated electronic components. In this process, the flow of the coolant and its vapor makes the internal temperature of the entire distribution cabinet tend to be consistent, avoiding the influence of overheating on the operation of the distribution cabinet, thereby solving the problem of untimely heat dissipation caused by the single heat transfer mode in the prior art, and the problem of condensation water generated by the intersection of cold and hot air in the installation cavity due to the temperature difference in the distribution cabinet, which affects the normal operation of the electronic components due to humidity.

[0023] Furthermore, by setting up flow channels and baffles, and making the heat sink rotate in a fixed direction when receiving excess coolant, the coolant can exchange heat with multiple heat sinks when flowing in the flow channel, further equalizing the temperatures of the multiple heat sinks, making the heat dissipation more uniform and reasonable, and avoiding the formation of condensed water in the installation cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the present invention after the back cover is removed;

[0027] Figure 3 It is a front view of the present invention;

[0028] Figure 4 for Figure 3 Middle AA section cutaway view;

[0029] Figure 5 A side view of the present invention;

[0030] Figure 6 In the initial state Figure 5 Middle BB section cutaway view;

[0031] Figure 7 It is a front view of the heat dissipation mechanism in the working state;

[0032] Figure 8 It is a schematic diagram of the state of the heat dissipation mechanism in the working state;

[0033] Fig. 9 for Figure 8 The enlarged schematic diagram of point A in the middle;

[0034] Fig.10 for Figure 8 The enlarged schematic diagram of point B in the middle;

[0035] Fig.11 for Figure 8 The enlarged schematic diagram of the center C;

[0036] Fig.12 for Figure 8 Enlarged schematic diagram of point D in the middle.

[0037] In the figure: 100, distribution cabinet body; 110, shell; 111, ventilation window; 120, partition plate; 121, hinged column; 122, support column; 123, installation cavity; 124, cooling cavity; 130, cover; 140, electronic components; 200, heat dissipation unit; 210, heat dissipation plate; 211, groove; 212, notch; 220, micro grid; 230, locking spring; 310, flow channel; 320, liquid storage tank; 330, water pump; 340, low-pressure nozzle; 350, guide plate; 360, pipeline; 370, baffle. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] like Figures 1 to 12 As shown, a ventilation and moisture-proof heat dissipation type power distribution cabinet provided in an embodiment of the present invention includes a power distribution cabinet body 100, a heat dissipation mechanism and a guiding mechanism;

[0040] The power distribution cabinet body 100 includes a shell 110, a partition plate 120 and a cover 130. The shell 110 opens forward and is a relatively thin hollow shell. The cover 130 is rotatably connected to the shell 110. The partition plate 120 is arranged in the shell 110. The partition plate 120 divides the shell 110 into two chambers, a front chamber and a rear chamber. The side of the partition plate 120 facing the cover 130 is an installation chamber 123. The electronic components 140 are located in the installation chamber 123 and installed on the partition plate 120. The rear of the partition plate 120 is a cooling chamber 124. The cooling chamber 124 is in a vacuum state.

[0041] The heat dissipation mechanism is disposed in the cooling cavity 124, and the heat dissipation mechanism includes a plurality of heat dissipation units 200, which are mounted on the partition plate 120 and are disposed corresponding to the electronic components 140; in an initial state, each heat dissipation unit 200 contains a preset amount of coolant; when the electronic component 140 is overheated, the coolant contained in the corresponding heat dissipation unit 200 evaporates;

[0042] The guiding mechanism is used to redistribute the condensed coolant to the heat dissipation unit 200 where the coolant evaporates.

[0043] During use, since the cooling chamber 124 is in a vacuum state, the vaporization point of the coolant is lowered and the liquefaction point is increased; when the electrical components of the distribution cabinet are partially overheated, the temperature of the heat dissipation unit 200 behind the overheated electronic component 140 increases abnormally through heat transfer, and part of the coolant contained therein evaporates into gas. The coolant gas randomly diffuses to the surroundings under the action of air pressure, and is condensed into liquid when encountering a heat dissipation unit 200 or a shell 110 with a lower temperature, and heat exchanges with multiple heat dissipation units 200 with lower temperatures to make the temperatures tend to be consistent; at this time, the guiding mechanism can redistribute the condensed coolant to the heat dissipation unit 200 with an abnormally high temperature, thereby reducing the temperature of the heat dissipation unit 200 corresponding to the overheated electronic component 140, and then through heat exchange, the temperature of the overheated electronic component 140 is reduced, and the temperature of the electronic component 140 is uniform through multiple heat exchanges.

[0044] Compared with the heat dissipation type power distribution cabinet in the prior art, the present invention sets the heat dissipation mechanism as multiple heat dissipation units 200, which are set one by one corresponding to the electronic components 140, so that the partial perception of the temperature abnormality of the electronic components 140 is more accurate. When overheating occurs, the coolant in the corresponding heat dissipation unit 200 evaporates, and re-condenses into liquid after heat exchange with other heat dissipation units 200 or the shell 110, and is redistributed by the guiding mechanism to the heat dissipation unit 200 corresponding to the overheated part, thereby reducing the temperature of the overheated electronic components 140. The flow of the coolant and its vapor makes the internal temperature of the entire power distribution cabinet tend to be consistent, avoiding the influence of overheating on the operation of the power distribution cabinet, thereby solving the problem that the intersection of cold and hot air in the installation cavity 123 produces condensed water due to the temperature difference in the power distribution cabinet, and the normal operation of the electronic components 140 is affected by humidity.

[0045] In a further embodiment, Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 As shown;

[0046] The heat dissipation unit 200 includes a heat dissipation plate 210 and a micro-grid 220; the heat dissipation plate 210 is rotatably mounted on the partition plate 120, and a groove 211 is provided on the upper end surface of the heat dissipation plate 210, and the groove 211 is covered with the micro-grid 220; the micro-grid 220 includes a plurality of warp tubes and a plurality of weft tubes arranged crosswise, and the intersection of the warp tubes and the weft tubes is connected, and when the micro-grid 220 contacts with liquid, the liquid is absorbed by capillary action and retained in the groove 211; in the initial state, the micro-grid 220 is in a saturated state and cannot continue to absorb liquid, and the heat dissipation plate 210 is in a horizontal state;

[0047] The guiding mechanism includes a flow channel 310 and a circulation component; the flow channel 310 is vertically arranged on one side of the heat dissipation unit 200, and the end surface of the drainage belt facing the heat dissipation plate 210 is smooth; the upper end of the flow channel 310 is higher than the highest heat dissipation plate 210, and the lower end of the flow channel 310 is lower than the lowest heat dissipation plate 210; when the amount of coolant contained on the heat dissipation plate 210 is greater than a preset value, the heat dissipation plate 210 rotates, and an angle appears between the heat dissipation plate 210 and the horizontal direction; a locking member is connected to the heat dissipation plate 210, and the locking member is used to keep the heat dissipation plate 210 in a horizontal state when the amount of coolant contained on the heat dissipation plate 210 is less than or equal to a preset value; when the heat dissipation plate 210 is in a horizontal state, one end of the micro grid 220 abuts against the flow channel 310; the circulation component is used to inject the coolant condensed at the bottom of the distribution box into the upper end of the flow channel 310.

[0048] During use, when the electrical components of the power distribution cabinet are partially overheated, the temperature of the heat sink 210 and the micro grid 220 behind the overheated electronic components 140 increases abnormally through heat transfer, and part of the coolant contained in the micro grid 220 evaporates into gas. The coolant gas randomly diffuses to the surroundings under the action of air pressure, and heat exchange occurs when it encounters the heat sink 210 or the shell 110 with a lower temperature, condensing into liquid to make the temperature uniform; at this time, the condensed coolant appears randomly at any position of the cooling cavity 124; when the condensed coolant falls on the heat sink 210 where evaporation occurs, the coolant is absorbed by the micro grid 220; when the condensed coolant falls on the heat sink 210 where evaporation does not occur, the coolant on the heat sink 210 The amount is greater than the preset value, at this time, the heat sink 210 rotates, and an angle appears between it and the horizontal direction. The micro grid 220 is out of contact with the flow channel 310 at the end facing the flow channel 310, and the condensed coolant flows along the heat sink 210 to the lower end of the heat sink 210. When the condensed coolant falls to the bottom of the distribution box, the circulation component injects the condensed coolant into the upper end of the flow channel 310. The heat sink 210 with abnormally increased temperature is kept horizontal under the action of the locking member. When the coolant in the flow channel 310 flows to be flush with the heat sink 210 with abnormally increased temperature, it is absorbed by the micro grid 220 thereon, thereby reducing the temperature of the heat sink 210 and the micro grid 220, and then through heat exchange, the temperature of the overheated electronic component 140 is reduced.

[0049] In a further embodiment, Figure 8 , Fig. 9 , Fig.10 , Fig.11 , Fig.12 As shown; the circulation component includes a liquid storage tank 320, a water pump 330, a low-pressure nozzle 340 and a guide plate 350; the liquid storage tank 320 is tilted at the bottom of the cooling chamber 124, and the water inlet end of the water pump 330 is located at the lower end of the liquid storage tank 320; the guide plate 350 is fixedly installed on the partition plate 120, and is located above the uppermost heat sink 210, and a micro-grid 220 is laid on the guide plate 350, and the micro-grid 220 is in a saturated state in the initial state; a water tank is installed at the upper end of the cooling chamber 124, and the water outlet end of the water pump 330 is connected to the water tank through a pipe 360; the guide plate 350 is tilted, the low-pressure nozzle 340 is installed above the higher end of the guide plate 350, and the lower end of the guide plate 350 abuts against the flow channel 310; the water tank is connected to the low-pressure nozzle 340. A guide member is provided between the lower end of the flow channel 310 and the liquid storage tank 320 , and the guide member may be a guide tube or a guide sheet;

[0050] When the condensed coolant flows from the flow channel 310 through the guide to the middle or drips from the lowest heat sink 210 into the liquid storage tank 320, the water pump 330 allows the coolant to flow into the water tank through the pipe 360 ​​and then reach the low-pressure nozzle 340. The low-pressure nozzle 340 sprays the coolant to the guide plate 350. When the coolant in the micro-grids 220 on the guide plate 350 evaporates, the amount of coolant therein is less than a preset value, and the micro-grids 220 absorb the coolant sprayed from the low-pressure nozzle 340. When the amount of coolant in the micro-grids 220 on the guide plate 350 is equal to the preset value, that is, it is in a saturated state, the coolant sprayed from the low-pressure nozzle 340 flows to the flow channel 310 through the guide plate 350, and then the redistribution of the coolant is completed.

[0051] In a further embodiment, Figure 6 , Figure 7 , Figure 8 As shown; two groups of heat dissipation mechanisms are provided, and the two groups of heat dissipation mechanisms are installed in the cooling cavity 124 at intervals on the left and right, and are respectively provided behind the electronic components 140; two flow channels 310 and two low-pressure nozzles 340 are provided corresponding to the heat dissipation mechanisms. By providing two flow channels 310, two groups of heat dissipation mechanisms and two low-pressure nozzles 340, two rows of electronic components 140 can be installed in the power distribution cabinet body 100 under the premise of ensuring heat dissipation and heat uniformity, and the lengths of the heat dissipation plates 210 on the left and right sides can be adapted according to the lengths of the corresponding electronic components 140.

[0052] In a further embodiment, Figure 7 , Figure 8 As shown; two flow channels 310 are respectively arranged on the left and right sides of the cooling chamber 124; a plurality of hinged columns 121 and a plurality of support columns 122 are fixedly installed on the partition plate 120, and the number of hinged columns 121 and the number of support columns 122 are consistent with the number of heat sinks 210; each heat sink 210 is rotatably installed on a hinged column 121; the support column 122 is located at the end of the heat sink 210 away from the flow channel 310; when the heat sink 210 abuts against the support column 122, the heat sink 210 is in a horizontal state; a locking member is installed on the support column 122, and the locking member is used to make the heat sink 210 abut against the support column 122.

[0053] In a further embodiment, the distance between the hinge column 121 and the end of the heat sink 210 close to the flow channel 310 is greater than the distance between the hinge column 121 and the end of the heat sink 210 away from the flow channel 310. Figure 6 and Figure 7The heat sink 210 on the left can only rotate counterclockwise, and the heat sink 210 on the right can only rotate clockwise; thereby ensuring that, under the premise that the two adjacent micro-grids 220 are in a saturated state, after receiving the condensed coolant, the two rotate in the same direction, ensuring that there is a channel for the coolant gas to flow between the two, further optimizing the uniform heat dissipation effect.

[0054] In a further embodiment, Figure 7 , Figure 8 As shown, the locking member is a locking spring 230, and an upwardly opening mounting groove is provided on the support column 122, and a locking spring 230 is installed in each mounting groove. The two ends of the locking spring 230 are respectively connected to the support column 122 and the heat sink 210; the locking spring 230 has a tendency to make the lower end surface of the heat sink 210 abut against the support column 122.

[0055] In the initial state, all heat sinks 210 are kept in a horizontal state under the action of the locking spring 230. When the electrical components of the power distribution cabinet are partially overheated, part of the coolant contained in the micro grid 220 behind the overheated electronic components 140 evaporates into gas. The coolant vapor randomly diffuses to the surroundings under the action of air pressure. When it encounters a heat sink 210 or a housing 110 with a lower temperature, heat exchange occurs and condenses into liquid. The condensed coolant randomly appears at any position of the cooling cavity 124. When the condensed coolant falls on the heat sink 210 where no evaporation occurs, the amount of coolant on the heat sink 210 is greater than the preset value. At this time, the heat sink 210 rotates. Figure 6 , the heat sink 210 on the left rotates counterclockwise, and the heat sink 210 on the right rotates clockwise. While the heat sink 210 rotates, the locking spring 230 is stretched and charged; the micro-grid 220 is out of contact with the flow channel 310 at the end facing the flow channel 310, and the condensed coolant flows along the heat sink 210 to the end close to the flow channel 310. As the condensed coolant drips from the inclined heat sink 210, the mass of the coolant contained thereon gradually approaches the preset value, and the locking spring 230 tends to restore its original length, thereby driving the heat sink 210 to gradually restore the horizontal state, until the coolant contained in the micro-grid 220 on the heat sink 210 is equal to the preset value, and the heat sink 210 restores the initial horizontal state.

[0056] In a further embodiment, Figure 7 , Fig. 9 , Fig.11As shown, a plurality of baffles 370 are arranged in the cooling chamber 124, and the sum of the number of the heat sink 210 and the guide plate 350 is consistent with the number of the baffles 370; the heat sink 210 and the guide plate 350 are provided with baffles 370 inclined downward toward one end of the flow channel 310, and the front and rear sides of the baffles 370 are respectively fixedly connected to the partition plate 120 and the outer shell 110; the end of the baffle 370 close to the flow channel 310 is lower than the end away from the flow channel 310, and the baffle 370 pours the coolant into the flow channel 310.

[0057] When the electrical components of the power distribution cabinet are partially overheated, part of the coolant contained in the micro grid 220 behind the overheated electronic components 140 evaporates into gas, and the coolant gas randomly diffuses to the surroundings under the action of air pressure, and heat exchange occurs when it encounters the heat sink 210 or the shell 110 with a lower temperature, condensing into liquid, so that the temperature tends to be consistent; at this time, the condensed coolant appears randomly at any position of the cooling cavity 124; when the condensed coolant falls on the heat sink 210 where evaporation occurs, the coolant is absorbed by the micro grid 220; when the condensed coolant falls on the heat sink 210 where evaporation does not occur, the amount of coolant on the heat sink 210 is greater than the preset value, and the heat sink 210 rotates at this time, referring to Figure 6 , the heat sink 210 on the left rotates counterclockwise, and the heat sink 210 on the right rotates clockwise; the micro-grid 220 is out of contact with the flow channel 310 toward the end of the flow channel 310, and the condensed coolant flows along the heat sink 210 to the end close to the flow channel 310. When the condensed coolant drips from the inclined heat sink 210, it falls on the baffle 370 below it, and the baffle 370 guides the coolant falling thereon into the flow channel 310. The heat sink 210 with abnormally increased temperature is kept horizontal under the action of the locking spring 230. When the coolant in the flow channel 310 flows to be flush with the heat sink 210 with abnormally increased temperature, it is absorbed by the micro-grid 220 thereon, thereby reducing the temperature of the heat sink 210 and the micro-grid 220, and then through heat exchange, the temperature of the overheated electronic component 140 is reduced.

[0058] In a further embodiment, Fig. 9 and Fig.11 The heat sink 210 and the guide plate 350 are both provided with a notch 212 at one end facing the drainage belt. When the coolant in the groove 211 is more than a preset value, the coolant flows out of the groove 211 through the notch 212 .

[0059] In a further embodiment, Figure 2 , Figure 3 , Figure 5Ventilation windows 111 are provided on the side walls on both sides of the housing 110. When the power distribution cabinet is working, the ventilation windows 111 can be used to ventilate and prevent moisture inside the power distribution cabinet body 100, and existing moisture-proof technologies such as desiccant can also be set in the power distribution cabinet body 100.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A ventilated and moisture-proof heat dissipation type power distribution cabinet, characterized in that: include: The power distribution cabinet body comprises a shell, a partition plate and a cover, the shell opens forward, and the cover is rotatably connected to the shell; The partition plate is arranged in the shell, and the partition plate divides the shell into two chambers, front and rear. The side of the partition plate facing the cover is the installation chamber, and the electronic components are located in the installation chamber and installed on the partition plate; the rear of the partition plate is the cooling chamber; the cooling chamber is in a vacuum state; The heat dissipation mechanism is arranged in the cooling cavity, and the heat dissipation mechanism includes a plurality of heat dissipation units, which are installed on the partition plate and arranged corresponding to the electronic components; in the initial state, each heat dissipation unit contains a preset amount of coolant; when the electronic components are overheated, the coolant contained in the corresponding heat dissipation unit evaporates; the heat dissipation unit includes a heat dissipation plate and a micro-grid; the heat dissipation plate is rotatably installed on the partition plate, and a groove is arranged on the upper end surface of the heat dissipation plate, and the groove is covered with a micro-grid; the micro-grid includes a plurality of warp tubes and a plurality of weft tubes arranged crosswise, and the intersection of the warp tubes and the weft tubes is connected, and when the micro-grid contacts with the liquid, the liquid is absorbed by capillary action and retained in the groove; in the initial state, the micro-grid is in a saturated state and cannot continue to absorb the liquid, and the heat dissipation plate is in a horizontal state; A guiding mechanism is used to redistribute the condensed coolant to the heat dissipation unit where the coolant evaporates; the guiding mechanism includes a flow channel and a circulation component; the flow channel is vertically arranged on one side of the heat dissipation unit, the upper end of the flow channel is higher than the highest heat dissipation plate, and the lower end of the flow channel is lower than the lowest heat dissipation plate; when the amount of coolant contained on the heat dissipation plate is greater than a preset value, the heat dissipation plate rotates, and an angle appears between the heat dissipation plate and the horizontal direction; a locking member is connected to the heat dissipation plate, and the locking member is used to keep the heat dissipation plate in a horizontal state when the amount of coolant contained on the heat dissipation plate is less than or equal to a preset value; when the heat dissipation plate is in a horizontal state, one end of the microgrid abuts against the flow channel; the circulation component is used to inject the coolant condensed at the bottom of the distribution box into the upper end of the flow channel; The circulation component includes a liquid storage tank, a water pump, a low-pressure nozzle and a guide plate; the liquid storage tank is tilted at the bottom of the cooling chamber, and the water inlet end of the water pump is located at the lower end of the liquid storage tank; the guide plate is fixedly installed on the partition plate and is located above the uppermost heat sink, and a micro-grid is laid on the guide plate, and the micro-grid is in a saturated state in the initial state; the guide plate is tilted, and the low-pressure nozzle is installed above the higher end of the guide plate, and the lower end of the guide plate is in contact with the flow channel; the low-pressure nozzle and the water pump are connected by a pipeline.

2. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 1, characterized in that: Two groups of heat dissipation mechanisms are provided, which are installed in the cooling cavity at intervals on the left and right and are respectively arranged behind the electronic components; two flow channels and low-pressure nozzles are provided corresponding to the heat dissipation mechanisms.

3. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 2, characterized in that: The two flow channels are respectively arranged on the left and right sides of the cooling chamber; a plurality of hinged columns and a plurality of support columns are fixedly installed on the partition plate, and the number of the hinged columns and the number of the support columns are consistent with the number of the heat sinks; each heat sink is rotatably installed on a hinged column; the support column is located at the end of the heat sink away from the flow channel; when the heat sink abuts against the support column, the heat sink is in a horizontal state; a locking member is installed on the support column, and the locking member is used to make the heat sink abut against the support column.

4. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 3, characterized in that: The distance between the hinged column and the end of the heat sink close to the flow channel is greater than the distance between the hinged column and the end of the heat sink far from the flow channel.

5. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 4, characterized in that: The locking piece is a locking spring. An upwardly opening mounting groove is provided on the support column. A locking spring is installed in each mounting groove. The two ends of the locking spring are respectively connected to the support column and the heat sink. The locking spring has a tendency to make the lower end surface of the heat sink abut against the support column.

6. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 5, characterized in that: A plurality of baffles are arranged in the cooling chamber, and the sum of the number of heat sinks and guide plates is consistent with the number of baffles; baffles are arranged obliquely below the heat sink and guide plate toward one end of the flow channel, and the front and rear sides of the baffles are respectively fixedly connected to the partition plate and the outer shell; the end of the baffle close to the flow channel is lower than the end away from the flow channel, and the baffle pours the coolant into the flow channel.

7. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to claim 1, characterized in that: The heat dissipation plate and the guide plate are both provided with a notch at one end facing the drainage belt.

8. A ventilated and moisture-proof heat dissipation type power distribution cabinet according to any one of claims 1 to 7, characterized in that: Ventilation windows are provided on the side walls on the left and right sides of the shell.

Images