Printed circuit board and configuration method, device, storage medium and electronic equipment

Abstract

The embodiment of the present application provides a printed circuit board and configuration method, device, storage medium and electronic device, including: multiple rows of pads, signal buses and adjustment devices deployed on the printed circuit board, through holes are deployed in the pads, the signal bus includes a perforated portion and a wiring portion, the perforated portion is deployed in the through hole, the wiring portion is deployed in the area between adjacent pads in different rows, the adjustment device is deployed on the wiring portion, the adjustment device is located in the target adjustment area, and the candidate adjustment area between adjacent pads in each row of pads in the multiple rows of pads includes the target adjustment area; the shape of the adjustment device includes a mirror symmetric shape. Through the present application, the problem of low quality of signal transmission by the signal bus on the printed circuit board is solved, thereby achieving the effect of improving the quality of signal transmission by the signal bus on the printed circuit board.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of printed circuit boards, and more specifically, to a printed circuit board and a configuration method, device, storage medium, and electronic device. Background Art

[0002] A signal bus (for example, a UPI bus) is deployed on the printed circuit board for transmitting signals. In the related art, when a pair of signal buses are formed between two through holes between pads, in order to effectively avoid anti-pads, the line width and line spacing must be as small as possible. However, too small a line width and line spacing will lead to increased impedance, which is inconsistent with the impedance of other areas, thereby causing a decrease in signal quality. In addition, too small a line width and line spacing will also approach the limit of the processing capacity of the PCB (Printed Circuit Board) factory, and the stability cannot be controlled.

[0003] If anti-pads are not avoided, the impedance of the place where the anti-pads are leaked will be high, causing impedance discontinuity and reflection problems. When a single-line outlet is used, its anti-interference ability is not as good as a two-line outlet and weak coupling will be formed. It is understandable that in the related art, there may be an impedance mismatch problem, resulting in low quality of signal bus transmission signals. Summary of the invention

[0004] The embodiments of the present application provide a printed circuit board and a configuration method, device, storage medium and electronic device to at least solve the problem of low quality of signal transmission by a signal bus on a printed circuit board in the related art.

[0005] According to one embodiment of the present application, a printed circuit board is provided, comprising: a plurality of rows of solder pads, a signal bus and an adjustment device disposed on the printed circuit board, wherein through holes are disposed in the solder pads, the signal bus comprises a perforated portion and a wiring portion, the perforated portion is disposed in the through holes, the wiring portion is disposed in an area between adjacent rows of the solder pads, the adjustment device is disposed on the wiring portion, the adjustment device is located in a target adjustment area, and candidate adjustment areas between adjacent solder pads in each row of the plurality of solder pads include the target adjustment area; wherein the adjustment device is used to adjust the quality of the signal transmitted by the signal bus by adjusting the impedance of the signal bus and adjusting the time delay of the signal transmitted by the signal bus; and the shape of the adjustment device comprises a mirror-symmetric shape.

[0006] In an exemplary embodiment, the mirror-symmetrical shape includes at least one of the following: an isosceles triangle, a combination of an isosceles trapezoid and a rectangle.

[0007] In an exemplary embodiment, the length of the base of the isosceles triangle is greater than or equal to 5 mils and less than or equal to 16 mils; the combined figure includes a first type of adjustment device and a second type of adjustment device, wherein in the first type of adjustment device, the length of the base of the combined figure is greater than or equal to 5 mils and less than or equal to 10 mils, and in the second type of adjustment device, the length of the base of the combined figure is greater than 10 mils and less than or equal to 16 mils.

[0008] In an exemplary embodiment, the target adjustment area is determined from the candidate adjustment areas based on a wiring method of the signal bus, wherein the wiring method includes: the area between the pads in adjacent rows passes through a pair of wiring portions of the signal bus, or the area between the pads in adjacent rows passes through a wiring portion of the signal bus.

[0009] In an exemplary embodiment, in a case where the wiring mode includes that the area between the pads of adjacent rows passes through the wiring portion of a pair of the signal buses, and the pair of the signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are disposed on the wiring portion of the first signal bus, and a second group of adjustment devices are disposed on the wiring portion of the second signal bus, wherein the height of the i-th adjustment device in the first group of adjustment devices is greater than 0 and less than or equal to a target quotient value, the height of the j-th adjustment device in the second group of adjustment devices is greater than 0 and less than or equal to the target quotient value, the target quotient value is equal to a value obtained by dividing a target difference value by 2, and the target difference value is equal to the j-th adjustment device in the second group of adjustment devices. a value obtained by subtracting a reference value from the spacing between a signal bus and a first candidate signal bus, the pads passed by the first candidate signal bus when passing through the outer side of the first signal bus, i is a positive integer, j is a positive integer; in the case where the wiring method includes an area between adjacent rows of pads passing through a wiring portion of the signal bus, the adjustment device is deployed on the wiring portion of the signal bus, wherein the height of the adjustment device is greater than 0 and less than or equal to the candidate difference value, wherein the candidate difference value is equal to the value obtained by subtracting a reference value from the spacing between the signal bus and the second candidate signal bus, the pads passed by the second candidate signal bus when passing through the outer side of the signal bus.

[0010] In an exemplary embodiment, in a case where the routing mode includes the area between the pads in adjacent rows passing through a pair of routing portions of the signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are deployed on the routing portion of the first signal bus, and a second group of adjustment devices are deployed on the routing portion of the second signal bus, wherein the first group of adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the first signal bus, the second group of adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the second signal bus, and the inner side of the routing portion of the first signal bus passes through the inner side of the routing portion of the second signal bus; in a case where the routing mode includes the area between the pads in adjacent rows passing through a routing portion of a signal bus, the adjustment devices are deployed on the routing portion of the signal bus, and the adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the signal bus.

[0011] In an exemplary embodiment, the printed circuit board further comprises: the soldering pad is used to solder the pins of the chip, and when the adjustment device comprises N adjustment devices and M pins are deployed on the chip, the distance between the i1th deployment position of the i1th adjustment device among the N adjustment devices on the wiring portion and the i1+1th deployment position of the i1+1th adjustment device on the wiring portion is equal to the distance between the corresponding i2th pin and i2+1th pin, wherein N is a positive integer, M is a positive integer, i1 is a positive integer less than or equal to N, i2 is a positive integer less than or equal to M, i1 is equal to i2, and the M pins include the i2th pin and the i2+1th pin.

[0012] In an exemplary embodiment, in a case where the wiring method includes that the area between the pads in adjacent rows passes through a pair of wiring portions of the signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are deployed on the wiring portion of the first signal bus, and a second group of adjustment devices are deployed on the wiring portion of the second signal bus, wherein the impedance of the first signal bus is equal to the impedance of the second signal bus, and the delay of the signal transmitted by the first signal bus is equal to the delay of the signal transmitted by the second signal bus; in a case where the wiring method includes that the area between the pads in adjacent rows passes through a wiring portion of the signal bus, a third group of adjustment devices are deployed on the wiring portion of the signal bus, wherein the impedance of the signal bus is less than or equal to an impedance threshold, and the delay of the signal transmitted by the signal bus is less than or equal to a delay threshold.

[0013] According to another embodiment of the present application, a method for configuring a signal bus of a printed circuit board is provided, which is applied to a configuration tool for a printed circuit board, the configuration tool being used to connect a printed circuit board as described in any one of the items, the signal bus deployed on the printed circuit board being an initial signal bus, the initial signal bus being configured to allow deployment of candidate adjustment devices, the candidate adjustment devices being used to adjust transmission parameters of a signal transmitted by the initial signal bus, the method comprising: detecting an initial transmission parameter of the initial signal bus; screening a target adjustment device from the candidate adjustment devices according to the initial transmission parameter and the corresponding transmission parameter threshold when an initial signal quality corresponding to the initial transmission parameter is less than a signal quality threshold; determining a target deployment position of the target adjustment device on the initial signal bus according to a deployment mode of the initial signal bus on the printed circuit board; deploying the target adjustment device at the target deployment position to obtain a target printed circuit board on which the target signal bus is deployed, wherein the target signal quality corresponding to the target transmission parameter of the target signal bus is greater than or equal to the signal quality threshold.

[0014] In an exemplary embodiment, the detecting of the initial transmission parameters of the initial signal bus includes: when the initial transmission parameters include impedances at N detection positions on the initial signal bus, detecting the i-th impedance at the i-th detection position among the N detection positions by performing the following steps, wherein N is a positive integer and i is a positive integer less than or equal to N: detecting the inductance at the i-th detection position and the capacitance at the i-th detection position; determining the i-th impedance as a value obtained by performing a square operation on a reference quotient value, wherein the reference quotient value is equal to a value obtained by dividing the inductance at the i-th detection position by the capacitance at the i-th detection position.

[0015] In an exemplary embodiment, the detecting of the initial transmission parameters of the initial signal bus includes: when the initial transmission parameters include the near-end crosstalk of the initial signal bus, detecting the near-end crosstalk of the initial signal bus by performing the following steps: determining the near-end crosstalk of the initial signal bus as a value obtained by performing a product operation on a proportional coefficient and a first sum value, wherein the first sum value is equal to a sum operation performed on a first quotient value and a second quotient value, wherein the first quotient value is equal to a value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, and the second quotient value is equal to a value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus.

[0016] In an exemplary embodiment, the detecting of the initial transmission parameters of the initial signal bus comprises: in the case where the initial transmission parameters include the far-end crosstalk of the initial signal bus, detecting the far-end crosstalk of the initial signal bus by performing the following steps: determining the far-end crosstalk of the initial signal bus as a value obtained by performing a product operation on a third quotient, a fourth quotient and a first difference, wherein the third quotient is equal to a value obtained by dividing a target length by a length of a rising edge of a signal on other signal buses, the fourth quotient is equal to a value obtained by dividing 1 by a target product value, and the target product value is equal to a value obtained by multiplying an adjustment coefficient and a signal The first difference is equal to the value obtained by subtracting the second quotient from the first quotient, wherein the first quotient is equal to the value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, and the second quotient is equal to the value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus. The target length is the length of the coupling area between the initial signal bus and the other signal buses, and the signal transmitted on the other signal bus interferes with the signal transmitted on the initial signal bus.

[0017] In an exemplary embodiment, the screening of a target adjustment device from the candidate adjustment devices based on the initial transmission parameters and the corresponding transmission parameter threshold includes: screening a reference adjustment device from the candidate adjustment devices based on a reference difference and a reference adjustment direction between the initial transmission parameters and the transmission parameter threshold; deploying the reference adjustment device at a reference deployment position on the initial signal bus to obtain a printed circuit board on which a reference signal bus is deployed; and determining the reference adjustment device as the target adjustment device when a reference signal quality corresponding to the reference transmission parameter of the reference signal bus is greater than or equal to the signal quality threshold.

[0018] In an exemplary embodiment, the screening of reference adjustment devices from the candidate adjustment devices based on the reference difference and reference adjustment direction between the initial transmission parameter and the transmission parameter threshold includes: searching for the initial adjustment device corresponding to the reference adjustment direction from the candidate adjustment devices; and searching for the reference adjustment device corresponding to the reference difference from the initial adjustment device.

[0019] In an exemplary embodiment, a plurality of rows of pads are disposed on the printed circuit board, and the initial signal bus is disposed in a reference area between adjacent different rows of pads in the plurality of rows of pads. Determining the target deployment position of the target adjustment device on the initial signal bus according to the deployment mode of the initial signal bus on the printed circuit board includes: when the initial signal bus is disposed in the reference area and a third signal bus is also disposed in the reference area, determining the target deployment position as a portion of the initial signal bus in a first area and a portion of the third signal bus in a second area, wherein the first area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus, and the second area includes an area between adjacent pads among a plurality of pads passed by the outer side of the third signal bus; when the initial signal bus is disposed in the reference area and only the initial signal bus is disposed in the reference area, determining the target deployment position as a portion of the initial signal bus in a third area, wherein the third area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus.

[0020] In an exemplary embodiment, the pad is used to solder the pins of the chip. When the pins of the chip include P pins, the target deployment positions include Q deployment positions, and the target adjustment device includes Q adjustment devices, the method further includes: determining the distance between the r1th adjustment device at the r1+1th deployment position on the initial signal bus and the r1+1th deployment position on the r1+1th adjustment device at the initial signal bus as the distance between the corresponding r2th pin and r2+1th pin, wherein P is a positive integer, Q is a positive integer, r1 is a positive integer less than or equal to Q, r2 is a positive integer less than or equal to P, the Q deployment positions include the r1+1th deployment position and the r1+1th deployment position, the P pins include the r2th pin and the r2+1th pin, and r1 is equal to r2.

[0021] According to another embodiment of the present application, there is provided a signal bus configuration device for a printed circuit board, which is applied to a configuration tool for a printed circuit board, wherein the configuration tool is used to connect a printed circuit board as described in any one of the items, wherein the signal bus deployed on the printed circuit board is an initial signal bus, wherein the initial signal bus is configured to allow the deployment of candidate adjustment devices, wherein the candidate adjustment devices are used to adjust the transmission parameters of the signal transmitted by the initial signal bus, and wherein the device comprises: a detection module, which is used to detect the initial transmission parameters of the initial signal bus; a screening module, which is used to screen a target adjustment device from the candidate adjustment devices according to the initial transmission parameters and the corresponding transmission parameter threshold when the initial signal quality corresponding to the initial transmission parameters is less than a signal quality threshold; a determination module, which is used to determine a target deployment position of the target adjustment device on the initial signal bus according to the deployment mode of the initial signal bus on the printed circuit board; and a deployment module, which is used to deploy the target adjustment device at the target deployment position to obtain a target printed circuit board on which the target signal bus is deployed, wherein the target signal quality corresponding to the target transmission parameters of the target signal bus is greater than or equal to the signal quality threshold.

[0022] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when run.

[0023] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0024] According to another embodiment of the present application, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0025] Through the present application, the impedance of the signal bus and the delay of the signal bus transmission signal can be adjusted by, but not limited to, deploying an adjustment device on the wiring part of the signal bus. The adjustment device with a mirror-symmetrical shape can be, but not limited to, used to adjust the impedance of the signal bus to a uniform distribution, thereby improving the quality of the signal bus transmission signal. Therefore, the problem of low quality of the signal bus transmission signal on the printed circuit board is solved, thereby achieving the effect of improving the quality of the signal bus transmission signal on the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of an optional printed circuit board according to an embodiment of the present application;

[0027] Figure 2 is a schematic diagram of an optional mirror-symmetrical shape according to an embodiment of the present application;

[0028] Figure 3 is a schematic diagram of the size of an optional adjustment device according to an embodiment of the present application Figure 1 ;

[0029] Figure 4 is a schematic diagram of the size of an optional adjustment device according to an embodiment of the present application Figure 2 ;

[0030] Figure 5 This is a schematic diagram of an optional wiring method according to an embodiment of the present application. Figure 1 ;

[0031] Figure 6 This is a schematic diagram of an optional wiring method according to an embodiment of the present application. Figure 2 ;

[0032] Figure 7 is a schematic diagram of optionally deploying an isosceles triangle adjustment device on a signal bus according to an embodiment of the present application;

[0033] Figure 8 is an impedance variation diagram of a signal bus in which an isosceles triangle adjustment device is optionally deployed according to an embodiment of the present application;

[0034] Fig. 9 is a schematic diagram of optionally deploying a first type of adjustment device on a signal bus according to an embodiment of the present application;

[0035] Fig.10 is an impedance variation diagram of a signal bus in which a first type of adjustment device is deployed according to an embodiment of the present application;

[0036] Fig.11 is a schematic diagram of optionally deploying a second type of adjustment device on a signal bus wiring according to an embodiment of the present application;

[0037] Fig.12 is an impedance variation diagram of a signal bus in which a second type of adjustment device is deployed according to an embodiment of the present application;

[0038] Fig.13 is a schematic diagram of optionally deploying adjustment devices of different shapes on a signal bus according to an embodiment of the present application;

[0039] Fig.14 is a schematic diagram of a delay of a signal bus in which an adjustment device is deployed according to an embodiment of the present application;

[0040] Fig.15It is a hardware structure block diagram of a server device of a printed circuit board and configuration method according to an embodiment of the present application;

[0041] Fig.16 is a flow chart of a printed circuit board and a configuration method according to an embodiment of the present application;

[0042] Fig.17 It is a structural block diagram of a printed circuit board and a configuration device according to an embodiment of the present application. DETAILED DESCRIPTION

[0043] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0045] First, the terms involved in the embodiments of the present application are explained as follows:

[0046] BGA: Ball Grid Array.

[0047] BGA packaging technology is an improvement on the pin grid array (PGA), which is a packaging method that covers (or partially covers) a surface with pins arranged in a grid pattern. When in operation, it can transmit electronic signals from the integrated circuit to the printed circuit board (PCB) on which it is located. Under the BGA package, the pins at the bottom of the package are replaced by solder balls, each of which is originally a small solder ball fixed on it. These solder balls can be configured manually or through automated machines and positioned by flux. When the device is fixed to the PCB using surface mount technology, the arrangement of the solder balls at the bottom corresponds exactly to the position of the copper foil on the board. The production line then heats it, either in a reflow oven or an infrared oven, to dissolve the solder balls. Surface tension causes the melted solder balls to support the package points and align them to the circuit board. At the correct spacing, when the solder balls cool and fix, the formed solder joints can connect the device to the PCB.

[0048] UPI: Ultra Path Interconnect, super interconnection channel.

[0049] ‌UPI bus (Ultra Path Interconnect)‌ is a bus technology. UPI bus technology can improve the speed and ability of servers with multi-core CPUs to access system memory by interconnecting multiple CPUs. This technology improves the efficiency and reliability of data transmission through point-to-point connections, thereby improving the overall performance and stability of the server. The introduction of the UPI bus was developed to improve the stability and performance of servers in the context of increasing server demand with the advent of the era of big data and artificial intelligence. Compared with QPI, the UPI bus improves power efficiency through a new low-power state, improves transmission efficiency through a new packet format, and improves scalability through a protocol layer that does not require pre-allocation of resources.

[0050] QPI: Quick Path Interconnect, fast interconnect channel.

[0051] FEXT: Far-End Crosstalk.

[0052] NEXT: Near-End Crosstalk.

[0053] In this embodiment, a printed circuit board is provided. Figure 1 is a schematic diagram of an optional printed circuit board according to an embodiment of the present application, such as Figure 1 As shown, the printed circuit board includes: multiple rows of pads, signal buses 102 and 103 and multiple adjustment devices 104 arranged on the printed circuit board 101, a through hole 105-1 is arranged in the pad 105, and an anti-pad is arranged outside the pad 105. Taking the signal bus 102 as an example, the signal bus 102 includes a perforated portion 102-1 and a wiring portion 102-2, the perforated portion 102-1 is arranged in the through hole 105-1, the wiring portion 102-2 is arranged in the area between adjacent pads in different rows, the adjustment device 104 is arranged on the wiring portion 102-2, the adjustment device 104 is located in a target adjustment area (for example, the adjustment area 106), and the candidate adjustment area between adjacent pads in each row of the multiple rows of pads includes the target adjustment area; wherein the adjustment device 104 is used to adjust the quality of the signal transmitted by the signal bus 102 by adjusting the impedance of the signal bus 102 and adjusting the delay of the signal transmitted by the signal bus 102; the shape of the adjustment device includes a mirror symmetric shape.

[0054] It should be noted that in the embodiments of the present application, only the pad with an anti-pad is used as an example for explanation and illustration. In fact, it can include but is not limited to pads with an anti-pad and pads without an anti-pad, and the present application does not impose any restrictions on this.

[0055] Through the embodiments of the present application, the impedance of the signal bus and the delay of the signal bus transmission signal can be adjusted by, but not limited to, deploying an adjustment device on the wiring part of the signal bus. The adjustment device with a mirror-symmetrical shape can be, but not limited to, used to adjust the impedance of the signal bus to a uniform distribution, thereby improving the quality of the signal bus transmission signal. Therefore, the problem of low quality of the signal bus transmission signal on the printed circuit board is solved, thereby achieving the effect of improving the quality of the signal bus transmission signal on the printed circuit board.

[0056] As an optional example, the signal bus may be, but is limited to, a signal bus for transmitting signals on a printed circuit board, such as a UPI (Ultra Path Interconnect) bus. The signal bus may be, but is not limited to, one line or a pair of lines, etc. For example, when the signal bus includes a pair of lines, the signal bus may be, but is not limited to, a bus including a P (forward signal) signal line and an N (reverse signal) signal line of equal length between the same lane (channel). When the signal bus includes one line, the signal bus may be, but is not limited to, a UPI bus, or a PCIE (Peripheral Component Interconnect Express) bus, etc.

[0057] Optionally, in this embodiment, the delay of transmitting the signal may include, but is not limited to, the time required for the signal bus to transmit the signal.

[0058] Optionally, in this embodiment, the material of the adjustment device may include but is not limited to metal materials, such as copper, etc., and the present application does not impose any limitation on this.

[0059] In an exemplary embodiment, the mirror-symmetrical shape includes at least one of the following: an isosceles triangle, a combination of an isosceles trapezoid and a rectangle.

[0060] Optionally, in this embodiment, the isosceles triangle may include but is not limited to an equilateral triangle, and the mirror-symmetrical shape may include but is not limited to a circle, a semicircle, or the like.

[0061] Figure 2 is a schematic diagram of an optional mirror-symmetrical shape according to an embodiment of the present application, such as Figure 2 (a) and Figure 2 As shown in (c) in FIG. 1 , the mirror-symmetric shape may include, but is not limited to, a combination of an isosceles trapezoid and a rectangle, such as Figure 2 As shown in (b), the mirror-symmetric shape may include but is not limited to an isosceles triangle.

[0062] In an exemplary embodiment, the length of the base of the isosceles triangle is greater than or equal to 5 mils and less than or equal to 16 mils; the combined figure includes a first type of adjustment device and a second type of adjustment device, wherein in the first type of adjustment device, the length of the base of the combined figure is greater than or equal to 5 mils and less than or equal to 10 mils, and in the second type of adjustment device, the length of the base of the combined figure is greater than 10 mils and less than or equal to 16 mils.

[0063] Optionally, in this embodiment, the thickness of the adjustment device may be but is not limited to being the same as that of the signal bus. For example, the thickness of the signal bus may be but is not limited to including the thickness of the outer layer of 1.9 mil (mil, or milli-inch) and the thickness of the inner layer of 1.2 mil.

[0064] As an optional example, the size of the adjustment device may be determined, but not limited to, according to the material of the printed circuit board, and may be, but not limited to, take a board with a DK (Dielectric Constant) of 3.3 as an example. Figure 3 is a schematic diagram of the size of an optional adjustment device according to an embodiment of the present application Figure 1 ,like Figure 3 As shown in (b), the length of the base of the isosceles triangle may be, but is not limited to, 12 mils, and the height of the base of the isosceles triangle may be, but is not limited to, 4 mils (mils, or mils); Figure 3 As shown in (a), in the second type of adjustment device, the length of the bottom side of the combined figure may be but is not limited to 16 mils, the height of the rectangle may be but is not limited to 1.8 mils, the height of the combined figure may be but is not limited to 4.12 mils, and the length of the upper bottom side of the isosceles trapezoid may be but is not limited to 7.15 mils; Figure 3 As shown in (c), in the first type of adjustment device, the length of the bottom side of the combined figure may be but is not limited to 10 mils, the height of the rectangle may be but is not limited to 1.75 mils, the height of the combined figure may be but is not limited to 7 mils, and the length of the upper bottom side of the isosceles trapezoid may be but is not limited to 8.5 mils.

[0065] It can be but not limited to taking DK (Dielectric Constant) = 3.6 plate as an example. Figure 4 is a schematic diagram of the size of an optional adjustment device according to an embodiment of the present application Figure 2 ,like Figure 4As shown in (b), the length of the base of the isosceles triangle may be, but is not limited to, 12 mils, and the height of the base of the isosceles triangle may be, but is not limited to, 3.6 mils (mils, or mils); Figure 4 As shown in (a), in the second type of adjustment device, the length of the bottom side of the combined figure may be but is not limited to 16 mils, the height of the rectangle may be but is not limited to 1.8 mils, the height of the combined figure may be but is not limited to 3.8 mils, and the length of the upper bottom side of the isosceles trapezoid may be but is not limited to 7.5 mils; Figure 4 As shown in (c), in the first type of adjustment device, the length of the bottom side of the combined figure may be but is not limited to 10 mils, the height of the rectangle may be but is not limited to 1.75 mils, the height of the combined figure may be but is not limited to 6 mils, and the length of the upper bottom side of the isosceles trapezoid may be but is not limited to 8.5 mils.

[0066] In an exemplary embodiment, the target adjustment area is determined from the candidate adjustment areas based on a wiring method of the signal bus, wherein the wiring method includes: the area between the pads in adjacent rows passes through a pair of wiring portions of the signal bus, or the area between the pads in adjacent rows passes through a wiring portion of the signal bus.

[0067] Optionally, in this embodiment, the area between adjacent pads may be, but is not limited to, a wiring portion passing through a signal bus, or a wiring portion of a signal bus. Figure 5 This is a schematic diagram of an optional wiring method according to an embodiment of the present application. Figure 1 ,like Figure 5 As shown, pads and signal buses are deployed on the printed circuit board, through holes are deployed in the pads, and the area between adjacent rows of pads passes through the wiring parts of a pair of signal buses, for example, the wiring part of signal bus 1 and the wiring part of signal bus 2. Figure 6 This is a schematic diagram of an optional wiring method according to an embodiment of the present application. Figure 2 ,like Figure 6 As shown, pads and signal buses are deployed on the printed circuit board, through holes are deployed in the pads, and the area between adjacent rows of pads (for example, pads in the first row of pads and pads in the second row) only passes through the wiring portion of one signal bus.

[0068] In an exemplary embodiment, in a case where the wiring mode includes that the area between the pads of adjacent rows passes through the wiring portion of a pair of the signal buses, and the pair of the signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are disposed on the wiring portion of the first signal bus, and a second group of adjustment devices are disposed on the wiring portion of the second signal bus, wherein the height of the i-th adjustment device in the first group of adjustment devices is greater than 0 and less than or equal to a target quotient value, the height of the j-th adjustment device in the second group of adjustment devices is greater than 0 and less than or equal to the target quotient value, the target quotient value is equal to a value obtained by dividing a target difference value by 2, and the target difference value is equal to the j-th adjustment device in the second group of adjustment devices. a value obtained by subtracting a reference value from the spacing between a signal bus and a first candidate signal bus, the pads passed by the first candidate signal bus when passing through the outer side of the first signal bus, i is a positive integer, j is a positive integer; in the case where the wiring method includes an area between adjacent rows of pads passing through a wiring portion of the signal bus, the adjustment device is deployed on the wiring portion of the signal bus, wherein the height of the adjustment device is greater than 0 and less than or equal to the candidate difference value, wherein the candidate difference value is equal to the value obtained by subtracting a reference value from the spacing between the signal bus and the second candidate signal bus, the pads passed by the second candidate signal bus when passing through the outer side of the signal bus.

[0069] Optionally, in this embodiment, the first candidate signal bus may be, but is not limited to, passing through the same pad as the first signal bus, such as Figure 5 As shown, in the case where the outer side of the signal bus includes the wiring portion of the signal bus 2, the wiring portion of the signal bus 3 (equivalent to the first candidate signal bus) can but is not limited to also pass through the first row of pads. It can be understood that the wiring portion of the signal bus 2 and the wiring portion of the signal bus 3 pass through the same first row of pads.

[0070] Optionally, in this embodiment, when the wiring mode includes that the area between the adjacent rows of pads passes through the wiring portion of a pair of signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, the height of the adjustment device may be, but is not limited to, greater than 0 and less than or equal to h max1 , h can be calculated by but not limited to the following formula (1): max1 :

[0071]

[0072] Among them, h max1 is the target quotient value, L1 is the distance between the first signal bus and the first candidate signal bus, L1-10 is the target quotient value, the reference value may be but is not limited to 10, and the unit of the reference value is mil (milliinch).

[0073] Optionally, in this embodiment, the second candidate signal bus may be, but is not limited to, passing through the same pad as the signal bus. In the case where the wiring method includes the area between adjacent rows of pads passing through a wiring portion of the signal bus, the height of the adjustment device may be, but is not limited to, greater than 0 and less than or equal to h. max2 h can be calculated by, but is not limited to, the following formula (2): max2 :

[0074]

[0075] Among them, h max2 is a candidate difference value, L2 is the distance between the signal bus and the second candidate signal bus, L1-10 is a candidate quotient value, the reference value may be but is not limited to 10, and the unit of the reference value is mil (milliinch).

[0076] In an exemplary embodiment, in a case where the routing mode includes the area between the pads in adjacent rows passing through a pair of routing portions of the signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are deployed on the routing portion of the first signal bus, and a second group of adjustment devices are deployed on the routing portion of the second signal bus, wherein the first group of adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the first signal bus, the second group of adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the second signal bus, and the inner side of the routing portion of the first signal bus passes through the inner side of the routing portion of the second signal bus; in a case where the routing mode includes the area between the pads in adjacent rows passing through a routing portion of a signal bus, the adjustment devices are deployed on the routing portion of the signal bus, and the adjustment devices are located in an area between adjacent pads among a plurality of pads passed by the outer side of the routing portion of the signal bus.

[0077] Optionally, in this embodiment, the first group of adjustment devices and the second group of adjustment devices may include, but are not limited to, adjustment devices of the same shape, or may include adjustment devices of different shapes. Deploying adjustment devices on a signal bus can effectively reduce the impedance of the signal bus, and may be explained and illustrated by taking, but not limited to, deploying an adjustment device of one shape on the signal bus as an example.

[0078] Figure 7 is a schematic diagram of optionally deploying an isosceles triangle adjustment device on a signal bus according to an embodiment of the present application, such as Figure 7 (a) and Figure 7As shown in (b), the printed circuit board includes multiple rows of pads, signal buses and isosceles triangle adjustment devices, and through holes are arranged in the pads. It can be explained and illustrated by taking, but not limited to, the first signal bus including signal bus 1 and the second signal bus including signal bus 2 as an example. A first group of adjustment devices are arranged on the wiring portion of signal bus 1, and a second group of adjustment devices are arranged on the wiring portion of signal bus 2. The first group of adjustment devices and the second group of adjustment devices can include, but are not limited to, isosceles triangle adjustment devices. The first group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 1, and the second group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 2.

[0079] Figure 8 is an impedance variation diagram of a signal bus in which an isosceles triangle adjustment device is optionally deployed according to an embodiment of the present application, such as Figure 8 As shown, the horizontal axis is time, and the vertical axis is the impedance of the signal bus. The unit of the impedance of the signal bus can be but is not limited to ohm (Ω), or kilohm (KΩ), etc. Before the isosceles triangle adjustment device in the middle of the signal bus wiring part, the signal bus impedance is 48.67Ω. After the isosceles triangle device is deployed in the signal bus wiring part, the signal impedance is 44.96Ω. It can be understood that the deployment of the isosceles triangle adjustment device in the signal bus wiring part greatly reduces the impedance of the signal bus and improves the quality of the signal transmitted by the signal bus.

[0080] Optionally, in this embodiment, Fig. 9 is a schematic diagram of optionally deploying a first type of adjustment device on a signal bus according to an embodiment of the present application, such as Fig. 9 (a) and Fig. 9 As shown in (b), the printed circuit board includes multiple rows of pads, signal buses and a first type of adjustment device (or called a small trapezoid), and through holes are arranged in the pads. It can be explained and illustrated by taking, but not limited to, the first signal bus including signal bus 1 and the second signal bus including signal bus 2 as an example. A first group of adjustment devices are arranged on the wiring portion of signal bus 1, and a second group of adjustment devices are arranged on the wiring portion of signal bus 2. The first group of adjustment devices and the second group of adjustment devices can include, but are not limited to, the first type of adjustment devices. The first group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 1, and the second group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 2.

[0081] Fig.10 is an impedance variation diagram of a signal bus in which a first type of adjustment device is deployed according to an embodiment of the present application, such as Fig.10As shown, the horizontal axis is time, and the vertical axis is the impedance of the signal bus. Before the first type of adjustment device is deployed in the signal bus wiring portion, the signal bus impedance is 55.62Ω. After the first type of adjustment device is deployed in the signal bus wiring portion, the signal impedance is 47.83Ω. Deploying the first type of adjustment device in the signal bus wiring portion greatly reduces the impedance of the signal bus and improves the quality of the signal transmitted by the signal bus.

[0082] Fig.11 is a schematic diagram of optionally deploying a second type of adjustment device on the signal bus wiring according to an embodiment of the present application, such as Fig.11 (a) and Fig.11 As shown in (b), the printed circuit board includes multiple rows of pads, signal buses and a first type of adjustment device (or called a small trapezoid), and through holes are arranged in the pads. It can be explained and illustrated by taking, but not limited to, the first signal bus including signal bus 1 and the second signal bus including signal bus 2 as an example. A first group of adjustment devices are arranged on the wiring portion of signal bus 1, and a second group of adjustment devices are arranged on the wiring portion of signal bus 2. The first group of adjustment devices and the second group of adjustment devices can include, but are not limited to, the first type of adjustment devices. The first group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 1, and the second group of adjustment devices are located in the area between adjacent pads among the multiple pads passed by the outer side of the wiring portion of signal bus 2.

[0083] Fig.12 is an impedance variation diagram of a signal bus in which a second type of adjustment device is deployed according to an embodiment of the present application, such as Fig.12 As shown, the horizontal axis is time, and the vertical axis is the impedance of the signal bus. Before the second type of adjustment device is deployed in the signal bus wiring portion, the signal bus impedance is 90.27Ω. After the second type of adjustment device is deployed in the signal bus wiring portion, the signal impedance is 82.43Ω. Deploying the second type of adjustment device in the signal bus wiring portion will reduce the signal bus impedance.

[0084] Fig.13 is a schematic diagram of an optional deployment of adjustment devices of different shapes on a signal bus according to an embodiment of the present application, such as Fig.13 As shown, an isosceles triangle adjustment device is deployed on the wiring portion of the signal bus 1, and a first type of adjustment device and a second type of adjustment device are deployed alternately on the wiring portion of the signal bus 2. Through the embodiment of the present application, the mirror-symmetrical shape of the adjustment device can reduce the impedance of the signal bus, and by arranging the distribution of the three tabs, the coupling distance is shortened and the crosstalk is reduced.

[0085] In an exemplary embodiment, the printed circuit board further comprises: the soldering pad is used to solder the pins of the chip, and when the adjustment device comprises N adjustment devices and M pins are deployed on the chip, the distance between the i1th deployment position of the i1th adjustment device among the N adjustment devices on the wiring portion and the i1+1th deployment position of the i1+1th adjustment device on the wiring portion is equal to the distance between the corresponding i2th pin and i2+1th pin, wherein N is a positive integer, M is a positive integer, i1 is a positive integer less than or equal to N, i2 is a positive integer less than or equal to M, i1 is equal to i2, and the M pins include the i2th pin and the i2+1th pin.

[0086] Optionally, in this embodiment, a pad can be but is not limited to being used to weld a pin of a chip, one or more adjustment devices can be but is not limited to being deployed on the same signal bus, the shapes of adjacent adjustment devices deployed on the same line can be but are not limited to being the same or different, the distance between adjacent adjustment devices deployed on the same line can be but is not limited to being equal to the distance between the pins of the corresponding chips, it can be understood that the distance between adjacent adjustment devices deployed on the same line can be but is not limited to being equal to the distance between adjacent pads in the same row of pads, for example, the distance between the center points of adjacent adjustment devices deployed on the same line can be but is not limited to being equal to the distance between the center points of adjacent pads in the same row of pads.

[0087] In an exemplary embodiment, in a case where the wiring method includes that the area between the pads in adjacent rows passes through a pair of wiring portions of the signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are deployed on the wiring portion of the first signal bus, and a second group of adjustment devices are deployed on the wiring portion of the second signal bus, wherein the impedance of the first signal bus is equal to the impedance of the second signal bus, and the delay of the signal transmitted by the first signal bus is equal to the delay of the signal transmitted by the second signal bus; in a case where the wiring method includes that the area between the pads in adjacent rows passes through a wiring portion of the signal bus, a third group of adjustment devices are deployed on the wiring portion of the signal bus, wherein the impedance of the signal bus is less than or equal to an impedance threshold, and the delay of the signal transmitted by the signal bus is less than or equal to a delay threshold.

[0088] Optionally, in this embodiment, when a pair of signal buses pass between the two through holes, the adjustment device can adjust the impedance and delay of the two signal buses to be equal, thereby improving the signal quality of the signal bus transmission; when a signal bus passes between the two through holes, the adjustment device can adjust the impedance and delay of the signal bus so that the impedance and delay of the adjusted signal bus meet the requirements.

[0089] Fig.14 is a schematic diagram of a delay of a signal bus in which an adjustment device is deployed according to an embodiment of the present application, such as Fig.14 As shown, the horizontal axis is time and the vertical axis is delay. It can be seen that the delays of the three adjustment devices (e.g., tabs) are in order of length, that is, the second type of adjustment device (e.g., the first tab (large trapezoid)) has the shortest delay, the isosceles triangle adjustment device (e.g., the second tab (triangle)) has the second longest delay, and the first type of adjustment device (e.g., the third tab (small trapezoid)) has the longest delay.

[0090] The method embodiments provided in the embodiments of the present application can be executed in a server device or a similar computing device. Taking running on a server device as an example, Fig.15 1 is a hardware structure block diagram of a server device of a printed circuit board and configuration method according to an embodiment of the present application. Fig.15 As shown, the server device may include one or more ( Fig.15 Only one is shown in the figure) a processor 1502 (the processor 1502 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 1504 for storing data, wherein the above-mentioned server device may also include a transmission device 1506 for communication functions and an input and output device 1508. It can be understood by those skilled in the art that Fig.15 The structure shown is only for illustration and does not limit the structure of the above server device. Fig.15 More or fewer components as shown, or with Fig.15 Different configurations are shown.

[0091] The memory 1504 can be used to store computer programs, for example, software programs and modules of application software, such as a computer program corresponding to a printed circuit board and a configuration method in an embodiment of the present application. The processor 1502 executes various functional applications and data processing by running the computer program stored in the memory 1504, that is, to implement the above method. The memory 1504 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 1504 may further include a memory remotely arranged relative to the processor 1502, and these remote memories may be connected to the server device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0092] The transmission device 1506 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of the server device. In one example, the transmission device 1506 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 1506 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0093] In this embodiment, a printed circuit board and a configuration method are provided, which are applied to a configuration tool for a printed circuit board, wherein the configuration tool is used to connect a printed circuit board as described in any one of the items, wherein a signal bus deployed on the printed circuit board is an initial signal bus, wherein the initial signal bus is configured to allow deployment of a candidate adjustment device, wherein the candidate adjustment device is used to adjust a transmission parameter of a signal transmitted by the initial signal bus, Fig.16 is a flow chart of a printed circuit board and a configuration method according to an embodiment of the present application, such as Fig.16 As shown, the process includes the following steps:

[0094] Step S1602, detecting the initial transmission parameters of the initial signal bus;

[0095] Step S1604, when the initial signal quality corresponding to the initial transmission parameter is less than the signal quality threshold, select a target adjustment device from the candidate adjustment devices according to the initial transmission parameter and the corresponding transmission parameter threshold;

[0096] Step S1606, determining a target deployment position of the target adjustment device on the initial signal bus according to the deployment mode of the initial signal bus on the printed circuit board;

[0097] Step S1608, deploying the target adjustment device at the target deployment position to obtain a target printed circuit board on which a target signal bus is deployed, wherein a target signal quality corresponding to a target transmission parameter of the target signal bus is greater than or equal to the signal quality threshold.

[0098] Through the above steps, when the signal quality corresponding to the transmission parameters of the signal bus is less than the signal quality threshold, it can be indicated that the quality of the signal currently transmitted by the signal bus is low. In this case, a suitable adjustment device can be selected, and the selected adjustment device can be deployed at the corresponding deployment position on the signal bus to adjust the transmission parameters of the signal bus, thereby adjusting the quality of the signal transmitted by the signal bus. In this way, the problem of low quality of the signal transmitted by the signal bus on the printed circuit board is solved, thereby achieving the effect of improving the quality of the signal transmitted by the signal bus on the printed circuit board.

[0099] In the technical solution provided in the above step S1602, the initial transmission parameters of the initial signal bus may, but are not limited to, affect the quality of the signal transmitted by the initial signal bus. For example, the initial transmission parameters may, but are not limited to, include the impedance of the signal bus, the near-end crosstalk of the signal bus, the far-end crosstalk of the signal bus, and the like.

[0100] In an exemplary embodiment, the initial transmission parameters of the initial signal bus can be detected in the following manner, but is not limited to: when the initial transmission parameters include impedances at N detection positions on the initial signal bus, the i-th impedance at the i-th detection position among the N detection positions is detected by performing the following steps, wherein N is a positive integer and i is a positive integer less than or equal to N: detecting the inductance at the i-th detection position and the capacitance at the i-th detection position; determining the i-th impedance as a value obtained by performing a square operation on a reference quotient value, wherein the reference quotient value is equal to a value obtained by dividing the inductance at the i-th detection position by the capacitance at the i-th detection position.

[0101] Optionally, in this embodiment, the signal bus may be made into a raised structure (bulge) with a certain thickness, but is not limited thereto. The bulge can provide better signal integrity and reduce signal transmission loss during signal transmission, and can also reduce crosstalk and interference in the signal.

[0102] Optionally, in this embodiment, the ith impedance at the ith detection position among the N detection positions may be detected by, but is not limited to, formula (3):

[0103]

[0104] Among them, Z is the impedance of the signal bus, L is the inductance of the signal bus, and C is the capacitance of the signal bus.

[0105] It is understandable that, compared to the prior art method of making a pair of signal lines of equal length by bulging, the impedance discontinuity at the bulge will cause reflection and attenuation of the signal on the transmission line, thereby affecting the transmission quality of the signal. Through the embodiments of the present application, by adjusting the device to make the impedance of each part on the signal bus evenly distributed, the reflection of the signal caused by the impedance discontinuity is avoided, and the transmission quality and reliability of the entire signal link are improved.

[0106] In an exemplary embodiment, the initial transmission parameters of the initial signal bus can be detected in the following manner but is not limited to: when the initial transmission parameters include the near-end crosstalk of the initial signal bus, the near-end crosstalk of the initial signal bus is detected by performing the following steps: the near-end crosstalk of the initial signal bus is determined as a value obtained by performing a product operation on a proportional coefficient and a first sum value, wherein the first sum value is equal to a sum operation performed on a first quotient value and a second quotient value, wherein the first quotient value is equal to a value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, and the second quotient value is equal to a value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus.

[0107] Optionally, in this embodiment, the near-end crosstalk of the initial signal bus may be detected according to, but not limited to, formula (4):

[0108]

[0109] Where NEXT is the near-end crosstalk of the initial signal bus, C mL is the mutual capacitance per unit length, C L is the capacitance per unit length on the signal path, L mL is the mutual inductance per unit length, L L is the inductance per unit length on the signal path, and the proportionality coefficient may be, but is not limited to, 0.25.

[0110] In an exemplary embodiment, the initial transmission parameters of the initial signal bus may be detected in the following manner, but is not limited to: in the case where the initial transmission parameters include the far-end crosstalk of the initial signal bus, the far-end crosstalk of the initial signal bus is detected by performing the following steps: determining the far-end crosstalk of the initial signal bus as a value obtained by performing a product operation on a third quotient value, a fourth quotient value, and a first difference value, wherein the third quotient value is equal to a value obtained by dividing a target length by a length of a rising edge of a signal on other signal buses, the fourth quotient value is equal to a value obtained by dividing 1 by a target product value, and the target product value is equal to a value obtained by multiplying the adjustment The first difference is equal to the value obtained by subtracting the second quotient from the first quotient, wherein the first quotient is equal to the value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, the second quotient is equal to the value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus, the target length is the length of the coupling area between the initial signal bus and the other signal buses, and the signal transmitted on the other signal bus interferes with the signal transmitted on the initial signal bus.

[0111] Optionally, in this embodiment, the far-end crosstalk of the initial signal bus may be detected according to, but not limited to, formula (5):

[0112]

[0113] Where FEXT is the far-end crosstalk of the initial signal bus, Len is the length of the coupling area of ​​the two signal buses (equivalent to the target length), the adjustment coefficient can be but is not limited to 2, v is the signal propagation speed (or signal transmission speed), RT is the length of the rising edge of the signal on the other signal bus, C mL is the mutual capacitance per unit length, C L is the capacitance per unit length on the signal path, L mL Represents mutual inductance per unit length, L L Represents the inductance per unit length in the signal path.

[0114] In the technical solution provided in the above step S1604, when the initial signal quality corresponding to the initial transmission parameter is greater than or equal to the signal quality threshold, it can be indicated that the quality of the current transmission signal of the initial signal bus is high. In this case, there is no need to deploy an adjustment device on the signal bus.

[0115] Optionally, in this embodiment, the signal quality may be, but is not limited to, used to represent the accuracy of the signal transmitted by the signal bus, the bit error rate of the signal transmitted by the signal bus, or the transmission rate of the signal transmitted by the signal bus, etc.

[0116] Optionally, in this embodiment, different transmission parameters may have, but are not limited to having, corresponding transmission parameter thresholds. For example, the transmission parameter thresholds corresponding to different transmission parameters may be, but are not limited to, the same or different.

[0117] In an exemplary embodiment, it is possible but not limited to screening a target adjustment device from the candidate adjustment devices based on the initial transmission parameters and the corresponding transmission parameter thresholds: screening a reference adjustment device from the candidate adjustment devices based on a reference difference and a reference adjustment direction between the initial transmission parameters and the transmission parameter thresholds; deploying the reference adjustment device at a reference deployment position on the initial signal bus to obtain a printed circuit board on which a reference signal bus is deployed; and determining the reference adjustment device as the target adjustment device when a reference signal quality corresponding to a reference transmission parameter of the reference signal bus is greater than or equal to the signal quality threshold.

[0118] Optionally, in this embodiment, the reference deployment position may include but is not limited to all positions on the initial signal bus that allow the adjustment device to be deployed. As an optional example, the reference deployment position may include but is not limited to the area between adjacent pads in the same row of pads deployed on the printed circuit board.

[0119] Optionally, in this embodiment, it is possible but not limited to first selecting a reference adjustment device of one shape or multiple shapes based on the difference between the transmission parameter of the signal bus and the corresponding parameter threshold and the adjustment direction (for example, increasing or decreasing, etc.), and when the reference signal quality corresponding to the reference transmission parameter of the reference signal bus is greater than or equal to the signal quality threshold, it indicates that a suitable adjustment device has been selected.

[0120] When the reference signal quality corresponding to the reference transmission parameter of the reference signal bus is greater than the initial signal quality and less than the signal quality threshold, other adjustment devices different from the reference adjustment device are selected from the candidate adjustment devices according to the difference between the transmission parameter of the signal bus and the corresponding parameter threshold and the adjustment direction (for example, increase or decrease), and whether the signal quality corresponding to the initial signal bus of the other adjustment devices is greater than or equal to the signal quality threshold, until the quality of the signal transmitted by the signal bus on which the selected adjustment device is deployed is greater than or equal to the signal quality threshold.

[0121] Optionally, in this embodiment, when the reference signal quality corresponding to the reference transmission parameter of the reference signal bus is greater than the initial signal quality and less than the signal quality threshold, other adjustment devices different from the reference adjustment device can be selected from the candidate adjustment devices in the following manners, but not limited to: selecting an adjustment device with a shape different from the reference adjustment device, for example, selecting an adjustment device with a shape different from the reference adjustment device from the candidate adjustment devices; or, selecting an adjustment device with a shape different from the reference adjustment device, and combining the selected adjustment devices with other shapes with the reference adjustment device.

[0122] In an exemplary embodiment, it is possible but not limited to screening a reference adjustment device from the candidate adjustment devices based on a reference difference and a reference adjustment direction between the initial transmission parameter and the transmission parameter threshold: searching for an initial adjustment device corresponding to the reference adjustment direction from the candidate adjustment devices; and searching for the reference adjustment device corresponding to the reference difference from the initial adjustment devices.

[0123] Optionally, in the present embodiment, the execution order of the operations based on the reference difference and reference adjustment direction between the initial transmission parameter and the transmission parameter threshold, and the operations of screening the reference adjustment device from the candidate adjustment devices are not limited in the embodiments of the present application. For example, the operation of searching the initial adjustment device for the reference adjustment device corresponding to the reference difference may be performed first, and then the operation of searching the candidate adjustment device for the initial adjustment device corresponding to the reference adjustment direction may be performed.

[0124] Optionally, in this embodiment, the reference adjustment direction may be, but is not limited to, increasing or decreasing. For example, when the initial transmission parameter value is less than the transmission parameter threshold, the reference adjustment direction may be, but is not limited to, increasing; when the initial transmission parameter is greater than the transmission parameter threshold, the reference adjustment direction may be, but is not limited to, decreasing.

[0125] In the technical solution provided in the above step S1606, the initial signal bus is deployed on the printed circuit board in a manner that may include but is not limited to a pair of signal buses passing through the area between adjacent rows of pads or a signal bus passing through the area between adjacent rows of pads.

[0126] In an exemplary embodiment, multiple rows of pads may be arranged on a printed circuit board, but are not limited to, and the initial signal bus is arranged in a reference area between adjacent different rows of pads in the multiple rows of pads. The target deployment position of the target adjustment device on the initial signal bus is determined according to the deployment mode of the initial signal bus on the printed circuit board: when the initial signal bus is arranged in the reference area and a third signal bus is also arranged in the reference area, the target deployment position is determined as a portion of the initial signal bus in a first area and a portion of the third signal bus in a second area, wherein the first area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus, and the second area includes an area between adjacent pads among a plurality of pads passed by the outer side of the third signal bus; when the initial signal bus is arranged in the reference area and only the initial signal bus is arranged in the reference area, the target deployment position is determined as a portion of the initial signal bus in a third area, wherein the third area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus.

[0127] Optionally, in the present embodiment, the signal bus is deployed in a reference area between adjacent rows of pads, and other signal buses (for example, a third signal bus) are also deployed in the reference area. It can be understood that two signal buses pass through the reference area. In this case, the target adjustment device can be but is not limited to being deployed in an area between adjacent pads among the pads passed by the outer side of the initial signal bus, and an area between adjacent pads among the pads passed by the outer side of the third signal bus, and the inner side of the third signal bus is opposite to the inner side of the initial signal bus.

[0128] Optionally, in this embodiment, when the signal bus is deployed in a reference area between adjacent rows of pads and only one signal bus passes through the reference area, the target adjustment device can be but is not limited to being deployed in an area between adjacent pads among the pads passed by the outer side of the signal bus.

[0129] In an exemplary embodiment, the pad may be but is not limited to being used to solder the pins of the chip, and when the pins of the chip include P pins, the target deployment positions include Q deployment positions, and the target adjustment device includes Q adjustment devices, the method further includes: determining the distance between the r1th adjustment device at the r1+1th deployment position on the initial signal bus and the r1+1th deployment position on the r1+1th adjustment device at the initial signal bus as the distance between the corresponding r2th pin and r2+1th pin, wherein P is a positive integer, Q is a positive integer, r1 is a positive integer less than or equal to Q, r2 is a positive integer less than or equal to P, the Q deployment positions include the r1+1th deployment position and the r1+1th deployment position, the P pins include the r2th pin and the r2+1th pin, and r1 is equal to r2.

[0130] Optionally, in this embodiment, when a plurality of adjustment devices are deployed on a signal bus, the distance between adjacent adjustment devices may be, but is not limited to, equal to the distance between pins of the corresponding chip.

[0131] In the technical solution provided in the above step S1608, by deploying the adjustment device at the corresponding deployment position on the signal bus, the transmission parameters (such as impedance and delay, etc.) of the signal bus are adjusted, thereby improving the quality of the signal transmitted by the signal bus.

[0132] Through the embodiments of the present application, the design of BGA fan-out involves multiple considerations and technical challenges, and it is necessary to comprehensively consider impedance optimization, crosstalk control, consistency of hole layout, and consideration of via size to ensure the performance and reliability of the circuit board. The present invention designs three tabs with different delays, which can effectively solve the situation of impedance mismatch in BGA routing. By combining different tabs, the wiring form of "bulging" can be avoided in the BGA area to achieve the purpose of equal delay. By using different tabs for adjacent lines, crosstalk can be reduced to improve signal quality.

[0133] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0134] In this embodiment, a signal bus configuration device for a printed circuit board is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0135] Fig.17 is a structural block diagram of a printed circuit board and a configuration device according to an embodiment of the present application, such as Fig.17 As shown, the device is applied to a configuration tool for a printed circuit board, the configuration tool is used to connect a printed circuit board as described in any one of the items, the signal bus deployed on the printed circuit board is an initial signal bus, the initial signal bus is configured to allow the deployment of a candidate adjustment device, the candidate adjustment device is used to adjust the transmission parameters of the signal transmitted by the initial signal bus, and the device includes:

[0136] A detection module 1702, configured to detect initial transmission parameters of the initial signal bus;

[0137] A screening module 1704 is configured to screen a target adjustment device from the candidate adjustment devices according to the initial transmission parameters and the corresponding transmission parameter threshold when the initial signal quality corresponding to the initial transmission parameters is less than the signal quality threshold;

[0138] A determination module 1706, configured to determine a target deployment position of the target adjustment device on the initial signal bus according to a deployment mode of the initial signal bus on the printed circuit board;

[0139] The deployment module 1708 is used to deploy the target adjustment device at the target deployment position to obtain a target printed circuit board with a target signal bus deployed, wherein the target signal quality corresponding to the target transmission parameter of the target signal bus is greater than or equal to the signal quality threshold.

[0140] Through the above-mentioned device, when the signal quality corresponding to the transmission parameters of the signal bus is less than the signal quality threshold, it can be indicated that the quality of the signal currently transmitted by the signal bus is low. In this case, a suitable adjustment device can be selected, and the selected adjustment device can be deployed at the corresponding deployment position on the signal bus to adjust the transmission parameters of the signal bus, thereby adjusting the quality of the signal transmitted by the signal bus. In this way, the problem of low quality of the signal transmitted by the signal bus on the printed circuit board is solved, thereby achieving the effect of improving the quality of the signal transmitted by the signal bus on the printed circuit board.

[0141] In an exemplary embodiment, the detection module is used to:

[0142] In the case where the initial transmission parameter includes impedances at N detection positions on the initial signal bus, the i-th impedance at the i-th detection position among the N detection positions is detected by performing the following steps, wherein N is a positive integer and i is a positive integer less than or equal to N:

[0143] Detecting the inductance at the i-th detection position and the capacitance at the i-th detection position;

[0144] The i-th impedance is determined as a value obtained by squaring a reference quotient value, wherein the reference quotient value is equal to a value obtained by dividing the inductance at the i-th detection position by the capacitance at the i-th detection position.

[0145] In an exemplary embodiment, the detection module is used to:

[0146] In a case where the initial transmission parameter includes the near-end crosstalk of the initial signal bus, the near-end crosstalk of the initial signal bus is detected by performing the following steps:

[0147] The near-end crosstalk of the initial signal bus is determined as a value obtained by performing a product operation on a proportional coefficient and a first sum value, wherein the first sum value is equal to a sum operation performed on a first quotient value and a second quotient value, wherein the first quotient value is equal to a value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, and the second quotient value is equal to a value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus.

[0148] In an exemplary embodiment, the detection module is further configured to:

[0149] The detecting the initial transmission parameters of the initial signal bus comprises: when the initial transmission parameters include the far-end crosstalk of the initial signal bus, detecting the far-end crosstalk of the initial signal bus by performing the following steps:

[0150] The far-end crosstalk of the initial signal bus is determined as a value obtained by performing a product operation on a third quotient, a fourth quotient and a first difference, wherein the third quotient is equal to a value obtained by dividing a target length by a length of a rising edge of a signal on other signal buses, the fourth quotient is equal to a value obtained by dividing 1 by a target product value, the target product value is equal to a value obtained by performing a product operation on an adjustment coefficient and a signal transmission speed, the first difference is equal to a value obtained by subtracting a second quotient from a first quotient, wherein the first quotient is equal to a value obtained by dividing a unit length mutual capacitance of the initial signal bus by a unit length capacitance of the initial signal bus on a unit path, the second quotient is equal to a value obtained by dividing a unit length mutual inductance of the initial signal bus by a unit length inductance of the initial signal bus, the target length is a length of a coupling region between the initial signal bus and the other signal buses, and a signal transmitted on the other signal buses interferes with a signal transmitted on the initial signal bus.

[0151] In an exemplary embodiment, the screening module includes:

[0152] a screening unit, configured to screen a reference adjustment device from the candidate adjustment devices according to a reference difference between the initial transmission parameter and the transmission parameter threshold and a reference adjustment direction;

[0153] A deployment unit, configured to deploy the reference adjustment device at a reference deployment position on the initial signal bus to obtain a printed circuit board on which the reference signal bus is deployed;

[0154] The first determining unit is configured to determine the reference adjustment device as the target adjustment device when a reference signal quality corresponding to a reference transmission parameter of the reference signal bus is greater than or equal to the signal quality threshold.

[0155] In an exemplary embodiment, the screening unit is used to:

[0156] Searching for an initial adjustment device corresponding to the reference adjustment direction from the candidate adjustment devices;

[0157] The reference adjustment device corresponding to the reference difference value is searched from the initial adjustment devices.

[0158] In an exemplary embodiment, a plurality of rows of pads are disposed on the printed circuit board, the initial signal bus is disposed in a reference area between adjacent rows of pads in the plurality of rows of pads, and the determination module includes:

[0159] a second determining unit, configured to determine the target deployment position as a portion of the initial signal bus in the first region and a portion of the third signal bus in the second region, when the initial signal bus is deployed in the reference region and a third signal bus is also deployed in the reference region, wherein the first region includes a region between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus, and the second region includes a region between adjacent pads among a plurality of pads passed by the outer side of the third signal bus;

[0160] A third determination unit is used to determine the target deployment position as a portion of the initial signal bus in a third area when the initial signal bus is deployed in the reference area and only the initial signal bus is deployed in the reference area, wherein the third area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus.

[0161] In an exemplary embodiment, the pad is used to weld the pins of the chip. When the pins of the chip include P pins, the target deployment positions include Q deployment positions, and the target adjustment device includes Q adjustment devices, the above-mentioned apparatus further includes: a determination module, used to determine the distance between the r1th adjustment device at the r1+1th deployment position on the initial signal bus and the r1+1th deployment position on the initial signal bus of the r1th adjustment device as the distance between the corresponding r2th pin and the r2+1th pin, wherein P is a positive integer, Q is a positive integer, r1 is a positive integer less than or equal to Q, r2 is a positive integer less than or equal to P, the Q deployment positions include the r1+1th deployment position and the r1+1th deployment position, the P pins include the r2th pin and the r2+1th pin, and r1 is equal to r2.

[0162] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0163] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.

[0164] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0165] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0166] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0167] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any one of the above method embodiments are implemented.

[0168] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0169] An embodiment of the present application also provides a computer program, which includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device performs the steps in any one of the above method embodiments.

[0170] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0171] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0172] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A printed circuit board, characterized in that: The method comprises a plurality of rows of pads, a signal bus and an adjustment device disposed on a printed circuit board, wherein a through hole is disposed in the pad, the signal bus comprises a through hole portion and a wiring portion, the through hole portion is disposed in the through hole, the wiring portion is disposed in an area between adjacent pads in different rows, the adjustment device is disposed on the wiring portion, the adjustment device is located in a target adjustment area, and a candidate adjustment area between adjacent pads in each row of the plurality of pads comprises the target adjustment area; Wherein, the adjustment device is used to adjust the quality of the signal transmitted by the signal bus by adjusting the impedance of the signal bus and adjusting the delay of the signal transmitted by the signal bus; The shape of the adjustment device includes a mirror-symmetrical shape; The mirror-symmetrical shape includes at least one of the following: an isosceles triangle, a combination of an isosceles trapezoid and a rectangle, a circle, and a semicircle; The target adjustment region is determined from the candidate adjustment regions according to a wiring pattern of the signal bus, wherein the wiring pattern includes: the region between the pads of adjacent rows passes through a pair of wiring portions of the signal bus; In the case where the wiring method includes that the area between the pads in adjacent rows passes through the wiring portion of a pair of the signal buses, and the pair of the signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are deployed on the wiring portion of the first signal bus, and a second group of adjustment devices are deployed on the wiring portion of the second signal bus, wherein the height of the i-th adjustment device in the first group of adjustment devices is greater than 0 and less than or equal to a target quotient value, the height of the j-th adjustment device in the second group of adjustment devices is greater than 0 and less than or equal to the target quotient value, the target quotient value is equal to a value obtained by dividing a target difference value by 2, and the target difference is equal to the spacing between the first signal bus and the first candidate signal bus minus a reference value The obtained value is the pad through which the first candidate signal bus passes through the outside of the first signal bus, i is a positive integer, j is a positive integer, wherein the shape of the adjustment devices included in the first group of adjustment devices is different from the shape of the adjustment devices included in the second group of adjustment devices, the first group of adjustment devices includes adjustment devices of any two different shapes of the mirror-symmetrical shapes, the second group of adjustment devices includes adjustment devices of any one shape of the mirror-symmetrical shapes, the first group of adjustment devices and the second group of adjustment devices are used to shorten the coupling distance between the first signal bus and the second signal bus, and reduce the crosstalk between the first signal bus and the second signal bus, wherein the reference value is equal to 10.

2. The printed circuit board according to claim 1, characterized in that: The length of the base of the isosceles triangle is greater than or equal to 5 mils and less than or equal to 16 mils; The combined pattern includes a first type of adjustment device and a second type of adjustment device, wherein in the first type of adjustment device, the length of the bottom side of the combined pattern is greater than or equal to 5 mils and less than or equal to 10 mils, and in the second type of adjustment device, the length of the bottom side of the combined pattern is greater than 10 mils and less than or equal to 16 mils.

3. The printed circuit board according to claim 1, characterized in that: The wiring method may include: the area between the pads in adjacent rows passes through a wiring portion of the signal bus.

4. The printed circuit board according to claim 1, characterized in that: In the case where the wiring method includes the area between adjacent rows of the pads passing through a wiring portion of the signal bus, the adjustment device is deployed on the wiring portion of the signal bus, wherein the height of the adjustment device is greater than 0 and less than or equal to a candidate difference value, wherein the candidate difference value is equal to the value obtained by subtracting a reference value from the spacing between the signal bus and a second candidate signal bus, and the second candidate signal bus passes through the pads on the outside of the signal bus.

5. The printed circuit board according to claim 1, characterized in that: In the case where the wiring mode includes that the area between the pads in adjacent rows passes through the wiring portion of a pair of the signal buses, and the pair of the signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are disposed on the wiring portion of the first signal bus, and a second group of adjustment devices are disposed on the wiring portion of the second signal bus, wherein the first group of adjustment devices are located in the area between adjacent pads among the plurality of pads passed by the outer side of the wiring portion of the first signal bus, the second group of adjustment devices are located in the area between adjacent pads among the plurality of pads passed by the outer side of the wiring portion of the second signal bus, and the inner side of the wiring portion of the first signal bus passes through the inner side of the wiring portion of the second signal bus; In a case where the wiring method includes the area between adjacent rows of pads passing through a wiring portion of the signal bus, the adjustment device is deployed on the wiring portion of the signal bus, and the adjustment device is located in the area between adjacent pads among the plurality of pads passed on the outside of the wiring portion of the signal bus.

6. The printed circuit board according to claim 1, characterized in that: The invention comprises: the pad is used for welding the pins of the chip, and when the adjustment device comprises N adjustment devices and M pins are deployed on the chip, the distance between the i1th deployment position of the i1th adjustment device among the N adjustment devices on the wiring part and the i1+1th deployment position of the i1+1th adjustment device on the wiring part is equal to the distance between the corresponding i2th pin and i2+1th pin, wherein N is a positive integer, M is a positive integer, i1 is a positive integer less than or equal to N, i2 is a positive integer less than or equal to M, i1 is equal to i2, and the M pins include the i2th pin and the i2+1th pin.

7. The printed circuit board according to claim 1, characterized in that: In the case where the wiring mode includes that the area between the pads in adjacent rows passes through a pair of wiring portions of the signal buses, and the pair of signal buses includes a first signal bus and a second signal bus, a first group of adjustment devices are disposed on the wiring portion of the first signal bus, and a second group of adjustment devices are disposed on the wiring portion of the second signal bus, wherein the impedance of the first signal bus is equal to the impedance of the second signal bus, and the delay of the signal transmitted by the first signal bus is equal to the delay of the signal transmitted by the second signal bus; In a case where the wiring method includes an area between adjacent rows of the pads passing through a wiring portion of the signal bus, a third group of adjustment devices is deployed on the wiring portion of the signal bus, wherein the impedance of the signal bus is less than or equal to an impedance threshold, and the delay of the signal bus transmitting the signal is less than or equal to a delay threshold.

8. A signal bus configuration method for a printed circuit board, characterized in that: A configuration tool for a printed circuit board, the configuration tool being used to connect the printed circuit board as claimed in any one of claims 1 to 7, the signal bus deployed on the printed circuit board being an initial signal bus, the initial signal bus being configured to allow deployment of a candidate adjustment device, the candidate adjustment device being used to adjust a transmission parameter of a signal transmitted by the initial signal bus, the method comprising: Detecting initial transmission parameters of the initial signal bus; When the initial signal quality corresponding to the initial transmission parameter is less than the signal quality threshold, selecting a target adjustment device from the candidate adjustment devices according to the initial transmission parameter and the corresponding transmission parameter threshold; Determining a target deployment position of the target adjustment device on the initial signal bus according to a deployment mode of the initial signal bus on the printed circuit board; The target adjustment device is deployed at the target deployment position to obtain a target printed circuit board on which a target signal bus is deployed, wherein a target signal quality corresponding to a target transmission parameter of the target signal bus is greater than or equal to the signal quality threshold.

9. The method according to claim 8, characterized in that The detecting the initial transmission parameters of the initial signal bus includes: In the case where the initial transmission parameter includes impedances at N detection positions on the initial signal bus, the i-th impedance at the i-th detection position among the N detection positions is detected by performing the following steps, wherein N is a positive integer and i is a positive integer less than or equal to N: Detecting the inductance at the i-th detection position and the capacitance at the i-th detection position; The i-th impedance is determined as a value obtained by squaring a reference quotient value, wherein the reference quotient value is equal to a value obtained by dividing the inductance at the i-th detection position by the capacitance at the i-th detection position.

10. The method according to claim 8, characterized in that The detecting the initial transmission parameters of the initial signal bus includes: In a case where the initial transmission parameter includes the near-end crosstalk of the initial signal bus, the near-end crosstalk of the initial signal bus is detected by performing the following steps: The near-end crosstalk of the initial signal bus is determined as a value obtained by performing a product operation on a proportionality coefficient and a first sum value, wherein the first sum value is equal to a sum operation performed on a first quotient value and a second quotient value, wherein the first quotient value is equal to a value obtained by dividing the mutual capacitance per unit length of the initial signal bus by the capacitance per unit length of the initial signal bus on a unit path, and the second quotient value is equal to a value obtained by dividing the mutual inductance per unit length of the initial signal bus by the inductance per unit length of the initial signal bus, and the proportionality coefficient is equal to 0.

25.

11. The method according to claim 8, characterized in that The detecting the initial transmission parameters of the initial signal bus comprises: when the initial transmission parameters include the far-end crosstalk of the initial signal bus, detecting the far-end crosstalk of the initial signal bus by performing the following steps: The far-end crosstalk of the initial signal bus is determined as a value obtained by performing a product operation on a third quotient, a fourth quotient and a first difference, wherein the third quotient is equal to a value obtained by dividing a target length by a length of a rising edge of a signal on other signal buses, the fourth quotient is equal to a value obtained by dividing 1 by a target product value, the target product value is equal to a value obtained by performing a product operation on an adjustment coefficient and a signal transmission speed, the first difference is equal to a value obtained by subtracting a second quotient from a first quotient, wherein the first quotient is equal to a value obtained by dividing a unit length mutual capacitance of the initial signal bus by a unit length capacitance of the initial signal bus on a unit path, the second quotient is equal to a value obtained by dividing a unit length mutual inductance of the initial signal bus by a unit length inductance of the initial signal bus, the target length is a length of a coupling region between the initial signal bus and the other signal buses, and a signal transmitted on the other signal buses interferes with a signal transmitted on the initial signal bus.

12. The method according to claim 8, characterized in that The step of selecting a target adjustment device from the candidate adjustment devices according to the initial transmission parameter and the corresponding transmission parameter threshold comprises: screening a reference adjustment device from the candidate adjustment devices according to a reference difference between the initial transmission parameter and the transmission parameter threshold and a reference adjustment direction; Deploy the reference adjustment device at a reference deployment position on the initial signal bus to obtain a printed circuit board on which the reference signal bus is deployed; In a case where the reference signal quality corresponding to the reference transmission parameter of the reference signal bus is greater than or equal to the signal quality threshold, the reference adjustment device is determined as the target adjustment device.

13. The method according to claim 12, characterized in that The step of selecting a reference adjustment device from the candidate adjustment devices according to a reference difference between the initial transmission parameter and the transmission parameter threshold and a reference adjustment direction includes: Searching for an initial adjustment device corresponding to the reference adjustment direction from the candidate adjustment devices; The reference adjustment device corresponding to the reference difference value is searched from the initial adjustment devices.

14. The method according to claim 8, characterized in that The printed circuit board is provided with multiple rows of pads, the initial signal bus is provided in a reference area between adjacent different rows of pads in the multiple rows of pads, and the target deployment position of the target adjustment device on the initial signal bus is determined according to the deployment mode of the initial signal bus on the printed circuit board, including: In a case where the initial signal bus is deployed in the reference area and a third signal bus is also deployed in the reference area, the target deployment position is determined as a portion of the initial signal bus in the first area and a portion of the third signal bus in the second area, wherein the first area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus, and the second area includes an area between adjacent pads among a plurality of pads passed by the outer side of the third signal bus; When the initial signal bus is deployed in the reference area and only the initial signal bus is deployed in the reference area, the target deployment position is determined as the portion of the initial signal bus in a third area, wherein the third area includes an area between adjacent pads among a plurality of pads passed by the outer side of the initial signal bus.

15. The method according to claim 14, characterized in that The pad is used for welding the pins of the chip. When the pins of the chip include P pins, the target deployment positions include Q deployment positions, and the target adjustment device includes Q adjustment devices, the method further includes: determining the distance between the r1th adjustment device at the r1+1th deployment position on the initial signal bus and the r1+1th deployment position on the initial signal bus of the r1th adjustment device as the distance between the corresponding r2th pin and r2+1th pin, wherein P is a positive integer, Q is a positive integer, r1 is a positive integer less than or equal to Q, r2 is a positive integer less than or equal to P, the Q deployment positions include the r1+1th deployment position and the r1+1th deployment position, the P pins include the r2th pin and the r2+1th pin, and r1 is equal to r2.

16. A signal bus configuration device for a printed circuit board, characterized in that: A configuration tool for a printed circuit board according to claim 1, wherein the configuration tool is used to connect the printed circuit board, the signal bus deployed on the printed circuit board is an initial signal bus, the initial signal bus is configured to allow deployment of a candidate adjustment device, the candidate adjustment device is used to adjust a transmission parameter of a signal transmitted by the initial signal bus, and the device comprises: A detection module, used for detecting the initial transmission parameters of the initial signal bus; a screening module, configured to screen a target adjustment device from the candidate adjustment devices according to the initial transmission parameters and the corresponding transmission parameter threshold when the initial signal quality corresponding to the initial transmission parameters is less than a signal quality threshold; A determination module, configured to determine a target deployment position of the target adjustment device on the initial signal bus according to a deployment mode of the initial signal bus on the printed circuit board; A deployment module is used to deploy the target adjustment device at the target deployment position to obtain a target printed circuit board with a target signal bus deployed, wherein the target signal quality corresponding to the target transmission parameter of the target signal bus is greater than or equal to the signal quality threshold.

17. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method described in any one of claims 8 to 15 when executed by a processor.

18. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method described in any one of claims 8 to 15 are implemented.

19. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method described in any one of claims 8 to 15 are implemented.

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