Plating method and plating device

Abstract

A plating method, which plates a substrate by using a plating device equipped with a substrate holder, wherein the substrate holder includes a contact component that can be in conductive contact with the substrate, the plating method comprising: a step of rotating the substrate holder at a first rotational speed while the substrate holder is tilted; a step of discharging liquid toward the substrate holder rotating at the first rotational speed so as to supply the liquid to the contact component; a step of stopping the discharge of the liquid; a step of starting to reduce the inclination of the substrate holder toward a horizontal position within a specified time before or after stopping the discharge of the liquid; a step of rotating the substrate holder at a second rotational speed faster than the first rotational speed while the substrate holder is in the horizontal position; and a step of plating the substrate after the substrate is mounted on the substrate holder.

Description

Technical Field

[0001] The present invention relates to a plating method and a plating device. Background Art

[0002] As an example of a plating apparatus, a cup-type electrolytic plating apparatus is known. In a cup-type electrolytic plating apparatus, a substrate (e.g., a semiconductor wafer) is immersed in a plating solution and a voltage is applied between the substrate and an anode to deposit a conductive film on the surface of the substrate. The substrate (e.g., a semiconductor wafer) is held by a substrate holder with the surface to be plated facing downward (see Patent Documents 1 and 2).

[0003] The substrate holder of such a plating device is provided with a contact member for contacting the substrate and supplying power. In addition, the substrate holder is provided with a sealing member for sealing the contact member so that the plating liquid does not come into contact with the contact member during the plating process.

[0004] Patent Document 1: Japanese Patent No. 7047200

[0005] Patent Document 2: Japanese Patent No. 7081063

[0006] Patent Document 3: U.S. Patent Application Publication No. 2017 / 0056934

[0007] If there is dirt or plating liquid on the contact parts, power supply deviation will occur during the plating process, thereby reducing the uniformity of the thickness of the formed plating. Patent Document 3 describes a cleaning device that sprays a cleaning liquid onto the electrical contact. In Patent Documents 1 and 2, the cleaning liquid is used to uniformly wet the entire contact part, thereby preventing power supply deviation during the plating process. It is hoped that the power supply deviation during the plating process can be more reliably reduced without the need for cumbersome operations. Summary of the Invention

[0008] The present invention has been made in view of the above problems, and one of its objects is to provide a plating method and a plating apparatus that can more reliably reduce power supply variations during plating and improve the uniformity of the thickness of the plating formed on the substrate without requiring complicated work.

[0009] According to one embodiment of the present invention, a plating method is provided, wherein a substrate is plated using a plating apparatus having a substrate holder, wherein the substrate holder includes a contact member capable of conductively contacting the substrate. The plating method includes: tilting the substrate holder; rotating the substrate holder at a first rotational speed while the substrate holder is tilted; discharging liquid toward the substrate holder rotating at the first rotational speed so as to supply the liquid to the contact member; stopping the discharge of the liquid; starting to reduce the tilt of the substrate holder toward a horizontal position within a predetermined time before or after stopping the discharge of the liquid; rotating the substrate holder at a second rotational speed faster than the first rotational speed while the substrate holder is in the horizontal position; stopping the rotation of the substrate holder at the second rotational speed; mounting the substrate on the substrate holder whose rotation has been stopped; and performing the plating process on the mounted substrate.

[0010] According to another aspect of the present invention, a plating apparatus is provided, comprising a substrate holder including a contact member capable of electrically contacting a substrate, and a control device. The control device of the plating apparatus is configured to: tilt the substrate holder, rotate the substrate holder at a first rotational speed while the substrate holder is tilted, discharge liquid toward the substrate holder rotating at the first rotational speed to supply the liquid to the contact member, stop the discharge of the liquid, begin to reduce the tilt of the substrate holder toward a horizontal position within a predetermined time before or after the cessation of the discharge of the liquid, rotate the substrate holder at a second rotational speed faster than the first rotational speed while the substrate holder is in the horizontal position, stop the rotation of the substrate holder at the second rotational speed, mount the substrate on the substrate holder whose rotation has been stopped, and perform the plating process on the mounted substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to this embodiment.

[0012] Figure 2 It is a plan view showing the overall structure of the plating apparatus according to this embodiment.

[0013] Figure 3 It is a longitudinal sectional view schematically showing the structure of the plating module according to the present embodiment.

[0014] Figure 4 It is a cross-sectional view schematically showing the substrate holder according to this embodiment.

[0015] Figure 5It is a cross-sectional view schematically showing a substrate holder of a contact member according to this embodiment.

[0016] Figure 6 Schematic diagram showing the configuration of a control module according to this embodiment.

[0017] Figure 7 This is a flowchart showing the flow of the plating method according to this embodiment.

[0018] Figure 8 1 is a flowchart showing the flow of a process for supplying liquid to a contact member in this embodiment.

[0019] Figure 9 It is a cross-sectional view schematically showing the step of tilting the substrate holder.

[0020] Figure 10 It is a cross-sectional view schematically showing the step of rotating the substrate holder at the first rotation speed.

[0021] Figure 11 1 is a cross-sectional view schematically showing the step of discharging liquid toward the substrate holder.

[0022] Figure 12 This is a cross-sectional view schematically showing a state in which the substrate holder is located in a horizontal position after the inclination of the substrate holder is reduced.

[0023] Figure 13 It is a cross-sectional view schematically showing the liquid supplied to the contact member.

[0024] Figure 14 It is a cross-sectional view schematically showing the step of rotating the substrate holder at the first rotation speed.

[0025] Figure 15 It is a cross-sectional view schematically showing the liquid supplied to the contact member.

[0026] Figure 16 This is a cross-sectional view schematically showing the discharge of liquid toward the substrate holder in Modification 1.

[0027] Figure 17 This is a cross-sectional view schematically showing the discharge of liquid toward the substrate holder in Modification 2.

[0028] Figure 18 This is a plan view schematically showing the discharge of liquid onto the substrate holder in Modification 3.

[0029] Figure 19 This is a side view schematically showing the discharge of liquid toward the substrate holder in Modification 3. DETAILED DESCRIPTION

[0030] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, identical or corresponding components are denoted by identical reference numerals, and redundant descriptions will be omitted.

[0031] <Overall structure of the plating equipment>

[0032] Figure 1 It is a perspective view showing the overall structure of the plating apparatus 1000 according to this embodiment. Figure 2 1 is a top view showing the overall structure of the plating device 1000. Figure 1 and Figure 2 As shown, the plating apparatus 1000 includes a load port 100 , a transfer robot 110 , an aligner 120 , a pre-wet module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin dryer 600 , a transfer device 700 , and a control module 800 .

[0033] The loading port 100 is a module for loading substrates stored in a cassette (not shown) such as a FOUP into the plating apparatus 1000, or for unloading substrates from the plating apparatus 1000 to a cassette. In this embodiment, four loading ports 100 are arranged horizontally side by side, but the number and arrangement of the loading ports 100 are arbitrary. The transfer robot 110 is a robot for transferring substrates and is configured to transfer substrates between the loading port 100, the aligner 120, and the transfer apparatus 700. When transferring substrates between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrates via a temporary stage (not shown).

[0034] Aligner 120 is a module for aligning the position of the orientation plane or recess of substrate with a prescribed direction. In the present embodiment, two aligners 120 are arranged in a horizontal direction, but the number and configuration of aligners 120 are arbitrary. Pre-wetting module 200 utilizes treatment fluids such as pure water or degassed water (pre-wetting liquid) to wet the plated surface of the substrate before the plating process, thereby replacing the air inside the pattern formed on the substrate surface with treatment fluid. Pre-wetting module 200 is configured to implement pre-wetting process, and this pre-wetting process replaces the treatment fluid inside the pattern with plating fluid during plating, thereby easily supplying the process of plating fluid to the inside of the pattern. In the present embodiment, two pre-wetting modules 200 are arranged in a vertical direction, but the number and configuration of pre-wetting module 200 are arbitrary.

[0035] The prepreg module 300 is configured to perform a prepreg treatment, which is a treatment process for cleaning or activating the surface of the plated substrate by etching away a relatively resistive oxide film such as a seed layer surface formed on the plated surface of the substrate before the plating treatment using a treatment solution such as sulfuric acid or hydrochloric acid. In the present embodiment, two prepreg modules 300 are arranged in an up-down direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two groups of plating modules 400, each of which is arranged in an up-down direction with three units and in a horizontal direction with four units, a total of 12 units. A total of 24 plating modules 400 are provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0036] The cleaning module 500 is configured to perform cleaning on the substrate in order to remove the plating solution etc. remaining on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for rotating the substrate after the cleaning process at high speed to dry it. In the present embodiment, two spin dryers are arranged in the vertical direction, but the number and configuration of the spin dryers are arbitrary. The conveying device 700 is a device for conveying substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, and for example, can be composed of a common computer or a special computer having an input and output interface with an operator.

[0037] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the loading port 100. Next, the transport robot 110 removes the substrate from the cassette in the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the position of the substrate's orientation flats, notches, etc., with a predetermined orientation. The transport robot 110 delivers the substrate, aligned by the aligner 120, to the transport apparatus 700.

[0038] The transport device 700 transports the substrate received from the transport robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The transport device 700 transports the pre-wetting substrate to the prepreg module 300. The prepreg module 300 performs a pre-preg process on the substrate. The transport device 700 transports the pre-preg substrate to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0039] The transport device 700 transports the plated substrates to the cleaning module 500. The cleaning module 500 cleans the substrates. The transport device 700 transports the cleaned substrates to the spin dryer 600. The spin dryer 600 dries the substrates. The transport device 700 hands the dried substrates to the transport robot 110. The transport robot 110 transports the substrates received from the transport device 700 to the cassette on the load port 100. Finally, the cassette containing the substrates is unloaded from the load port 100.

[0040] <Structure of the plating module>

[0041] Next, the structure of the plating module 400 will be described. In this embodiment, the 24 plating modules 400 have the same structure, so only one plating module 400 will be described. Figure 3 4 is a longitudinal sectional view schematically showing the structure of the plating module 400 of this embodiment. Figure 3 As shown, the plating module 400 includes a plating tank 410 for storing plating solution. The plating tank 410 is a container having cylindrical sidewalls and a circular bottom wall, with a circular opening formed at the top. In addition, the plating module 400 includes an overflow tank 405 arranged outside the upper opening of the plating tank 410. The overflow tank 405 is a container for receiving the plating solution that overflows from the upper opening of the plating tank 410.

[0042] The plating module 400 includes a diaphragm 420 that vertically divides the interior of the plating tank 410. The diaphragm 420 divides the interior of the plating tank 410 into a cathode region 422 and an anode region 424. Plating solution is filled into each of the cathode region 422 and the anode region 424. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. A resistor 450 is disposed in the cathode region 422, facing the diaphragm 420. The resistor 450 is a component for achieving uniform plating on the plated surface Wf-a of the substrate Wf and is formed of a plate-shaped component with multiple holes. As long as the plating process can be performed with the desired accuracy, the resistor 450 does not need to be disposed in the plating tank 410.

[0043] The plating solution may be any solution containing ions of the metal element constituting the plated film, and its specific example is not particularly limited. As an example of a plating process, a copper plating process can be used, and as an example of a plating solution, a copper sulfate solution can be used. Furthermore, in this embodiment, the plating solution contains a predetermined additive. However, this configuration is not limiting, and the plating solution may also be configured to contain no additives.

[0044] The specific type of anode 430 is not particularly limited, and a soluble anode or an insoluble anode can be used. In this embodiment, an insoluble anode is used as anode 430. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

[0045] The plating module 400 also includes a substrate holder 440 for holding the substrate Wf with the surface to be plated Wf-a facing downward. The plating module 400 also includes a first lifting mechanism 442 for raising and lowering the substrate holder 440. The first lifting mechanism 442 can be implemented, for example, by a known mechanism such as a direct-acting actuator. The plating module 400 also includes a rotation mechanism 446 for rotating the substrate holder 440 so that the substrate Wf rotates about a virtual rotation axis extending vertically through the center of the surface to be plated Wf-a. The rotation mechanism 446 can be implemented, for example, by a known mechanism such as a motor.

[0046] The plating module 400 is configured to immerse the substrate Wf in the plating solution in the cathode region 422 using the first lifting mechanism 442 , rotate the substrate Wf using the rotating mechanism 446 , and apply a voltage between the anode 430 and the substrate Wf, thereby plating the surface to be plated Wf-a of the substrate Wf.

[0047] Furthermore, the plating module 400 includes a tilting mechanism 447 configured to tilt the substrate holder 440. The tilting mechanism 447 can be implemented by a known mechanism such as a pitch mechanism.

[0048] The plating module 400 includes a liquid supply device 470 that supplies liquid L1 to a contact member (described later) of a substrate holder 440. The liquid supply device 470 is configured to discharge liquid L1 toward the substrate holder 440, thereby supplying the liquid L1 to the contact member. The liquid L1 supplied to the contact member is configured to cover at least a portion of the contact member. The liquid supply device 470 includes an arm 474, a drive mechanism 476, a tray member 478, and a liquid supply nozzle 482.

[0049] The composition of the liquid L1 is not particularly limited as long as it has the effect of protecting the contact parts. The liquid L1 preferably has an electrical conductivity below a predetermined value or is degassed.

[0050] The conductivity of the liquid L1 is preferably 50 μS / cm or less, and more preferably 10 μS / cm or less. If a liquid with a high conductivity is present around the contact member and the substrate Wf, in addition to the current passing through the contact portion between the contact member and the substrate Wf, there will also be a shunt current, which does not pass through the contact portion but flows between the seed layer of the substrate Wf and the contact member through the liquid. At this time, the copper in the seed layer is ionized and melted, and the seed layer becomes thinner and the resistance increases, which may cause power supply deviation. If the conductivity of the liquid L1 is low, this power supply deviation can be suppressed. In addition, for details about the shunt current, please refer to the above-mentioned patent document 2.

[0051] If a liquid containing oxygen is present around the contact member and substrate Wf, the oxygen ionizes, potentially causing a local battery effect in which the seed layer dissolves in the liquid. For example, the copper in the seed layer donates electrons to the dissolved oxygen, generating hydroxide ions from the dissolved oxygen, and the copper dissolves as copper ions. This local battery effect thins the seed layer and increases its resistance, potentially causing power supply deviations. Degassing the liquid L1 can suppress this power supply deviation. For details on the local battery effect, please refer to Patent Document 2 above.

[0052] From the above viewpoints, the liquid L1 is more preferably pure water, ion-exchanged water, or degassed water.

[0053] Liquid supply nozzle 482 discharges liquid L1. Besides discharging liquid L1 to coat contact components, liquid supply nozzle 482 can also use liquid L1 as a cleaning liquid to appropriately clean contact components. A pipe (not shown) is connected to liquid supply nozzle 482, and liquid supply nozzle 482 discharges liquid L1 supplied from a liquid source (not shown) via the pipe. The supply of liquid L1 using liquid supply device 470 will be described in detail later.

[0054] The liquid supply device 470 includes a drive mechanism 476 configured to rotate an arm 474. The drive mechanism 476 can be implemented by a known mechanism such as a motor. The arm 474 is a plate-shaped member extending horizontally from the drive mechanism 476. A liquid supply nozzle 482 is held by the arm 474. The drive mechanism 476 is configured to rotate the arm 474 to move the liquid supply nozzle 482 between a supply position between the plating tank 410 and the substrate holder 440 and a retracted position, retracted from the plating tank 410 and the substrate holder 440.

[0055] The liquid supply device 470 includes a tray member 478 disposed below the liquid supply nozzle 482. The tray member 478 is configured to receive the liquid L1 that falls after being discharged from the liquid supply nozzle 482 and supplied to the contact member. In this embodiment, the liquid supply nozzle 482 and the arm 474 are housed in the tray member 478. The drive mechanism 476 is configured to rotate the liquid supply nozzle 482, the arm 474, and the tray member 478 together between a supply position and a retracted position. However, the drive mechanism 476 can also independently drive the liquid supply nozzle 482, the arm 474, and the tray member 478.

[0056] Figure 4 This is a schematic longitudinal cross-sectional view of the substrate holder 440. The substrate holder 440 includes a support portion 490 that supports the substrate Wf; a backing plate assembly 492 that, together with the support portion 490, holds the substrate Wf; and a rotational shaft 491 that extends vertically upward from the backing plate assembly 492. The support portion 490 includes a first upper component 493, a second upper component 496, and a support mechanism 494 that supports the outer periphery of the plated surface Wf-a of the substrate Wf. The first upper component 493 holds the second upper component 496. In the illustrated example, the first upper component 493 extends substantially horizontally, and the second upper component 496 extends substantially vertically, but this is not limited to this embodiment. The support mechanism 494 is an annular component having an opening in the center for exposing the plated surface Wf-a of the substrate Wf, and is suspended and held by the second upper component 496. The second upper member 496 can be a member obtained by providing one or more pillar members on the annular upper surface of the support mechanism 494 .

[0057] The backplate assembly 492 includes a circular floating plate 492-2 that, together with a support mechanism 494, holds the substrate Wf. The floating plate 492-2 is positioned behind the plated surface Wf-a of the substrate Wf. Furthermore, the backplate assembly 492 includes a circular backplate 492-1 positioned above the floating plate 492-2. The backplate assembly 492 also includes a floating mechanism 492-4 for biasing the floating plate 492-2 away from the back surface of the substrate Wf, and a pressing mechanism 492-3 for pressing the floating plate 492-2 toward the back surface of the substrate Wf, overcoming the force exerted by the floating mechanism 492-4.

[0058] The floating mechanism 492-4 includes a compression spring mounted between the upper end of a shaft extending upward from the floating plate 492-2 through the back plate 492-1 and the back plate 492-1. The floating mechanism 492-4 utilizes the compression reaction force of the compression spring to lift the floating plate 492-2 upward via the shaft, thereby biasing it away from the back surface of the substrate Wf. The floating mechanism 492-4 is not shown in the following figures.

[0059] The pressing mechanism 492-3 is configured to press the floating plate 492-2 downward by supplying fluid to the floating plate 492-2 through a flow path formed inside the back plate 492-1. When the fluid is supplied to the pressing mechanism 492-3, the pressing mechanism 492-3 presses the substrate Wf toward the support mechanism 494 with a force stronger than the force generated by the floating mechanism 492-4.

[0060] The first lifting mechanism 442 raises and lowers the entire substrate holder 440 (arrow A10). The plating module 400 further includes a second lifting mechanism 443. The second lifting mechanism 443 is driven by a known mechanism such as a direct-acting actuator to raise and lower the rotating shaft 491 and the backing plate assembly 492 relative to the support portion 490 (arrow A20).

[0061] Figure 5 This is a longitudinal cross-sectional view schematically illustrating a portion of the structure of the substrate holder 440 in an enlarged manner. The support mechanism 494 includes an annular support member 494-1 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf. The support member 494-1 has a flange 494-1a extending toward the outer periphery of the lower surface of the backing plate assembly 492 (floating plate 492-2). An annular sealing member 494-2 is disposed on the flange 494-1a. The sealing member 494-2 is an elastic member. The support member 494-1 supports the outer periphery of the plated surface Wf-a of the substrate Wf via the sealing member 494-2. When the substrate Wf is plated, the sealing member 494-2 and the floating plate 492-2 sandwich the substrate Wf, thereby creating a seal between the support member 494-1 (substrate holder 440) and the substrate Wf.

[0062] Support mechanism 494 includes an annular base 494-3 attached to the inner circumference of support member 494-1, and an annular conductive member 494-5 attached to the upper surface of base 494-3. Base 494-3 is a conductive member, for example, made of stainless steel or other metals. Conductive member 494-5 is an annular conductive member, for example, made of copper or other metals.

[0063] The support mechanism 494 includes a contact member 494-4 for supplying power to the substrate Wf. The contact member 494-4 is annularly attached to the inner circumference of the base 494-3 using screws or other means. The shape of the contact member 494-4 is not particularly limited as long as it can supply power to the substrate Wf. For example, multiple arch-shaped contact members 494-4 may be arranged in a ring. The support member 494-1 holds the contact member 494-4 via the base 494-3. The contact member 494-4 is a conductive member that supplies power from a power source (not shown) to the substrate Wf held by the substrate holder 440. The contact member 494-4 includes multiple substrate contacts 494-4a that contact the outer circumference of the plated surface Wf-a of the substrate Wf, and a main body 494-4b that extends above the substrate contacts 494-4a. The contact member 494-4 is in conductive contact with the substrate Wf via the substrate contacts 494-4a.

[0064] Figure 6 800 is a schematic diagram for explaining the control module 800. The control module 800 functions as a control device for controlling the action of the plating module 400. The control module 800 includes a computer such as a microcomputer, which includes a CPU (Central Processing Unit: central processing unit) 801 as a processor, a memory 802 as a temporary or non-temporary storage medium, etc. The control module 800 controls the controlled part of the plating module 400 through the action of the CPU 801. The CPU 801 can perform various processes by executing a program stored in the memory 802 or reading a program stored in a storage medium not shown into the memory 802 and executing it. The program includes, for example, a program for executing a conveying robot, conveying control of a conveying device, control of the processing in each processing module, control of the plating process in the plating module 400, control of the liquid supply process, and a program for detecting abnormalities in various devices. As storage medium, for example, it is possible to use disk-shaped storage media such as computer-readable ROM, RAM, flash memory, hard disk, CD-ROM, DVD-ROM or floppy disk, or known storage media such as solid state drive. Control module 800 is configured to communicate with an unillustrated host controller that controls the plating device 1000 and other related devices in a unified manner, and can exchange data between the database possessed by the host controller. A part or all of the functions of control module 800 can be composed of hardware such as ASIC. A part or all of the functions of control module 800 can also be composed of PLC, sequence controller, etc. A part or all of control module 800 can be configured in the inside and / or outside of the housing of the plating device. A part or all of control module 800 can be connected to each part of the plating device by wired and / or wireless communication.

[0065] Figure 7800 is a flowchart showing the flow of the plating method according to this embodiment.

[0066] In step S11, the pre-wetting module 200 performs a pre-wetting process on the substrate Wf with a seed layer formed on the surface to be plated Wf-a. During the pre-wetting process, the surface to be plated Wf-a of the substrate Wf, before plating, is moistened with a treatment liquid such as pure water or degassed water. This replaces the air within the resist pattern formed on the substrate surface with the treatment liquid. Following step S11, step S12 is performed.

[0067] In step S12, the substrate Wf is pre-preg treated in the pre-preg module 300. During the pre-preg treatment, a treatment liquid such as sulfuric acid or hydrochloric acid is used to etch away the oxide film with high resistance on the surface of the seed layer, thereby cleaning or activating the surface of the plating base. In addition, after the pre-preg treatment, the substrate Wf can also be cleaned with a treatment liquid such as pure water or degassed water. The substrate Wf after the pre-wetting treatment is wetted by the above-mentioned treatment liquid, so that the opening of the resist pattern on the surface of the substrate Wf is filled with the above-mentioned treatment liquid. After step S12, step S13 is performed. Step S12 can also be omitted, and the plating device 1000 can also be equipped with a pre-preg module 300.

[0068] In step S13, the plating process is performed on the substrate Wf in the plating module 400. Under the control of the control module 800, the first lifting mechanism 442 and a horizontal movement mechanism (not shown) that horizontally moves the substrate holder 440 move the substrate holder 440 to the position of the substrate Wf. The substrate Wf, wetted with the processing liquid in step S11 or S12, is then mounted on the substrate holder 440. At this point, the substrate holder 440 supplies liquid L1 to the contact member 494-4 in step S15, described later, so that at least a portion of the contact member 494-4 is covered with liquid L1. After the substrate Wf is mounted on the substrate holder 440, the substrate holder 440 is lowered by the first lifting mechanism 442, immersing the substrate Wf in the plating solution. A voltage is then applied between the anode 430 and the substrate Wf to perform the plating process.

[0069] In the plating process of this embodiment, since the substrate contact points 494-4a of the contact member 494-4 are covered with liquid L1, power supply variations caused by localized battery effects or shunt currents can be suppressed. Furthermore, when the substrate Wf is mounted on the substrate holder 440, if the area where the outer periphery of the substrate Wf contacts the contact member 494-4 has wet and dry portions, this can cause power supply variations. However, in this embodiment, this is suppressed by uniformly covering the contact member 494-4 with liquid L1. Furthermore, since the occurrence of wet and dry portions is suppressed, the substrate Wf wetted during the pre-wetting or pre-dipping process does not need to be dried, and plating defects caused by drying to the plated surface Wf-a can be prevented. Furthermore, cleaning or covering the contact member 494-4 with liquid L1 can also suppress power supply variations caused by localized contamination in the area where the outer periphery of the substrate Wf contacts the contact member 494-4. Following step S13, step S14 is performed.

[0070] In step S14, a substrate cleaning process is performed to clean the substrate Wf that has been plated. After the plating process, the substrate holder 440 is raised above the liquid level of the plating liquid in the plating tank 410, and the plated surface Wf-a of the substrate Wf is cleaned using a cleaning liquid supplied from a cleaning liquid nozzle (not shown). At this time, the substrate holder 440 and / or the cleaning liquid nozzle can also be rotated so that the cleaning liquid acts evenly on the substrate Wf. Through this substrate cleaning process, the plating liquid attached to the substrate Wf can be recovered and appropriately reused, and / or the plated surface Wf-a of the substrate Wf can be prevented from drying by wetting it. For example, in addition to pure water and degassed water, the cleaning liquid can also be a liquid used for pre-wetting treatment, pre-soaking treatment, cleaning, and the like. The substrate Wf to be cleaned is removed from the substrate holder 440 and sequentially transferred to the cleaning module 500 and the spin dryer 600. After cleaning and drying, it is transferred to the cassette of the load port 100. After step S14, step S15 is performed.

[0071] In step S15 , a process of supplying liquid to the contact member 494 - 4 is performed. Figure 8Flowchart showing the flow of liquid supply processing. In step S1501, the control module 800 controls the tilting mechanism 447 to tilt the substrate holder 440 on which no substrate Wf is arranged. In step S1503 described later, as long as the liquid L1 is supplied to the contact member 494-4, the angle of tilt is not particularly limited. For example, the substrate holder 440 can be tilted from 3 to 7 degrees from the horizontal, preferably to a state of tilting 5 degrees. Here, the so-called tilt of the substrate holder 440 refers to the tilt of the substrate Wf that can be arranged on the substrate holder 440, for example, represented by the angle between the lower surface of the floating plate 492-2 and the horizontal.

[0072] Figure 9 This is a schematic diagram for explaining step S1501. The entire substrate holder 440 including the support portion 490 and the backing plate assembly 492 is tilted by the tilting mechanism 447. After step S1501, step S1502 is performed.

[0073] In step S1502, the control module 800 controls the rotation mechanism 446 to rotate the tilted substrate holder 440 at a first rotation speed. Hereinafter, the rotation in step S1502 is referred to as the first rotation. The first rotation speed is preferably 8 rpm or higher, more preferably 10 rpm or higher. If the first rotation speed is too low, most of the liquid L1 falls from the substrate holder 440 along the tilt due to gravity, potentially preventing the contact member 494-4 from being fully covered with liquid L1. The first rotation speed is preferably 15 rpm or lower, more preferably 12 rpm or lower. If the first rotation speed is too high, excess liquid L1 may spread further from the area above the sealing member 494-2 where the contact member 494-4 is located. In this case, liquid L1 may separate from the tray member 478 and fall into the plating tank 410, thereby diluting the plating solution. Based on this perspective, the first rotation speed is preferably 8 rpm or higher and 15 rpm or lower, more preferably 10 rpm or higher and 12 rpm or lower.

[0074] Figure 10 is a schematic diagram for explaining step S1502. Figure 10 , the arrow A30 schematically indicates the first rotation of the substrate holder 440. After step S1502, step S1503 is performed.

[0075] In step S1503, the control module 800 controls the liquid supply device 470 to discharge liquid L1 toward the substrate holder 470. Liquid L1 is discharged by supplying liquid L1 toward the contact member 494-4. For example, liquid L1 is discharged from the liquid supply nozzle 482 toward the contact member 494-4 so that the liquid L1 directly impacts the contact member 494-4. Preferably, while liquid L1 is being discharged, the substrate holder 440 is rotated at the first rotational speed for at least one rotation. The supplied liquid L1 covers at least a portion of the contact member 494-4.

[0076] Figure 11 This is a schematic diagram illustrating step S1503. When the drive device 476 drives the arm 474 and the tray assembly 478, moving the liquid supply nozzle 482 to the supply position, liquid L1 is discharged from the liquid supply nozzle 482, supplying the liquid L1 to the contact member 494-4. Following step S1503, step S1504 proceeds. In step S1503, in addition to supplying liquid to the contact member 494-4, the contact member 494-4 can also be cleaned using a simple structure.

[0077] In step S1504, the control module 800 controls the liquid supply device 470 to stop discharging the liquid L1 and controls the tilt mechanism 447 to begin decreasing the tilt of the substrate holder 440 toward the horizontal position. The decrease in the tilt of the substrate holder 440 begins before or within a predetermined time after the discharging of the liquid L1 is stopped.

[0078] The step of stopping the discharge of liquid L1 is called the discharge stop step, and the step of starting to reduce the tilt of the substrate holder 440 is called the tilt reduction step. After the discharge stop step, if a certain period of time passes without performing the tilt reduction step, the liquid L1 that has been in contact with the contact member 494-4 will fall from the tilted substrate holder 440 due to gravity, resulting in the contact member 494-4 not being fully covered by the liquid L1. On the other hand, after the tilt reduction step, if a certain period of time passes without performing the discharge stop step, the discharged liquid L1 overflows from the substrate holder 440, separates from the tray member 478 and falls into the plating tank 410, resulting in dilution of the plating liquid. The above-mentioned prescribed time is preferably pre-set to avoid the above-mentioned problem. From this point of view, the above-mentioned prescribed time is preferably less than 2 seconds, more preferably less than 1 second, and even more preferably less than 0.5 seconds. The discharge stop step and the tilt reduction step are preferably performed approximately simultaneously.

[0079] Here, the so-called horizontal position means that the contact part 494-4 is covered by the liquid L1 within a sufficient range required for uniform plating to the desired degree. The degree of inclination is not particularly limited. For example, it refers to the posture of the substrate holder 440 where the inclination of the substrate holder 440 is less than 1 degree.

[0080] Figure 12 This is a schematic diagram for explaining the substrate holder 440 that is in the horizontal position after step S1504. Figure 13 yes Figure 12 An enlarged cross-sectional view of the area near the contact member 494-4 in FIG. In the illustrated example, liquid L1 is disposed above the flange 494-1a and the sealing member 494-2, in the space inside the base 494-3 where the contact member 494-4 is disposed. In the illustrated example, the sealing member 494-2 functions as a liquid retaining portion 494L that retains the liquid L1 in contact with the contact member 494-4. The liquid retaining portion 494L is not limited to this function, as long as it retains the liquid L1 in contact with the contact member 494-4. Shortly after step S1504, the liquid L1 contacts a portion of the contact member 494-4, but sometimes the liquid L1 is not evenly distributed, and the substrate contact point 494-4a is not fully covered. In this case, when the substrate Wf is mounted on the substrate holder 440 in contact with the contact member 494-4, local battery effects, shunt current, and other factors may cause power supply deviations. Following step S1504, step S1505 is performed.

[0081] In step S1505, the control module 800 controls the rotation mechanism 446 to stop the rotation of the substrate holder 440. After step S1505, step S1506 is performed.

[0082] In step S1506, the control module 800 controls the second lifting mechanism 443 to raise the backplate assembly 492. The backplate assembly 492 rises relative to the support portion 490. If liquid L1 contacts the backplate assembly 492 and the like, surface tension causes the liquid L1 to be unevenly distributed in step S1507, described later. This causes uneven coverage of the contact member 494-4, potentially causing power supply deviation. This step increases the distance between the backplate assembly 492 and the contact member 494-4, making it difficult for the liquid L1 in contact with the contact member 494-4 to contact the backplate assembly 492, such as the floating plate 492-2. Therefore, when the substrate holder 440 is rotated at the second rotational speed in step S1507, described later, the liquid L1 stored in the liquid retaining portion 494L is more evenly distributed throughout the entire circumference due to centrifugal force, thereby more evenly covering the contact member 494-4. Furthermore, not limited to the back plate assembly 492 , a component facing the contact member 494 - 4 can be moved away from the contact member 494 .

[0083] After step S1506, step S1507 is performed. In addition, as long as plating can be formed uniformly to a desired degree, step S1505 and step S1506 may be omitted.

[0084] In step S1507, the control module 800 controls the rotation mechanism 446 to rotate the substrate holder 440 at a second rotational speed. This rotation is referred to as the second rotation. The second rotational speed is set to a speed greater than the first rotational speed. The first and second rotational speeds are not affected by the direction of rotation and are positive values indicating the magnitude of the rotational speed. The first and second rotations can be in the same direction or in opposite directions.

[0085] The first rotation speed can be set based on the viewpoint described in step S1502. Figure 13 As described in [ 1 ], there are cases where the contact member 494 - 4 may not be sufficiently covered with liquid L1. The inventors have discovered that by rotating the substrate holder 440 at a second rotational speed, which is greater than the first rotational speed, the contact member 494 - 4 can be more evenly covered with liquid L1. Based on this viewpoint, the second rotational speed is preferably set to 30 rpm or higher. Based on the same viewpoint and the fact that an excessively high second rotational speed results in inefficient power usage, the second rotational speed is preferably set to, for example, 40 rpm or higher and 60 rpm or lower.

[0086] Figure 14 This is a schematic diagram for explaining the substrate holder 440 in step S1507. In step S1507, the substrate holder 440 in the horizontal position rotates at the second rotation speed. The second rotation is schematically represented by arrow A40. In the example shown in the figure, the back plate assembly 492 is raised in step S1506, so that the space where there are no components near the contact component 494-4 is expanded, thereby suppressing the deviation of the liquid L1 caused by the contact between the liquid L1 and other components. In addition, when step S1506 is omitted, the second rotation is performed while the back plate assembly 492 is kept in the lowered state. Even in this case, a certain effect of suppressing the deviation of the liquid L1 can be obtained.

[0087] Figure 15 This is an enlarged cross-sectional view of the area around contact member 494-4 after step S1507. As a result of the second rotation, contact member 494-4 is covered with liquid L1 over a wider area, with less bias. For example, the entire annular contact member 494-4 can be covered with liquid L1, covering substrate contact point 494-4a. After step S1507, step S1508 is performed.

[0088] In step S1508, the control module 800 controls the rotation mechanism 446 to stop the second rotation of the substrate holder 440. After step S1508, step S13 ( Figure 7 ).

[0089] In the plating apparatus and plating method of this embodiment, the control module 800 is configured to tilt the substrate holder 440, rotate the substrate holder 440 at a first rotational speed while the substrate holder 440 is tilted, discharge liquid L1 toward the substrate holder 440 rotating at the first rotational speed to supply liquid L1 to the contact member 494-4, stop the discharge of liquid L1, and begin to tilt the substrate holder 440 toward the horizontal position within a predetermined time before or after the cessation of the discharge of liquid L1. With the substrate holder 440 in the horizontal position, the control module 800 rotates the substrate holder 440 at a second rotational speed faster than the first rotational speed, stop the rotation of the substrate holder 440 at the second rotational speed, mount the substrate Wf on the stopped substrate holder 440, and perform plating on the mounted substrate Wf. This configuration eliminates the need for complex operations, more reliably reduces power supply variations during plating, and improves the thickness uniformity of the plating formed on the substrate Wf.

[0090] The following modifications are also within the scope of the present invention and can be combined with the above embodiment or other modifications. In the following modifications, parts and the like representing the same structure and function as the above embodiment are referenced using the same reference numerals, and description thereof is omitted as appropriate.

[0091] (Variation 1)

[0092] In step S1503 of the above embodiment, the liquid L1 may be discharged toward the back plate assembly 492 . In particular, the liquid supply nozzle 482 can discharge the liquid L1 toward the floating plate 492 - 2 that presses the substrate Wf when the substrate Wf is placed on the substrate holder 440 .

[0093] Figure 16This is a cross-sectional view schematically illustrating a method for supplying liquid to the contact member 494-4 using the plating method of this variation. In step S1503, the floating plate 492-2 of the backplate assembly 492 can be positioned within a position surrounded by the contact member 494-4. The liquid supply nozzle 482 is configured to discharge liquid L1 from the discharge port 482a toward the lower surface of the backplate assembly 492. Liquid L1, which impacts the lower surface of the backplate assembly 492 and rebounds, is directed toward the main body 494-4b. After colliding with the main body 494-4b, the liquid L1 flows downward from the main body 494-4b due to gravity. As a result, the liquid L flows into the liquid retaining portion 494L. Alternatively, plating liquid adhering to the main body 494-4b and the substrate contact 494-4a falls along with the liquid L1 and is recovered in the tray member 478.

[0094] According to this variation, similar to the above-mentioned embodiment, power supply deviation during the plating process can be more reliably reduced without requiring complex work. Furthermore, according to this variation, rust formation on metal components (e.g., conductive component 494-5) mounted on substrate holder 440 can be suppressed. Specifically, when supplying liquid L1 to contact component 494-4, in the technique of arranging liquid supply nozzle 482 above or to the side of contact component 494-4, there is a concern that liquid supply nozzle 482 may contact backplate assembly 492, so backplate assembly 492 is retracted to a higher position. Consequently, liquid L1 discharged from liquid supply nozzle 482 and colliding with contact component 494-4 may splash and adhere to metal components (e.g., conductive component 494-5), thereby posing a concern of rust formation. To prevent liquid L1 from splashing and adhering to metal components, precise control of the position of liquid supply nozzle 482, the discharge angle of liquid L1, and the discharge intensity of liquid L1 is required, making this undesirable.

[0095] In contrast, in this modification, the liquid supply nozzle 482 is disposed below the substrate holder 440, and the liquid L1 is discharged from below the substrate holder 440. Therefore, since a space can be formed at a position surrounded by the contact member 494-4, the back plate assembly 492 can be disposed in the space. Figure 16 As shown, the back plate assembly 492 serves as a wall relative to the metal member (e.g., the conductive member 494-5) located above the contact member 494-4, thereby preventing the liquid L1 discharged from the liquid supply nozzle 482 from splashing onto the metal member. As a result, according to this modified example, the liquid L1 can be easily supplied to the contact member 494-4 without requiring precise control of the position of the liquid supply nozzle 482, the discharge angle of the liquid L1, the discharge intensity of the liquid L1, and the like.

[0096] (Variation 2)

[0097] In the above embodiment, the liquid supply nozzle 482 may be a straight nozzle.

[0098] Figure 17 Schematically shows the liquid supply nozzle 4820 of this modification. Figure 17 As shown, the liquid supply nozzle 4820 is a straight nozzle that discharges liquid L1 linearly. By using a straight nozzle, liquid L1 can be discharged toward a desired location on the main body 494-4b of the contact member 494-4. In the illustrated example, liquid L1 is discharged from the liquid supply nozzle 4820 so that the liquid L1 directly strikes the contact member 494-4.

[0099] (Variation 3)

[0100] In the above-described embodiment, the direction of rotation of the substrate holder 440 when discharging the liquid L1 may be adjusted.

[0101] Figure 18 and Figure 19 15 and 15 are respectively a top view and a side view schematically showing the discharge of the liquid L1 in step S1503 in this modification. Figure 18 In the figure, the dotted circle schematically illustrates the substrate holder 440 viewed from above in the vertical direction. In the illustrated example, the substrate holder 440 rotates counterclockwise (arrow A50). In the inclined substrate holder 440, the upper end of the inclination is referred to as the upper end Hi, and the lower end of the inclination is referred to as the lower end Lo.

[0102] The location where the discharged liquid L1 collides with the substrate holder 440 is defined as collision position P1. During the first rotation of the substrate holder 440, it is preferred that the substrate holder 440 rotate so that, at collision position P1, a velocity component is present in the direction from the lower end Lo toward the upper end Hi of the tilted substrate holder 440. This reduces the downward velocity component imparted to the liquid L1, and the liquid L1 is more likely to accumulate in the liquid retaining portion 494L, covering the contact member 494-4. In the illustrated example, the substrate holder 440 has a velocity component from the lower end Lo toward the upper end Hi in the right-hand semicircle of the substrate holder 440 in the figure, and the collision position P1 is located within this semicircle.

[0103] Furthermore, it is preferable that the liquid L1 is discharged so that it has a velocity component in the same direction as the rotation direction of the substrate holder 440 at the collision position P1. This facilitates the movement of the liquid L1 toward the liquid retaining portion 494L, and facilitates the accumulation of the liquid L1 so that it covers the contact member 494-4. In the illustrated example, the liquid L1 is discharged so that it has a velocity component (arrow V10) in the direction toward the upper end Hi, and is configured to have a velocity component in the same direction as the rotation direction of the substrate holder 440 at the collision position P1.

[0104] The liquid L1 is preferably discharged from the discharge port 482a of the liquid supply nozzle 482 in a semi-fan-shaped manner. More specifically, the liquid L1 is spread from the discharge port 482a along a plane extending toward the upper end Hi. Therefore, the discharged liquid L1 is distributed in the space on one side of the vertical plane Vp passing through the discharge port 482a. With this structure, a larger amount of liquid L1 can be discharged so that it can be easily accumulated in the liquid retaining portion 494L.

[0105] (Variation 4)

[0106] In the above embodiment, the plating module 400 may also include a cover member that prevents the plating liquid atmosphere within the plating tank 410 from being released into the plating module 400 when the liquid L1 is supplied to the contact member 494-4. The cover member may be, for example, a cylindrical member that surrounds the substrate holder 440. At least two of the liquid supply nozzle 482, the cover member, and the cleaning liquid nozzle for cleaning the substrate Wf may be integrally formed.

[0107] The present invention can also be described in the following aspects.

[0108] [Method 1] According to method 1, a plating method is provided, which plates a substrate by using a plating device equipped with a substrate holder, the substrate holder including a contact part that can be conductively contacted with the substrate, wherein the plating method includes: a step of tilting the substrate holder; a step of rotating the substrate holder at a first rotational speed in a state where the substrate holder is tilted; a step of discharging liquid toward the substrate holder rotating at the first rotational speed so as to supply the liquid to the contact part; a step of stopping the above-mentioned discharge of the liquid; a step of starting to reduce the tilt of the substrate holder toward a horizontal position within a specified time before or after stopping the above-mentioned discharge of the liquid; a step of rotating the substrate holder at a second rotational speed faster than the first rotational speed in a state where the substrate holder is located in the above-mentioned horizontal position; a step of stopping the rotation of the substrate holder at the second rotational speed; a step of mounting the substrate on the substrate holder whose rotation has been stopped; and a step of performing the above-mentioned plating treatment on the mounted substrate. According to the first aspect, it is possible to more reliably reduce variations in power supply during plating without requiring complicated work, thereby improving the uniformity of the thickness of the plating formed on the substrate.

[0109] [Method 2]

[0110] According to aspect 2, the predetermined time is 2 seconds or less in aspect 1. According to aspect 2, it is possible to suppress the liquid from dripping from the liquid retaining portion near the contact member and to suppress the liquid from overflowing from the substrate holder 440 and diluting the plating liquid.

[0111] [Method 3]

[0112] According to aspect 3, in aspect 1 or 2, the second rotation speed is 30 rpm or higher. According to aspect 3, the contact member can be more evenly covered with the liquid L1, and variations in power supply during plating can be further reduced.

[0113] [Method 4]

[0114] According to aspect 4, in any of aspects 1 to 3, the first rotation speed is 8 rpm to 15 rpm. According to aspect 4, liquid can be prevented from dripping from the liquid retaining portion near the contact member and from scattering from the substrate holder, thereby diluting the plating liquid.

[0115] [Method 5]

[0116] According to aspect 5, in any of aspects 1 to 4, the method further includes the step of: after the substrate holder is in the horizontal position and before the substrate holder is rotated at the second rotational speed, moving a portion of the substrate holder that faces the contact member away from the contact member. According to aspect 5, it is possible to prevent uneven distribution of liquid due to contact with other components, thereby preventing uneven coverage of the contact member and causing uneven power supply.

[0117] [Method 6]

[0118] According to aspect 6, in any of aspects 1 to 5, in the step of discharging the liquid, the liquid is discharged toward a plate that presses the substrate when the substrate is placed on the substrate holder. According to aspect 6, it is possible to suppress the formation of rust on metal parts attached to the substrate holder due to liquid adhesion.

[0119] [Method 7]

[0120] According to aspect 7, in any of aspects 1 to 6, during the step of discharging the liquid, the substrate holder is rotated so that a velocity component is provided in a direction from the lower end of the inclined substrate holder toward the upper end at the location where the substrate holder collides with the discharged liquid. According to aspect 7, the liquid that collides with the substrate holder is less likely to receive a downward velocity component, and the liquid is more likely to accumulate so as to cover the contact member.

[0121] [Method 8]

[0122] According to mode 8, in mode 7, in the step of discharging the liquid, the liquid is discharged so as to have a velocity component in the same direction as the rotation direction of the substrate holder at the collision position. According to mode 8, the liquid that has collided with the substrate holder is more likely to move toward the contact member, and the liquid is more likely to accumulate so as to cover the contact member.

[0123] [Method 9]

[0124] According to aspect 9, in aspect 8, in the step of discharging the liquid, the liquid is discharged from the discharge port along a plane extending toward the upper end of the substrate holder. According to aspect 9, a larger amount of liquid can be discharged so as to be easily accumulated in the liquid retaining portion near the contact member.

[0125] [Method 10]

[0126] According to aspect 10, in any of aspects 1 to 9, the conductivity of the liquid is below a predetermined value, or the liquid is degassed. According to aspect 10, it is possible to suppress power supply deviation caused by shunt current or local battery effect.

[0127] [Method 11]

[0128] According to aspect 11, a plating apparatus is provided, comprising a substrate holder including a contact member capable of electrically contacting a substrate, and a control device, wherein the control device is configured to: tilt the substrate holder; rotate the substrate holder at a first rotational speed while the substrate holder is tilted; discharge liquid toward the substrate holder rotating at the first rotational speed to supply the liquid to the contact member; stop the discharge of the liquid; and, within a predetermined time before or after the cessation of the discharge of the liquid, begin to reduce the tilt of the substrate holder toward a horizontal position; rotate the substrate holder at a second rotational speed faster than the first rotational speed while the substrate holder is in the horizontal position; stop the rotation of the substrate holder at the second rotational speed; mount the substrate on the substrate holder whose rotation has been stopped; and perform the plating process on the mounted substrate. According to aspect 11, power supply variation during the plating process can be more reliably reduced without requiring complex work, thereby improving the thickness uniformity of the plating formed on the substrate.

[0129] The embodiments of the present invention have been described above, but the embodiments of the invention described above are for ease of understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from its main purpose, and its equivalents are naturally included in the present invention. In addition, within the scope of at least a part of the above-mentioned problem or the scope of at least a part of the effect, any combination of the embodiments and modifications can be performed, and any combination or omission of the various constituent elements described in the claims and the specification can be performed.

[0130] Description of Reference Numerals

[0131] 400…plating module; 410…plating tank; 440…substrate holder; 442…first lifting mechanism; 443…second lifting mechanism; 446…rotating mechanism; 447…tilting mechanism; 470…cleaning device; 482, 4820…liquid supply nozzle; 482a…discharge port; 490…support portion; 491…rotating shaft; 492…back plate assembly; 492-1…back plate; 492-2…floating plate; 494…support mechanism; 494L…liquid retaining portion; 494-1…support component; 494-2…sealing component; 494-4…contact component; 494-4a…substrate contact; 494-4b…main body; 800…control module; 1000…plating device; L1…liquid; P1…collision position; Wf…substrate; Wf-a…plated surface.

Claims

1. A plating method, comprising plating a substrate using a plating apparatus including a substrate holder, wherein the substrate holder includes a contact member capable of electrically contacting the substrate. The plating method is characterized by comprising: a step of tilting the substrate support; a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted; a step of discharging liquid toward the substrate holder rotating at the first rotation speed so as to supply the liquid to the contact member; the step of stopping said discharge of said liquid; before or within a predetermined time after stopping the discharge of the liquid, starting the step of reducing the tilt of the substrate holder toward a horizontal position; a step of rotating the substrate holder at a second rotation speed faster than the first rotation speed in a state where the substrate holder is located in the horizontal position; stopping the rotation of the substrate holder at the second rotation speed; a step of mounting the substrate on the substrate holder whose rotation is stopped; as well as the step of performing the plating treatment on the mounted substrate, The prescribed time is less than 2 seconds.

2. The plating method according to claim 1, wherein The second rotation speed is 30 rpm or higher.

3. The plating method according to claim 1, wherein The first rotation speed is greater than or equal to 8 rpm and less than or equal to 15 rpm.

4. The plating method according to any one of claims 1 to 3, characterized in that The method further includes the step of moving a member of the substrate holder that faces the contact member away from the contact member after the substrate holder is in the horizontal position and before the substrate holder is rotated at the second rotation speed.

5. The plating method according to any one of claims 1 to 3, characterized in that In the step of discharging the liquid, the liquid is discharged toward a plate that presses the substrate when the substrate is arranged on the substrate holder.

6. The plating method according to any one of claims 1 to 3, characterized in that In the step of discharging the liquid, the substrate holder is rotated so as to have a velocity component in a direction from a lower end toward an upper end of the inclined substrate holder at a collision position of the substrate holder with the discharged liquid.

7. The plating method according to claim 6, wherein: In the step of discharging the liquid, the liquid is discharged so as to have a velocity component in the same direction as a rotation direction of the substrate holder at the collision position.

8. The plating method according to claim 7, wherein In the step of discharging the liquid, the liquid is discharged from a discharge port along a plane extending toward an upper end side of the substrate holder.

9. The plating method according to any one of claims 1 to 3, characterized in that The conductivity of the liquid is 50 μS / cm or less, or the liquid is degassed.

10. A plating device comprising a substrate holder including a contact member capable of electrically contacting a substrate, and a control device, The plating device is characterized in that The control device is composed of: tilting the substrate holder, In a state where the substrate holder is tilted, the substrate holder is rotated at a first rotation speed, discharging liquid toward the substrate holder rotating at the first rotation speed so as to supply the liquid to the contact member, stopping said discharge of said liquid, Before or within a predetermined time after stopping the discharge of the liquid, starting to reduce the tilt of the substrate holder toward the horizontal position, In a state where the substrate holder is located in the horizontal position, the substrate holder is rotated at a second rotation speed that is faster than the first rotation speed; stopping the rotation of the substrate holder at the second rotation speed, The substrate is mounted on the substrate holder whose rotation has stopped, performing the plating process on the mounted substrate, The prescribed time is less than 2 seconds.

Images