A method and device for ultrasonic-assisted efficient polishing of large-size diamond slices

Abstract

The present invention provides a method and device for ultrasonically assisting in the efficient polishing of large-sized diamond slices. The method and device include a polishing disc, a polishing block, an electric slip ring, an ultrasonic power supply, and piezoelectric ceramics. The polishing disc is located at the bottom of the entire device. The upper and lower parts of the polishing disc are grooved in the circumferential direction. The polishing block is installed in the circumferential groove on the lower side of the polishing disc. During polishing, the polishing block contacts the large-sized diamond slice to be polished. A flange is located above the polishing disc and connected to the polishing disc. The piezoelectric ceramic is installed in the groove on the upper part of the polishing disc. The electric slip ring is located above the flange and fixed to the main shaft by four rotor screws. The lead wires of the piezoelectric ceramic are connected to the rotor end wires of the electric slip ring. The device for ultrasonically assisting in the efficient polishing of large-sized diamond slices utilizes ultrasonic assistance. When an electric field is applied, the piezoelectric ceramic expands and contracts to push the polishing disc to generate a micro-displacement. This increases the friction distance between the polishing block and the large-sized diamond slice within the same time, thereby improving the polishing efficiency of the large-sized diamond.

Description

Technical Field

[0001] The present invention relates to the technical field of a new generation of semiconductor manufacturing equipment, and in particular to a method and device for ultrasonically assisted efficient polishing of large-sized diamond slices. Background Art

[0002] In recent years, the semiconductor industry has experienced rapid growth. As an emerging industry, semiconductors are becoming increasingly important in the national economy and high-tech sectors. Furthermore, silicon-based materials are no longer able to meet the high-power, high-energy consumption demands of power electronics applications. Diamond, as a semiconductor material, has become a promising development for the semiconductor industry. Diamond possesses excellent properties such as a wide bandgap, high electron saturation drift velocity, high thermal conductivity, high fracture toughness, high hardness, and high-temperature resistance. It is widely used in optics, mechanics, electricity, heat, acoustics, and other fields, and is considered a very promising fourth-generation semiconductor material.

[0003] Natural diamonds are primarily used in jewelry. From a technical perspective, the irregular shape and small size of natural diamonds make them difficult to apply to optical windows and heat dissipation applications. Furthermore, the rapid development of chemical vapor deposition (CVD) technology in recent decades has overcome the limitations of the limited quantity and small size of traditional natural diamonds, enabling the low-cost and large-scale production of synthetic diamonds. Consequently, CVD has ultimately promoted the widespread application of diamond in optics, acoustics, thermal management, and semiconductors. Whether naturally mined or artificially produced, diamond crystals' industrial applications require high-precision flatness to achieve an ultra-smooth, damage-free surface. Furthermore, diamond's unique high hardness, wear resistance, high chemical inertness, and anisotropy make its processing extremely difficult. Therefore, the principles, processes, and equipment associated with ultra-precision polishing of diamond crystals have long been a focus of attention in academia and industry. Numerous polishing techniques have been developed to reduce the surface roughness of diamond crystals. The most commonly used methods include mechanical polishing, thermochemical polishing, chemical-mechanical polishing, dynamic friction polishing, laser polishing, ion beam polishing, and hydroxyl radical-enhanced chemical polishing. Each of these techniques offers unique advantages, such as high material removal capacity, high-quality polished surfaces, and low processing costs. The choice of polishing technique depends on the application and the size of the pre-polished diamond. For example, when applying ultra-thin, wear-resistant or chemical-resistant diamond coatings, a medium polishing technique is appropriate. Diamonds used in optical windows, on the other hand, require a highly polished surface. In particular, applications in heat spreaders require polishing on both sides of the diamond. Notably, the widespread adoption of CVD diamond films has also introduced new challenges to current diamond polishing methods. This is because the initial rough surface, large diameter, and thin thickness of CVD diamond create an unprecedented imbalance between efficiency and quality. Therefore, it is imperative to select an appropriate polishing technique that is appropriate for the desired application and within economic constraints. Currently, the most commonly used methods for diamond polishing are mechanical polishing and chemical-mechanical polishing. However, due to diamond's extreme hardness and excellent chemical stability, diamond polishing efficiency is low, resulting in prohibitively high manufacturing costs for diamond semiconductors.

[0004] Therefore, the existing technology still needs to be improved and enhanced. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method and device for ultrasonically assisted efficient polishing of large-sized diamond slices, aiming to solve the problem of low efficiency of traditional mechanical polishing of large-sized diamond slices in the prior art.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, a device for ultrasonically assisted efficient polishing of large-sized diamond sheets comprises a polishing disc, a polishing block, a piezoelectric ceramic, an electric slip ring, and an ultrasonic power supply;

[0008] The top of the polishing plate is connected to the bottom of the flange, and the top of the flange is connected to the main shaft. A plurality of grooves are respectively provided around the top and bottom of the polishing plate, wherein the grooves around the bottom are equipped with polishing blocks, and the grooves around the top and the grooves around the top are equipped with rubber sheets 1 and 2 respectively.

[0009] A plurality of the piezoelectric ceramics are installed in the grooves around the top of the polishing plate and placed on the rubber sheet. The height of the piezoelectric ceramics is equal to the height of the polishing plate, and the displacement direction of the piezoelectric ceramics after the electric field is applied is consistent with the turning direction of the polishing plate.

[0010] The inner hole of the electric slip ring is connected to the main shaft, the top of the electric slip ring is the stator end, and the bottom is the rotor end. The lead wires of the rotor end at the bottom of the electric slip ring are respectively connected to multiple piezoelectric ceramics through wire 1 and wire 2;

[0011] The ultrasonic power supply is located in the non-processing area, and the output channel of the ultrasonic power supply is electrically connected to the stator end of the electric slip ring through wire three, wire four, and wire five.

[0012] Furthermore, a plurality of narrow grooves are formed on the outer circumference of the polishing disc to divide the polishing disc into a plurality of sector-shaped areas;

[0013] The polishing plate is provided with a plurality of top peripheral grooves with the narrow groove as the central axis, wherein half of the top peripheral grooves arranged at intervals are piezoelectric ceramic mounting grooves;

[0014] A polishing block mounting groove is provided at the bottom of each sector-shaped area of ​​the polishing disc; and the polishing disc is in a stepped shape.

[0015] Furthermore, the diameter of the polishing disc is 20mm-300mm and the thickness is 8mm-50mm; the narrow groove is cut through along the axial direction of the polishing disc, and the cutting length along the radial direction of the polishing disc is 3mm-80mm, and the groove width along the circumference of the polishing disc is 0.05mm-3mm; the grooves around the top are 2mm-20mm away from the edge of the polishing disc, and the size of the piezoelectric ceramic mounting groove is 2mm×2mm×3mm-20mm×20mm×80mm; the groove depth of the polishing block mounting groove is 1mm-8mm and the groove width is 3mm-15mm; the polishing disc is set with a step height of 3-15mm.

[0016] Furthermore, the piezoelectric ceramics are installed in grooves around the top of the polishing plate and placed on a rubber sheet. The height of the piezoelectric ceramics is 3mm-80mm, the rated frequency is 10kHz-200kHz, and the displacement of the piezoelectric ceramics after applying an electric field is 1μm-80μm.

[0017] Furthermore, the lead wire at the bottom rotor end of the electric slip ring is connected to multiple piezoelectric ceramics through wire 1 and wire 2 respectively. The connection method is that one line of the electric slip ring is connected in parallel with multiple piezoelectric ceramics, and the rated parameters of each line of the electric slip ring are equal to the usage parameters of multiple piezoelectric ceramics working in parallel.

[0018] Furthermore, the output channel of the ultrasonic power supply is electrically connected to the stator end of the electric slip ring through wire three, wire four, and wire five. Each output channel of the ultrasonic power supply drives multiple piezoelectric ceramics to work in parallel. The output frequency of the ultrasonic power supply is 1kHz-100kHz.

[0019] Furthermore, the polishing block is bonded and installed in the groove around the bottom of the polishing disc. The polishing block is made of metal, ceramic, grinding wheel block or organic material, wherein the metal material includes iron, stainless steel, cobalt, nickel, titanium and titanium alloy.

[0020] Furthermore, the rubber sheet is bonded to the grooves around the top of the polishing plate to prevent the piezoelectric ceramics from being corroded in the grooves around the top of the polishing plate.

[0021] In a second aspect, a polishing method for a large-size diamond sheet device using ultrasound-assisted high-efficiency polishing comprises:

[0022] The main shaft drives the entire polishing device to rotate. The ultrasonic power supply applies a continuously changing electric field to the piezoelectric ceramic through the electric slip ring. At this time, the piezoelectric ceramic produces deformation, that is, a micro-displacement along the deformation direction. The force is applied to the sector-shaped area of ​​the polishing disk, pushing each sector-shaped area of ​​the polishing disk to produce a micro-displacement. This drives the polishing block attached to the bottom of the polishing disk to vibrate back and forth at high speed, accelerating the friction speed between the polishing block and the diamond surface. Under the action of mechanical friction and chemical reaction, high-speed removal of diamond material is achieved;

[0023] In the rough polishing stage, a grit diamond grinding wheel is used as the polishing disk, which rubs against the diamond surface under the action of ultrasound to produce micro-impact, thus achieving rough processing of the diamond;

[0024] In the semi-finishing stage, catalytic metal is used as the polishing disk, which generates high-speed friction with the diamond workpiece under the action of ultrasound, and the diamond is quickly removed under the friction heat and metal catalysis.

[0025] In the finishing stage, organic fibers are used as polishing discs and diamond abrasives are added to achieve ultra-smooth polishing of diamonds under the action of ultrasound.

[0026] The technical solution adopted by the present invention has the following beneficial effects:

[0027] (1) Compared with the traditional mechanical polishing method of large-size diamond sheets, the ultrasonic power supply applies a high-frequency changing electric field to the piezoelectric ceramics through the electric slip ring. Due to the inverse piezoelectric effect of the piezoelectric ceramics, periodic deformation is generated, which pushes the fan-shaped area of ​​the polishing disk to drive the polishing block to move. Under the action of ultrasound, the polishing block produces high-speed relative friction with the diamond workpiece, thereby improving the polishing efficiency.

[0028] (2) The polishing device can be installed on a vertical grinder or polishing machine as an independent module and is suitable for a variety of polishing equipment.

[0029] (3) Multiple 1mm slots are opened around the polishing disc, which can be regarded as dividing the polishing disc into multiple sector-shaped areas. Each sector-shaped area is equipped with piezoelectric ceramics and polishing blocks. The joint stiffness is low, which is conducive to large amplitude movement and greatly improves polishing efficiency. Each sector-shaped unit operates independently without affecting other units.

[0030] (4) The bottom of the polishing disc is opened with grooves around it to install the polishing blocks. The polishing blocks can be selected from different materials and sizes such as cast iron, diamond grinding wheel blocks, chemical reaction grinding wheel blocks, etc. according to actual needs, and are easy to replace.

[0031] (5) The circumferential distance of each polishing block is small and highly consistent, making it easy to adjust and ensuring good surface quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic structural diagram of a device for ultrasonically assisted high-efficiency polishing of large-sized diamond sheets provided in an embodiment of the present invention;

[0033] Figure 2 A schematic front view of a device for ultrasonically assisted high-efficiency polishing of large-sized diamond sheets provided in an embodiment of the present invention;

[0034] Figure 3 A schematic bottom view of a device for ultrasonically assisted high-efficiency polishing of large-sized diamond sheets provided in an embodiment of the present invention;

[0035] Figure 4 A schematic diagram of a top view of a partial structure of a polishing disc provided by an embodiment of the present invention;

[0036] Figure 5 A schematic diagram of a partial structure of a polishing disc provided by an embodiment of the present invention as viewed from below;

[0037] Figure 6 A schematic top view of a rubber sheet bonded to a polishing disc provided by an embodiment of the present invention;

[0038] Figure 7 A partial schematic diagram of a polishing disc sector assembly provided by an embodiment of the present invention;

[0039] Figure 8 A schematic diagram of the polishing principle provided by an embodiment of the present invention.

[0040] In the figure: 1 polishing disc; 2 polishing block; 3 flange; 4 piezoelectric ceramic; 5 rubber sheet 1, 6 rubber sheet 2; 7 wire 1, 8 wire 2, 15 wire 3, 16 wire 4, 17 wire 5; 9 main shaft; 10 screw 1, 11 screw 2, 18 screw 3; 12 electric slip ring; 13 dust cover; 14 ultrasonic power supply; 101 narrow slot; 102 top peripheral slot 1; 103 top peripheral slot 2; 104 bottom peripheral slot. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0042] See also Figure 1-8 , a device for ultrasonically assisted efficient polishing of large-sized diamond slices, comprising a polishing disc 1, a polishing block 2, a piezoelectric ceramic 4, an electric slip ring 12, and an ultrasonic power supply 14;

[0043] like Figure 1 、 Figure 5 and Figure 6 As shown, the top of the polishing disc 1 is connected to the bottom of the flange 3, and the top of the flange 3 is connected to the main shaft 9. The polishing disc 1 is provided with multiple grooves around the top and bottom. The polishing block 2 is installed in the groove 104 around the bottom, and the rubber sheet 1 6 and the rubber sheet 2 5 are installed in the groove 1 102 and the groove 2 103 around the top respectively.

[0044] like Figure 1 and Figure 7 As shown, a plurality of the piezoelectric ceramics 4 are installed in the grooves around the top of the polishing plate 1 and placed on the rubber sheet 6. The height of the piezoelectric ceramics 4 is equal to the height of the polishing plate 1, and the displacement direction of the piezoelectric ceramics 4 after the electric field is applied is consistent with the turning direction of the polishing plate 1.

[0045] like Figure 1 As shown, the inner hole of the electric slip ring 12 is connected to the main shaft 9, the top of the electric slip ring 12 is the stator end, and the bottom is the rotor end. The lead wires of the rotor end at the bottom of the electric slip ring 12 are connected to multiple piezoelectric ceramics 4 respectively through wire 1 7 and wire 2 8;

[0046] The ultrasonic power supply 14 is located in the non-processing area, and the output channel of the ultrasonic power supply 14 is electrically connected to the stator end of the electric slip ring 12 through the wire three 15, the wire four 16, and the wire five 17.

[0047] In this embodiment, if Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, a plurality of narrow grooves 101 are opened circumferentially on the outer circumference of the polishing disc 1 to divide the polishing disc 1 into a plurality of sector-shaped areas; a plurality of top peripheral grooves are opened around the top of the polishing disc 1 with the narrow groove 101 as the central axis, half of which are arranged at intervals as piezoelectric ceramic mounting grooves; a polishing block mounting groove is opened at the bottom of each sector-shaped area of ​​the polishing disc 1; and the polishing disc 1 is stepped; and further, during use, due to the inverse piezoelectric effect of the piezoelectric ceramic 4, periodic deformation is generated, which pushes the sector-shaped area of ​​the polishing disc 1 to drive the polishing block 2 to move, and the polishing block 2 generates high-speed relative friction with the diamond workpiece under the action of ultrasound, which can improve the polishing efficiency.

[0048] It should be noted that, in an embodiment of the present invention, the diameter of the polishing disc 1 is 20mm-300mm and the thickness is 8mm-50mm; the narrow groove 101 is cut through along the axial direction of the polishing disc 1, and the cutting length along the radial direction of the polishing disc 1 is 3mm-80mm, and the groove width along the circumference of the polishing disc 1 is 0.05mm-3mm; the grooves around the top are 2mm-20mm away from the edge of the polishing disc 1, and the size of the piezoelectric ceramic mounting groove is 2mm×2mm×3mm-20mm×20mm×80mm; the groove depth of the polishing block mounting groove is 1mm-8mm, and the groove width is 3mm-15mm; the polishing disc 1 is set with a step height of 3-15mm.

[0049] To match it, the piezoelectric ceramic 4 is installed in the grooves around the top of the polishing disc 1 and placed on a rubber sheet. The height of the piezoelectric ceramic is 3mm-80mm, the rated frequency is 10kHz-200kHz, and the displacement of the piezoelectric ceramic after the electric field is applied is 1μm-80μm, which matches the groove body of the polishing disc.

[0050] In this embodiment, the lead wires at the bottom rotor end of the electric slip ring 12 are connected to the multiple piezoelectric ceramics 4 respectively through wire 1 7 and wire 2 8. The connection method is that one path of the electric slip ring 12 is connected in parallel with the multiple piezoelectric ceramics 4. The rated parameters of each path of the electric slip ring 1 are equal to the operating parameters of the multiple piezoelectric ceramics 4 working in parallel.

[0051] In this embodiment, the output channel of the ultrasonic power supply 14 is electrically connected to the stator end of the electric slip ring 12 through wire three 15, wire four 16, and wire five 17. The output frequency of the ultrasonic power supply 14 is 1kHz-100kHz, so that each output channel of the ultrasonic power supply 14 drives multiple piezoelectric ceramics 4 to work in parallel.

[0052] In this embodiment, the polishing block 2 is bonded and installed in the groove 104 around the bottom of the polishing disc 1. The polishing block 2 is made of metal, ceramic, grinding wheel block or organic material, wherein the metal material includes iron, stainless steel, cobalt, nickel, titanium, titanium alloy, etc.

[0053] It should be noted that the rubber sheet 6 is bonded to the groove 102 around the top of the polishing plate 1 to prevent the piezoelectric ceramic 4 from being corroded in the groove 102 around the top of the polishing plate 1 and to protect the piezoelectric ceramic 4 .

[0054] Working principle: When using the ultrasonic assisted high-efficiency polishing device for large-size diamond slices, according to Figure 1-8 As shown, the flange 3 and the spindle 9 are threadedly connected, and the polishing plate 1 and the flange 3 are also threadedly connected, enabling the spindle 9 to drive the entire polishing device in rotation. An ultrasonic power supply generates a varying electric field, which is connected via electrical wires to the stator end of an electric slip ring 12. The rotor end of the electric slip ring 12 is connected via electrical wires to the piezoelectric ceramic 4 mounted in a mounting slot above the polishing plate 1. This allows the ultrasonic power supply to apply a periodic, uninterrupted, high-frequency varying electric field to the piezoelectric ceramic 4 while the polishing device rotates. Under the action of this periodic electric field, the piezoelectric ceramic 4 periodically stretches and then returns to its original length. During this stretching process, the piezoelectric ceramic 4 exerts force on the sectors of the polishing plate 1 on either side of the piezoelectric ceramic 4 (around the circumference of the polishing plate 1), pushing these sectors in the circumferential direction (the direction in which the piezoelectric ceramic 4 stretches). During this process, the sectors also displace in the circumferential direction (the direction in which the piezoelectric ceramic 4 shortens), driving the polishing block 2 mounted at the bottom of each sector. During operation, the spindle 9 drives the entire device in rotation, and the sectors vibrate at high frequencies (around the circumferential direction) under the action of ultrasound. The polishing block 2 moves relative to the surface of the large diamond disc being machined by combining rotation with a lateral oscillation along the circumference of the polishing disc 1, increasing the friction distance within the same timeframe. This polishing device enables efficient polishing of large diamond discs. By utilizing the inverse piezoelectric effect of piezoelectric ceramics to induce micro-deformation and micro-displacement of the polishing disc, it significantly improves polishing efficiency compared to traditional mechanical polishing of large diamond discs.

[0055] During use, the polishing disc 1 can be replaced according to different polishing modes. The materials of the polishing disc 1 are catalytic metal, diamond grinding wheel block, organic material, etc. The catalytic metal polishing disc realizes diamond catalytic reaction removal, the grinding wheel block polishing disc realizes rough processing, and the organic material polishing disc is combined with diamond abrasives of different diamond grain sizes to realize diamond fine processing.

[0056] In an embodiment of the present invention, a method for efficiently polishing a large-sized diamond sheet using ultrasound-assisted polishing comprises: a spindle 9 drives the entire polishing device to rotate, an ultrasonic power supply 14 applies a continuously changing electric field to a piezoelectric ceramic 4 via an electric slip ring 12, causing the piezoelectric ceramic 4 to deform, i.e., to produce a micro-displacement along the deformation direction, and applies force to a sector-shaped area of ​​a polishing plate 1, causing each sector-shaped area of ​​the polishing plate 1 to produce a micro-displacement, driving a polishing block 2 attached to the bottom of the polishing plate 1 to vibrate back and forth at high speed, accelerating the friction speed between the polishing block 2 and the diamond surface, and achieving high-speed removal of diamond material under the action of mechanical friction and chemical reaction;

[0057] In the rough polishing stage, a grit diamond grinding wheel is used as the polishing disc 1, which rubs against the diamond surface under the action of ultrasound to produce microscopic impact, thus achieving rough processing of the diamond;

[0058] In the semi-finishing stage, a catalytic metal is used as the polishing disc 1, which generates high-speed friction with the diamond workpiece under the action of ultrasound, and the diamond is quickly removed under the friction heat and metal catalysis;

[0059] In the finishing stage, organic fiber is used as the polishing disc 1 and diamond abrasive is added to achieve ultra-smooth polishing of the diamond under the action of ultrasound.

[0060] Figure 8 The figure shows a piezoelectric ceramic 4 and two sectors on either side of it. Under the action of a periodic electric field, the piezoelectric ceramic 4 periodically stretches to its sides, restoring its original length. During this stretching process, the piezoelectric ceramic 4 applies force to the sectors of the polishing plate 1 on both sides of the piezoelectric ceramic 4 (along the circumference of the polishing plate 1), pushing the sectors to displace in the circumferential direction (the direction in which the piezoelectric ceramic 4 stretches). During the process of restoring the piezoelectric ceramic 4 to its original length, the sectors displace in the opposite circumferential direction (the direction in which the piezoelectric ceramic 4 shortens). Under the action of a high-frequency electric field, high-frequency displacement of the sectors on both sides is achieved.

[0061] After the polishing disc 1 is provided with narrow grooves 101 , the polishing disc 1 is divided into a plurality of sector-shaped areas. The piezoelectric ceramics 4 push the sectors to generate micro-displacement, thereby realizing ultrasonic-assisted polishing.

[0062] The polishing disc 1 is provided in a stepped shape in order to allow trimming of the polishing block 2 without disassembling the polishing block 2 . The stepped shape can facilitate fixing the polishing disc 1 and directly trimming the polishing block 2 .

[0063] The function of screw 2 11 is to connect the main shaft 9 and the flange 3 so that the main shaft 9 drives the flange 3 to rotate.

[0064] The function of screw 10 is to connect the polishing disc 1 and the flange 3, so that the main shaft 9 drives the polishing disc 1 to rotate through the flange 3.

[0065] The function of screw three 18 is to fix the electric slip ring 12 on the main shaft 9, and pass through the positioning hole of the electric slip ring 12 to clamp it on the main shaft 9.

[0066] The dust cover 13 is placed below the electric slip ring 12 and is placed at a height higher than the top of the flange 3 . The size can be adjusted according to the actual workbench.

[0067] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the embodiments disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the claims.

Claims

1. A device for ultrasonically assisted high-efficiency polishing of large-sized diamond sheets, characterized by: It includes a polishing disc (1), a polishing block (2), a piezoelectric ceramic (4), an electric slip ring (12), and an ultrasonic power supply (14); The polishing disc (1) is in a stepped shape, the top of the polishing disc (1) is connected to the bottom of the flange (3), the top of the flange (3) is connected to the main shaft (9), a plurality of narrow grooves (101) are provided on the outer circumferential surface of the polishing disc (1), the narrow grooves (101) are cut through along the axial direction of the polishing disc (1) to divide the polishing disc (1) into a plurality of sector-shaped areas, each sector-shaped area of ​​the polishing disc (1) is provided with a bottom peripheral groove (104), and a polishing block (2) is installed in the bottom peripheral groove (104); a plurality of top peripheral grooves are provided around the top of the polishing disc (1) with the narrow groove (101) as the central axis, half of which are arranged at intervals as piezoelectric ceramic mounting grooves, and a rubber sheet (6) is installed in the piezoelectric ceramic mounting groove; A plurality of the piezoelectric ceramics (4) are mounted on a rubber sheet (6), the height of the piezoelectric ceramics (4) is equal to the height of the polishing disc (1), and the displacement direction of the piezoelectric ceramics (4) after an electric field is applied is consistent with the rotation direction of the polishing disc (1); The inner hole of the electric slip ring (12) is connected to the main shaft (9), the top of the electric slip ring (12) is the stator end, and the bottom is the rotor end. The lead wires of the rotor end at the bottom of the electric slip ring (12) are respectively connected to the plurality of piezoelectric ceramics (4) through the wire 1 (7) and the wire 2 (8); The ultrasonic power supply (14) is located in a non-processing area, and an output channel of the ultrasonic power supply (14) is electrically connected to the stator end of the electric slip ring (12) through wire three (15), wire four (16), and wire five (17).

2. The ultrasonic-assisted, high-efficiency polishing device for large-size diamond slices according to claim 1, characterized in that: The polishing disc (1) has a diameter of 20 mm to 300 mm and a thickness of 8 mm to 50 mm. The cut-through length of the narrow groove (101) along the radial direction of the polishing disc (1) is 3 mm to 80 mm, and the groove width along the circumferential direction of the polishing disc (1) is 0.05 mm to 3 mm. The top four grooves are 2 mm to 20 mm away from the edge of the polishing disc (1), wherein the size of the piezoelectric ceramic mounting groove is 2 mm × 2 mm × 3 mm to 20 mm × 20 mm × 80 mm. The groove depth of the bottom four grooves (104) is 1 mm to 8 mm, and the groove width is 3 mm to 15 mm. The polishing disc (1) is provided with a step height of 3 to 15 mm.

3. The ultrasonic-assisted, high-efficiency polishing device for large-size diamond slices according to claim 1, characterized in that: The height of the piezoelectric ceramic is 3mm-80mm, the rated frequency is 10kHz-200kHz, and the displacement of the piezoelectric ceramic after applying an electric field is 1μm-80μm.

4. The ultrasonic-assisted, high-efficiency polishing device for large-sized diamond slices according to claim 1, characterized in that: The electric slip ring (12) is connected in parallel to a plurality of piezoelectric ceramics (4), and the rated parameters of each path of the electric slip ring (12) are equal to the operating parameters of the plurality of piezoelectric ceramics (4) working in parallel.

5. The ultrasonic-assisted high-efficiency polishing device for large-size diamond slices according to claim 1, characterized in that: Each output channel of the ultrasonic power supply (14) drives a plurality of piezoelectric ceramics (4) to work in parallel, and the output frequency of the ultrasonic power supply (14) is 1 kHz-100 kHz.

6. The ultrasonic-assisted, high-efficiency polishing device for large-sized diamond slices according to claim 1, characterized in that: The polishing block (2) is bonded and installed in the groove (104) around the bottom of the polishing plate (1). The polishing block (2) is made of metal, ceramic or organic material, wherein the metal material includes iron, stainless steel, cobalt, nickel, titanium and titanium alloy.

7. The ultrasonic-assisted high-efficiency polishing device for large-sized diamond slices according to claim 1, characterized in that: The rubber sheet 1 (6) is bonded to the piezoelectric ceramic mounting groove of the polishing plate (1).

8. A polishing method using the ultrasonic-assisted high-efficiency polishing device for large-sized diamond sheets according to claim 1, characterized in that: The main shaft (9) drives the entire polishing device to rotate, and the ultrasonic power supply (14) applies a continuously changing electric field to the piezoelectric ceramic (4) through the electric slip ring (12). At this time, the piezoelectric ceramic (4) is deformed, that is, it produces a micro-displacement along the deformation direction, and applies force to the sector area of ​​the polishing disc (1), pushing each sector area of ​​the polishing disc (1) to produce a micro-displacement, driving the polishing block (2) attached to the bottom of the polishing disc (1) to vibrate back and forth at high speed, accelerating the friction speed between the polishing block (2) and the diamond surface, and realizing high-speed removal of diamond material under the action of mechanical friction and chemical reaction; In the rough polishing stage, a diamond grinding wheel with a certain particle size is used as a polishing disc (1), which rubs against the diamond surface under the action of ultrasound to produce microscopic impact, thereby achieving rough processing of the diamond; In the semi-finishing stage, a catalytic metal is used as a polishing disk (1), which generates high-speed friction with the diamond workpiece under the action of ultrasound, and the diamond is quickly removed under the friction heat and metal catalysis; In the finishing stage, organic fiber is used as a polishing disc (1) and diamond abrasive is added to achieve ultra-smooth polishing of diamond under the action of ultrasound.

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