Polishing head pressure detection apparatus, method, and polishing apparatus for wafer processing

Abstract

The application provides a polishing head pressure detection device, a method and a polishing device for wafer processing. The polishing head pressure detection device comprises a base, a bottom surface of the base being suitable for placing the polishing head pressure detection device on a polishing turntable of a polishing device, a sensor reserved slot being provided on an upper surface of the base and being uniformly distributed on one index circle or a plurality of concentric index circles, the sensor reserved slot being used for placing a pressure sensor; and an upper cover plate, the upper cover plate being stacked on the upper surface of the base and being suitable for pressing the pressure sensor uniformly distributed on at least one index circle, and the upper cover plate being pressed by a polishing head of the polishing device downward when polishing head pressure detection is performed. The technical scheme of the application can effectively and accurately detect the polishing head pressure, provides accurate guidance for polishing head pressure adjustment, is beneficial to accurate adjustment of the polishing head pressure, and further improves the polishing effect of the polishing device.

Description

Technical Field

[0001] This invention belongs to the field of chemical mechanical polishing technology, specifically relating to a polishing head pressure detection device, method, and polishing equipment for wafer processing. Background Technology

[0002] In chemical mechanical polishing (CMP), the pressure applied by the polishing head to the wafer directly affects the polishing effect. To achieve precise control over the polishing effect, the internal partition design of the polishing head is continuously optimized. However, with the increasing complexity of the partition structure, the coupling between partitions strengthens, making the quantitative characterization of the partition relationships increasingly difficult. Furthermore, the theoretical pressure value calculated based on structural parameters under unloaded film conditions has a significant error compared to the actual pressure value under loaded conditions. For partitions with strong film coupling, the results obtained using theoretical calculations or empirical formulas often exhibit large deviations. Conventional theoretical calculation methods require a high degree of user experience, limiting their widespread applicability. Moreover, wafer polishing experiments are not only costly but also susceptible to the influence of chemical factors, leading to unstable polishing performance under different operating conditions. Summary of the Invention

[0003] In view of this, the present invention provides a polishing head pressure detection device, method, and polishing equipment for wafer processing, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0004] To achieve the aforementioned objectives, a first aspect of the present invention provides a polishing head pressure detection device, the polishing head pressure detection device comprising:

[0005] A base, adapted to be placed on the polishing turntable of a polishing device with its bottom surface, wherein the upper surface of the base is provided with sensor slots evenly distributed along one or more concentric circular tracks, the sensor slots being used to house pressure sensors; and

[0006] A top cover plate, which is stacked on the upper surface of the base and adapted to press against the pressure sensors evenly distributed on at least one circular track;

[0007] The polishing head pressure detection device is configured to detect the pressure of the polishing head via the pressure sensor when the polishing head of the polishing device presses down against the upper cover plate.

[0008] In the polishing pressure testing device described above, optionally, the upper cover plate includes a disc-shaped cover plate that can cover all the sensor reserved slots on the circular trajectory.

[0009] In the polishing pressure detection device as described above, optionally, the upper cover plate comprises a circular ring cover plate capable of covering the sensor reserved groove on the single circular track.

[0010] In the polishing pressure detection device as described above, optionally, the circular ring cover plate comprises a first circular ring cover plate adapted to the air film area of the polishing head and a second circular ring cover plate adapted to the retaining ring area of the polishing head, the thickness of the first circular ring cover plate is greater than the thickness of the second circular ring cover plate.

[0011] In the polishing pressure detection device as described above, optionally, the upper surface of the base is provided with a line reserved groove for arranging the power line and / or signal line of the pressure sensor, the sensor reserved groove is arranged at the intersection of the line reserved groove and the circular track.

[0012] In the polishing pressure detection device as described above, optionally, the base is disc-shaped, the line reserved groove extends radially on the upper surface of the base, and the line reserved groove evenly divides the upper surface of the base circumferentially.

[0013] In the polishing pressure detection device as described above, optionally, the upper surface of the base is provided with three line reserved grooves extending through the center of the base, three pressure sensors are arranged on each circular track, and the pressure sensors on different circular tracks are arranged circumferentially staggered.

[0014] In the polishing pressure detection device as described above, optionally, the line reserved groove has an outlet port.

[0015] In the polishing pressure detection device as described above, optionally, a plurality of line reserved grooves extend parallel to each other on the upper surface of the base.

[0016] In the polishing pressure detection device as described above, optionally, a gap is formed between adjacent circular ring cover plates.

[0017] In the polishing pressure detection device as described above, optionally, the bottom surface of the base is a flat surface.

[0018] In the polishing pressure detection device as described above, optionally, the polishing head pressure detection device further comprises two radially outwardly extending flanges provided on the outer periphery of the base, and a gripping element is arranged on each extending flange.

[0019] In the polishing pressure detection device as described above, optionally, the base is disc-shaped, and a plurality of auxiliary positioning holes are arranged on the base, the auxiliary positioning holes are used to define the position of the outer periphery of the upper cover plate, so that the upper cover plate is concentric with the base.

[0020] In the polishing pressure detection device as described above, optionally, the polishing head pressure detection device is configured with a processing module for receiving and processing the pressure data detected by the pressure sensors.

[0021] To achieve the foregoing object, the second aspect of the present application provides a method for detecting the pressure of a polishing head using the polishing head pressure detection device according to any one of the foregoing first aspects.

[0022] In the method for detecting the pressure of a polishing head as described above, optionally, the method comprises the following steps:

[0023] placing pressure sensors in the sensor reserved grooves of the same circular track;

[0024] placing the polishing pressure detection device on a polishing turntable of a polishing device;

[0025] concentrically arranging the upper cover plate on the upper surface of the base, and covering the pressure sensors of the same circular track with the upper cover plate;

[0026] pressing the upper cover plate with a polishing head of the polishing device; and

[0027] obtaining the output results of the pressure sensors and determining the mechanical properties of the polishing head according to the output results.

[0028] In the method for detecting the pressure of a polishing head as described above, optionally, the method comprises a step of polishing head concentric alignment, in which the polishing head is pressurized, and if the output pressure difference of the pressure sensors on the same circular track is within a preset threshold, it is determined that the polishing head is concentrically aligned.

[0029] In the method for detecting the pressure of a polishing head as described above, optionally, multiple pressure sensors are arranged on only one of the circular tracks, and the pressure values detected by the multiple pressure sensors are summed up as the pressure of the polishing head.

[0030] In the method for detecting the pressure of a polishing head as described above, optionally, the upper cover plate comprises a circular ring-shaped cover plate, and multiple pressure sensors are arranged on each of the circular ring-shaped cover plates, and the sum of the pressure values detected by the multiple pressure sensors under each of the circular ring-shaped cover plates is taken as the pressure of the corresponding gas film area of the polishing head, thereby achieving decoupling of pressure measurement of different gas film areas.

[0031] To achieve the aforementioned objectives, a third aspect of the present invention provides a polishing apparatus for wafer processing, the polishing apparatus comprising a polishing turntable, a polishing head, a dresser, a polishing head pressure detection device as described in any one of the first aspects above, a controller, and a moving assembly, the controller controlling the moving assembly to move the polishing head pressure detection device onto or away from the polishing turntable.

[0032] The polishing head pressure detection device, method, and polishing equipment for wafer processing disclosed in this application can effectively and accurately detect polishing head pressure, providing accurate guidance for polishing head pressure adjustment, which is beneficial for accurate adjustment of polishing head pressure and thus improves the polishing effect of polishing equipment. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0034] The disclosure of this invention will become more apparent from the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings:

[0035] Figure 1 A perspective view of an embodiment of the polishing head and the polishing head pressure detection device of the present invention;

[0036] Figure 2 for Figure 1 Top view of the embodiment shown;

[0037] Figure 3 for Figure 1 Full sectional view of the embodiment shown;

[0038] Figure 4 This is a perspective view of another embodiment of the pressure detection device of the present invention;

[0039] Figure 5 for Figure 4 The illustrated embodiment has a perspective view of the ring-shaped cover plate removed;

[0040] Figure 6 for Figure 4 The illustrated embodiment is a full sectional view with part of the annular cover plate removed;

[0041] Figure 7 for Figure 1 and Figure 4 Top view of the base of the two embodiments shown;

[0042] Figure 8 For Figure 7 A top view of another embodiment of the base;

[0043] Figure 9 A flowchart of a polishing head pressure detection method of a polishing head pressure detection device according to the present application is shown;

[0044] Figure 10 A schematic diagram of a step of polishing head concentric alignment of a polishing head pressure detection device and a polishing head pressure detection method according to the present application is shown;

[0045] Figure 11 A pressure coupling phenomenon of a polishing head air film area is shown.

[0046] Reference numerals: 1-polishing head; 2-polishing head pressure detection device; 3-upper cover plate; 4-base; 5-assisted positioning hole; 6-pressure sensor; 7-sensor reserved groove; 8-circuit reserved groove; 9-retaining ring; 10-air film; 11-circular ring cover plate; 12-holding element; 13-first circular ring cover plate; 131-cover plate one; 132-cover plate two; 133-cover plate three; 134-cover plate four; 14-second circular ring cover plate; 15-retaining ring area; 16-air film area; 17-disc-shaped cover plate. DETAILED DESCRIPTION

[0047] In order to make the personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the embodiments of the present application shall belong to the scope of protection of the embodiments of the present application.

[0048] In the description of the present application, it should be understood that the terms "transverse", "upper", "lower", "horizontal", "top", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0049] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "mounting", "connection" should be understood broadly, for example, it can be mechanical connection or electrical connection, it can be the communication between two elements, it can be direct connection or indirect connection through intermediate medium, and those of ordinary skill in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature.

[0051] Figure 1 This is a perspective view of an embodiment of the polishing head and the polishing head pressure detection device of the present invention. Figure 1 As shown, the device 2 can be directly mounted on the polishing turntable of the polishing equipment, or placed on a polishing pad to adapt to different types of polishing equipment. During chemical mechanical polishing (CMP), the polishing equipment rotates the polishing turntable, causing the polishing pad mounted on it to rotate as well. The polishing head 1 applies pressure to press the wafer onto the polishing pad, causing the wafer to rotate and move linearly, thus performing the polishing process. The polishing head pressure detection device 2 of this invention is used to accurately detect the polishing pressure of the wafer, thereby analyzing and optimizing the pressure application scheme of the polishing head 1 to ensure uniformity and accuracy in the polishing process. In this embodiment, the polishing head pressure detection device 2 is located below the polishing head 1. During polishing pressure detection, the polishing head 1 of the polishing equipment presses downwards against the upper part of the polishing head pressure detection device 2, thereby measuring the pressure experienced by the wafer during polishing.

[0052] Figure 2 for Figure 1 Top view of the illustrated embodiment. From Figure 2 As can be seen, the polishing head pressure testing device 2 mainly includes a base 4 and an upper cover plate 3. The base 4 is suitable for placing its bottom surface on the polishing turntable of the polishing equipment, ensuring the stability and reliability of the polishing head pressure testing device 2 during operation. In particular, the bottom structure of the base 4 is suitable for stable placement on different types of polishing turntables, and the specific design can be adjusted according to different usage environments. For example, in some application scenarios, such as when the polishing turntable area is small, the bottom of the base 4 can be designed with legs to improve the stability of the equipment, or a ring-shaped support structure can be set to enhance the overall rigidity of the equipment. For scenarios where the polishing turntable has high flatness, the bottom of the base 4 is suitable to be set as a flat bottom structure. For operations requiring higher precision and complex environments, the base 4 can also be used with suction cups or magnetic base plates to increase the fixing effect, thereby improving the flexibility of use of the polishing head pressure testing device 2.

[0053] Multiple sensor slots 7 are provided on the upper surface of the base 4. Figure 2(Not shown) These sensor slots 7 are evenly distributed on one or more concentric circular tracks on the upper surface of the base 4, facilitating multi-point pressure measurement during the measurement process. These sensor slots 7 not only house the pressure sensors 6 but also ensure sensor stability for accurate measurement data. The even distribution of the sensor slots 7 on each circular track allows for real-time monitoring of the pressure applied by the polishing head 1, determining its equilibrium state and thus optimizing the control of the polishing process.

[0054] like Figure 2 As shown, the upper cover plate 3 is stacked on the upper surface of the base 4. During pressure measurement, the pressure sensors 6 can be evenly distributed on a circular track on the upper surface of the base 4, or they can be evenly distributed on multiple circular tracks, allowing the tester to choose the sensor distribution method according to different testing requirements. The upper cover plate 3 is adapted to press these pressure sensors 6 together. During polishing head pressure testing, the polishing head pressure testing device 2 of the present invention is configured such that when the polishing head 1 of the polishing device presses down against the upper cover plate 3, the upper cover plate 3 transmits this pressure to the pressure sensors 6 installed in the base 4, and the pressure of the polishing head 1 is detected by the pressure sensors 6.

[0055] Furthermore, such as Figure 2 As shown, the upper cover plate 3 includes a disc-shaped cover plate 17, which covers all the sensor slots 7 on the circular tracks. The disc-shaped cover plate 17 is a single unit, designed to ensure that all pressure sensors 6 are subjected to uniform force during polishing head pressure testing, thereby improving the accuracy and reliability of the detection. Specifically, the area of ​​the disc-shaped cover plate 17 is large enough to completely cover all the sensor slots 7 located on different circular tracks. The integrated cover plate structure makes force transmission more stable, effectively preventing interference from external factors to the sensors, and avoiding uneven local pressure during use, thus improving the repeatability and reliability of the measurement results.

[0056] In this embodiment, the material and structure of the upper cover plate 3 can also be optimized. For example, the upper cover plate 3 can be made of a high-rigidity composite material to ensure that it will not deform under high pressure, thereby improving the accuracy of sensor measurements. In addition, the surface of the upper cover plate 3 can be coated with a wear-resistant coating to extend its service life. Furthermore, positioning grooves can be provided on the contact surface between the upper cover plate 3 and the pressure sensor 6, making the fit between the upper cover plate 3 and the pressure sensor 6 more stable and accurate, which helps to improve the final polishing effect.

[0057] The outer periphery of the upper cover plate 3 is provided with auxiliary positioning holes 5, which, in conjunction with positioning elements, define the position of the upper cover plate 3. This allows the upper cover plate 3 and the base 4 to be concentrically fixed and installed.

[0058] Figure 3 For Figure 1 the full section view of the embodiment. As can be seen from Figure 3 , the lower part of the polishing head 1 includes a retaining ring 9 and an air film 10. The retaining ring 9 is connected to the bottom edge of the polishing head 1 above, and the retaining ring 9 is more protruding than the air film 10 below the polishing head 1, and is pressed against the upper cover plate 3. When the retaining ring 9 contacts the upper cover plate 3, the height difference between the air film 10 and the upper cover plate 3 is about 750 microns, which is equal to or slightly less than the thickness of a wafer, and can be adjusted to other values according to the thickness of the wafer used in actual processing, to improve adaptability.

[0059] As Figure 3 shown in the embodiment, when measuring the pressure of the polishing head, no wafer is placed between the polishing head 1 and the polishing head pressure detection device 2. When the upper cover plate 3 is a disc-shaped cover plate 17, the upper surface thereof is a plane. In the case where no wafer is placed, there is a height difference between the air film of the polishing head 1 and the upper cover plate 3, and no contact occurs. Thus, the polishing head 1 only exerts pressure on the upper cover plate 3 through the retaining ring 9, so that the pressure of the retaining ring 9 can be directly measured. In addition, a wafer can also be placed below the air film 10 to simulate the actual polishing process. The air film 10 indirectly exerts pressure on the disc-shaped cover plate 17 through the wafer, and the retaining ring 9 directly exerts pressure on the disc-shaped cover plate 17, so that the pressure exerted by the air film 10 and the retaining ring 9 together can be measured using the pressure sensor 6 at this time.

[0060] Figure 4 is a perspective view of another embodiment of the pressure detection device of the present application. As Figure 4 shown, the upper cover plate 3 includes a circular ring-shaped cover plate 11, and each of the circular ring-shaped cover plates 11 can cover the sensor reserved groove 7 on a single circular track of the base 4. The design of the circular ring-shaped cover plate 11 is suitable for the case where the pressure of the local annular area of the polishing head needs to be detected.

[0061] In this embodiment, the bottom of the polishing head 1 is divided into several annular areas, which are distributed in sequence from the center to the outer periphery of the circle. The circular ring-shaped cover plate 11 is located below the polishing head 1, and includes a first circular ring-shaped cover plate 13 adapted to the air film area 16 of the polishing head 1, which is applied below the air film area 16. The circular ring-shaped cover plate 11 also includes a second circular ring-shaped cover plate 14 adapted to the retaining ring area 15 of the polishing head 1, which is located below the retaining ring area 15. The first circular ring-shaped cover plate 13 is used to bear the pressure of the air film area 16 of the polishing head 1, and the second circular ring-shaped cover plate 14 is used to bear the pressure of the retaining ring area 15. The design of the first circular ring-shaped cover plate 13 and the second circular ring-shaped cover plate 14 is suitable for detecting the pressure of the air film area 16. Through this design, the pressures of different areas can be measured relatively independently, realizing decoupled measurement of the pressures of each area, and ensuring the accuracy of pressure data acquisition under different working conditions.

[0062] Secondly, the second circular cover plate 14 provides stable support for the retaining ring area 15, thereby ensuring the stability of the device during operation. Through independent detection of the gas film area 16 and the retaining ring area 15, the device can more accurately detect and regulate the pressure distribution of the polishing head 1 during polishing, thereby optimizing the polishing effect. Specifically, three pressure sensors 6 are uniformly arranged below the second circular cover plate 14 along the circular track of the base 4, for accurately measuring the pressure exerted by the retaining ring 9 on the polishing pad.

[0063] In addition, the thickness of the first circular cover plate 13 is greater than the thickness of the second circular cover plate 14. The difference in thickness is the thickness of a wafer, which is 750 microns in this embodiment. The design of the first circular cover plate 13 simulates the measurement state of placing a wafer on the disc-shaped cover plate 17. Specifically, when measuring the pressure of the gas film area 16, only the first circular cover plate 13 is covered, so that the retaining ring 9 does not indirectly contact the pressure sensor 6 below, at which time the pressure of the gas film area 16 can be measured alone; when measuring the pressure of the retaining ring area 15, only the second circular cover plate 14 is covered, so that the pressure of the retaining ring area 15 can be measured. Therefore, the pressure detection device 2 of this embodiment can detect the polishing pressure of the gas film area 16 and the retaining ring area 15 without placing a wafer, simplifying the operation process and improving the detection efficiency.

[0064] In addition, since the first circular cover plate 13 is protruded at the center of the second circular cover plate 14, it can be embedded with the retaining ring 9 of the polishing head 1 during the pressurization of the polishing head 1, playing a positioning role, and further improving the accuracy of pressure measurement during polishing by ensuring that the polishing head 1 is in the appropriate position.

[0065] Further, in this embodiment, a wafer can not be loaded during measurement. The top surface of the base 4 is a plane, and the thickness of the first circular cover plate 13 of the gas film area 16 is slightly greater than the thickness of the second circular cover plate 14 of the retaining ring area 15. Therefore, the first circular cover plate 13 is protruded upward at the center of the second circular cover plate 14. When measuring the pressure of the gas film area 16, the corresponding annular movable cover plate of the gas film area 16 is covered, so that the retaining ring does not indirectly contact the sensor below the gas film area 16, and the pressure of the gas film area 16 can be measured alone; when measuring the pressure of the retaining ring area 15, only the corresponding cover plate is arranged in the retaining ring area 15, so that the retaining ring pressure can be measured.

[0066] In summary, by adopting the circular cover plate layout and through independent pressure measurement of the gas film area 16 and the retaining ring area 15, the overall detection accuracy of the polishing head 1 on the wafer pressure can be improved, the overall detection performance can be improved, and the polishing pressure can be better adjusted according to the detection results, thereby improving the polishing effect.

[0067] Further, the first circular cover plate 13 can be composed of multiple annular cover plates. As shown, the first circular cover plate 13 includes cover plate one 131, cover plate two 132, cover plate three 133, and cover plate four 134, which can correspond to different annular partitions of the air film area 16 respectively. Each cover plate constituting the first circular cover plate 13 corresponds to a circular track of the base 4 below, and each circular track is uniformly distributed with three sensor reserved slots 7, and the pressure sensor 6 is installed in these reserved slots. Each circular track is divided into three circular arcs by the three sensor reserved slots 7, and each circular arc corresponds to a central angle of 120 degrees, thereby ensuring the uniform distribution of the pressure sensor 6 on the circular track and improving the accuracy of pressure detection. Figure 4 The air film area 16 can be divided into multiple annular partitions along the radial direction, and the polishing head 1 provides different air pressures to different annular partitions of the air film area 16 to adjust the pressure on the wafer, and the pressures between the annular partitions affect and couple with each other. When using the pressure sensor 6 to measure the pressure of the air film area 16, it is difficult to accurately calculate the polishing pressure of each partition of the air film area 16 of different polishing head 1 radii by theoretical derivation or empirical formula due to the mutual influence of the pressures between the partitions (the pressure coupling phenomenon of the polishing head air film area 16 is shown). To solve this problem, the pressure sensor 6 distributed below each cover plate can be used to measure the pressure of different partitions of the air film area 16 respectively.

[0068] Figure 11 Further, the number of cover plates contained in the first circular cover plate 13 and the number of annular partitions of the air film area 16 corresponding to the cover plates can be adjusted according to the demand for measurement accuracy. In the present application, the first circular cover plate 13 is designed to contain four cover plates, which makes the air film area 16 correspondingly divided into four independent areas. By dividing the air film area 16 into four annular partitions, independent monitoring of the pressure of each area can be achieved to ensure accurate pressure data. This fine pressure measurement not only improves the control accuracy of the polishing process, but also provides reliable data support for subsequent polishing process optimization. In addition, dividing the air film area 16 into four areas also helps to save measurement cost. Fewer measurement areas mean that the number of sensors can be reduced, thereby reducing the overall manufacturing and maintenance cost of the equipment and improving measurement efficiency. In summary, the design scheme of four cover plates effectively optimizes the cost investment under the premise of ensuring measurement accuracy, improving the economy and practicality of the polishing head pressure detection equipment 2.

[0069] Further, as shown in the drawings,

[0070] Further, as shown in the drawings, Figure 4 ​As shown, a small gap is provided between adjacent annular cover plates 11. This design ensures that each cover plate is independent during installation and operation, thereby avoiding adverse effects caused by friction or collision. Specifically, the presence of a small gap prevents direct contact between cover plates. When the polishing head 1 exerts pressure or undergoes slight displacement, each cover plate can maintain its independence and will not be affected by the movement or deformation of adjacent cover plates, thereby ensuring measurement accuracy. In addition, these small gaps can also absorb part of the external force, reducing friction and extrusion caused by mechanical vibration, temperature changes or other external interference factors, thereby improving the stability and durability of the device. Maintaining an appropriate gap ensures sufficient independence between cover plates while avoiding the situation where excessive gaps cause cover plates to loosen or become unstable.

[0071] Further, when the pressure of a certain gas film area 16 does not need to be detected, the detection process can be simplified by removing the corresponding annular cover plate 11.

[0072] Figure 5 As shown Figure 4 The perspective view of the embodiment with some annular cover plates removed. As shown Figure 5 Cover plate one 131, cover plate three 133 and cover plate four 134 are removed, exposing the sensor reservation slots 7 below these cover plates. At this time, the base 4 has three sensor reservation slots 7 evenly distributed on each circular track. The advantage of this design is that when the pressure of certain gas film areas 16 does not need to be detected, the corresponding annular cover plates 11 can be removed flexibly, thereby reducing unnecessary interference. This not only simplifies the operation process, but also enhances the flexibility and adaptability of the device. Through this detachable cover plate design, users can quickly adjust the system according to specific detection needs, further improving detection efficiency.

[0073] Figure 6 For Figure 4 The full cross-sectional view of the embodiment with some annular cover plates removed. As shown in Figure 6 In the detection state of the polishing head pressure detection device 2 of the present embodiment, only cover plate two 132 and the second annular cover plate 14 are retained. This configuration is used to detect the pressure of part of the polishing head 1, while reducing unnecessary detection interference. The enlarged view further shows the installation structure of cover plate two 132 and the pressure sensor 6. As can be seen, the bottom of cover plate two 132 is provided with a positioning groove, and the top of the pressure sensor 6 is provided with a positioning boss, which cooperate to ensure accurate installation and stable positioning of cover plate two 132. This precise positioning structure not only facilitates the disassembly and replacement of the cover plate, but also ensures close contact between the cover plate and the sensor during detection, thereby improving the measurement accuracy of the pressure sensor 6.

[0074] With Figure 5Similar, Figure 6 The device structure after removing part of the circular cover plate 11 is also shown. Compared with Figure 5 The difference is that, Figure 6 The internal structure of the cover plate and the pressure sensor 6 is shown in a more detailed cross-sectional view. Through this cross-sectional view, the position of the pressure sensor 6 and its cooperation with the cover plate 132 can be seen more clearly. This design further highlights the flexibility of the circular cover plate layout. Users can choose to retain or remove part of the cover plate according to specific detection needs, in order to conduct pressure detection on specific areas.

[0075] Figure 7 For Figure 1 and Figure 4 The top view of the base of the two embodiments shown. The upper surface of the base 4 is provided with a line reservation slot 8 for arranging the power supply line and / or signal line of the pressure sensor 6. The arrangement of the line reservation slot 8 enables the sensor lead to be arranged safely and neatly on the base 4, avoiding the situation of lead disorder or exposure, thereby improving the reliability and stability of the detection equipment. Specifically, the sensor reservation slot 7 is arranged at the intersection of the line reservation slot 8 and the circular track.

[0076] Specifically, the pressure sensor 6 is installed at a designated position of the base 4, and its power supply line is connected to an external power source through the line reservation slot 8, ensuring that the pressure sensor 6 can continuously obtain power support during operation. At the same time, the signal line of the sensor is also connected to an external data collection device or processor through the line reservation slot 8, in order to transmit pressure data in real time. Such wiring design ensures the neatness of the inside of the equipment, and improves the stability of signal transmission. The width of the line reservation slot 8 can be designed to be suitable for placing the sensor lead stably in the reservation slot, which can prevent the lead from coming out or being damaged.

[0077] In addition, the design of the line reservation slot 8 has high flexibility. One line reservation slot 8 can connect only one sensor reservation slot 7, meeting the wiring needs of a single pressure sensor 6. The line reservation slot 8 can also connect multiple sensor reservation slots 7 in order to accommodate the power supply lines and signal lines of multiple sensors at the same time. This design can improve the space utilization of the line reservation slot 8, and also effectively reduces the number of reservation slots on the base 4, thereby saving the occupied space and processing cost of the equipment.

[0078] Further, as Figure 7 shown, the base 4 is disc-shaped, and the line reservation slots 8 extend radially on the upper surface of the base 4 and converge at the center of the base 4. Each line reservation slot 8 is evenly distributed circumferentially, dividing the upper surface of the base 4 into six equal parts. This design simplifies the wiring structure and reduces line crossings and redundant settings of line reservation slots 8.

[0079] Figure 7Five circular tracks are shown by dotted lines, and each track is evenly distributed with sensor reserved slots 7. The five circular tracks correspond to different cover plate parts, specifically cover plate one 131, cover plate two 132, cover plate three 133, cover plate four 134, and the second circular cover plate 14. This distribution ensures that each sensor can accurately measure the pressure of the corresponding area. The radial extension design of the line reserved slot 8 can effectively simplify the cable path, reducing unnecessary bending and length, thereby improving the efficiency and stability of signal transmission. In addition, the layout of the reserved slot 8 in the six equal parts of the base surface ensures that each partition of the base 4 can be evenly laid with wires, which helps to ensure the structural strength of the base 4.

[0080] Further, the upper surface of the base 4 is provided with three line reserved slots 8 extending through the center of the base 4, and three pressure sensors 6 are arranged on each circular track. The pressure sensors 6 on adjacent circular tracks are connected to different line reserved slots 8. Figure 7 As can be seen from the figure, the pressure sensors 6 on different circular tracks are arranged in a circumferential staggered manner. Specifically, the pressure sensors 6 on adjacent circular tracks are staggered by 60 degrees. Along the radius of the base 4, the circular tracks are divided into first, second, third, fourth, and fifth circular tracks from small to large. Taking the first and second circular tracks as examples, each of the first and second circular tracks is evenly distributed with three pressure sensors 6, and the angle between the adjacent sensors and the center of the base is 120 degrees. At the same time, the pressure sensors 6 on the second circular track are staggered by 60 degrees from the first circular track, so that the pressure sensors 6 on the first, third, and fifth circular tracks are aligned along the radial direction of the base 4, and the pressure sensors 6 on the second and fourth circular tracks are aligned along the radial direction of the base 4. Therefore, the six line reserved slots 8 arranged along the radial direction of the base 4 pass through multiple sensor reserved slots 7 and divide the circular tracks on the base 4 into six equal parts. By designing the line reserved slot 8 to connect multiple sensor reserved slots 7, the number of line reserved slots 8 is further reduced. This not only reduces the complexity of cutting processing required on the base, but also reduces material waste and manufacturing costs.

[0081] Furthermore, the wiring slot 8 has lead-out ports. Specifically, when using a disc-shaped upper cover plate 3, pressure sensors 6 are typically placed in sensor slots 7 located on the same circular track, with these pressure sensors 6 located in three different wiring slots 8. In this case, each wiring slot 8 has a lead-out port leading out of a pressure sensor 6. When the upper cover plate 3 includes multiple annular cover plates 11, each annular cover plate 11 has a corresponding pressure sensor 6 in its circular track below it. In this case, each wiring slot 8 has a lead-out port leading out of multiple sensor power lines and signal lines. By centrally managing the sensor leads, the number of lead-out ports required by the equipment is reduced, the wiring structure of the sensor leads is simplified, and the complexity of the wiring layout is reduced. This design optimizes the wiring path, allowing the power lines and signal lines of multiple pressure sensors 6 located in the same radial wiring slot 8 to be led out through the same lead-out port, improving the neatness of the wiring and the convenience of maintenance.

[0082] Figure 8 for Figure 7 A top view of another embodiment of the base. (See image) Figure 8 As shown, multiple line pre-reserved slots 8 extend parallel to each other on the upper surface of the base 4 and connect to the sensor pre-reserved slot 7. Figure 8 In the illustrated embodiment, except for one line pre-reserved slot 8 located on the horizontal diameter of the base 4 and shared by multiple sensor pre-reserved slots 7, each of the other sensor pre-reserved slots 7 can be connected to external lines through parallel, independent line pre-reserved slots 8. This design avoids interference between wires and improves the stability of signal transmission and measurement accuracy. This makes the polishing head pressure detection device 2 of the present invention more suitable for scenarios with high detection accuracy. Depending on actual operational needs and processing requirements, the number of line pre-reserved slots 8 can be reduced. For example, in an optional embodiment, only three sensors can be set on a single circular trajectory, requiring only three line pre-reserved slots 8 connected to the sensor pre-reserved slots 7 of these three sensors.

[0083] from Figures 1 to 8 As can be seen, the polishing head pressure testing device 2 also includes two radially opposing, back-to-back extended flanges located on the outer periphery of the base 4. This design enhances the stability of the device and provides the necessary structural foundation for mounting the gripping elements 12. Gripping elements 12 are respectively provided on the two extended flanges. Specifically, in this embodiment, the two flanges are symmetrically arranged on both sides of the base 4, with right angles at the edges. The gripping elements 12, fixed to the upper surface of the flanges, are designed as C-shaped handles, with the openings facing the base 4 and both ends securely screwed to the flanges of the base 4 via connecting bosses. The C-shaped handles facilitate the handling and installation of the polishing head pressure testing device 2, and are particularly suitable for applications where the polishing head pressure testing device 2 is heavy or requires frequent movement.

[0084] In addition, the design of the holding element 12 is not limited to the C-shaped handle. According to the needs of different application scenarios, the holding element 12 can adopt other shapes and structures, such as a U-shaped handle, an L-shaped handle, or a similar ring-shaped structure, or even be designed to be suitable for connection with a mechanical hand to improve the comfort and efficiency of device operation. At the same time, the material of the holding element 12 can be selected as metal, plastic, or composite material according to actual needs to ensure its strength and durability. The connection mode of the holding element 12 and the base 4 can also have multiple choices. In addition to the current screw connection mode, the holding element 12 can also be connected with the base 4 through welding, buckle connection, or through a hinge device. These different connection modes can be selected according to the different operating environments of the device. For example, in the case of replacing or dismounting the holding element 12, the buckle type or hinge type design can provide the function of quick assembly and disassembly. In summary, the holding element 12 can improve the overall operability of the device through various structural designs, flexible connection modes, and the selection of different materials, reducing the burden on the operator.

[0085] Further, as shown in Figure 8 The base 4 is disc-shaped, and a plurality of auxiliary positioning holes 5 are provided on the base 4. These auxiliary positioning holes 5 are used to accurately define the outer peripheral position of the upper cover plate 3, so that the upper cover plate 3 is concentric with the base 4 during installation, thereby avoiding the occurrence of deflection and sliding of the upper cover plate 3 during pressure bearing. The auxiliary positioning holes 5 are uniformly distributed on the outermost circle of the upper surface of the base 4. This uniform distribution design ensures the stability of the upper cover plate 3 when the polishing head 1 exerts pressure, and effectively prevents any lateral movement or rotation of the upper cover plate 3 even in the case of uneven stress.

[0086] In order to further improve the positioning accuracy of the upper cover plate 3, a positioning pin can be installed in the auxiliary positioning hole 5, and a corresponding groove is provided at the bottom of the upper cover plate 3. When the upper cover plate 3 is installed with the base 4, the positioning pin is embedded in the groove on the upper cover plate 3, forming a stable hole-pin-groove cooperation structure. This structure improves the installation accuracy of the upper cover plate 3 and enhances the stability of the pressure detection device 2.

[0087] Further, a processing module can be configured in the polishing head pressure detection device 2 for receiving and processing the pressure data detected by the pressure sensor 6. By introducing the processing module, the pressure detection device 2 can perform real-time analysis, processing, and feedback on the pressure information collected by the pressure sensor 6, greatly improving the intelligence and data processing capability of the overall system.

[0088] The polishing head pressure detection device 2 provided by the present application can improve the polishing process through various ways, while ensuring the stability of the device in the polishing operation through the structural design. For example, by adding different distributed pressure sensors 6, the pressure distribution in a larger range can be monitored, and the precision of the polishing process is improved. In addition, by adjusting the connection design between the base 4 and the upper cover plate 3, the durability and measurement accuracy of the device can be further improved.

[0089] The design of the base 4 can be changed in different applications. For example, in a high-precision measurement environment, a shock-absorbing cushion can be added between the base 4 and the polishing turntable to reduce the mutual influence of vibration between them. In the application scenario that needs to be frequently moved, the base can be made of lightweight alloy material to reduce the weight and facilitate the transfer of the device between different stations.

[0090] The sensitivity and response speed of the pressure sensor 6 directly affect the pressure detection effect in the polishing process. In the case of high precision requirement, a pressure sensor 6 with self-calibration function can be used to ensure accurate measurement performance after long time use. In addition, the communication module between the pressure sensor 6 and the processing module can also be improved to realize wireless data transmission, which is convenient for remote monitoring and analysis. In addition to uniformly distributing the pressure sensors 6 on one or more concentric circular tracks, the number and type of sensors can also be flexibly adjusted according to the needs of the polishing process. For polishing processes that require higher resolution, higher sensitivity pressure sensors 6 can be selected and distributed on multiple different circular tracks to achieve independent measurement of the pressure of each region.

[0091] In the embodiment of the present application, there are three pressure sensors 6 on each circular track, and the corresponding sensor reserved slot 7 on each circular track is also at least three. Further, the number of pressure sensors 6 on each circular track can also be two or more. Correspondingly, the distribution and number of sensor reserved slots 7 will also change accordingly. This design improves the flexibility of sensor distribution and meets more polishing processing conditions.

[0092] Figure 9 The flowchart of the polishing head pressure detection method of the polishing head pressure detection device 2 according to the present application is shown. The polishing head pressure detection method relies on the polishing head pressure detection device 2 disclosed by the present application, which can effectively detect the pressure distribution and mechanical properties applied by the polishing head 1 in the working process. The specific steps of the method include the following contents:

[0093] First, the pressure sensors 6 are placed in the sensor reserved slots 7 of the same circular track of the base 4. These pressure sensors 6 can measure the pressure applied by the polishing head 1 in different regions respectively;

[0094] Next, the polishing pressure detection device is placed on the polishing turntable of the polishing device. Optionally, a polishing pad can be pre-placed on the polishing turntable to simulate the actual polishing environment, thereby ensuring that the pressure measured by the detection device of the present application is the same as that in actual processing.

[0095] Next, the upper cover plate 3 is concentrically stacked on the upper surface of the base 4, covering the pressure sensors 6 on the circular track. To ensure accurate positioning of the upper cover plate 3 and the base 4, positioning pins can be used in conjunction with auxiliary positioning holes 5 to limit the position of the outer peripheral edge of the upper cover plate 3, improve the fixing accuracy of the upper cover plate 3, and prevent it from shifting or sliding during testing.

[0096] Next, the polishing head 1 of the polishing device is placed above the upper cover plate 3, and the polishing head 1 is ensured to be concentrically aligned with the upper cover plate 3. This operation is crucial, as only when the polishing head 1 and the upper cover plate 3 are coaxial with the base 4 can the accuracy and consistency of the measurement results be ensured.

[0097] Next, optionally, before formal testing, all pressure sensors 6 need to be zeroed. This step can eliminate environmental interference or errors of the measurement components themselves, ensuring that the subsequent collected data is more accurate.

[0098] Next, the polishing head 1 is pressed down tightly on the upper cover plate 3 to start applying pressure. During this process, the pressure sensors 6 will record the pressure values applied by the polishing head 1 in different areas in real time. The test can be performed multiple cycles as needed to ensure the reliability and representativeness of the data.

[0099] Next, the output results of the pressure sensors 6 are obtained. Based on these output data, the mechanical properties of the polishing head 1, including the pressure distribution of each area, can be analyzed. Through further processing and analysis of the data, the uniformity and stability of the polishing head 1 under pressure and its performance in actual operation can be judged. This provides an important reference for optimizing the polishing process or adjusting the equipment.

[0100] Specifically, to measure the pressure of the polishing head 1, multiple pressure sensors 6 can be arranged on the circular track of one base 4, and the total sum of the pressure values detected by the multiple pressure sensors 6 is taken as the polishing head pressure. These sensors 6 are evenly distributed, and each pressure sensor 6 independently detects the pressure value at its location and calculates the total sum of these pressure values. Further, when measuring the pressure of the polishing head 1, the upper cover plate 3 can be either a disc-shaped cover plate layout or a ring-shaped cover plate layout. When using a ring-shaped cover plate layout, since each circular track below the ring-shaped cover plate 11 is provided with a pressure sensor 6, the polishing head pressure is the total sum of the pressure values of all pressure sensors 6.

[0101] Further, Figure 10The step diagram of the polishing head concentric alignment according to the polishing head pressure detection device 2 and the polishing head pressure detection method of the present application is shown. The judgment of the successful concentric alignment of the polishing head 1 is that the polishing head 1 pressurizes the upper cover plate 3, and if the pressure values measured by the pressure sensors 6 on the same circular track are equal, it is determined that the polishing head 1 is concentric with the circular track and the bottom plate 4, that is, the concentric alignment is completed. In the step of the polishing head concentric alignment, the polishing head pressure detection method is the same as the foregoing method, including: installing the pressure sensors 6, placing the polishing head pressure detection device 2, installing the upper cover plate 3, placing the polishing head 1, zeroing the pressure sensors 6, applying pressure and starting the test, and obtaining the results and analyzing. The specific method details are not repeated. The difference is that after the polishing head 1 presses the upper cover plate 3 and starts to apply pressure, the pressure sensors 6 measure the real-time pressure, and the following needs to compare whether the pressure difference measured by the pressure sensors 6 on the same circular track is within the preset threshold range to determine whether the polishing head 1 is concentrically aligned. When the pressure difference measured by the multiple sensors on the same circular track is determined to be within the preset threshold range, it means that the concentric alignment of the polishing head 1 is successful; if the pressure difference of the multiple sensors on the same circular track is determined to be not within the preset threshold range, it means that the concentric alignment of the polishing head 1 is not successful. The next step needs to reposition the polishing head 1 and perform pressure testing to detect whether the concentric alignment is successful again. If the concentric alignment is not successful all the time, it will continue to circulate until the alignment is successful.

[0102] Figure 11 The pressure coupling phenomenon of the polishing head air film area is shown. The horizontal axis represents the pressure value range of the polishing head edge area, and the pressure of the air film area 16 varies from 0 psi to 7 psi. The vertical axis represents the change of the overall pressure of the polishing head 1 with the change of the pressure of the air film area 16 of the polishing head 1, ranging from 10 kg to 50 kg. There are two curves in the figure, the dotted curve (adjacent area 0 psi) represents the change of the pressure of the air film edge area with the increase of the overall pressure of the polishing head 1 when the pressure of the adjacent area around the air film edge area is 0 psi; the solid line curve (adjacent area 1 psi) represents the change trend of the pressure of the air film edge area with the increase of the overall pressure of the polishing head 1 when the pressure of the adjacent area is 1 psi, and the pressure of the air film edge area is smaller than that under the condition of "adjacent area 0 psi". The picture illustrates that under the same overall pressure of the polishing head 1, the pressure of the adjacent area has a great influence on the pressure of the air film edge area, reflecting the air film pressure coupling phenomenon of the polishing head 1, that is, the pressure of the adjacent area not only affects the pressure of the area, but also affects the pressure of other air film areas 16 through coupling.

[0103] Further, the upper cover plate 3 can include circular cover plates 11, and a plurality of pressure sensors 6 are arranged on each single circular track covered by each circular cover plate 11. The sum of pressure values detected by the plurality of pressure sensors 6 under each circular cover plate 11 is taken as the pressure of the corresponding gas film area 16 of the polishing head 1, so as to realize decoupling of the pressure measurement of the gas film area 16. Specifically, in the embodiment, the gas film area 16 is divided into independent annular subareas corresponding to cover plate one 131, cover plate two 132, cover plate three 133, and cover plate four 134, respectively. The pressure sensors 6 distributed on each circular track only measure the pressure of the subarea where they are located, so as to realize decoupling of the pressure measurement of the gas film area 16. The decoupling effect ensures that the pressure measurements of different gas film areas 16 do not affect each other, so that the pressure data of each area is more accurate and reliable. In the case where the pressure of a certain area is not concerned, the circular cover plate 11 corresponding to the area can be removed during detection, so that the measurement is more flexible.

[0104] The application also provides a polishing device for wafer processing, mainly used for improving the flatness and smoothness of the wafer surface. In the embodiment, the polishing device includes a polishing turntable, a polishing head 1, a trimmer, the polishing head pressure detection device 2 of the application, a controller, and a moving assembly.

[0105] The polishing turntable is the core part of the polishing device, responsible for supporting and rotating the wafer. Through accurate control of the turntable, uniform polishing effect can be achieved. Moreover, the upper surface of the polishing turntable is provided with a polishing pad for polishing the wafer. The polishing head 1 directly contacts the end face of the other side of the wafer surface to be polished, presses the wafer against the polishing pad, and rotates the wafer, so that the wafer completes polishing in rotation. During the working process, the pressure adjustment of the polishing head 1 is a key factor to ensure the polishing quality. The polishing head pressure detection device 2 in the application is specially used for detecting the pressure applied by the polishing head 1 to the wafer. Through accurate measurement of the pressure, the polishing head pressure in the actual polishing process can be measured. The controller is used for controlling the moving assembly to move the polishing head pressure detection device 2 of the application to or away from the polishing turntable. The moving assembly can quickly and accurately position the detection device to the required position, so as to realize efficient polishing head pressure detection and mode switching operation of wafer polishing. The polishing device for wafer processing of the application can automatically measure and calibrate the polishing head pressure through the cooperative work of each component, so as to meet more diverse polishing process requirements and improve the processing and measurement efficiency.

[0106] The polishing head pressure detection device 2, the method, and the polishing device for wafer processing of the application have wide application value for the improvement of wafer polishing process.

[0107] The polishing head pressure detection device 2 of the present application can measure the pressure of the retaining ring and the different annular areas of the air film 10 on the polishing pad under different pressures applied by the polishing head 1. This function can be used to verify the simulation results of the pressure applied by the polishing head and establish relevant data tables. These data tables can provide a reference basis for establishing simulation models such as the physical model of the polishing head pressure and the selection of polishing process parameters and other actual operations. Users can quickly obtain the actual pressure values of the retaining ring and the different annular areas of the air film 10 on the polishing pad under specific pressure conditions by looking up the table, thereby improving the accuracy of the simulation model and the reliability of the process parameter table.

[0108] The polishing head pressure detection device 2 of the present application can also be used for preliminary experiments to obtain the safety factor of the device operation related to the retaining ring pressure and the air film pressure. For example, when performing wafer slip testing, the retaining ring pressure and the air film pressure under the condition that the wafer does not slip can be measured, and the relevant safety factor can be calculated. Using the measured pressure of the retaining ring and the air film 10 on the polishing pad in this application, the user can calculate the actual safety factor under the current polishing head pressure condition. If the actual safety factor is higher than the previously measured safety factor, it indicates that the device can operate safely under this pressure condition; otherwise, the pressure condition of the polishing head 1 needs to be adjusted to ensure safe operation.

[0109] In addition to the above uses, the measurement technology of the present application can also be extended to other related fields, such as optimizing the polishing process, improving the efficiency of material use, and prolonging the service life of the device. Through precise control of the retaining ring and air film pressure, unnecessary material wear can be reduced during the polishing process, while the consistency and yield of the product can be improved. In addition, this technical solution also accumulates process data for further equipment and process upgrades, enabling researchers to make more accurate designs and adjustments.

[0110] The above embodiments are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the patent protection scope of the embodiments of the present application should be defined by the claims.

Claims

1. A polishing head pressure detection apparatus characterized by comprising: The polishing head pressure detection device comprises: a base adapted to be placed on a polishing turntable of a polishing equipment with its bottom surface, an upper surface of the base is provided with sensor reserved slots uniformly distributed on one circular track or multiple concentric circular tracks, the sensor reserved slots are used for placing pressure sensors; and an upper cover plate stacked on the upper surface of the base and adapted to press the pressure sensors uniformly distributed on at least one circular track; the polishing head pressure detection device is configured to detect the pressure of the polishing head via the pressure sensors when the polishing head of the polishing equipment presses the upper cover plate; the upper cover plate comprises a circular ring-shaped cover plate capable of covering the sensor reserved slots on a single circular track; the circular ring-shaped cover plate comprises a first circular ring-shaped cover plate adapted to the air film area of the polishing head and a second circular ring-shaped cover plate adapted to the retaining ring area of the polishing head, the thickness of the first circular ring-shaped cover plate is greater than the thickness of the second circular ring-shaped cover plate, and the difference in thickness is the thickness of a wafer; when measuring the pressure of the air film area, only the first circular ring-shaped cover plate is covered to separately measure the pressure of the air film area; when measuring the pressure of the retaining ring area, only the second circular ring-shaped cover plate is covered to separately measure the pressure of the retaining ring area; the first circular ring-shaped cover plate is composed of multiple ring-shaped cover plates, gaps are formed between adjacent circular ring-shaped cover plates, the air film area is divided into independent ring-shaped sub-areas corresponding to the multiple ring-shaped cover plates respectively, and the pressure sensors distributed on each circular track only measure the pressure of the sub-area where they are located, so as to realize decoupling of air film area pressure measurement.

2. The polishing head pressure detection apparatus according to claim 1, wherein The upper surface of the base is provided with a line reserved slot for arranging power lines and / or signal lines of the pressure sensors, and the sensor reserved slot is arranged at the intersection of the line reserved slot and the circular track.

3. The polishing head pressure detection apparatus of claim 2, wherein The base is disc-shaped, the line reserved slot extends radially on the upper surface of the base, and the line reserved slot uniformly divides the upper surface of the base circumferentially.

4. The polishing head pressure detection apparatus of claim 3, wherein The upper surface of the base is provided with three line reserved slots extending through the center of the base, three pressure sensors are arranged on each circular track, and the pressure sensors on different circular tracks are arranged circumferentially staggered.

5. The polishing head pressure detection apparatus of claim 3, wherein The line reserved slot has an outlet port.

6. The polishing head pressure detection apparatus of claim 2, wherein Multiple line reserved slots extend parallel to each other on the upper surface of the base.

7. The polishing head pressure detection apparatus of claim 1, wherein The bottom surface of the base is a flat surface.

8. The polishing head pressure detection apparatus of claim 1, wherein The polishing head pressure detection device further comprises two radially outwardly extending flanges opposite to the convex, and a holding element is arranged on each of the extending flanges.

9. The polishing head pressure detection apparatus of claim 1, wherein The base is disc-shaped, a plurality of auxiliary positioning holes are arranged on the base, and the auxiliary positioning holes are used to define the position of the outer periphery of the upper cover plate, so that the upper cover plate is concentric with the base.

10. The polishing head pressure detection apparatus according to any one of claims 1 to 9, wherein The polishing head pressure detection device is configured with a processing module for receiving and processing pressure data detected by the pressure sensors.

11. A method for polishing head pressure detection using the polishing head pressure detection device according to any one of the preceding claims 1 to 10.

12. The method of claim 11, wherein, The method comprises the following steps: placing pressure sensors in the sensor reserved slots on the same circular track; placing the polishing head pressure detection device on a polishing turntable of a polishing equipment; The upper cover plate is arranged concentrically on the upper surface of the base and covers the pressure sensors of the same circular track; The upper cover plate is pressed by a polishing head of the polishing equipment; And The output of the pressure sensors is obtained and the mechanical properties of the polishing head are determined according to the output.

13. The method of claim 12, wherein, The method comprises a step of concentric alignment of the polishing head, in which the polishing head is pressurized, and if the output pressure difference of the pressure sensors on the same circular track is within a preset threshold, it is determined that the polishing head is concentrically aligned.

14. The method of claim 12 or 13, wherein, A plurality of pressure sensors are arranged on only one of the circular tracks, and the pressure values detected by the plurality of pressure sensors are summed up as the polishing head pressure.

15. The method of claim 12 or 13, wherein, The upper cover plate comprises a circular ring cover plate, and a plurality of pressure sensors are arranged on each of the circular ring cover plates covering a single circular track, and the sum of the pressure values detected by the plurality of pressure sensors under each of the circular ring cover plates is the pressure of the corresponding gas film area of the polishing head, thereby realizing decoupling of pressure measurement of different gas film areas.

16. A polishing apparatus for wafer processing, characterized by comprising: The polishing equipment comprises a polishing turntable, a polishing head, a dresser, a polishing head pressure detection device according to any one of claims 1 to 9, a controller, and a moving assembly, wherein the controller controls the moving assembly to move the polishing head pressure detection device to or away from the polishing turntable.

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