A heat dissipation structure

Abstract

The application discloses a heat dissipation structure, which comprises a heated part and a heat dissipation base body; in a first direction, one end of the heat dissipation base body is formed with a condensing end of a phase change cooling device, and the other end is formed with a cooling end of a pulsating heat channel device; the heated part is located between the condensing end and the cooling end, and the evaporation end of the phase change cooling device and the heating end of the pulsating heat channel device can be directly and / or indirectly heated from the heated part. Since the heat transfer of the pulsating heat channel device is not affected by gravity, the heat can be transferred downward, that is, in a direction away from the heated part, and the heat can be transferred to the cooling end in a direction away from the phase change cooling device. Therefore, in the first direction, the phase change cooling device and the pulsating heat channel device can transfer the heat away from the heated part in the middle part, so that the heat can be dispersed in a better way in the first direction, and the problem of low heat dissipation efficiency can be effectively solved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more specifically, to a heat dissipation structure. Background Technology

[0002] In practical applications, when the bottom cavity of a heat dissipation structure cannot achieve ultra-high equivalent thermal conductivity through phase change, its thermal resistance will be greater than that of a solid metal fin of the same volume, failing to achieve temperature uniformity. The larger the internal cavity volume of the phase change fin, the greater the amount of working fluid required, and the more difficult the fin manufacturing process becomes. Therefore, in actual production, solid metal fins are directly used below the heat source, resulting in relatively low heat dissipation efficiency.

[0003] In the process of realizing this invention, the inventors discovered that at least the following problems exist in the prior art: heat dissipation structure can effectively solve the problem of low heat dissipation efficiency. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a heat dissipation structure that can effectively solve the problem of low heat dissipation efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A heat dissipation structure includes a heat-receiving part and a heat dissipation substrate; in a first direction, one end of the heat dissipation substrate forms a condensation end of a phase change cooling device, and the other end forms a cooling end of a pulsating heat channel device; the heat-receiving part is located between the condensation end and the cooling end, and both the evaporation end of the phase change cooling device and the heating end of the pulsating heat channel device can be directly and / or indirectly heated from the heat-receiving part.

[0007] When applying the heat dissipation structure, the first direction can be vertical, meaning the condenser end of the phase change cooling device and the cooling end of the pulsating heat channel device are arranged side-by-side, with the condenser end of the phase change cooling device above the cooling end of the pulsating heat channel device. The heat source is then placed against the heated part, allowing heat to be transferred to the heated part, which in turn transfers heat to the evaporator end of the phase change cooling device and the heating end of the pulsating heat channel device. The heat transferred to the evaporator end of the phase change cooling device is absorbed by the liquid phase change medium, forming a gaseous phase change medium that flows away from the heated part, i.e., away from the pulsating heat channel device, flowing to the condenser end to dissipate the heat. Similarly, the heat transferred to the pulsating heat channel device is absorbed by the fluid inside the heating end. Since heat transfer in the pulsating heat channel device is not affected by gravity, heat can be transferred downwards, i.e., away from the heated part and away from the phase change cooling device, to the cooling end. In the first direction, after the phase change cooling device and the pulsating heat channel device introduce heat from the heated part in the middle, they can transfer heat in the direction away from the phase change, so that the heat dissipation effect is better in the first direction. Therefore, this heat dissipation structure can effectively solve the problem of low heat dissipation efficiency.

[0008] In some technical solutions, the heated part is located at the middle of the heat dissipation substrate in the first direction.

[0009] In some technical solutions, the pulsating heat channel device has a plate-like structure and extends away from the phase change cooling device.

[0010] In some technical solutions, the heat dissipation substrate is plate-shaped, and the thickness direction of the plate is perpendicular to the first direction.

[0011] In some technical solutions, a protrusion is formed on one side of the heat dissipation substrate in the second direction, and the protrusion is connected to the heated part. The second direction is perpendicular to both the first direction and the plate thickness direction.

[0012] In some technical solutions, the heat dissipation substrate includes an upper working chamber and a lower working chamber. The lower working chamber forms a channel cavity, which is filled with a working fluid to form the pulsating heat channel device. The upper working chamber is filled with the liquid phase change medium of the phase change cooling device, and the upper part of the upper working chamber is a gaseous cavity to serve as the condensation end of the phase change cooling device.

[0013] In some technical solutions, the cavity of the heated part forms the evaporation end of the phase change cooling device, the inside of the protrusion forms a protruding cavity, and the cavity of the heated part is connected to the upper working chamber through the protruding cavity; the liquid phase change medium of the phase change cooling device has a liquid level in the protruding cavity that is lower than the upper sidewall of the protruding cavity.

[0014] In some technical solutions, the heat dissipation substrate includes a base plate and a cover plate arranged side by side along the thickness direction of the plate, and an upper working cavity and a lower working cavity are formed between the base plate and the cover plate.

[0015] In some technical solutions, the upper working cavity has multiple support columns arranged in an array.

[0016] In some technical solutions, multiple heat dissipation substrates are included, each of which is arranged in parallel along the thickness direction of the plate, and all of the multiple heat dissipation substrates are connected to the same cavity of the heat receiving part. One end of the heat receiving part is connected to the heat dissipation substrate, and the other end forms a heat receiving surface.

[0017] In some technical solutions, the pulsating hot channel device includes a first curved channel segment and a second curved channel segment arranged side by side, both of which repeatedly bend up and down and extend along the second direction, and the two ends of the first curved channel segment and the second curved channel segment are connected.

[0018] In some technical solutions, the pulsating hot channel device includes a third curved channel segment and a fourth curved channel segment arranged side by side along the second direction. The third curved channel segment and the fourth curved channel segment are repeatedly bent along the second direction and extended along the first direction. The two ends of the third curved channel segment and the fourth curved channel segment are connected. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the internal structure of a heat dissipation structure provided in an embodiment of the present invention;

[0021] Figure 2 This is an exploded structural diagram of a heat dissipation substrate provided in an embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram of a heat dissipation structure provided in an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the working structure of the vertical tube heat dissipation structure provided in an embodiment of the present invention;

[0024] Figure 5This is a partial working schematic diagram of the vertical tube-type pulsating heat channel device provided in an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of the internal structure of the horizontal tube heat dissipation structure provided in an embodiment of the present invention;

[0026] Figure 7 This is a partial working schematic diagram of the horizontal tube-type pulsating hot channel device provided in an embodiment of the present invention.

[0027] The following labels are shown in the attached diagram:

[0028] 1. Heat dissipation base; 2. Heating part; 3. Heat source; 4. Cover plate; 5. Upper working chamber; 6. Liquid phase change medium; 7. Gas phase change medium; 8. Condensation end; 9. Support column; 10. Heating end; 11. Pulsating heat channel device; 12. Liquid column; 13. Steam movement direction; 14. Liquid column movement direction; 15. Working medium filling port; 16. Protruding cavity; 17. Bottom plate; 18. Channel cavity; 19. Cooling end; 20. Protrusion; 21. Evaporation end; 22. First curved channel section; 23. Second curved channel section; 24. Vertical pipe section; 25. U-shaped section; 26. Third curved channel section; 27. Fourth curved channel section; 28. Horizontal pipe section; 29. ​​Phase change cooling device.

[0029] Where Z is one of the first directions, pointing upwards;

[0030] Where X is one of the directions in the second direction;

[0031] The Y direction is one of the directions in which the plate thickness is measured. Detailed Implementation

[0032] This invention discloses a heat dissipation structure that can effectively solve the problem of low heat dissipation efficiency.

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see Figures 1-7 , Figure 1 This is a schematic diagram of the internal structure of a heat dissipation structure provided in an embodiment of the present invention; Figure 2 This is an exploded structural diagram of a heat dissipation substrate provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of a heat dissipation structure provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the working structure of the vertical tube heat dissipation structure provided in an embodiment of the present invention; Figure 5This is a partial working schematic diagram of the vertical tube-type pulsating heat channel device provided in an embodiment of the present invention; Figure 6 A schematic diagram of the internal structure of the horizontal tube heat dissipation structure provided in an embodiment of the present invention; Figure 7 This is a partial working schematic diagram of the horizontal tube-type pulsating hot channel device provided in an embodiment of the present invention.

[0035] In some embodiments, this embodiment provides a heat dissipation structure, which can be called a thermosiphon heat dissipation structure, and is generally a thermosiphon radiator fin.

[0036] The heat dissipation structure mainly includes a heat dissipation substrate 1, which is mainly used to stabilize the various structures and can participate in the formation of the phase change cooling device 29 and / or the pulsating heat channel device 11. "Participating in the formation" means that a portion of its own structure is part or all of the structure of the phase change cooling device 29, in which case it can be combined to form the cavity required by the phase change cooling device 29; similarly, a portion of its own structure is part or all of the structure of the pulsating heat channel device 11, such as when it is combined to form the channel portion of the pulsating heat channel device 11.

[0037] The heated portion 2 is positioned to be in contact with the heat source 3 to draw heat from it. Generally, the heat dissipation substrate 1 can also conduct heat, allowing the heat from the heated portion 2 to be transferred through the heat dissipation substrate 1 to the working fluid of the phase change cooling device and the working fluid of the pulsating heat channel device 11. Simultaneously, it facilitates the transfer of heat from the working fluid to the external environment. The heated portion 2 can be integrally formed with the heat dissipation substrate 1, i.e., a single-piece structure, meaning the heated portion 2 is directly formed on the structural component where the heat dissipation substrate 1 is located; alternatively, it can be a separate structure, as shown in the attached diagram, which employs a separate structure.

[0038] To facilitate the explanation of the positional relationship between the various structures, a direction is defined as the first direction. In application, the first direction is generally the up-down direction, which can be set to tilt up-down or vertically.

[0039] In the first direction, one end of the heat dissipation substrate 1 forms the condensation end 8 of the phase change cooling device 29, and the other end forms the heating end 10 of the pulsating heat channel device 11. The aforementioned one end and the other end can be divided from the middle, and they can be arranged adjacently or non-adjacently in the first direction; as shown in the attached figure, they are both arranged adjacently. The phase change cooling device 29 can also be called a cavity-type phase change cooling device 29, which mainly works by evaporating the working fluid to form a gas, which flows into the condensation chamber, condenses into a liquid, and then flows back, absorbing heat again, thus forming a reciprocating cycle. Unlike the phase change cooling device 29, the working fluid of the pulsating heat channel device 11 mainly forms a liquid column 12.

[0040] The phase change cooling device 29 mainly includes an evaporation end 21 and a condensation end 8, which are connected to each other. The evaporation end 21 is heated, causing the liquid phase change medium 6 inside to evaporate and form a gaseous phase change medium 7. The gaseous phase change medium 7 flows to the condensation end 8 under the action of gas pressure, where it releases heat and liquefies into the liquid phase change medium 6. The formed liquid phase change medium 6 falls to the bottom under the action of gravity and then returns to the cavity of the evaporation end 21. It should be noted that the return of the liquid phase change medium 6 in the cavity of the condensation end 8 to the cavity of the evaporation end 21 can be achieved by gravity or by capillary force of the capillary structure.

[0041] The pulsating heat channel device 11, specifically, can be a pulsating heat pipe. The pulsating heat channel device 11 generally forms an elongated channel containing a liquid working medium forming a liquid column 12. A gaseous space (containing the evaporated gas from the liquid in the liquid column) is formed between adjacent liquid working medium columns 12. The gaseous spaces at both ends of the liquid column 12 are isolated from each other, and the liquid column and gaseous space are arranged alternately. When the liquid column 12 moves to the heating end 10, the liquid working medium undergoes a phase change to produce steam, increasing the vapor pressure there. When the gaseous space moves to the heating end 10, it expands due to heat, increasing the vapor pressure there as well. The movement of the pulsating heat pipe, i.e., the pulsating heat pipe part, is driven by vapor pressure.

[0042] It should be noted that the elongated channel of the pulsating heat channel device 11 can be a tube structure or a long elongated channel formed on a block. A common type of pulsating heat channel device 11 has a very small tube diameter (generally 0.5-3 mm inner diameter). It is made of a metal capillary tube bent into a serpentine structure, with the tube cavity of the metal capillary tube forming the aforementioned elongated channel. One end of the bend is the heating end 10, and the other end is the cooling end 19. An insulating section can be arranged in the middle as needed. The interior is evacuated to a vacuum and then filled with a portion of the working fluid. Under the action of surface tension, the working fluid forms liquid columns and gas plugs of varying lengths inside the tube. The working fluid is generally water, methanol, ethanol, Freon, etc. It can generally be divided into two structures: open loop and closed loop.

[0043] In the pulsating heat channel device 11, at the heating end 10, the working fluid absorbs heat to generate bubbles, which rapidly expand and increase in pressure, propelling the working fluid towards the cooling end 19. There, the bubbles cool, contract, and burst, causing a pressure drop. Due to the pressure difference between the two ends and the pressure imbalance between adjacent channels, the working fluid oscillates and flows between the heating end 10 and the cooling end 19, thereby achieving heat transfer. Throughout this process, no external mechanical or electrical work is required; it is entirely a self-oscillating process driven by heat.

[0044] It should also be noted that the evaporation process of the pulsating heat pipe section occurs near the heating end 10. Once it moves away from the heating end 10, the outer surface (fins) acts as the condenser end for heat dissipation, and partial condensation occurs at this point. Therefore, the evaporation end and condensation end here are relative concepts, and there is no strict distinction between evaporation and condensation; it simply means that evaporation and condensation occur at both ends of the whole system.

[0045] One end of the heat dissipation substrate 1 forms the condensation end 8 of the phase change cooling device 29, mainly including the following three situations: First, a local structure of the heat dissipation substrate 1 constitutes the condensation end 8 of the phase change cooling device 29; second, a local structure of the heat dissipation substrate 1 and other structures constitute the condensation end 8 of the phase change cooling device 29; third, other structures individually constitute the condensation end 8 of the phase change cooling device 29, but are located in the corresponding end structure of the heat dissipation substrate 1. As shown in the attached figure, the upper structure and partition of the heat dissipation substrate 1 constitute the chamber of the phase change cooling device 29, and the chamber is filled with liquid phase change medium 6, which is in an incomplete state. Through the above example analysis, the fact that one end of the heat dissipation substrate 1 forms the condensation end 8 of the phase change cooling device 29 does not mean that this end is entirely the condensation end 8 of the phase change cooling device 29. In the attached figure, the entire upper structure is part of the phase change cooling device 29. The evaporation end 21 of the phase change cooling device 29 can be located in the heat dissipation substrate 1, such as in the middle of the heat dissipation substrate 1, in which case the heat from the heated part 2 can be transferred to the internal evaporation end 21 through the heat dissipation substrate 1; or it can be directly installed at the heated part 2.

[0046] In some embodiments, a pulsating heat channel device 11 is formed at the other end of the heat dissipation substrate 1, mainly including the following three cases: First, a local structure of the heat dissipation substrate 1 constitutes the pulsating heat channel device 11; second, a local structure of the heat dissipation substrate 1 and other structures constitute the pulsating heat channel device 11; third, other structures constitute the pulsating heat channel device 11 independently, but are disposed in the corresponding end structure of the heat dissipation substrate 1. As shown in the figure, the heat dissipation substrate 1 forms the channel structure of the pulsating heat channel device 11.

[0047] In some embodiments, a condensation end 8 of a phase change cooling device 29 is formed at one end of the heat dissipation substrate 1, and a cooling end 19 of a pulsating heat channel device 11 is formed at the other end, such that the condensation end 8 of the pulsating heat channel device 11 and the cooling end 19 of the phase change cooling device 29 are arranged side by side in a first direction, and the heated part 2 is located between the condensation end 8 and the cooling end 19, so that the heat of the heated part 2 can be transferred in both directions along the first direction, that is, in the up and down direction to both ends.

[0048] In some embodiments, the evaporation end 21 of the phase change cooling device 29 can be heated from the heating part 2, and the heating end 10 of the pulsating heat channel device 11 can be heated from the heating part 2, either directly or indirectly. After the heating part 2 is heated, the heat can be transferred to the evaporation end 21 of the phase change cooling device 29. In the phase change cooling device 29, the liquid phase change medium 6 in the evaporation end 21 vaporizes and flows away from the heating part 2, that is, away from the pulsating heat channel device 11, flowing towards the condensation end 8 at one end of the heat dissipation substrate 1, then releasing heat, liquefying again, and then flowing back to form a cycle. Similarly, after the heating part 2 is heated, heat will also be directly and / or indirectly transferred to the pulsating heat channel device 11. After the heating end 10 of the pulsating heat channel device 11 is heated, it will transfer heat away from the heating part 2, that is, away from the phase change cooling device 29, that is, to the other end of the heat dissipation substrate 1. Even if both the phase change cooling device 29 and the pulsating heat channel device 11 are heated from the heated part 2, the heat is then transferred away in directions away from each other. This ensures sufficient heat dissipation in the first direction. However, it should be noted that, taking the pulsating heat channel device 11 as an example, it can be heated directly from the heated part 2 or indirectly. Indirect heating methods include absorbing heat from the liquid phase change working fluid of the phase change cooling device 29. Of course, it is also possible to absorb heat both directly and indirectly at the same time.

[0049] In some embodiments, when applying the heat dissipation structure, the first direction can be vertical, that is, the condensing end 8 of the phase change cooling device 29 and the cooling end 19 of the pulsating heat channel device 11 are arranged vertically side by side, with the condensing end 8 of the phase change cooling device 29 above the cooling end 19 of the pulsating heat channel device 11. Then, the heat source 3 is placed against the heated part 2 so that the heat from the heat source 3 can be transferred to the heated part 2, and the heat from the heated part 2 can be transferred to the evaporating end 21 of the phase change cooling device 29, and also to the heating end 10 of the pulsating heat channel device 11. The heat transferred to the evaporating end 21 of the phase change cooling device 29 is absorbed by the liquid phase change medium 6, forming a gaseous phase change medium 7 that flows away from the heated part 2, that is, away from the pulsating heat channel device 11, flowing to the condensing end 8 to transfer the heat away. Similarly, the heat transferred to the pulsating heat channel device 11 is absorbed by the fluid inside the heating end 10. Since the heat transfer of the pulsating heat channel device 11 is not affected by gravity, heat can be transferred downwards, that is, in a direction away from the heated part 2 and in a direction away from the phase change cooling device 29, to the cooling end 19. This allows the phase change cooling device 29 and the pulsating heat channel device 11 to transfer heat in directions away from each other after the heat is introduced from the heated part 2 in the middle in the first direction, resulting in better heat dispersion in the first direction. Therefore, this heat dissipation structure can effectively solve the problem of low heat dissipation efficiency.

[0050] In some embodiments, the heated portion 2 is disposed in the middle of the heat dissipation base 1 in the first direction. In application, the heated portion 2 is located in the middle of the heat dissipation base 1 in the vertical direction. It should be noted that it is not required that the entire middle position of the heat dissipation base 1 in the vertical direction is the heated portion 2, that is, the heated portion 2 is provided in all four directions perpendicular to the first direction to be connected to the heat source 3; or, as shown in the figure, only a portion is the heated portion 2.

[0051] In some embodiments, the evaporation end 21 of the phase change cooling device 29 and the heating end 10 of the pulsating heat channel device 11 may also coincide in the first direction, so that the size in the first direction can be effectively controlled. Furthermore, the evaporation end 21 of the phase change cooling device 29 may be lower than the heating end 10 of the pulsating heat channel device 11, so as to further compress the spatial size.

[0052] In some embodiments, to achieve a larger heat dissipation surface area, the pulsating heat channel device 11 can be shaped like a plate and extend away from the phase change cooling device 29. Specifically, the thickness direction of the plate-like structure is perpendicular to the first direction mentioned above, allowing it to extend away from the phase change cooling device 29. In practice, the channels of the pulsating heat channel device 11 are curved back and forth to form a plate-like structure. It should be noted that the plate-like structure refers to a structure with dimensions in three directions, one of which is significantly smaller than the dimensions in the other two directions, generally not exceeding one-third of the dimensions in the other two directions. The heat dissipation area of ​​the plate-like structure is larger than that of the block-shaped structure.

[0053] In some embodiments, the pulsating heat channel device 11 can be formed by bending a pipe back and forth in a plane to create a plate-like structure, where the thickness of the plate-like structure is equal to the diameter of the heat pipe. Alternatively, the thickness of the plate-like structure can be more than twice the diameter of the heat pipe. In this case, the channel of the pulsating heat channel device 11 can extend in the thickness direction of the plate; or it can be formed by stacking two smaller plate-like structures formed by the pulsating heat channel device 11 in the thickness direction.

[0054] In some embodiments, the heat dissipation substrate 1 can be plate-shaped, with the thickness direction perpendicular to the first direction. Preferably, the thickness direction of the heat dissipation substrate 1 is consistent with the thickness direction of the plate-shaped structure formed by the pulsating heat channel device 11. It should be noted that the thickness direction in the context refers to the thickness direction of the heat dissipation substrate 1. If the heat dissipation substrate 1 is plate-shaped, then the dimension of the heat dissipation substrate 1 in the thickness direction is much smaller than the dimensions in the other two dimensions. Therefore, the heat dissipation substrate 1 can also be called a finned structure, and thus the heat dissipation structure can be called a heat dissipation fin; specifically, the heat dissipation structure can be called a thermosiphon radiator fin.

[0055] In some embodiments, to facilitate a better description of the local structure, a second direction can be introduced. This second direction is perpendicular to both the first direction and the plate thickness direction. Thus, the first direction, the second direction, and the plate thickness direction constitute three dimensional directions. It should be noted that, as described above, the phase change cooling device 29 and the pulsating heat channel device 11 are arranged side-by-side in the first direction, but this is not strictly required. Approximately side-by-side arrangement in the first direction is sufficient to meet the objective. Similarly, the directional relationship of other structures is not strictly required; the description should be based on the objective.

[0056] In the second direction, a protrusion 20 is formed on one side of the heat dissipation base 1, and the protrusion 20 connects to the heat receiving part 2. This connection facilitates the installation of the heat receiving part 2 and the heat source 3. The protrusion 20 on one side of the heat dissipation base 1 should be at least on one side. Specifically, if the first side of the heat dissipation base 1 in the second direction has a protrusion 20, and this protrusion 20 is located in the middle of the first side, it can be considered as the middle position of the first side in the first direction. The bottom of the protrusion 20 is connected to the main body of the heat dissipation base 1. That is, the heat dissipation base 1 includes the main body and the protrusion 20, and the protrusion 20 is located on one side of the main body in the second direction, and in the middle of that side, i.e., the middle position in the first direction. The protrusion 20 and the main body are only roughly divided into two parts, and do not mean that they are two independent structures. The protrusion 20 on one side of the heat dissipation base 1 corresponds to the heat receiving part 2 being located on one side of the heat dissipation base 1 in the second direction, but in the middle position in the first direction.

[0057] In some embodiments, the heat dissipation substrate 1 may form an inner cavity, primarily the main body portion, and the inner cavity of the heat dissipation substrate 1 includes an upper working cavity 5 and a lower working cavity. The upper working cavity 5 and the lower working cavity are separated along a first direction.

[0058] The pulsating heat channel device 11 is formed in the lower working chamber. A heat pipe structure can be partitioned within the lower working chamber, or a separate pipe structure can be installed and placed within the lower working chamber. The upper part of the pulsating heat channel device 11 forms the heating end 10, and the lower part forms the condensing end 8. Specifically, the lower working chamber can form a channel cavity 18, which is filled with a working fluid to form the pulsating heat channel device 11.

[0059] The upper working chamber 5 is filled with the phase change medium of the phase change cooling device 29, and the upper part or all of the upper working chamber 5 constitutes the condensation end 8 of the phase change cooling device 29. At least the upper part of the upper working chamber 5 is a gaseous cavity used to store the evaporated gaseous phase change medium 7, so as to serve as the condensation end 8 of the phase change cooling device 29.

[0060] In some embodiments, the lower part of the upper working chamber 5 may form the evaporation end 21 of the phase change cooling device 29.

[0061] In some embodiments, in order to achieve a better evaporation effect, the cavity of the heated part 2 forms the evaporation end 21 of the phase change cooling device 29. The cavity of the heated part 2 is connected to the upper working chamber 5, and at least to the gaseous cavity portion of the upper working chamber 5, so that the gaseous phase change medium 7 evaporated in the cavity of the heated part 2 can enter the upper part of the upper working chamber 5 to release heat and form a liquid phase change medium.

[0062] When the aforementioned protrusion 20 is provided, the protrusion cavity 16 can be formed inside the protrusion 20, and the cavity of the heated part 2 and the upper working cavity 5 are connected through the protrusion cavity 16; the liquid phase change medium 6 of the phase change cooling device 29 has a liquid level lower than the upper sidewall of the protrusion cavity 16 in the protrusion cavity 16 to retain a gas passage. Specifically, the upper cavity wall of the protrusion cavity 16 and the upper cavity wall of the heated part 2 can both be higher than the liquid level of the liquid phase change medium 6 of the phase change cooling device 29.

[0063] In some embodiments, the lower cavity wall of the protruding cavity 16 and the lower cavity wall of the upper working cavity 5 can be set at the same height, while the lower cavity wall of the heated part 2 is lower than the lower cavity wall of the protruding cavity 16 and lower than the lower cavity wall of the upper working cavity 5, so that the heated part 2 has sufficient liquid phase change medium 6.

[0064] In some embodiments, since the bottom of the upper working chamber 5 has a liquid phase change medium 6, and the protruding cavity 16, the cavity of the heated part 2, and the liquid in the upper working chamber 5 are interconnected, the upper heating end 10 of the pulsating heat channel device 11 can obtain heat from the liquid phase change medium 6 at the bottom of the upper working chamber 5. Similarly, the liquid phase change medium 6 at the bottom of the upper working chamber 5 can also be evaporated to form a gaseous phase change medium 7.

[0065] In some embodiments, a plurality of heat dissipation substrates 1 may be included, which are arranged in parallel along the thickness direction of the plate, and all of the plurality of heat dissipation substrates 1 are connected to the same heating part 2, so that the gas inside the evaporation cavity can be evenly dispersed into the upper working cavity 5 of each heat dissipation substrate 1. One end of the heating part 2 is connected to the heat dissipation substrate 1, and the other end forms a heating surface to be in contact with the heat source 3.

[0066] In some embodiments, the structure of the pulsating heat channel device 11 may refer to the prior art or may be configured as needed.

[0067] In some embodiments, as shown in the appendix Figure 4 , 5As shown, the pulsating heat channel device 11 can include a first curved channel segment 22 and a second curved channel segment 23 arranged vertically side by side. Both the first curved channel segment 22 and the second curved channel segment 23 repeatedly bend vertically and extend along a second direction, where repeatedly bending vertically means repeatedly bending along a first direction. To more directly clarify the above structure, taking the first curved channel segment 22 as an example, the first curved channel segment 22 includes multiple vertical pipe segments 24 that all extend vertically. The vertical pipe segments 24 of the first curved channel segment 22 are arranged in parallel along the second direction, thus forming an extended state in the second direction; and each vertical pipe segment 24 is connected end to end so that each vertical pipe segment 24 is connected in series. Adjacent two vertical pipe segments 24 are connected by a U-shaped segment 25, thus achieving a back-and-forth bending state in the first direction. When heated, there is a liquid column in the vertical pipe segment 24. The end of the liquid column near the heat-conducting surface will evaporate due to heat, resulting in an increase in pressure, while the end away from the heat-conducting surface will release heat, conduct heat to reduce pressure, and thus push the liquid column to move. Of course, the working principle of the pulsating hot channel device 11 can also refer to existing technology. The second curved channel section 23 is set up in the same way, so that each vertical pipe section 24 of the first curved channel section 22 and the second curved channel section 23 can be aligned one by one.

[0068] The first curved channel segment 22 and the second curved channel segment 23 are connected at both ends to form a ring structure. Typically, a working fluid filling port 15 is provided at one of the connection points. In the aforementioned ring structure, multiple liquid columns are formed. The working fluid in each liquid column maintains the column structure under tension and other forces, and the gas at both ends of the liquid column is isolated by the liquid column. As shown in the attached diagram, the steam movement direction 13 and the liquid column movement direction 14 are consistent.

[0069] In some embodiments, in addition to the placement methods described above, as shown in the attached figure... Figure 6 , 7 As shown, the pulsating hot channel device 11 can also include a third curved channel segment 26 and a fourth curved channel segment 27 arranged in parallel along the second direction. The third curved channel segment 26 and the fourth curved channel segment 27 are both repeatedly bent along the second direction and extended along the first direction, and the two ends of the corresponding third curved channel segment 26 and fourth curved channel segment 27 are connected.

[0070] To clarify the above structure more directly, taking the third curved channel segment 26 as an example, the third curved channel segment 26 includes multiple horizontal pipe segments 28 that extend in the left-right direction, which is the second direction. The horizontal pipe segments 28 of the third curved channel segment 26 are arranged side by side in the first direction, thus forming an extended state in the first direction; and each horizontal pipe segment 28 is connected end to end in the first direction so that each horizontal pipe segment 28 is connected in series, and adjacent horizontal pipe segments 28 are connected by U-shaped segments 25, thus achieving a back-and-forth bending state in the second direction.

[0071] In the above arrangement, the pulsating heat channel device 11 can generate a larger vapor pressure during the start-up phase, quickly transforming the liquid column of the horizontal tube section 28 into a shorter gas-liquid plug, thereby improving the heat dissipation efficiency of the heat dissipation structure.

[0072] The third curved channel segment 26 and the fourth curved channel segment 27 are connected at both ends to form a ring structure. Generally, a working fluid filling port 15 is provided at one of the connection points; however, considering the filling effect, the working fluid filling port 15 is usually located at one end of the partition. In the aforementioned ring structure, multiple liquid columns will be formed. The working fluid in each liquid column will maintain the column structure under the action of tension and other forces, and the gas at both ends of the liquid column is isolated by the liquid column.

[0073] In some embodiments, given the limited volume of the protruding cavity 16, it is preferable that the pulsating heat channel device 11 is disposed only in the lower cavity of the main cavity.

[0074] In some embodiments, the heat dissipation substrate 1 includes a bottom plate 17 and a cover plate arranged side by side along the thickness direction, and the inner cavity is formed between the bottom plate 17 and the cover plate, namely the upper working cavity 5 and the lower working cavity.

[0075] In some embodiments, the upper working cavity 5 has a plurality of support columns 9 arranged in an array, with both ends of the support columns 9 connected to the base plate 17 and the cover plate, respectively. Similarly, support columns 9 can be arranged in the upper cavity of the protruding cavity 16.

[0076] A flow channel is formed in the upper working chamber 5 to guide the gaseous phase change working fluid to various parts of the heat dissipation substrate 1, while simultaneously guiding the condensed droplets back. This also improves the structural strength of the heat dissipation substrate 1, preventing it from deforming or collapsing under atmospheric pressure during vacuuming, and also preventing fin deformation or leakage caused by excessive internal vapor pressure during heat dissipation. The support columns 9 can be triangular, square, hexagonal, circular, etc., and the recommended diameter of the support columns 9 is 5-10 mm. The recommended spacing between the support columns 9 is 1-1.5 times the diameter of the support column 9.

[0077] In some embodiments, to better shape the aforementioned heat dissipation structure, both the upper working cavity 5 and the lower working cavity can be manufactured by blowing. The heat dissipation substrate 1 is typically made of aluminum or other highly thermally conductive metal materials. Carbon powder is printed on the aluminum substrate to form the flow channel areas of the upper working cavity 5 and the lower working cavity. The portion of the upper working cavity 5 corresponding to the support column 9 is the non-protruding part 20, and carbon powder does not need to be printed during processing; carbon powder is printed in the area of ​​the upper working cavity 5 other than the support column 9. The aluminum substrate serves as the subsequent base plate 17. Subsequently, an aluminum cover plate is placed over the printed aluminum substrate. A high-pressure air blowing process is used to inflate the material between the two aluminum plates using high-pressure gas, forming a blown structure. The flow channels are cleaned using high-pressure liquid to remove the printed carbon powder, completing the processing of the blown fins. This creates a cavity in the area where the toner was previously brushed on. In the upper working chamber 5, except for the support column 9 formed by the blowing, the other areas are open. In the lower working chamber, an open channel is formed, such as the annular structure containing the first curved channel segment 22 and the second curved channel segment 23, or the annular structure containing the second curved channel segment 23 and the third curved channel segment 26.

[0078] It should be noted that in this embodiment, after the blown fins are processed, the channel portion formed in the lower working chamber needs to be filled. A filling metal tube is welded at the location of the working fluid filling port 15 of the pulsating heat channel device 11 using resistance welding or similar methods to serve as the working fluid filling port 15. Subsequently, the channel cavity 18 of the pulsating heat channel device 11 is evacuated and filled with liquid working fluid. At this time, in the heat dissipation substrate 1, the upper working chamber 5 is empty of working fluid, while the pulsating heat channel device 11 contains working fluid. The heat dissipation substrate 1 is welded to another heated part 2 using brazing, diffusion welding, or similar methods, and the evaporation chamber of the heated part 2 and the upper working chamber 5 are connected. Finally, the evaporation chamber is evacuated and filled with working fluid to complete the assembly of the entire radiator. In practical applications, multiple heat dissipation substrates 1 are typically welded to one heated part 2 simultaneously.

[0079] In some embodiments, the channels of the pulsating hot channel device 11 and the cavity of the phase change cooling device 29 can both be formed by machine tool processing. The base plate 17 and the cover plate are connected by welding. The inner walls of the channels of the pulsating hot channel device 11 and the inner walls of the cavities of the phase change cooling device 29 can both be coated with a hydrophobic layer. The hydrophobic layer on the inner wall of the cavity of the phase change cooling device 29 can increase the reflux rate of the condensate and prevent the condensing working fluid from adhering to the inner wall of the cavity, causing significant thermal resistance and hindering condensation. The hydrophobic layer on the inner wall of the channels of the pulsating hot channel device 11 can reduce the flow resistance of the liquid column, making it easier to start.

[0080] In some embodiments, a suitable working fluid needs to be selected for either the phase change cooling device 29 or the pulsating heat channel device 11. Based on the radiator structure, the upper working chamber 5 is connected to the evaporation chamber, and its heat mainly comes from the vapor in the evaporation chamber and the thermal conductivity of the finned metal shell; therefore, the upper working chamber 5 can be considered a condensation chamber. For the pulsating heat channel device 11, the heat in this part comes from the thermal conductivity of the liquid phase change working fluid at the bottom of the upper working chamber 5. Therefore, the temperature of the heating end 10 of the pulsating heat channel device 11 will be lower than the temperature at the heat source 3. Common working fluids for either the phase change cooling device 29 or the pulsating heat channel device 11 include water, methanol, ethanol, R134a (tetrafluoroethane), and R1233zd (trans-chlorotrifluoropropylene refrigerant).

[0081] In some embodiments, it is recommended that the phase change cooling device 29 and the pulsating heat channel device 11 be charged with different working fluids (refrigerants). The working fluid charged in the pulsating heat channel device 11 is recommended to have a lower boiling point, making it easier to undergo phase change compared to the phase change cooling device 29. Simultaneously, the operating temperature of the phase change fins must not exceed the critical temperature of the selected working fluid. For the pulsating heat channel device 11, the liquid filling rate of the working fluid is recommended to be 40% to 70% to provide better thermal drive within the device. For the phase change cooling device 29, the liquid filling rate of the working fluid can be 30% to 70% to provide better phase change space. Preferably, the liquid level of the working fluid in the phase change cooling device 29 should be above the high heat flux density heat source 3 to prevent the heat source 3 from drying out and causing heat dissipation failure.

[0082] The structural design of the pulsating heat pipe device 11 includes the channel diameter, length, shape, and the layout of the heating end 10 and cooling end 19. A smaller channel diameter makes startup easier, but it can withstand a lower heat load. Recommended diameter for the pulsating heat pipe is:

[0083] ;

[0084] Where σ is the surface tension of the working fluid, g is gravity, and ρ l Let ρ be the liquid density of the working fluid. v The temperature of the working fluid in its gaseous state is given by k. k is a coefficient, typically ranging from 0.5 to 2.0.

[0085] In the pulsating heat channel device 11, the distance S between two adjacent parallel pipes (such as the adjacent horizontal pipe section 28 and the adjacent vertical pipe section 24 mentioned above) should not be too small. This distance S directly affects the local resistance caused by the U-shaped bend of the pulsating heat pipe (the U-shaped section 25 mentioned above).

[0086] ;

[0087] Among them, h fLet v be the local head loss (in meters), K be the local drag coefficient, a dimensionless coefficient that depends on the pipe geometry, bend radius, and fluid flow characteristics. v is the fluid velocity in the pipe (in meters per second); g is the acceleration due to gravity (in meters per second squared).

[0088] The bending angle of the U-shaped section 25 of the pulsating heat channel device 11 is 180°, and its local resistance coefficient K can be expressed as:

[0089] ;

[0090] Where R is the center radius of the U-shaped section 25 (in meters), D is the inner diameter of the channel (in meters), and S = 2R. As S increases, the flow resistance inside the pulsating heat pipe decreases, but the metal volume in the pulsating heat pipe region increases, which has a negative impact on temperature uniformity. Therefore, R / D can be set between 4 and 12.

[0091] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0092] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure, characterized in that, It includes a heat-receiving part (2) and a heat-dissipating base (1); in a first direction, one end of the heat-dissipating base (1) is formed with a condensing end (8) of a phase change cooling device (29), and the other end is formed with a cooling end (19) of a pulsating heat channel device (11); the heat-receiving part (2) is located between the condensing end (8) and the cooling end (19), and the evaporating end (21) of the phase change cooling device (29) and the heating end (10) of the pulsating heat channel device (11) can be directly and / or indirectly heated from the heat-receiving part (2); The heat dissipation substrate (1) includes an upper working chamber (5) and a lower working chamber. The lower working chamber forms the pulsating heat channel device (11), and the upper working chamber (5) forms the phase change cooling device (29).

2. The heat dissipation structure according to claim 1, characterized in that, The heated part (2) is disposed in the middle of the heat dissipation substrate (1) in the first direction.

3. The heat dissipation structure according to claim 1, characterized in that, The pulsating heat channel device (11) has a plate-like structure and extends away from the phase change cooling device (29).

4. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation substrate (1) is plate-shaped, and the thickness direction of the plate is perpendicular to the first direction.

5. The heat dissipation structure according to claim 4, characterized in that, In the second direction, a protrusion (20) is formed on one side of the heat dissipation substrate (1), the protrusion (20) is connected to the heat-receiving part (2), and the second direction is perpendicular to the first direction and the plate thickness direction.

6. The heat dissipation structure according to claim 5, characterized in that, The lower working chamber forms a channel cavity (18), the channel cavity (18) is filled with a working medium to form the pulsating hot channel device (11), the upper working chamber (5) is filled with the liquid phase change medium (6) of the phase change cooling device (29), and the upper part of the upper working chamber (5) is a gaseous cavity to serve as the condensation end (8) of the phase change cooling device (29).

7. The heat dissipation structure according to claim 6, characterized in that, The cavity of the heated part (2) forms the evaporation end (21) of the phase change cooling device (29), and the inside of the protrusion (20) forms a protrusion cavity (16). The cavity of the heated part (2) is connected to the upper working chamber (5) through the protrusion cavity (16). The liquid phase change medium (6) of the phase change cooling device (29) has a liquid level in the protrusion cavity (16) that is lower than the upper sidewall of the protrusion cavity (16).

8. The heat dissipation structure according to claim 7, characterized in that, The heat dissipation substrate (1) includes a bottom plate (17) and a cover plate (4) arranged side by side along the thickness direction of the plate, and an upper working cavity (5) and a lower working cavity are formed between the bottom plate (17) and the cover plate (4).

9. The heat dissipation structure according to claim 8, characterized in that, The upper working cavity (5) has multiple support columns (9) arranged in an array.

10. The heat dissipation structure according to any one of claims 1-9, characterized in that, It includes multiple heat dissipation substrates (1), each heat dissipation substrate (1) is arranged in parallel along the thickness direction of the plate, and all multiple heat dissipation substrates (1) are connected to the cavity of the same heat receiving part (2). One end of the heat receiving part (2) is connected to the heat dissipation substrate (1), and the other end forms a heat receiving surface.

11. The heat dissipation structure according to any one of claims 5-9, characterized in that, The pulsating hot channel device (11) includes a first curved channel segment (22) and a second curved channel segment (23) arranged side by side. The first curved channel segment (22) and the second curved channel segment (23) both bend repeatedly up and down and extend along the second direction. The two ends of the first curved channel segment (22) and the second curved channel segment (23) are connected.

12. The heat dissipation structure according to any one of claims 5-9, characterized in that, The pulsating hot channel device (11) includes a third curved channel segment (26) and a fourth curved channel segment (27) arranged side by side along a second direction. The third curved channel segment (26) and the fourth curved channel segment (27) both bend repeatedly along the second direction and extend along the first direction. The two ends of the third curved channel segment (26) and the fourth curved channel segment (27) are connected.

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