Wafer transfer device and semiconductor equipment

Abstract

The embodiment of the present application provides a wafer transmission device and a semiconductor device, which are used to solve the problem of poor high temperature resistance. The wafer transmission device includes a supporting body, a driving assembly, a moving assembly, a large arm assembly, a small arm assembly and at least two end effectors. The moving assembly is connected to the supporting body in a transmission manner, driving the supporting body to move along a first direction, and the driving assembly is arranged in the supporting body and extends outward from the supporting body. The large arm assembly includes a first transmission arm and a large arm transmission member arranged in the first transmission arm, and the first transmission arm and the large arm transmission member are both connected in a transmission manner to the driving assembly. The small arm assembly includes a second transmission arm and a small arm transmission member arranged in the second transmission arm, and the small arm transmission arm and the small arm transmission member are both connected in a transmission manner to the large arm transmission member, and at least two end effectors are both connected in a transmission manner to the small arm transmission member. At least one of the large arm transmission member and the small arm transmission member is a wire transmission, which improves the adaptability of the large arm assembly and / or the small arm assembly in a high temperature environment.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor etching equipment, and in particular to a wafer transmission device and semiconductor equipment. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. The vacuum environment can ensure the quality of the wafer and minimize the falling of dust particles in the vacuum environment. Therefore, in the manufacturing process of semiconductor devices, the wafer can be transferred from different vacuum chambers through the wafer transfer device and sent to the corresponding workstation. However, in the high temperature (200°C) scenario, the reliability and availability of the wafer transfer device are poor, that is, the high temperature resistance of the wafer transfer device is poor. Summary of the invention

[0003] The embodiments of the present application provide a wafer transfer device and a semiconductor device to improve their high temperature resistance.

[0004] In the first aspect, the embodiment of the present application provides a wafer transfer device, which includes: a supporting body, a driving assembly, a moving assembly, a large arm assembly, a small arm assembly and at least two end effectors; the moving assembly is connected to the supporting body in a transmission manner, driving the supporting body to move along a first direction, the driving assembly is arranged in the supporting body and extends outward from the supporting body, driving the large arm assembly, the small arm assembly, and at least two end effectors to rotate, the large arm assembly includes a first transmission arm, and a large arm transmission member arranged in the first transmission arm, the first transmission arm and the large arm transmission member are both connected to the driving assembly in a transmission manner, the small arm assembly includes a second transmission arm, and a small arm transmission member arranged in the second transmission arm, the small arm transmission arm and the small arm transmission member are both connected to the large arm transmission member in a transmission manner, and the at least two end effectors are both connected to the small arm transmission member in a transmission manner; at least one of the large arm transmission member and the small arm transmission member is a wire transmission. The use of the large arm assembly and the small arm assembly can realize multi-degree-of-freedom movement of the end effector. At least two end effectors are used, each of which can realize the placement and pick-up of wafers. These end effectors realize the freedom series (Scara) motion through the arm assembly and the arm assembly, which can improve the efficiency of wafer transmission. The arm transmission parts and / or the arm transmission parts adopt wire transmission, which are made of metal materials, so that the arm assembly and / or the arm assembly can be adapted to high temperature environments, can adapt to vacuum and high temperature environments, and can also be compatible with atmosphere and normal temperature environments. It can also reduce or even avoid the generation of particles during the movement of the arm assembly and / or ensure the cleanliness of the reaction chamber. Among them, the arm assembly adopts wire transmission to ensure that the arm assembly has a joint movement freedom of more than 360°, and is flexible in rotation. It can also avoid zero drift during the movement of the arm assembly by setting a fixed connection anchor point, thereby reducing safety hazards.

[0005] In a possible embodiment, the driving assembly includes a first motor, a second motor, a third motor and a fourth motor, wherein the first motor, the second motor, the third motor and the fourth motor each include a stator and a rotor arranged opposite to each other, and a transmission shaft fixedly connected to the rotor, each of the stators is fixedly connected to the supporting body, and arranged in sequence in a direction away from the large arm assembly, and the corresponding transmission shafts are arranged in sequence at intervals. By using multiple motors to independently connect and drive the large arm assembly, multiple rotational degrees of freedom of the wafer transfer device can be realized, and the motion range of the end effector can be improved.

[0006] In a possible embodiment, the driving assembly further includes a sealing sleeve disposed between each stator and the corresponding rotor, and both ends of the sealing sleeve are abutted against the supporting body to achieve sealing isolation between each stator and rotor, thereby achieving sealing of the wafer transfer device.

[0007] In a possible implementation manner, along a direction away from the boom assembly, the stator of the first motor, the stator of the second motor, the stator of the third motor, and the stator of the fourth motor are sequentially arranged at intervals;

[0008] The transmission shaft of the first motor is sleeved outside the transmission shaft of the second motor and fixedly connected to the first transmission arm, the transmission shaft of the second motor is sleeved outside the transmission shaft of the third motor, the transmission shaft of the third motor is sleeved outside the transmission shaft of the fourth motor, and the transmission shafts of the second motor, the third motor and the fourth motor are all transmission-connected to the large arm transmission member. The large arm assembly can have four rotational degrees of freedom by using each transmission shaft, and the transmission shaft of the first motor can provide the first transmission arm with 360° rotational degrees of freedom.

[0009] In a possible implementation manner, the boom transmission member includes a first transmission member, a second transmission member, and a third transmission member, and the first transmission member, the second transmission member, and the third transmission member each include a first driving wheel, a first driven wheel, and a first steel wire connected between the first driving wheel and the first driven wheel;

[0010] Each of the first driving wheels and the first transmission arm is fixedly connected to each of the transmission shafts, and each of the first driven wheels is connected to the corresponding second transmission arm and the small arm transmission member. The small arm assembly is connected to the large arm transmission member to achieve relative rotation between the small arm assembly and the large arm assembly; and the large arm transmission member uses the first steel wire for transmission, which can improve the environmental adaptability of the large arm assembly under high temperature.

[0011] In a possible implementation, each of the first driven wheels is sequentially arranged in a direction away from the small arm assembly, and the first transmission member, the second transmission member, and the third transmission member each further include a first connecting rod, each of the first connecting rods is sequentially spaced apart, and one end is respectively fixedly connected to the corresponding first driven wheel, and the other end is respectively fixedly connected to the corresponding second transmission arm and the small arm transmission member. By sequentially spacing apart a plurality of first connecting rods, motion interference between the large arm assembly and the small arm assembly can be avoided, and motion interference between each small arm transmission member and the second transmission arm can be avoided.

[0012] In a possible implementation manner, along a direction away from the small arm assembly, the first driven wheel of the first transmission member, the first driven wheel of the second transmission member, and the first driven wheel of the third transmission member are sequentially arranged at intervals;

[0013] The first connecting rod of the first transmission member is sleeved outside the first connecting rod of the second transmission member and is fixedly connected to the second transmission arm. The first connecting rod of the second transmission member is sleeved outside the first connecting rod of the third transmission member. The first connecting rod of the second transmission member and the first connecting rod of the third transmission member are both transmission-connected to the small arm transmission member. The rotation of the second transmission arm is realized by the first connecting rod of the first transmission member, and the second transmission arm has a 360° rotational freedom. The rotation of the small arm transmission member is realized by the first connecting rod of the second transmission rod and the first connecting rod of the third transmission rod.

[0014] In a possible implementation manner, the number of the end effectors is two, the forearm transmission member includes a fourth transmission member and a fifth transmission member, and the fourth transmission member and the fifth transmission member each include a second driving wheel, a second driven wheel, and a second steel wire connected between the second driving wheel and the second transmission wheel;

[0015] The second transmission arm and each of the second driving wheels are respectively fixedly connected to each of the first connecting rods, and each of the second driven wheels is respectively connected to the two end effectors. The end effector is driven by the small arm transmission member, so that the end effector has a 360° rotational freedom, and the end effector is offset relative to the large arm assembly to achieve an offset arrangement of the wafer transmission device. In addition, the small arm transmission member uses the first steel wire for transmission, which can improve the environmental adaptability of the small arm assembly at high temperatures.

[0016] In a possible implementation manner, a transmission ratio between the second driving wheel and the second driven wheel is less than 1, so as to improve the flexibility of the end effector.

[0017] In a possible implementation, each of the second driven wheels is sequentially arranged in a direction away from the end effector, and the fourth transmission member and the fifth transmission member each further include a second connecting rod, each of the second connecting rods is sequentially spaced and sleeved, and one end is respectively fixedly connected to the corresponding second driven wheel, and the other end is respectively fixedly connected to the corresponding end effector. Each second connecting rod is respectively connected to each of the second driven wheels in the forearm assembly, and is correspondingly connected to the end effector to realize a separate drive of the end effector.

[0018] In a possible implementation, the second driven wheel of the fourth transmission member is arranged on a side of the second driven wheel of the fifth transmission member close to the end effector, and the second connecting rod of the fourth transmission member is sleeved outside the second connecting rod of the fifth transmission member. In this way, motion interference between the end effectors can be avoided.

[0019] In a possible implementation, the driving assembly includes a moving support, a moving connection, a fifth motor and a lead screw;

[0020] The movable connecting member is fixedly connected to the movable supporting member, and is configured as follows: it is arranged outside the reaction chamber and fixedly connected to the outer wall of the reaction chamber, the fifth motor is fixedly connected to the supporting body, the lead screw is fixedly connected to the output end of the fifth motor and is transmission-connected to the movable supporting member, and the movable supporting member is slidably connected to the supporting body. The lead screw and the motor can realize the movement of the supporting body, so that the wafer transmission device has a degree of freedom of movement to realize the taking and placing of wafers.

[0021] In a possible implementation manner, the driving assembly passes through the movable connection and extends into the reaction chamber;

[0022] The driving assembly further comprises a sealing bellows, which is sleeved outside the driving assembly and has two ends respectively abutting against the movable connecting member and the supporting body, so that the reaction chamber and the supporting body can be sealed.

[0023] In a possible implementation manner, each of the first driving wheels includes two first rotating wheels that are sequentially stacked and fixedly connected, each of the first driven wheels includes two second rotating wheels that are sequentially stacked and fixedly connected, and each of the second rotating wheels and the corresponding first rotating wheel form a first wheel set;

[0024] The first steel wire comprises a first segment and a second segment, two ends of the first segment are respectively fixedly connected to the first rotating wheel and the second rotating wheel of one of the first wheel sets, two ends of the second segment are respectively fixedly connected to the first rotating wheel and the second rotating wheel of another of the first wheel sets, and the winding directions of the first segment and the second segment are opposite;

[0025] And / or, each of the second driving wheels includes two third rotating wheels which are sequentially stacked and fixedly connected, each of the second driven wheels includes two fourth rotating wheels which are sequentially stacked and fixedly connected, and each of the fourth rotating wheels and the corresponding third rotating wheel form a second wheel set;

[0026] The second steel wire includes a third segment and a fourth segment, the two ends of the third segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of one of the second wheel groups, the two ends of the fourth segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of another second wheel group, and the winding directions of the third segment and the fourth segment are opposite. The winding of the first segment, the second segment, the third segment and the fourth segment can all exceed 360°, and can achieve transmission of more than 360°, and can be pre-tightened by pulling, which can avoid zero drift during the movement of the boom assembly and improve safety.

[0027] In a possible implementation, the first rotating wheel, the second rotating wheel, the third rotating wheel and the fourth rotating wheel are all provided with spiral grooves, and the first segment, the second segment, the third segment and the fourth segment are respectively located in the corresponding spiral grooves. The spiral grooves are used for guidance to avoid mutual friction and rolling of the first segment, the second segment, the third segment and the fourth segment, so as to ensure transmission accuracy.

[0028] In a second aspect, the present application provides a semiconductor device, including the wafer transfer device described above. The semiconductor device includes the wafer transfer device described above, and thus has at least the advantage of good adaptability in high temperature environments. The specific effects are referred to above and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0030] Figure 1 A schematic diagram of a robot in the related art;

[0031] Figure 2 A schematic diagram of a bias cavity according to an embodiment of the present application;

[0032] Figure 3 A schematic diagram of a cavity facing an embodiment of the present application;

[0033] Figure 4 A schematic diagram of a wafer transfer device according to an embodiment of the present application;

[0034] Figure 5It is a partial schematic diagram of a large arm assembly and a small arm assembly of an embodiment of the present application;

[0035] Figure 6 This is a transmission relationship diagram of an embodiment of the present application;

[0036] Figure 7 A schematic diagram of the working state of a wafer transfer device according to an embodiment of the present application;

[0037] Figure 8 A schematic diagram of a first rotating wheel and a second rotating wheel according to an embodiment of the present application;

[0038] Fig. 9 This is a schematic diagram of the first segment and the second segment of an embodiment of the present application.

[0039] Description of reference numerals:

[0040] 11-wafer; 12-robot;

[0041] 13-reaction chamber; 21-support body;

[0042] 22-first motor; 23-second motor;

[0043] 24- the third motor; 25- the fourth motor;

[0044] 26-sealing sleeve; 27-sealing bellows;

[0045] 28-transmission shaft of the first motor; 29-transmission shaft of the second motor;

[0046] 30-transmission shaft of the third motor; 31-transmission shaft of the fourth motor;

[0047] 41-mobile support member; 42-mobile connecting member;

[0048] 43-screw; 44-fifth motor;

[0049] 45-guide rail; 51-first transmission arm;

[0050] 52-big arm transmission member; 53-second transmission arm;

[0051] 54- small arm transmission member; 55- end effector;

[0052] 56 - a second connecting rod of the fourth transmission member; 57 - a second connecting rod of the fifth transmission member;

[0053] 58 - the second driven wheel of the fourth transmission member; 59 - the second driven wheel of the fifth transmission member;

[0054] 60 - the second steel wire of the fourth transmission member; 61 - the second steel wire of the fifth transmission member;

[0055] 62 - the second driving wheel of the fourth transmission member; 63 - the second driving wheel of the fifth transmission member;

[0056] 64-a first connecting rod of a first transmission member; 65-a first connecting rod of a second transmission member;

[0057] 66 - a first connecting rod of the third transmission member; 67 - a first driven wheel of the first transmission member;

[0058] 68-a first driven wheel of a second transmission member; 69-a first driven wheel of a third transmission member;

[0059] 70 - the first steel wire of the first transmission member; 71 - the first steel wire of the second transmission member;

[0060] 72-a first steel wire of the third transmission member; 73-a first driving wheel of the first transmission member;

[0061] 74-a first driving wheel of the second transmission member; 75-a first driving wheel of the third transmission member;

[0062] 81-first rotating wheel; 82-second rotating wheel;

[0063] 83-first segment; 84-second segment. DETAILED DESCRIPTION

[0064] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0065] See also Figure 1 In high temperature scenarios, the transmission components of the robot 12 that transfers the wafer 11 have higher temperature resistance requirements. However, the traditional robot 12 using motors and belts will face challenges in terms of reliability and availability. At the same time, the sealing performance, cleanliness performance and reliability of magnetic fluids under high temperature and vacuum are also extremely challenging. In addition, Figure 1 As shown, the robot 12 for transporting the wafer 11 has two degrees of freedom in the plane. The robot 12 can extend and retract along the R direction and rotate along the θ direction of the main axis center. The end effector itself has no rotational freedom and cannot achieve safe obstacle avoidance and meet the requirements of any reaction chamber offset layout.

[0066] In view of this, the wafer transfer device of the embodiment of the present application realizes the adaptability of the arm assembly and / or in high temperature environment by making at least one of the arm transmission member and the arm transmission member a wire transmission, which is made of metal material, so as to adapt to vacuum and high temperature environment, and also be compatible with atmosphere and normal temperature environment, and can also reduce or even avoid the generation of particles during the movement of the arm assembly and / or to ensure the cleanliness of the reaction chamber. At the same time, the arm assembly adopts a wire transmission, which can also ensure that the arm assembly has a joint movement freedom of more than 360° and is flexible in rotation. It can also avoid zero drift during the movement of the arm assembly by setting a fixed connection anchor point, thereby reducing safety hazards.

[0067] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0068] See also Figures 2 to 8 The present application provides a semiconductor device, which refers to production equipment required to produce various semiconductor products, such as equipment used in chip manufacturing and packaging and testing processes. For example, semiconductor equipment includes photolithography equipment, etching equipment, deposition equipment, ion implantation equipment, polishing equipment, and other equipment.

[0069] The semiconductor device includes a wafer transfer device for transferring a wafer 11, which includes a supporting body 21, a driving component, a moving component, a large arm component, a small arm component and at least two end effectors 55. The wafer transfer device forms a SACRA (Selective Compliance Assembly Robot Arm) manipulator, which is commonly used in semiconductor devices related to grinding, polishing, etching, diffusion, deposition, assembly, packaging and testing, etc. Through the cooperation of the moving component, the large arm component, the small arm component and the end effector 55, the large arm component, the small arm component and the end effector 55 can have a degree of freedom in series motion, so that each end effector 55 can vertically enter and exit the reaction chamber 13. In this way, on the one hand, each end effector 55 can take and place the wafer 11, which can improve the transmission efficiency of the wafer 11. On the other hand, each end effector 55 is independent of each other, realizing different trajectories, and has stronger versatility and flexibility.

[0070] The reaction chamber 13 may be a vacuum chamber, and the interior of the chamber may be evacuated. The reaction chamber 13 includes a process module (PM), which is also called a processing module or a process module, and is used to perform an etching process. Figure 2 As shown in FIG, the chamber door of the process module is offset from the installation axis of the drive assembly, forming an offset chamber. Figure 3 As shown, the chamber door of the process module and the installation axis of the drive assembly can also be perpendicular to each other to form a facing chamber.

[0071] See also Figure 4 The support body 21 is used to accommodate the drive assembly so that the drive assembly is mainly located inside the support body 21, thereby improving the space utilization rate of the wafer transfer device. The support body 21 is formed with a accommodating space and an opening connected to the accommodating space, and the opening faces the reaction chamber 13 so that the output end of the drive assembly can extend outward to realize the connection between the drive assembly and the arm assembly. Specifically, the support body 21 includes a shell, and a cover body arranged at one end of the shell, and one end of the shell is open, and the cover body is buckled on the opening. The shell and the cover body enclose the above-mentioned accommodating space, and the above-mentioned opening is formed on the cover body, and the opening passes through the cover body. The cover body can be a flange, and the cover body and the shell can be connected by bolts.

[0072] The support body 21 is also in transmission connection with the moving assembly, and the moving assembly drives the support body 21 to move along the first direction, so that the wafer transfer device has the degree of freedom in the first direction, thereby realizing the function of the end effector 55 to take and place the wafer. The first direction is the direction away from / close to the reaction chamber 13, such as Figure 4 The Z direction shown enables the support body 21 to be close to the reaction chamber 13 or far away from the reaction chamber 13 .

[0073] In some possible implementations, the drive assembly includes a mobile support 41, a mobile connection 42, a fifth motor 44 and a lead screw 43. The mobile connection 42 is fixedly connected to the mobile support 41, and is configured to be arranged outside the reaction chamber 13 and fixedly connected to the outer wall of the reaction chamber 13, the fifth motor 44 is fixedly connected to the support body 21, the lead screw 43 is fixedly connected to the output end of the fifth motor 44, and is transmission-connected to the mobile support 41, and the mobile support 41 is slidably connected to the support body 21. The mobile connection 42 is arranged outside the reaction chamber 13 and fixedly connected to the outer wall of the reaction chamber 13. Exemplarily, the mobile connection 42 can be a flange, and is connected to the outer wall of the reaction chamber 13 by bolts.

[0074] The movable connecting member 42 is also fixedly connected to the movable supporting member 41, for example, by welding, clamping or connecting through threaded fasteners. The movable supporting member 41 is arranged beside the supporting body 21, and can be connected to the screw 43 by transmission. The screw 43 is fixedly connected to the output end of the fifth motor 44 (for example, the transmission shaft of the fifth motor 44), and the fifth motor 44 is fixedly connected to the supporting body 21. In this way, the fifth motor 44 and the screw 43 can form a Z-axis module, and the screw 43 can be driven to rotate by the fifth motor 44 to move relative to the movable connecting member 42. Since the movable connecting member 42 is relatively fixed to the reaction chamber 13, the supporting body 21 moves relative to the reaction chamber 13, thereby driving the driving component in the supporting body 21 to move in the reaction chamber 13.

[0075] In order to improve the smoothness and directionality of the movement of the support body 21, the support body 21 and the movable support member 41 can be connected by a guide rail 45 for guidance. Exemplarily, one of the movable support member 41 and the support body 21 is provided with a guide rail 45, and the other of the movable support member 41 and the support body 21 is correspondingly provided with a roller or a slider.

[0076] Continue reading Figure 4 The driving assembly is disposed in the supporting body 21 and extends outward from the supporting body 21 to drive the big arm assembly, the small arm assembly, and at least two end effectors 55 to rotate. In some possible examples, the driving assembly includes a first motor 22, a second motor 23, a third motor 24, and a fourth motor 25, and the first motor 22, the second motor 23, the third motor 24, and the fourth motor 25 can all be T-axis driving motors.

[0077] The first motor 22, the second motor 23, the third motor 24 and the fourth motor 25 all include stators and rotors arranged relatively to each other, and a transmission shaft fixedly connected to the rotor. Each stator is fixedly connected to the support body 21, and is arranged in sequence in the direction away from the big arm assembly, and the corresponding transmission shafts are arranged in sequence at intervals. By fixing each stator in the support body 21 and sleeved outside the corresponding rotor, the corresponding stator and rotor are spaced apart to realize the relative rotation of the rotor to the stator. By arranging each stator and each rotor in the support body, most of the drive assembly is located in the support body, which is convenient for assembling and moving the drive assembly, and can also reduce the size of the reaction chamber 13 in the thickness direction, reduce the size of the reaction chamber 13, and increase the time for the reaction chamber 13 to establish and break the vacuum.

[0078] Among them, each stator can be coaxially arranged, each rotor can be coaxially arranged, and each transmission shaft can be coaxially arranged, thereby improving the space utilization of the support body 21. Each transmission shaft is sequentially spaced and sleeved, and can be independently connected to the arm assembly, providing four rotational degrees of freedom for the wafer transfer device, plus the mobile degrees of freedom of the support body 21, so that the wafer transfer device can achieve 5 degrees of freedom movement, and the end effector 55 can enter the reaction chamber 13 and take and place the wafer 11.

[0079] In some possible examples, along the direction away from the boom assembly, the stator of the first motor 22, the stator of the second motor 23, the stator of the third motor 24, and the stator of the fourth motor 25 are arranged in sequence. That is, the stator of the first motor 22 is close to the boom assembly, and the stator of the fourth motor 25 is far away from the boom assembly. Correspondingly, along the direction away from the boom assembly, the rotor of the first motor 22, the rotor of the second motor 23, the rotor of the third motor 24, and the rotor of the fourth motor 25 are arranged in sequence. That is, the rotor of the first motor 22 is close to the boom assembly, and the rotor of the fourth motor 25 is far away from the boom assembly.

[0080] The transmission shaft 28 of the first motor 22 is fixedly connected to the rotor of the first motor 22, the transmission shaft 29 of the second motor 23 is fixedly connected to the rotor of the second motor 23, the transmission shaft 30 of the third motor 24 is fixedly connected to the rotor of the third motor 24, and the transmission shaft 31 of the fourth motor 25 is fixedly connected to the rotor of the fourth motor 25. The transmission shaft 28 of the first motor 22 is sleeved outside the transmission shaft 29 of the second motor 23, the transmission shaft 29 of the second motor 23 is sleeved outside the transmission shaft 30 of the third motor 24, and the transmission shaft 30 of the third motor 24 is sleeved outside the transmission shaft 31 of the fourth motor 25.

[0081] The transmission shaft 28 of the first motor 22, the transmission shaft 29 of the second motor 23, the transmission shaft 30 of the third motor 24, and the transmission shaft 31 of the fourth motor 25 are spaced apart to avoid interference between the transmission shafts when they rotate. The transmission shaft 31 of the fourth motor 25 extends outward from the transmission shaft 30 of the third motor 24, the transmission shaft 30 of the third motor 24 extends outward from the transmission shaft 29 of the second motor 23, and the transmission shaft 29 of the second motor 23 extends outward from the transmission shaft 28 of the first motor 22, so that each transmission shaft is connected to the boom assembly for transmission.

[0082] Continue reading Figure 4 The driving assembly passes through the movable connecting member 42 and extends into the reaction chamber 13. In order to realize the vacuum sealing of the wafer transfer device, the driving assembly further includes a sealing bellows 27. The sealing bellows 27 is sleeved outside the driving assembly, and the two ends of the sealing bellows 27 are respectively against the movable connecting member 42 and the supporting body 21. Specifically, Figure 4As shown, the sealing bellows 27 is sleeved outside each transmission shaft, and one end thereof abuts against the flange of the moving assembly, and the other end abuts against the flange of the support body 21, thereby sealing the two flanges. The sealing bellows 27 can ensure the sealing between the two flanges during the movement of the support body 21, and realize the sealing of the support body 21 and the reaction chamber 13.

[0083] The drive assembly further includes a sealing sleeve 26 disposed between each stator and the corresponding rotor, and both ends of the sealing sleeve 26 abut against the support body 21. Figure 4 As shown, the sealing sleeve 26 is sleeved on the outside of the rotor of the first motor 22, the outside of the rotor of the second motor 23, the outside of the rotor of the third motor 24, and the outside of the rotor of the fourth motor 25, and one end of the sealing sleeve 26 abuts against the end surface of the support body 21 close to the big arm assembly, and the other end abuts against the end surface of the support body 21 away from the big arm assembly, so that each stator and the corresponding rotor are sealed and isolated, and the sealing inside the support body 21 is realized. Among them, the sealing sleeve 26 can be a sealing steel sleeve, which is not easy to deform, so as to ensure the sealing performance and avoid interference with the stator and the rotor.

[0084] See also Figure 4 and Figure 5 The arm assembly is used to provide rotational freedom, which is located in the reaction chamber 13, and includes a first transmission arm 51 (i.e., the arm), and an arm transmission member 52 disposed in the first transmission arm 51. The first transmission arm 51 and the arm transmission member 52 are both connected to the driving assembly in a transmission manner, and the first transmission arm 51 and the arm transmission member 52 are both located in the reaction chamber 13. Specifically, the transmission shaft 28 of the first motor 22 is fixedly connected to the first transmission arm 51, which can provide the first transmission arm 51 with 360° rotational freedom, thereby improving rotational flexibility and efficiency. The arm transmission member 52 is correspondingly connected to the transmission shaft 29 of the second motor 23, the transmission shaft 30 of the third motor 24, and the transmission shaft 31 of the fourth motor 25, that is, the transmission shaft 29 of the second motor 23, the transmission shaft 30 of the third motor 24, and the transmission shaft 31 of the fourth motor 25 are all connected to the arm transmission member 52 in a transmission manner.

[0085] Among them, the arm transmission member 52 can be a steel wire transmission. In this way, on the one hand, its material is a metal material, which can realize the environmental adaptability of the arm assembly at high temperature, and can also reduce or even avoid the generation of particles when the arm assembly moves, ensuring the cleanliness of the reaction chamber 13. On the other hand, it can ensure that the joint movement freedom of the arm assembly exceeds 360°, and the rotation is flexible. It can also avoid zero drift during the movement of the arm assembly by setting a fixed connection anchor point, thereby reducing safety hazards.

[0086] In some possible implementations, such as Figure 5As shown, the arm transmission member 52 includes a first transmission member, a second transmission member and a third transmission member, each of which includes a first driving wheel, a first driven wheel, and a first steel wire connected between the first driving wheel and the first driven wheel. Each first driving wheel and the first transmission arm 51 are respectively fixedly connected to each transmission shaft, and each first driven wheel is respectively connected to the corresponding second transmission arm 53 and the arm transmission member 54.

[0087] The first transmission member, the second transmission member, and the third transmission member are all driven by steel wires, and each of the first transmission member, the second transmission member, and the third transmission member includes a first driving wheel, a first driven wheel, and a first steel wire. The first driving wheel and the first driven wheel are connected by the first steel wire, and the first driven wheel is driven to rotate by the first driving wheel. Each first driving wheel is driven to move by each transmission shaft, and is driven by the corresponding first driven wheel through the first steel wire.

[0088] Specifically, each first driving wheel is arranged in sequence in a direction away from the small arm assembly, that is, the first driving wheel 73 of the first transmission member is close to the small arm assembly, and the first driving wheel 75 of the third transmission member is away from the small arm assembly and close to the support body 21. The first driving wheel 73 of the first transmission member is fixedly connected to the transmission shaft 31 of the fourth motor 25, and is transmitted to the first driven wheel 67 of the first transmission member through the first steel wire 70 of the first transmission member. The first driving wheel 74 of the second transmission member is fixedly connected to the transmission shaft 30 of the third motor 24, and is transmitted to the first driven wheel 68 of the second transmission member through the first steel wire 71 of the second transmission member. The first driving wheel 75 of the third transmission member is fixedly connected to the transmission shaft 29 of the second motor 23, and is transmitted to the first driven wheel 69 of the third transmission member through the first steel wire 72 of the third transmission member.

[0089] Continue reading Figure 5 , along the direction away from the small arm assembly, each first driven wheel is arranged in sequence in the direction away from the small arm assembly, the first transmission member, the second transmission member and the third transmission member all further include a first connecting rod, each first connecting rod is sequentially spaced and sleeved, and one end is respectively fixedly connected to the corresponding first driven wheel, and the other end is respectively connected to the small arm assembly. Each first connecting rod is respectively connected to each first driven wheel in the big arm assembly and is correspondingly connected to the small arm assembly to realize the driving assembly driving the small arm assembly, so that the small arm assembly has a rotational degree of freedom.

[0090] In some possible examples, along the direction away from the small arm assembly, the first driven wheel 67 of the first transmission member, the first driven wheel 68 of the second transmission member, and the first driven wheel 69 of the third transmission member are sequentially arranged at intervals, that is, the first driven wheel 67 of the first transmission member is close to the small arm assembly, and the first driven wheel 69 of the third transmission member is away from the small arm assembly and close to the support body 21. The first connecting rod 64 of the first transmission member is sleeved outside the first connecting rod 65 of the second transmission member and is fixedly connected to the second transmission arm 53, and the first connecting rod 65 of the second transmission member is sleeved outside the first connecting rod 66 of the third transmission member.

[0091] One end of each first connecting rod is fixedly connected to the corresponding first driven wheel, and the other end of each first connecting rod is connected to the arm assembly. Specifically, one end of the first connecting rod 64 of the first transmission member is fixedly connected to the first driven wheel 67 of the first transmission member, one end of the first connecting rod 65 of the second transmission member is fixedly connected to the first driven wheel 68 of the second transmission member, and one end of the first connecting rod 66 of the third transmission member is fixedly connected to the first driven wheel 69 of the third transmission member. The other end of each first connecting rod is connected to the second transmission arm 53 and the arm transmission member 54 of the arm assembly.

[0092] Continue reading Figure 4 and Figure 5 The small arm assembly includes a second transmission arm 53 (i.e., a small arm), and a small arm transmission member 54 disposed in the second transmission arm 53. The small arm transmission arm and the small arm transmission member 54 are both transmission-connected to the large arm transmission member 52, and at least two end effectors 55 are both transmission-connected to the small arm transmission member 54. The second transmission arm 53 and the small arm transmission member 54 are both located in the reaction chamber 13, and are correspondingly connected to the large arm transmission member 52, and are correspondingly connected to the end effectors 55. The large arm transmission member 52 is used to realize the driving assembly to drive the second transmission arm 53, so that the second transmission arm 53 has a 360° rotational freedom, and the small arm transmission member 54 is used to realize the driving assembly to drive the end effector 55, so that the end effector 55 has a 360° rotational freedom.

[0093] Among them, the arm transmission member 54 can be a wire transmission. In this way, on the one hand, the arm assembly is made of metal material, which can achieve environmental adaptability of the arm assembly at high temperatures, and can also reduce or even avoid the generation of particles when the arm assembly moves, thereby ensuring the cleanliness of the reaction chamber 13. On the other hand, it can ensure that the joint movement freedom of the arm assembly exceeds 360°, and the rotation is flexible. It can also avoid zero drift during the movement of the arm assembly by setting a fixed connection anchor point, thereby reducing safety hazards.

[0094] It can be understood that the transmission methods of the forearm transmission member 54 and the boom transmission member 52 are independent of each other. For example, the forearm transmission member 54 can be driven by wire, or the boom transmission member 52 can be driven by wire, or both the boom transmission member 52 and the forearm transmission member 54 can be driven by wire.

[0095] In some possible examples, the number of the end effectors 55 is two, the arm transmission member 54 includes a fourth transmission member and a fifth transmission member, the fourth transmission member and the fifth transmission member each include a second driving wheel, a second driven wheel, and a second steel wire connected between the second driving wheel and the second transmission wheel. The second transmission arm 53 and each second driving wheel are respectively fixedly connected to each first connecting rod, each second driven wheel is respectively connected to two end effectors 55, and the end effector 55 can be a fork.

[0096] Among them, the third transmission member and the fourth transmission member are both wire-driven, and the third transmission member and the fourth transmission member both include a second driving wheel, a second driven wheel and a second steel wire, and the second driving wheel and the second driven wheel are connected by the second steel wire, and the second driven wheel is driven to rotate by the second driving wheel. Each second driving wheel is driven to move by each first connecting rod, and is driven with the corresponding second driven wheel by the second steel wire. The transmission ratio of the second driving wheel and the second driven wheel is less than 1, so as to improve the flexibility of the end effector 55.

[0097] The second driving wheels are arranged in sequence in a direction away from the end effector 55, that is, the second driving wheel 62 of the fourth transmission member is close to the end effector 55, and the second driving wheel 63 of the fifth transmission member is away from the end effector 55 and close to the support body 21. The first driving wheel of the fourth transmission member is fixedly connected to the first connecting rod 66 of the third transmission member, and is transmitted to the second driven wheel 58 of the fourth transmission member through the second steel wire 60 of the fourth transmission member. The second driving wheel 63 of the fifth transmission member is fixedly connected to the first connecting rod 65 of the second transmission member, and is transmitted to the second driven wheel 59 of the fifth transmission member through the second steel wire 61 of the fifth transmission member. The second transmission arm 53 is fixedly connected to the first connecting rod 64 of the first transmission member.

[0098] Specifically, each second driven wheel is sequentially arranged in a direction away from the end effector 55, and the fourth transmission member and the fifth transmission member both further include a second connecting rod, each second connecting rod is sequentially spaced and sleeved, and one end is respectively fixedly connected to the opposite second driven wheel, and the other end is respectively fixedly connected to the corresponding end effector 55. Each second connecting rod is respectively connected to each second driven wheel in the arm assembly and is correspondingly connected to the end effector 55, so that the drive assembly drives the end effector 55, so that the end effector 55 has a rotational degree of freedom.

[0099] In some possible implementations, the second driven wheel 58 of the fourth transmission member is disposed on a side of the second driven wheel 59 of the fifth transmission member close to the end effector 55, and the second connecting rod 56 of the fourth transmission member is sleeved outside the second connecting rod 57 of the fifth transmission member. Figure 5 As shown, one end of the second connecting rod 56 of the fourth transmission member is fixedly connected to the second driven wheel 58 of the fourth transmission member, and the other end is fixedly connected to an end effector 55. One end of the second connecting rod 57 of the fifth transmission member is fixedly connected to the second driven wheel 59 of the fifth transmission member, and the other end is fixedly connected to another end effector 55.

[0100] It can be understood that the transmission shaft 28 of the first motor drives the first transmission arm 51 to rotate, the transmission shaft 29 of the second motor drives one of the end effectors 55 to rotate through the third transmission member and the fourth transmission member in turn, the transmission shaft 30 of the third motor drives another end effector 55 to rotate through the second transmission member and the fifth transmission member in turn, and the transmission shaft 31 of the fourth motor drives the second transmission arm 53 to rotate through the first transmission member. By using the first transmission member, the second transmission member, and the third transmission member in the large arm assembly, and the fourth transmission member and the fifth transmission member in the small arm assembly, the wafer transmission device has four rotational degrees of freedom. In addition to the freedom of movement of the supporting body, the wafer transmission device has a total of five degrees of freedom, so that within a certain range, each end effector 55 can be reached at any position and any posture on the plane, thereby realizing the ability of the offset cavity to enter and exit vertically, and improving the flexibility of the wafer transmission device and the efficiency of wafer placement.

[0101] See also Figure 6 , the transmission relationship between the arm assembly and the forearm assembly is as follows: the wrist transmission ratio is 1:J, where J is the transmission ratio of the second driving wheel to the second driven wheel in the forearm assembly. Θ arm = M arm, Θ forearm = M forearm - M arm, Θ wrist = (M wrist - M forearm) / J, T wrist = M wrist - M arm. Where Θ is the joint angle, M is the corresponding motor angle, and T is the corresponding transmission member angle.

[0102] See also Figure 7 , the wafer transfer device for taking and placing the wafer 11 is described as follows: when one end effector 55 extends into the process module, the other end effector 55 performs an evasive motion outside the process module, and at this time, the end effector 55 extending into the process module performs the action of taking and placing the wafer 11. After the end effector 55 completes the taking and placing, the end effector 55 is completely retracted perpendicular to the chamber door of the process module, and then performs a scissor motion relative to the end effector 55 outside the process module to achieve position alternation. At this time, the end effector 55 originally outside the cavity extends into the process module perpendicular to the chamber door of the process module to perform the action of taking and placing the wafer 11, and the other end effector 55 performs an evasive motion outside the process module. In the process of taking and placing the wafer 11, the support body 21 moves up and down along the first direction.

[0103] In order to improve the transmission performance of the arm transmission member 52 and the arm transmission member 54, in some possible examples, refer to Figure 8 and Fig. 9 , each first driving wheel includes two first rotating wheels 81 stacked in sequence and fixedly connected, each first driven wheel includes two second rotating wheels 82 stacked in sequence and fixedly connected, and each second rotating wheel 82 and the corresponding first rotating wheel 81 form a first wheel set. Specifically, the two first rotating wheels 81 of the same first driving wheel are fixedly connected, the two second rotating wheels 82 of the same first driven wheel are fixedly connected, and the two first rotating wheels 81 of the same first driving wheel and the two second rotating wheels 82 of the corresponding first driven wheel form two first wheel sets, and the two first wheel sets are stacked up and down. Figure 3 As shown, the first rotating wheel 81 and the second rotating wheel 82 located at the upper layer form a first wheel group, and the first rotating wheel 81 and the second rotating wheel 82 located at the lower layer form another first wheel group.

[0104] The first steel wire includes a first segment 83 and a second segment 84, and the two ends of the first segment 83 are respectively fixedly connected to the first rotating wheel 81 and the second rotating wheel 82 of one of the first wheel groups, and the two ends of the second segment 84 are respectively fixedly connected to the first rotating wheel 81 and the second rotating wheel 82 of the other first wheel group. Among them, the first segment 83 and the second segment 84 are independent of each other, and the two ends of the first segment 83 are fixedly connected to the corresponding first rotating wheel 81 and the second rotating wheel 82. The two ends of the second segment 84 are respectively fixedly connected to the corresponding first rotating wheel 81 and the second rotating wheel 82. By arranging a fixed anchor point at the two ends of the first segment 83 and the second segment 84, respectively, and arranging a tensionable anchor point in the boom transmission member 52 (for example, using a commonly used steel wire tensioning mechanism), and pre-tightening by pulling, zero point drift can be avoided during the movement of the boom assembly, thereby improving safety.

[0105] The winding directions of the first segment 83 and the second segment 84 are opposite. For example, the first segment 83 is wound right-handed on the corresponding first rotating wheel 81 and the second rotating wheel 82, and the second segment 84 is wound left-handed on the corresponding first rotating wheel 81 and the second rotating wheel 82. By adopting a left-handed mirror arrangement between the upper and lower first wheel groups, the transmission ratio is guaranteed to remain unchanged during the rotation process. The winding of the first segment 83 and the second segment 84 can exceed 360°, and transmission of more than 360° can be achieved.

[0106] In some possible examples, each second driving wheel includes two third rotating wheels stacked in sequence and fixedly connected, each second driven wheel includes two fourth rotating wheels stacked in sequence and fixedly connected, and each fourth rotating wheel and the corresponding third rotating wheel form a second wheel set. The second steel wire includes a third segment and a fourth segment, and both ends of the third segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of one of the second wheel sets, and both ends of the fourth segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of another second wheel set, and the winding directions of the third segment and the fourth segment are opposite.

[0107] The third rotating wheel, the fourth rotating wheel, and the first wheel group can refer to the first rotating wheel 81, the second rotating wheel 82, and the second wheel group, respectively. The third segment and the fourth segment can refer to the first segment 83 and the second segment 84, respectively. The details are as described above and will not be repeated here.

[0108] In order to avoid the first segment 83 and the second segment 84, as well as the third segment and the fourth segment from rubbing against each other and rolling against each other, so as to ensure the transmission accuracy, the first rotating wheel 81, the second rotating wheel 82, the third rotating wheel and the fourth rotating wheel are all provided with spiral grooves, and the first segment 83, the second segment 84, the third segment and the fourth segment are respectively located in the corresponding spiral grooves. In this way, by providing the spiral grooves for guiding, the transmission accuracy can be improved. The cross-sectional shape of the spiral groove can be V-shaped, arc-shaped or special-shaped.

[0109] In summary, the wafer transfer device in the embodiment of the present application includes a support body 21, a driving assembly, a moving assembly, a large arm assembly, a small arm assembly and at least two end effectors 55. The moving assembly is connected to the support body 21 in a transmission manner, and drives the support body 21 to move along a first direction. The driving assembly is arranged in the support body 21 and extends outward from the support body 21, and drives the large arm assembly, the small arm assembly, and at least two end effectors 55 to rotate. The large arm assembly includes a first transmission arm 51, and a large arm transmission member 52 arranged in the first transmission arm 51, and the first transmission arm 51 and the large arm transmission member 52 are both connected to the driving assembly in a transmission manner. The small arm assembly includes a second transmission arm 53, and a small arm transmission member 54 arranged in the second transmission arm 53, and the small arm transmission arm and the small arm transmission member 54 are both connected to the large arm transmission member 52 in a transmission manner, and at least two end effectors 55 are both connected to the small arm transmission member 54 in a transmission manner. At least one of the arm transmission member 52 and the arm transmission member 54 is a wire transmission. On the one hand, the material thereof is a metal material, which can realize the environmental adaptability of the arm assembly at high temperature, can adapt to vacuum and high temperature environments, and can also be compatible with atmosphere and normal temperature environments. It can also reduce or even avoid the generation of particles when the arm assembly moves, and ensure the cleanliness in the reaction chamber 13. On the other hand, it can ensure that the joint movement freedom of the arm assembly exceeds 360°, and the rotation is flexible. It can also avoid zero drift during the movement of the arm assembly by setting a fixed connection anchor point, thereby reducing safety hazards.

[0110] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0111] All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this specification are only used to explain the relative position relationship, movement relationship, etc. between the components under a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indication will also change accordingly. The meaning of "and / or" appearing in the full text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or solutions that satisfy both A and B.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer transfer device, characterized in that: include: A support body, a driving assembly, a moving assembly, a large arm assembly, a small arm assembly and at least two end effectors; The moving assembly is in transmission connection with the supporting body, driving the supporting body to move along a first direction; The driving assembly is arranged in the supporting body and extends outward from the supporting body, driving the large arm assembly, the small arm assembly, and the at least two end effectors to rotate; The boom assembly includes a first transmission arm and a boom transmission member disposed in the first transmission arm, and the first transmission arm and the boom transmission member are both transmission-connected to the drive assembly; The small arm assembly includes a second transmission arm and a small arm transmission member arranged in the second transmission arm, the second transmission arm and the small arm transmission member are both transmission-connected to the large arm transmission member, and the at least two end effectors are both transmission-connected to the small arm transmission member; The driving assembly includes a first motor, a second motor, a third motor and a fourth motor, each of which includes a stator and a rotor arranged opposite to each other, and a transmission shaft fixedly connected to the rotor, each of which is fixedly connected to the supporting body and arranged in sequence in a direction away from the large arm assembly, and each of which is spaced and sleeved in sequence; The arm transmission member includes a first transmission member, a second transmission member and a third transmission member, and the first transmission member, the second transmission member and the third transmission member each include a first driving wheel, a first driven wheel, and a first steel wire connected between the first driving wheel and the first driven wheel; Each of the first driving wheels and the first transmission arm is respectively fixedly connected to each of the transmission shafts, and each of the first driven wheels is respectively transmission-connected to the corresponding second transmission arm and the forearm transmission member; Each of the first driving wheels includes two first rotating wheels which are sequentially stacked and fixedly connected, and each of the first driven wheels includes two second rotating wheels which are sequentially stacked and fixedly connected, and each of the second rotating wheels and the corresponding first rotating wheel form a first wheel set; The first steel wire comprises a first segment and a second segment, two ends of the first segment are respectively fixedly connected to the first rotating wheel and the second rotating wheel of one of the first wheel sets, two ends of the second segment are respectively fixedly connected to the first rotating wheel and the second rotating wheel of another of the first wheel sets, and the winding directions of the first segment and the second segment are opposite; A fixed anchor point is arranged at both ends of the first section and the second section respectively, and a tensionable anchor point is arranged in the boom transmission member, so as to perform pre-tightening by pulling.

2. The wafer transfer device according to claim 1, characterized in that: The driving assembly further comprises a sealing sleeve arranged between each stator and the corresponding rotor, and both ends of the sealing sleeve abut against the supporting body.

3. The wafer transfer device according to claim 1, characterized in that: Along the direction away from the boom assembly, the stator of the first motor, the stator of the second motor, the stator of the third motor, and the stator of the fourth motor are sequentially arranged at intervals; The transmission shaft of the first motor is sleeved outside the transmission shaft of the second motor and is fixedly connected to the first transmission arm. The transmission shaft of the second motor is sleeved outside the transmission shaft of the third motor. The transmission shaft of the third motor is sleeved outside the transmission shaft of the fourth motor. The transmission shafts of the second motor, the third motor and the fourth motor are all transmission-connected to the upper arm transmission member.

4. The wafer transfer device according to claim 1, characterized in that: Each of the first driven wheels is arranged in sequence along a direction away from the small arm assembly, and the first transmission member, the second transmission member and the third transmission member also include a first connecting rod, each of the first connecting rods is arranged in sequence at intervals, and one end is fixedly connected to the corresponding first driven wheel, and the other end is fixedly connected to the corresponding second transmission arm and the small arm transmission member.

5. The wafer transfer device according to claim 4, characterized in that: Along the direction away from the small arm assembly, the first driven wheel of the first transmission member, the first driven wheel of the second transmission member, and the first driven wheel of the third transmission member are sequentially arranged at intervals; The first connecting rod of the first transmission member is sleeved outside the first connecting rod of the second transmission member and is fixedly connected to the second transmission arm. The first connecting rod of the second transmission member is sleeved outside the first connecting rod of the third transmission member. The first connecting rod of the second transmission member and the first connecting rod of the third transmission member are both transmission-connected to the forearm transmission member.

6. The wafer transfer device according to claim 4, characterized in that: The number of the end effectors is two, the arm transmission member includes a fourth transmission member and a fifth transmission member, the fourth transmission member and the fifth transmission member each include a second driving wheel, a second driven wheel, and a second steel wire connected between the second driving wheel and the second driven wheel; The second transmission arm and each of the second driving wheels are respectively and correspondingly fixedly connected to each of the first connecting rods, and each of the second driven wheels is respectively and correspondingly connected to two of the end effectors.

7. The wafer transfer device according to claim 6, characterized in that: A transmission ratio between the second driving wheel and the second driven wheel is less than 1.

8. The wafer transfer device according to claim 6, characterized in that: The second driven wheels are arranged in sequence in a direction away from the end effector, and the fourth transmission member and the fifth transmission member also include a second connecting rod. The second connecting rods are arranged in sequence at intervals, and one end is fixedly connected to the corresponding second driven wheel, and the other end is fixedly connected to the corresponding end effector.

9. The wafer transfer device according to claim 8, characterized in that: The second driven wheel of the fourth transmission member is arranged on a side of the second driven wheel of the fifth transmission member close to the end effector, and the second connecting rod of the fourth transmission member is sleeved outside the second connecting rod of the fifth transmission member.

10. The wafer transfer device according to any one of claims 1 to 9, characterized in that: The driving assembly includes a moving support, a moving connection, a fifth motor and a lead screw; The movable connecting member is fixedly connected to the movable supporting member, and is configured as: arranged outside the reaction chamber and fixedly connected to the outer wall of the reaction chamber, the fifth motor is fixedly connected to the supporting body, the lead screw is fixedly connected to the output end of the fifth motor and is transmission-connected to the movable supporting member, and the movable supporting member is slidably connected to the supporting body.

11. The wafer transfer device according to claim 10, characterized in that: The driving assembly passes through the movable connecting piece and extends into the reaction chamber; The driving assembly further comprises a sealing bellows, which is sleeved outside the driving assembly, and whose two ends are respectively against the movable connecting member and the supporting body.

12. The wafer transfer device according to any one of claims 6 to 9, characterized in that: Each of the second driving wheels includes two third rotating wheels which are sequentially stacked and fixedly connected, and each of the second driven wheels includes two fourth rotating wheels which are sequentially stacked and fixedly connected, and each of the fourth rotating wheels and the corresponding third rotating wheel form a second wheel set; The second steel wire includes a third segment and a fourth segment, two ends of the third segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of one of the second wheel groups, and two ends of the fourth segment are respectively fixedly connected to the third rotating wheel and the fourth rotating wheel of the other second wheel group, and the winding directions of the third segment and the fourth segment are opposite.

13. The wafer transfer device according to claim 12, characterized in that: The first rotating wheel, the second rotating wheel, the third rotating wheel and the fourth rotating wheel are all provided with spiral grooves, and the first segment, the second segment, the third segment and the fourth segment are respectively located in the corresponding spiral grooves.

14. A semiconductor device, characterized in that: Comprising a wafer transfer device as described in any one of claims 1-13.

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