Wafer aging equipment

Abstract

The present invention discloses a wafer aging device, comprising a test box, wherein an upper cabinet door is installed on the upper portion of the test box through a rotating sliding assembly, the upper cabinet door, an assembly seat is installed in the test box, the assembly seat is located in the upper cabinet door, and a bottom box is provided at the lower portion of the test box, the surface of the bottom box is connected to a lower cabinet door through a hydraulic rod, and an aging component is installed in the lower cabinet door. The present invention can provide a wafer aging device, comprising a test box, characterized in that an upper cabinet door is installed on the upper portion of the test box through a rotating sliding assembly, the upper cabinet door, an assembly seat is installed in the test box, the assembly seat is located in the upper cabinet door, and a bottom box is provided at the lower portion of the test box, the surface of the bottom box is connected to a lower cabinet door through a hydraulic rod, and an aging component is installed in the lower cabinet door.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing, and in particular to a wafer aging device. Background Art

[0002] Wafer aging test is an important part of the semiconductor manufacturing process. It is mainly used to improve the reliability of the final product. The main purpose is to simulate the "ravages of time" environment to find out products that may have defects in the early stage, thereby improving the reliability of the final product. This helps to reduce the rate of manufacturing defects and ensure that semiconductor chips can maintain stable performance throughout their life cycle. According to the test requirements, the temperature, humidity, atmosphere and other parameters of the test equipment are adjusted to perform wafer aging tests. After selecting the test equipment, the test equipment needs to be debugged, including stabilizing the temperature, setting the test time, etc. The aging voltage is usually about 30% higher than the application voltage, and the aging temperature is generally between 95°C and 105°C.

[0003] A Chinese patent discloses a wafer aging test device (publication number: CN117368543A), which relates to the field of wafer testing technology. The support structure has at least one probe station located below the fixture, and the probe station has multiple first probes in contact with the wafer power-on board. At least one group of circuit switch board groups is arranged on the side of the support structure, and each group of circuit switch board groups includes at least one circuit switch board with multiple switches. However, due to design problems, when the aging test is completed, this existing wafer aging test device will cause condensation on the surface of the wafer due to the temperature difference between the inside and outside. At the same time, due to the auxiliary clamping design, the wafer cannot be in close contact with the detection board, and the installation is inconvenient, the working efficiency is low, and the heat dissipation guide is single, which is not conducive to internal heat dissipation during testing. For this reason, we propose a wafer aging device to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to overcome the current situation where, when the aging test is completed, condensation occurs on the surface of the wafer due to the temperature difference between the inside and the outside, and at the same time, due to the auxiliary clamping design, the wafer cannot be in close contact with the detection board, and the installation is inconvenient, the working efficiency is low, and the heat dissipation guide is single, which is not conducive to the deficiency of internal heat dissipation during testing. A wafer aging device is proposed.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A wafer aging device comprises a test box, wherein an upper cabinet door is installed on the upper part of the test box through a rotating sliding component, an assembly seat is installed in the test box, and the assembly seat is located in the upper cabinet door, a bottom box is provided at the lower part of the test box, and the surface of the bottom box is connected with the lower cabinet door through a hydraulic rod, an aging component is installed in the lower cabinet door, a display screen is provided on one side of the upper cabinet door, a control switch is provided at the bottom of the display screen, a test bottom plate and a heat insulation bottom plate are provided on the aging component, a clamping component and a PCB driving board are provided on the test bottom plate and the heat insulation bottom plate, the PCB driving board is located on both sides of the clamping component, aging board guide components are symmetrically provided on both sides of the front end of the clamping component, a test component is provided in the clamping component, the test component is located between the aging board guide components, and the clamping component is provided between the aging board guide components. A driving adapter plate is provided on both sides of the clamping assembly, the pin needle of the PCB driving board is electrically connected to the outer side of the driving adapter plate, the driving adapter plate extends into the clamping assembly, an aging board cover assembly is provided on the top of the test assembly, a nitrogen heating assembly is provided at the bottom of the test assembly, two inlet and outlet pipes are provided on the test assembly, the nitrogen heating assembly is connected to one of the inlet and outlet pipes, an aging PC board is provided in the aging board cover assembly, the aging PC board is electrically connected to the driving adapter plate through the pin needle, a to-be-tested piece is provided in the aging board cover assembly, after the to-be-tested piece is installed on the aging board cover assembly through the assembly seat, it is sent into the aging assembly through the aging board guide assembly, and is pressed on the test assembly through the clamping assembly for aging test.

[0007] Preferably, a heating plate body is provided on the test assembly, a wafer thermal conductive main board is provided on the top of the heating plate body, the test piece is located in the wafer thermal conductive main board, an insulating bottom board is provided at the bottom of the heating plate body, a guide rail is provided together with the insulating bottom board and one side of the heating plate body, the inlet and outlet pipes are located on both sides of the heating plate body, an air inlet pressure plate is provided at the bottom of the wafer thermal conductive main board corresponding to the inlet and outlet pipes, one of the inlet and outlet pipes connects the heated nitrogen provided by the nitrogen heating assembly through the air inlet pressure plate, and sends it into the enclosed space formed by the aging board cover assembly and the test assembly, the other inlet and outlet pipes is connected to an external vacuum pump, and the enclosed space is evacuated into a vacuum state in advance, a heating table probe is provided on one side of the heating plate body, and limit spring rods are provided at the front and rear ends of the heating plate body corresponding to the insulating bottom board.

[0008] Preferably, the aging component is also provided with a standard power supply, a heat dissipation component is provided on one side of the standard power supply, the heat dissipation component is connected to the inside of the clamping component, the heat dissipation component includes a forward fan and a baffle, the forward fan and the baffle are located on the front side of the clamping component, the forward fan and the baffle cooperate with the heat dissipation component to form a heat dissipation duct, handles are provided on the four corners of the test base plate and the heat insulation base plate, the test base plate and the heat insulation base plate are provided with an installation base plate, and the PCB driver board is installed on the installation base plate when connected to the driver adapter board.

[0009] Preferably, the heat dissipation component is provided with a rear exhaust fan, the surface of the rear exhaust fan is provided with a rear baffle net, the top of the heat dissipation component is provided with an air duct connection port, the forward fan and the baffle net and the rear exhaust fan form a heat dissipation air duct, and the air flow in the clamping component is discharged through the air duct connection port.

[0010] Preferably, the aging plate cover plate assembly is provided with a bottom guard plate, a reinforcing plate is symmetrically provided on the surface of the bottom guard plate, a mounting plate is provided at the bottom of the bottom guard plate, an aging PC board is provided inside the mounting plate, a pad is provided at the bottom of the mounting plate, an upper decorative plate is provided at the bottom of the pad, a needle card is provided inside the mounting plate, the needle card is electrically connected to the aging PC board, an aging bin upper sealing plate is provided on the needle card, and the part to be tested is installed in the aging bin upper sealing plate.

[0011] Preferably, a guide plate is provided in the aging plate guide assembly at a downward angle, a non-return wedge is provided in the guide plate, a limit plate is provided in the clamping assembly corresponding to the aging plate cover assembly, a spring plunger is installed on the limit plate, the aging plate cover assembly slides into the clamping assembly through the guide plate, the spring plunger on the limit plate is used to buffer the downward pressure on both sides of the aging plate cover assembly, and the non-return wedge is used to limit the aging plate cover assembly after it is sent in.

[0012] Preferably, the nitrogen heating assembly comprises a nitrogen heating mounting plate, a heating cover plate is mounted on the nitrogen heating mounting plate, a delivery pipe is arranged inside the heating cover plate, a heating coil is wound around the delivery pipe, both ends of the delivery pipe extend to the outside of the heating cover plate and are connected with connectors, a heating pipe support block is arranged on the top of the nitrogen heating mounting plate corresponding to the delivery pipe, and the delivery pipe is fixed inside the heating cover plate through the heating pipe support block.

[0013] Preferably, a guide slide groove is provided on the test box corresponding to the upper cabinet door, a translation shaft is installed in the guide slide groove, the guide slide groove is installed in the guide slide groove through a connecting groove, and a door rotating block is connected to the translation shaft. When the upper cabinet door is rotated to be vertical to the test box through the translation shaft, the upper cabinet door is pushed and sent into the test box through the guide slide groove, and the door rotating block is used to contact the outer inner frame of the upper cabinet door to prevent the upper cabinet door from entering the test box completely. When the upper cabinet door is pulled out, the door rotating block is used to contact the inner frame of the upper cabinet door to prevent the upper cabinet door from being pulled out of the test box completely, and then it is rotated back to the surface of the test box through the translation shaft.

[0014] Preferably, an air supply assembly is provided in the clamping assembly, a clamping cylinder is connected to the air supply assembly, the clamping cylinder is located at the four corners of the bottom of the clamping assembly, a clamping plate is provided at the bottom of the clamping cylinder, and the bottom of the clamping plate abuts against the top of the aging plate cover assembly.

[0015] Preferably, two heating platform pads are symmetrically arranged at the bottom of the insulating base plate, and the bottom of the heating platform pad is installed on the test base plate and the thermal insulation base plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The enclosed space is first evacuated into a vacuum state through one of the air inlet and outlet pipes, and then the heated nitrogen provided by the nitrogen heating component is connected through the air inlet pressure plate and sent into the enclosed space formed by the aging board cover assembly and the test assembly to heat the wafers for internal aging test with nitrogen, so as to avoid condensation on the wafer surface due to the temperature difference between the inside and the outside when the existing wafer aging test is completed;

[0018] 2. Through the coordinated use of the clamping assembly and the aging board cover assembly and other components, the test piece is installed on the aging board cover assembly through the assembly seat, and then sent into the aging assembly through the aging board guide assembly, and is pressed on the test assembly by the clamping assembly to perform the aging test, ensuring that the wafer is in close contact with the wafer thermal conductive mainboard, thereby improving the efficiency of the aging test;

[0019] 3. Through the coordinated use of heat dissipation components, forward fans, baffles, and clamping components, the heat dissipation air duct composed of the forward fans, baffles, and rear exhaust fans is used to discharge the hot air generated by the aging test in the clamping component through the air duct connection port;

[0020] 4. Through the coordinated use of PCB driver board, driver adapter board, aging PC board and other components, the PCB driver is connected to the pin card in the aging board cover assembly through the driver adapter board to perform aging test on the DUT on the wafer thermal conductive mainboard. At the same time, the test data is transmitted to the display screen on the surface of the test box through the aging PC board and other components in the aging board cover assembly for display.

[0021] To summarize, the present invention can provide that after the part to be tested is installed on the aging board cover assembly through the assembly seat, it is sent into the aging assembly through the aging board guide assembly, and is pressed on the test assembly through the pressing assembly to perform an aging test, thereby ensuring that the wafer is in close contact with the wafer thermal conductive mainboard, improving the aging test efficiency, and having the advantage of simple process. The closed space is first evacuated into a vacuum state through one of the inlet and outlet air pipes, and then the heated nitrogen provided by the nitrogen heating assembly is connected through the air inlet pressure plate and sent into the closed space formed by the aging board cover assembly and the test assembly, so as to perform nitrogen heating on the wafer under the internal aging test, thereby avoiding the situation where condensation on the wafer surface occurs due to the temperature difference between the inside and the outside when the existing wafer aging test is completed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an overall schematic diagram of a wafer aging device proposed by the present invention;

[0023] Figure 2 A schematic diagram of opening the upper cabinet door of a wafer aging device proposed by the present invention;

[0024] Figure 3 A schematic diagram of the upper cabinet door of a wafer aging device proposed by the present invention being retracted;

[0025] Figure 4 A schematic diagram of retracting the upper cabinet door of a wafer aging device proposed by the present invention;

[0026] Figure 5 For the present invention Figure 4 A is an enlarged schematic diagram;

[0027] Figure 6 A schematic diagram of an aging component and connecting parts of a wafer aging device proposed by the present invention;

[0028] Figure 7 A partial schematic diagram of an aging component of a wafer aging device proposed by the present invention;

[0029] Figure 8 A schematic diagram of an aging board cover assembly and a test assembly of a wafer aging device proposed by the present invention;

[0030] Fig. 9 A schematic diagram of the bottom surface of an aging plate cover assembly of a wafer aging device proposed by the present invention;

[0031] Fig.10 This is a schematic diagram of the assembly of an aging plate cover plate assembly of a wafer aging device proposed by the present invention;

[0032] Fig.11 For the present invention Figure 7The enlarged schematic diagram of point B in FIG.

[0033] Fig.12 The nitrogen heating component of a wafer aging device proposed by the present invention is intended;

[0034] Fig.13 This is a schematic diagram of the assembly of a nitrogen heating component of a wafer aging device proposed by the present invention.

[0035] In the figure: 10, test box; 11, bottom box;

[0036] 20. Upper cabinet door; 201. Lower cabinet door; 21. Guide slide; 22. Translation shaft; 23. Assembly bin; 24. Connection slot; 25. Door rotating block; 26. Assembly seat;

[0037] 30. Display screen; 31. Control switch;

[0038] 40. Aging components; 41. Standard power supply; 42. Handle; 43. PCB driver board; 44. Installation base plate; 45. Driver adapter board; 46. Test base plate and thermal insulation base plate;

[0039] 50. Heat dissipation assembly; 51. Front fan and baffle; 52. Air duct connection port; 53. Rear exhaust fan; 54. Rear baffle;

[0040] 60. Clamping assembly; 61. Air supply assembly; 62. Clamping cylinder; 63. Clamping plate; 64. Aging plate guide assembly; 641. Guide plate; 642. Check wedge; 643. Limiting plate; 644. Spring plunger;

[0041] 70. Test assembly; 71. Wafer heat conduction main board; 72. Air inlet pressure plate; 73. Guide rail; 74. Heating table probe; 75. Heating plate body; 76. Air inlet and outlet pipes; 77. Limit spring rod; 78. Insulating bottom plate; 79. Heating table pad;

[0042] 80. Aging board cover assembly; 81. Bottom guard plate; 82. Reinforcement plate; 83. Aging chamber upper cover plate; 84. Aging PC board; 85. Mounting plate; 86. Pad plate; 87. Upper decorative plate; 88. Needle card;

[0043] 90. Nitrogen heating assembly; 91. Nitrogen heating mounting plate; 92. Connector; 93. Heating cover plate; 94. Delivery pipe; 95. Heating coil; 96. Heating tube support block;

[0044] 100. Parts to be tested. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the embodiments of the specification.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0047] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0048] Unless otherwise specified, the raw materials used in the examples were purchased commercially.

[0049] like Figure 1-Figure 13 As shown, a wafer aging device disclosed in the present application comprises a test box 10, an upper cabinet door 20 is installed on the upper part of the test box 10 through a rotating sliding assembly, an assembly seat 26 is installed in the upper cabinet door 20, and the assembly seat 26 is located in the upper cabinet door 20. A bottom box 11 is provided at the lower part of the test box 10, and a lower cabinet door 201 is connected to the surface of the bottom box 11 through a hydraulic rod. An aging component 40 is installed in the lower cabinet door 201, a display screen 30 is provided on one side of the upper cabinet door 20, and a control switch 31 is provided at the bottom of the display screen 30. A test bottom plate and a heat insulation bottom plate 46 are provided on the aging component 40, and a clamping component 60 and a PCB driving board 43 are provided on the test bottom plate and the heat insulation bottom plate 46. The PCB driving board 43 is located on both sides of the clamping component 60, and the front ends of the clamping component 60 are opposite to each other. An aging board guide assembly 64 is provided, and a test assembly 70 is provided in the clamping assembly 60. The test assembly 70 is located between the aging board guide assemblies 64. Drive adapter plates 45 are provided on both sides of the clamping assembly 60. The pin needle of the PCB drive board 43 is electrically connected to the outer side of the drive adapter plate 45. The drive adapter plate 45 extends into the clamping assembly 60. An aging board cover assembly 80 is provided on the top of the test assembly 70. A nitrogen heating assembly 90 is provided at the bottom of the test assembly 70. Two air inlet and outlet pipes 76 are provided on the test assembly 70. The nitrogen heating assembly 90 is connected to one of the air inlet and outlet pipes 76. An aging PC board 84 is provided in the aging board cover assembly 80. The aging PC board 84 is electrically connected to the drive adapter plate 45 through the pin needle. A component to be tested 100 is provided in the aging board cover assembly 80.

[0050] In the above embodiment, the upper cabinet door 20 is opened, and after the piece to be tested 100 is installed on the aging board cover assembly 80 through the assembly seat 26, the lower cabinet door 201 is opened, and it is sent into the aging assembly 40 through the aging board guide assembly 64, and is pressed on the test assembly 70 by the clamping assembly 60 to perform an aging test on the wafer piece to be tested 100.

[0051] Among them, the test box 10 is provided with a guide slot 21 corresponding to the upper cabinet door 20, and a translation shaft 22 is installed in the guide slot 21. The guide slot 21 is installed in the guide slot 21 through the connecting slot 24, and a door rotating block 25 is connected to the translation rotating shaft 22. When the upper cabinet door 20 is rotated to be vertical to the test box 10 through the translation rotating shaft 22, the upper cabinet door 20 is pushed and sent into the test box 10 through the guide slot 21, and the door rotating block 25 is used to resist the outer inner frame of the upper cabinet door 20 to prevent the upper cabinet door 20 from entering the test box 10 completely. When the upper cabinet door 20 is pulled out, the door rotating block 25 is used to resist the inner frame of the upper cabinet door 20 to prevent the upper cabinet door 20 from being pulled out of the test box 10 completely, and then it is rotated back to the surface of the test box 10 through the translation rotating shaft 22. Compared with the traditional rotation to open the test cabinet door, this design effectively stores the cabinet door into the test equipment, avoids the collision between the aging cover and the cabinet door, and facilitates the subsequent aging test.

[0052] like Figure 6-Figure 8 As shown, in a preferred embodiment, a standard power supply 41 is also provided on the aging component 40 to provide and control power during the aging test. A heat dissipation component 50 is provided on one side of the standard power supply 41. The heat dissipation component 50 is internally connected to the clamping component 60. The heat dissipation component 50 includes a forward fan and a baffle 51. The forward fan and the baffle 51 are located on the front side of the clamping component 60. The forward fan and the baffle 51 cooperate with the heat dissipation component 50 to form a heat dissipation air duct. Handles 42 are provided on the four corners of the test base plate and the heat insulation base plate 46. A mounting base plate 44 is provided on the test base plate and the heat insulation base plate 46. The PCB drive board 43 is installed on the mounting base plate 44 when connected to the drive adapter board 45.

[0053] In the above embodiment, a rear exhaust fan 53 is provided on the heat dissipation component 50, a rear baffle 54 is provided on the surface of the rear exhaust fan 53, an air duct connection port 52 is provided on the top of the heat dissipation component 50, a heat dissipation air duct composed of a forward fan and a baffle 51 and the rear exhaust fan 53, the air flow in the compression component 60 is discharged through the air duct connection port 52, the heat dissipation air duct is L-shaped in the device, and the principle of hot air rising is used, even if the heat dissipation fan is damaged, the hot air can be discharged from the device through the front air pressure, and the hot air can be discharged more effectively with the heat dissipation fan, the nitrogen heating component 90 includes a nitrogen heating mounting plate 91, a heating cover plate 93 is installed on the nitrogen heating mounting plate 91, and the heating cover plate A delivery pipe 94 is provided in 93, and a heating coil 95 is wound on the delivery pipe 94. Both ends of the delivery pipe 94 extend to the outside of the heating cover plate 93 and are connected to a connector 92. A heating pipe support block 96 is provided on the top of the nitrogen heating mounting plate 91 corresponding to the delivery pipe 94. The delivery pipe 94 is fixed in the heating cover plate 93 through the heating pipe support block 96. Two heating table pads 79 are symmetrically provided at the bottom of the insulating bottom plate 78. The bottom of the heating table pad 79 is installed on the test bottom plate and the insulating bottom plate 46 to perform nitrogen heating on the wafers undergoing the internal aging test, so as to avoid condensation on the wafer surface due to the temperature difference between the inside and the outside when the existing wafer aging test is completed.

[0054] like Figure 8-Figure 10 As shown, in a preferred embodiment, a heating plate body 75 is provided on the test assembly 70, a wafer heat-conducting main board 71 is provided on the top of the heating plate body 75, the test piece 100 is located in the wafer heat-conducting main board 71, an insulating bottom plate 78 is provided at the bottom of the heating plate body 75, and a guide bar 73 is provided on the insulating bottom plate 78 and one side of the heating plate body 75, and the inlet and outlet pipes 76 are located on both sides of the heating plate body 75, and an air inlet pressure plate 72 is provided at the bottom of the wafer heat-conducting main board 71 corresponding to the inlet and outlet pipes 76. One of the inlet and outlet pipes 76 connects the heated nitrogen provided by the nitrogen heating assembly 90 through the inlet pressure plate 72 and sends it into the enclosed space formed by the aging board cover assembly 80 and the test assembly 70, and the other inlet and outlet pipe 76 is connected to an external vacuum pump to first evacuate the enclosed space into a vacuum state, a heating table probe 74 is provided on one side of the heating plate body 75, and limit spring rods 77 are provided at the front and rear ends of the heating plate body 75 corresponding to the insulating bottom plate 78.

[0055] In the above embodiment, a bottom guard plate 81 is provided on the aging board cover plate assembly 80, a reinforcing plate 82 is symmetrically provided on the surface of the bottom guard plate 81, a mounting plate 85 is provided at the bottom of the bottom guard plate 81, an aging PC board 84 is provided in the mounting plate 85, a pad 86 is provided at the bottom of the mounting plate 85, an upper decorative plate 87 is provided at the bottom of the pad 86, a needle card 88 is provided in the mounting plate 85, the needle card 88 is electrically connected to the aging PC board 84, an aging chamber upper sealing plate 83 is provided on the needle card 88, and the test piece 100 is installed in the aging chamber upper sealing plate 83 for aging test.

[0056] In a preferred embodiment, a guide plate 641 is provided in the aging plate guide assembly 64, which is inclined downward, and a check wedge 642 is provided in the guide plate 641. A limit plate 643 is provided in the clamping assembly 60 corresponding to the aging plate cover assembly 80. A spring plunger 644 is installed on the limit plate 643. The aging plate cover assembly 80 slides into the clamping assembly 60 through the guide plate 641, and the spring plunger 644 on the limit plate 643 is used to buffer the downward pressure on both sides of the aging plate cover assembly 80. The check wedge 642 limits the aging plate cover assembly 80 after it is sent in. An air supply assembly 61 is provided in the clamping assembly 60, and a clamping cylinder 62 is connected to the air supply assembly 61. The clamping cylinder 62 is located at the four bottom corners of the clamping assembly 60. A clamping plate 63 is provided at the bottom of the clamping cylinder 62, and the bottom of the clamping plate 63 abuts against the top of the aging plate cover assembly 80.

[0057] In the above embodiment, a guide slot 21 is provided on the test box 10 corresponding to the upper cabinet door 20, and a translation shaft 22 is installed in the guide slot 21. The guide slot 21 is installed in the guide slot 21 through the connecting slot 24, and a door rotating block 25 is connected to the translation shaft 22. When the upper cabinet door 20 is rotated to be vertical to the test box 10 through the translation shaft 22, the upper cabinet door 20 is pushed and sent into the test box 10 through the guide slot 21, and the door rotating block 25 is used to resist the outer inner frame of the upper cabinet door 20 to prevent the upper cabinet door 20 from entering the test box 10 completely. When the upper cabinet door 20 is pulled out, the door rotating block 25 is used to resist the inner frame of the upper cabinet door 20 to prevent the upper cabinet door 20 from being pulled out of the test box 10 completely, and then it is rotated back to the surface of the test box 10 through the translation shaft 22.

[0058] In summary, the present invention can provide that after the test piece 100 is installed on the aging board cover assembly 80 through the assembly seat 26, it is sent into the aging assembly 40 through the aging board guide assembly 64, and is pressed on the test assembly 70 through the pressing assembly 60 to perform an aging test, thereby ensuring that the wafer is in close contact with the wafer thermal conductive main board 71, thereby improving the aging test efficiency, and has the advantage of simple process. The closed space is first evacuated into a vacuum state through one of the inlet and outlet air pipes 76, and then the heated nitrogen provided by the nitrogen heating assembly 90 is connected through the air inlet pressure plate 72 and sent into the closed space formed by the aging board cover assembly 80 and the test assembly 70, so as to perform nitrogen heating on the wafer for the internal aging test, thereby avoiding the situation where condensation and water are present on the wafer surface due to the temperature difference between the inside and the outside when the existing wafer aging test is completed.

[0059] It should be noted that the above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and the description in the specification are only to illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer aging device, comprising a test box, characterized in that: An upper cabinet door is installed on the upper part of the test box through a rotating sliding component, an assembly seat is installed in the test box, and the assembly seat is located in the upper cabinet door. A bottom box is provided at the lower part of the test box, and the surface of the bottom box is connected to the lower cabinet door through a hydraulic rod. An aging component is installed in the lower cabinet door, a display screen is provided on one side of the upper cabinet door, and a control switch is provided at the bottom of the display screen. A test bottom plate and a heat insulation bottom plate are provided on the aging component, and a clamping component and a PCB drive board are provided on the test bottom plate and the heat insulation bottom plate. The PCB drive board is located on both sides of the clamping component, and aging board guide components are symmetrically provided on both sides of the front end of the clamping component. A test component is provided in the clamping component, and the test component is located between the aging board guide components. A driving adapter plate is provided on both sides of the clamping assembly, the pin needle of the PCB driving board is electrically connected to the outer side of the driving adapter plate, the driving adapter plate extends into the clamping assembly, an aging board cover assembly is provided on the top of the test assembly, a nitrogen heating assembly is provided at the bottom of the test assembly, two air inlet and outlet pipes are provided on the test assembly, the nitrogen heating assembly is connected to one of the air inlet and outlet pipes, an aging PC board is provided in the aging board cover assembly, the aging PC board is electrically connected to the driving adapter plate through a pin needle, a heating plate body is provided on the test assembly, a wafer heat-conducting main board is provided on the top of the heating plate body, the test piece is located in the wafer heat-conducting main board, an insulating bottom plate is provided at the bottom of the heating plate body, and the insulating bottom plate is connected to the heating A guide rail is provided on one side of the hot plate body, the air inlet and outlet pipes are located on both sides of the hot plate body, an air inlet pressure plate is provided at the bottom of the wafer heat-conducting main board corresponding to the air inlet and outlet pipes, one of the air inlet and outlet pipes connects the heated nitrogen provided by the nitrogen heating component through the air inlet pressure plate, and sends it into the closed space formed by the aging board cover assembly and the test assembly, the other air inlet and outlet pipes are connected to an external vacuum pump, and the closed space is evacuated into a vacuum state in advance, a heating table probe is provided on one side of the hot plate body, and limit spring rods are provided at the front and rear ends of the hot plate body corresponding to the insulating bottom plate, a bottom guard plate is provided on the aging board cover assembly, a reinforcing plate is symmetrically provided on the surface of the bottom guard plate, a mounting plate is provided at the bottom of the bottom guard plate, an aging PC board is provided in the mounting plate, and the A pad is provided at the bottom of the mounting plate, an upper decorative plate is provided at the bottom of the pad, a needle card is provided in the mounting plate, the needle card is electrically connected to the aging PC board, an aging bin upper cover plate is provided on the needle card, the part to be tested is installed in the aging bin upper cover plate, a guide plate is provided in the aging plate guide assembly which is tilted downward, a non-return wedge is provided in the guide plate, a limiting plate is provided in the clamping assembly corresponding to the aging plate cover assembly, a spring plunger is installed on the limiting plate, the aging plate cover assembly slides into the clamping assembly through the guide plate, the spring plunger on the limiting plate is used to buffer the downward pressure on both sides of the aging plate cover assembly, the non-return wedge is used to limit the aging plate cover assembly after it is sent in, and the part to be tested is provided in the aging plate cover assembly,After the test piece is installed on the aging board cover assembly through the assembly seat, it is sent into the aging assembly through the aging board guide assembly, and is pressed on the test assembly through the pressing assembly to perform the aging test.

2. The wafer aging equipment according to claim 1, characterized in that: A standard power supply is also provided on the aging component, a heat dissipation component is provided on one side of the standard power supply, the heat dissipation component is connected to the inside of the clamping component, the heat dissipation component includes a forward fan and a baffle, the forward fan and the baffle are located on the front side of the clamping component, the forward fan and the baffle cooperate with the heat dissipation component to form a heat dissipation duct, handles are provided on the four corners of the test base plate and the heat insulation base plate, the test base plate and the heat insulation base plate are provided with an installation base plate, and the PCB driver board is installed on the installation base plate when connected to the driver adapter board.

3. The wafer aging equipment according to claim 2, characterized in that: The heat dissipation component is provided with a rear exhaust fan, the surface of the rear exhaust fan is provided with a rear baffle, the top of the heat dissipation component is provided with an air duct connection port, the forward fan and the baffle and the rear exhaust fan form a heat dissipation air duct, and the air flow in the clamping component is discharged through the air duct connection port.

4. The wafer aging equipment according to claim 3, characterized in that: The nitrogen heating assembly includes a nitrogen heating mounting plate, a heating cover plate is mounted on the nitrogen heating mounting plate, a delivery pipe is arranged inside the heating cover plate, a heating coil is wound around the delivery pipe, both ends of the delivery pipe extend to the outside of the heating cover plate and are connected with connectors, a heating pipe support block is arranged on the top of the nitrogen heating mounting plate corresponding to the delivery pipe, and the delivery pipe is fixed in the heating cover plate through the heating pipe support block.

5. The wafer aging equipment according to claim 4, characterized in that: A guide slide is provided on the test box corresponding to the upper cabinet door, a translation shaft is installed in the guide slide, the guide slide is installed in the guide slide through a connecting groove, and a door rotating block is connected to the translation shaft. When the upper cabinet door is rotated to be vertical to the test box through the translation shaft, the upper cabinet door is pushed and sent into the test box through the guide slide, and the door rotating block is used to contact the outer inner frame of the upper cabinet door to prevent the upper cabinet door from entering the test box completely. When the upper cabinet door is pulled out, the door rotating block is used to contact the inner frame of the upper cabinet door to prevent the upper cabinet door from being pulled out of the test box completely, and then it is rotated back to the surface of the test box through the translation shaft.

6. The wafer aging equipment according to claim 5, characterized in that: An air supply assembly is provided in the clamping assembly, and a clamping cylinder is connected to the air supply assembly. The clamping cylinder is located at the four corners of the bottom of the clamping assembly. A clamping plate is provided at the bottom of the clamping cylinder, and the bottom of the clamping plate abuts against the top of the aging plate cover assembly.

7. The wafer aging equipment according to claim 6, characterized in that: Two heating platform pads are symmetrically arranged at the bottom of the insulating bottom plate, and the bottom of the heating platform pad is installed on the test bottom plate and the heat-insulating bottom plate.

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