Test rack for semiconductor packaging test

Abstract

The present invention discloses a test stand for semiconductor packaging testing, including a test base, a control component, a support foot, a detection mold, a support plate, a fixed plate, a cylinder, a mounting plate, and a test component, wherein the control component is arranged at one end of the test base, the support foot is fixedly connected to the bottom of the test base, the detection mold is installed inside the test base, the support plate is fixedly connected to the top of the test base, the fixed plate is fixedly connected to the top of the support plate, the cylinder is fixedly connected to the top of the fixed plate, the mounting plate is pneumatically lifted and connected to the bottom of the cylinder, and the test component is installed at one end of the mounting plate. The present invention drives the moving rod to move by meshing the moving rod, adjusts the position of the clamping block, and installs and fixes the detection equipment by adjusting the position of the clamping block, simplifies the installation steps, and improves the efficiency of replacing the detection equipment.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to a test rack for semiconductor packaging testing. Background Art

[0002] Semiconductor packaging refers to the process of packaging and protecting semiconductor chips produced through a series of semiconductor manufacturing processes (such as photolithography, etching, doping, etc.) so that they can work normally in various electronic devices. Semiconductor chips are very fragile and are easily affected by dust, moisture, static electricity, mechanical stress and other factors in the external environment. Packaging can provide a solid shell for the chip to prevent these factors from damaging the chip and ensure the stability and reliability of the chip. The package contains various pins, leads and other structures, which can connect the circuit on the chip with the external circuit to realize signal transmission and power supply. Good packaging design can ensure the quality of signal transmission and reduce signal interference and loss.

[0003] According to the authorization announcement number CN213304095U, a test stand for semiconductor packaging testing is disclosed, including a support body, a translation block and a position control mechanism; an auxiliary block is provided on one side of the support body, the translation block is slidably connected to the support body, and the position control mechanism is located between the translation block and the auxiliary block; the two inclined surfaces of the first isosceles trapezoidal block are respectively slidably matched with the inclined surface A and the inclined surface C, and the two inclined surfaces of the second isosceles trapezoidal block are respectively slidably matched with the inclined surface B and the inclined surface D; the two ends of the bidirectional screw are respectively threadedly connected with the first nut and the second nut; the fixed block is provided with a first step groove along the length direction on the side close to the auxiliary block, and the translation block is provided with a second step groove along the length direction on the side close to the fixed block. The above application facilitates the adjustment of the distance between the translation block and the fixed block by rotating the bidirectional screw, so that semiconductors of various specifications can be placed between the translation block and the fixed block for limiting or clamping, thereby improving practicality.

[0004] However, the above device still has shortcomings. The adjustable translation block is used to facilitate the clamping of semiconductors of different specifications. However, for semiconductor chip detection, in order to improve the efficiency of semiconductor detection, corresponding detection needles are set for the circuits of the semiconductor chip to ensure the efficiency of the detection. Therefore, semiconductor detection molds and detection needles that can be quickly replaced are needed to improve the efficiency of the detection and facilitate the use of semiconductor chips of different specifications.

[0005] Therefore, it is necessary to design a test rack for semiconductor packaging testing that is highly practical and capable of quickly replacing semiconductor inspection molds and inspection needles. Summary of the invention

[0006] The object of the present invention is to provide a test stand for semiconductor packaging testing to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: a test stand for semiconductor packaging testing, comprising a test base, a control component, a support foot, a detection mold, a support plate, a fixing plate, a cylinder, a mounting plate, a mounting plate and a test component, wherein the control component is arranged at one end of the test base, the support foot is fixedly connected to the bottom of the test base, the detection mold is installed inside the test base, the support plate is fixedly connected to the top of the test base, the fixing plate is fixedly connected to the top of the support plate, the cylinder is fixedly connected to the top of the fixing plate, the mounting plate is pneumatically lifted and connected to the bottom of the cylinder, and the test component is installed at one end of the mounting plate.

[0008] The test component comprises a fixed detection piece and a detection device, wherein the fixed detection piece is arranged inside the mounting plate, and the detection device is arranged at the bottom of the fixed detection piece.

[0009] According to the above technical solution, the test base includes a frame, a bracket, mold pins, mounting holes, a heat dissipation groove and a hair dryer. The bracket is fixedly connected to the inner side of the frame, the mold pins are arranged at one end of the top of the bracket, the mounting hole is opened inside the bracket, the heat dissipation groove is opened inside the frame, and the hair dryer is installed inside the frame and is located on one side of the heat dissipation groove. Through the arrangement of the bracket and the mold pins, the detection mold can be installed on the bracket, and then connected and fixed through the mounting holes. With the help of the hair dryer blowing air to the heat dissipation groove, the chip of the semiconductor package to be detected can be cooled to maintain the normal temperature of the detection.

[0010] According to the above technical solution, the detection mold includes a mold block, a placement groove, a semiconductor test pin, a detection circuit board and a magnet block. The placement groove is opened at the top of the mold block, the semiconductor test pin is arranged at one end of the placement groove, the detection circuit board is fixedly connected to the inside of the mold block and is located below the semiconductor test pin, and the magnet block is installed on the outside of the inside of the mold block. By using the placement groove to place the semiconductor packaged chip, it is convenient to test the semiconductor package. The detection mold can also be quickly replaced according to the packaging specifications of different semiconductor chips in combination with the test base.

[0011] According to the above technical scheme, the fixed detection component includes an installation frame, a rotating block, a connecting rod, a gear block, a moving rod, a clamping block and a clamping cylinder. The installation frame is fixedly connected to the inside of one end of the mounting plate, the rotating block is rotatably connected to the top of the installation frame, the connecting rod is fixedly connected to the bottom of the rotating block and is located inside the installation frame, the gear block is fixedly connected to the bottom of the connecting rod, the moving rod is meshingly connected to one side of the gear block, the clamping block is fixedly connected to one end of the moving rod and is located at the bottom of the outer end of the installation frame, and the clamping cylinder is arranged at the bottom inside the installation frame. By the rotation of the rotating block and the transmission of the connecting rod, the gear block is driven to rotate, and by the meshing of the moving rod, the moving rod is driven to move, and the position of the clamping block is adjusted. By adjusting the position of the clamping block, the detection equipment is installed and fixed, the installation steps are simplified, and the efficiency of replacing the detection equipment is improved.

[0012] According to the above technical solution, the detection device includes a mounting block, a cylindrical block, a spring, a clamping block, a fixed groove, a connecting plate and a detection needle. The cylindrical block is fixedly connected to the top of the mounting block, the spring is arranged inside the cylindrical block, the clamping block is fixedly connected to both ends of the spring, the fixed groove is opened at both ends of the mounting block, the connecting plate is fixedly connected to the bottom of the mounting block, and the detection needle is fixedly connected to the bottom of the connecting plate. The clamping block, the cylindrical block and the clamping tube are clamped together to quickly fix the detection device and the fixed detection part, and then the clamping block is used to clamp and fix the fixed groove, thereby increasing the fixation and stability of the detection device and ensuring the use effect.

[0013] According to the above technical solution, slide grooves are provided at both ends of the cylindrical block, and the interior of the slide grooves is slidably connected to the two ends of the clamping block, so that the clamping block can move inside the cylindrical block and cooperate with the action of the spring to fix the clamping tube.

[0014] According to the above technical solution, holes are provided at both ends of the clamping tube, and the size of the holes is consistent with the size of the clamping block, thereby ensuring the clamping fixing effect.

[0015] According to the above technical solution, semicircular grooves are arranged on the top of the frame, respectively arranged at the two ends above the bracket, and the detection mold can be quickly taken out through the two semicircular grooves, which is convenient for replacing the template of the detection mold.

[0016] According to the above technical solution, a magnetic block is provided at the bottom of the bracket, which cooperates with the magnet block inside the frame body for magnetic fixation to ensure that the frame body and the detection mold are firmly fixed.

[0017] According to the above technical solution, the size of the connecting plate is consistent with the size of the detection mold, thereby ensuring the detection effect on the semiconductor package.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0019] 1. The present invention can install the detection mold on the bracket through the arrangement of the bracket and the mold pins, and then connect and fix it through the mounting holes. With the help of a hair dryer blowing air to the heat dissipation groove, the chip of the semiconductor package can be cooled to maintain the normal temperature of the detection.

[0020] 2. The present invention uses a placement slot to place semiconductor packaged chips, thereby facilitating testing of semiconductor packaging. The detection mold and the test base can also be quickly replaced according to different semiconductor chip packaging specifications.

[0021] 3. The present invention drives the moving rod to move by meshing the moving rod, adjusts the position of the clamping block, and installs and fixes the detection equipment by adjusting the position of the clamping block, thereby simplifying the installation steps and improving the efficiency of replacing the detection equipment.

[0022] 4. The present invention is used to quickly fix the detection equipment and the fixed detection part by clamping the clamping block, the cylindrical block and the clamping tube, and then the clamping block is used to clamp and fix the fixed groove, thereby increasing the fixation of the detection equipment and ensuring the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0024] In the attached picture:

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the structure of the test base of the present invention;

[0027] Figure 3 It is a schematic diagram of the internal structure of the test base of the present invention;

[0028] Figure 4 It is a structural schematic diagram of the detection mold of the present invention;

[0029] Figure 5 It is a schematic diagram of the structure of the test component of the present invention;

[0030] Figure 6 It is a schematic diagram of the structure of the fixed detection member of the present invention;

[0031] Figure 7 It is a schematic diagram of the structure of the detection device of the present invention.

[0032] In the figure: 1, test base; 2, control component; 3, support foot; 4, detection mold; 5, support plate; 6, fixed plate; 7, cylinder; 8, mounting plate; 9, test component; 101, frame; 102, bracket; 103, mold pin; 104, mounting hole; 105, heat sink; 106, hair dryer; 401, mold block; 402, placement slot; 403, semiconductor test pin; 404, detection circuit board; 405, magnet block; 201, fixed detection part; 202, detection equipment; 210, installation frame; 211, rotating block; 212, connecting rod; 213, gear block; 214, moving rod; 215, clamping block; 216, clamping cylinder; 220, installation block; 221, cylinder block; 222, spring; 223, clamping block; 224, fixed groove; 225, connecting plate; 226, detection needle. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-7 The present invention provides the following technical solutions: a test stand for semiconductor packaging testing, comprising a test base 1, a control component 2, a support leg 3, a detection mold 4, a support plate 5, a fixing plate 6, a cylinder 7, a mounting plate 8 and a test component 9, wherein the control component 2 is arranged at one end of the test base 1, the support leg 3 is fixedly connected to the bottom of the test base 1, the detection mold 4 is installed inside the test base 1, the support plate 5 is fixedly connected to the top of the test base 1, the fixing plate 6 is fixedly connected to the top of the support plate 5, the cylinder 7 is fixedly connected to the top of the fixing plate 6, the mounting plate 8 is pneumatically lifted and connected to the bottom of the cylinder 7, and the test component 9 is installed at one end of the mounting plate 8.

[0035] The testing component 9 includes a fixed detection member 201 and a detection device 202 . The fixed detection member 201 is arranged inside the mounting plate 8 , and the detection device 202 is arranged at the bottom of the fixed detection member 201 .

[0036] The test base 1 includes a frame 101, a bracket 102, a mold pin 103, a mounting hole 104, a heat dissipation groove 105 and a hair dryer 106. The bracket 102 is fixedly connected to the inner side of the frame 101, the mold pin 103 is arranged at one end of the top of the bracket 102, the mounting hole 104 is opened in the bracket 102, the heat dissipation groove 105 is opened in the frame 101, and the hair dryer 106 is installed in the frame 101 and is located on one side of the heat dissipation groove 105. Through the arrangement of the bracket 102 and the mold pin 103, the detection mold 4 can be installed on the bracket 102, and then connected and fixed through the mounting hole 104. With the blowing of the hair dryer 106 to the heat dissipation groove 105, the chip of the semiconductor package to be detected can be cooled to maintain the normal temperature of the detection. Semicircular grooves are arranged on the top of the frame 101, which are respectively arranged at the two ends above the bracket 102. The detection mold 4 can be quickly taken out through the two semicircular grooves, which is convenient for replacing the template of the detection mold 4.

[0037] The detection mold 4 includes a mold block 401, a placement groove 402, a semiconductor test pin 403, a detection circuit board 404 and a magnet block 405. The placement groove 402 is opened at the top of the mold block 401, and the semiconductor test pin 403 is arranged at one end of the placement groove 402. The detection circuit board 404 is fixedly connected to the inside of the mold block 401 and is located below the semiconductor test pin 403. The magnet block 405 is installed on the outside of the mold block 401. By using the placement groove 402 to place the semiconductor packaged chip, it is convenient to test the semiconductor package. The detection mold 4 can be quickly replaced according to the packaging specifications of different semiconductor chips in conjunction with the test base 1. A magnetic suction block is arranged at the bottom of the bracket 102, which is magnetically fixed in conjunction with the magnet block 405 inside the frame 101 to ensure that the frame 101 and the detection mold 4 are firmly fixed.

[0038] The fixed detection member 201 includes a mounting frame 210, a rotating block 211, a connecting rod 212, a gear block 213, a moving rod 214, a clamping block 215 and a clamping tube 216. The mounting frame 210 is fixedly connected to the inside of one end of the mounting plate 8, the rotating block 211 is rotatably connected to the top of the mounting frame 210, the connecting rod 212 is fixedly connected to the bottom of the rotating block 211 and is located inside the mounting frame 210, the gear block 213 is fixedly connected to the bottom of the connecting rod 212, the moving rod 214 is meshed and connected to one side of the gear block 213, and the clamping block 215 is clamped to the mounting frame 216. Block 215 is fixedly connected to one end of the moving rod 214 and is located at the bottom of one end outside the installation frame 210. The clamping tube 216 is arranged at the bottom inside the installation frame 210. The rotating block 211 is rotated and the connecting rod 212 is transmitted to drive the gear block 213 to rotate. The moving rod 214 is engaged and driven to move, and the position of the clamping block 215 is adjusted. By adjusting the position of the clamping block 215, the detection device 202 is installed and fixed, which simplifies the installation steps and improves the efficiency of replacing the detection device 202.

[0039] The detection device 202 includes a mounting block 220, a cylindrical block 221, a spring 222, a clamping block 223, a fixing groove 224, a connecting plate 225 and a detection needle 226. The cylindrical block 221 is fixedly connected to the top of the mounting block 220, the spring 222 is arranged inside the cylindrical block 221, the clamping block 223 is fixedly connected to both ends of the spring 222, the fixing groove 224 is provided at both ends of the mounting block 220, the connecting plate 225 is fixedly connected to the bottom of the mounting block 220, and the detection needle 226 is fixedly connected to the bottom of the connecting plate 225. The clamping block 223, the cylindrical block 221 and the clamping cylinder 216 are clamped together to quickly connect the detection device 202 and The detection part 201 is fixed, and then the clamping block 215 is used to clamp and fix the fixing groove 224 to increase the fixation of the detection equipment 202 and ensure the use effect. Slide grooves are set at both ends of the cylindrical block 221, and the interior of the slide groove is slidably connected to the two ends of the clamping block 223, so that the clamping block 223 can move in the cylindrical block 221, and cooperate with the action of the spring 222 to form a fixation for the clamping tube 216. Holes are opened at both ends of the clamping tube 216. The size of the hole is consistent with the size of the clamping block 223 to ensure the fixing effect of the clamping. The size of the connecting plate 225 is consistent with the size of the detection mold 4 to ensure the detection effect for semiconductor packaging.

[0040] In summary, when the device is in use, the semiconductor packaged chip is placed in the placement groove 402 by a manipulator, and the semiconductor test pin 403 is connected to the pin of the packaged chip. Then the cylinder 7 drives the mounting plate 8 to descend, so that the detection needle 226 of the detection device 202 detects the packaging device. After the detection is completed, the signal is displayed through the control component 2. For different chip detections, the clamping block 215 can be taken out from the detection device 202 by rotating the cylindrical block 221, and then the detection device 202 is moved downward to take out the detection device 202. Similarly, the detection device 202 can be installed. The detection mold 4 can be replaced by taking out the detection mold 4 through the semicircular groove, and the replaced detection mold 4 is fixed by magnetic attraction.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test stand for semiconductor packaging testing, comprising a test base (1), a control component (2), a support leg (3), a detection mold (4), a support plate (5), a fixing plate (6), a cylinder (7), a mounting plate (8) and a test component (9), characterized in that: The control assembly (2) is arranged at one end of the test base (1), the support foot (3) is fixedly connected to the bottom of the test base (1), the detection mold (4) is installed inside the test base (1), the support plate (5) is fixedly connected to the top of the test base (1), the fixing plate (6) is fixedly connected to the top of the support plate (5), the cylinder (7) is fixedly connected to the top of the fixing plate (6), the mounting plate (8) is pneumatically lifted and connected to the bottom of the cylinder (7), and the test component (9) is installed at one end of the mounting plate (8); The test component (9) comprises a fixed detection member (201) and a detection device (202), wherein the fixed detection member (201) is arranged inside the mounting plate (8), and the detection device (202) is arranged at the bottom of the fixed detection member (201); The test base (1) comprises a frame (101), a bracket (102), a mold pin (103), a mounting hole (104), a heat dissipation groove (105) and a blower (106); the bracket (102) is fixedly connected to the inner side of the frame (101); the mold pin (103) is arranged at one end of the top of the bracket (102); the mounting hole (104) is opened inside the bracket (102); the heat dissipation groove (105) is opened inside the frame (101); and the blower (106) is installed inside the frame (101) and is located on one side of the heat dissipation groove (105); The detection mold (4) comprises a mold block (401), a placement groove (402), a semiconductor test pin (403), a detection circuit board (404) and a magnet block (405); the placement groove (402) is opened at the top of the mold block (401); the semiconductor test pin (403) is arranged at one end of the placement groove (402); the detection circuit board (404) is fixedly connected to the inside of the mold block (401) and is located below the semiconductor test pin (403); and the magnet block (405) is installed on the outside of the inside of the mold block (401); The fixed detection component (201) comprises a mounting frame (210), a rotating block (211), a connecting rod (212), a gear block (213), a moving rod (214), a clamping block (215) and a clamping tube (216); the mounting frame (210) is fixedly connected to the inside of one end of the mounting plate (8); the rotating block (211) is rotatably connected to the top of the mounting frame (210); the connecting rod (212) is fixedly connected to the bottom of the rotating block (211) and is located inside the mounting frame (210); the gear block (213) is fixedly connected to the bottom of the connecting rod (212); the moving rod (214) is meshedly connected to one side of the gear block (213); the clamping block (215) is fixedly connected to one end of the moving rod (214) and is located at the bottom of one end outside the mounting frame (210); and the clamping tube (216) is arranged at the bottom inside the mounting frame (210); The detection device (202) comprises a mounting block (220), a cylindrical block (221), a spring (222), a clamping block (223), a fixing groove (224), a connecting plate (225) and a detection needle (226); the cylindrical block (221) is fixedly connected to the top of the mounting block (220); the spring (222) is arranged inside the cylindrical block (221); the clamping block (223) is fixedly connected to both ends of the spring (222); the fixing groove (224) is provided at both ends of the mounting block (220); the connecting plate (225) is fixedly connected to the bottom of the mounting block (220); and the detection needle (226) is fixedly connected to the bottom of the connecting plate (225).

2. The semiconductor packaging test stand according to claim 1, wherein: Slide grooves are provided at both ends of the cylindrical block (221), and the interior of the slide grooves is slidably connected to both ends of the clamping block (223).

3. The semiconductor packaging test stand according to claim 2, wherein: Both ends of the clamping cylinder (216) are provided with hole slots, and the size of the hole slots is consistent with the size of the clamping block (223).

4. The semiconductor packaging test stand according to claim 3, wherein: The top of the frame body (101) is provided with semicircular grooves, which are respectively arranged at two ends above the bracket (102).

5. The semiconductor packaging test stand according to claim 4, wherein: The bottom of the bracket (102) is provided with a magnetic attraction block, which cooperates with the magnet block (405) inside the frame body (101) for magnetic attraction and fixation.

6. The semiconductor packaging test stand according to claim 5, wherein: The size of the connecting plate (225) is consistent with the size of the detection mold (4).

Images