Integrated circuit packaging equipment and process

Abstract

The present invention discloses an integrated circuit packaging device and process, belonging to the field of circuit packaging devices. An integrated circuit packaging device includes a processing table and a loading robot arm, a welding robot arm and an assembly robot arm fixed on the side wall thereof, and also includes: a station turntable rotatably connected to the processing table, four groups of packaging disks are fixed on the station turntable at equal intervals, and a clamping part for fixing the integrated circuit board is arranged on the packaging disk; the present invention uses the arrangement of friction wheels and friction rings to press the gas in the piston groove into the clamping groove to achieve the clamping and positioning of the circuit substrate, thereby ensuring the stability of the circuit substrate during processing; and in conjunction with the arrangement of the airflow groove, the third conduit and the fourth conduit, the airflow on the surface of the circuit substrate moves into the airflow groove, thereby sucking away the dust attached to the surface of the circuit substrate, thereby improving the cleanliness of the surface of the circuit substrate; and in the subsequent stage, the speed of heat dissipation and solidification can also be increased, thereby improving the overall packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit packaging equipment, and in particular to an integrated circuit packaging equipment and process. Background Art

[0002] Integrated circuit packaging is an important part of the semiconductor manufacturing process. It is responsible for protecting the chip from the external environment and connecting the chip's electrical signals to the external circuit. Packaging technology is essential to ensure the reliability and performance of electronic devices. The packaging of integrated circuits includes steps such as soldering pins, connecting the substrate to the chip, and injection molding packaging.

[0003] At present, when the existing packaging equipment is in use, the substrate is usually transferred along the conveyor belt, and the conveyor belt lacks a limit fixed structure, which easily causes the circuit substrate to deviate, making its processing stability insufficient, resulting in reduced packaging quality; and during continuous injection molding, the packaging resin is stationary in the tank, which is prone to uneven dispersion, and there are some bubbles inside the packaging resin, which ultimately reduces the packaging effect. Therefore, an integrated circuit packaging equipment and process are proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art of insufficient stability of circuit substrate processing, resulting in reduced packaging quality; and defects in packaging resin during long-term filling, which will result in reduced packaging effect, and to propose an integrated circuit packaging equipment and process.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An integrated circuit packaging device comprises a processing table and a loading robot arm, a welding robot arm and an assembly robot arm fixed on the side wall thereof, and further comprises: a station turntable rotatably connected to the processing table, four groups of packaging disks are fixed on the station turntable at equal intervals, a clamping part for fixing an integrated circuit board is arranged on the packaging disk, wherein a limit slide bar is fixedly connected to the bottom of the station turntable, the limit slide bar is slidably connected to the bottom of the inner cavity of the processing table, and an inflation part for driving the clamping part to operate is arranged on the limit slide bar; a packaging tank rotatably connected to the top of the processing table, the packaging tank is provided with a packaging part for sealing the integrated circuit board, wherein a material leveling part for treating the packaging slurry inside the packaging tank is arranged on the side wall of the packaging tank.

[0007] In order to facilitate the positioning of the integrated circuit board, preferably, the clamping part includes a clamping block, clamping grooves are provided on the inner walls around the packaging disk, the clamping block is slidably connected in the clamping groove, a first spring is fixedly connected between the side wall of the clamping block and the clamping groove, and a power unit for driving the workstation turntable to rotate is provided in the processing table.

[0008] In order to improve the packaging efficiency, preferably, the power unit includes a driving gear disc, which is fixed on the inner wall of the workstation turntable, and a first motor is fixedly connected to the processing table. A driving gear is fixedly connected to the output shaft of the first motor, and the driving gear is meshingly connected to the driving gear disc.

[0009] In order to improve the packaging stability, preferably, the inflatable part includes an installation box, which is sleeved and fixed on the limiting sliding rod, and a driven shaft is rotatably connected in the installation box, and two groups of piston grooves are symmetrically opened in the installation box, the driven shaft passes through the piston groove and is slidably connected to the limiting swivel, and a piston plate is slidably connected in the piston groove, a push rod is fixedly connected between the limiting swivel and the piston plate, and a second spring is fixedly connected between the other side of the limiting swivel and the piston groove, the piston grooves on both sides are connected by a first conduit, the side wall of the first conduit is fixed and connected with a second conduit, the four groups of clamping grooves are connected by an air guide ring, and the top of the second conduit is connected to the inner cavity of the air guide ring, a friction wheel is rotatably connected to the driven shaft, and a friction ring is fixedly connected to the inner wall of the processing table, and the friction wheel rotates in fit with the friction ring.

[0010] In order to facilitate unloading, the friction ring is further arranged to be open, both ends of the opening are treated with arc chamfers, and the opening is located below the loading robot arm station. When the second spring is in a natural state, the distance from the outer wall of the friction ring to the inner wall of the processing table is smaller than the distance that the friction ring extends out of the inner wall of the processing table.

[0011] In order to improve the packaging quality, preferably, two groups of air flow grooves are symmetrically opened in the installation box, and the two ends of the driven shaft respectively penetrate into the air flow grooves on both sides and are rotatably connected thereto, and the outer wall of the driven shaft located in the air flow groove is fixedly connected with a guide vane, and the airflow generated in the air flow grooves on both sides moves toward the friction wheel, and the air flow grooves on both sides are connected by a third conduit, and a fourth conduit is fixed on and connected to the third conduit, and the top end of the fourth conduit is connected to the upper part of the inner cavity of the workstation turntable.

[0012] In order to improve the packaging efficiency, preferably, the packaging part includes a packaging cylinder, which is fixed in the middle of the inner cavity of the processing table, and a mounting plate is fixedly connected to the top of the packaging cylinder, and a second motor is fixedly connected to the mounting plate, and a mounting sleeve is fixedly connected to the top of the output shaft of the second motor, and the packaging can is fixedly connected to the mounting sleeve, and the bottom end of the packaging can is fixed and connected with a feeding pipe, and a quantitative valve is arranged in the feeding pipe, and a packaging mold is slidably sleeved on the outer wall of the bottom end of the feeding pipe, and the feeding pipe is connected with the inner cavity of the packaging mold, and four groups of limiting guide rods are fixed at equal intervals on the bottom of the packaging can, and the packaging mold is slidably sleeved between the four groups of limiting guide rods, and a third spring is sleeved on the limiting guide rod.

[0013] In order to improve the packaging quality, preferably, a limiting slide groove is provided on the side wall of the mounting plate, the mounting sleeve is fixedly connected to a support plate, one end of the support plate away from the mounting sleeve is fixedly connected to a rotating seat, an auxiliary support wheel is rotatably connected in the rotating seat, the outer wall of the auxiliary support wheel is in contact with the inner wall of the limiting slide groove, an air pressure groove is provided in the support plate, an air pressure plate is slidably connected in the air pressure groove, a fourth spring is fixedly connected between the air pressure plate and the air pressure groove, a strong magnetic plate is fixedly connected to the outer wall of the auxiliary support wheel, and the strong magnetic plate and the air pressure plate are magnetically repelled from each other, the top of the air pressure groove is fixed and connected to an exhaust pipe, the other end of the exhaust pipe is connected to the top of the inner cavity of the packaging can, and a one-way valve is provided in the exhaust pipe.

[0014] Furthermore, a pneumatic ring is fixedly connected to the side wall of the support plate, a pneumatic shaft is rotatably connected inside the pneumatic ring, a pneumatic impeller is fixedly connected to the outer wall of the pneumatic shaft, the pneumatic shaft penetrates into the packaging tank and is fixedly connected to a liquid stirring piece, an exhaust groove is provided in the support plate, a guide pipe is fixedly connected to the side wall of the exhaust groove, the other end of the guide pipe is connected to the inner cavity of the pneumatic ring, a one-way valve is arranged in the guide pipe, the bottom of the pneumatic ring is fixedly connected to the exhaust pipe, and the output end of the exhaust pipe faces the outer wall of the packaging mold.

[0015] An integrated circuit packaging process, the steps are as follows:

[0016] Step 1: Fix the integrated circuit board to the workstation turntable and rotate the workstation;

[0017] Step 2: Processing the integrated circuit board in different steps at different workstations;

[0018] Step 3: packaging the assembled integrated circuit board;

[0019] Step 4: Take out the integrated circuit board after packaging to realize circular production.

[0020] Compared with the prior art, the present invention provides an integrated circuit packaging device and process, which has the following beneficial effects:

[0021] 1. The integrated circuit packaging equipment, through the arrangement of the friction wheel and the friction ring, enables the gas in the piston groove to be pressed into the clamping groove, thereby achieving the clamping and positioning of the circuit substrate, ensuring the stability of the circuit substrate during processing, and improving the packaging quality; and in conjunction with the arrangement of the airflow groove, the third conduit and the fourth conduit, the airflow on the surface of the circuit substrate moves into the airflow groove, thereby sucking away the dust attached to the surface of the circuit substrate, improving the cleanliness of the surface of the circuit substrate; and in the subsequent process, the speed of heat dissipation and solidification can also be increased, thereby improving the overall packaging efficiency.

[0022] 2. The integrated circuit packaging equipment, through the repulsive effect of the strong magnetic plate and the air pressure plate, first allows the air flow to rush into the pneumatic ring to drive the pneumatic impeller to rotate, and the pneumatic impeller will rotate in the packaging tank with the stirring blade to achieve stirring of the packaging resin, ensuring the uniformity of the dispersion of the packaging resin in the packaging tank and improving the packaging effect; secondly, the gas in the inner cavity of the packaging tank will be extracted to reduce the internal air pressure, and with the stirring effect, the internal bubbles will move upward quickly, ensuring the use quality of the packaging resin, thereby improving the final packaging effect.

[0023] 3. The integrated circuit packaging equipment, through the setting of the limiting guide rod and the third spring, can ensure that the packaging mold fits tightly with the circuit substrate while minimizing the squeezing force on the circuit substrate, reducing the possibility of damage to the circuit substrate due to excessive squeezing, and improving the protection effect of the circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The main view of the overall structure of an integrated circuit packaging device proposed by the present invention is shown in FIG. Figure 1 ;

[0025] Figure 2 The main view of the overall structure of an integrated circuit packaging device proposed by the present invention is shown in FIG. Figure 2 ;

[0026] Figure 3 A schematic diagram of the internal structure of a processing platform of an integrated circuit packaging device proposed by the present invention;

[0027] Figure 4 A schematic diagram of a side view and half-section structure of an integrated circuit packaging device proposed by the present invention;

[0028] Figure 5 An integrated circuit packaging device proposed by the present invention Figure 4 A schematic diagram of the enlarged structure of the middle A area;

[0029] Figure 6 An integrated circuit packaging device proposed by the present invention Figure 4 Schematic diagram of the enlarged structure of the middle B area;

[0030] Figure 7 A schematic diagram of a partial cross-sectional structure of an integrated circuit packaging device proposed by the present invention;

[0031] Figure 8 An integrated circuit packaging device proposed by the present invention Figure 7 Schematic diagram of the enlarged structure of the middle C area.

[0032] In the figure: 1, processing table; 2, feeding robot arm; 21, welding robot arm; 22, assembly robot arm; 3, work station turntable; 31, packaging plate; 32, limit slide bar; 4, packaging tank; 5, clamping block; 51, clamping groove; 511, air guide ring; 52, first spring; 53, driving gear plate; 531, first motor; 532, driving gear; 6, installation box; 61, driven shaft; 611, friction wheel; 62, piston groove; 621, limit swivel; 622, piston plate; 623, push rod; 624, second spring; 63, first conduit; 631, second conduit; 64, friction ring; 65, air flow groove; 651 , guide vane; 652, third conduit; 653, fourth conduit; 7, packaging cylinder; 71, mounting plate; 711, second motor; 712, limit slide groove; 72, mounting sleeve; 73, feeding pipe; 731, packaging mold; 74, limit guide rod; 741, third spring; 75, support plate; 751, rotating seat; 76, auxiliary support wheel; 761, strong magnetic plate; 77, air pressure groove; 771, air pressure plate; 772, fourth spring; 773, exhaust pipe; 78, pneumatic ring; 781, pneumatic shaft; 782, pneumatic impeller; 783, liquid stirring sheet; 784, exhaust pipe; 79, exhaust groove; 791, guide pipe. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Embodiment 1:

[0036] Reference Figure 1-Figure 8, an integrated circuit packaging equipment, including a processing table 1 and a loading robot arm 2, a welding robot arm 21 and an assembly robot arm 22 fixed on the side wall thereof, and the above three groups of robots all adopt existing mature technologies, and their specific principles are no longer repeated, and also include: a station turntable 3 rotatably connected to the processing table 1, four groups of packaging disks 31 are fixed on the station turntable 3 at equal intervals, and a clamping part for fixing the integrated circuit board is provided on the packaging disk 31, wherein a limit slide bar 32 is fixedly connected to the bottom of the station turntable 3, the limit slide bar 32 is slidably connected to the bottom of the inner cavity of the processing table 1, and an inflation part for driving the clamping part to operate is provided on the limit slide bar 32; a packaging tank 4 is rotatably connected to the top of the processing table 1, and a packaging part for sealing the integrated circuit board is provided on the packaging tank 4, wherein a material leveling part for processing the packaging slurry inside the packaging tank 4 is provided on the side wall.

[0037] Reference Figure 3 , Figure 4 and Figure 8 , wherein the clamping part includes a clamping block 5, and clamping grooves 51 are provided on the inner walls around the packaging disk 31. The clamping block 5 is slidably connected in the clamping groove 51. A first spring 52 is fixedly connected between the side wall of the clamping block 5 and the clamping groove 51, and a power unit for driving the workstation turntable 3 to rotate is arranged in the processing table 1; the power unit includes a driving gear plate 53, and the driving gear plate 53 is fixed on the inner wall of the workstation turntable 3. A first motor 531 is fixedly connected in the processing table 1. The first motor 531 adopts a servo programming motor, and a driving gear 532 is fixedly connected to the output shaft of the first motor 531, and the driving gear 532 is meshingly connected with the driving gear plate 53.

[0038] Through the arrangement of the above-mentioned structure, the loading robot arm 2 transfers the circuit substrate to the packaging disk 31 of its corresponding workstation, and then turns on the first motor 531, and drives the workstation turntable 3 to rotate through the meshing relationship between the driving gear 532 and the driving gear disk 53, so that the packaging disk 31 with the circuit substrate rotates with the workstation turntable 3 to different workstations, realizing the joint processing of multiple workstations and effectively improving the packaging efficiency.

[0039] Reference Figure 5 , Figure 8, wherein the inflatable part includes a mounting box 6, which is sleeved and fixed on the limit sliding rod 32, a driven shaft 61 is rotatably connected in the mounting box 6, two groups of piston grooves 62 are symmetrically opened in the mounting box 6, the driven shaft 61 passes through the piston groove 62 and is slidably connected to the limit swivel 621, a piston plate 622 is slidably connected in the piston groove 62, a push rod 623 is fixedly connected between the limit swivel 621 and the piston plate 622, a second spring 624 is fixedly connected between the other side of the limit swivel 621 and the piston groove 62, the piston grooves 62 on both sides are connected through a first conduit 63, and the side wall of the first conduit 63 is fixed and connected A second conduit 631 is provided, and the four groups of clamping grooves 51 are connected through the air guide ring 511, and the top of the second conduit 631 is connected to the inner cavity of the air guide ring 511. A friction wheel 611 is rotatably connected to the driven shaft 61, and a friction ring 64 is fixedly connected to the inner wall of the processing table 1. The friction wheel 611 and the friction ring 64 rotate in close contact; the friction ring 64 is open, and both ends of the opening are chamfered with arcs, and the opening is located below the loading robot arm 2 station. When the second spring 624 is in a natural state, the distance from the outer wall of the friction ring 64 to the inner wall of the processing table 1 is less than the distance of the friction ring 64 extending out of the inner wall of the processing table 1.

[0040] Through the arrangement of the above structure, when the workstation turntable 3 leaves the bottom of the welding robot arm 21, the friction wheel 611 will contact the friction ring 64, and under the action of the rotating torque of the workstation turntable 3, the driven shaft 61 pushes the limiting swivel 621 to stretch the second spring 624, so that the friction wheel 611 will fit the surface of the friction ring 64, and when the limiting swivel 621 moves, it will push the piston plate 622 to move into the piston groove 62, so as to compress the gas in the piston groove 62, and make this part of the gas enter the four groups of clamping grooves 51 at the same time along the first conduit 63, the second conduit 631 and the air guide ring 511, so as to push the four groups of clamping grooves 5 1 extends outward, thereby achieving the clamping and positioning of the circuit substrate, ensuring the stability of the circuit substrate during processing; and when the packaging plate 31 rotates one circle and moves back to the bottom of the loading robot arm 2, the friction wheel 611 will be separated from the friction ring 64. At this time, under the pulling back action of the second spring 624, the friction wheel 611 will be reset, so that the gas previously pressed into the clamping groove 51 can flow back, thereby releasing the clamping and fixing effect on the integrated circuit board, and the packaged integrated circuit board is taken out by the final loading robot arm 2, and a new circuit substrate is placed at the same time, and the above process is repeated, and multiple stations can operate at the same time, which effectively improves the packaging efficiency.

[0041] Reference Figure 5 , Figure 8, wherein two groups of airflow grooves 65 are symmetrically provided in the installation box 6, and both ends of the driven shaft 61 respectively penetrate into the airflow grooves 65 on both sides and are rotatably connected thereto, and a guide vane 651 is fixedly connected to the outer wall of the driven shaft 61 located in the airflow groove 65, and the airflows generated in the airflow grooves 65 on both sides all move toward the friction wheel 611, and the airflow grooves 65 on both sides are connected through a third conduit 652, and a fourth conduit 653 is fixed and connected to the third conduit 652, and the top end of the fourth conduit 653 is connected to the upper part of the inner cavity of the station turntable 3;

[0042] By setting the above structure, after the friction wheel 611 is attached to the surface of the friction ring 64, the friction force is utilized, and when the work station turntable 3 rotates, the friction wheel 611 will rotate together, thereby driving the guide blades 651 in the air flow grooves 65 on both sides to rotate, so that a suction effect is generated on the side of the air flow groove 65 close to the third conduit 652, so that the air flow on the surface of the circuit substrate moves along the fourth conduit 653 and the third conduit 652 into the air flow groove 65, so as to absorb the dust attached to the surface of the circuit substrate, improve the cleanliness of the surface of the circuit substrate, and ensure the subsequent welding quality, and the air flow sucked into the air flow groove 65 will be blown toward the friction wheel 611, so as to reduce the heat generated by the friction wheel 611 due to friction, and effectively improve the friction wheel 611 and the friction ring. 64; and when the packaging disk 31 moves to the bottom of the welding robot arm 21 (exactly rotated 90 degrees), the first motor 531 stops rotating, and the welding robot arm 21 works at this time to spot-weld an array of spherical bump pins on the circuit substrate, and then the first motor 531 drives the station turntable 3 to rotate 90 degrees again, so that the welded circuit substrate moves to the assembly robot arm 22, and during this process, the airflow still moves along the fourth duct 653 and the third duct 652 into the airflow groove 65, so as to take away the heat generated during the welding process, accelerate the cooling speed of the welding convex ball, and thus improve the overall packaging efficiency; then the assembly robot arm 22 places the chip to be packaged on the circuit substrate, and presses it on the top of the spherical bump pin to complete the docking assembly.

[0043] Reference Figure 4 , Figure 7The packaging part includes a packaging cylinder 7, which is fixed in the middle of the inner cavity of the processing table 1. A mounting plate 71 is fixedly connected to the top of the packaging cylinder 7. A second motor 711 is fixedly connected to the mounting plate 71. The second motor 711 adopts a servo programming motor. A mounting sleeve 72 is fixedly connected to the top of the output shaft of the second motor 711. The packaging tank 4 is fixedly connected to the mounting sleeve 72. The bottom end of the packaging tank 4 is fixed and connected with a feeding pipe 73, and a quantitative valve is arranged in the feeding pipe 73. A packaging mold 731 is slidably sleeved on the outer wall of the bottom end of the feeding pipe 73. The feeding pipe 73 is connected to the inner cavity of the packaging mold 731. Four groups of limiting guide rods 74 are fixed at equal intervals on the bottom of the packaging tank 4. The packaging mold 731 is slidably sleeved between the four groups of limiting guide rods 74, and a third spring 741 is sleeved on the limiting guide rod 74.

[0044] Through the arrangement of the above-mentioned structure, the assembly robot arm 22 rotates away from the top of the assembled circuit substrate. At the same time, the second motor 711 drives the packaging tank 4 to rotate to the top of the circuit substrate, and through the operation of the packaging cylinder 7, the packaging mold 731 is attached to the top of the circuit substrate. At this time, the quantitative valve in the feeding tube 73 is opened to allow a quantitative amount of packaging resin to drip onto the surface of the circuit substrate, thereby completing the packaging of the chip and the circuit substrate. In addition, through the arrangement of the limiting guide rod 74 and the third spring 741, it is possible to ensure that the packaging mold 731 is tightly attached to the circuit substrate while minimizing the squeezing force on the circuit substrate, thereby reducing the possibility of damage to the circuit substrate caused by excessive squeezing, thereby improving the protection effect of the circuit substrate.

[0045] Reference Figure 4 , Figure 6 and Figure 7The cam 76 is provided with a plurality of springs 76a and 77b, respectively, which are used to push the stopper 71 against the stopper 74 and the stopper 76b are provided with a plurality of springs 76b. The cam 76a is provided with a plurality of springs 76b, 77b and 77b are provided to push the stopper 71 against the stopper 74 and the stopper 76b are provided with a plurality of springs 76b. The cam 76a is provided with a plurality of springs 76b, 77b and 77b are provided to push the stopper 71 against the stopper 74 and the stopper 76b are provided with a plurality of springs 76b. The cam 76a is provided with a plurality of springs 76b, 77b and 77b are provided to push the stopper 71 against the stopper 74 and the stopper 76b are provided with a plurality of springs 76b. The other end of the support plate 75 is connected to the top of the inner cavity of the packaging tank 4, and a one-way valve is provided in the air extraction pipe 773; a pneumatic ring 78 is fixedly connected to the side wall of the support plate 75, a pneumatic shaft 781 is rotatably connected in the pneumatic ring 78, a pneumatic impeller 782 is fixedly connected to the outer wall of the pneumatic shaft 781, the pneumatic shaft 781 penetrates into the packaging tank 4 and is fixedly connected to a liquid stirring piece 783, an exhaust groove 79 is provided in the support plate 75, the side wall of the exhaust groove 79 is fixed and connected to a guide pipe 791, the other end of the guide pipe 791 is connected to the inner cavity of the pneumatic ring 78, and a one-way valve is provided in the guide pipe 791, the bottom of the pneumatic ring 78 is fixed and connected to an exhaust pipe 784, and the output end of the exhaust pipe 784 faces the outer wall of the packaging mold 731.

[0046] It should be noted that the one-way valve in the exhaust pipe 773 can only allow the gas in the packaging tank 4 to enter the air pressure groove 77; the one-way valve in the guide pipe 791 can only allow the gas in the air pressure groove 77 to rush into the pneumatic ring 78.

[0047] By setting the above structure, when the second motor 711 drives the packaging tank 4 to rotate, the auxiliary support wheel 76 will also rotate along the inner wall of the limiting slide groove 712, and under the action of friction, the auxiliary support wheel 76 will rotate. At this time, through the repulsion between the strong magnetic plate 761 and the air pressure plate 771, when the two are in the magnetic repulsion area, the air pressure plate 771 will slide into the air pressure groove 77, thereby compressing the gas in the air pressure groove 77 and opening the one-way valve in the guide pipe 791, so that the gas rushes into the pneumatic ring 78 along the exhaust groove 79 and the guide pipe 791, thereby pushing the pneumatic impeller 782 to rotate, so that the pneumatic shaft 781 rotates with the stirring piece 783 in the packaging tank 4, realizing the stirring of the packaging resin, ensuring the uniformity of the dispersion of the packaging resin in the packaging tank 4, and improving the packaging effect. The airflow entering the pneumatic ring 78 will eventually blow along the exhaust pipe 784 to the outer wall of the packaging mold 731, so as to achieve the effect of the packaging effect. This realizes heat dissipation for the packaging mold 731, accelerates the solidification speed of the packaging resin after it falls, and thus improves the packaging efficiency; and when the strong magnetic plate 761 and the air pressure plate 771 are separated from the repulsive area, under the rebound effect of the fourth spring 772, the air pressure plate 771 will be reset, thereby generating a suction effect in the air pressure groove 77, so that the one-way valve in the exhaust pipe 773 is opened, so that the gas at the top of the inner cavity of the packaging tank 4 is sucked into the air pressure groove 77, and the air pressure in the packaging tank 4 is reduced while the air flow in the air pressure groove 77 is replenished. Therefore, while the packaging resin is stirred, the bubbles inside it will move upward quickly, ensuring the use quality of the packaging resin, thereby improving the final packaging effect; and when the first motor 531 continues to drive the packaging disk 31 to rotate to the feeding robot arm 2, the diversion effect generated at the fourth guide tube 653 will effectively accelerate the solidification speed of the packaging resin, thereby improving the packaging efficiency.

[0048] Reference Figure 1-Figure 8In the present invention, when in use, the loading robot arm 2 first transfers the circuit substrate to the packaging disk 31 of the corresponding station, and then turns on the first motor 531, and drives the station turntable 3 to rotate through the meshing relationship between the driving gear 532 and the driving gear plate 53, so that the packaging disk 31 with the circuit substrate moves toward the welding robot arm 21, and when the station turntable 3 leaves the bottom of the welding robot arm 21, the friction wheel 611 will contact the friction ring 64, and under the rotational torque of the station turntable 3, the driven shaft 61 pushes the limiting ring 621 to stretch the second spring 624, so that the friction wheel 611 will fit the friction ring 6 4 surface, and when the limit rotating ring 621 moves, it will push the piston plate 622 to move into the piston groove 62, thereby compressing the gas in the piston groove 62, and making this part of the gas enter the four groups of clamping grooves 51 along the first conduit 63, the second conduit 631 and the air guide ring 511 at the same time, thereby pushing the clamping blocks 5 in the four groups of clamping grooves 51 to extend outward, thereby achieving the clamping and positioning of the circuit substrate, ensuring the stability of the circuit substrate during processing; and after the friction wheel 611 is attached to the surface of the friction ring 64, by the effect of friction, when the station turntable 3 rotates, the friction wheel 611 will rotate together, thereby driving the air flow grooves 6 on both sides. 5 rotates, so that the side of the airflow slot 65 close to the third conduit 652 generates suction, so that the airflow on the surface of the circuit substrate moves along the fourth conduit 653 and the third conduit 652 into the airflow slot 65, thereby sucking away the dust attached to the surface of the circuit substrate, improving the cleanliness of the surface of the circuit substrate, and ensuring the subsequent welding quality, and the airflow sucked into the airflow slot 65 will be blown toward the friction wheel 611, thereby reducing the heat generated by the friction wheel 611 due to friction, and effectively improving the durability of the friction wheel 611 and the friction ring 64; when the packaging plate 31 moves to the bottom of the welding robot arm 21 (just rotated 90 degrees), The first motor 531 stops rotating, and the welding robot arm 21 works at this time to spot-weld an array of spherical bump pins on the circuit substrate. Then the first motor 531 drives the workstation turntable 3 to rotate 90 degrees again, so that the welded circuit substrate moves to the assembly robot arm 22. During this process, the airflow still moves along the fourth duct 653 and the third duct 652 into the airflow groove 65, so as to take away the heat generated during the welding process, accelerate the cooling speed of the welding convex ball, and thus improve the overall packaging efficiency; then the assembly robot arm 22 places the chip to be packaged on the circuit substrate, and presses it on the top of the spherical bump pin to complete the docking assembly.

[0049] Then, the assembly robot arm 22 is rotated away from the assembled circuit substrate. At the same time, the second motor 711 drives the packaging tank 4 to rotate to the top of the circuit substrate, and the packaging cylinder 7 works to make the packaging mold 731 fit on the top of the circuit substrate. At this time, the quantitative valve in the feeding tube 73 is opened to make a quantitative packaging resin drip on the surface of the circuit substrate, thereby completing the packaging of the chip and the circuit substrate. In addition, the setting of the limiting guide rod 74 and the third spring 741 can ensure that the packaging mold 731 fits tightly with the circuit substrate while minimizing the risk of damage to the circuit substrate. The squeezing force on the circuit substrate reduces the possibility of the circuit substrate being damaged by excessive squeezing, thereby improving the protection effect of the circuit substrate; and in the process of the second motor 711 driving the packaging can 4 to rotate, the auxiliary support wheel 76 will also rotate along the inner wall of the limiting slide groove 712, and under the action of the friction force, the auxiliary support wheel 76 will rotate. At this time, through the repulsive effect of the strong magnetic plate 761 and the air pressure plate 771, when the two are in the magnetic repulsive area, the air pressure plate 771 will slide into the air pressure groove 77, thereby compressing the gas in the air pressure groove 77 and opening the guide tube 791. The one-way valve allows the gas to rush into the pneumatic ring 78 along the exhaust groove 79 and the guide pipe 791, thereby driving the pneumatic impeller 782 to rotate, so that the pneumatic shaft 781 rotates with the liquid stirring blade 783 in the packaging tank 4, so as to achieve the stirring of the packaging resin, ensure the uniformity of the packaging resin in the packaging tank 4, and improve the packaging effect. The airflow entering the pneumatic ring 78 will eventually blow along the exhaust pipe 784 to the outer wall of the packaging mold 731, so as to achieve the heat dissipation of the packaging mold 731, accelerate the solidification speed of the packaging resin after it falls, and thus improve the packaging efficiency; and And when the strong magnetic plate 761 and the air pressure plate 771 are separated from the repulsive area, the air pressure plate 771 will be reset under the rebound action of the fourth spring 772, thereby generating a suction effect in the air pressure groove 77, so that the one-way valve in the exhaust pipe 773 is opened, so that the gas at the top of the inner cavity of the packaging tank 4 is sucked into the air pressure groove 77, and the air pressure in the packaging tank 4 is reduced while the air flow in the air pressure groove 77 is replenished. Therefore, while the packaging resin is stirred, the internal bubbles will move upward quickly, ensuring the use quality of the packaging resin, thereby improving the final packaging effect.

[0050] Then the packaging tank 4 is reset. At this time, the first motor 531 continues to drive the packaging plate 31 to rotate to the loading robot arm 2. During this process, the diversion effect generated by the fourth conduit 653 will effectively accelerate the solidification speed of the packaging resin, thereby improving the packaging efficiency. When the packaging plate 31 moves to the bottom of the loading robot arm 2, the friction wheel 611 will be separated from the friction ring 64. At this time, under the pull-back effect of the second spring 624, the friction wheel 611 will be reset, so that the gas previously pressed into the clamping groove 51 can flow back, thereby releasing the clamping and fixing effect on the integrated circuit board. The packaged integrated circuit board is taken out by the final loading robot arm 2, and a new circuit substrate is placed at the same time. The above process is repeated, and multiple stations can operate at the same time, which effectively improves the packaging efficiency.

[0051] Embodiment 2:

[0052] Reference Figure 1-Figure 8 , which is basically the same as the first embodiment, on the basis of the first embodiment, an integrated circuit packaging process is proposed, and the steps are as follows:

[0053] Step 1: Fix the integrated circuit board to the workstation turntable 3 and then rotate the workstation: the loading robot arm 2 transfers the circuit substrate to the packaging disk 31 of its corresponding workstation, and then turns on the first motor 531, and drives the workstation turntable 3 to rotate through the meshing relationship between the driving gear 532 and the driving gear disk 53, so that the packaging disk 31 with the circuit substrate rotates with the workstation turntable 3, and moves to different processing stations according to the corresponding rotation angle.

[0054] Step 2: Process the integrated circuit board in different workstations in steps: when the packaging disk 31 rotates 90 degrees and just moves under the welding robot arm 21, the first motor 531 stops rotating, and the welding robot arm 21 works to spot-weld an array of spherical bump pins on the circuit substrate. Then the first motor 531 drives the workstation turntable 3 to rotate 90 degrees again, so that the welded circuit substrate moves to the assembly robot arm 22. Then the assembly robot arm 22 places the chip to be packaged on the circuit substrate and presses it on the top of the spherical bump pin to complete the docking assembly.

[0055] Step 3: Encapsulate the assembled integrated circuit board: the assembly robot arm 22 is rotated away from the assembled circuit substrate, and at the same time, the second motor 711 drives the encapsulation tank 4 to rotate to the top of the circuit substrate, and the encapsulation cylinder 7 works to make the encapsulation mold 731 fit on the top of the circuit substrate. At this time, the quantitative valve in the feeding pipe 73 is opened to make a quantitative encapsulation resin drip on the surface of the circuit substrate, thereby completing the encapsulation of the chip and the circuit substrate;

[0056] Step 4: Take out the integrated circuit board after packaging to realize circular production: reset the packaging can 4, and at this time, the first motor 531 continues to drive the packaging disk 31 to rotate to the loading robot arm 2, and the packaged integrated circuit board is taken out by the final loading robot arm 2, and a new circuit substrate is placed at the same time, and the above process is repeated, and multiple stations can operate at the same time, which effectively improves the packaging efficiency.

[0057] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An integrated circuit packaging device, comprising a processing table (1) and a loading robot arm (2), a welding robot arm (21) and an assembly robot arm (22) fixed to the side wall thereof, characterized in that: Also includes: A workstation turntable (3) is rotatably connected to the processing table (1), four groups of packaging disks (31) are fixed on the workstation turntable (3) at equal intervals, and a clamping portion for fixing an integrated circuit board is provided on the packaging disk (31). The bottom of the workstation turntable (3) is fixedly connected to a limit slide bar (32), the limit slide bar (32) is slidably connected to the bottom of the inner cavity of the processing table (1), and an inflation part for driving the clamping part to operate is arranged on the limit slide bar (32); A packaging can (4) rotatably connected to the top of the processing table (1), wherein the packaging can (4) is provided with a packaging portion for sealing the integrated circuit board; The packaging part comprises a packaging cylinder (7), the packaging cylinder (7) being fixed in the middle of the inner cavity of the processing table (1), the top of the packaging cylinder (7) being fixedly connected to a mounting plate (71), the mounting plate (71) being fixedly connected to a second motor (711), the top end of the output shaft of the second motor (711) being fixedly connected to a mounting sleeve (72), the packaging tank (4) being fixedly connected to the mounting sleeve (72), the bottom end of the packaging tank (4) being fixedly connected to and connected to a feeding port A feeding tube (73) is provided in the feeding tube (73), a quantitative valve is provided in the feeding tube (73), a packaging mold (731) is slidably sleeved on the outer wall of the bottom end of the feeding tube (73), the feeding tube (73) is communicated with the inner cavity of the packaging mold (731), four groups of limit guide rods (74) are fixed at equal intervals on the bottom of the packaging tank (4), the packaging mold (731) is slidably sleeved between the four groups of limit guide rods (74), and a third spring (741) is sleeved on the limit guide rod (74); A limiting slide groove (712) is provided on the side wall of the mounting plate (71), a support plate (75) is fixedly connected to the mounting sleeve (72), one end of the support plate (75) away from the mounting sleeve (72) is fixedly connected to a rotating seat (751), an auxiliary support wheel (76) is rotatably connected in the rotating seat (751), the outer wall of the auxiliary support wheel (76) is in contact with the inner wall of the limiting slide groove (712), an air pressure groove (77) is provided in the support plate (75), and an air pressure wheel (76) is slidably connected in the air pressure groove (77). A pressure plate (771), a fourth spring (772) is fixedly connected between the air pressure plate (771) and the air pressure groove (77), a strong magnetic plate (761) is fixedly connected to the outer wall of the auxiliary support wheel (76), and the strong magnetic plate (761) and the air pressure plate (771) are magnetically repelled from each other, the top of the air pressure groove (77) is fixed and connected to an exhaust pipe (773), the other end of the exhaust pipe (773) is connected to the top of the inner cavity of the packaging tank (4), and a one-way valve is arranged in the exhaust pipe (773); A pneumatic ring (78) is fixedly connected to the side wall of the support plate (75), a pneumatic shaft (781) is rotatably connected inside the pneumatic ring (78), a pneumatic impeller (782) is fixedly connected to the outer wall of the pneumatic shaft (781), the pneumatic shaft (781) penetrates into the packaging tank (4) and is fixedly connected to a liquid stirring piece (783), an exhaust groove (79) is provided in the support plate (75), a guide pipe (791) is fixedly connected to the side wall of the exhaust groove (79), the other end of the guide pipe (791) is connected to the inner cavity of the pneumatic ring (78), and a one-way valve is arranged inside the guide pipe (791), the bottom of the pneumatic ring (78) is fixedly connected to an exhaust pipe (784), and the output end of the exhaust pipe (784) faces the outer wall of the packaging mold (731); Wherein, a material mixing portion for processing the packaging slurry inside the packaging tank (4) is provided on the side wall thereof.

2. The integrated circuit packaging device according to claim 1, characterized in that: The clamping portion comprises a clamping block (5), and clamping grooves (51) are provided on the inner walls around the packaging disk (31). The clamping block (5) is slidably connected in the clamping groove (51), and a first spring (52) is fixedly connected between the side wall of the clamping block (5) and the clamping groove (51), and a power unit for driving the workstation turntable (3) to rotate is provided in the processing table (1).

3. The integrated circuit packaging device according to claim 2, characterized in that: The power unit comprises a driving toothed disc (53), the driving toothed disc (53) being fixed on the inner wall of the workstation turntable (3), a first motor (531) being fixedly connected inside the processing table (1), a driving gear (532) being fixedly connected to the output shaft of the first motor (531), and the driving gear (532) being meshingly connected to the driving toothed disc (53).

4. The integrated circuit packaging device according to claim 2, characterized in that: The inflation portion comprises a mounting box (6), the mounting box (6) being sleeved and fixed on the limit sliding rod (32), a driven shaft (61) being rotatably connected in the mounting box (6), two groups of piston grooves (62) being symmetrically provided in the mounting box (6), the driven shaft (61) passing through the piston groove (62) and being slidably connected to a limit rotating ring (621), a piston plate (622) being slidably connected in the piston groove (62), a push rod (623) being fixedly connected between the limit rotating ring (621) and the piston plate (622), the other side of the limit rotating ring (621) being connected to the piston groove (62) A second spring (624) is fixedly connected between the two sides of the piston grooves (62), the piston grooves (62) on both sides are connected via a first conduit (63), the side wall of the first conduit (63) is fixed and connected to a second conduit (631), the four groups of clamping grooves (51) are connected via an air guide ring (511), and the top end of the second conduit (631) is connected to the inner cavity of the air guide ring (511), a friction wheel (611) is rotatably connected to the driven shaft (61), a friction ring (64) is fixedly connected to the inner wall of the processing table (1), and the friction wheel (611) and the friction ring (64) rotate in close contact.

5. The integrated circuit packaging device according to claim 4, characterized in that: The friction ring (64) is open, both ends of the opening are chamfered, and the opening is located below the workstation of the loading robot arm (2). When the second spring (624) is in a natural state, the distance from the outer wall of the friction ring (64) to the inner wall of the processing table (1) is less than the distance that the friction ring (64) extends from the inner wall of the processing table (1).

6. The integrated circuit packaging device according to claim 4, characterized in that: Two groups of air flow grooves (65) are symmetrically provided in the installation box (6), and the two ends of the driven shaft (61) respectively penetrate into the air flow grooves (65) on both sides and are rotatably connected thereto. A guide vane (651) is fixedly connected to the outer wall of the driven shaft (61) located in the air flow groove (65), and the airflow generated in the air flow grooves (65) on both sides moves toward the friction wheel (611). The air flow grooves (65) on both sides are connected via a third conduit (652), and a fourth conduit (653) is fixed on and connected to the third conduit (652), and the top end of the fourth conduit (653) is connected to the upper part of the inner cavity of the workstation turntable (3).

7. An integrated circuit packaging process, using an integrated circuit packaging device as claimed in any one of claims 1 to 6, characterized in that: Here are the steps: Step 1: fix the integrated circuit board to the workstation turntable (3) and then rotate the workstation; Step 2: Processing the integrated circuit board in different steps at different workstations; Step 3: packaging the assembled integrated circuit board; Step 4: Take out the integrated circuit board after packaging to realize circular production.

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