Fixing device, fixing method and semiconductor process equipment

Abstract

The present disclosure provides a fixing device, a fixing method and a semiconductor process treatment equipment. The fixing device is used to fix the gas float in the processing chamber of the semiconductor process treatment equipment, and the fixing device includes: a first fixing unit, including a first through hole and a first recess, the first through hole penetrates the first surface and the second surface of the first fixing unit to receive the first part of the gas float, the first recess is formed on the second surface to receive the second part of the gas float, wherein a part of the first recess coincides with the first through hole; a second fixing unit, including a second recess, the second recess is used to receive the third part of the gas float. The gas float is installed in the processing chamber of the semiconductor process treatment equipment by using the fixing device, so as to realize the efficient installation of the gas float, improve the accuracy of the positioning of the gas float outlet, and improve the stability of the process.

Description

Technical Field

[0001] Exemplary embodiments of the present disclosure generally relate to the field of semiconductor manufacturing, and more particularly, to a fixture, a fixture method, and semiconductor process equipment. Background Art

[0002] In the wafer processing process, such as the heat treatment process, the success or failure of the air flotation installation determines the rotation characteristics of the wafer and affects the quality of the wafer thermal reaction film. For example, if the air flotation is directly placed on the lower quartz plate, there will be position deviation, which will affect the wafer rotation characteristics. Summary of the invention

[0003] In a first aspect of the present disclosure, a fixing device is provided for fixing an air float in a processing chamber in a semiconductor process processing equipment, the fixing device comprising: a first fixing unit, comprising a first through hole and a first recess, the first through hole penetrating the first surface and the second surface of the first fixing unit to receive the first part of the air float, the first recess being formed on the second surface to receive the second part of the air float, wherein a part of the first recess coincides with the first through hole; a second fixing unit, comprising a second recess, the second recess being used to receive the third part of the air float.

[0004] The air float is installed in the processing chamber of the semiconductor process equipment by using a fixing device, so that the efficient installation of the air float is realized, the accuracy of positioning the air float outlet is improved, and the stability of the process is improved.

[0005] In some embodiments, the fixing device further includes a first positioning member detachably connected to the first fixing unit, the first positioning member includes a second through hole, and when the first positioning member is connected to the first fixing unit, the second through hole is connected to the first through hole and fixes the first part of the air float.

[0006] In some embodiments, the fixing device further comprises a third fixing unit detachably connected to the first fixing unit, and the third fixing unit comprises a pipe supporting structure for supporting the fourth part of the air float.

[0007] In some embodiments, the first fixing unit includes a first mounting structure, which can detachably mount the first fixing unit to the processing chamber; the second fixing unit includes a second mounting structure, which can detachably mount the second fixing unit to the processing chamber.

[0008] In some embodiments, the first mounting structure includes two first protrusions, which are hollow and protrude from the first surface of the first fixing unit; the second mounting structure includes one second protrusion, which is hollow and protrudes from the first surface of the second fixing unit.

[0009] In some embodiments, the two first protrusions are respectively located at a first side and a second side of the first fixing unit, and the first through hole is located between the two first protrusions.

[0010] In some embodiments, the second protrusion is adjacent to the second recess.

[0011] In some embodiments, the first part of the air flotation includes a first air flotation outlet disc, the second part of the air flotation includes an air flotation pipeline, the third part of the air flotation includes a second air flotation outlet disc, and the fourth part of the air flotation includes a three-way air flotation air inlet pipeline; the three-way air flotation air inlet pipeline, the air flotation pipeline, the first air flotation outlet disc and the second air flotation outlet disc are connected to provide airflow, and the airflow controls the movement state of the workpiece located in the processing chamber.

[0012] In some embodiments, the motion state of the workpiece includes one or more of the following items: floating height, floating speed, rotation speed, rotation acceleration, and rotation deceleration.

[0013] In some embodiments, the pipeline support structure includes a stepped structure and a support plate, and each of the three-way air-floating air-inlet pipelines is supported by the stepped structure and the support plate.

[0014] In some embodiments, a cross-sectional size of the first recess of the first fixing unit is larger than a size of a corresponding pipeline portion of the air flotation pipeline received in the first recess.

[0015] In the second aspect of the present disclosure, a fixing method is provided, which is suitable for fixing the air float in a semiconductor process processing equipment using a fixing device in any of the above-mentioned embodiments. The semiconductor process processing equipment includes a processing chamber and a quartz plate located below the processing chamber. The fixing method includes: placing the air float on the quartz plate; positioning the air float three-way air inlet pipe of the air float in the mounting hole in the first wall of the processing chamber; fixing the first fixing unit of the fixing device to the quartz plate; and fixing the second fixing unit of the fixing device to the quartz plate.

[0016] In some embodiments, the surface of the quartz plate facing the air flotation includes a third mounting structure; fixing the first fixing unit of the fixing device to the quartz plate includes: aligning and receiving the first through hole of the first fixing unit with the first air flotation outlet disc of the air flotation; aligning and receiving the first recess of the first fixing unit with the air flotation pipeline of the air flotation; and connecting the first mounting structure of the first fixing unit with the third mounting structure of the quartz plate to fix the first fixing unit on the quartz plate.

[0017] In some embodiments, fixing the second fixing unit of the fixing device to the quartz plate includes: aligning the second recess of the second fixing unit with and receiving the second air-floating air outlet disc; and connecting the second mounting structure of the second fixing unit to the third mounting structure of the quartz plate.

[0018] In some embodiments, the fixing method further includes: before fixing the second fixing unit of the fixing device to the quartz plate, connecting the first positioning member to the first fixing unit, wherein the second through hole of the first positioning member is aligned and connected with the first through hole of the first fixing unit to position the first air-floating air outlet disc of the air-floating.

[0019] In some embodiments, the fixing method includes: connecting the third fixing unit to the first fixing unit of the fixing device to provide support and positioning for the air-floating three-way air inlet pipeline of the air-floating.

[0020] In some embodiments, the fixing method further includes: when the first fixing unit of the fixing device and the second fixing unit of the fixing device are fixed to the quartz plate, detecting a first gap between the first side of the fixing device and the first wall of the processing chamber and detecting a second gap between the second side of the fixing device and the second wall of the processing chamber; and determining whether the first gap and the second gap meet a predetermined gap value.

[0021] In some implementations, the predetermined gap value is zero.

[0022] In a third aspect of the present disclosure, a semiconductor process treatment equipment is provided, comprising: a treatment chamber, in which a workpiece to be treated is placed; a quartz plate, located below the treatment chamber; an air float, installed on the quartz plate, the air float is used to control the movement state of the workpiece; and a fixing device in any of the above embodiments, the fixing device fixes the air float on the quartz plate.

[0023] In some embodiments, the semiconductor processing equipment is a thermal processing equipment.

[0024] It should be understood that the contents described in the summary of the invention are not intended to limit the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0026] Figure 1 is a schematic structural diagram of a fixing device according to an embodiment of the present disclosure;

[0027] Figure 2 is a schematic structural diagram of a fixing device according to an embodiment of the present disclosure;

[0028] Figure 3 is a schematic diagram of the structure of the air flotation of an embodiment of the present disclosure;

[0029] Figure 4 It is a structural schematic diagram of the fixing device and the air flotation in the embodiment of the present disclosure;

[0030] Figure 5 It is a structural schematic diagram of the fixing device and the air flotation in the embodiment of the present disclosure;

[0031] Figure 6 is a schematic structural diagram of a semiconductor process equipment according to an embodiment of the present disclosure;

[0032] Figure 7 is a schematic structural diagram of a processing chamber according to an embodiment of the present disclosure;

[0033] Figure 8 is a schematic diagram of a fixing method according to an embodiment of the present disclosure.

[0034] Description of reference numerals:

[0035] 100: Fixture;

[0036] 101: first fixing unit;

[0037] 1011: first through hole;

[0038] 1012: first concave part;

[0039] 1013: first installation structure;

[0040] 102: second fixing unit;

[0041] 1021: second concave part;

[0042] 1022: second mounting structure;

[0043] 103: first positioning member;

[0044] 1031: second through hole;

[0045] 104: third fixing unit;

[0046] 1041: Pipeline support structure;

[0047] 105: limit structure;

[0048] 106: handle structure;

[0049] 107: pass / stop rule;

[0050] 200: air flotation;

[0051] 201: first air floats out of the air disc;

[0052] 205: vertical air flotation outlet disc;

[0053] 206: tilted air flotation outlet disc;

[0054] 202: air flotation pipeline;

[0055] 203: The second gas floats out of the gas disc;

[0056] 204: air flotation three-way air inlet pipe;

[0057] 300: Semiconductor process equipment;

[0058] 301: processing chamber;

[0059] 302: Quartz plate;

[0060] 3021: The third installation structure. DETAILED DESCRIPTION

[0061] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0062] like Figures 1 to 7 As shown, the present disclosure provides a fixing device 100 for fixing an air float 200 in a processing chamber 301 in a semiconductor process processing equipment 300. The fixing device 100 includes a first fixing unit 101 and a second fixing unit 102. The first fixing unit 101 includes a first through hole 1011 and a first recess 1012. The first through hole 1011 penetrates the first surface and the second surface of the first fixing unit 101 to receive the first part of the air float 200. The first recess 1012 is formed on the second surface to receive the second part of the air float 200, wherein a part of the first recess 1012 coincides with the first through hole 1011. The second fixing unit 102 includes a second recess 1021, and the second recess 1021 is used to receive the third part of the air float 200.

[0063] The semiconductor process equipment 300 may be a thermal processing equipment, a thin film deposition equipment, a cleaning equipment, an etching equipment, etc. Taking a thermal processing equipment as an example, Figure 6 , Figure 7As shown, the heat treatment equipment may include a processing chamber 301, a quartz plate 302, and an air float 200. The processing chamber 301 is used to place the workpiece to be processed (e.g., a wafer). The quartz plate 302 (the bottom wall of the processing chamber 301 in the figure) is located below the processing chamber 301. The air float 200 is installed on the quartz plate 302 to control the motion state of the workpiece. In some embodiments, the motion state may include floating height, floating speed, rotation speed, rotation acceleration, and rotation deceleration.

[0064] like Figures 3 to 6 As shown, the air flotation 200 may include 5 air flotation outlet discs, of which 3 air flotation blowing discs have vertical air flotation outlets for blowing air vertically toward the lower surface of the workpiece. The air flotation 200 may include a first air flotation outlet disc 201, i.e., the first part of the air flotation 200, and two vertical air flotation outlet discs labeled 205. The floating height and floating speed of the workpiece can be controlled by controlling the blowing volume of the three air flotation outlet discs. The other two air flotation outlet discs of the air flotation 200 have inclined air flotation outlets for blowing air obliquely toward the lower surface of the workpiece to control the rotation of the workpiece. The air flotation 200 may include a second air flotation outlet disc 203, i.e., the third part of the air flotation 200, and an inclined air flotation outlet disc labeled 206.

[0065] In some embodiments, after the workpiece floats, the air output of the third part of the air float 200, that is, the second air floatation air outlet disk 203, is controlled to control the workpiece along the Figure 6 The rotation speed and rotation acceleration of the clockwise rotation can control the rotation deceleration of the workpiece by controlling the gas output of the inclined air flotation gas outlet disk 206 .

[0066] The air flotation 200 may also include an air flotation pipeline 202 connected to the five air flotation outlet discs, i.e., the second part of the air flotation 200, and an air flotation three-way air inlet pipeline 204 that can be connected to the gas source, i.e., the fourth part of the air flotation 200. The gas provided by the gas source can be blown toward the workpiece through the air flotation three-way air inlet pipeline 204, the air flotation pipeline 202 and the five air flotation outlet discs in sequence.

[0067] The first fixing unit of the fixing device 100 is Figure 1 , Figure 2 , Figures 4 to 6 In the structure shown by reference numeral 101 , the upper surface of the first fixing unit 101 in the figure is the first surface of the first fixing unit 101 , and the lower surface of the first fixing unit 101 in the figure is the second surface of the first fixing unit 101 .

[0068] The first through hole 1011 passes through the first surface and the second surface. The first through hole 1011 can be Figure 2When cooperating with the air float 200 , the first part of the air float 200 , that is, a part of the first air floatation outlet disc 201 , is accommodated in the first through hole 1011 to achieve positioning of the first air floatation outlet disc 201 .

[0069] In some embodiments, the fixing device 100 further includes a first positioning member 103, which is detachably connected to the first fixing unit 101 (for example, Figure 1 , Figure 4 , Figure 6 The first positioning member 103 includes a second through hole 1031. When the first positioning member 103 is connected to the first fixing unit 101, the second through hole 1031 is connected to the first through hole 1011 and fixes another part of the first air flotation outlet disc 201, further positioning the first air flotation outlet disc 201, and improving the accuracy of positioning the air flotation 200 outlet.

[0070] In some embodiments, the second through hole 1031 has the same shape and size as the first through hole 1011, and both are slightly larger than the size of the first air flotation outlet disc 201. For example, the difference between the two is in the range of 0.1-0.2 mm. During the installation of the air flotation 200, the position of the first air flotation outlet disc 201 can be observed at any time through the second through hole 1031 and the first through hole 1011, thereby preventing failure caused by improper installation and improving the accuracy of the calibration of the fixture 100.

[0071] The first concave portion 1012 is located on the second surface and can be formed as Figure 5 When mating with the air flotation 200, the air flotation pipeline 202 is accommodated in the first recess 1012. In some embodiments, the cross-sectional size of the first recess 1012 of the first fixing unit 101 is larger than the size of the corresponding pipeline portion of the air flotation pipeline 202 received in the first recess 1012, so as to avoid a part of the air flotation pipeline 202 from being hard-contacted or squeezed by the first recess 1012 when mating with the first fixing unit 101.

[0072] The second fixing unit of the fixing device 100 can be Figure 1 , Figure 2 , Figures 4 to 6 In the structure shown by the middle number 102, the second recess 1021 can be Figure 1 , Figure 2 When cooperating with the air flotation 200, the third part of the air flotation 200, that is, at least part of the second air flotation outlet disc 203 is accommodated in the second recess 1021, so as to realize the positioning of the second air flotation outlet disc 203 and improve the accuracy of the positioning of the air flotation 200 outlet.

[0073] The air float 200 is mounted and fixed on the quartz plate 302 by using the fixing device 100, so as to efficiently realize the accurate positioning of the air float 200, improve the accuracy of the positioning of the air outlet of the air float 200, ensure the rotation characteristics of the workpiece, and improve the stability of the process.

[0074] In some embodiments, Figure 1 , Figure 2 , Figures 4 to 6 As shown, the fixture 100 and the processing chamber 301 can be connected in a detachable manner, for example, the first fixture unit 101 includes a first mounting structure 1013, and the first mounting structure 1013 can detachably mount the first fixture unit 101 to the processing chamber 301. The second fixture unit 102 includes a second mounting structure 1022, and the second mounting structure 1022 can detachably mount the second fixture unit 102 to the processing chamber 301. By adopting a detachable connection method, subsequent maintenance of the air flotation 200 or the fixture 100 can be facilitated.

[0075] like Figure 1 , Figure 2 , Figures 4 to 6 As shown, the first mounting structure 1013 may include two first protrusions, the first protrusions are hollow and protrude from the first surface of the first fixing unit 101. The second mounting structure 1022 includes a second protrusion, the second protrusion is hollow and protrudes from the first surface of the second fixing unit 102. When the fixing device 100 is connected to the quartz plate 302 of the processing chamber 301, the hollow first protrusion is sleeved on the third mounting structure 3021 (e.g. Figure 7 The first fixing unit 101 is fixed on the quartz plate 302. The second hollow protrusion is sleeved on the third mounting structure 3021 of the quartz plate 302 to fix the second fixing unit 102 on the quartz plate 302.

[0076] The relative positions of the two first protrusions and the first through hole 1011 can be adjusted, for example Figure 1 , Figure 2 , Figures 4 to 6 As shown, in some embodiments, the two first protrusions are respectively located on the first side and the second side of the first fixing unit 101 , and the first through hole 1011 is located between the two first protrusions to improve the stability of the connection between the first fixing unit 101 and the quartz plate 302 .

[0077] The relative positions of the second protrusion and the second recess 1021 can be adjusted, for example Figure 1 , Figure 2 , Figures 4 to 6 As shown, in some embodiments, the second protrusion is adjacent to the second recess 1021 .

[0078] In some embodiments, the three-way air inlet pipe 204 of the air flotation outside the processing chamber 301 is installed with a sealing ring to improve the sealing of the processing chamber 301. When installing the sealing ring, external force may be applied to the three-way air inlet pipe 204 of the air flotation. To this end, the three-way air inlet pipe 204 of the air flotation in the processing chamber 301 can be supported by the third fixing unit 104. For example, the fixing device 100 also includes a third fixing unit 104, which is detachably connected to the first fixing unit 101, and the third fixing unit 104 includes a pipe support structure 1041 for supporting the fourth part of the air flotation 200, that is, the three-way air inlet pipe 204 of the air flotation.

[0079] like Figure 1 , Figure 2 , Figure 4 As shown, the pipeline support structure 1041 may include a stepped structure and a support plate, and each of the three-way air-floating air-intake pipelines 204 is supported by the stepped structure and the support plate to avoid deformation and failure of the three-way air-floating air-intake pipelines 204 caused by force when installing the pipeline sealing ring outside the chamber.

[0080] In some embodiments, Figure 2 , Figure 4 , Figure 6 As shown, the first fixing unit 101 and the second fixing unit 102 are both provided with a limiting structure indicated by reference numeral 105. When the fixing device 100 is connected with the quartz plate 302, the limiting structure is inserted into the reserved gap between the quartz plate 302 and the side wall of the processing chamber 301 to position the fixing device 100 and calibrate the position of the fixing device 100.

[0081] After the above structure is inserted into the reserved gap, the position of the fixture 100 can be checked by comparing the first gap between the first side of the limiting structure 105 of the first fixing unit 101 and the first side wall of the processing chamber 301, and the second gap between the second side of the limiting structure 105 of the second fixing unit 102 and the second side wall of the processing chamber 301 with the preset gap value. In some embodiments, the preset gap value can be set to zero, so that after the limiting structure 105 is inserted into the reserved gap, the stability of the connection between the first fixing unit 101, the second fixing unit 102 and the processing chamber 301 is improved, the displacement or shaking of the first fixing unit 101, the second fixing unit 102 is avoided, and the accuracy of the fixing device 100 in positioning the air float 200 is improved.

[0082] The mutually cooperating positioning structures arranged on the fixing device 100 and the processing chamber 301 and the quartz plate 302 can be used to detect and correct the relative position of the quartz plate 302 and the processing chamber 301 .

[0083] In some embodiments, Figure 1 , Figure 2 , Figures 4 to 6 As shown, the first fixing unit 101 and the second fixing unit 102 may also be configured with a handle structure shown by reference numeral 106 for an operator to grasp and operate.

[0084] In some embodiments, the fixing device 100 may be made of a relatively soft Teflon material to reduce damage to the air float 200 or the quartz plate 302 caused by hard contact.

[0085] In some embodiments, Figure 4 , Figure 6 As shown, the fixing device 100 may also include a go / no-go gauge 107 for detecting and obtaining information on the size of the three-way air inlet pipe 204 for flotation located outside the processing chamber 301. By comparing the information with a preset information range value (e.g., 3.5-4.5 mm), it can be determined whether the size of the exposed portion is too long or too short. It can also be used to detect whether the exposed size of the three-way air inlet pipe 204 for flotation is qualified or not.

[0086] In some embodiments, the edges of the surfaces of the first fixing unit 101 and the second fixing unit 102 connected to the quartz plate 302 are chamfered to facilitate their installation in the processing chamber 301. The edges of the first through hole 1011, the second through hole 1031 and the second recess 1021 can also be chamfered to facilitate the air flotation outlet disc of the air flotation 200 to be accommodated therein.

[0087] like Figure 8 As shown, the present disclosure provides a fixing method, which is suitable for fixing the air float in a semiconductor process processing equipment using the fixing device 100 in any of the above embodiments. The semiconductor process processing equipment includes a processing chamber and a quartz plate located below the processing chamber. The fixing method includes:

[0088] S101: placing the air float on a quartz plate;

[0089] S102: positioning a three-way air inlet pipe of an air flotation in a mounting hole in a first wall of the processing chamber;

[0090] S103: fixing the first fixing unit of the fixing device to the quartz plate; and

[0091] S104: Fixing the second fixing unit of the fixing device to the quartz plate.

[0092] In some embodiments, the surface of the quartz plate facing the air flotation includes a third mounting structure; fixing the first fixing unit of the fixing device to the quartz plate includes: aligning the first through hole of the first fixing unit with and receiving the first air flotation outlet disc of the air flotation; aligning the first recess of the first fixing unit with and receiving the air flotation pipeline of the air flotation; and connecting the first mounting structure of the first fixing unit with the third mounting structure of the quartz plate to fix the first fixing unit on the quartz plate.

[0093] In some embodiments, fixing the second fixing unit of the fixing device to the quartz plate includes: aligning the second recess of the second fixing unit with and receiving the second air-floating air outlet disc; and connecting the second mounting structure of the second fixing unit with the third mounting structure of the quartz plate.

[0094] In some embodiments, the fixing method further includes: before fixing the second fixing unit of the fixing device to the quartz plate, connecting the first positioning member to the first fixing unit, wherein the second through hole of the first positioning member is aligned and connected with the first through hole of the first fixing unit to position the first air-floating air outlet disc of the air-floating.

[0095] In some embodiments, the fixing method includes: connecting a third fixing unit to the first fixing unit of the fixing device to provide support and positioning for the air-floating three-way air inlet pipe of the air-floating.

[0096] In some embodiments, the fixing method further includes: when the first fixing unit of the fixing device and the second fixing unit of the fixing device are fixed to the quartz plate, detecting a first gap between the first side of the fixing device and the first wall of the processing chamber and detecting a second gap between the second side of the fixing device and the second wall of the processing chamber; and determining whether the first gap and the second gap meet a predetermined gap value.

[0097] In some embodiments, the predetermined gap value is zero.

[0098] When installing the fixing device of the disclosed embodiment, first place the air float on the quartz plate below the processing chamber, move the three-way air inlet pipe of the air float into the installation hole of the first wall of the processing chamber, then install the first fixing unit of the fixing device, and install the two first installation structures on the third installation structure of the quartz plate, so that the first fixing unit is installed in the processing chamber. Next, fix the first positioning member to the first fixing unit, thereby realizing the positioning of the first air float outlet disc.

[0099] Then install the second fixing unit, install the second mounting structure on the third mounting structure of the quartz plate to realize the positioning of the second air flotation outlet disc, and install the pipeline support plate on the pipeline support structure to realize the support and positioning of the three-way air flotation inlet pipeline.

[0100] Finally, a go / no-go gauge is used to detect the size of the portion of the flotation three-way air inlet pipe exposed in the processing chamber to avoid failure caused by the exposed size of the flotation three-way air inlet pipe being too long or too short.

[0101] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0102] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0103] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0104] In the present disclosure, unless otherwise expressly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0105] The disclosure above provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0106] The above specific implementations do not constitute a limitation on the protection scope of the present disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A fixing device for fixing an air float in a processing chamber of a semiconductor process equipment, the fixing device comprising: A first fixing unit, comprising a first through hole and a first recess, wherein the first through hole penetrates through the first surface and the second surface of the first fixing unit to receive the first part of the air float, and the first recess is formed on the second surface to receive the second part of the air float, wherein a part of the first recess coincides with the first through hole; A second fixing unit includes a second recess, wherein the second recess is used to receive the third part of the air float; a third fixing unit, detachably connected to the first fixing unit, wherein the third fixing unit comprises a pipe supporting structure for supporting the fourth part of the air float; The first part of the air flotation includes a first air flotation outlet disc, the second part of the air flotation includes an air flotation pipeline, the third part of the air flotation includes a second air flotation outlet disc, and the fourth part of the air flotation includes a three-way air flotation air inlet pipeline.

2. The fixing device according to claim 1, further comprising: The first positioning member is detachably connected to the first fixing unit. The first positioning member includes a second through hole. When the first positioning member is connected to the first fixing unit, the second through hole is communicated with the first through hole and fixes the first part of the air float.

3. The fixing device according to claim 1, wherein: The first fixing unit includes a first mounting structure, and the first mounting structure can detachably mount the first fixing unit to the processing chamber; The second fixing unit includes a second mounting structure, and the second mounting structure can detachably mount the second fixing unit to the processing chamber.

4. The fixing device according to claim 3, wherein: The first mounting structure includes two first protrusions, wherein the first protrusions are hollow and protrude out of the first surface of the first fixing unit; The second mounting structure includes a second protrusion, which is hollow and protrudes out of the first surface of the second fixing unit.

5. The fixing device according to claim 4, wherein: The two first protrusions are respectively located at a first side and a second side of the first fixing unit, and the first through hole is located between the two first protrusions.

6. The fixing device according to claim 4, wherein: The second protrusion is adjacent to the second recess.

7. A fixing device according to any one of claims 1 to 6, wherein: The three-way air flotation inlet pipe, the air flotation pipeline, the first air flotation outlet disc and the second air flotation outlet disc are connected to provide airflow, and the airflow controls the movement state of the workpiece located in the processing chamber.

8. The fixing device according to claim 7, wherein: The motion state of the workpiece includes one or more of the following items: floating height, floating speed, rotation speed, rotation acceleration, and rotation deceleration.

9. The fixing device according to claim 7, wherein: The pipeline support structure comprises a stepped structure and a support plate, and each of the three-way air-floating air-intake pipelines is supported by the stepped structure and the support plate.

10. The fixing device according to claim 7, wherein: The cross-sectional size of the first recess of the first fixing unit is larger than the size of the corresponding pipeline portion of the air flotation pipeline received in the first recess.

11. A fixing method, suitable for fixing the air float in a semiconductor process processing equipment using the fixing device according to any one of claims 1 to 10, wherein the semiconductor process processing equipment comprises a processing chamber and a quartz plate located below the processing chamber, the fixing method comprising: placing an air float on the quartz plate; Positioning the three-way air flotation inlet conduit of the air flotation in the mounting hole in the first wall of the processing chamber; fixing a first fixing unit of the fixing device to the quartz plate; and The second fixing unit of the fixing device is fixed to the quartz plate.

12. The fixing method according to claim 11, wherein: The surface of the quartz plate facing the air bearing includes a third mounting structure; Fixing the first fixing unit of the fixing device to the quartz plate comprises: Aligning the first through hole of the first fixing unit with the first air flotation outlet disc of the air flotation; Aligning the first recess of the first fixing unit with the air flotation pipeline of the air flotation; and The first mounting structure of the first fixing unit is connected to the third mounting structure of the quartz plate to fix the first fixing unit on the quartz plate.

13. The fixing method according to claim 12, wherein: Fixing the second fixing unit of the fixing device to the quartz plate comprises: Aligning the second recess of the second fixing unit with the second air-floating outlet disc of the air-floating device and receiving the second air-floating outlet disc; and The second mounting structure of the second fixing unit is connected to the third mounting structure of the quartz plate.

14. The fixing method according to claim 12, further comprising: Before fixing the second fixing unit of the fixing device to the quartz plate, a first positioning member is connected to the first fixing unit, wherein the second through hole of the first positioning member is aligned and communicated with the first through hole of the first fixing unit to position the first air-floating air outlet disc.

15. The fixing method according to claim 13, comprising: The third fixing unit is connected to the first fixing unit of the fixing device to provide support and positioning for the air flotation three-way air inlet pipeline of the air flotation.

16. The fixing method according to claim 15, further comprising: When the first fixing unit and the second fixing unit of the fixing device are fixed to the quartz plate, detecting a first gap between a first side of the fixing device and a first wall of the processing chamber and detecting a second gap between a second side of the fixing device and a second wall of the processing chamber; It is determined whether the first gap and the second gap satisfy a predetermined gap value.

17. The fixing method according to claim 16, wherein: The predetermined gap value is zero.

18. A semiconductor process equipment, comprising: a processing chamber, in which a workpiece to be processed is placed; a quartz plate, located below the processing chamber; An air float is installed on the quartz plate, and the air float is used to control the motion state of the workpiece; as well as The fixing device according to any one of claims 1 to 10, wherein the fixing device fixes the air float on the quartz plate.

19. The semiconductor process equipment according to claim 18, wherein: The semiconductor process equipment is a thermal processing equipment.

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