A ceramic base packaging structure

Abstract

The present invention relates to a ceramic base packaging structure applied to the field of ceramic base packaging, comprising a ceramic base, wherein the ceramic base is composed of a first sealing layer, a second sealing layer and a base layer stacked up and down in sequence, wherein a first reinforcement groove is provided at the upper end of the first sealing layer to avoid a metal circuit layer, a reinforcement hole extending downward is provided at the bottom of the first reinforcement groove, and a second reinforcement groove whose length or width is greater than that of the reinforcement hole is provided at the lower end of the reinforcement hole, and a consolidating agent is injected into the first reinforcement groove, the reinforcement hole and the second reinforcement groove. By adopting the above-mentioned structures such as the first reinforcement groove, the reinforcement hole and the second reinforcement groove, the contact area between the bottom of the packaged chip and the first sealing layer is increased, and the connection stability between the packaged chip and the first sealing layer is enhanced by injecting the consolidating agent. After the consolidating agent solidifies, an I-shaped structure is formed, so that the installed packaged chip is more secure and not easy to detach, thereby enhancing the overall stability of the ceramic base packaging structure.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to a ceramic base packaging structure applied in the field of ceramic base packaging. Background Art

[0002] At present, the mainstream packaging method of LED is organic packaging, and the main packaging materials are mostly organic materials such as epoxy resin and silicone resin. However, due to the shorter wavelength of ultraviolet light and high radiation energy, these organic materials are prone to aging after long-term exposure to it, thereby reducing the luminous efficiency of the LED chip and affecting its performance and life. With the continuous advancement of UVLED packaging technology, in order to improve the stability of UVLED use, inorganic materials are gradually replacing organic materials for packaging. Nowadays, most of the inorganic packaging on the market uses ceramic frames, but it is still inevitable to use organic glue to connect it with the UVLED packaging liner. Of course, there are also research institutions (such as Kyocera in Japan) that have developed the use of ceramic frames and packaging liner for integrated molding, eliminating the subsequent packaging connection problem between the two, but this process is complicated and requires the production of precision molds. The production cost is extremely high and is not suitable for industrial mass production.

[0003] To solve the above problems, the Chinese patent CN206003815U specification discloses a UVLED ceramic base packaging structure, which includes a ceramic substrate, a metal layer, a solder layer and a packaging ceramic frame. The metal layer includes a circuit connection part distributed on the ceramic substrate and a packaging connection part surrounding the circuit connection part. In a direction perpendicular to the ceramic substrate, the metal layer includes a first metal layer and a second metal layer. The first metal layer is arranged on the surface of the ceramic substrate, the second metal layer is arranged on the surface of the first metal layer, the solder layer is arranged on the packaging connection part, and the packaging ceramic frame is arranged on the solder layer. The UVLED ceramic base packaging structure can realize inorganic packaging of the UVLED ceramic base, avoid the use of organic packaging materials, and extend the service life of the LED device.

[0004] Most of the existing ceramic bases use the low temperature co-firing (LTCC) process to sinter the multi-layer ceramic matrix, so as to obtain a ceramic base with good integrity. However, the existing ceramic base is mostly combined with the packaged chip during packaging by welding the wire and the pin, so that the bonding force between the packaged chip and the ceramic base is not strong enough. The wire bears the main bonding force, which makes the wire more prone to breakage and other problems. In addition, the pre-connection between the multi-layer structures of the existing ceramic base is mostly achieved by pressing. The strength of the pre-connection structure itself is not high, and it is easy to have displacement before sintering or displacement during the pre-connection process, affecting the subsequent molding operation. Summary of the invention

[0005] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is how to provide a ceramic base packaging structure that can enhance the connection strength between the packaged chip and the ceramic base, while enhancing the structural strength and stability of the ceramic base itself.

[0006] To solve the above problems, the present invention provides a ceramic base packaging structure, including a ceramic base, the ceramic base is composed of a first sealing layer, a second sealing layer and a base layer stacked up and down in sequence, a metal circuit layer is arranged on the upper surface of the first sealing layer, between the first sealing layer and the second sealing layer, and between the second sealing layer and the base layer, the first sealing layer, the second sealing layer and the base layer are all provided with vertically extending through holes, a connecting circuit is arranged in the through holes, and the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit are sintered and formed using an LTCC process;

[0007] A packaged chip electrically connected to the connecting circuit is fixed on the upper end of the ceramic base;

[0008] A first reinforcing groove is formed at the upper end of the first sealing layer, avoiding the metal circuit layer; a reinforcing hole extending downward is formed at the bottom of the first reinforcing groove; a second reinforcing groove having a length or width greater than that of the reinforcing hole is formed at the lower end of the reinforcing hole; and a consolidating agent is injected into the first reinforcing groove, the reinforcing hole and the second reinforcing groove;

[0009] A portion of the lower end of the packaged chip is fixed to the first sealing layer by a consolidating agent;

[0010] A reinforcement structure for increasing connection stability is arranged between the first sealing layer, the second sealing layer and the base layer.

[0011] In the above-mentioned ceramic base packaging structure, the contact area between the bottom of the packaged chip and the first sealing layer can be increased by providing the first reinforcement groove, and the connection stability between the packaged chip and the first sealing layer can be enhanced by injecting a consolidating agent. After the consolidating agent solidifies, an I-shaped structure is formed, so that the installed packaged chip is more secure and not easy to detach, thereby enhancing the overall stability of the ceramic base packaging structure;

[0012] In addition, by increasing the connection stability between the first sealing layer, the second sealing layer and the base layer through the reinforcement structure, the purpose of enhancing the overall stability of the ceramic base packaging structure is also achieved.

[0013] As a further supplement to the present application, the reinforcement structure includes an anchoring column and a receiving groove, and a plurality of anchoring columns are provided, and the plurality of anchoring columns are respectively located at the lower end of the first sealing layer or the second sealing layer and are integrally formed with the first sealing layer or the second sealing layer;

[0014] The receiving groove is opened on the upper end surface of the second sealing layer and the base layer, and the receiving groove is set away from the metal circuit layer.

[0015] The anchor column is plugged and fixed into the receiving groove.

[0016] Before the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit are sintered and formed using the LTCC process, the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit need to be assembled and installed first, and pressed to shape them before sintering. Before the pre-pressing process, the first sealing layer is inserted into the receiving groove of the second sealing layer through the anchoring column. Similarly, the second sealing layer is inserted into the receiving groove of the base layer through the anchoring column, so that the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit are assembled and have a relatively stable connection structure before pressing, thereby ensuring that the ceramic base packaging structure is not prone to displacement or deviation during pressing, ensuring the structural stability during pressing and the accuracy after pressing, thereby improving the finished product qualification rate of the ceramic base packaging structure to a certain extent, weakening the accuracy requirements during pressing, and helping to reduce production costs.

[0017] As a further supplement to the present application, a convex expansion foot protruding outward is formed on the peripheral side of the lower end of the anchor column, and the cross section of the convex expansion foot is semicircular;

[0018] A recessed portion adapted to the convex expanded foot is formed on the inner side of the receiving groove. The setting of the convex expanded foot can prevent the first sealing layer and the second sealing layer or the second sealing layer and the base layer from being separated up and down due to unexpected forces after insertion, thereby avoiding the need to dock and combine the first sealing layer, the second sealing layer and the base layer multiple times, further improving the stability of the ceramic base packaging structure after assembly.

[0019] As a further supplement to the present application, the interface between the reinforcement hole and the first reinforcement groove and the interface between the reinforcement hole and the second reinforcement groove are both arranged at the transition chamfer portion, and the transition chamfer portion is a trumpet-shaped structure that expands away from the middle of the reinforcement hole. Through the setting of the transition chamfer portion, it is possible to easily discharge the air in the second reinforcement groove and the reinforcement hole when injecting the consolidating agent, thereby avoiding hollowing of the second reinforcement groove and the reinforcement hole, thereby avoiding a series of connection instability or other problems caused by subsequent hollowing of the ceramic base packaging structure.

[0020] As another improvement of the present application, a main glue injection hole is opened on the first sealing layer, one end of the main glue injection hole forms an opening on the upper end surface of the first sealing layer, and the other end of the main glue injection hole is connected to the bottom of one of the second reinforcement grooves;

[0021] The plurality of second reinforcement grooves are interconnected through auxiliary glue injection holes;

[0022] Through the setting of the main injection hole and the auxiliary injection hole, when the consolidating agent needs to be injected, the staff can inject it into one of the second reinforcement grooves through the main injection hole, and inject the consolidating agent into multiple second reinforcement grooves at the same time through the auxiliary injection hole, so as to achieve the purpose of completing the injection operation at one time. At the same time, injecting from the bottom of the second reinforcement groove can also avoid the second reinforcement groove or reinforcement hole from hollowing during the injection process to the greatest extent, and further avoid a series of connection instability or other problems caused by subsequent hollowing of the ceramic base packaging structure.

[0023] As another improved supplement of the present application, the first sealing layer, the second sealing layer and both sides of the base layer are provided with glue removal grooves, and the end openings of the glue removal grooves intersect with the edges of the metal circuit layer;

[0024] The first sealing layer, the second sealing layer and the base layer are also provided with a glue discharge channel connected to the glue discharge groove, and the glue discharge channel is located at the end of the first sealing layer or the second sealing layer or the base layer close to the metal circuit layer;

[0025] The glue removal channel is connected to the first sealing layer or the second sealing layer or the connection between the second sealing layer and the metal circuit layer through a branch channel, and one or more branch channels are provided;

[0026] The glue discharge channel and the branch channel are both arranged to avoid the anchoring column.

[0027] By setting the glue discharge groove, the glue discharge channel and the branch channel, the impurities after the adhesive is sintered can be better discharged during sintering, so that the ceramic base packaging structure has better bonding after sintering, thereby improving the integrity of the ceramic base packaging structure and extending the service life.

[0028] As another improvement of the present application, heat dissipation teeth are provided in the glue discharge groove, and a plurality of heat dissipation teeth are provided and distributed in a tooth shape along the inner wall of the glue discharge groove. The plurality of heat dissipation teeth are respectively integrally formed with the first sealing layer or the second sealing layer or the base layer.

[0029] By providing the heat dissipation teeth, a heat dissipation structure can be formed on the side wall of the ceramic base packaging structure, so that it has better heat dissipation performance, thereby extending the service life of the ceramic base packaging structure.

[0030] As another improvement of the present application, heat pipes are fixedly embedded in the first sealing layer, the second sealing layer and the ends of the base layer close to the metal circuit layer, one end of the heat pipe is close to the middle of the ceramic base, and the other end of the heat pipe slightly extends out of one side of the ceramic base, and the heat pipe is arranged to avoid the anchor column.

[0031] The heat pipe can also play a role in heat dissipation by providing a heat pipe, and the heat dissipation effect of the heat pipe is better and the heat dissipation efficiency is higher, further extending the service life of the ceramic base packaging structure.

[0032] In summary, the contact area between the bottom of the packaged chip and the first sealing layer can be increased by providing the first reinforcement groove, and the connection stability between the packaged chip and the first sealing layer can be enhanced by injecting a consolidating agent. After the consolidating agent solidifies, an I-shaped structure is formed, so that the installed packaged chip is more secure and not easy to fall off, thereby enhancing the overall stability of the ceramic base packaging structure;

[0033] In addition, the connection stability between the first sealing layer, the second sealing layer and the base layer is increased by the reinforcement structure. Specifically, before the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit are sintered and formed using the LTCC process, the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit need to be assembled and installed first, and pressed to shape them before sintering. Before the pre-pressing process, the first sealing layer is inserted into the receiving groove of the second sealing layer through the anchoring column. Similarly, the second sealing layer is inserted into the receiving groove of the base layer through the anchoring column, so that the first sealing layer, the second sealing layer, the base layer, the metal circuit layer and the connecting circuit are assembled and have a relatively stable connection structure before pressing, thereby ensuring that the ceramic base packaging structure is not prone to displacement or deviation during pressing, ensuring the structural stability during pressing and the accuracy after pressing, thereby improving the finished product qualification rate of the ceramic base packaging structure to a certain extent, weakening the accuracy requirements during pressing, and helping to reduce production costs;

[0034] At the same time, through the setting of the main injection hole and the auxiliary injection hole, when the consolidating agent needs to be injected, the staff can inject it into one of the second reinforcement grooves through the main injection hole, and inject the consolidating agent into multiple second reinforcement grooves at the same time through the auxiliary injection hole, so as to achieve the purpose of completing the injection operation at one time. At the same time, injecting from the bottom of the second reinforcement groove can also avoid the generation of hollowing in the second reinforcement groove or reinforcement hole during the injection process to the greatest extent, and further avoid a series of connection instability or other problems caused by subsequent hollowing of the ceramic base packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a cross-sectional view of the first embodiment of the present application;

[0036] Figure 2 Another cross-sectional view of the first embodiment of the present application;

[0037] Figure 3 for Figure 2 A magnified view of the structure at center;

[0038] Figure 4 This is a top view of the first embodiment of the present application when the packaged chip is hidden;

[0039] Figure 5 This is a distribution diagram of the main glue injection holes and the auxiliary glue injection holes when the second embodiment of the present application is viewed in section;

[0040] Figure 6 This is a schematic diagram of the distribution of the glue removal grooves when the second embodiment of the present application is viewed in section;

[0041] Figure 7 This is a schematic diagram of the positions of the heat dissipation teeth when the third embodiment of the present application is viewed in section;

[0042] Figure 8 This is a schematic diagram of the heat pipe position when viewed in cross section in the fourth embodiment of the present application.

[0043] Description of the numbers in the figure:

[0044] 1. Ceramic base; 11. First sealing layer; 111. First reinforcement groove; 112. Reinforcement hole; 1121. Transition chamfer; 113. Second reinforcement groove; 12. Second sealing layer; 13. Base layer; 14. Anchor column; 141. Outwardly convex expansion foot; 15. Receiving groove; 2. Metal circuit layer; 3. Connecting circuit; 4. Packaged chip; 5. Main injection hole; 51. Auxiliary injection hole; 6. Glue discharge groove; 61. Glue discharge channel; 611. Branch channel; 7. Heat dissipation teeth; 8. Heat pipe. DETAILED DESCRIPTION

[0045] The following is a detailed description of four implementation methods of the present application in conjunction with the accompanying drawings.

[0046] The first implementation method:

[0047] The present invention provides a ceramic base packaging structure, see Figure 1-Figure 4 , comprising a ceramic base 1, the ceramic base 1 is composed of a first sealing layer 11, a second sealing layer 12 and a base layer 13 stacked up and down in sequence, a metal circuit layer 2 is arranged on the upper surface of the first sealing layer 11, between the first sealing layer 11 and the second sealing layer 12, and between the second sealing layer 12 and the base layer 13, the first sealing layer 11, the second sealing layer 12 and the base layer 13 are all provided with vertically extending through holes, a connecting circuit 3 is arranged in the through holes, and the first sealing layer 11, the second sealing layer 12, the base layer 13, the metal circuit layer 2 and the connecting circuit 3 are sintered and formed using a LTCC process;

[0048] A package chip 4 electrically connected to the connecting circuit 3 is fixed on the upper end of the ceramic base 1;

[0049] The first sealing layer 11 has a first reinforcement groove 111 formed on the upper end thereof to avoid the metal circuit layer 2, a reinforcement hole 112 extending downward is formed on the bottom of the first reinforcement groove 111, a second reinforcement groove 113 having a length or width greater than that of the reinforcement hole 112 is formed on the lower end of the reinforcement hole 112, and a consolidating agent is injected into the first reinforcement groove 111, the reinforcement hole 112 and the second reinforcement groove 113;

[0050] The lower end area of ​​the packaged chip 4 is fixed on the first sealing layer 11 by a consolidating agent;

[0051] A reinforcement structure for increasing connection stability is provided between the first sealing layer 11 , the second sealing layer 12 and the base layer 13 .

[0052] Based on the above structure, the contact area between the bottom of the packaged chip 4 and the first sealing layer 11 can be increased by setting the first reinforcement groove 111, and the connection stability between the packaged chip 4 and the first sealing layer 11 can be enhanced by injecting a consolidating agent. After the consolidating agent solidifies, an I-shaped structure is formed, so that the installed packaged chip 4 is more secure and not easy to fall off, thereby enhancing the overall stability of the ceramic base packaging structure;

[0053] In addition, the connection stability between the first sealing layer 11, the second sealing layer 12 and the base layer 13 is increased by the reinforcement structure, thereby also achieving the purpose of enhancing the overall stability of the ceramic base packaging structure.

[0054] Figure 2 The reinforcement structure is shown to include an anchoring column 14 and a receiving groove 15. A plurality of anchoring columns 14 are provided. The plurality of anchoring columns 14 are respectively located at the lower end of the first sealing layer 11 or the second sealing layer 12 and are integrally formed with the first sealing layer 11 or the second sealing layer 12;

[0055] The receiving groove 15 is formed on the upper end surface of the second sealing layer 12 and the base layer 13, and the receiving groove 15 is arranged away from the metal circuit layer 2.

[0056] The anchoring column 14 is plugged and fixed into the receiving groove 15 .

[0057] Before the first sealing layer 11, the second sealing layer 12, the base layer 13, the metal circuit layer 2 and the connecting circuit 3 are sintered and formed using the LTCC process, the first sealing layer 11, the second sealing layer 12, the base layer 13, the metal circuit layer 2 and the connecting circuit 3 need to be assembled and installed first, and pressed to shape them before sintering. Before the pre-pressing, the first sealing layer 11 is inserted into the receiving groove 15 of the second sealing layer 12 through the anchoring column 14. Similarly, the second sealing layer 12 is inserted into the receiving groove 15 of the base layer 13 through the anchoring column 14, so that the first sealing layer 11, the second sealing layer 12, the base layer 13, the metal circuit layer 2 and the connecting circuit 3 are assembled and have a relatively stable connection structure before pressing, thereby ensuring that the ceramic base packaging structure is not prone to displacement or deviation during pressing, ensuring the structural stability during pressing and the accuracy after pressing, thereby improving the finished product qualification rate of the ceramic base packaging structure to a certain extent, weakening the accuracy requirements during pressing, and helping to reduce production costs.

[0058] Figure 2 It is shown that an outwardly protruding expanded foot 141 is formed on the peripheral side of the lower end of the anchor column 14, and the cross section of the outwardly protruding expanded foot 141 is semicircular;

[0059] A recessed portion adapted to the convex expansion foot 141 is formed on the inner side of the receiving groove 15. The setting of the convex expansion foot 141 can prevent the first sealing layer 11 and the second sealing layer 12 or the second sealing layer 12 and the base layer 13 from being separated up and down due to unexpected forces after insertion, thereby avoiding the need for multiple docking and combination of the first sealing layer 11, the second sealing layer 12 and the base layer 13, further improving the stability of the ceramic base packaging structure after assembly.

[0060] Figure 3 It is shown that the interface between the reinforcement hole 112 and the first reinforcement groove 111 and the interface between the reinforcement hole 112 and the second reinforcement groove 113 are both arranged at the transition chamfer 1121. The transition chamfer 1121 is a trumpet-shaped structure that expands away from the middle of the reinforcement hole 112. Through the setting of the transition chamfer 1121, it is convenient to discharge the air in the second reinforcement groove 113 and the reinforcement hole 112 when injecting the consolidating agent, thereby avoiding the second reinforcement groove 113 and the reinforcement hole 112 from hollowing, thereby avoiding a series of connection instability or other problems caused by subsequent hollowing of the ceramic base packaging structure.

[0061] Second implementation method:

[0062] Figure 5 It is shown that a main glue injection hole 5 is opened on the first sealing layer 11, one end of the main glue injection hole 5 forms an opening on the upper end surface of the first sealing layer 11, and the other end of the main glue injection hole 5 is connected to the bottom of one of the second reinforcement grooves 113;

[0063] The plurality of second reinforcement grooves 113 are interconnected through auxiliary glue injection holes 51;

[0064] By setting the main injection hole 5 and the auxiliary injection hole 51, when it is necessary to inject the consolidating agent, the staff can inject it into one of the second reinforcement grooves 113 through the main injection hole 5, and inject the consolidating agent into multiple second reinforcement grooves 113 through the auxiliary injection hole 51 at the same time, so as to achieve the purpose of completing the injection operation at one time. At the same time, injecting from the bottom of the second reinforcement groove 113 can also avoid the second reinforcement groove 113 or the reinforcement hole 112 from hollowing during the injection process to the greatest extent, and further avoid a series of connection instability or other problems caused by subsequent hollowing of the ceramic base packaging structure.

[0065] Figure 6 It is shown that both sides of the first sealing layer 11, the second sealing layer 12 and the base layer 13 are provided with a glue removal groove 6, and the end opening of the glue removal groove 6 intersects with the edge of the metal circuit layer 2;

[0066] The first sealing layer 11, the second sealing layer 12 and the base layer 13 are further provided with a debonding channel 61 connected to the debonding groove 6. The debonding channel 61 is located at the end of the first sealing layer 11 or the second sealing layer 12 or the base layer 13 close to the metal circuit layer 2.

[0067] The glue discharge channel 61 is connected to the first sealing layer 11 or the second sealing layer 12 or the connection between the second sealing layer 12 and the metal circuit layer 2 through the branch channel 611, and one or more branch channels 611 are provided;

[0068] The glue discharge channel 61 and the branch channel 611 are both arranged to avoid the anchor column 14 .

[0069] By setting the glue discharge groove 6, the glue discharge channel 61 and the branch channel 611, the impurities after the adhesive is sintered can be better discharged during sintering, so that the ceramic base packaging structure has better bonding after sintering, thereby improving the integrity of the ceramic base packaging structure and extending the service life.

[0070] The third implementation method:

[0071] Figure 7 It is shown that heat dissipation teeth 7 are arranged in the glue removal groove 6, and a plurality of heat dissipation teeth 7 are arranged and distributed in a tooth shape along the inner wall of the glue removal groove 6. The plurality of heat dissipation teeth 7 are respectively integrally formed with the first sealing layer 11 or the second sealing layer 12 or the base layer 13.

[0072] By providing the heat dissipation teeth 7, a heat dissipation structure can be formed on the side wall of the ceramic base packaging structure, so that it has better heat dissipation performance, thereby extending the service life of the ceramic base packaging structure.

[0073] The fourth implementation method:

[0074] Figure 8 It is shown that the first sealing layer 11, the second sealing layer 12 and the base layer 13 are fixedly embedded with heat pipes 8 at the ends close to the metal circuit layer 2, one end of the heat pipe 8 is close to the middle of the ceramic base 1, and the other end of the heat pipe 8 slightly extends out of one side of the ceramic base 1, and the heat pipe 8 is arranged to avoid the anchor column 14.

[0075] The heat pipe 8 can also play a role in heat dissipation, and the heat pipe 8 has a better heat dissipation effect and higher heat dissipation efficiency, further extending the service life of the ceramic base packaging structure.

[0076] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A ceramic base packaging structure, comprising a ceramic base (1), the ceramic base (1) comprising a first sealing layer (11), a second sealing layer (12) and a base layer (13) stacked in sequence, a metal circuit layer (2) being arranged on the upper surface of the first sealing layer (11), between the first sealing layer (11) and the second sealing layer (12), and between the second sealing layer (12) and the base layer (13), the first sealing layer (11), the second sealing layer (12) and the base layer (13) being provided with vertically extending through holes, the through holes being provided with connecting circuits (3), the first sealing layer (11), the second sealing layer (12), the base layer (13) and the metal circuit layer (2) and the connecting circuit (3) being sintered and formed by using a LTCC process, characterized in that: A packaged chip (4) electrically connected to the connecting circuit (3) is fixed on the upper end of the ceramic base (1); A first reinforcement groove (111) is formed at the upper end of the first sealing layer (11) to avoid the metal circuit layer (2); a reinforcement hole (112) extending downward is formed at the bottom of the first reinforcement groove (111); a second reinforcement groove (113) having a length or width greater than that of the reinforcement hole (112) is formed at the lower end of the reinforcement hole (112); and a consolidating agent is injected into the first reinforcement groove (111), the reinforcement hole (112) and the second reinforcement groove (113); The lower end portion of the packaged chip (4) is fixed to the first sealing layer (11) by means of a consolidating agent; A reinforcement structure for increasing connection stability is provided between the first sealing layer (11), the second sealing layer (12) and the base layer (13); The reinforcement structure comprises an anchoring column (14) and a receiving groove (15), wherein a plurality of the anchoring columns (14) are provided, and the plurality of anchoring columns (14) are respectively located at the lower end of the first sealing layer (11) or the second sealing layer (12) and are integrally formed with the first sealing layer (11) or the second sealing layer (12); The receiving groove (15) is provided on the upper end surfaces of the second sealing layer (12) and the base layer (13), and the receiving groove (15) is arranged away from the metal circuit layer (2). The anchoring column (14) is plugged and fixed into the receiving groove (15); A main glue injection hole (5) is provided on the first sealing layer (11), one end of the main glue injection hole (5) forms an opening on the upper end surface of the first sealing layer (11), and the other end of the main glue injection hole (5) is connected to the bottom of one of the second reinforcement grooves (113); The plurality of second reinforcement grooves (113) are interconnected via auxiliary glue injection holes (51); Glue removal grooves (6) are provided on both sides of the first sealing layer (11), the second sealing layer (12) and the base layer (13), and the end openings of the glue removal grooves (6) intersect with the edges of the metal circuit layer (2); A glue discharge channel (61) communicating with the glue discharge groove (6) is further provided in the first sealing layer (11), the second sealing layer (12) and the base layer (13); the glue discharge channel (61) is located at an end of the first sealing layer (11) or the second sealing layer (12) or the base layer (13) close to the metal circuit layer (2); The debonding channel (61) is connected to the first sealing layer (11) or the second sealing layer (12) or the connection between the second sealing layer (12) and the metal circuit layer (2) through a branch channel (611), and one or more branch channels (611) are provided; The glue discharge channel (61) and the branch channel (611) are both arranged away from the anchor column (14); A heat dissipation tooth (7) is provided in the glue discharge groove (6); a plurality of the heat dissipation teeth (7) are provided and distributed in a tooth shape along the inner wall of the glue discharge groove (6); and the plurality of heat dissipation teeth (7) are respectively integrally formed with the first sealing layer (11) or the second sealing layer (12) or the base layer (13).

2. The ceramic base packaging structure according to claim 1, characterized in that: An outwardly protruding expanded foot (141) is formed on the circumferential side of the lower end of the anchoring column (14), and the cross section of the outwardly protruding expanded foot (141) is semicircular; A recessed portion adapted to the outwardly convex expanded foot (141) is formed on the inner side of the receiving groove (15).

3. The ceramic base packaging structure according to claim 2, characterized in that: The interface between the reinforcement hole (112) and the first reinforcement groove (111) and the interface between the reinforcement hole (112) and the second reinforcement groove (113) are both arranged at a transition chamfered portion (1121), and the transition chamfered portion (1121) is a trumpet-shaped structure that expands away from the middle of the reinforcement hole (112).

4. The ceramic base packaging structure according to claim 1, characterized in that: Heat pipes (8) are fixedly embedded in the ends of the first sealing layer (11), the second sealing layer (12) and the base layer (13) close to the metal circuit layer (2); one end of the heat pipe (8) is close to the middle of the ceramic base (1); the other end of the heat pipe (8) slightly protrudes from one side of the ceramic base (1); and the heat pipe (8) is arranged away from the anchoring column (14).

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