Packaging method of purple light beads and purple light beads

Abstract

The present invention discloses a packaging method for a purple light lamp bead and the purple light lamp bead, comprising coating a first mixed glue on the light-emitting surface of a purple light chip, wherein the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed glue is made of a mixture of blue light phosphor, green light phosphor and silica gel; coating a second mixed glue on the light-emitting surface of the purple light chip, wherein the second mixed glue is coated at least above the orthographic projection position of the first mixed glue layer on the light-emitting surface of the purple light chip, and the second mixed glue is made of a mixture of red light phosphor and silica gel. In the technical solution of the present invention, after the purple light chip is lit, part of the purple light emitted forms white light after being emitted through the first mixed glue layer and the second mixed glue layer, and another part of the purple light emitted forms a mixed light formed by white light and purple light with the formed white light, which can reduce damage to human eyes and reduce environmental pollution while achieving the curing of the curing material.

Description

Technical Field

[0001] The present invention relates to the technical field of lamp bead packaging, and in particular to a packaging method for a purple light lamp bead and the purple light lamp bead. Background Art

[0002] In the LED (Light Emitting Diode) lamp bead manufacturing process, a violet light-curing LED light source made of violet light lamp beads can be used to cure the light-curing material in the LED lamp beads.

[0003] At present, the wavelength of violet light emitted by the violet lamp beads used to make violet light-curing LED light sources is between 365 and 420 nm. When curing curable materials, the existing violet lamp beads only emit violet light, which is very harmful to the human eye, reducing vision and causing light pollution to the surrounding environment.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a packaging method for purple light lamp beads and purple light lamp beads, so as to solve the problem in the prior art that the light emitted by the purple light lamp beads is only purple light, which is harmful to the human eye, reduces the human eye vision, and causes light pollution to the surrounding environment.

[0006] The technical solution adopted by the present invention to solve the technical problem is: to provide a method for packaging purple light beads, comprising:

[0007] Provide a bracket and at least one Ziguang chip;

[0008] Fixing the Ziguang chip on the bracket and performing wire bonding between the Ziguang chip and the bracket;

[0009] Applying a first mixed glue on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed glue is made of a mixture of blue phosphor, green phosphor and silica gel;

[0010] baking and curing the first mixed adhesive to form a first mixed adhesive layer;

[0011] Applying a second mixed adhesive on the light-emitting surface of the purple light chip, wherein the second mixed adhesive is applied at least above the orthographic projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip, and the second mixed adhesive is made of a mixture of red phosphor and silica gel;

[0012] The second mixed adhesive is baked and cured to form a second mixed adhesive layer, so that the purple light chip emits mixed light of white light and purple light after being lit.

[0013] According to a further configuration of the present invention, the coating area of ​​the first mixed glue on the light emitting surface of the purple light chip is 40%-60% of the area of ​​the light emitting surface of the purple light chip.

[0014] According to a further configuration of the present invention, the coating area of ​​the first mixed glue on the light emitting surface of the purple light chip is 50% of the area of ​​the light emitting surface of the purple light chip.

[0015] According to a further configuration of the present invention, the peak height of the white light in the mixed light is greater than 80% of the peak height of the purple light in the mixed light, and the peak height of the white light in the mixed light is less than 120% of the peak height of the purple light in the mixed light.

[0016] According to a further configuration of the present invention, the peak height of the white light in the mixed light is the same as the peak height of the purple light in the mixed light.

[0017] The present invention is further configured such that a first mixed glue is coated on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed glue comprises, before being mixed with blue phosphor, green phosphor and silica gel:

[0018] The blue phosphor, the green phosphor and the silica gel are provided, and the blue phosphor, the green phosphor and the silica gel are mixed and stirred to form the first mixed glue.

[0019] The present invention is further provided with a second mixed glue being coated on the light emitting surface of the purple light chip, wherein the second mixed glue is coated at least above the orthographic projection position of the first mixed glue layer on the light emitting surface of the purple light chip, and the second mixed glue is made by mixing red light phosphor and silica gel, and comprises:

[0020] The red fluorescent powder and the silica gel are provided, and the red fluorescent powder and the silica gel are mixed and stirred to form the second mixed glue.

[0021] According to a further configuration of the present invention, the coating area of ​​the second mixed glue on the light-emitting surface of the purple light chip is equal to the area of ​​the light-emitting surface of the purple light chip.

[0022] According to a further configuration of the present invention, the second mixed adhesive layer is located above the first mixed adhesive layer.

[0023] The present invention also provides a purple light lamp bead, which is manufactured by the packaging method of the purple light lamp bead described above.

[0024] The beneficial effects of the present invention are:

[0025] The present invention discloses a packaging method for a purple light lamp bead and the purple light lamp bead. In the packaging method for the purple light lamp bead, a first mixed adhesive layer is provided on the purple light chip, and at least the first mixed adhesive layer has a second mixed adhesive layer above the positive projection position of the purple light chip, wherein the first mixed adhesive layer contains blue light phosphor and green light phosphor, the second mixed adhesive layer contains red light phosphor, and the area of ​​the first mixed adhesive layer on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip. Therefore, after the purple light chip is lit, part of the emitted purple light forms white light after being emitted through the first mixed adhesive layer and the second mixed adhesive layer, and another part of the emitted purple light and the formed white light form a mixed light formed by white light and purple light. While achieving the curing of the curing material, it can reduce damage to human eyes and reduce environmental pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary personnel in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0027] Figure 1 It is a flow chart of the packaging method of the purple light bead of the present invention.

[0028] Figure 2 This is the spectrum of violet light.

[0029] Figure 3 Diagram of the light path of violet or blue light entering the eye.

[0030] Figure 4 This is an emission diagram of purple light emitted by a purple light chip in one embodiment of the present invention.

[0031] Figure 5 This is a structural diagram of a purple light lamp bead equipped with a purple light chip in one embodiment of the present invention.

[0032] Figure 6 This is an exploded view of a purple light lamp bead equipped with a purple light chip in one embodiment of the present invention.

[0033] Figure 7 This is a structural diagram of a purple light lamp bead with two purple light chips in one embodiment of the present invention.

[0034] Figure 8 This is an exploded view of a purple light lamp bead equipped with two purple light chips in one embodiment of the present invention.

[0035] Figure 9 This is a structural diagram of a purple light lamp bead with three purple light chips in one embodiment of the present invention.

[0036] Figure 10 This is an exploded view of a purple light lamp bead equipped with three purple light chips in one embodiment of the present invention.

[0037] Figure 11 This is a spectrum diagram of the mixed light emitted by the purple light bead in one embodiment of the present invention.

[0038] Figure 12 This is a spectrum diagram when the peak height of the purple light in the mixed light emitted by the purple light lamp bead is the same as the peak height of the white light in one embodiment of the present invention.

[0039] The marks in the accompanying drawings are: 10, bracket; 11, Ziguang chip; 12, first mixed adhesive layer; 13, second mixed adhesive layer. DETAILED DESCRIPTION

[0040] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings and are constructed and operated in specific directions. They are only for the convenience of describing the technical solution and do not indicate that the devices or components referred to must have specific directions. Therefore, they should not be understood as limiting the present invention.

[0041] In the LED (Light Emitting Diode) lamp bead manufacturing process, a violet light-curing LED light source made of violet light lamp beads can be used to cure the light-curing material in the LED lamp beads to extend the service life of the LED lamp beads.

[0042] At present, the wavelength of violet light emitted by violet lamp beads made of violet curing LED light source is between 365-420nm. Figure 2 As shown in FIG, the spectrum of the violet light emitted by the violet lamp beads in the prior art is a graph. When curing the curing material, the light emitted by the existing violet lamp beads is only violet light, which is very harmful to the human eye and reduces the human eye vision. At the same time, it will cause light pollution to the surrounding environment. Figure 3 As shown, purple or blue light enters the human eye, passes through the cornea and lens, and reaches the retina directly.

[0043] Based on the above problems, the present invention provides a method for packaging purple light beads, which is applied to the packaging of purple light beads. Figure 1 As shown, the packaging method of the purple light bead includes the following steps:

[0044] S100: Provide a bracket and at least one Ziguang chip;

[0045] S101, fixing the Ziguang chip on the bracket, and performing wire bonding between the Ziguang chip and the bracket;

[0046] S103, applying a first mixed adhesive on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed adhesive on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed adhesive is made of a mixture of blue phosphor, green phosphor, and silica gel;

[0047] S104, baking and curing the first mixed adhesive to form a first mixed adhesive layer;

[0048] S106, applying a second mixed adhesive on the light-emitting surface of the purple light chip, wherein the second mixed adhesive is applied at least above the orthographic projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip, and the second mixed adhesive is made of a mixture of red phosphor and silica gel;

[0049] S107 , baking and curing the second mixed adhesive to form a second mixed adhesive layer, so that the purple light chip emits mixed light of white light and purple light after being lit.

[0050] Specifically, when fixing the Ziguang chip to the bracket, the Ziguang chip can be fixed to the bracket through silicone. When the Ziguang chip is set, one can be set, or other quantities can be set, such as two, three or other quantities, without further limitation here.

[0051] After the Unisplendour chip is fixed to the bracket, the Unisplendour chip and the bracket are subjected to wire bonding (this process can adopt the process of wire bonding between the Unisplendour chip and the bracket in the prior art). Particularly, when applying the first mixed glue to the Unisplendour chip fixed to the bracket, the coating can be started from one end of the light-emitting surface of the Unisplendour chip. After the first mixed glue is applied, the first mixed glue is dried and cured to form a first mixed glue layer. When applying the second mixed glue to the Unisplendour chip, at least the first mixed glue is coated with the second mixed glue above the orthographic projection position on the light-emitting surface of the Unisplendour chip. After the second mixed glue is applied, it is dried and cured to form a second mixed glue layer.

[0052] After the purple light bead using this packaging method is lit, Figure 4As shown, the purple light emitted from the location where the first and second mixed adhesive layers are disposed on the light-emitting surface of the purple light chip passes through the first and second mixed adhesive layers, while the purple light emitted from other locations does not pass through the first mixed adhesive layer. Since the first mixed adhesive layer contains blue and green phosphors, and the second mixed adhesive layer contains red phosphors, the purple light emitted through the first and second mixed adhesive layers will form white light (the purple light first excites the blue and green phosphors, and then excites the red phosphor in the second adhesive layer at the location of the orthogonal projection of the first mixed adhesive layer, forming white light). The purple light that does not pass through the first mixed adhesive layer still emits purple light.

[0053] It can be seen that when the purple light bead using this packaging method is lit, part of the emitted purple light forms white light after passing through the first mixed adhesive layer and the second mixed adhesive layer, and another part of the emitted purple light and the formed white light form a mixed light composed of white light and purple light. While achieving the curing of the curing material, it can reduce damage to human eyes and reduce environmental pollution.

[0054] like Figure 11 As shown, this is the spectrum of the emitted light when the purple light bead prepared by this packaging method is lit. Figure 11 In the process, the peak height of purple light will be lowered, which can reduce damage to human eyes and reduce environmental pollution.

[0055] Here, it should be noted that the bracket refers to the bracket (also called substrate) commonly used in the prior art for packaging LED chips, and will not be described in detail here.

[0056] It should also be noted that the orthographic projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip refers to the projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip when looking at the side of the purple light chip from top to bottom as the angle of the main view.

[0057] In this embodiment, the first mixed adhesive can be applied by mixing and dispensing. That is, the blue phosphor, green phosphor, and silica gel can be mixed to prepare the first mixed adhesive, and then the adhesive can be applied to the ultraviolet chip by dispensing. The second mixed adhesive can also be applied by mixing and dispensing. That is, the red phosphor and silica gel can be mixed to prepare the second mixed adhesive, and then the adhesive can be applied to the ultraviolet chip by dispensing.

[0058] Furthermore, when the first mixed adhesive is applied, the coating area of ​​the first mixed adhesive on the light emitting surface of the Ziguang chip may be 40%-60% of the area of ​​the light emitting surface of the Ziguang chip.

[0059] Specifically, when applying the first mixed glue, the coating area of ​​the first mixed glue on the purple light chip can be 40%, 50%, 55%, 60%, etc. Those skilled in the art can determine the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip according to actual needs.

[0060] In a preferred embodiment, the coating area of ​​the first mixed glue on the purple light chip is 50% of the area of ​​the light emitting surface of the purple light chip.

[0061] In some embodiments, the spectral peak height of the purple light in the mixed light is greater than or equal to 80% of the spectral peak height of the white light in the mixed light, and the spectral peak height of the purple light in the mixed light is less than or equal to 120% of the spectral peak height of the white light in the mixed light.

[0062] To ensure the peak height of the generated purple light spectrum, a first adhesive mixture is first applied to the purple light chip. After the first adhesive mixture is dried and cured, a second adhesive mixture is applied over the first adhesive mixture and dried and cured. If the peak height of the generated purple light spectrum is greater than or equal to 80% of the peak height of the generated white light spectrum, the purple light energy will be too low, resulting in poor curing of the curing material. If the peak height of the generated purple light spectrum is greater than 120% of the generated white light spectrum, the purple light energy will be too high, similarly causing environmental pollution and eye damage.

[0063] That is to say, when applying the first mixed glue and the second mixed glue, it is sufficient to ensure that the spectral peak height of the formed purple light can be 80%, 90%, 100%, 105%, 120%, etc. of the spectral peak height of the formed white light.

[0064] In a preferred embodiment, if Figure 12 As shown, the spectral peak height of the formed purple light is 100% of the spectral peak height of the formed white light, that is, the spectral peak height of the formed purple light is the same as the spectral peak height of the formed white light.

[0065] In some embodiments, as Figure 1 As shown, a first mixed glue is coated on the light-emitting surface of the purple light chip, and the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip. The first mixed glue is prepared by mixing blue phosphor, green phosphor and silica gel, and the following steps are included before the step:

[0066] S102: providing blue phosphor, green phosphor and silica gel, and mixing the blue phosphor, green phosphor and silica gel to form a first mixed glue.

[0067] In this embodiment, when preparing the first mixed glue, it is necessary to match the ratio of blue light phosphor and green light phosphor in the first mixed glue with the color temperature of the output light after passing through the first mixed glue layer and the second mixed glue layer when the purple light chip is lit. No further restrictions are made here.

[0068] In some embodiments, as Figure 1 As shown, a second mixed glue is applied on the light-emitting surface of the purple light chip, wherein the second mixed glue is applied at least above the orthographic projection position of the first mixed glue layer on the light-emitting surface of the purple light chip, and the second mixed glue is made by mixing red light phosphor and silica gel. Before the step of mixing the second mixed glue with red light phosphor and silica gel, the steps include:

[0069] S105 , providing red phosphor and silica gel, and mixing the red phosphor and silica gel to form a second mixed glue.

[0070] In this embodiment, when preparing the second mixed adhesive, the ratio of the red phosphor needs to be matched with the color temperature of the output light after passing through the first mixed adhesive layer and the second mixed adhesive layer when the purple light chip is lit, which is not limited here.

[0071] In some embodiments, the coating area of ​​the second mixed glue on the light emitting surface of the Ziguang chip is equal to the area of ​​the light emitting surface of the Ziguang chip.

[0072] Specifically, when encapsulating the purple light-emitting diodes, a first adhesive mixture can be applied to the light-emitting surface of the purple light chip. When the first adhesive mixture is applied, the coating area of ​​the first adhesive mixture on the light-emitting surface of the purple light chip can be half the area of ​​the light-emitting surface of the purple light chip. After the first adhesive mixture is applied and cured, a second adhesive mixture is applied. The second adhesive mixture is applied above the first adhesive mixture layer and also to areas on the purple light chip not coated with the first adhesive mixture.

[0073] like Figure 5 、 Figure 6 The figure shows a purple light lamp bead with a purple light chip, wherein when the first mixed glue is applied, the area coated on the light-emitting surface of the purple light chip is half the area of ​​the light-emitting surface of the purple light chip. Specifically, the purple light chip is set at approximately the middle position of the bracket. When applying the first mixed glue, while ensuring that the area coated on the light-emitting surface of the purple light chip by the first mixed glue is half the area of ​​the light-emitting surface of the purple light chip, the first mixed glue can also be connected to the bracket to further fix the purple light chip and facilitate coating; after the first mixed glue is applied and baked and cured, the second mixed glue can be filled on the bracket in a filling manner so that the light-emitting surface of the purple light chip is coated with the second mixed glue (ensuring that at least the second mixed glue is coated above the orthographic projection position of the purple light chip coated with the first mixed glue).

[0074] like Figure 7 、 Figure 8 The figure shows a purple light bead with two purple light chips. When the first mixed glue is applied, the area coated on the light-emitting surface of the two purple light chips is half the area of ​​the light-emitting surface of the two purple light chips. That is, the light-emitting surface of one of the two purple light chips is coated with the first mixed glue, while the light-emitting surface of the other purple light chip is not coated with the first mixed glue. Specifically, the two purple light chips are arranged in parallel on the bracket, and the coating method can refer to the coating method of the first mixed glue and the second mixed glue when a single purple light chip is installed.

[0075] like Figure 9 、 Figure 10 As shown, a purple light lamp bead is provided with three purple light chips, wherein, when the first mixed glue is applied, the area coated on the light-emitting surfaces of the three purple light chips is half of the area of ​​the light-emitting surfaces of the three purple light chips, that is, the first mixed glue is applied on the light-emitting surface of one of the three purple light chips, and half of the first mixed glue is applied on the light-emitting surface of the other purple light chip.

[0076] Furthermore, the second mixed adhesive layer is located above the first mixed adhesive layer. Specifically, the three purple light chips are arranged in parallel on the bracket, and the coating method can refer to the coating method of the first mixed adhesive and the second mixed adhesive when one purple light chip is arranged.

[0077] like Figure 7 、 Figure 9 as well as Figure 10 As shown, the bracket can be a bracket with a downwardly concave groove on the upper surface, and the purple light chip is fixed in the groove. When applying the first mixed glue and the second mixed glue, the first mixed glue is first applied to the purple light chip. After the first mixed glue is dried and cured, the second fixing glue is filled into the groove. At this time, the second mixed glue is applied above the positive projection position of the first mixed glue layer, and the second mixed glue is also applied to the position on the purple light chip where the first mixed glue is not applied.

[0078] In this embodiment, the order and method of applying the first mixed glue and the second mixed glue are simple, and the appearance of the packaged purple light beads is neat (the second mixed glue can be filled to be flush with the upper surface of the groove of the bracket).

[0079] In some embodiments, the present invention further provides a purple light lamp bead, which is made by the above-mentioned packaging method of the purple light lamp bead.

[0080] The packaging method of the purple light bead may include the following steps:

[0081] S100: Provide a bracket and at least one Ziguang chip;

[0082] S101, fixing the Ziguang chip on the bracket, and performing wire bonding between the Ziguang chip and the bracket;

[0083] S103, applying a first mixed adhesive on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed adhesive on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed adhesive is made of a mixture of blue phosphor, green phosphor, and silica gel;

[0084] S104, baking and curing the first mixed adhesive to form a first mixed adhesive layer;

[0085] S106, applying a second mixed adhesive on the light-emitting surface of the purple light chip, wherein the second mixed adhesive is applied at least above the orthographic projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip, and the second mixed adhesive is made of a mixture of red phosphor and silica gel;

[0086] S107 , baking and curing the second mixed adhesive to form a second mixed adhesive layer, so that the purple light chip emits mixed light of white light and purple light after being lit.

[0087] Specifically, when securing the Unisplendour chip to the bracket, the Unisplendour chip can be secured to the bracket using silicone. A single Unisplendour chip can be provided, or other quantities can be provided, such as two, three, or other quantities. After securing the Unisplendour chip to the bracket, wire bonding is performed between the Unisplendour chip and the bracket (this process can utilize conventional wire bonding techniques for Unisplendour chips and brackets).

[0088] When applying the first adhesive mixture to the purple light chip fixed to the bracket, the application can be started from one end of the light-emitting surface of the purple light chip. After the first adhesive mixture is applied, the first adhesive mixture is dried and cured to form a first adhesive mixture layer. When applying the second adhesive mixture to the purple light chip, the second adhesive mixture is applied to at least the portion of the first adhesive mixture above the orthographic projection of the purple light chip on the light-emitting surface. After the second adhesive mixture is applied, the second adhesive mixture is dried and cured to form a second adhesive mixture layer.

[0089] When a purple light bead using this packaging method is illuminated, the purple light emitted from the location on the light-emitting surface of the purple light chip where the first and second mixed adhesive layers are disposed passes through the first and second mixed adhesive layers, while the purple light emitted from other locations does not pass through the first mixed adhesive layer. Because the first mixed adhesive layer contains blue and green phosphors, and the second mixed adhesive layer contains red phosphors, the purple light emitted through the first and second mixed adhesive layers will form white light (the purple light first excites the blue and green phosphors, and then excites the red phosphor in the second adhesive layer at the location of the orthogonal projection of the first mixed adhesive layer, forming white light). Purple light that has not passed through the first mixed adhesive layer will still be emitted.

[0090] It can be seen that when the purple light bead using this packaging method is lit, part of the emitted purple light forms white light after passing through the first mixed adhesive layer and the second mixed adhesive layer, and another part of the emitted purple light and the formed white light form a mixed light composed of white light and purple light. While achieving the curing of the curing material, it can reduce damage to human eyes and reduce environmental pollution.

[0091] In some embodiments, as Figure 1 As shown, a first mixed glue is coated on the light-emitting surface of the purple light chip, and the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip. The first mixed glue is prepared by mixing blue phosphor, green phosphor and silica gel, and the following steps are included before the step:

[0092] S102: providing blue phosphor, green phosphor and silica gel, and mixing the blue phosphor, green phosphor and silica gel to form a first mixed glue.

[0093] In some embodiments, as Figure 1 As shown, a second mixed glue is applied on the light-emitting surface of the purple light chip, wherein the second mixed glue is applied at least above the orthographic projection position of the first mixed glue layer on the light-emitting surface of the purple light chip, and the second mixed glue is made by mixing red light phosphor and silica gel. Before the step of mixing the second mixed glue with red light phosphor and silica gel, the steps include:

[0094] S105 , providing red phosphor and silica gel, and mixing the red phosphor and silica gel to form a second mixed glue.

[0095] It should be noted that the description of the above embodiment of the purple light bead is similar to the description of the embodiment of the packaging method of the purple light bead, and has similar beneficial effects as the packaging method of the purple light bead. For technical details not disclosed in the embodiment of the purple light bead in this embodiment, please refer to the description of the embodiment of the packaging method of the purple light bead of the present invention for understanding.

[0096] In summary, the present invention provides a packaging method for a purple light chip and a purple light lamp bead, which has the following beneficial effects:

[0097] In the packaging method of the purple light lamp bead, a first mixed adhesive layer is provided on the purple light chip, and at least a second mixed adhesive layer is provided above the orthographic projection position of the purple light chip. The first mixed adhesive layer contains blue light phosphor and green light phosphor, the second mixed adhesive layer contains red light phosphor, and the area of ​​the first mixed adhesive layer on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip. Therefore, after the purple light chip is lit, part of the emitted purple light forms white light after being emitted through the first mixed adhesive layer and the second mixed adhesive layer, and another part of the emitted purple light and the formed white light form a mixed light formed by white light and purple light. While achieving the curing of the curing material, it can reduce damage to human eyes and reduce environmental pollution.

[0098] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A method for packaging a purple light bead, characterized in that: include: Provide a bracket and at least one Ziguang chip; Fixing the Ziguang chip on the bracket and performing wire bonding between the Ziguang chip and the bracket; Applying a first mixed glue on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed glue is made of a mixture of blue phosphor, green phosphor and silica gel; baking and curing the first mixed adhesive to form a first mixed adhesive layer; Applying a second mixed adhesive on the light-emitting surface of the purple light chip, wherein the second mixed adhesive is applied at least above the orthographic projection position of the first mixed adhesive layer on the light-emitting surface of the purple light chip, and the second mixed adhesive is made of a mixture of red phosphor and silica gel; The second mixed adhesive is baked and cured to form a second mixed adhesive layer, so that the purple light chip emits mixed light of white light and purple light after being lit.

2. The packaging method of the purple light bead according to claim 1, characterized in that: The coating area of ​​the first mixed glue on the light-emitting surface of the Ziguang chip is 40%-60% of the area of ​​the light-emitting surface of the Ziguang chip.

3. The packaging method of the purple light bead according to claim 2, characterized in that: The coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is 50% of the area of ​​the light-emitting surface of the purple light chip.

4. The packaging method of the purple light bead according to claim 1, characterized in that: The peak height of the white light in the mixed light is greater than 80% of the peak height of the purple light in the mixed light, and the peak height of the white light in the mixed light is less than 120% of the peak height of the purple light in the mixed light.

5. The packaging method of the purple light bead according to claim 4, characterized in that: The peak height of the white light in the mixed light is the same as the peak height of the purple light in the mixed light.

6. The packaging method of the purple light bead according to claim 1, characterized in that: A first mixed glue is applied on the light-emitting surface of the purple light chip, wherein the coating area of ​​the first mixed glue on the light-emitting surface of the purple light chip is smaller than the area of ​​the light-emitting surface of the purple light chip, wherein the first mixed glue comprises the following before being mixed with blue phosphor, green phosphor and silica gel: The blue phosphor, the green phosphor and the silica gel are provided, and the blue phosphor, the green phosphor and the silica gel are mixed and stirred to form the first mixed glue.

7. The packaging method of the purple light bead according to claim 1, characterized in that: A second mixed glue is applied on the light-emitting surface of the purple light chip, wherein the second mixed glue is applied at least above the orthographic projection position of the first mixed glue layer on the light-emitting surface of the purple light chip, and the second mixed glue is made by mixing red phosphor and silica gel, and includes: The red fluorescent powder and the silica gel are provided, and the red fluorescent powder and the silica gel are mixed and stirred to form the second mixed glue.

8. The method for packaging a purple light bead according to claim 1, wherein: The coating area of ​​the second mixed glue on the light-emitting surface of the purple light chip is equal to the area of ​​the light-emitting surface of the purple light chip.

9. The method for packaging a purple light bead according to claim 8, characterized in that: The second mixed adhesive layer is located above the first mixed adhesive layer.

10. A purple light bead, characterized in that: The violet light bead is manufactured by the packaging method of the violet light bead according to any one of claims 1 to 9.

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