Antenna and electronic device

Abstract

The present disclosure provides an antenna and an electronic device, and belongs to the technical field of antennas. The antenna comprises at least one phase shift structure, a first reference electrode layer and a feeding substrate; the phase shift structure comprises a first dielectric substrate, a second dielectric substrate, a first electrode layer, a second electrode layer and an adjustable dielectric layer; the first reference electrode layer has a first opening; the feeding substrate comprises a first dielectric layer located on the side of the first reference electrode layer away from the adjustable dielectric layer and a feeding structure located on the side of the first dielectric layer away from the first reference electrode layer; the first dielectric layer has a second opening penetrating along the thickness direction thereof; the antenna further comprises a conductive part; the feeding structure comprises a main path and at least one branch path electrically connected with the main path; one branch path is electrically connected with one conductive part, and the conductive part is electrically connected with the first electrode layer through the first opening, the second opening and a third opening; the third opening penetrates at least part of the thickness of the first dielectric substrate along the thickness direction of the first dielectric substrate.

Description

Technical Field

[0001] The present disclosure belongs to the field of antenna technology, and particularly relates to an antenna and an electronic device. Background Art

[0002] A phased array antenna is an antenna whose radiation pattern is modified by controlling the feeding phase of the radiating elements in the array. Controlling the phase can change the direction of the antenna's maximum radiation pattern, thereby achieving beam scanning. In the field of liquid crystal phased array antennas, a common problem is the difficulty of wire feeding due to the presence of the liquid crystal cell. Therefore, coupled feeding is typically used. However, coupled feeding requires a large space and exhibits high losses in the coupling structure. The resulting device has limitations in terms of size, weight, and transmission performance. Summary of the Invention

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides an antenna and an electronic device.

[0004] In a first aspect, a technical solution adopted to solve the technical problem of the present disclosure is an antenna comprising at least one phase-shifting structure, a first reference electrode layer, and a feed substrate; wherein the phase-shifting structure comprises a first dielectric substrate and a second dielectric substrate disposed opposite each other, and a first electrode layer, a second electrode layer, and an adjustable dielectric layer disposed therebetween; the adjustable dielectric layer is located between the first electrode layer and the second electrode layer;

[0005] The first reference electrode layer is located on a side of the first dielectric substrate away from the adjustable dielectric layer and has a first opening;

[0006] The feed substrate includes a first dielectric layer and a feed structure, wherein the first dielectric layer is located on a side of the first reference electrode layer away from the adjustable dielectric layer, and the feed structure is located on a side of the first dielectric layer away from the first reference electrode layer; the first dielectric layer has a second opening extending through the first dielectric layer in a thickness direction thereof;

[0007] The antenna further includes a conductive member; the feed structure includes a main circuit and at least one branch circuit electrically connected to the main circuit; one of the branch circuits is electrically connected to one of the conductive members, and the conductive member is electrically connected to the first electrode layer through the first opening, the second opening, and the third opening; the third opening penetrates at least a portion of the thickness of the first dielectric substrate along the thickness direction of the first dielectric substrate.

[0008] In some embodiments, the third opening passes through the first dielectric substrate, and the first electrode layer is disposed on a side of the first dielectric substrate close to the adjustable dielectric layer. The conductive member passes through the first opening, the second opening, and the third opening and is directly connected to the first electrode layer.

[0009] In some embodiments, the third opening passes through a portion of the first dielectric substrate, and the first electrode layer is disposed on a side of the first dielectric substrate close to the adjustable dielectric layer. The conductive member passes through the first opening, the second opening, and the third opening to couple with the first electrode layer.

[0010] In some embodiments, along a depth direction of the third opening, a thickness of a portion of the first dielectric substrate not penetrated by the third opening is between 1.5 μm and 2.5 μm.

[0011] In some embodiments, the branch includes a first main portion and a first end portion electrically connected to the conductive member; the first electrode layer includes a second main portion and a second end portion connected to the conductive member;

[0012] The width of the first end portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along the direction from the first main body portion to the first end portion; and / or,

[0013] The width of the second end portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along a direction from the second main body portion to the second end portion.

[0014] In some embodiments, the orthographic projection of the first end portion on the first dielectric substrate covers the orthographic projection of the conductive member on the first dielectric substrate, and the outline of the orthographic projection of the conductive member on the first dielectric substrate falls within the outline of the orthographic projection of the first end portion on the first dielectric substrate; and / or,

[0015] The orthographic projection of the second end portion on the first dielectric substrate covers the orthographic projection of the conductive member on the first dielectric substrate, and an outline of the orthographic projection of the conductive member on the first dielectric substrate falls within the outline of the orthographic projection of the second end portion on the first dielectric substrate.

[0016] In some embodiments, the orthographic projection of the branch on the first dielectric substrate covers the orthographic projection of the conductive element on the first dielectric substrate; the orthographic projection of the first electrode layer on the first dielectric substrate covers the orthographic projection of the conductive element on the first dielectric substrate;

[0017] For the remaining parts of the branch except the part connected to the main path, the remaining parts have the same width perpendicular to the cross section of the first dielectric substrate; and / or the first electrode layer has the same width perpendicular to the cross section of the first dielectric substrate.

[0018] In some embodiments, the conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening;

[0019] The width of the first conductive portion perpendicular to the cross section of the first dielectric substrate increases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

[0020] In some embodiments, the first conductive portion includes a first surface and a second surface disposed opposite to each other in a thickness direction thereof, and the first surface is closer to the first dielectric substrate than the second surface;

[0021] The orthographic projection of the second surface on the first dielectric substrate covers the orthographic projection of the first surface on the first dielectric substrate, and an area ratio of the first surface to the second surface is between 0.125 and 0.375.

[0022] In some embodiments, the second conductive portion includes a third surface and a fourth surface disposed opposite to each other in a thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface;

[0023] The third surface is connected to the second surface, and their orthographic projections coincide with each other.

[0024] In some embodiments, the conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening;

[0025] The width of the first conductive portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

[0026] In some embodiments, the first conductive portion includes a first surface and a second surface disposed opposite to each other in a thickness direction thereof, and the first surface is closer to the first dielectric substrate than the second surface;

[0027] The orthographic projection of the first surface on the first dielectric substrate covers the orthographic projection of the second surface on the first dielectric substrate, and an area ratio of the second surface to the first surface is between 0.125 and 0.375.

[0028] In some embodiments, the second conductive portion includes a third surface and a fourth surface disposed opposite to each other in a thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface;

[0029] The third surface is connected to the second surface, and an orthographic projection of the third surface on the first dielectric substrate covers an orthographic projection of the second surface on the first dielectric substrate.

[0030] In some embodiments, the conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening;

[0031] The first conductive portion includes a first sub-conductive portion and a second sub-conductive portion, and the first conductive portion is closer to the first electrode layer than the second sub-conductive portion;

[0032] The width of the first sub-conductive portion perpendicular to the cross-section of the first dielectric substrate decreases monotonically along a direction from the second dielectric substrate to the first dielectric substrate; and / or the width of the second sub-conductive portion perpendicular to the cross-section of the first dielectric substrate increases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

[0033] In some embodiments, the first sub-conductive portion includes a first surface and a fifth surface disposed opposite to each other in the thickness direction thereof, and the first surface is closer to the first dielectric substrate than the fifth surface; the second sub-conductive portion includes a sixth surface and a second surface disposed opposite to each other in the thickness direction thereof, and the sixth surface is closer to the first dielectric substrate than the second surface;

[0034] The orthographic projection of the first surface on the first dielectric substrate covers the orthographic projection of the fifth surface on the first dielectric substrate, and the area ratio of the fifth surface to the first surface is between 0.125 and 0.375; and / or the orthographic projection of the second surface on the first dielectric substrate covers the orthographic projection of the sixth surface on the first dielectric substrate, and the area ratio of the sixth surface to the second surface is between 0.125 and 0.375.

[0035] In some embodiments, the second conductive portion includes a third surface and a fourth surface disposed opposite to each other in a thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface;

[0036] The third surface is connected to the second surface, and their orthographic projections coincide with each other.

[0037] In some embodiments, the feed substrate further includes a second dielectric layer disposed on a side of the feed structure away from the first dielectric layer, and a second reference electrode layer disposed on a side of the second dielectric layer away from the feed structure;

[0038] An orthographic projection of the first reference electrode layer on the first dielectric substrate does not overlap with an orthographic projection of the feeding structure on the first dielectric substrate.

[0039] In some embodiments, the feed substrate further includes a third dielectric layer, a connecting portion, and a feed source; the third dielectric layer is located on the side of the second reference electrode layer facing away from the second dielectric layer, and has a fourth opening; the feed source is located at the fourth opening and is electrically connected to the connecting portion; the connecting portion is electrically connected to the main circuit through a fifth opening passing through the second reference electrode layer and a sixth opening passing through the second dielectric layer.

[0040] In some embodiments, the antenna further includes a packaging structure, which is located on a side of the first electrode layer close to the adjustable dielectric layer, and an orthographic projection of the packaging structure on the first dielectric substrate covers an orthographic projection of the conductive element on the first dielectric substrate.

[0041] In some embodiments, the width of the first opening is greater than the width of the conductive member, and the widths of the second opening and the third opening are both equal to the width of the conductive member.

[0042] In a second aspect, an embodiment of the present disclosure further provides an electronic device, which includes an antenna as described in any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1a It is a three-dimensional schematic diagram of a liquid crystal phased array antenna in the prior art;

[0044] Figure 1b Schematic diagram of the film layer of the liquid crystal phased array antenna in the prior art;

[0045] Figure 2 Schematic diagram of S-parameter simulation of the structure in Figure 1;

[0046] Figure 3 A schematic diagram of a film layer of an antenna provided in an embodiment of the present disclosure;

[0047] Figure 4 A schematic diagram of a film layer of another antenna provided in an embodiment of the present disclosure;

[0048] Figure 5 A three-dimensional schematic diagram of a partial antenna structure provided by an embodiment of the present disclosure;

[0049] Figure 6This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 1;

[0050] Figure 7 A three-dimensional schematic diagram of another exemplary partial antenna structure provided by an embodiment of the present disclosure;

[0051] Figure 8 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 3;

[0052] Figure 9 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 4;

[0053] Figure 10a A three-dimensional schematic diagram of another exemplary partial antenna structure provided by an embodiment of the present disclosure;

[0054] Figure 10b for Figure 10a Schematic diagram of the membrane layer of the antenna structure;

[0055] Figure 11 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 5;

[0056] Figure 12a A three-dimensional schematic diagram of another exemplary partial antenna structure provided by an embodiment of the present disclosure;

[0057] Figure 12b for Figure 12a Schematic diagram of the membrane layer of the antenna structure;

[0058] Figure 13 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 9;

[0059] Figure 14a A three-dimensional schematic diagram of another exemplary partial antenna structure provided by an embodiment of the present disclosure;

[0060] Figure 14b for Figure 14a Schematic diagram of the membrane layer of the antenna corresponding to the structure;

[0061] Figure 15 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 13;

[0062] Figure 16 A schematic diagram of a film layer of another exemplary antenna provided in an embodiment of the present disclosure;

[0063] Figure 17 This is a schematic diagram of the S-parameter simulation of the structure corresponding to Example 17;

[0064] Figure 18 A schematic diagram of a specific film layer of an exemplary antenna provided in an embodiment of the present disclosure;

[0065] Figure 19 A partial film layer schematic diagram of an example antenna provided for the embodiments of the present disclosure.

[0066] Wherein the reference signs are: 1, phase shift structure; 11, first dielectric substrate; 12, second dielectric substrate; 13, first electrode layer; 14, second electrode layer; 15, tunable dielectric layer; 13-1, second main body part; 13-2, second end part;

[0067] 2, first reference electrode layer; Via1, first opening;

[0068] 3, feeding substrate; 31, first dielectric layer; 32, feeding structure; 33, second dielectric layer; 34, second reference electrode layer; 35, connecting part; 36, feed source; 321, main path; 322, branch path; 322-1, first main body part; 322-2, first end part; 3221, remaining part; 37, third dielectric layer; 38, reflecting layer; Via2, second opening; Via3, third opening; Via4, fourth opening; Via5, fifth opening; Via6, sixth opening; Via7, seventh opening; Via8, eighth opening;

[0069] 4, conductive part; 41, first conductive part; 42, second conductive part; 411, first sub-conductive part; 412, second sub-conductive part; 401, first surface; 402, second surface; 403, third surface; 404, fourth surface; 405, fifth surface; 406, sixth surface;

[0070] 5, packaging structure. DETAILED DESCRIPTION

[0071] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. The components of the embodiments of the present disclosure described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the claimed present disclosure, but only represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present disclosure.

[0072] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0073] In this disclosure, "multiple or several" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0074] In related technologies, in order to avoid technical problems such as complex lead feeding, the feeding method of liquid crystal phased array antennas mostly adopts coupling feeding. Figure 1a is a three-dimensional schematic diagram of a liquid crystal phased array antenna in the prior art, Figure 1b Schematic diagram of the film layer of the liquid crystal phased array antenna in the prior art, such as Figure 1a and Figure 1bAs shown, the liquid crystal phased array antenna includes at least one phase-shifting structure 1, a first reference electrode layer 2, and a feed substrate 3. The phase-shifting structure 1 includes a first dielectric substrate 11 and a second dielectric substrate 12 disposed opposite each other, as well as a first electrode layer 13, a second electrode layer 14, and an adjustable dielectric layer 15 disposed therebetween. The adjustable dielectric layer 15 is located between the first electrode layer 13 and the second electrode layer 14. The first reference electrode layer 2 is located on the side of the first dielectric substrate 11 facing away from the adjustable dielectric layer 15. The feed substrate 3 includes a first dielectric layer 31, a feed structure 32, a second dielectric layer 33, a second reference electrode layer 34, and a feed source 36, sequentially disposed on the side of the first reference electrode layer 2 facing away from the adjustable dielectric layer 15. A first through hole Via01 is provided on the first reference electrode layer 2, and a second through hole Via02 is provided on the second reference electrode layer 34. The orthographic projections of the first through hole Via01 and the second through hole Via02 on the first dielectric substrate 11 at least partially overlap. The feed source 36 transmits the signal to the feeding structure 32 through the connection portion 35 . The feeding structure 32 feeds the signal to the first electrode layer 13 through gap coupling between the first through hole Via01 and the second through hole Via02 .

[0075] Figure 2 for Figure 1a The S parameter simulation diagram of the structure, where S parameter is also the scattering parameter, is an important parameter in microwave transmission. Among them, S11 represents the input reflection coefficient, that is, the input return loss; S21 represents the insertion loss. Figure 2 As shown, the horizontal axis represents the signal radiation frequency and the vertical axis represents the S parameter. Figure 2 The simulation results show that at the resonance point of 12GHz, S11 = -9.81dB, S21 = -1.03dB, which shows that the liquid crystal phased array antenna is Figure 1b The energy transmission performance of the feeding method shown is slightly poor, and the coupling loss reaches 1.03dB.

[0076] In view of this, the embodiment of the present disclosure provides an antenna that substantially eliminates one or more of the problems caused by the limitations and defects of the related art. Specifically, the antenna in the embodiment of the present disclosure includes at least one phase-shifting structure 1, a first reference electrode layer 2 and a feeding substrate 3; wherein the phase-shifting structure 1 includes a first dielectric substrate 11 and a second dielectric substrate 12 arranged opposite to each other, and a first electrode layer 13, a second electrode layer 14 and an adjustable dielectric layer 15 arranged therebetween; the adjustable dielectric layer 15 is located between the first electrode layer 13 and the second electrode layer 14; the first reference electrode layer 2 is located on the side of the first dielectric substrate 11 away from the adjustable dielectric layer 15, and has a first opening Via1; the feeding substrate 3 includes a first dielectric layer 31 and a feeding structure 32, and the first dielectric layer 31 is located on the first reference electrode layer 2 A feed structure 32 is located on a side of the first dielectric layer 31 away from the first reference electrode layer 2, away from the adjustable dielectric layer 15. The first dielectric layer 31 has a second opening (via 2) extending through its thickness. The antenna also includes a conductive element 4. The feed structure 32 includes a main path 321 and at least one branch path 322 electrically connected to the main path 321. One branch path 322 is electrically connected to a conductive element 4, which is electrically connected to the first electrode layer 13 via a first opening (via 1), a second opening (via 2), and a third opening (via 3). The third opening (via 3) extends through at least a portion of the thickness of the first dielectric substrate 11. The disclosed embodiment connects the feed structure 32 and the first electrode layer 13 via the conductive element 4, effectively improving energy transmission performance and reducing insertion loss.

[0077] The specific structure of an antenna provided by an embodiment of the present disclosure is introduced in detail below. Figure 3 A schematic diagram of a film layer of an antenna provided in an embodiment of the present disclosure, such as Figure 3 As shown, the antenna includes at least one phase-shifting structure 11, a first reference electrode layer 22, and a feed substrate 33. The phase-shifting structure 11 includes a first dielectric substrate 11 and a second dielectric substrate 12 disposed opposite each other, as well as a first electrode layer 13, a second electrode layer 14, and an adjustable dielectric layer 15 disposed therebetween. The adjustable dielectric layer 15 is located between the first electrode layer 13 and the second electrode layer 14. For example, the antenna in the disclosed embodiment may be a liquid crystal phased array antenna, and the adjustable dielectric layer 15 may be a liquid crystal layer. Liquid crystal flipping is achieved by the first electrode layer 13 and the second electrode layer 14 disposed on either side of the liquid crystal layer, thereby achieving phase shifting.

[0078] Continue as Figure 3As shown, the first reference electrode layer 2 is located on a side of the first dielectric substrate 11 away from the adjustable dielectric layer 15 and has a first opening Via1. The feed substrate 3 includes a first dielectric layer 31 and a feed structure 32. The first dielectric layer 31 is located on a side of the first reference electrode layer 2 away from the adjustable dielectric layer 15, and the feed structure 32 is located on a side of the first dielectric layer 31 away from the first reference electrode layer 2. The first dielectric layer 31 has a second opening Via2 extending through the first dielectric layer 31 along its thickness. The antenna also includes a conductive element 4. The feed structure 32 includes a main path 321 and at least one branch path 322 electrically connected to the main path 321. One branch path 322 is electrically connected to one conductive element 4, and the conductive element 4 is electrically connected to the first electrode layer 13 through the first opening Via1, the second opening Via2, and the third opening Via3. The third opening Via3 extends through at least a portion of the thickness of the first dielectric substrate 11 along its thickness.

[0079] For example, the third opening Via3 can completely penetrate the first dielectric substrate 11 along the thickness direction of the first dielectric substrate 11. In this case, the conductive element 4 can directly feed the signal to the first electrode layer 13. Alternatively, the third opening Via3 can partially penetrate the first dielectric substrate 11 along the thickness direction of the first dielectric substrate 11. In this case, the conductive element 4 can feed the signal to the first electrode layer 13 through self-transmission plus slot coupling. Both of these methods can feed the signal to the first electrode layer 13 through the conductive element 4, effectively improving energy transmission performance and reducing feeding loss.

[0080] For example, Figure 3 As shown, the embodiment of the present disclosure can achieve power feeding by only setting a first dielectric layer 31 to isolate the feeding structure 32 from the first reference electrode layer 2 and using the conductive member 4. Compared with the prior art (e.g. Figure 1a and Figure 1b The structure shown in the figure) is coupled to feed the antenna, which reduces the setting of multiple reference electrode layers and dielectric layers and avoids unnecessary hole opening processes, thereby saving structural layout space and making the antenna more miniaturized and lightweight.

[0081] For example, the feeding structure 32 can also be understood as a "one-to-many" power splitter, that is, a main circuit 321 and multiple branches 322. Each branch 322 corresponds to a phase shifting structure 1.

[0082] Exemplarily, the first opening Via1, the second opening Via2, and the third opening Via3 can all be circular openings. Preferably, the first opening Via1, the second opening Via2, and the third opening Via3 are parallel to and coaxial with the center of any cross-section of the first dielectric substrate 11. Preferably, the first opening Via1 penetrates the first reference electrode layer 2 along its thickness, and extends perpendicularly to the second dielectric substrate 12. The second opening Via2 penetrates the first dielectric layer 31 along its thickness, and extends perpendicularly to the second dielectric substrate 12. The third opening Via3 penetrates the first dielectric substrate 11 along its thickness, and extends perpendicularly to the second dielectric substrate 12. This facilitates the subsequent fabrication of a vertical conductive element 4, where "vertical" refers to the direction of the conductive element 4 extending perpendicularly to the second dielectric substrate 12. Compared to existing coupling architectures, the relatively vertical, three-dimensional vertical conductive element 4 significantly reduces lateral structural layout space, conforming to the trend toward smaller, lighter, and higher-performance devices.

[0083] Optionally, the width of the first opening Via1 is greater than the width of the conductive member 4, and the widths of the second opening Via2 and the third opening Via3 are both equal to the width of the conductive member 4. Exemplarily, the first opening Via1, the second opening Via2, and the third opening Via3 can all be circular openings, with the diameter of the first opening Via1 being greater than the diameter of the second opening Via2, and the diameter of the first opening Via1 being greater than the diameter of the third opening Via3. The conductive pillars can completely fill the second opening Via2 and the third opening Via3. The conductive pillars are isolated from the first reference electrode layer 2 by the first opening Via1 to prevent energy leakage. The projection of the first opening Via1 on the first dielectric substrate 11 nests within the projection of the second opening Via2 on the first dielectric substrate 11, with the distance between the two being less than 1 mm.

[0084] Exemplarily, the adjustable dielectric layer 15 is located between the first electrode layer 13 and the second electrode layer 14. In one embodiment, the first electrode layer 13 is disposed on a side of the first dielectric substrate 11 close to the adjustable dielectric layer 15. In another embodiment, the first electrode layer 13 is disposed on a side of the second dielectric substrate 12 close to the adjustable dielectric layer 15. Figure 3 Only the case where the first electrode layer 13 is arranged on a side of the first dielectric substrate 11 close to the adjustable dielectric layer 15 is shown.

[0085] Exemplarily, the first electrode layer 13 may be a coplanar waveguide (CPW) structure, and the material of the first electrode layer 13 includes, but is not limited to, copper (Cu). The first dielectric substrate 11 may be a glass substrate, and the third openings (vias) 3 provided on the glass substrate may be formed by glass drilling. The third openings (vias) 3 penetrating the glass substrate may be formed using glass through hole (TGV) technology. Exemplarily, the thickness of the glass substrate is between 0.45 mm and 0.55 mm. For example, the thickness of the glass substrate is 0.5 mm.

[0086] In some embodiments, as Figure 3 As shown, the third opening Via3 penetrates the first dielectric substrate 11, and the first electrode layer 13 is disposed on a side of the first dielectric substrate 11 near the adjustable dielectric layer 15. The conductive member 4 passes through the first opening Via1, the second opening Via2, and the third opening Via3 to directly connect to the first electrode layer 13. The direct connection here can be understood as seamless contact between the conductive member 4 and the first electrode layer 13. The direct connection of the conductive member 4 improves energy input performance and reduces insertion loss.

[0087] In some embodiments, Figure 4 A schematic diagram of a film layer of another antenna provided in an embodiment of the present disclosure, such as Figure 4 As shown, the third opening Via3 penetrates a portion of the first dielectric substrate 11, and the first electrode layer 13 is disposed on a side of the first dielectric substrate 11 near the adjustable dielectric layer 15. The conductive element 4 passes through the first opening Via1, the second opening Via2, and the third opening Via3 to couple with the first electrode layer 13. The coupling connection here can be understood as the conductive element 4 and the first electrode layer 13 not being in contact and being isolated by the first dielectric substrate 11. The transmission + coupling feeding method utilizing the conductive element 4 improves energy input performance and reduces insertion loss.

[0088] In some embodiments, in combination with the above embodiments, such as Figure 4 As shown, along the depth direction of the third opening Via3 , the thickness of the portion of the first dielectric substrate 11 not penetrated by the third opening Via3 is between 1.5 μm and 2.5 μm.

[0089] In some embodiments, the third opening Via3 penetrates the first dielectric substrate 11, and the first electrode layer 13 is disposed on a side of the first dielectric substrate 11 near the adjustable dielectric layer 15. The conductive element 4 passes through the first opening Via1 and the second opening Via2 and is coupled to the first electrode layer 13. The coupled connection here can be understood as a gap between the conductive element 4 and the first electrode layer 13 (i.e., the portion of the second opening Via2 not filled by the conductive element 4). The transmission + coupling feeding method using the conductive element 4 improves energy input performance and reduces insertion loss.

[0090] In some embodiments, the conductive member 4 can be a metal cylinder with a radius of R, where R can be set based on actual experience, for example, 0.1 mm. Of course, R can be selected differently in different application scenarios, and the present disclosure does not specifically limit this. In addition, the conductive member 4 provided in the present disclosure can also be selected in different three-dimensional shapes, such as cones, trapezoidal cylinders, prisms, etc., and the present disclosure does not limit this.

[0091] In some embodiments, Figure 5 A three-dimensional schematic diagram of an exemplary partial antenna structure provided in an embodiment of the present disclosure is shown in FIG. Figure 5 As shown, any of the above embodiments can be combined here. Specifically, the branch 322 includes a first main portion 322-1 and a first end portion 322-2 electrically connected to the conductive member 4; the first electrode layer 13 includes a second main portion 13-1 and a second end portion 13-2 connected to the conductive member 4; the width of the first end portion 322-2 perpendicular to the cross section of the first dielectric substrate 11 decreases monotonically along the direction from the first main portion 322-1 to the first end portion 322-2; and / or the width of the second end portion 13-2 perpendicular to the cross section of the first dielectric substrate 11 decreases monotonically along the direction from the second main portion 13-1 to the second end portion 13-2.

[0092] Figure 5 For example, the width of the first end portion 322-2 perpendicular to the cross section of the first dielectric substrate 11 decreases monotonically along the direction from the first main portion 322-1 to the first end portion 322-2, and the width of the second end portion 13-2 perpendicular to the cross section of the first dielectric substrate 11 decreases monotonically along the direction from the second main portion 13-1 to the second end portion 13-2. Figure 5 As shown, the positive direction of the first direction X indicates the direction along the first main portion 322-1 toward the first end portion 322-2; the negative direction of the first direction X indicates the direction along the second main portion 13-1 toward the second end portion 13-2. W1 represents the width of the first end portion 322-2 perpendicular to the cross section of the first dielectric substrate 11; W2 represents the width of the second end portion 13-2 perpendicular to the cross section of the first dielectric substrate 11. Width W1 decreases monotonically along the positive direction of the first direction X, while width W2 decreases monotonically along the negative direction of the first direction X.

[0093] Here, the connection position of the first electrode layer 13 and the feed structure 32 with the conductive piece 4 adopts a size-graduated manner, which can improve the energy input performance and reduce the insertion loss.

[0094] Further in combination with the above embodiments, as shown in Figure 5 the first end portion 322-2 on the first dielectric substrate 11 covers the orthographic projection of the conductive piece 4 on the first dielectric substrate 11, and the contour of the orthographic projection of the conductive piece 4 on the first dielectric substrate 11 falls into the contour of the orthographic projection of the first end portion 322-2 on the first dielectric substrate 11; and / or, the second end portion 13-2 on the first dielectric substrate 11 covers the orthographic projection of the conductive piece 4 on the first dielectric substrate 11, and the contour of the orthographic projection of the conductive piece 4 on the first dielectric substrate 11 falls into the contour of the orthographic projection of the second end portion 13-2 on the first dielectric substrate 11.

[0095] The above embodiments adopt a size-graduated manner for the connection position of the first electrode layer 13 and the feed structure 32 with the conductive piece 4, which is used for impedance matching of the conductive piece 4 with the first electrode layer 13 and the feed structure 32 of different sizes.

[0096] It should be noted that, Figure 5 the structure shown in Figure 3 or Figure 4 the structure shown in Figure 5 the structure shown in Figure 3 the structure shown in Figure 5 the structure shown in Figure 4In the structure shown, the conductive member 4 passes through the first opening Via1, the second opening Via2, and the third opening Via3 to be coupled and connected to the first electrode layer 13; the connection positions of the first electrode layer 13, the feeding structure 32, and the conductive member 4 adopt a dimensional gradient; at the same time, the orthographic projection of the first end portion 322-2 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11, and the outline of the orthographic projection of the conductive member 4 on the first dielectric substrate 11 falls within the outline of the orthographic projection of the first end portion 322-2 on the first dielectric substrate 11; the orthographic projection of the second end portion 13-2 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11, and the outline of the orthographic projection of the conductive member 4 on the first dielectric substrate 11 falls within the outline of the orthographic projection of the second end portion 13-2 on the first dielectric substrate 11.

[0097] Figure 6 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 1, that is, Figure 6 Yes Figure 5 Structure+ Figure 3 The structure is simulated, such as Figure 6 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 6 It can be seen from the simulation results that, by adopting the above-mentioned size gradient connection method, at the resonance point of 12 GHz, S11 = -14.96 dB, S21 = -0.3 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB, S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21).

[0098] In some embodiments, Figure 7 A three-dimensional schematic diagram of another exemplary partial antenna structure provided in an embodiment of the present disclosure is shown in FIG. Figure 7 As shown, any of the above embodiments can be combined here. Specifically, the orthographic projection of the branch 322 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11; the orthographic projection of the first electrode layer 13 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11; the remaining portion 3221 of the branch 322 except the portion connected to the main path 321 has the same width perpendicular to the cross section of the first dielectric substrate 11; and / or the width of the first electrode layer 13 perpendicular to the cross section of the first dielectric substrate 11 is the same.

[0099] Figure 7The following example illustrates that the widths of the remaining portion 3221 perpendicular to the cross section of the first dielectric substrate 11 are all the same; the widths of the first electrode layer 13 perpendicular to the cross section of the first dielectric substrate 11 are all the same. Figure 7 As shown, W3 represents the width of the remaining portion perpendicular to the cross section of the first dielectric substrate 11 ; W4 represents the width of the first electrode layer 13 perpendicular to the cross section of the first dielectric substrate 11 .

[0100] It should be noted that Figure 7 The structure shown can be combined with the above Figure 3 or Figure 4 The structure shown. Example 3, Figure 7 The structure shown is combined Figure 3 In the structure shown, the conductive member 4 passes through the first opening Via1, the second opening Via2, and the third opening Via3 and is directly connected to the first electrode layer 13, wherein the conductive member 4 can be a cylinder with a radius of 0.1 mm. The orthographic projection of the branch 322 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11; the orthographic projection of the first electrode layer 13 on the first dielectric substrate 11 covers the orthographic projection of the conductive member 4 on the first dielectric substrate 11; for the remaining parts of the branch 322 except the connection portion 35 with the main path 321, the width of the remaining parts perpendicular to the cross section of the first dielectric substrate 11 is the same; the width of the first electrode layer 13 perpendicular to the cross section of the first dielectric substrate 11 is the same. Example 4, Figure 7 The structure shown is combined Figure 4 In the illustrated structure, the conductive member 4 is coupled to the first electrode layer 13 through the first opening Via1, the second opening Via2, and the third opening Via3. The distance between the surface of the conductive member 4 near the first electrode layer 13 and the surface of the first electrode layer 13 near the conductive member 4 is 2 μm. The orthographic projection of the branch 322 on the first dielectric substrate 11 overlaps the orthographic projection of the conductive member 4 on the first dielectric substrate 11; the orthographic projection of the first electrode layer 13 on the first dielectric substrate 11 overlaps the orthographic projection of the conductive member 4 on the first dielectric substrate 11. Except for the connection portion 35 with the main path 321, the remaining portions of the branch 322 have the same width perpendicular to the cross-section of the first dielectric substrate 11. The width of the first electrode layer 13 perpendicular to the cross-section of the first dielectric substrate 11 is also the same.

[0101] Figure 8 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 3, that is, Figure 8 Yes Figure 7 Structure+ Figure 3 The structure is simulated, such as Figure 8 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 8Simulation results show that, using the aforementioned dimensionally unchanged connection method, at a resonance point of 12 GHz, S11 = -15.44 dB and S21 = -0.29 dB. Compared to the prior art (at a resonance point of 12 GHz, S11 = -9.81 dB and S21 = -1.03 dB), under the same conditions, this embodiment improves energy input (S11) performance and reduces insertion loss (S21). Furthermore, compared to the corresponding structure in Example 1, this embodiment achieves better energy input (S11) performance and lower insertion loss (S21).

[0102] Figure 9 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 4, that is, Figure 9 Yes Figure 7 Structure+ Figure 4 The structure is simulated, such as Figure 9 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 9 The simulation results show that, using the above-mentioned dimensionally unchanged connection method, at the resonance point of 12 GHz, S11 = -16.25 dB and S21 = -0.29 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB and S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21). Furthermore, compared with the corresponding structure of Example 1, this embodiment has better energy input (S11) performance and lower insertion loss (S21); compared with the corresponding structure of Example 3, this embodiment has better energy input (S11) performance.

[0103] In some embodiments, Figure 10a A three-dimensional schematic diagram of another exemplary partial antenna structure provided in an embodiment of the present disclosure is shown in FIG. Figure 10a As shown, the conductive member 4 includes a first conductive portion 41 and a second conductive portion 42 that are electrically connected. The first conductive portion 41 is located within the third opening Via3 of the first dielectric substrate 11, and the second conductive portion 42 is located within the first opening Via1 and the second opening Via2. The width of the first conductive portion 41 perpendicular to the cross-section of the first dielectric substrate 11 increases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11.

[0104] like Figure 10aAs shown, the direction opposite to the second direction Y represents the direction along the second dielectric substrate 12 toward the first dielectric substrate 11. W5 represents the width of the first conductive portion 41 perpendicular to the cross section of the first dielectric substrate 11. This width W5 increases monotonically in the direction opposite to the second direction Y. For example, the conductive member 4 may be a trapezoidal cylinder. The first conductive portion 41 has a trapezoidal profile perpendicular to the cross section of the first dielectric substrate 11, with the relatively parallel short sides closer to the first dielectric substrate 11 than the long sides. In other words, the width of the trapezoid decreases monotonically in the direction opposite to the second direction Y.

[0105] Exemplarily, the first conductive portion 41 and the second conductive portion 42 are prepared separately. The first conductive portion 41 and the second conductive portion 42 are independently provided and connected via pads during the patch process to form the conductive member 4. The cross-sections of the first conductive portion 41 and the second conductive portion 42 are circular, with the centers of the cross-sections being coaxial.

[0106] Further combined with the above embodiment, as Figure 10a As shown, the first conductive portion 41 includes a first surface 401 and a second surface 402 that are oppositely disposed in the thickness direction thereof, and the first surface 401 is closer to the first dielectric substrate 11 than the second surface 402. The orthographic projection of the second surface 402 on the first dielectric substrate 11 covers the orthographic projection of the first surface 401 on the first dielectric substrate 11, and the area ratio of the first surface 401 to the second surface 402 is between 0.125 and 0.375.

[0107] Exemplarily, the projected contours of first surface 401 and second surface 402 are the same, the projected area of ​​second surface 402 is larger than the projected area of ​​first surface 401, and the orthographic projection of first surface 401 on first dielectric substrate 11 falls within the orthographic projection of second surface 402 on first dielectric substrate 11. Furthermore, exemplary, first surface 401 is a circular surface with a radius of 0.05 mm, second surface 402 is a circular surface with a radius of 0.1 mm, and the ratio of the areas of first surface 401 to second surface 402 is 0.25.

[0108] Further combined with the above embodiment, as Figure 10a As shown, the second conductive portion 42 includes a third surface 403 and a fourth surface 404 disposed opposite each other in the thickness direction thereof, with the third surface 403 being closer to the first conductive portion 41 than the fourth surface 404. The third surface 403 and the second surface 402 are connected, and their orthographic projections coincide. "Orthographic projections coincide" here means that the orthographic projections of the third surface 403 and the second surface 402 completely overlap. For example, the second surface 402 is a circular surface with a radius of 0.1 mm, and the third surface 403 is also a circular surface with a radius of 0.1 mm.

[0109] It should be noted that Figure 10a The conductive member 4 shown can be made of the above Figure 3 or Figure 4 The connection method shown, combined with the above Figure 5 or Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 5, Figure 10b for Figure 10a Schematic diagram of the membrane layer of the antenna structure, such as Figure 10b As shown, specifically Figure 10a The conductive member 4 shown is directly connected and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 6: Figure 10a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 7: Figure 10a As an example, the conductive member 4 shown in FIG. 4 is directly connected and combined with Figure 5 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 8, Figure 10a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 5 The structures of the feeding structure 32 and the first electrode layer 13 are shown.

[0110] Figure 11 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 5, as shown in Figure 11 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 11 It can be seen from the simulation results that at the resonance point of 12 GHz, S11 = -14.74 dB, S21 = -0.31 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB, S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21).

[0111] In some embodiments, Figure 12a A three-dimensional schematic diagram of another exemplary partial antenna structure provided in an embodiment of the present disclosure is shown in FIG. Figure 12a As shown, the conductive member 4 includes a first conductive portion 41 and a second conductive portion 42 that are electrically connected. The first conductive portion 41 is located within the third opening Via3 of the first dielectric substrate 11, and the second conductive portion 42 is located within the first opening Via1 and the second opening Via2. The width of the first conductive portion 41 perpendicular to the cross-section of the first dielectric substrate 11 decreases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11.

[0112] like Figure 12a As shown, the direction opposite to the second direction Y represents the direction along the second dielectric substrate 12 toward the first dielectric substrate 11. W6 represents the width of the first conductive portion 41 perpendicular to the cross section of the first dielectric substrate 11. This width W6 decreases monotonically in the direction opposite to the second direction Y. For example, the conductive member 4 may be a trapezoidal cylinder. The first conductive portion 41 has a trapezoidal profile perpendicular to the cross section of the first dielectric substrate 11, with the relatively parallel long sides closer to the first dielectric substrate 11 than the short sides. The width of the trapezoid decreases monotonically in the direction opposite to the second direction Y.

[0113] Exemplarily, the first conductive portion 41 and the second conductive portion 42 are prepared separately. The first conductive portion 41 and the second conductive portion 42 are independently provided and connected via pads during the patch process to form the conductive member 4. The cross-sections of the first conductive portion 41 and the second conductive portion 42 are circular, with the centers of the cross-sections being coaxial.

[0114] Further combined with the above embodiment, as Figure 12a As shown, the first conductive portion 41 includes a first surface 401 and a second surface 402 that are oppositely disposed in the thickness direction thereof, and the first surface 401 is closer to the first dielectric substrate 11 than the second surface 402. The orthographic projection of the first surface 401 on the first dielectric substrate 11 covers the orthographic projection of the second surface 402 on the first dielectric substrate 11, and the area ratio of the second surface 402 to the first surface 401 is between 0.125 and 0.375.

[0115] Exemplarily, the projected contours of first surface 401 and second surface 402 are the same, the projected area of ​​second surface 402 is smaller than the projected area of ​​first surface 401, and the orthographic projection of second surface 402 on first dielectric substrate 11 falls within the orthographic projection of first surface 401 on first dielectric substrate 11. Furthermore, exemplary, second surface 402 is a circular surface with a radius of 0.05 mm, first surface 401 is a circular surface with a radius of 0.1 mm, and the area ratio of second surface 402 to first surface 401 is 0.25.

[0116] Further combined with the above embodiment, as Figure 12a As shown, the second conductive portion 42 includes a third surface 403 and a fourth surface 404 that are arranged opposite to each other in the thickness direction thereof, and the third surface 403 is closer to the first conductive portion 41 than the fourth surface 404. The third surface 403 is connected to the second surface 402, and the orthographic projection of the third surface 403 on the first dielectric substrate 11 covers the orthographic projection of the second surface 402 on the first dielectric substrate 11.

[0117] Exemplarily, the projected contours of the third surface 403 and the second surface 402 are the same, the projected area of ​​the second surface 402 is smaller than the projected area of ​​the third surface 403, and the orthographic projection of the second surface 402 on the first dielectric substrate 11 falls within the orthographic projection of the third surface 403 on the first dielectric substrate 11. Furthermore, exemplarily, the second surface 402 is a circular surface with a radius of 0.05 mm, the third surface 403 is a circular surface with a radius of 0.1 mm, and the ratio of the area of ​​the second surface 402 to the first surface 401 is 0.25.

[0118] It should be noted that Figure 12a The conductive member 4 shown can be made of the above Figure 3 or Figure 4 The connection method shown, combined with the above Figure 5 or Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 9, Figure 12b for Figure 12a Schematic diagram of the membrane layer of the antenna structure, such as Figure 12b As shown, specifically Figure 12a The conductive member 4 shown is directly connected and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 10, with Figure 12a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 11, with Figure 12a As an example, the conductive member 4 shown in FIG. 4 is directly connected and combined with Figure 5 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 12, with Figure 12a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 5 The structures of the feeding structure 32 and the first electrode layer 13 are shown.

[0119] Figure 13 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 9, as shown in Figure 13 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 13The simulation results show that at the resonance point of 12 GHz, S11 = -14.64 dB and S21 = -0.31 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB and S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21). Furthermore, compared with the corresponding structure in Example 1, this embodiment has better energy input (S11) performance.

[0120] In some embodiments, Figure 14a A three-dimensional schematic diagram of another exemplary partial antenna structure provided in an embodiment of the present disclosure is shown in FIG. Figure 14a As shown, the conductive member 4 includes an electrically connected first conductive portion 41 and a second conductive portion 42; the first conductive portion 41 is located within the third opening Via3 of the first dielectric substrate 11, and the second conductive portion 42 is located within the first opening Via1 and the second opening Via2; the first conductive portion 41 includes a first sub-conductive portion 411 and a second sub-conductive portion 412, and the first conductive portion 41 is closer to the first electrode layer 13 than the second sub-conductive portion 412; the width of the first sub-conductive portion 411 perpendicular to the cross-section of the first dielectric substrate 11 decreases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11; and / or the width of the second sub-conductive portion 412 perpendicular to the cross-section of the first dielectric substrate 11 increases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11.

[0121] Figure 14a For example, the width of the first sub-conductive portion 411 perpendicular to the cross section of the first dielectric substrate 11 decreases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11, while the width of the second sub-conductive portion 412 perpendicular to the cross section of the first dielectric substrate 11 increases monotonically along the direction from the second dielectric substrate 12 to the first dielectric substrate 11. Figure 14a As shown, the opposite direction of the second direction Y represents the direction along the second dielectric substrate 12 pointing to the first dielectric substrate 11, W7 represents the width of the first sub-conductive portion 411 perpendicular to the cross section of the first dielectric substrate 11, and the width W7 monotonically decreases in the opposite direction of the second direction Y; W8 represents the width of the second sub-conductive portion 412 perpendicular to the cross section of the first dielectric substrate 11, and the width W8 monotonically increases in the opposite direction of the second direction Y.

[0122] For example, the first sub-conductive portion 411 and the second sub-conductive portion 412 may be integrally formed. The cross-sections of the first sub-conductive portion 411 and the second sub-conductive portion 412 are circular, and the centers of the cross-sections are coaxial.

[0123] Further combined with the above embodiment, as Figure 14aAs shown, the first sub-conductive part 411 includes the first surface 401 and the fifth surface 405 oppositely arranged in the thickness direction of the first sub-conductive part 411, and the first surface 401 is closer to the first dielectric substrate 11 than the fifth surface 405; the second sub-conductive part 412 includes the sixth surface 406 and the second surface 402 oppositely arranged in the thickness direction of the second sub-conductive part 412, and the sixth surface 406 is closer to the first dielectric substrate 11 than the second surface 402; the orthographic projection of the first surface 401 on the first dielectric substrate 11 covers the orthographic projection of the fifth surface 405 on the first dielectric substrate 11, and the area ratio of the fifth surface 405 to the first surface 401 is between 0.125 and 0.375; and / or, the orthographic projection of the second surface 402 on the first dielectric substrate 11 covers the orthographic projection of the sixth surface 406 on the first dielectric substrate 11, and the area ratio of the sixth surface 406 to the second surface 402 is between 0.125 and 0.375.

[0124] For example, the projection profiles of the first surface 401, the second surface 402, the fifth surface 405 and the sixth surface 406 are all the same, the projection area of the first surface 401 is equal to the projection area of the second surface 402, the projection area of the fifth surface 405 is equal to the projection area of the sixth surface 406, the projection area of the first surface 401 is greater than the projection area of the fifth surface 405 (i.e., the projection area of the second surface 402 is greater than the projection area of the sixth surface 406), and the orthographic projection of the fifth surface 405 on the first dielectric substrate 11 falls within the orthographic projection of the first surface 401 on the first dielectric substrate 11, and the orthographic projection of the sixth surface 406 on the first dielectric substrate 11 falls within the orthographic projection of the second surface 402 on the first dielectric substrate 11. For another example, the first surface 401 and the second surface 402 are circular surfaces with a radius of 0.1 mm, the fifth surface 405 and the sixth surface 406 are circular surfaces with a radius of 0.1 mm, and the area ratio of the fifth surface 405 to the first surface 401 is 0.25 (i.e., the area ratio of the sixth surface 406 to the second surface 402 is 0.25).

[0125] Further in combination with the above embodiments, as Figure 14aAs shown, the second conductive part 42 includes a third surface 403 and a fourth surface 404 arranged opposite to each other in the thickness direction thereof, and the third surface 403 is closer to the first conductive part 41 than the fourth surface 404; the third surface 403 and the second surface 402 are connected, and the orthographic projections of the two coincide. The "orthographic projection coincides" here means that the orthographic projections of the third surface 403 and the second surface 402 completely coincide. Exemplarily, the second surface 402 is a circular surface with a radius of 0.1 mm, and the third surface 403 is also a circular surface with a radius of 0.1 mm. Exemplarily, the first conductive part 41 and the second conductive part 42 are prepared separately. The first conductive part 41 and the second conductive part 42 are arranged independently of each other, and when performing the patch process, they are connected by pads to form a conductive part 4. The cross-sections of the first conductive part 41 and the second conductive part 42 are circular, and the centers of the circles of each cross-section are coaxial.

[0126] It should be noted that Figure 14a The conductive member 4 shown can be made of the above Figure 3 or Figure 4 The connection method shown, combined with the above Figure 5 or Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 13, Figure 14b for Figure 14a The schematic diagram of the antenna film layer corresponding to the structure is as follows: Figure 14b As shown, specifically Figure 14a The conductive member 4 shown is directly connected and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 14: Figure 14a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 7 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 15, with Figure 14a As an example, the conductive member 4 shown in FIG. 4 is directly connected and combined with Figure 5 The structure of the feeding structure 32 and the first electrode layer 13 shown. Example 16, with Figure 14a As an example, the conductive member 4 is connected in a coupled manner and combined with Figure 5 The structures of the feeding structure 32 and the first electrode layer 13 are shown.

[0127] Figure 15 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 13, as shown in Figure 15 As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 15It can be seen from the simulation results that at the resonance point of 12 GHz, S11 = -14.62 dB, S21 = -0.31 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB, S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21).

[0128] In some embodiments, Figure 16 A schematic diagram of another exemplary antenna film layer provided in an embodiment of the present disclosure is shown in FIG. Figure 16 As shown, the feed substrate 3 further includes a second dielectric layer 33 arranged on a side of the feed structure 32 away from the first dielectric layer 31, and a second reference electrode layer 34 arranged on a side of the second dielectric layer 33 away from the feed structure 32; the orthographic projection of the first reference electrode layer 2 on the first dielectric substrate 11 does not overlap with the orthographic projection of the feed structure 32 on the first dielectric substrate 11.

[0129] In the prior art, Figure 1b As shown, in general, the first reference electrode layer 2 is a whole layer structure, and its orthographic projection on the second dielectric layer 33 completely covers the orthographic projection of the feeding structure 32 on the second dielectric layer 33. However, in the embodiment of the present disclosure, the first reference electrode layer 2 on the upper layer of the feeding structure 32 is etched so that the orthographic projection of the first reference electrode layer 2 on the first dielectric substrate 11 does not overlap with the orthographic projection of the feeding structure 32 on the first dielectric substrate 11.

[0130] For example, Figure 16 As shown, a seventh opening Via7 is provided on the first reference electrode layer 2, and the seventh opening Via7 penetrates the first reference electrode layer 2 along the thickness direction of the first reference electrode layer 2. The seventh opening Via7 can be connected with the second opening Via2 to form a large slot. The orthographic projection of the slot on the first dielectric layer 31 covers the orthographic projection of the feeding structure 32 on the first dielectric substrate 11, which can improve the performance of energy input.

[0131] It should be noted that Figure 16 The antenna shown can be applied to any of the above embodiments (including Examples 1 to 16), and the repeated parts will not be repeated. Figure 16 As shown, the conductive member 4 can be a cylinder with a radius of 0.1 mm, and the conductive member 4 adopts a coupling connection method and combines Figure 7 The structures of the feeding structure 32 and the first electrode layer 13 are shown. The orthographic projection of the first reference electrode layer 2 on the first dielectric substrate 11 does not overlap with the orthographic projection of the feeding structure 32 on the first dielectric substrate 11 .

[0132] Figure 17 This is a schematic diagram of the S parameter simulation of the structure corresponding to Example 17, as shown in Figure 17As shown, in order to reduce the complexity of the simulation, the original "one-to-many" power divider is equivalent to a metal line, and only the simulation results of one branch 322 and its corresponding phase shift structure 1 are used as an example to illustrate. Figure 17 The simulation results show that at the resonance point of 12 GHz, S11 = -21.28 dB and S21 = -0.21 dB. Compared with the prior art (at the resonance point of 12 GHz, S11 = -9.81 dB and S21 = -1.03 dB), under the same conditions, this embodiment can improve the energy input (S11) performance and reduce the insertion loss (S21). Furthermore, compared with the corresponding structures of Examples 1, 3, 4, 5, 9, and 13, this embodiment has better energy input (S11) performance and lower insertion loss (S21).

[0133] In some embodiments, Figure 18 A schematic diagram of a specific film layer of an exemplary antenna provided in an embodiment of the present disclosure is shown as follows: Figure 18 As shown, the feed substrate 3 further includes a third dielectric layer, a connecting portion 35 and a feed source 36; the third dielectric layer is located on the side of the second reference electrode layer 34 away from the second dielectric layer 33, and has a fourth opening Via4; the feed source 36 is located in the fourth opening Via4 and is electrically connected to the connecting portion 35; the connecting portion 35 is electrically connected to the main path 321 through a fifth opening Via5 that penetrates the second reference electrode layer 34 and a sixth opening Via6 that penetrates the second dielectric layer 33.

[0134] like Figure 18 As shown, a reflective layer 38 (ie, BR layer) is provided on the side of the third dielectric layer away from the second reference electrode layer 34. The reflective layer 38 has an eighth opening Via8, and the feed source 36 is located within the fourth opening Via4 and the eighth opening Via8. The reflective layer 38 is used to reflect signals and increase signal strength.

[0135] For example, Figure 18 As shown, the thickness of the first reference electrode layer 2 provided in the embodiment of the present disclosure is 18 μm, the thickness of the first dielectric layer 31 is 0.508 mm, the thickness of the second dielectric layer 33 is 0.058 mm, the thickness of the second reference electrode layer 34 is 18 μm, and the thickness of the feed structure 32 is 18 μm. The material of the first reference electrode layer 2, the material of the second reference electrode layer 34, and the material of the feed structure 32 can all be copper (Cu). The material of the feed source 36 and the connecting portion 35 can be a shape memory polymer (SMP).

[0136] In some embodiments, Figure 19 A schematic diagram of a portion of a film layer of an exemplary antenna provided in an embodiment of the present disclosure, such as Figure 19As shown, the antenna further includes a packaging structure 5 , which is located on a side of the first electrode layer 13 close to the adjustable dielectric layer 15 , and an orthographic projection of the packaging structure 5 on the first dielectric substrate 11 covers an orthographic projection of the conductive element 4 on the first dielectric substrate 11 .

[0137] This embodiment can be combined with any of the above embodiments. For example, while maintaining the overall structural hierarchy, a third opening, Via3, is opened on the first dielectric substrate 11 (glass substrate) and filled with metal to form a first conductive portion 41. An encapsulation structure 5, such as encapsulant, is provided at the projection of the first conductive portion 41 on the side of the first electrode layer 13 facing away from the first dielectric substrate 11. This encapsulant effectively reduces the pressure exerted by the liquid crystal on the third opening, Via3, preventing the third opening from reopening and potentially causing device failure.

[0138] The present disclosure also provides an electronic device comprising the antenna of any of the above-described embodiments. The electronic device may be, for example, a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, vehicle-mounted device, or any other product with signal transceiver capabilities. Other essential components of the electronic device are readily understood by those skilled in the art and are not detailed here, nor should they be construed as limitations of the present disclosure.

[0139] In some examples, the antenna in the electronic device also includes a transceiver unit, a radio frequency transceiver, a signal amplifier, a power amplifier, and a filtering unit. The antenna in the communication device can be used as a transmitting antenna or a receiving antenna. The transceiver unit may include a baseband and a receiving end. The baseband provides signals of at least one frequency band, such as 2G signals, 3G signals, 4G signals, 5G signals, etc., and transmits the signals of at least one frequency band to the radio frequency transceiver. After the antenna in the communication system receives the signal, it can be processed by the filtering unit, power amplifier, signal amplifier, and radio frequency transceiver and then transmitted to the receiving end in the transceiver unit. The receiving end may be, for example, a smart gateway.

[0140] Furthermore, a radio frequency transceiver is connected to the transceiver unit and is used to modulate the signals sent by the transceiver unit or to demodulate the signals received by the antenna and transmit them back to the transceiver unit. Specifically, the radio frequency transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate these various types of signals provided by the baseband and then transmit them to the antenna. The antenna receives the signal and transmits it to the receiving circuit of the radio frequency transceiver. The receiving circuit transmits the signal to the demodulation circuit, which demodulates the signal and transmits it to the receiving end.

[0141] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit, which is connected to at least one antenna. When the communication system transmits signals, the signal amplifier is used to increase the signal-to-noise ratio of the signal output by the RF transceiver before transmitting it to the filtering unit. The power amplifier is used to amplify the power of the signal output by the RF transceiver before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output by the signal amplifier and the power amplifier, filters out noise, and then transmits them to the antenna, which radiates the signal. When the communication system receives signals, the antenna receives the signal and transmits it to the filtering unit. The filtering unit filters out noise from the signal received by the antenna and transmits it to the signal amplifier and power amplifier. The signal amplifier amplifies the signal received by the antenna to increase the signal-to-noise ratio. The power amplifier amplifies the power of the signal received by the antenna. The signal received by the antenna is processed by the power amplifier and the signal amplifier before being transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0142] In some examples, the signal amplifier may include various types of signal amplifiers, such as a low noise amplifier, which is not limited herein.

[0143] In some examples, the antenna provided by the embodiments of the present disclosure further includes a power management unit, which is connected to a power amplifier to provide the power amplifier with a voltage for amplifying a signal.

[0144] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. An antenna comprising at least one phase shift structure, a first reference electrode layer and a feed substrate; wherein: The phase shift structure includes a first dielectric substrate and a second dielectric substrate arranged opposite to each other, and a first electrode layer, a second electrode layer and an adjustable dielectric layer arranged therebetween; The adjustable dielectric layer is located between the first electrode layer and the second electrode layer; The first reference electrode layer is located on a side of the first dielectric substrate away from the adjustable dielectric layer and has a first opening; The feed substrate includes a first dielectric layer and a feed structure, wherein the first dielectric layer is located on a side of the first reference electrode layer away from the adjustable dielectric layer, and the feed structure is located on a side of the first dielectric layer away from the first reference electrode layer; the first dielectric layer has a second opening extending through the first dielectric layer in a thickness direction thereof; The antenna further comprises a conductive member; the feeding structure comprises a main circuit and at least one branch circuit electrically connected to the main circuit; One of the branches is electrically connected to one of the conductive elements, and the conductive element is electrically connected to the first electrode layer through the first opening, the second opening, and the third opening; the third opening penetrates at least a portion of the thickness of the first dielectric substrate along the thickness direction of the first dielectric substrate.

2. The antenna according to claim 1, wherein The third opening passes through the first dielectric substrate, and the first electrode layer is arranged on a side of the first dielectric substrate close to the adjustable dielectric layer. The conductive member passes through the first opening, the second opening, and the third opening and is directly connected to the first electrode layer.

3. The antenna according to claim 1, wherein The third opening passes through a portion of the first dielectric substrate, and the first electrode layer is arranged on a side of the first dielectric substrate close to the adjustable dielectric layer. The conductive member passes through the first opening, the second opening, and the third opening and is coupled to the first electrode layer.

4. The antenna according to claim 3, wherein Along the depth direction of the third opening, the thickness of the portion of the first dielectric substrate not penetrated by the third opening is between 1.5 μm and 2.5 μm.

5. The antenna according to any one of claims 1 to 4, wherein The branch includes a first main portion and a first end portion electrically connected to the conductive member; the first electrode layer includes a second main portion and a second end portion connected to the conductive member; The width of the first end portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along the direction from the first main body portion to the first end portion; and / or, The width of the second end portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along a direction from the second main body portion to the second end portion. The antenna according to claim 5 , wherein: The orthographic projection of the first end portion on the first dielectric substrate covers the orthographic projection of the conductive member on the first dielectric substrate, and the outline of the orthographic projection of the conductive member on the first dielectric substrate falls within the outline of the orthographic projection of the first end portion on the first dielectric substrate; and / or, The orthographic projection of the second end portion on the first dielectric substrate covers the orthographic projection of the conductive member on the first dielectric substrate, and an outline of the orthographic projection of the conductive member on the first dielectric substrate falls within the outline of the orthographic projection of the second end portion on the first dielectric substrate.

7. The antenna according to any one of claims 1 to 4, wherein: The orthographic projection of the branch on the first dielectric substrate covers the orthographic projection of the conductive member on the first dielectric substrate; The orthographic projection of the first electrode layer on the first dielectric substrate covers the orthographic projection of the conductive element on the first dielectric substrate; For the remaining parts of the branch except the part connected to the main path, the remaining parts have the same width perpendicular to the cross section of the first dielectric substrate; and / or the first electrode layer has the same width perpendicular to the cross section of the first dielectric substrate.

8. The antenna according to claim 7, wherein The conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening; The width of the first conductive portion perpendicular to the cross section of the first dielectric substrate increases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

9. The antenna according to claim 8, wherein The first conductive portion includes a first surface and a second surface that are opposite to each other in the thickness direction thereof, and the first surface is closer to the first dielectric substrate than the second surface; The orthographic projection of the second surface on the first dielectric substrate covers the orthographic projection of the first surface on the first dielectric substrate, and an area ratio of the first surface to the second surface is between 0.125 and 0.

375.

10. The antenna according to claim 9, wherein The second conductive portion includes a third surface and a fourth surface disposed opposite to each other in the thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface; The third surface is connected to the second surface, and their orthographic projections coincide with each other.

11. The antenna according to claim 7, wherein The conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening; The width of the first conductive portion perpendicular to the cross section of the first dielectric substrate decreases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

12. The antenna according to claim 11, wherein The first conductive portion includes a first surface and a second surface that are opposite to each other in the thickness direction thereof, and the first surface is closer to the first dielectric substrate than the second surface; The orthographic projection of the first surface on the first dielectric substrate covers the orthographic projection of the second surface on the first dielectric substrate, and an area ratio of the second surface to the first surface is between 0.125 and 0.

375.

13. The antenna according to claim 12, wherein The second conductive portion includes a third surface and a fourth surface disposed opposite to each other in the thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface; The third surface is connected to the second surface, and an orthographic projection of the third surface on the first dielectric substrate covers an orthographic projection of the second surface on the first dielectric substrate.

14. The antenna according to claim 7, wherein The conductive member includes a first conductive portion and a second conductive portion that are electrically connected; the first conductive portion is located in the third opening of the first dielectric substrate, and the second conductive portion is located in the first opening and the second opening; The first conductive portion includes a first sub-conductive portion and a second sub-conductive portion, and the first conductive portion is closer to the first electrode layer than the second sub-conductive portion; The width of the first sub-conductive portion perpendicular to the cross-section of the first dielectric substrate decreases monotonically along a direction from the second dielectric substrate to the first dielectric substrate; and / or the width of the second sub-conductive portion perpendicular to the cross-section of the first dielectric substrate increases monotonically along a direction from the second dielectric substrate to the first dielectric substrate.

15. The antenna according to claim 14, wherein The first sub-conductive portion includes a first surface and a fifth surface that are oppositely arranged in the thickness direction thereof, and the first surface is closer to the first dielectric substrate than the fifth surface; The second sub-conductive portion includes a sixth surface and a second surface that are arranged opposite to each other in the thickness direction thereof, and the sixth surface is closer to the first dielectric substrate than the second surface; The orthographic projection of the first surface on the first dielectric substrate covers the orthographic projection of the fifth surface on the first dielectric substrate, and the ratio of the area of ​​the fifth surface to the area of ​​the first surface is between 0.125 and 0.375; And / or, the orthographic projection of the second surface on the first dielectric substrate covers the orthographic projection of the sixth surface on the first dielectric substrate, and the area ratio of the sixth surface to the second surface is between 0.125 and 0.

375.

16. The antenna according to claim 15, wherein The second conductive portion includes a third surface and a fourth surface disposed opposite to each other in the thickness direction thereof, and the third surface is closer to the first conductive portion than the fourth surface; The third surface is connected to the second surface, and their orthographic projections coincide with each other.

17. The antenna according to claim 7, wherein The feed substrate further includes a second dielectric layer provided on a side of the feed structure away from the first dielectric layer, and a second reference electrode layer provided on a side of the second dielectric layer away from the feed structure; An orthographic projection of the first reference electrode layer on the first dielectric substrate does not overlap with an orthographic projection of the feeding structure on the first dielectric substrate.

18. The antenna according to claim 17, wherein The feed substrate also includes a third dielectric layer, a connecting portion and a feed source; the third dielectric layer is located on the side of the second reference electrode layer away from the second dielectric layer and has a fourth opening; the feed source is located in the fourth opening and is electrically connected to the connecting portion; the connecting portion is electrically connected to the main circuit through a fifth opening that penetrates the second reference electrode layer and a sixth opening that penetrates the second dielectric layer.

19. The antenna according to any one of claims 1 to 4, wherein: The antenna further includes a packaging structure, which is located on a side of the first electrode layer close to the adjustable dielectric layer, and an orthographic projection of the packaging structure on the first dielectric substrate covers an orthographic projection of the conductive element on the first dielectric substrate.

20. The antenna according to claim 1, wherein The width of the first opening is greater than the width of the conductive member, and the widths of the second opening and the third opening are both equal to the width of the conductive member.

21. An electronic device comprising the antenna according to any one of claims 1 to 20.

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