Ceramic plate transfer device with auxiliary loading component and use method

Abstract

The present invention discloses a ceramic disk transfer device with an auxiliary loading component and a use method, which relates to the technical field of semiconductor material processing, and comprises a transfer mechanism and a transfer motor installed on one side of the bottom of the transfer mechanism, one side of the transfer mechanism is provided with an auxiliary loading mechanism, and the front side of the auxiliary loading mechanism is provided with a loading motor, the transfer mechanism comprises a transfer base, the top of the transfer base is fixedly provided with a transfer support rod, the bottom side of the transfer support rod is fixedly provided with a motor bracket, wherein the transfer motor is fixedly installed at the end of the motor bracket, and the output end of the transfer motor is fixedly connected with a rotating disk, and the transfer mechanism can be provided with the transfer motor to realize the rotation of the rotating sleeve and the transfer connecting rod by arranging the transfer motor, and since the slide groove opened inside the transfer groove wheel is arranged at 90 degrees, the rotating sleeve and the transfer connecting rod can be rotated 90 degrees each time, which is convenient for polishing semiconductor silicon single crystal wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material processing, and in particular to a ceramic disc transfer device provided with an auxiliary loading component and a use method thereof. Background Art

[0002] In the field of semiconductor materials, semiconductor silicon single crystals need to be polished multiple times to achieve the desired effect. Before polishing, wax is applied to the surface of the silicon wafer and then dried. A robot is used to flip it over and place it on a ceramic disk for loading so that the ceramic disk and the silicon wafer are bonded. The ceramic disk with the silicon wafer is then placed on a polishing machine to rough-polish the silicon wafer. After the rough polishing is completed, the robot is used to transfer the ceramic disk and the silicon wafer to the next polishing machine.

[0003] Announcement No. CN 216037336 U discloses a ceramic disc transfer device, which uses the transmission member connecting block to energize and drive the connecting block and the ceramic disc to descend, applies pressure to the wafer after glue coating and drying, so that the wafer is attached to the ceramic disc and fixed, and then uses the driving motor to drive the device to rotate, and drives the attached wafer to move to the rough polishing area, and then moves to the fine polishing area for polishing after grinding in the rough polishing area. The entire device abandons the external auxiliary mechanism, directly drives the wafer to move, and the wafer moves synchronously in different processing areas, and the processing is synchronous, which greatly improves the work efficiency. In addition, the structure does not need to flip the wafer, the operation is simple, and the operation error is avoided, and the wafer is prevented from falling and being damaged during operation. A transmission area is added, and the wafer is transported by a transmission belt, and wax and dry the wafer during the wafer transportation process. After drying, it automatically moves to the loading area, and the automation degree of the entire device is improved, and the continuous and uninterrupted operation and processing of the wafer are realized. However, the above patent still has the following problems in actual use:

[0004] Although the ceramic disc transfer equipment can realize continuous and uninterrupted operation and processing of wafers, it cannot ensure that the wafer falls exactly on the bottom center of the ceramic disc when the transmission belt is used to transport the wafer. When pressure is applied to the wafer after glue coating and drying, the wafer is adhered and fixed to the ceramic disc. Since the wafer is not in the center position of the ceramic disc, the force on the wafer is uneven, which affects the tightness of the pressing between the wafer and the ceramic disc, and easily causes uneven polishing during polishing.

[0005] The invention proposes a ceramic plate transfer device with an auxiliary loading component and a method of use to solve the above-mentioned problems. Summary of the invention

[0006] The object of the present invention is to provide a ceramic disc transfer device with an auxiliary loading component and a method of use, so as to solve the problem proposed in the above background technology that although the ceramic disc transfer device can realize continuous and uninterrupted operation and processing of chips, when the chips are transported by a transmission belt, it cannot be guaranteed that the chips will fall exactly at the bottom center of the ceramic disc. When pressure is applied to the chips after glue coating and drying so that the chips are adhered and fixed to the ceramic disc, the chips are not in the center of the ceramic disc, resulting in uneven force on the chips, thereby affecting the tightness of the pressing between the chips and the ceramic disc, which can easily cause uneven polishing during polishing.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a ceramic plate transfer device provided with an auxiliary loading assembly and a method of using the device, comprising a transfer mechanism, and a transfer motor installed on one side of the bottom of the transfer mechanism;

[0008] An auxiliary feeding mechanism is provided on one side of the transfer mechanism, and a feeding motor is provided on the front side of the auxiliary feeding mechanism;

[0009] Also includes:

[0010] The transfer mechanism comprises a transfer base, a transfer support rod is fixedly installed on the top of the transfer base, and a motor bracket is fixedly installed on one side of the bottom of the transfer support rod;

[0011] The transfer motor is fixedly installed at the end of the motor bracket, the output end of the transfer motor is fixedly connected to a transfer disk, and a transfer limit block is fixedly installed on one side of the top of the transfer disk;

[0012] Among them, a transfer engagement block is fixedly installed at the top center position of the rotating disk, one side of the transfer engagement block is meshedly connected with a transfer groove wheel, and a rotating sleeve is fixedly installed on the top of the transfer groove wheel, and the rotating sleeve is rotatably connected to the transfer support rod;

[0013] Transfer connecting rods are fixedly installed around the outer side of the rotating sleeve, connecting columns are fixedly installed on the ends of the transfer connecting rods, a limiting sleeve is fixedly installed on the top of the connecting column, a limiting motor is fixedly installed on one side of the bottom of the limiting sleeve, the output end of the limiting motor is fixedly connected to the limiting main gear, and one side of the limiting main gear is meshedly connected to the limiting slave gear.

[0014] By adopting the above technical scheme, the transfer motor is used to drive the transfer turntable and the transfer engaging block to rotate, and the meshing action between the transfer engaging block and the transfer groove wheel is used to realize the rotation of the rotating sleeve and the transfer connecting rod. Since the slide groove opened inside the transfer groove wheel is set at 90 degrees, the rotating sleeve and the transfer connecting rod can be rotated 90 degrees each time, which is convenient for polishing semiconductor silicon single crystal wafers.

[0015] The limit slave gear is rotationally connected to the limit sleeve, and a plurality of spiral grooves are opened inside the limit slave gear. The inner part of the spiral groove is slidably connected to the limit slider, and a limit sliding rod is fixedly installed on the top of the limit slider, and a plurality of vibration sliding grooves are opened inside the limit sliding rod.

[0016] By adopting the above technical scheme, a limit motor is set to drive the limit main gear to rotate, and the meshing action between the limit main gear and the limit slave gear is utilized. Under the limiting action of the spiral slide groove, the limit slider drives the limit sliding rod to slide inside the limit sleeve, and the limit sliding rod drives the limit support plate to expand or contract. Under the action of the clamping spring and the clamping plate, the semiconductor silicon single crystal chip on the ceramic disk body can be clamped and limited, so that the semiconductor silicon single crystal chip can be located at the top center position of the ceramic disk body, which is convenient for pasting the ceramic disk body and the semiconductor silicon single crystal chip.

[0017] A first vibration spring is fixedly installed inside the vibration slide groove, a vibration protrusion is fixedly connected to the top of the first vibration spring, the vibration protrusion is slidably connected to the limit sliding rod through the vibration slide groove, a limit support plate is fixedly installed on the end of the limit sliding rod, and a clamping spring is fixedly installed on the limit support plate near the top of the limit sliding rod.

[0018] By adopting the above technical scheme, under the action of the clamping spring and the clamping plate, the semiconductor silicon single crystal chip on the ceramic disk body can be clamped and limited, so that the semiconductor silicon single crystal chip can be located at the top center position of the ceramic disk body, thereby facilitating the pasting of the ceramic disk body and the semiconductor silicon single crystal chip.

[0019] The end of the clamping spring is fixedly connected to a clamping plate, the top of the clamping plate is fixedly installed with a rotating support, the top of the rotating support is rotatably connected to a vibration plate, a second vibration spring is fixedly installed on one side of the bottom of the vibration plate, the second vibration spring is fixedly connected to the limiting support plate, and a ceramic disk body is fixedly installed on the top of the limiting sleeve.

[0020] By adopting the above technical solution, while the limiting sliding rod is telescoping and sliding, the vibration protrusion will continuously knock the limiting sleeve and the ceramic disk body, and under the action of the first vibration spring and the second vibration spring, the vibration plate will vibrate, so that the semiconductor silicon single crystal wafer that falls on the surface of the vibration plate can fall to the top of the ceramic disk body, and cooperate with the clamping plate to clamp and limit, so that the semiconductor silicon single crystal wafer is in the top center position of the ceramic disk body, which is convenient for polishing the semiconductor silicon single crystal wafer.

[0021] A rotating top plate is fixedly installed on the top of the transfer support rod, and a plurality of first electric telescopic rods are fixedly installed on the bottom of the rotating top plate. A rough polisher, a fine polisher and a heating device are fixedly installed on the bottom of the first electric telescopic rods, respectively. The fine polisher and the heating device are symmetrically arranged on both sides of the bottom of the rotating top plate, and the rough polisher is arranged perpendicular to the middle part of the horizontal connecting line between the fine polisher and the heating device.

[0022] By adopting the above technical scheme, a rough polisher and a fine polisher are set up to perform rough polishing and fine polishing on the semiconductor silicon single wafer respectively, thereby improving the polishing effect of the semiconductor silicon single wafer. At the same time, a heating device can be used to heat the polished semiconductor silicon single wafer to melt the wax on the surface of the semiconductor silicon single wafer, thereby facilitating the separation of the semiconductor silicon single wafer from the ceramic disk body and simultaneously performing uninterrupted transportation of the ceramic disk body and polishing of the semiconductor silicon single wafer.

[0023] Preferably, the auxiliary feeding mechanism includes a feeding bracket, the feeding motor is fixedly installed on the front side of the feeding bracket, the output end of the feeding motor is fixedly connected to a first sprocket transmission assembly, the inner side of the first sprocket transmission assembly is fixedly connected to a plurality of conveying rollers, and the outer side of the conveying roller is transmission-connected to a conveyor belt.

[0024] By adopting the above technical solution and setting up an auxiliary feeding mechanism, not only can the feeding motor be used to drive the first sprocket transmission assembly and the conveying roller to rotate, but also the characteristics of the transmission connection between the conveying roller and the conveyor belt can be used to realize the transportation of semiconductor silicon single crystals.

[0025] Preferably, a second electric telescopic rod is symmetrically installed on one side of the interior of the loading bracket, and the end of the second electric telescopic rod is fixedly connected to a limit baffle, and the limit baffle is fitly connected to the surface of the conveyor belt, and one side of the first sprocket transmission assembly is transmission-connected to the second sprocket transmission assembly.

[0026] By adopting the above technical solution, the second electric telescopic rod is used to drive the limit baffle to move, so that the distance between the limit baffles can be controlled, so that the transported semiconductor silicon single wafer is in the middle of the conveyor belt.

[0027] Preferably, a transmission shaft is fixedly connected to an inner side of the second sprocket transmission assembly, rotating disks are symmetrically installed at both ends of the transmission shaft, a plurality of flip baffles are fixedly connected between the two rotating disks, a gluing device is fixedly installed on the top side of the feeding bracket, and a drying device is fixedly installed on the top side of the feeding bracket close to the gluing device.

[0028] By adopting the above technical scheme, the second sprocket transmission assembly is used to drive the transmission shaft and the rotating disk to rotate. Under the action of the flip baffle, the semiconductor silicon single crystal wafer is flipped 180 degrees when passing through the flip baffle and falls on the vibration plate or the ceramic disk body, which is convenient for polishing the semiconductor silicon single crystal wafer. By setting up a gluing device and a drying device, the surface of the semiconductor silicon single crystal wafer can be waxed and dried. After drying, it falls on the ceramic disk body and is adhered to the ceramic disk body.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows: the ceramic disc transfer device and the use method provided with the auxiliary loading assembly can not only utilize the transfer motor to drive the rotating disc and the transfer meshing block to rotate by setting the transfer mechanism, but also utilize the meshing action between the transfer meshing block and the transfer groove wheel to realize the rotation of the rotating sleeve and the transfer connecting rod. Since the slide groove provided inside the transfer groove wheel is arranged at 90 degrees, the rotating sleeve and the transfer connecting rod can be rotated 90 degrees each time, which is convenient for polishing semiconductor silicon single wafers. By arranging the auxiliary loading mechanism, not only can the feeding motor be utilized to realize the transportation of semiconductor silicon single wafers, but also the second electric telescopic rod is utilized to make the transported semiconductor silicon single wafers be in the middle part of the conveyor belt, and the second sprocket transmission assembly is utilized to drive the transmission shaft and the rotating disc to rotate, so that the semiconductor silicon single wafer is flipped 180 degrees when passing through the flip baffle and falls on the vibration plate or the ceramic disc body, which is convenient for polishing the semiconductor silicon single wafer. The specific contents are as follows:

[0030] 1. By setting up the transfer mechanism, not only can the transfer motor be used to drive the transfer disk and the transfer meshing block to rotate, but also the meshing action between the transfer meshing block and the transfer groove wheel can be used to realize the rotation of the rotating sleeve and the transfer connecting rod. Since the slide groove provided inside the transfer groove wheel is set at 90 degrees, the rotating sleeve and the transfer connecting rod can be rotated 90 degrees each time, which is convenient for polishing the semiconductor silicon single wafer. By setting up a limit motor to drive the limit main gear to rotate, the meshing action between the limit main gear and the limit slave gear is utilized, and under the limiting action of the spiral slide groove, the limit slider drives the limit sliding rod to slide inside the limit sleeve, and the limit sliding rod drives the limit support plate to expand or contract. Under the action of the clamping spring and the clamping plate, the semiconductor silicon single wafer on the ceramic disk body can be clamped and limited, so that the semiconductor silicon single wafer can be at the top center position of the ceramic disk body, which is convenient for polishing the ceramic disk body. When the semiconductor silicon single wafer is pasted to the vibrating plate, while the limiting sliding rod is extending and sliding, the vibration protrusion will continuously knock the limiting sleeve and the ceramic disk body. Under the action of the first vibration spring and the second vibration spring, the vibration plate will vibrate, so that the semiconductor silicon single wafer falling on the surface of the vibration plate can fall into the top of the ceramic disk body, and cooperate with the clamping plate to clamp and limit, so that the semiconductor silicon single wafer is at the top center position of the ceramic disk body, which is convenient for polishing the semiconductor silicon single wafer. By setting a rough polishing machine and a fine polishing machine, the semiconductor silicon single wafer can be rough polished and fine polished respectively, thereby improving the polishing effect of the semiconductor silicon single wafer. At the same time, the polished semiconductor silicon single wafer can be heated by a heating device to melt the wax on the surface of the semiconductor silicon single wafer, which is convenient for separating the semiconductor silicon single wafer from the ceramic disk body, and at the same time, the ceramic disk body can be transported uninterruptedly and the semiconductor silicon single wafer can be polished;

[0031] 2. By setting up an auxiliary feeding mechanism, not only can the feeding motor be used to drive the first sprocket transmission assembly and the conveying roller to rotate, but also the characteristics of the transmission connection between the conveying roller and the conveyor belt can be used to realize the transportation of the semiconductor silicon single wafer. The second electric telescopic rod is used to drive the limit baffle to move, and the distance between the limit baffles can be controlled so that the conveyed semiconductor silicon single wafer is in the middle of the conveyor belt. The second sprocket transmission assembly is used to drive the transmission shaft and the rotating disk to rotate. Under the action of the flip baffle, the semiconductor silicon single wafer is flipped 180 degrees when passing through the flip baffle and falls on the vibration plate or the ceramic disk body, which is convenient for polishing the semiconductor silicon single wafer. By setting up a glue coating device and a drying device, the surface of the semiconductor silicon single wafer can be waxed and dried. After drying, it falls on the ceramic disk body and is pasted to the ceramic disk body. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0033] Figure 2It is a schematic diagram of the three-dimensional structure of the transfer mechanism in the present invention;

[0034] Figure 3 It is a schematic diagram of the three-dimensional structure of the transport meshing block and the transport groove wheel in the present invention;

[0035] Figure 4 It is a schematic diagram of the three-dimensional structure of the limiting slave gear and the limiting sleeve in the present invention;

[0036] Figure 5 It is a schematic diagram of the three-dimensional structure of the limiting support plate and the vibration plate in the present invention;

[0037] Figure 6 It is a schematic diagram of the three-dimensional structure of the rotating top plate in the present invention;

[0038] Figure 7 It is a schematic diagram of the three-dimensional structure of the auxiliary feeding mechanism in the present invention;

[0039] Figure 8 It is a schematic diagram of the three-dimensional structure of the limit baffle in the present invention;

[0040] Fig. 9 It is a schematic diagram of the three-dimensional structure of the rotating disk and the flip baffle in the present invention.

[0041] In the figure: 1. transfer mechanism; 101. transfer base; 102. transfer support rod; 103. motor bracket; 104. transfer motor; 105. transfer turntable; 106. transfer limit block; 107. transfer meshing block; 108. transfer groove wheel; 109. rotating sleeve; 110. transfer connecting rod; 111. connecting column; 112. limit motor; 113. limit main gear; 114. limit slave gear; 115. spiral slide; 116. limit slider; 117. limit sliding rod; 118. vibration slide; 119. first vibration spring; 120. vibration convex block; 121. limit support plate; 122. clamping spring; 123. clamping plate; 1 24. Rotating support; 125. Vibrating plate; 126. Second vibration spring; 127. Rotating top plate; 128. First electric telescopic rod; 129. Rough polishing machine; 130. Fine polishing machine; 131. Heating equipment; 132. Limit sleeve; 133. Ceramic plate body; 2. Auxiliary feeding mechanism; 201. Feeding bracket; 202. Feeding motor; 203. First sprocket transmission assembly; 204. Conveying roller; 205. Conveying belt; 206. Second electric telescopic rod; 207. Limit baffle; 208. Second sprocket transmission assembly; 209. Transmission shaft; 210. Rotating disk; 211. Flip baffle; 212. Gluing equipment; 213. Drying equipment. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] See also Figure 1-Figure 9The present invention provides a technical solution: a ceramic plate transfer device with an auxiliary loading component and a use method, comprising a transfer mechanism 1, and a transfer motor 104 installed on one side of the bottom of the transfer mechanism 1, an auxiliary loading mechanism 2 is provided on one side of the transfer mechanism 1, and a loading motor 202 is provided on the front side of the auxiliary loading mechanism 2, the transfer mechanism 1 comprises a transfer base 101, a transfer support rod 102 is fixedly installed on the top of the transfer base 101, a motor bracket 103 is fixedly installed on one side of the bottom of the transfer support rod 102, wherein the transfer motor 104 is fixedly installed on the end of the motor bracket 103, the output end of the transfer motor 104 is fixedly connected to a transfer disk 105, and a transfer limit block 10 is fixedly installed on one side of the top of the transfer disk 105 6, wherein a transfer meshing block 107 is fixedly installed at the top center position of the rotating disk 105, one side of the transfer meshing block 107 is meshedly connected with a transfer groove wheel 108, a rotating sleeve 109 is fixedly installed on the top of the transfer groove wheel 108, the rotating sleeve 109 is rotatably connected with the transfer support rod 102, a transfer connecting rod 110 is fixedly installed around the outer side of the rotating sleeve 109, a connecting column 111 is fixedly installed at the end of the transfer connecting rod 110, a limiting sleeve 132 is fixedly installed on the top of the connecting column 111, a limiting motor 112 is fixedly installed on one side of the bottom of the limiting sleeve 132, the output end of the limiting motor 112 is fixedly connected with a limiting main gear 113, one side of the limiting main gear 113 is meshedly connected with a limiting slave gear 114, and the limiting The slave gear 114 is rotatably connected with the limit sleeve 132, and a plurality of spiral slide grooves 115 are provided inside the limit slave gear 114. The spiral slide groove 115 is internally slidably connected to a limit slider 116. A limit sliding rod 117 is fixedly installed on the top of the limit slider 116. A plurality of vibration slide grooves 118 are provided inside the limit sliding rod 117. By setting the transfer mechanism 1, not only can the transfer motor 104 be used to drive the transfer disk 105 and the transfer meshing block 107 to rotate, but also the meshing action between the transfer meshing block 107 and the transfer groove wheel 108 can be used to realize the rotation of the rotating sleeve 109 and the transfer connecting rod 110. Since the slide grooves provided inside the transfer groove wheel 108 are arranged at 90 degrees, the rotation of the rotating sleeve 109 and the transfer connecting rod 110 can be realized. 110 rotates ninety degrees each time, which is convenient for polishing the semiconductor silicon single crystal wafer. The limit motor 112 is set to drive the limit main gear 113 to rotate, and the meshing action between the limit main gear 113 and the limit slave gear 114 is utilized. Under the limiting action of the spiral slide groove 115, the limit slider 116 drives the limit sliding rod 117 to slide inside the limit sleeve 132, and the limit sliding rod 117 drives the limit support plate 121 to expand or contract. Under the action of the clamping spring 122 and the clamping plate 123, the semiconductor silicon single crystal wafer on the ceramic disk body 133 can be clamped and limited, so that the semiconductor silicon single crystal wafer can be at the top center position of the ceramic disk body 133, which is convenient for pasting the ceramic disk body 133 and the semiconductor silicon single crystal wafer.

[0044] A first vibration spring 119 is fixedly installed inside the vibration slide groove 118, and a vibration protrusion 120 is fixedly connected to the top of the first vibration spring 119. The vibration protrusion 120 is slidably connected to the limit sliding rod 117 through the vibration slide groove 118. A limit support plate 121 is fixedly installed on the end of the limit sliding rod 117. A clamping spring 122 is fixedly installed on the limit support plate 121 near the top of the limit sliding rod 117. A clamping plate 123 is fixedly connected to the end of the clamping spring 122. A rotating support 124 is fixedly installed on the top of the clamping plate 123. The top of the rotating support 124 rotates The transfer support rod 102 is connected to a vibration plate 125, a second vibration spring 126 is fixedly installed on one side of the bottom of the vibration plate 125, and the second vibration spring 126 is fixedly connected to the limiting support plate 121. The top of the limiting sleeve 132 is fixedly installed with a ceramic disc body 133. The top of the transfer support rod 102 is fixedly installed with a rotating top plate 127, and the bottom of the rotating top plate 127 is fixedly installed with a plurality of first electric telescopic rods 128. The bottom of the first electric telescopic rod 128 is respectively fixedly installed with a rough polisher 129, a fine polisher 130 and a heating device 131, and the fine polisher 130 and the heating device 131 The rough polisher 129 is symmetrically arranged on both sides of the bottom of the rotating top plate 127, and is arranged perpendicular to the middle part of the horizontal connection line between the fine polisher 130 and the heating device 131. When the limit sliding rod 117 is telescopically slidable, the vibration protrusion 120 will continuously knock the limit sleeve 132 and the ceramic disk body 133. Under the action of the first vibration spring 119 and the second vibration spring 126, the vibration plate 125 is vibrated, so that the semiconductor silicon single crystal wafer falling on the surface of the vibration plate 125 can fall into the top of the ceramic disk body 133, and cooperate with the clamping plate 123 to clamp and limit, so that the semiconductor silicon single crystal wafer can be vibrated. The conductor silicon single crystal wafer is located at the top center position of the ceramic disk body 133, which is convenient for polishing the semiconductor silicon single crystal wafer. By setting up a rough polisher 129 and a fine polisher 130, the semiconductor silicon single crystal wafer can be rough polished and fine polished respectively, thereby improving the polishing effect of the semiconductor silicon single crystal wafer. At the same time, the heating device 131 can be used to heat the polished semiconductor silicon single crystal wafer to melt the wax on the surface of the semiconductor silicon single crystal wafer, thereby facilitating the separation of the semiconductor silicon single crystal wafer from the ceramic disk body 133, and simultaneously performing uninterrupted transportation of the ceramic disk body 133 and polishing of the semiconductor silicon single crystal wafer.

[0045] The auxiliary feeding mechanism 2 includes a feeding bracket 201, a feeding motor 202 is fixedly installed on the front side of the feeding bracket 201, the output end of the feeding motor 202 is fixedly connected to a first sprocket transmission assembly 203, the inner side of the first sprocket transmission assembly 203 is fixedly connected to a plurality of conveying rollers 204, the outer side of the conveying rollers 204 is transmission-connected to a conveyor belt 205, and a second electric telescopic rod 206 is symmetrically installed on one side of the inner side of the feeding bracket 201, and the end of the second electric telescopic rod 206 is fixedly connected to a limit baffle 20 7, the limit baffle 207 is connected to the surface of the conveyor belt 205, one side of the first sprocket transmission assembly 203 is connected to the second sprocket transmission assembly 208, the inner side of the second sprocket transmission assembly 208 is fixedly connected to the transmission shaft 209, the two ends of the transmission shaft 209 are symmetrically installed with rotating disks 210, a plurality of flip baffles 211 are fixedly connected between the two rotating disks 210, a glue coating device 212 is fixedly installed on the top side of the feeding bracket 201, and the top of the feeding bracket 201 is close to the glue coating device 212. 2 is fixedly installed with a drying device 213. By setting up the auxiliary feeding mechanism 2, not only can the feeding motor 202 be used to drive the first sprocket transmission component 203 and the conveying roller 204 to rotate, but also the transmission connection between the conveying roller 204 and the conveying belt 205 can be used to realize the conveying of the semiconductor silicon single wafer. The second electric telescopic rod 206 is used to drive the limit baffle 207 to move, and the distance between the limit baffles 207 can be controlled so that the conveyed semiconductor silicon single wafer is in the middle of the conveying belt 205. The second sprocket transmission component 208 is used to drive the transmission shaft 209 and the rotating disk 210 to rotate. Under the action of the flip baffle 211, the semiconductor silicon single wafer is flipped 180 degrees when passing through the flip baffle 211 and falls on the vibration plate 125 or the ceramic disk body 133, which is convenient for polishing the semiconductor silicon single wafer. By setting up the glue coating device 212 and the drying device 213, the surface of the semiconductor silicon single wafer can be waxed and dried. After drying, it falls on the ceramic disk body 133 and the ceramic disk body 133 is pasted.

[0046] Working principle: Before using the ceramic plate transfer device with auxiliary feeding components and the method of use, it is necessary to first check the overall condition of the device to ensure that it can work normally. Figure 1 - Fig. 9As shown, first, the semiconductor silicon single wafer is placed on the conveyor belt 205, and the feeding motor 202 is started to drive the first sprocket transmission assembly 203 and the conveyor roller 204 to rotate. The transmission connection between the conveyor roller 204 and the conveyor belt 205 is used to realize the transportation of the semiconductor silicon single wafer. The surface of the semiconductor silicon single wafer can be waxed and dried by the gluing device 212 and the drying device 213. The second electric telescopic rod 206 is used to drive the limit baffle 207 to move, and the distance between the limit baffles 207 can be controlled so that the transported semiconductor silicon single wafer is in the middle of the conveyor belt 205. The second sprocket transmission assembly 208 is used to drive the transmission shaft 209 and the rotating disk 210 to rotate. Under the action of the flip baffle 211, the semiconductor silicon single wafer is flipped 180 degrees when passing through the flip baffle 211 and falls on the vibration plate 125 or the ceramic disk body 133, which is convenient for polishing the semiconductor silicon single wafer.

[0047] Secondly, the limit motor 112 is started to drive the limit main gear 113 to rotate, and the meshing action between the limit main gear 113 and the limit slave gear 114 is utilized, and under the limiting action of the spiral slide 115, the limit slider 116 drives the limit sliding rod 117 to slide inside the limit sleeve 132, and the limit sliding rod 117 drives the limit support plate 121 to expand or contract. Under the action of the clamping spring 122 and the clamping plate 123, the semiconductor silicon single crystal on the ceramic disk body 133 can be clamped and limited, so that the semiconductor silicon single crystal can be in the ceramic disk body. At the top center position of 133, while the limiting sliding rod 117 is telescopically sliding, the vibration protrusion 120 will continuously knock the limiting sleeve 132 and the ceramic disk body 133, and under the action of the first vibration spring 119 and the second vibration spring 126, the vibration plate 125 will vibrate, which can make the semiconductor silicon single crystal wafer falling on the surface of the vibration plate 125 fall into the top of the ceramic disk body 133, and cooperate with the clamping plate 123 to clamp and limit, so that the semiconductor silicon single crystal wafer is at the top center position of the ceramic disk body 133, which is convenient for polishing the semiconductor silicon single crystal wafer.

[0048] Finally, the transfer motor 104 is used to drive the transfer turntable 105 and the transfer engagement block 107 to rotate, and the meshing action between the transfer engagement block 107 and the transfer groove wheel 108 is used to realize the rotation of the rotating sleeve 109 and the transfer connecting rod 110. Since the slide groove opened inside the transfer groove wheel 108 is set at 90 degrees, the rotating sleeve 109 and the transfer connecting rod 110 can be rotated 90 degrees each time to move the semiconductor silicon single wafer to the bottom of the rough polishing machine 129, and the first electric telescopic rod 128 is used to drive the rough polishing machine 129 to descend and press down the semiconductor silicon single wafer, so that the semiconductor silicon single wafer and the rough polishing machine 129 are pressed down. The ceramic disk body 133 is pasted, and the rough polishing machine 129 is started to perform rough polishing of the semiconductor silicon single wafer. The fine polishing machine 130 can be used to perform fine polishing on the semiconductor silicon single wafer to improve the polishing effect of the semiconductor silicon single wafer. After polishing, the semiconductor silicon single wafer is moved to the bottom of the heating device 131. The heating device 131 can be used to heat the polished semiconductor silicon single wafer to melt the wax on the surface of the semiconductor silicon single wafer, which is convenient for separating the semiconductor silicon single wafer from the ceramic disk body 133. At the same time, the ceramic disk body 133 is continuously transported and the semiconductor silicon single wafer is polished.

[0049] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A ceramic plate transfer device provided with an auxiliary loading assembly, comprising a transfer mechanism (1), and a transfer motor (104) installed on one side of the bottom of the transfer mechanism (1); An auxiliary feeding mechanism (2) is provided on one side of the transfer mechanism (1), and a feeding motor (202) is provided on the front side of the auxiliary feeding mechanism (2); It is characterized in that Also includes: The transfer mechanism (1) comprises a transfer base (101), a transfer support rod (102) is fixedly mounted on the top of the transfer base (101), and a motor bracket (103) is fixedly mounted on one side of the bottom of the transfer support rod (102); The transfer motor (104) is fixedly mounted on the end of the motor bracket (103); the output end of the transfer motor (104) is fixedly connected to a transfer disk (105); and a transfer limit block (106) is fixedly mounted on one side of the top of the transfer disk (105); A transfer engagement block (107) is fixedly installed at the center of the top of the transfer disc (105); one side of the transfer engagement block (107) is meshedly connected with a transfer groove wheel (108); a rotating sleeve (109) is fixedly installed on the top of the transfer groove wheel (108); and the rotating sleeve (109) is rotatably connected to the transfer support rod (102); A transfer connecting rod (110) is fixedly mounted on the outer periphery of the rotating sleeve (109), a connecting column (111) is fixedly mounted on the end of the transfer connecting rod (110), a limit sleeve (132) is fixedly mounted on the top of the connecting column (111), a limit motor (112) is fixedly mounted on one side of the bottom of the limit sleeve (132), an output end of the limit motor (112) is fixedly connected to a limit main gear (113), and one side of the limit main gear (113) is meshingly connected to a limit slave gear (114); The limit slave gear (114) is rotatably connected to the limit sleeve (132); a plurality of spiral grooves (115) are provided inside the limit slave gear (114); a limit slider (116) is slidably connected inside the spiral groove (115); a limit sliding rod (117) is fixedly installed on the top of the limit slider (116); and a plurality of vibration sliding grooves (118) are provided inside the limit sliding rod (117); A first vibration spring (119) is fixedly installed inside the vibration slide groove (118); a vibration protrusion (120) is fixedly connected to the top of the first vibration spring (119); the vibration protrusion (120) is slidably connected to the limit sliding rod (117) through the vibration slide groove (118); a limit support plate (121) is fixedly installed at the end of the limit sliding rod (117); a clamping spring (122) is fixedly installed on the limit support plate (121) near the top of the limit sliding rod (117); The end of the clamping spring (122) is fixedly connected to a clamping plate (123), a rotating support (124) is fixedly mounted on the top of the clamping plate (123), a vibration plate (125) is rotatably connected to the top of the rotating support (124), a second vibration spring (126) is fixedly mounted on one side of the bottom of the vibration plate (125), the second vibration spring (126) is fixedly connected to the limiting support plate (121), and a ceramic disk body (133) is fixedly mounted on the top of the limiting sleeve (132); A rotating top plate (127) is fixedly mounted on the top of the transfer support rod (102); a plurality of first electric telescopic rods (128) are fixedly mounted on the bottom of the rotating top plate (127); a rough polisher (129), a fine polisher (130) and a heating device (131) are fixedly mounted on the bottom of the first electric telescopic rods (128); the fine polisher (130) and the heating device (131) are symmetrically arranged on both sides of the bottom of the rotating top plate (127); the rough polisher (129) is arranged perpendicular to the middle part of the horizontal connection line between the fine polisher (130) and the heating device (131).

2. A ceramic plate transfer device with an auxiliary loading assembly according to claim 1, characterized in that: The auxiliary feeding mechanism (2) comprises a feeding bracket (201), the feeding motor (202) is fixedly mounted on a front side of the feeding bracket (201), the output end of the feeding motor (202) is fixedly connected to a first sprocket transmission assembly (203), the inner side of the first sprocket transmission assembly (203) is fixedly connected to a plurality of conveying rollers (204), and the outer side of the conveying rollers (204) is drivingly connected to a conveyor belt (205).

3. A ceramic plate transfer device with an auxiliary loading assembly according to claim 2, characterized in that: A second electric telescopic rod (206) is symmetrically mounted on one side of the interior of the loading bracket (201); an end of the second electric telescopic rod (206) is fixedly connected to a limit baffle (207); the limit baffle (207) is fittedly connected to the surface of the conveyor belt (205); and one side of the first sprocket transmission assembly (203) is transmission-connected to a second sprocket transmission assembly (208).

4. The ceramic plate transfer device with an auxiliary loading assembly according to claim 3, characterized in that: A transmission shaft (209) is fixedly connected to one side of the interior of the second sprocket transmission assembly (208), rotating disks (210) are symmetrically mounted at both ends of the transmission shaft (209), a plurality of flip baffles (211) are fixedly connected between the two rotating disks (210), a gluing device (212) is fixedly mounted on one side of the top of the loading bracket (201), and a drying device (213) is fixedly mounted on one side of the top of the loading bracket (201) close to the gluing device (212).

5. A method for using a ceramic plate transfer device provided with an auxiliary loading component, using the ceramic plate transfer device provided with an auxiliary loading component as claimed in claim 4, and the manufacturing method steps are as follows: Step 1: placing a semiconductor silicon single crystal wafer on a conveyor belt (205), starting to use a feeding motor (202) to drive the first sprocket transmission assembly (203) and the conveyor roller (204) to rotate, using the transmission connection characteristics between the conveyor roller (204) and the conveyor belt (205) to realize the conveyance of the semiconductor silicon single crystal wafer, waxing and drying the surface of the semiconductor silicon single crystal wafer by means of a glue coating device (212) and a drying device (213), and using a second electric telescopic rod (206) to drive the limit baffle (20 7) movement, and the distance between the limit baffles (207) can be controlled so that the transported semiconductor silicon single crystal wafer is located in the middle of the conveyor belt (205), and the second sprocket transmission assembly (208) is used to drive the transmission shaft (209) and the rotating disk (210) to rotate, so that the semiconductor silicon single crystal wafer is turned 180 degrees when passing through the turning baffle (211) and falls on the vibration plate (125) or the ceramic disk body (133), so as to facilitate the polishing of the semiconductor silicon single crystal wafer; Step 2: Start the limit motor (112) to drive the limit main gear (113) to rotate, and utilize the meshing action between the limit main gear (113) and the limit slave gear (114), and under the limiting action of the spiral slide groove (115), the limit slider (116) drives the limit sliding rod (117) to slide inside the limit sleeve (132), and the limit sliding rod (117) drives the limit support plate (121) to expand or contract. Under the action of the clamping spring (122) and the clamping plate (123), the semiconductor silicon single crystal on the ceramic disk body (133) can be clamped and limited, so that the semiconductor silicon single crystal can be in the ceramic disk. At the top center position of the main body (133), while the limiting sliding rod (117) is telescopically sliding, the vibration protrusion (120) will continuously strike the limiting sleeve (132) and the ceramic disk main body (133), and under the action of the first vibration spring (119) and the second vibration spring (126), the vibration plate (125) will vibrate, so that the semiconductor silicon single crystal wafer falling on the surface of the vibration plate (125) can fall to the top of the ceramic disk main body (133), and cooperate with the clamping plate (123) to clamp and limit, so that the semiconductor silicon single crystal wafer is at the top center position of the ceramic disk main body (133), which is convenient for polishing the semiconductor silicon single crystal wafer; Step 3: Using the transfer motor (104) to drive the transfer turntable (105) and the transfer meshing block (107) to rotate, and using the meshing action between the transfer meshing block (107) and the transfer groove wheel (108) to realize the rotation of the rotating sleeve (109) and the transfer connecting rod (110). Since the slide groove provided inside the transfer groove wheel (108) is arranged at a 90-degree angle, the rotating sleeve (109) and the transfer connecting rod (110) can be rotated 90 degrees each time, and the semiconductor silicon single wafer is moved to the bottom of the rough polishing machine (129). The rough polishing machine (129) is driven to descend and press down the semiconductor silicon single wafer by the first electric telescopic rod (128), so that the semiconductor silicon single wafer is moved to the bottom of the rough polishing machine (129). The bulk silicon single crystal wafer is pasted to the ceramic disk body (133), and the rough polishing machine (129) is started to perform rough polishing of the semiconductor silicon single crystal wafer. The fine polishing machine (130) can be used to perform fine polishing of the semiconductor silicon single crystal wafer to improve the polishing effect of the semiconductor silicon single crystal wafer. After the polishing is completed, the semiconductor silicon single crystal wafer is moved to the bottom of the heating device (131). The heating device (131) can be used to heat the polished semiconductor silicon single crystal wafer to melt the wax on the surface of the semiconductor silicon single crystal wafer, thereby facilitating the separation of the semiconductor silicon single crystal wafer from the ceramic disk body (133), and simultaneously performing uninterrupted transportation of the ceramic disk body (133) and polishing of the semiconductor silicon single crystal wafer.

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