Polymer photosensitive material and preparation method thereof

Abstract

The invention discloses a high-molecular photosensitive material and a preparation method thereof, and relates to the field of photosensitive materials. Nano zinc boride modified organic silicon resin modified epoxy resin is used as modified resin, hydroxyl groups on the surface of the epoxy resin and borate groups form hydrogen bonds or are subjected to a condensation reaction, cohesion of the material is enhanced, crosslinking points of the epoxy resin are increased due to introduction of the organic silicon resin, a complex crosslinking net structure is formed, and the performance of the material is improved; boron is introduced to form a strong B-O bond, the stability of the resin is improved, zinc ions can promote formation of a carbon layer in the combustion process, the structure of an expanded carbon layer is improved, and the flame retardance of the material is improved. According to the invention, the alkenyl phosphite modified epoxy acrylic resin is used as a film-forming main material and has strong compatibility with the modified epoxy resin, and the synthesized material has stable performance; the introduction of the alkenyl phosphite group can reduce the viscosity of the resin, prevent UV yellowing and improve the photocuring rate. The light-sensitive material prepared by the invention is rapid in light curing and stable in chemical performance.

Description

Technical Field

[0001] The present invention relates to the field of photosensitive materials, and specifically to a polymer photosensitive material and a preparation method thereof. Background Art

[0002] Photosensitive materials are materials that can produce physical or chemical changes under light conditions. They can absorb light energy and convert it into chemical energy or electrical energy to achieve specific functions. Photosensitive materials have a variety of properties, such as light absorption, photoconductivity, photochromism, etc. These properties make photosensitive materials have broad application prospects in the fields of electronics, optics, biomedicine, and printing.

[0003] Photosensitive coatings, also known as photocurable coatings, are mainly composed of photosensitive resins, photosensitizers (photoinitiators) and diluents. They are coatings that use ultraviolet or visible light energy to initiate curing reactions. They are widely used in printing, electronics, plastic processing, medical devices and other fields. Common photosensitive coatings are inhibited by oxygen during the curing process, which may lead to poor surface curing, especially in free radical photocurable coatings. They have strict requirements on the construction environment, are sensitive to dust, and are not easy to operate irregular objects. Although they have a high hardness after molding, they are brittle and have poor chemical stability. They are not resistant to high temperatures and corrosion. Therefore, it is technically necessary to develop a polymer photosensitive material to solve the existing problems. Summary of the invention

[0004] The purpose of the present invention is to provide a polymer photosensitive material to solve the problems existing in the prior art.

[0005] To solve the above problems, the present invention provides the following technical solutions:

[0006] A method for preparing a polymer photosensitive material, characterized in that it comprises the following preparation steps:

[0007] (1) adding epoxy resin and acrylic monomer in a proportion into a container, heating to control the temperature, adding alkenyl phosphite, catalyst, and polymerization inhibitor with stirring, and obtaining alkenyl phosphite-modified acrylic epoxy resin after the reaction is complete;

[0008] (2) adding silane monomer and distilled water into a container, heating and stirring, then adding nano zinc boride, controlling the temperature, cooling after the reaction is complete, distilling, extracting, and obtaining nano zinc boride modified silicone resin;

[0009] (3) adding an organic solvent to a container to dissolve the nano-zinc boride modified silicone resin prepared in step (2); taking a beaker, adding epoxy resin, heating, and then pouring it into the container in which the nano-zinc boride modified silicone resin is dissolved, adjusting the temperature, and reacting completely to obtain the nano-zinc boride modified silicone resin modified epoxy resin;

[0010] (4) adding the alkenyl phosphite-modified acrylic epoxy resin obtained in step (1), the nano zinc boride-modified silicone resin-modified epoxy resin obtained in step (3), and a diluent into a container in parts by weight, then placing the container in an oven and heating it. After the reaction is completed, taking it out, adding a photoinitiator, stirring and dispersing, and vacuum drying it to obtain a photosensitive material;

[0011] The alkenyl phosphite in step (1) is prepared by the following steps:

[0012] (i) adding phenol to a reaction kettle under nitrogen, then adding an alkaline medium as an acid binding agent, and stirring uniformly;

[0013] (ii) controlling the temperature, slowly adding phosphorus trichloride to the reaction kettle, cooling to room temperature after the reaction is complete, filtering and distilling to obtain triphenyl phosphite;

[0014] (iii) adding triphenyl phosphite and an alcohol compound to a reaction kettle under nitrogen regulation, stirring evenly, adding a catalyst, heating, filtering and distilling after the reaction is complete to obtain an olefin phosphite;

[0015] The acid-binding agent in step (i) is a potassium carbonate solution with a mass concentration of 15% to 25%; and the catalyst in step (iii) is sodium methoxide.

[0016] Furthermore, in the step (1), the acrylic acid monomer is hydroxyethyl methacrylate, and the mass ratio of the two is 1:1 to 1.5; the catalyst in the step (1) is triethylamine, and the inhibitor is hydroquinone.

[0017] Furthermore, the silane monomer in step (2) is a mixture of methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, phenyltriethoxysilane and diphenyldimethoxysilane.

[0018] Furthermore, the organic solvent in step (3) is cyclohexanone.

[0019] Furthermore, the nano zinc boride is prepared by the following steps:

[0020] (i) preheating an ethanol solution, adding zinc acetate and zinc stearate, stirring and dissolving, and obtaining a solution;

[0021] (ii) adding boric acid to another portion of preheated ethanol solution, stirring to dissolve, and then slowly adding the solution obtained in step (i), controlling the temperature, and after the reaction is complete, centrifuging, precipitating, washing, drying, and grinding to obtain nano zinc boride;

[0022] The mass ratio of the zinc acetate, zinc stearate and ethanol solution is 30-40:1-3:80-100; the mass ratio of the boric acid and ethanol solution is 1-3:60-80.

[0023] Furthermore, the diluent in step (4) is an epoxy acrylate diluent; and the photoinitiator is a mixture of one or more of 4-methylbenzophenone, triphenylsulfonium hexafluoroantimonate, and 1-hydroxycyclohexyl phenyl ketone.

[0024] Furthermore, 50 to 60 parts of alkenyl phosphite-modified acrylic epoxy resin, 45 to 55 parts of epoxy acrylate diluent, 20 to 30 parts of nano zinc boride-modified silicone resin-modified epoxy resin, and 8 to 12 parts of photoinitiator.

[0025] Furthermore, a polymer photosensitive material is provided, characterized in that the material is prepared by the method.

[0026] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0027] The present invention uses epoxy acrylic resin modified by alkenyl phosphite groups as the main material for synthesizing photocurable coatings. The introduction of alkenyl phosphite groups can reduce the viscosity of the resin, improve its fluidity, and make it easier for photoinitiators and reactive diluents to disperse in the resin, thereby improving the photocuring efficiency. At the same time, the alkenyl phosphite groups have strong photosensitivity and accelerate the decomposition of photoinitiators and the formation of free radicals with acrylate. During the reaction, the alkenyl phosphite groups will undergo redox reactions with oxygen, thereby inhibiting UV yellowing of the system during the photocuring process. The alkenyl phosphite groups will undergo reduction reactions with peroxidized free radicals to obtain new free radicals, thereby preventing oxygen inhibition during the photocuring process and improving the photocuring performance of the coating.

[0028] The present invention uses nano zinc boride to modify the epoxy resin and the organosilicon resin. As the modified resin, the borate group decomposes at high temperature to form boron oxides, which can be used as a flame retardant. The nano zinc ions promote the formation of a carbon layer during combustion, improve the structure of the expanded carbon layer, and improve the flame retardancy of the material. The -Si-O-Si- structure bond energy of the organosilicon molecule is low, and the introduction of the boron element forms a strong BO bond in the main chain of the molecule, thereby improving the high temperature resistance and stability of the resin. The epoxy resin surface contains a large number of hydroxyl groups, which can form hydrogen bonds or condensation reactions with the borate group to enhance the cohesion of the material. The introduction of the organosilicon resin increases the crosslinking points of the epoxy resin, and the alkoxy and hydroxyl groups on the organosilicon intermediate react to form a more complex crosslinked network structure, thereby improving the mechanical properties. At the same time, the epoxy group in the epoxy resin acts quickly under a photoinitiator, and synergistically acts with the acrylic group in the modified epoxy acrylic resin to accelerate the formation of free radicals and improve the photocuring rate. In addition, the zinc boride groups and alkenyl phosphite groups in the nano-zinc boride modified silicone resin have high polarity, which helps the interaction between the two resins and improves the main performance of the material; the zinc boride groups and alkenyl phosphite groups react with the epoxy groups in the epoxy resin to form chemical bonds, thereby improving compatibility. Chemical bonding can enhance the adhesion between resins and improve the cohesion of the coating. DETAILED DESCRIPTION

[0029] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] In order to more clearly illustrate the method provided by the present invention, the following examples are used to describe in detail the various index testing methods of the polymer photosensitive materials prepared in the following examples are as follows:

[0031] Light curing time: Use a steel plate of 150mm×150mm×6mm and a paint film thickness of 6mm, apply the paint evenly, and measure the time it takes for the paint to change from liquid to solid under specific lighting conditions;

[0032] Fire resistance: Use a steel plate of 150mm×150mm×6mm and a paint film thickness of 6mm. Test according to GA / T714-2007 standard. The time when the back temperature of the steel plate reaches 450℃ is taken as the fire resistance limit.

[0033] Corrosion rate: Use a steel plate of 150mm×150mm×6mm, with a paint film thickness of 6mm, and use the GB / T19746-2005 method for testing, taking the average of three times;

[0034] Adhesion test: For the specific method of adhesion test, please refer to GBT9286-1998.

[0035] Example 1

[0036] (1) Add 80 parts of phenol to a reaction kettle under nitrogen, then add 20 parts of a 20% potassium carbonate solution, and stir evenly;

[0037] (2) keeping the temperature at 80° C. in a water bath, slowly dropwise add 70 parts of phosphorus trichloride into the reaction kettle, cool to room temperature after the reaction is complete, and filter and distill to obtain triphenyl phosphite;

[0038] (3) under nitrogen atmosphere, add 60 parts of triphenyl phosphite and 80 parts of anhydrous ethanol to the reaction kettle, stir evenly, add 2 parts of sodium methoxide, heat to 150° C., react for 6 hours, filter and distill to obtain alkenyl phosphite;

[0039] (4) Add 50 parts of epoxy resin and 60 parts of hydroxyethyl methacrylate into a container, add 25 parts of alkenyl phosphite, 2 parts of triethylamine and 2 parts of hydroquinone at 85° C., and react for 4 hours to obtain alkenyl phosphite-modified acrylic epoxy resin;

[0040] (5) preheating 90 parts of 95% ethanol solution to 85° C., adding 35 parts of zinc acetate and 2 parts of zinc stearate, stirring and dissolving to obtain a solution;

[0041] (6) dissolving 2 parts of boric acid in 70 parts of 95% ethanol solution, then slowly adding the solution obtained in step (5), controlling the temperature at 90° C. for 2 h, centrifuging, washing, drying, and grinding to obtain nano zinc boride;

[0042] (7) Add 30 parts of methyltrimethoxysilane, 25 parts of methyltriethoxysilane, 20 parts of dimethyldimethoxysilane and 30 parts of distilled water into a container, keep the water bath at a constant temperature of 70° C., then add 8 parts of nano zinc boride, cool after the reaction is complete, distill and extract to obtain nano zinc boride modified silicone resin;

[0043] (8) Add 50 parts of cyclohexanone to a container to dissolve 40 parts of the nano-zinc boride modified silicone resin prepared in step (7); take a beaker, add 45 parts of epoxy resin, heat at 100° C. to dissolve, then pour into the container in which the nano-zinc boride modified silicone resin is dissolved, adjust the temperature to 160° C., and react for 6 hours to obtain a nano-zinc boride modified silicone resin modified epoxy resin;

[0044] (9) Add 55 parts of the olefin phosphite-modified acrylic epoxy resin obtained in step (4), 25 parts of the nano zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 50 parts of epoxy acrylate diluent into a container in parts by weight, then place the container in an oven, heat to 50° C. for 1 h, take it out, add 4 parts of 4-methylbenzophenone, 1.5 parts of triphenylsulfonium hexafluoroantimonate, and 4 parts of 1-hydroxycyclohexyl phenyl ketone, stir and disperse, and dry in a vacuum at 90° C. to obtain a polymer photosensitive material.

[0045] Example 2

[0046] (1) Add 90 parts of phenol and 30 parts of 25% potassium carbonate solution into a reaction kettle under nitrogen and stir evenly;

[0047] (2) keeping the temperature at 85° C. in a water bath, slowly dropwise add 75 parts of phosphorus trichloride into the reaction kettle, cool to room temperature after the reaction is complete, and filter and distill to obtain triphenyl phosphite;

[0048] (3) Under a nitrogen atmosphere, 70 parts of triphenyl phosphite and 90 parts of anhydrous ethanol were added to a reaction kettle, stirred evenly, 3 parts of sodium methoxide were added, heated to 155° C., reacted for 8 hours, filtered and distilled to obtain alkenyl phosphite;

[0049] (4) Add 60 parts of epoxy resin and 70 parts of hydroxyethyl methacrylate into a container, add 35 parts of olefin phosphite, 3 parts of triethylamine and 3 parts of hydroquinone at 90° C., and react for 6 hours to obtain olefin phosphite-modified acrylic epoxy resin;

[0050] (5) preheating 100 parts of 95% ethanol solution to 90° C., adding 45 parts of zinc acetate and 3 parts of zinc stearate, stirring and dissolving to obtain a solution;

[0051] (6) dissolving 3 parts of boric acid in 75 parts of 95% ethanol solution, then slowly adding the solution obtained in step (5), controlling the temperature at 95° C. for 2.5 hours, centrifuging, washing, drying, and grinding to obtain nano zinc boride;

[0052] (7) Add 35 parts of methyltrimethoxysilane, 25 parts of methyltriethoxysilane, 25 parts of dimethyldimethoxysilane and 40 parts of distilled water into a container, keep the water bath at a constant temperature of 75° C., then add 10 parts of nano zinc boride, cool after the reaction is complete, distill and extract to obtain nano zinc boride modified silicone resin;

[0053] (8) Add 60 parts of cyclohexanone to a container to dissolve 50 parts of the nano-zinc boride modified silicone resin prepared in step (7); take a beaker, add 55 parts of epoxy resin, heat at 110° C. to dissolve, then pour into the container in which the nano-zinc boride modified silicone resin is dissolved, adjust the temperature to 165° C., and react for 8 hours to obtain a nano-zinc boride modified silicone resin modified epoxy resin;

[0054] (9) Add 60 parts of the alkenyl phosphite-modified acrylic epoxy resin obtained in step (4), 30 parts of the nano zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 55 parts of epoxy acrylate diluent into a container in parts by weight, then place the container in an oven, heat to 55° C. for 2 h, take it out, add 5 parts of 4-methylbenzophenone, 2 parts of triphenylsulfonium hexafluoroantimonate, and 5 parts of 1-hydroxycyclohexyl phenyl ketone, stir and disperse, and dry in a vacuum at 95° C. to obtain a polymer photosensitive material.

[0055] Example 3

[0056] (1) Add 70 parts of phenol to a reaction kettle under nitrogen, then add 15 parts of a 15% potassium carbonate solution, and stir evenly;

[0057] (2) keeping the temperature at 75° C. in a water bath, slowly dropwise add 60 parts of phosphorus trichloride into the reaction kettle, cool to room temperature after the reaction is complete, and filter and distill to obtain triphenyl phosphite;

[0058] (3) Under a nitrogen atmosphere, 50 parts of triphenyl phosphite and 70 parts of anhydrous ethanol were added to a reaction kettle, stirred evenly, 1 part of sodium methoxide was added, and the mixture was heated to 145° C. After reacting for 4 hours, the mixture was filtered and distilled to obtain an olefin phosphite;

[0059] (4) Add 40 parts of epoxy resin and 50 parts of hydroxyethyl methacrylate into a container, add 20 parts of alkenyl phosphite, 1 part of triethylamine and 1 part of hydroquinone at 75° C., stir and react for 2 hours to obtain alkenyl phosphite-modified acrylic epoxy resin;

[0060] (5) preheating 80 parts of 95% ethanol solution to 80° C., adding 25 parts of zinc acetate and 1 part of zinc stearate, stirring and dissolving to obtain a solution;

[0061] (6) dissolving 1 part of boric acid in 60 parts of 95% ethanol solution, then slowly adding the solution obtained in step (5), controlling the temperature at 90° C. for 2 h, centrifuging, washing, drying, and grinding to obtain nano zinc boride;

[0062] (7) Add 25 parts of methyltrimethoxysilane, 20 parts of methyltriethoxysilane, 15 parts of dimethyldimethoxysilane and 25 parts of distilled water into a container, keep the water bath at a constant temperature of 65° C., then add 6 parts of nano zinc boride, cool after the reaction is complete, distill and extract to obtain nano zinc boride modified silicone resin;

[0063] (8) Add 40 parts of cyclohexanone to a container to dissolve 30 parts of the nano-zinc boride modified silicone resin prepared in step (7); take a beaker, add 35 parts of epoxy resin, heat at 95° C. to dissolve, then pour into the container in which the nano-zinc boride modified silicone resin is dissolved, adjust the temperature to 155° C., and react for 4 hours to obtain a nano-zinc boride modified silicone resin modified epoxy resin;

[0064] (9) Add 50 parts of the alkenyl phosphite-modified acrylic epoxy resin obtained in step (4), 20 parts of the nano zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 45 parts of epoxy acrylate diluent into a container in parts by weight, then place the container in an oven, heat to 45° C. for 1 hour, take it out, add 3 parts of 4-methylbenzophenone, 1 part of triphenylsulfonium hexafluoroantimonate, and 3 parts of 1-hydroxycyclohexyl phenyl ketone, stir and disperse, and vacuum dry at 85° C. to obtain a polymer photosensitive material.

[0065] Comparative Example 1

[0066] The difference between Comparative Example 1 and Example 1 is that steps (1) to (4) are deleted, and step (9) is changed to: 55 parts of epoxy resin, 25 parts of nano-zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 50 parts of epoxy acrylate diluent are added in parts by weight, and then the container is placed in an oven, heated to 50° C. for 1 hour, taken out, 4 parts of 4-methylbenzophenone, 1.5 parts of triphenylsulfonium hexafluoroantimonate, and 4 parts of 1-hydroxycyclohexyl phenyl ketone are added, stirred and dispersed, and vacuum dried at 90° C. to obtain a polymer photosensitive material; the remaining steps are the same as those in Example 1.

[0067] Comparative Example 2

[0068] The difference between Comparative Example 2 and Example 1 is that steps (1) to (4) are deleted, and step (9) is changed to: 55 parts of commercially available bisphenol A epoxy acrylate, 25 parts of nano-zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 50 parts of epoxy acrylate diluent are added in parts by weight, and then the container is placed in an oven, heated to 50° C. for 1 hour, taken out, 4 parts of 4-methylbenzophenone, 1.5 parts of triphenylsulfonium hexafluoroantimonate, and 4 parts of 1-hydroxycyclohexyl phenyl ketone are added, stirred and dispersed, and vacuum dried at 90° C. to obtain a polymer photosensitive material; the remaining steps are the same as those of Example 1.

[0069] Comparative Example 3

[0070] The difference between Comparative Example 3 and Example 1 is that steps (1) to (3) are deleted, and step (4) is changed to adding 50 parts of epoxy resin and 60 parts of hydroxyethyl methacrylate into a container, adding 25 parts of phosphite, 2 parts of triethylamine and 2 parts of hydroquinone at 85°C with stirring, and reacting for 4 hours to obtain a phosphite-modified acrylic epoxy resin; step (9) is changed to adding 55 parts of the phosphite-modified acrylic epoxy resin obtained in step (4), 25 parts of the nano-zinc boride-modified silicone resin-modified epoxy resin obtained in step (8), and 50 parts of epoxy acrylate diluent in parts by weight, and then placing the container in an oven, heating to 50°C for 1 hour, taking it out, adding 4 parts of 4-methylbenzophenone, 1.5 parts of triphenylsulfonium hexafluoroantimonate, and 4 parts of 1-hydroxycyclohexyl phenyl ketone, stirring and dispersing, and vacuum drying at 90°C to obtain a polymer photosensitive material; the remaining steps are the same as those of Example 1.

[0071] Comparative Example 4

[0072] The difference between Comparative Example 4 and Example 1 is that steps (5) and (6) are deleted, and step (7) is changed to adding 30 parts of methyltrimethoxysilane, 25 parts of methyltriethoxysilane, 20 parts of dimethyldimethoxysilane and 30 parts of distilled water into a container, keeping the water bath at a constant temperature of 70°C, cooling after the reaction is complete, distilling and extracting to obtain a silicone resin; the remaining steps are the same as in Example 1.

[0073] Comparative Example 5

[0074] The difference between Comparative Example 5 and Example 1 is that steps (5) and (6) are deleted, and step (7) is changed to adding 30 parts of methyltrimethoxysilane, 25 parts of methyltriethoxysilane, 20 parts of dimethyldimethoxysilane and 30 parts of distilled water into a container, keeping the water bath at a constant temperature of 70° C., adding 8 parts of commercially available nano zinc oxide, cooling after the reaction is complete, distilling, and extracting to obtain a nano zinc oxide-modified silicone resin; the remaining steps are the same as those of Example 1.

[0075] Comparative Example 6

[0076] The difference between Comparative Example 6 and Example 1 is that steps (5) and (6) are deleted, and step (7) is changed to adding 30 parts of methyltrimethoxysilane, 25 parts of methyltriethoxysilane, 20 parts of dimethyldimethoxysilane and 30 parts of distilled water into a container, keeping the water bath temperature at 70°C, adding 4 parts of commercially available polyborosiloxane and 4 parts of polyborazane, cooling after the reaction is complete, distilling and extracting to obtain a boron nitrogen modified silicone resin; the remaining steps are the same as those of Example 1.

[0077] Table 1 below shows the performance analysis results of the polymer photosensitive materials of Examples 1 to 3 of the present invention and Comparative Examples 1 to 6.

[0078] Table 1

[0079]

[0080]

[0081] From the comparison of the experimental data of the embodiments and the comparative examples, it can be found that the present invention uses nano-zinc boride-modified silicone resin-modified epoxy resin as the modified resin, the hydroxyl groups on the surface of the epoxy resin form hydrogen bonds or condensation reactions with the borate groups to enhance the cohesion of the material, the introduction of the silicone resin increases the cross-linking points of the epoxy resin, forms a complex cross-linked network structure, and improves the material performance, the introduction of boron forms a stronger BO bond, and improves the stability of the resin, and the zinc ions promote the formation of a carbon layer during the combustion process, improve the structure of the expanded carbon layer, and improve the flame retardancy of the material. The present invention uses epoxy acrylic resin modified by alkenyl phosphite groups as the main material for synthesizing photocurable coatings. The introduction of alkenyl phosphite groups can reduce the viscosity of the resin, improve its fluidity, and make it easier for photoinitiators and reactive diluents to disperse in the resin, thereby improving the photocuring efficiency. At the same time, the alkenyl phosphite groups have strong photosensitivity and accelerate the decomposition of photoinitiators and the formation of free radicals with acrylate. During the reaction, the alkenyl phosphite groups will undergo redox reactions with oxygen, thereby inhibiting UV yellowing of the system during the photocuring process. The alkenyl phosphite groups will undergo reduction reactions with peroxidized free radicals to obtain new free radicals, thereby preventing oxygen inhibition during the photocuring process and improving the photocuring performance of the coating.

[0082] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention, and no mark in the claims should be regarded as limiting the claims involved.

Claims

1. A method for preparing a polymer photosensitive material, characterized in that: The method comprises the following preparation steps: (1) adding epoxy resin and acrylic monomer in a proportion into a container, heating to control the temperature, adding alkenyl phosphite, catalyst, and polymerization inhibitor with stirring, and obtaining alkenyl phosphite-modified acrylic epoxy resin after the reaction is complete; (2) adding silane monomer and distilled water into a container, heating and stirring, then adding nano zinc boride, controlling the temperature, cooling after the reaction is complete, distilling, extracting, and obtaining nano zinc boride modified silicone resin; (3) adding an organic solvent to a container to dissolve the nano-zinc boride modified silicone resin prepared in step (2); taking a beaker, adding epoxy resin, heating, and then pouring it into the container in which the nano-zinc boride modified silicone resin is dissolved, adjusting the temperature, and reacting completely to obtain the nano-zinc boride modified silicone resin modified epoxy resin; (4) adding the alkenyl phosphite-modified acrylic epoxy resin obtained in step (1), the nano zinc boride-modified silicone resin-modified epoxy resin obtained in step (3), and a diluent into a container in parts by weight, then placing the container in an oven and heating it. After the reaction is completed, taking it out, adding a photoinitiator, stirring and dispersing, and vacuum drying it to obtain a photosensitive material; The alkenyl phosphite in step (1) is prepared by the following steps: (i) adding phenol to a reaction kettle under nitrogen, then adding an alkaline medium as an acid binding agent, and stirring uniformly; (ii) controlling the temperature, slowly adding phosphorus trichloride to the reaction kettle, cooling to room temperature after the reaction is complete, filtering and distilling to obtain triphenyl phosphite; (iii) adding triphenyl phosphite and an alcohol compound to a reaction kettle under nitrogen regulation, stirring evenly, adding a catalyst, heating, filtering and distilling after the reaction is complete to obtain an olefin phosphite; The acid-binding agent in step (i) is a potassium carbonate solution with a mass concentration of 15% to 25%; and the catalyst in step (iii) is sodium methoxide.

2. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The acrylic acid monomer in step (1) is hydroxyethyl methacrylate, and the mass ratio of the two is 1:1-1.5; the catalyst in step (1) is triethylamine, and the inhibitor is hydroquinone.

3. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The silane monomer in step (2) is a mixture of methyltrimethoxysilane, methyltriethoxysilane, dimethyldimethoxysilane, phenyltriethoxysilane and diphenyldimethoxysilane.

4. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The organic solvent in step (3) is cyclohexanone.

5. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The nano zinc boride is prepared by the following steps: (i) preheating an ethanol solution, adding zinc acetate and zinc stearate, stirring and dissolving, and obtaining a solution; (ii) adding boric acid to another portion of preheated ethanol solution, stirring to dissolve, and then slowly adding the solution obtained in step (i), controlling the temperature, and after the reaction is complete, centrifuging, precipitating, washing, drying, and grinding to obtain nano zinc boride; The mass ratio of the zinc acetate, zinc stearate and ethanol solution is 30-40:1-3:80-100; the mass ratio of the boric acid and ethanol solution is 1-3:60-80.

6. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The diluent in step (4) is an epoxy acrylate diluent; the photoinitiator is a mixture of one or more of 4-methylbenzophenone, triphenylsulfonium hexafluoroantimonate, and 1-hydroxycyclohexyl phenyl ketone.

7. The method for preparing a polymer photosensitive material according to claim 1, characterized in that: The photosensitive material comprises, by components, 50-60 parts of olefin phosphite-modified acrylic epoxy resin, 45-55 parts of epoxy acrylate diluent, 20-30 parts of nano zinc boride-modified silicone resin-modified epoxy resin, and 8-12 parts of photoinitiator.

8. A polymer photosensitive material, characterized in that: The photosensitive material is prepared by the method according to any one of claims 1 to 7.

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