A thermoelectric refrigerator of a new heat dissipation mode

Abstract

The application discloses a thermoelectric refrigerator with a novel heat dissipation mode, which comprises a refrigeration sheet, a heat conduction layer body and a radiator. The refrigeration sheet comprises a cold end face and a hot end face. The hot end face of the refrigeration sheet is fixedly connected with the upper face of the heat conduction layer body. The lower face of the heat conduction layer body is fixedly connected with the radiator. The heat conduction layer body comprises a phase change material and a cavity for placing the phase change material. The phase change material is applied to the heat dissipation process of the thermoelectric refrigerator. The heat generated by the thermoelectric refrigerator is efficiently transferred through phase change heat absorption, so that the temperature control purpose of the thermoelectric refrigerator is achieved. Meanwhile, the volume ratio of solid and liquid phases of the phase change material is determined by collecting the volume of the phase change material in the heat conduction layer body, the temperature information of the phase change material is obtained, the working state of the thermoelectric refrigerator is controlled, the heat in the heat conduction layer body is effectively transferred to the environment, and the normal working of the thermoelectric refrigerator is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigeration technology, and in particular to a thermoelectric cooler with a novel heat dissipation method. Background Technology

[0002] Thermoelectric coolers can simultaneously achieve cooling and heating. They are characterized by not involving chemical reactions, having no moving parts, not using working fluids, not producing emissions that could lead to global warming, being easy to control, and being highly efficient and reliable. They have been applied in many fields. However, when they are working, the heat from the hot end needs to be released into the surrounding environment.

[0003] According to available data, the traditional method of heat dissipation for the hot surface of thermoelectric coolers is to use finned radiators to contact the hot surface of the thermoelectric cooler for heat dissipation. When the hot surface temperature of the thermoelectric cooler is high, it is difficult to ensure that the hot surface temperature is within the normal operating temperature range, which can easily lead to thermal failure of the thermoelectric cooler and damage it.

[0004] Chinese patent document CN110345663A discloses a "thermoelectric semiconductor cooler and thermoelectric cooler module". It includes a first substrate and a second substrate parallel to each other. The first substrate has a first plane facing the second substrate, and the second substrate has a second plane facing the first substrate. Multiple thermocouples are disposed between the first and second substrates, connecting the first and second planes to form a functional area with a current path. Non-functional areas are also formed on the first and / or second substrates. This technical solution has poor heat dissipation and is prone to thermal failure of the thermoelectric cooler. Summary of the Invention

[0005] This invention primarily addresses the technical problem of poor heat dissipation in existing solutions, which easily leads to thermal failure of thermoelectric coolers. It provides a novel thermoelectric cooler with a new heat dissipation method, applying phase change materials to the heat dissipation process of the thermoelectric cooler. Through phase change heat absorption, the heat generated by the thermoelectric cooler is efficiently transferred, thereby achieving the purpose of temperature control. At the same time, by collecting the volume of the phase change material inside the heat-conducting layer, the solid-liquid phase ratio of the phase change material is determined, and the temperature information of the phase change material is obtained to control the working state of the thermoelectric cooler, ensuring that the heat inside the heat-conducting layer is effectively transferred to the environment and maintaining the normal operation of the thermoelectric cooler.

[0006] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions: The present invention includes a cooling chip, the cooling chip includes a cold end face and a hot end face, the hot end face of the cooling chip is fixedly connected to the upper part of the heat-conducting layer, and the lower part of the heat-conducting layer is fixedly connected to a heat sink.

[0007] After the cooling chip starts working, its hot surface temperature rises to the phase change temperature of the phase change material (PCM). At this point, a phase change reaction occurs inside the heat-conducting layer containing the PCM, rapidly absorbing a large amount of heat from the hot surface and quickly controlling its temperature. To ensure the PCM-containing heat-conducting layer can continuously absorb heat from the hot surface, a reasonable solid-liquid phase ratio must be maintained. Therefore, a heat sink is installed below the PCM-containing heat-conducting layer to transfer the heat to the environment. This allows the PCM-containing heat-conducting layer to continuously absorb heat through phase change. While the PCM changes from a solid to a liquid phase, a phase change and heat release also occurs inside the heat-conducting layer, causing the PCM to change from a liquid to a solid phase.

[0008] Preferably, the cooling chip includes a first substrate and a second substrate, with a plurality of thermocouples disposed between the first substrate and the second substrate. The heat generated at the hot end face of the cooling chip is transferred to the phase change material in the heat-conducting layer. This prevents the thermoelectric cooler from failing due to thermal failure when the hot end face temperature is high, as this can be difficult to maintain within a normal operating temperature range. The hot end face of the cooling chip and the heat sink are respectively attached to the upper and lower surfaces of the heat-conducting layer, ensuring sufficient contact area between the upper and lower surfaces of the heat-conducting layer and the hot end face of the cooling chip and the heat sink. This effectively absorbs the heat generated at the hot end face of the cooling chip and promptly transfers the absorbed heat to the environment through the fins of the heat sink.

[0009] Preferably, the opposing surfaces of the first and second substrates are provided with guide plates, and the two ends of the thermocouple are respectively connected to the guide plates on the first and second substrates. The guide plates of the first substrate and the guide plates of the second substrate are staggered, and the thermocouple connects the guide plates of the first plane and the staggered guide plates of the second plane to form a functional area with a current path. Specifically, at least two thermocouples are connected to one guide plate of the first substrate, and each thermocouple is connected to one guide plate of the second substrate; at least two thermocouples are connected to one guide plate of the first substrate.

[0010] Preferably, the current-guiding plates on the first substrate and the second substrate are respectively connected to the input and output terminals of the power connection line. The first substrate and the second substrate are provided with an input power connection line and an output power connection line, which are respectively connected to the current-guiding plates on the first substrate and the second substrate. The input power connection line is used to introduce current, and the output power connection line is used to extract current.

[0011] Preferably, the heat-conducting layer includes a phase change material and a cavity for holding the phase change material. The cavity is made of a rigid material and abuts against the upper and lower surfaces of the heat-conducting layer. The phase change material in the heat-conducting layer absorbs the heat generated by the hot end face of the cooling element, preventing thermal failure of the thermoelectric cooler due to the difficulty in maintaining the hot end face temperature within a normal operating temperature range when the temperature is high. The rigidity of the cavity ensures that the phase change material does not deform and detach from the hot end face of the cooling element and the heat sink when absorbing heat, ensuring sufficient contact area between the cavity and the upper and lower surfaces of the heat-conducting layer to effectively absorb the heat generated by the hot end face of the cooling element and promptly transfer the absorbed heat to the environment through the fins of the heat sink. Preferably, the cavity is made of a material with good thermal conductivity to facilitate the absorption of heat generated by the hot end face of the cooling element by the phase change material within the cavity and the timely transfer of the absorbed heat to the environment through the fins of the heat sink. An elastic film is provided on the side of the cavity, and a pressure sensor is mounted on the elastic film. Solid-liquid phase change materials (SLCs) absorb and release energy through the interconversion between their solid and liquid states. During this solid-liquid phase transition, a change in volume typically occurs. Therefore, by collecting the volume information of the SLC, the solid-liquid ratio can be determined, and the continued operation of the thermoelectric cooler can be decided based on this ratio. An elastic membrane placed on the side of the cavity prevents damage to the cavity caused by the volume expansion of the SLC as it absorbs heat and liquefies. Insufficient contact area between the cavity and the upper and lower surfaces of the heat-conducting layer would prevent effective absorption of heat generated at the hot end of the cooling element and timely transfer of this heat to the environment via the fins of the radiator. Simultaneously, the volume expansion of the SLC as it absorbs heat and liquefies directly exerts pressure on the elastic membrane. A pressure sensor on the elastic membrane can then collect the volume change based on this pressure, thus obtaining the volume information of the SLC. This allows for the determination of the solid-liquid ratio, which in turn determines the continued operation of the thermoelectric cooler.

[0012] Preferably, the cavity is filled with phase change material. Filling the cavity with phase change material means that the volume of the cavity is the volume of the phase change material. When the solid-liquid phase change material absorbs heat and becomes liquid, its volume expansion directly exerts pressure on the elastic membrane. At this time, the pressure sensor installed on the elastic membrane can collect the volume of the expanded elastic membrane based on the pressure, thus obtaining the change in the volume of the solid-liquid phase change material. This allows the determination of the solid-liquid ratio of the phase change material, and then the decision on whether the thermoelectric cooler can continue to operate is based on the solid-liquid ratio.

[0013] Preferably, the phase change material within the cavity is a paraffin-based phase change material. Through research and analysis of the melting point, heat transfer characteristics, and phase change volume expansion rate of paraffin-based solid-liquid phase change materials, this invention selects a paraffin-based solid-liquid phase change heat transfer medium matrix material with a relatively high volume expansion rate. Paraffin-based phase change materials can largely meet the performance requirements of the heat transfer medium required by this invention. Phase change materials that meet the temperature requirements can be prepared by mixing different components. Furthermore, paraffin-based phase change materials have advantages such as a large volume expansion rate, no supercooling phenomenon, no corrosion, and stable chemical properties. However, a significant problem with paraffin-based phase change materials is their low thermal conductivity; therefore, it is necessary to further enhance their thermal conductivity.

[0014] Preferably, a compounding agent is added to the phase change material to shorten its melting time. The added compounding agent can significantly shorten the complete melting time of the binary solid-liquid phase change material. The compounding agent has good compatibility with hexadecane, and the compounded phase change material not only allows for adjustment of its phase change temperature but also reduces the complete melting time while having minimal impact on its phase change volume change rate. Furthermore, the process is simple.

[0015] Preferably, the thickness of the first substrate and the second substrate is 1.0 mm. Both the first substrate and the second substrate are made of ceramic, which has good electrical insulation and thermal conductivity. The current-conducting plate is made of metal and is used to conduct current.

[0016] The beneficial effects of this invention are: by applying phase change materials to the heat dissipation process of thermoelectric coolers, heat generated by the thermoelectric cooler can be efficiently transferred through phase change heat absorption, thereby achieving the purpose of temperature control of the thermoelectric cooler; at the same time, by collecting the volume of phase change materials inside the heat-conducting layer to determine the solid-liquid phase ratio of the phase change materials, the temperature information of the phase change materials can be obtained, the working state of the thermoelectric cooler can be controlled, and the heat inside the heat-conducting layer can be effectively transferred to the environment to maintain the normal operation of the thermoelectric cooler. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of one structure of the present invention.

[0018] Figure 2 This is a schematic diagram of a cooling chip structure according to the present invention.

[0019] Figure 3 This is a schematic diagram of a thermally conductive layer structure according to the present invention.

[0020] Figure 4 This is a schematic diagram of a heat sink structure according to the present invention.

[0021] In the figure, 1 is a cooling chip, 1.1 is a first substrate, 1.2 is a second substrate, 1.3 is a thermocouple, 1.4 is a power connection wire, 2 is a heat-conducting layer, and 3 is a heat sink. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only one preferred embodiment of the present invention and are only used to explain the present invention. They do not limit the scope of protection of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Traditional thermoelectric coolers typically use finned radiators to contact the hot surface of the thermoelectric cooler for heat dissipation. When the hot surface temperature of the thermoelectric cooler is high, it is difficult to ensure that the hot surface temperature is within the normal operating temperature range, which can easily lead to thermal failure of the thermoelectric cooler and damage it.

[0024] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0025] Example: A novel thermoelectric cooler with a novel heat dissipation method, such as... Figure 1 As shown, it includes a cooling chip 1, which has a cold end face and a hot end face. The hot end face of the cooling chip 1 is fixedly connected to the upper part of the heat-conducting layer 2, and the lower part of the heat-conducting layer 2 is fixedly connected to the heat sink 3.

[0026] After the cooling chip starts working, its hot surface temperature rises to the phase change temperature of the phase change material (PCM). At this point, a phase change reaction occurs inside the heat-conducting layer containing the PCM, rapidly absorbing a large amount of heat from the hot surface and quickly controlling its temperature. To ensure the PCM-containing heat-conducting layer can continuously absorb heat from the hot surface, a reasonable solid-liquid phase ratio must be maintained. Therefore, a heat sink is installed below the PCM-containing heat-conducting layer to transfer the heat to the environment. This allows the PCM-containing heat-conducting layer to continuously absorb heat through phase change. While the PCM changes from a solid to a liquid phase, a phase change and heat release also occurs inside the heat-conducting layer, causing the PCM to change from a liquid to a solid phase.

[0027] like Figure 2As shown, the cooling chip 1 includes a first substrate 1.1 and a second substrate 1.2, with several thermocouples 1.3 disposed between the first substrate 1.1 and the second substrate 1.2. The heat generated at the hot end face of the cooling chip 1 is transferred to the phase change material in the heat-conducting layer 2. This prevents the thermoelectric cooler from failing due to high temperatures, as it is difficult to maintain the hot end face temperature within a normal operating temperature range. The hot end face of the cooling chip 1 and the heat sink 3 are respectively attached to the upper and lower surfaces of the heat-conducting layer 2, ensuring sufficient contact area between the upper and lower surfaces of the heat-conducting layer 2 and the hot end face of the cooling chip 1 and the heat sink 3. This effectively absorbs the heat generated at the hot end face of the cooling chip 1 and promptly transfers the absorbed heat to the environment through the fins of the heat sink 3. Figure 4 As shown. The thickness of the first substrate 1.1 and the second substrate 1.2 is 1.0 mm. Both the first substrate 1.1 and the second substrate 1.2 are made of ceramic. Ceramic materials have good electrical insulation and thermal conductivity. The current-conducting plate is made of metal and is used to conduct current.

[0028] The first substrate 1.1 and the second substrate 1.2 have guide plates on their opposing surfaces. The thermocouple 1.3 has its two ends connected to the guide plates on the first substrate 1.1 and the second substrate 1.2, respectively. The guide plates on the first substrate 1.1 and the guide plates on the second substrate 1.2 are staggered and correspond to each other. The thermocouples connect the guide plates on the first plane and the staggered guide plates on the second plane to form a functional area with a current path. At least two thermocouples are connected to one guide plate on the first substrate 1.1, and each thermocouple is connected to one guide plate on the second substrate 1.2. At least two thermocouples are connected to one guide plate on the second substrate 1.2, and each thermocouple is connected to one guide plate on the first substrate 1.1.

[0029] The current-conducting plates on the first substrate 1.1 and the second substrate 1.2 are respectively connected to the input and output terminals of the power connection line 1.4. The first substrate and the second substrate are provided with an input power connection line 1.4 and an output power connection line 1.4, which are respectively connected to the current-conducting plates on the first substrate 1.1 and the second substrate 1.2. The input power connection line 1.4 is used to introduce current, and the output power connection line 1.4 is used to extract current.

[0030] like Figure 3As shown, the heat-conducting layer 2 includes a phase change material and a cavity for holding the phase change material. The cavity is made of a rigid material and abuts against the upper and lower surfaces of the heat-conducting layer 2. The phase change material in the heat-conducting layer 2 is used to absorb the heat generated by the hot end face of the cooling chip 1. This prevents the thermoelectric cooler from failing due to thermal failure when the hot end face temperature is high, as it is difficult to maintain the hot end face temperature within a normal operating temperature range. The rigidity of the cavity ensures that the phase change material does not deform and detach from the hot end face of the cooling chip 1 and the heat sink 3 when absorbing heat. It also ensures sufficient contact area between the cavity and the upper and lower surfaces of the heat-conducting layer 2 to effectively absorb the heat generated by the hot end face of the cooling chip 1, while simultaneously transferring the absorbed heat to the environment through the fins of the heat sink 3. The cavity is made of a material with good thermal conductivity to facilitate the absorption of heat generated by the hot end face of the cooling chip 1 by the phase change material within the cavity, and to promptly transfer the absorbed heat to the environment through the fins of the heat sink 3. An elastic film is provided on the side of the cavity, and a pressure sensor is mounted on the elastic film. Solid-liquid phase change materials (SLCs) absorb and release energy through the interconversion between their solid and liquid states. During this solid-liquid phase transition, a change in volume typically occurs. Therefore, by collecting volume information of the SLC, the solid-liquid ratio can be determined, and the continued operation of the thermoelectric cooler can be decided based on this ratio. An elastic membrane on the side of the cavity prevents damage to the cavity caused by the volume expansion of the SLC as it absorbs heat and liquefies. This prevents insufficient contact area between the cavity and the upper and lower surfaces of the heat-conducting layer 2, hindering the effective absorption of heat generated at the hot end of the cooling element 1 and its timely transfer to the environment via the fins of the radiator 3. Simultaneously, the volume expansion of the SLC as it absorbs heat and liquefies directly exerts pressure on the elastic membrane. A pressure sensor on the elastic membrane can then collect the volume expansion, thus obtaining the volume change information of the SLC. This allows for the determination of the solid-liquid ratio, which in turn determines whether the thermoelectric cooler can continue operating.

[0031] The cavity is filled with phase change material. This means the cavity's volume is equal to the volume of the phase change material. When the solid-liquid phase change material absorbs heat and becomes liquid, its volume expands, directly exerting pressure on the elastic membrane. A pressure sensor on the elastic membrane can then collect data on the expanded volume, thus obtaining information about the solid-liquid phase change material's volume change. This allows the determination of the solid-liquid ratio of the phase change material, and ultimately, the decision on whether the thermoelectric cooler can continue operating.

[0032] The phase change material within the cavity is a paraffin-based phase change material. Through research and analysis of the melting point, heat transfer characteristics, and phase change volume expansion rate of paraffin-based solid-liquid phase change materials, this invention selects a paraffin-based solid-liquid phase change heat transfer medium matrix material with a relatively high volume expansion rate. Paraffin-based phase change materials can largely meet the performance requirements of the heat transfer medium required by this invention. Phase change materials that meet the temperature requirements can be prepared by mixing different components. Furthermore, paraffin-based phase change materials have advantages such as a large volume expansion rate, no supercooling phenomenon, non-corrosiveness, and stable chemical properties. However, a significant problem with paraffin-based phase change materials is their low thermal conductivity; therefore, it is necessary to further enhance their thermal conductivity.

[0033] A compounding agent is added to the phase change material to shorten its melting time. This compounding agent significantly reduces the complete melting time of the binary solid-liquid phase change material. The compounding agent has good compatibility with hexadecane. The compounded phase change material not only allows for adjustment of its phase change temperature, but also reduces the complete melting time while having minimal impact on its phase change volume change rate. Furthermore, the process is simple.

[0034] The solid-liquid phase change material is composed of hexadecane with a compounding agent;

[0035] The compounding agent is any one of n-octane, n-nonane, n-heptane, p-xylene, and benzene; the phase change temperature of the solid-liquid phase change material is adjustable in the range of 12.4-15℃.

[0036] According to the above scheme, the compounding agent is n-octane; the mass fraction of n-octane is 8.6% at a phase change temperature of 12.4℃; the mass fraction of n-octane is 3.1% at a phase change temperature of 15℃; the phase change temperature of the solid-liquid phase change material between 12.4℃ and 15℃ shows a linear relationship with the mass fraction of n-octane. The compounding agent is n-octane, and the mass fraction of n-octane is 7.8% at a phase change temperature of 13℃.

[0037] According to the above scheme, the compounding agent is n-nonane; the mass fraction of n-nonane is 9.8% at a phase change temperature of 12.4℃; the mass fraction of n-nonane is 5.4% at a phase change temperature of 15℃; the phase change temperature of the solid-liquid phase change material between 12.4℃ and 15℃ shows a linear relationship with the mass fraction of n-nonane. The compounding agent is n-nonane; the mass fraction of n-nonane is 8.9% at a phase change temperature of 13℃.

[0038] According to the above scheme, the compounding agent is n-heptane; the mass fraction of n-heptane is 10.7% at a phase change temperature of 12.4℃ and 6.4% at a phase change temperature of 15℃; the phase change temperature of the solid-liquid phase change material shows a linear relationship with the mass fraction of n-heptane between 12.4℃ and 15℃. Alternatively, the compounding agent is n-heptane; the mass fraction of n-heptane is 9.8% at a phase change temperature of 13℃.

[0039] According to the above scheme, the compounding agent is p-xylene; the mass fraction of p-xylene is 10.4% at a phase change temperature of 12.4℃; the mass fraction of p-xylene is 4.7% at a phase change temperature of 15℃; the phase change temperature of the solid-liquid phase change material between 12.4℃ and 15℃ shows a linear relationship with the mass fraction of p-xylene. The compounding agent is p-xylene; the mass fraction of p-xylene is 9.2% at a phase change temperature of 13℃.

[0040] According to the above scheme, the compounding agent is benzene; the mass fraction of benzene is 9.6% at a phase change temperature of 12.4℃; the mass fraction of benzene is 5.1% at a phase change temperature of 15℃; the phase change temperature of the solid-liquid phase change material between 12.4℃ and 15℃ shows a linear relationship with the mass fraction of benzene. Alternatively, the compounding agent is benzene; the mass fraction of benzene is 8.5% at a phase change temperature of 13℃.

[0041] Solid-liquid phase change materials (SCTs) absorb and release energy through the interconversion between their solid and liquid states. During the solid-liquid phase transition, a change in volume typically occurs. If this volume change is converted into hydraulic energy, and then used to generate electricity via a micro-hydraulic motor, ocean thermal energy can ultimately be converted into usable electrical energy. Paraffin-based SCTs possess characteristics such as low phase transition temperature, wide adjustable range, high solid-liquid phase transition volume change rate, and relatively stable volume change rate under high pressure, making them well-suited for use in ocean profile observation platforms' thermal energy power supply systems.

[0042] By studying and analyzing the melting point, heat transfer characteristics, and phase change volume expansion rate of paraffin-based solid-liquid phase change materials, this invention selects hexadecane, which has a relatively high volume expansion rate, as the parent material for the heat transfer medium in solid-liquid phase change. Paraffin-based phase change materials can meet the performance requirements of heat transfer mediums over a wide range. This invention prepares phase change materials that meet the temperature requirements by adding compounding agents. Furthermore, paraffin-based phase change materials have advantages such as a large volume expansion rate, no supercooling phenomenon, non-corrosiveness, and stable chemical properties.

[0043] The heat transfer medium undergoes roughly three stages during the melting process:

[0044] In the first stage, before the melting process begins, the temperature difference between the internal and external environments is large, and heat is easily transferred from the environment to the heat transfer medium, so the temperature rises rapidly.

[0045] In the second stage, the phase change process, the heat transfer medium gradually melts from the outside to the inside, and the amount of liquid heat transfer medium gradually increases. At this time, the temperature of the heat transfer medium remains basically unchanged within a certain range, so the heating rate slows down.

[0046] In the third stage, the melting process ends. At this time, the temperature difference between the internal and external environments is large, the temperature rise rate of the heat transfer medium gradually increases, and the temperature eventually approaches the ambient temperature.

[0047] Similarly, the solidification process of composite phase change materials also roughly goes through three stages:

[0048] In the first stage, due to the large temperature difference between the inside and outside, natural convection plays a very strong role, resulting in a high heat flow rate, so that heat can be easily transferred from the heat transfer medium to the water in the constant temperature bath.

[0049] In the second stage, during the phase change process, the cooling rate slows down. This is because during the liquid-solid phase change process, as the amount of liquid phase change material decreases, the effect of natural convection gradually diminishes, the latent heat of phase change is gradually released, the solid-liquid interface gradually moves from the outside to the inside, the thermal resistance increases, and the heat conduction from the inside to the outside slows down.

[0050] In the third stage, in the later stage of the phase change process, the solid phase change material dominates in terms of heat conduction, and the cooling rate accelerates. Finally, the temperature of the phase change material tends to level off until it approaches the ambient temperature.

[0051] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0052] The compounding agent added in this invention can adjust the phase transition temperature of hexadecane, which can be arbitrarily adjusted between 13.4℃ and 17.4℃.

[0053] The compounding agent added in this invention can significantly shorten the complete melting time of binary solid-liquid phase change materials.

[0054] The phase change volume change rate of the compounded binary solid-liquid phase change material is not significantly different from that of hexadecane.

[0055] The present invention adds a compounding agent to hexadecane. The compounding agent has good compatibility with hexadecane. The compounded phase change material can not only adjust its phase change temperature, but also reduce the complete melting time of the phase change material after adding the compounding agent. At the same time, it has little effect on the phase change volume change rate, and the operation is simple.

[0056] Example

[0057] A heat-conducting layer 2 containing phase change material is attached to the hot side of the cooling chip; a heat sink is attached to the other side of the heat-conducting layer containing phase change material. The heat is primarily absorbed from the hot side of the cooling chip by the phase change heat-conducting layer 2. The heat sink is attached to the lower surface of the heat-conducting layer 2 to transfer heat from the heat-conducting layer, ensuring a reasonable solid-liquid phase ratio within the heat-conducting layer 2, allowing it to continuously absorb heat from the hot side of the cooling chip.

[0058] Beneficial effects: When the temperature of the hot surface of the cooling chip 2 reaches the phase change temperature of the phase change material, the phase change material inside the heat-conducting layer 2 containing the phase change material undergoes a phase change and absorbs heat from the hot surface of the cooling chip, thereby ensuring that the temperature of the hot surface of the cooling chip is always within a reasonable operating temperature range and improving the reliability of the cooling chip.

[0059] Phase change materials are combined with thermoelectric coolers; the heat absorption characteristics of phase change materials are used to dissipate heat from thermoelectric coolers; the solid-liquid phase ratio inside the heat-conducting layer of phase change materials is controlled by controlling the thickness of the phase change material, thereby ensuring the sustainable phase change heat dissipation of the phase change material.

[0060] During operation, all components are assembled. Figure 1 After the shape shown is applied and the cooling chip is powered on, after a period of time, the temperature of the hot surface of the cooling chip rises to the phase change temperature of the phase change material. At this time, a phase change reaction occurs inside the heat-conducting layer containing the phase change material, which absorbs a large amount of heat from the hot surface of the cooling chip quickly and rapidly controls the temperature of the hot surface of the cooling chip.

[0061] In order for the thermally conductive layer containing phase change material to continuously absorb heat from the hot surface of the cooling chip, a reasonable solid-liquid phase ratio must be maintained inside the thermally conductive layer containing phase change material. Therefore, a heat sink is installed below the thermally conductive layer containing phase change material to transfer the heat in the thermally conductive layer containing phase change material to the environment, so that the thermally conductive layer containing phase change material continuously absorbs heat through phase change. While the phase change material changes from solid to liquid, a phase change and heat release also occurs inside the thermally conductive layer containing phase change material, changing from liquid to solid.

[0062] Solid-liquid phase change materials (SLCs) absorb and release energy through the interconversion between their solid and liquid states. When a solid-liquid phase change occurs in a SLC, it is usually accompanied by a change in volume. Therefore, the solid-liquid ratio of a SLC can be effectively determined by collecting the volume information of the SLC, and then the thermoelectric cooler can be continued to operate based on the solid-liquid ratio of the SLC.

[0063] The elastic film set on the side of the cavity is used to prevent the solid-liquid phase change material from absorbing heat and becoming liquid, which would cause damage to the cavity due to volume expansion. As a result, the contact area between the cavity and the upper and lower surfaces of the heat-conducting layer 2 is insufficient, and the heat generated by the hot end face of the cooling chip 1 cannot be effectively absorbed and the absorbed heat can be transferred to the environment in a timely manner through the fins of the radiator 3.

[0064] Simultaneously, when the solid-liquid phase change material absorbs heat and turns into a liquid, its volume expansion directly exerts pressure on the elastic membrane. A pressure sensor installed on the elastic membrane can then collect data on the volume expansion, thus obtaining information about the volume change of the solid-liquid phase change material. This allows for the determination of the solid-liquid ratio of the material, which in turn determines whether the thermoelectric cooler can continue operating. To prevent the thermoelectric cooler from experiencing excessively high hot-side temperatures, it is crucial to ensure that the hot-side temperature remains within the normal operating range, as this can easily lead to thermal failure and damage to the thermoelectric cooler.

[0065] The specific embodiments described herein are merely illustrative examples illustrating the spirit of the invention. The above embodiments only express several implementation methods of the invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims. For those skilled in the art, multiple variations and improvements can be made without departing from the concept of the invention. Therefore, the scope of protection of this invention should be determined by the appended claims.

Claims

1. A novel thermoelectric cooler with a heat dissipation method, characterized in that, It includes a cooling chip (1), which includes a cold end face and a hot end face. The hot end face of the cooling chip (1) is fixedly connected to the upper part of the heat-conducting layer (2), and the lower part of the heat-conducting layer (2) is fixedly connected to the heat sink (3). The heat-conducting layer (2) includes a phase change material and a cavity for placing the phase change material. The cavity is made of rigid material and abuts against the upper and lower surfaces of the heat-conducting layer (2); The cavity is filled with phase change material; the phase change material in the cavity is a paraffin-based phase change material; a compounding agent that shortens the melting time of the phase change material is added to the phase change material; the compounding agent is any one of n-octane, n-nonane, n-heptane, p-xylene, and benzene.

2. The thermoelectric cooler with a novel heat dissipation method according to claim 1, characterized in that, The cooling chip (1) includes a first substrate (1.1) and a second substrate (1.2), and a plurality of thermocouples (1.3) are provided between the first substrate (1.1) and the second substrate (1.2).

3. The thermoelectric cooler with a novel heat dissipation method according to claim 2, characterized in that, The first substrate (1.1) and the second substrate (1.2) have flow guide plates on their opposing side surfaces, and the two ends of the thermocouple (1.3) are respectively connected to the flow guide plates on the first substrate (1.1) and the second substrate (1.2).

4. A thermoelectric cooler with a novel heat dissipation method according to claim 3, characterized in that, The current guide plates on the first substrate (1.1) and the second substrate (1.2) are respectively connected to the input end and the output end of the power connection line (1.4).

5. A thermoelectric cooler with a novel heat dissipation method according to claim 1, characterized in that, An elastic diaphragm is provided on the side of the cavity, and a pressure sensor is provided on the elastic diaphragm.

6. A thermoelectric cooler with a novel heat dissipation method according to claim 3, characterized in that, A flow guide plate of the first substrate (1.1) is connected to at least two thermocouples (1.3), each thermocouple (1.3) being connected to a flow guide plate of the second substrate (1.2); a flow guide plate of the second substrate (1.2) is connected to at least two thermocouples (1.3), each thermocouple (1.3) being connected to a flow guide plate of the first substrate (1.1).

7. A thermoelectric cooler with a novel heat dissipation method according to any one of claims 1 to 6, characterized in that, The phase change temperature of the phase change material can be adjusted within the range of 12.4-15℃.

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