Image processing method and related device

Abstract

The present application discloses an image processing method and related devices, which relate to the field of wafer cutting machines. After receiving a trigger on a first control, the motion control is controlled to move to the position represented by the first control, so that the motion control drives the image acquisition module to move to the position, and the image acquisition module is controlled to take real-time photos of the cutting object, and then the image taken by the image acquisition module is displayed. The process engineer can intuitively view the physical image of the specific cutting path coordinates corresponding to the first control in the preset display area in the display interface, so as to check whether the alignment coordinates are correct, without manually checking the size table of the cutting object and then comparing it with the coordinate data of the cutting path, which reduces the chance of misreading and shortens the inspection time.

Description

Technical Field

[0001] The present application relates to the field of wafer cutting machines, and more specifically, to an image processing method and related devices. Background Art

[0002] Wafer sawing machine is an indispensable key equipment in the semiconductor manufacturing process, which is mainly used to cut the whole wafer into individual chip dies. The main processes of wafer sawing machine are alignment and cutting. Among them, ensuring the accuracy of alignment and correct coordinates is the prerequisite for correct cutting.

[0003] To ensure the accuracy of alignment, the wafer cutting machine will display the coordinate data of the cutting path on the display interface. The process engineer will compare the dimension table of the workpiece with the coordinate data of the cutting path on the display interface, which is easy to make mistakes and takes a long time. Summary of the invention

[0004] In view of the above problems, the present application provides an image processing method and related devices. The specific scheme is as follows:

[0005] The first aspect of the present application provides an image processing method, comprising:

[0006] In response to receiving a trigger of a first control in a coordinate list in a display interface, controlling a motion control to move to a position indicated by the first control, the coordinate list further displays a plurality of second controls in addition to the first control, the first control and each of the second controls respectively indicating coordinate data of a cutting path of a current cutting surface of a cutting object, and the positions indicated by the first control and each of the second controls are different;

[0007] After the motion control drives the image acquisition module to move to the position indicated by the first control, the image acquisition module is controlled to shoot the cutting object to obtain the shot image;

[0008] If a trigger to a shooting parameter control is received during the shooting process, the shooting parameters of the image acquisition module are adjusted;

[0009] The image captured by the image acquisition module is displayed in a preset display area in the display interface.

[0010] In a possible implementation, after receiving a trigger on the first control, the image processing method further includes:

[0011] Determining whether there is a captured image corresponding to the position represented by the first control;

[0012] If there is a captured image corresponding to the position represented by the first control, the captured image corresponding to the position represented by the first control is displayed in the preset display area.

[0013] In a possible implementation, if the coordinate list displays multi-step cutting path data, for each step, the color of the first coordinate data of the step is different from the colors of other coordinate data of the step.

[0014] In a possible implementation, the coordinate list uses at least two background colors to alternately display coordinate data of multiple cutting paths of the current cutting surface of the cutting object.

[0015] In a possible implementation, when the image acquisition module is a high-power microscope camera and the upper left corner of the cut object is located at the center of the high-power microscope camera, the display interface is also used to display the coordinates of the upper left corner of the cut object.

[0016] In a possible implementation, if a trigger for a shooting parameter control is received during the shooting process, adjusting the shooting parameters of the image acquisition module includes:

[0017] In response to receiving a trigger on the brightness control, displaying an image brightness adjustment interface;

[0018] In response to receiving a trigger of at least one brightness adjustment control in the image brightness adjustment interface, the brightness parameters of the image acquisition module are adjusted accordingly. The image brightness adjustment interface includes at least one of a direct adjustment control, an oblique adjustment control, an automatic brightness control, and an initial brightness control.

[0019] In a possible implementation, if a trigger for a shooting parameter control is received during the shooting process, adjusting the shooting parameters of the image acquisition module includes:

[0020] In response to receiving a trigger of the focus control, displaying a focus adjustment interface;

[0021] In response to receiving a trigger of a focus adjustment control in the focus adjustment interface, the image acquisition module is automatically focused or manually focused, and the focus adjustment interface includes a plurality of focus adjustment controls, each of which has different focus parameters.

[0022] In a possible implementation, the image acquisition module includes a high-power microscope camera and a low-power microscope camera. After the image captured by the image acquisition module is displayed in a preset display area in the display interface, the image processing method further includes:

[0023] In response to receiving a trigger for a magnification change control, displaying a magnification change interface;

[0024] In response to receiving a trigger of a high-power microscope camera control in the magnification change interface, displaying an image captured by the high-power microscope camera in the preset display area;

[0025] or,

[0026] In response to receiving a trigger of a low-magnification microscope control in the magnification change interface, an image captured by the low-magnification microscope is displayed in the preset display area.

[0027] A second aspect of the present application provides an image processing device, comprising:

[0028] a motion control module, configured to control the motion control to move to a position indicated by a first control in a coordinate list in a display interface in response to a received trigger on the first control, wherein the coordinate list further displays a plurality of second controls in addition to the first control, wherein the first control and each of the second controls respectively indicate coordinate data of a cutting path of a current cutting surface of a cutting object, and the positions indicated by the first control and each of the second controls are different;

[0029] A shooting control module, configured to control the image acquisition module to shoot the cutting object to obtain the shot image after the motion control drives the image acquisition module to move to the position indicated by the first control;

[0030] A parameter adjustment module, used to adjust the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process;

[0031] The image display module is used to display the image captured by the image acquisition module in a preset display area in the display interface.

[0032] A third aspect of the present application provides a controller, which is arranged in a wafer cutting machine and includes at least one processor and a memory connected to the processor, wherein:

[0033] The memory is used to store computer programs;

[0034] The processor is used to execute the computer program so that the controller can implement the image processing method of the first aspect or any implementation manner of the first aspect.

[0035] A fourth aspect of the present application provides a wafer cutting machine, comprising: a controller, a motion control, an image acquisition module and a display;

[0036] The motion control is used to drive the image acquisition module to move under the control of the controller;

[0037] The image acquisition module is used to photograph the cutting object under the control of the controller;

[0038] The display is used to display the image captured by the image acquisition module in a preset display area in the display interface;

[0039] The controller is used to implement the image processing method of the first aspect or any implementation of the first aspect.

[0040] In a fifth aspect, the present application provides a computer program product, comprising computer-readable instructions. When the computer-readable instructions are executed on a controller, the controller implements the image processing method of the first aspect or any implementation of the first aspect.

[0041] In a sixth aspect, the present application provides a computer storage medium, which carries one or more computer programs. When the one or more computer programs are executed by a controller, the controller can implement the image processing method of the first aspect or any implementation method of the first aspect.

[0042] By means of the above-mentioned technical scheme, the image processing method and related devices provided by the present application, after receiving a trigger on the first control, control the motion control to move to the position represented by the first control, so that the motion control drives the image acquisition module to move to the position, controls the image acquisition module to shoot the cutting object in real time, and then displays the image shot by the image acquisition module. The process engineer can intuitively view the physical image of the specific cutting path coordinates corresponding to the first control in the preset display area in the display interface, so as to check whether the alignment coordinates are correct, without the need to manually check the size table of the cutting object and then compare it with the coordinate data of the cutting path, thereby reducing the chance of misreading and shortening the inspection time. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0044] Figure 1 A flowchart of an image processing method provided in an embodiment of the present application;

[0045] Figure 2 A schematic diagram of a display interface of a wafer cutting machine provided in an embodiment of the present application;

[0046] Figure 3 A schematic diagram of the distribution of single-step cutting lanes provided in an embodiment of the present application;

[0047] Figure 4 A schematic diagram of the distribution of multi-step cutting paths provided in an embodiment of the present application;

[0048] Figure 5 A schematic diagram of an image brightness adjustment interface provided in an embodiment of the present application;

[0049] Figure 6 A schematic diagram of a focus adjustment interface provided in an embodiment of the present application;

[0050] Figure 7 A schematic diagram of an image taken by a high-power microscope camera provided in an embodiment of the present application;

[0051] Figure 8 A schematic diagram of an image taken by a low-magnification microscope camera provided in an embodiment of the present application;

[0052] Fig. 9 A schematic diagram of the automatic cutting (2.4) screen provided in an embodiment of the present application;

[0053] Fig.10 A schematic diagram of the semi-automatic cutting (2.5) screen provided in an embodiment of the present application;

[0054] Fig.11 A schematic diagram of a fully automatic cutting state screen provided in an embodiment of the present application;

[0055] Fig.12 A schematic diagram of a pause screen provided in an embodiment of the present application;

[0056] Fig.13 A schematic diagram of the structure of an image processing device provided in an embodiment of the present application;

[0057] Fig.14 A schematic diagram of the structure of a controller provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] The following describes the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation method section of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0059] The embodiments of the present application are described below in conjunction with the accompanying drawings. Those skilled in the art will appreciate that, with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0060] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and need not be used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is only to describe the distinction mode adopted by the objects of the same attributes when describing in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0061] An embodiment of the present application provides an image processing method, which is applied to a controller in a wafer cutting machine. The image processing method of the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0062] Reference Figure 1 , Figure 1 A flowchart of an image processing method provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the image processing method provided in the embodiment of the present application may include steps 101 to 104, and these steps are described in detail below.

[0063] 101: In response to receiving a trigger on a first control in a coordinate list in a display interface, controlling a motion control to move to a position indicated by the first control;

[0064] The display screen of the wafer cutting machine can provide a screen of the alignment length measurement results, that is, a coordinate list in the display interface, which is used to display the physical coordinates of all cutting lanes of the current cutting surface. The physical coordinates of each cutting lane correspond to a control, and the control can indicate the position of the physical coordinates of the corresponding cutting lane. The first control can be any one of the above controls.

[0065] The coordinate list in the display interface also displays multiple second controls in addition to the first control. For the sake of convenience, the control triggered by the user is the first control, and the controls corresponding to other cutting paths in the coordinate list are second controls. The first control and each second control respectively represent the coordinate data of a cutting path on the current cutting surface of the cutting object, and the positions represented by the first control and each second control are different.

[0066] After a user, such as a process engineer, triggers the first control, the controller controls the motion control to move to the position indicated by the first control after receiving the trigger signal of the first control.

[0067] The way in which the user triggers the first control is related to the hardware and software structure of the wafer cutting machine. If the display screen of the wafer cutting machine is a touch screen and the software is touch control software, the user triggers the first control through touch operation. In other embodiments, the user can also trigger the first control through one or more ways of a physical keyboard, function key, trackball, mouse, joystick, etc.

[0068] 102: After the motion control drives the image acquisition module to move to the position indicated by the first control, the image acquisition module is controlled to shoot the cutting object to obtain the shot image;

[0069] The motion control can drive the image acquisition module to move, and control the motion control to move to the position represented by the first control, that is, the motion control can drive the image acquisition module to move to the position represented by the first control. After the image acquisition module moves to the position represented by the first control, the controller controls the image acquisition module to shoot the cutting object.

[0070] The image acquisition module includes at least one image acquisition device. In one possible implementation, the image acquisition module includes a low-magnification microscope camera; in another possible implementation, the image acquisition module includes a high-magnification microscope camera; in another possible implementation, the image acquisition module includes a low-magnification microscope camera and a high-magnification microscope camera.

[0071] 103: If a trigger for a shooting parameter control is received during the shooting process, adjusting the shooting parameters of the image acquisition module;

[0072] The shooting parameters of the image acquisition module include: brightness, focal length and other parameters.

[0073] By adjusting the shooting parameters of the image acquisition module, users' different shooting requirements for cutting objects can be met.

[0074] 104: Displaying the image captured by the image acquisition module in a preset display area in the display interface.

[0075] like Figure 2 The schematic diagram of the wafer cutting machine display interface is shown below. The various controls in the wafer cutting machine display interface are introduced below.

[0076] The control represented by serial number 3 is the workpiece number control. Each workpiece number corresponds to a cutting object. If there are multiple cutting objects, the workpiece number can be selected by triggering the control to select a specific cutting object.

[0077] The control represented by sequence number 4 is a channel control, that is, the current cutting surface of the cutting object corresponding to the workpiece number.

[0078] The control represented by number 6 is the current page number control of the cutting lane coordinate list, and the control represented by number 7 is the total page number control of the cutting lane coordinate list. Due to the limitation of the display interface of the wafer saw, if there are many cutting lanes, they need to be displayed in pages. Figure 2 Taking the cutting path of the cutting object shown as an example, the coordinate list of the cutting path includes 7 pages, and the 2nd page is currently displayed.

[0079] The control represented by serial number 8 is the previous page control. The user triggers the control to switch to the previous page of the current page. If there is no previous page, the coordinate list of the cutting path that triggers the control does not change.

[0080] The control represented by serial number 9 is the next page control. The user triggers the control to switch to the next page of the current page. If there is no next page, the coordinate list of the cutting path that triggers the control does not change.

[0081] The area corresponding to serial number 2 represents the coordinate list of the cutting path, and the coordinate list displays the cutting path serial number and actual alignment coordinates of the current cutting surface and the current page. In some embodiments, each cutting path corresponds to a control. For ease of representation, the control triggered by the user is the first control. After the user triggers the first control, the controller controls the motion control to drive the image acquisition module to move to the position represented by the first control. Among them, No represents the cutting path serial number, step represents the distance relative to the previous cutting path, and this distance is the relative position distance. Y represents the actual coordinate Y of the high-power microscope camera when the cutting path is located at the center of the high-power microscope camera.

[0082] The display area corresponding to sequence number 1 is used to display the above-mentioned image, which is a real-time picture taken by the image acquisition module.

[0083] The control corresponding to serial number 10 is the Ch1 control. When the user triggers the control, it switches to cutting surface 1. If there is no cutting surface 1, the user triggers the control without jumping. If the current cutting surface is cutting surface 1, the control does not display the text description Ch1 ( Figure 2 The current cutting plane is cutting plane 1).

[0084] The control corresponding to sequence number 11 is the Ch2 control. When the user triggers the control, the switch switches to cutting surface 2. If there is no cutting surface 2, the user triggers the control without jumping.

[0085] The control corresponding to sequence number 12 is the Ch3 control. When the user triggers the control, the switch switches to cutting surface 3. If there is no cutting surface 3, the user triggers the control without jumping.

[0086] The control corresponding to sequence number 13 is the Ch4 control. When the user triggers the control, the switch switches to cutting surface 4. If there is no cutting surface 4, the user triggers the control without jumping.

[0087] In some embodiments, the control corresponding to serial number 14 is a cutting path viewing control, which is triggered after the user selects a piece of data in the coordinate list, and the controller controls the motion control to drive the image acquisition module to move to the position represented by the selected data.

[0088] Figure 2 The controls represented by other serial numbers in the will be described in detail in the subsequent embodiments and will not be described in detail here.

[0089] It can be seen that the image processing method disclosed in this embodiment, after receiving the trigger of the first control, controls the motion control to move to the position represented by the first control, so that the motion control drives the image acquisition module to move to the position, controls the image acquisition module to shoot the cutting object in real time, and then displays the image taken by the image acquisition module. The process engineer can intuitively view the physical image of the specific cutting path coordinates corresponding to the first control in the preset display area in the display interface, so as to check whether the alignment coordinates are correct, without manually checking the size table of the cutting object and then comparing it with the coordinate data of the cutting path, which reduces the chance of misreading and shortens the inspection time.

[0090] In a possible implementation, after the above step 104, the captured image corresponding to the position represented by the first control is saved, for example, with the cutting path data corresponding to the first control as the key and the image as the value. After receiving the trigger of the first control, it is determined whether there is a captured image corresponding to the position represented by the first control. If there is a captured image corresponding to the position represented by the first control, the image is displayed in a preset display area to avoid the loss of the motion control and the image acquisition module caused by the user repeatedly controlling the motion control to drive the image acquisition module to move to the position represented by the first control when the user repeatedly triggers the first control, and to improve the display speed.

[0091] In practical applications, the wafer cutting machine may be single-step cutting or multi-step cutting. Figure 3 The distribution diagram of the single-step cutting lanes shown in the figure shows that the distribution of each cutting lane (cutting lane number 1-9) is the same. Figure 4 In the schematic diagram of the distribution of multi-step cutting paths shown in the figure, the distribution of cutting path numbers 1-4 is not exactly the same, and the distribution of cutting path numbers 5-8 is not exactly the same, but the distribution of cutting path numbers 1-4 and cutting path numbers 5-8 is the same, and the distribution is cyclic. If the coordinate list displays multi-step cutting path data, in order to distinguish different steps and facilitate users to quickly locate, in this embodiment, for each step, the color of the first coordinate data of the step is different from the color of the other coordinate data of the step, for example, the first coordinate data of the step is displayed in red, and the other coordinate data is displayed in black. Figure 4In the schematic diagram of the distribution of multi-step cutting paths shown, the coordinate data colors of the cutting path numbers 1 and 4 in the coordinate list are different from the coordinate data colors of the other numbers.

[0092] In addition, if there are too many coordinate data of the cutting paths in the coordinate list, it is easy for the human eye to misread them. In this embodiment, at least two background colors are used in the coordinate list to alternately display the coordinate data of multiple cutting paths of the current cutting surface of the cutting object. Taking the use of two background colors for alternate display as an example, the display effect is as follows: Figure 2 The schematic diagram of the wafer cutting machine display interface shown is convenient for users to distinguish the coordinate data of different cutting lanes according to the background color to prevent misalignment.

[0093] In a possible implementation, when the image acquisition module is a high-power microscope camera and the upper left corner of the cut object is located at the center of the high-power microscope camera, the display interface is also used to display the coordinates of the upper left corner of the cut object, such as Figure 2 In the schematic diagram of the wafer cutting machine display interface shown in the figure, serial number 5 represents the upper left corner control, which displays the upper left corner coordinates of the cutting object. By displaying the upper left corner coordinates of the cutting object, it is convenient for the user to confirm whether the Y in the coordinate list is correct and check whether the alignment coordinates are offset as a whole. In theory, the Y value of the upper left corner of the cutting object must be greater than the Y value of the cutting path, because the cutting path must be distributed below the upper left corner of the cutting object, and the cutting path cannot be distributed outside the cutting object.

[0094] In a possible implementation, the shooting parameters of the image acquisition module include a brightness parameter, and adjusting the shooting parameters of the image acquisition module specifically includes the following steps A1-A2:

[0095] A1: In response to receiving a trigger on the brightness control, displaying an image brightness adjustment interface;

[0096] Exemplarily, the brightness control is Figure 2 The control corresponding to serial number 15 shown in the figure is displayed after the user triggers the control. Figure 5 The image brightness adjustment interface schematic diagram shown in the figure shows that in the image brightness adjustment interface, the brightness of the image acquisition module (eg, the current microscope camera) can be adjusted by triggering at least one brightness adjustment control to make the image clearer.

[0097] A2: In response to receiving a trigger of at least one brightness adjustment control in the image brightness adjustment interface, adjusting the brightness parameters of the image acquisition module accordingly.

[0098] The image brightness adjustment interface includes at least one of a direct light adjustment control, an oblique light adjustment control, an automatic light control, and an initial light control. The user can trigger at least one of the above light adjustment controls to adjust the light parameters of the image acquisition module. Among them, the user can adjust the direct light brightness of the image acquisition module by triggering the direct light adjustment control, the user can adjust the oblique light brightness of the image acquisition module by triggering the oblique light adjustment control, the user can automatically adjust the direct light brightness and oblique light brightness of the image acquisition module to the default value by triggering the automatic light control, and the user can adjust the direct light brightness and oblique light brightness of the image acquisition module to the initial value by triggering the initial light control.

[0099] In some embodiments, there are multiple direct adjustment controls and multiple oblique adjustment controls, each of which corresponds to a different direct adjustment amount, and each of which corresponds to a different oblique adjustment amount. Figure 5 As shown, the adjustment range of direct light and oblique light is 0-255. The purpose of setting multiple adjustment controls in this embodiment is to adjust to the appropriate brightness more quickly. For example, if the direct light target value is 186 and the current direct light brightness is 0, then the direct light adjustment control of +50 is triggered 4 times, the direct light adjustment control of -5 is triggered 3 times, and the direct light adjustment control of +1 is triggered once. A total of 8 times of triggering the direct light adjustment control can adjust to the target value. If there is only a +1 direct light adjustment control, the direct light adjustment control needs to be triggered 186 times, affecting the user experience.

[0100] In addition, if Figure 5 As shown, the image brightness adjustment interface may also include a default value for direct brightness and a default value for oblique brightness, a current direct brightness, and a current oblique brightness, so that users can view the adjusted current direct brightness and current oblique brightness in real time.

[0101] It should be noted that, when the user does not trigger the brightness adjustment control, the image acquisition module shoots the cutting object according to the pre-configured default values ​​of direct light brightness and oblique light brightness.

[0102] In a possible implementation, the shooting parameters of the image acquisition module include focal length, and adjusting the shooting parameters of the image acquisition module specifically includes the following steps B1-B2:

[0103] B1: In response to receiving a trigger of a focus control, displaying a focus adjustment interface;

[0104] Exemplarily, the focus control is Figure 2 The control corresponding to serial number 16 shown in the figure is displayed after the user triggers the control. Figure 6 The focus adjustment interface shown in the figure, in the focus adjustment interface, the focus of the microscope camera can be adjusted by triggering the focus adjustment control to make the image clearer.

[0105] B2: in response to receiving a trigger of a focus adjustment control in the focus adjustment interface, automatically focusing or manually focusing the image acquisition module.

[0106] The focus adjustment interface includes a plurality of focus adjustment controls, and each focus adjustment control has different focus parameters.

[0107] For example, Figure 6 In the focus adjustment interface shown, F8 is an autofocus control. After F8 is triggered, autofocus is implemented; the focus adjustment control corresponding to F3 is centered on the position of [film thickness + cutting object thickness] set in the current cutting parameters at a height from the workbench, and autofocus is implemented; F4 is a large-stroke autofocus control. After F4 is triggered, large-range (about 4mm wide) autofocus is implemented; F9 is a small-stroke autofocus control. After F9 is triggered, small-range (about 0.4mm wide) autofocus is implemented; the focus adjustment control corresponding to F5 returns the microscope to the initial origin position and implements autofocus. Other focus adjustment controls are manual focus controls: F2 is an ascending focus control. After F2 is triggered, the microscope is ascended through a scanning action; F7 is a descending focus control. After F7 is triggered, the microscope is descended through a scanning action.

[0108] In some embodiments, the focus adjustment interface may further include a brightness control, and the user triggers the brightness control to display the image brightness adjustment interface.

[0109] In some embodiments, the image acquisition module includes a high-magnification microscope camera and a low-magnification microscope camera. After step 104 in the above embodiment, the following steps C1-C3 are also included:

[0110] C1: In response to the received triggering of the magnification change control, display the magnification change interface;

[0111] Exemplarily, the magnification change control is Figure 2 The control corresponding to the serial number 17 shown is displayed when the user triggers the control. The magnification change interface is displayed.

[0112] C2: in response to receiving a trigger of a high-power microscope camera control in the magnification change interface, displaying an image captured by the high-power microscope camera in the preset display area;

[0113] or,

[0114] C3: In response to receiving a trigger of a low-magnification microscope control in the magnification change interface, displaying the image captured by the low-magnification microscope in the preset display area.

[0115] Specifically, Figure 7 This is an image taken by a high-magnification microscope camera. Figure 8The images are taken by a microscope camera at a low magnification at the same position. This embodiment provides a magnification change function to meet the user's need to view images taken by microscope cameras with different magnifications.

[0116] Furthermore, the controller can also determine whether the cutting process is in progress. If not, the controller can control the light to be turned on, the image acquisition module cover to be opened, the image acquisition module blowing function to be started, and the alignment length measurement result, the first cutting object, the first cutting surface, and the first page of data to be displayed. The image acquisition module cover can prevent water from entering the lens, and the image acquisition module blowing function can blow away water droplets on the cutting object to make the captured image clearer.

[0117] If the cutting is in progress, the automatic cutting screen may be displayed in response to the triggering of the automatic cutting control. For example, the automatic cutting (2.4) screen may be as follows: Fig. 9 shown.

[0118] In response to receiving a trigger for the semi-automatic cutting control, a semi-automatic cutting screen is displayed. For example, the semi-automatic cutting (2.5) screen is as follows: Fig.10 shown.

[0119] In response to the received triggering of the full-automatic cutting control, the full-automatic cutting state screen is displayed. For example, the full-automatic cutting state screen is as follows: Fig.11 shown.

[0120] In response to the received triggering of the pause control, a pause screen is displayed. For example, the pause screen is as follows: Fig.12 shown.

[0121] Among them, the alignment and length measurement result control is included in these 4 screens. In response to the trigger of the alignment and length measurement result control, the alignment and length measurement result screen is displayed. When the alignment and length measurement result screen is called up from the cutting status screen, the following buttons will be hidden: view cutting path, light intensity, focus, and magnification change. The light source, microscope camera cover, and camera air blowing function will not be enabled. Because cutting is in progress at this time, the axis cannot be moved and the cutting path cannot be viewed.

[0122] An image processing method provided by an embodiment of the present application is introduced above, and a device for executing the above image processing method will be introduced below.

[0123] See also Fig.13 , Fig.13 Schematic diagram of the structure of an image processing device provided in an embodiment of the present application. Fig.13 As shown, the image processing device comprises:

[0124] A motion control module 131 is used to control the motion control to move to the position indicated by the first control in the coordinate list in the display interface in response to the trigger received, wherein the coordinate list further displays a plurality of second controls in addition to the first control, wherein the first control and each of the second controls respectively indicate the coordinate data of a cutting path of the current cutting surface of the cutting object, and the positions indicated by the first control and each of the second controls are different;

[0125] A shooting control module 132, configured to control the image acquisition module to shoot the cutting object to obtain the shot image after the motion control drives the image acquisition module to move to the position indicated by the first control;

[0126] The parameter adjustment module 133 is used to adjust the shooting parameters of the image acquisition module if a trigger of the shooting parameter control is received during the shooting process;

[0127] The image display module 134 is used to display the image captured by the image acquisition module in a preset display area in the display interface.

[0128] In a possible implementation, the image processing apparatus further includes:

[0129] A judgment module is used to judge whether there is a captured image corresponding to the position represented by the first control; if there is a captured image corresponding to the position represented by the first control, the captured image corresponding to the position represented by the first control is displayed in the preset display area.

[0130] In a possible implementation, if the coordinate list displays multi-step cutting path data, for each step, the color of the first coordinate data of the step is different from the colors of other coordinate data of the step.

[0131] In a possible implementation, the coordinate list uses at least two background colors to alternately display coordinate data of multiple cutting paths of the current cutting surface of the cutting object.

[0132] In a possible implementation, when the image acquisition module is a high-power microscope camera and the upper left corner of the cut object is located at the center of the high-power microscope camera, the display interface is also used to display the coordinates of the upper left corner of the cut object.

[0133] In a possible implementation, the parameter adjustment module 133 includes:

[0134] A brightness adjustment submodule is used to display an image brightness adjustment interface in response to receiving a trigger for a brightness control; in response to receiving a trigger for at least one brightness adjustment control in the image brightness adjustment interface, adjust the brightness parameters of the image acquisition module accordingly, and the image brightness adjustment interface includes at least one of a direct adjustment control, an oblique adjustment control, an automatic brightness control, and an initial brightness control.

[0135] In a possible implementation, the parameter adjustment module 133 includes:

[0136] A focus adjustment submodule is used to display a focus adjustment interface in response to receiving a trigger of a focus control; in response to receiving a trigger of a focus adjustment control in the focus adjustment interface, automatically focus or manually focus the image acquisition module, wherein the focus adjustment interface includes a plurality of focus adjustment controls, and each focus adjustment control has different focus parameters.

[0137] In a possible implementation, the image acquisition module includes a high-magnification microscope camera and a low-magnification microscope camera, and the image processing device further includes:

[0138] A magnification change module is used to display a magnification change interface in response to a received trigger of a magnification change control; to display an image taken by the high-magnification microscope camera in the preset display area in response to a received trigger of a high-magnification microscope camera control in the magnification change interface; or to display an image taken by the low-magnification microscope camera in the preset display area in response to a received trigger of a low-magnification microscope camera control in the magnification change interface.

[0139] An image processing device disclosed in the present embodiment relates to the field of wafer cutting machines. After receiving a trigger on a first control, the motion control is controlled to move to the position represented by the first control, so that the motion control drives the image acquisition module to move to the position, and the image acquisition module is controlled to take real-time photos of the cutting object, and then the image taken by the image acquisition module is displayed. The process engineer can intuitively view the physical image of the specific cutting path coordinates corresponding to the first control in the preset display area in the display interface, so as to check whether the alignment coordinates are correct, without manually checking the size table of the cutting object and then comparing it with the coordinate data of the cutting path, thereby reducing the chance of misreading and shortening the inspection time.

[0140] Fig.14 A schematic diagram of the structure of a controller is provided, such as Fig.14 As shown, the controller includes a bus 141, a processor 142, a communication interface 143 and a memory 144. The processor 142, the memory 144 and the communication interface 143 communicate with each other via the bus 141.

[0141] The bus 141 may be a peripheral component interconnect (PCI) bus or an extended industry standard architecture (EISA) bus. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Fig.14 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0142] The processor 142 may be any one or more of a central processing unit (CPU), a graphics processing unit (GPU), a microprocessor (MP), or a digital signal processor (DSP).

[0143] The memory 144 may include a volatile memory, such as a random access memory (RAM). The memory 144 may also include a non-volatile memory, such as a read-only memory (ROM), a flash memory, a hard disk drive (HDD), or a solid state drive (SSD).

[0144] The memory 144 may be used to store software codes related to the image processing method, and the processor 142 may execute the steps of the image processing method and may also schedule other units to implement corresponding functions.

[0145] The embodiment of the present application also provides a wafer cutting machine, including: a controller, a motion control, an image acquisition module and a display;

[0146] The motion control is used to drive the image acquisition module to move under the control of the controller;

[0147] The image acquisition module is used to photograph the cutting object under the control of the controller;

[0148] The display is used to display the image captured by the image acquisition module in a preset display area in the display interface;

[0149] The controller is used to implement any image processing method provided in the embodiments of the present application.

[0150] An embodiment of the present application also provides a computer program product including computer-readable instructions. When the computer-readable instructions are executed on a controller, the controller implements any image processing method provided in the embodiment of the present application.

[0151] A computer-readable storage medium is also provided in an embodiment of the present application. The storage medium carries one or more computer programs. When the one or more computer programs are executed by a controller, the controller can implement any image processing method provided in the embodiment of the present application.

[0152] It should also be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed over multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the drawings of the device embodiments provided by the present application, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines.

[0153] Through the description of the above implementation mode, the technicians in the field can clearly understand that the present application can be implemented by means of software plus necessary general hardware, and of course, it can also be implemented by special hardware including special integrated circuits, special CPUs, special memories, special components, etc. In general, all functions completed by computer programs can be easily implemented by corresponding hardware, and the specific hardware structure used to implement the same function can also be various, such as analog circuits, digital circuits or special circuits. However, for the present application, software program implementation is a better implementation mode in more cases. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a readable storage medium, such as a computer floppy disk, a U disk, a mobile hard disk, a ROM, a RAM, a disk or an optical disk, etc., including a number of instructions to enable a computer device (which can be a personal computer, a training device, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0154] In the above embodiments, all or part of the embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the embodiments may be implemented in the form of a computer program product.

[0155] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website site, a computer, a training device, or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, training device, or data center. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a training device, a data center, etc. that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive (SSD)), etc.

Claims

1. An image processing method, characterized in that: A controller used in a wafer cutting machine, wherein the image processing method comprises: In response to receiving a trigger of a first control in a coordinate list in a display interface, controlling a motion control to move to a position indicated by the first control, the coordinate list further displays a plurality of second controls in addition to the first control, the first control and each of the second controls respectively indicating coordinate data of a cutting path of a current cutting surface of a cutting object, and the positions indicated by the first control and each of the second controls are different; After the motion control drives the image acquisition module to move to the position indicated by the first control, the image acquisition module is controlled to shoot the cutting object to obtain the shot image; If a trigger to a shooting parameter control is received during the shooting process, the shooting parameters of the image acquisition module are adjusted; The image captured by the image acquisition module is displayed in a preset display area in the display interface.

2. The image processing method according to claim 1, characterized in that: After receiving a trigger on the first control, the image processing method further includes: Determining whether there is a captured image corresponding to the position represented by the first control; If there is a captured image corresponding to the position represented by the first control, the captured image corresponding to the position represented by the first control is displayed in the preset display area.

3. The image processing method according to claim 1, characterized in that: If the coordinate list displays multi-step cutting lane data, for each step, the color of the first coordinate data of the step is different from the colors of other coordinate data of the step.

4. The image processing method according to claim 1, characterized in that: The coordinate list uses at least two background colors to alternately display coordinate data of multiple cutting paths of the current cutting surface of the cutting object.

5. The image processing method according to claim 1, characterized in that: When the image acquisition module is a high-power microscope camera, and the upper left corner of the cut object is located at the center of the high-power microscope camera, the display interface is also used to display the coordinates of the upper left corner of the cut object.

6. The image processing method according to claim 1, characterized in that: If a trigger to a shooting parameter control is received during the shooting process, adjusting the shooting parameters of the image acquisition module includes: In response to receiving a trigger on the brightness control, displaying an image brightness adjustment interface; In response to receiving a trigger of at least one brightness adjustment control in the image brightness adjustment interface, the brightness parameters of the image acquisition module are adjusted accordingly. The image brightness adjustment interface includes at least one of a direct adjustment control, an oblique adjustment control, an automatic brightness control, and an initial brightness control.

7. The image processing method according to claim 1, characterized in that: If a trigger to a shooting parameter control is received during the shooting process, adjusting the shooting parameters of the image acquisition module includes: In response to receiving a trigger of the focus control, displaying a focus adjustment interface; In response to receiving a trigger of a focus adjustment control in the focus adjustment interface, the image acquisition module is automatically focused or manually focused, and the focus adjustment interface includes a plurality of focus adjustment controls, each of which has different focus parameters.

8. The image processing method according to claim 1, characterized in that: The image acquisition module includes a high-power microscope camera and a low-power microscope camera. After the image captured by the image acquisition module is displayed in a preset display area in the display interface, the image processing method further includes: In response to the received triggering of the magnification change control, displaying the magnification change interface; In response to receiving a trigger of a high-power microscope camera control in the magnification change interface, displaying an image captured by the high-power microscope camera in the preset display area; or, In response to receiving a trigger of a low-magnification microscope control in the magnification change interface, an image captured by the low-magnification microscope is displayed in the preset display area.

9. An image processing device, characterized in that: A controller used in a wafer cutting machine, wherein the image processing device comprises: a motion control module, configured to control the motion control to move to a position indicated by a first control in a coordinate list in a display interface in response to a received trigger on the first control, wherein the coordinate list further displays a plurality of second controls in addition to the first control, wherein the first control and each of the second controls respectively indicate coordinate data of a cutting path of a current cutting surface of a cutting object, and the positions indicated by the first control and each of the second controls are different; A shooting control module, configured to control the image acquisition module to shoot the cutting object to obtain the shot image after the motion control drives the image acquisition module to move to the position indicated by the first control; A parameter adjustment module, used to adjust the shooting parameters of the image acquisition module if a trigger to the shooting parameter control is received during the shooting process; The image display module is used to display the image captured by the image acquisition module in a preset display area in the display interface.

10. A controller, characterized in that: The invention is provided in a wafer cutting machine, comprising at least one processor and a memory connected to the processor, wherein: The memory is used to store computer programs; The processor is configured to execute the computer program so that the controller can implement the image processing method according to any one of claims 1 to 8.

11. A wafer cutting machine, characterized in that: include: controller, motion control, image acquisition module, and display; The motion control is used to drive the image acquisition module to move under the control of the controller; The image acquisition module is used to photograph the cutting object under the control of the controller; The display is used to display the image captured by the image acquisition module in a preset display area in the display interface; The controller is used to implement the image processing method according to any one of claims 1 to 8.

12. A computer program product, characterized in that The method comprises computer-readable instructions, and when the computer-readable instructions are executed on a controller, the controller is enabled to implement the image processing method according to any one of claims 1 to 8.

13. A computer storage medium, characterized in that: The storage medium carries one or more computer programs, and when the one or more computer programs are executed by the controller, the controller can implement the image processing method according to any one of claims 1 to 8.

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