Chip universal die bonding apparatus with pressure regulating function and hot pressing method

Abstract

This invention relates to the field of die bonding equipment technology, and more particularly to a universal die bonding device and hot-pressing method for chips with pressure regulation function. It includes a frame, on which a first intelligent moving platform is mounted for mounting a die disk. The die disk includes a plurality of uniformly distributed wafers. A fixed frame is fixedly connected within the frame, and an electric rotating shaft is mounted on the fixed frame. The electric rotating shaft is fixedly connected to a fixed slide rail, and a slider is mounted on the fixed slide rail. A swing arm is fixedly connected to the slider on the fixed slide rail. A sliding frame is slidably connected to the swing frame, and a heat-conducting plate is fixedly connected to the sliding frame. A heating element that contacts and engages with the heat-conducting plate is fixedly connected to the swing arm. This invention heats the wafer by contacting it with the heat-conducting plate, directly heating the contact surface between the wafer and the substrate, thereby more safely controlling the heating temperature of the wafer and reducing the probability of accidental wafer failure.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonding equipment, and mainly mentions a die bonding equipment and a hot pressing method for chips that have a pressure regulating function. Background Art

[0002] In the chip production process, it is usually necessary to use hot-pressing die bonding equipment to install the wafer on the corresponding position of the substrate. The specific process is: the die bonding equipment removes the wafer from the crystal plate through negative pressure, and heats the wafer and the substrate at high temperature at the same time, and presses the wafer to the corresponding position of the substrate for crimping, so that the heated wafer and the substrate are connected as a whole. In the above process, the heating temperature of the wafer must be strictly controlled to avoid the heating temperature being too high to cause the internal structure of the wafer to melt and be damaged, or the heating temperature being too low to cause the wafer and the substrate to be loosely fixed. The heating device of the existing die bonding equipment is usually directly set on the telescopic end of the electric push rod. Although this design makes it easy for the existing device to directly heat the wafer when sucking the wafer so as to heat the contact surface of the wafer and the substrate to a temperature suitable for crimping, the existing device can only heat the back side of the contact surface of the wafer and the substrate when heating the wafer. Since temperature transfer requires a certain process, there is a temperature difference between the two surfaces of the wafer. Therefore, the temperature of the heated surface of the wafer is usually higher than the temperature of the contact surface of the wafer and the substrate. As a result, the existing device needs to control the temperature of the heated wafer with extremely high accuracy. Otherwise, the heated surface of the wafer is easily heated too much and melted, causing the crystal path of the heated surface of the wafer to be destroyed, and ultimately causing the wafer to be scrapped. Summary of the invention

[0003] In order to overcome the disadvantage that the heating device in the existing equipment can only heat the back side of the contact surface between the chip and the substrate, resulting in a higher precision of temperature control required by the existing heating device, the present invention provides a chip-universal die bonding equipment and hot pressing method with pressure regulation function.

[0004] Technical solution: A chip-universal crystal bonding equipment with pressure regulation function, comprising a frame, a first intelligent mobile platform and a second intelligent mobile platform are installed in the frame, the first intelligent mobile platform is used to install a crystal plate, the crystal plate includes a number of evenly distributed wafers, a fixed frame is fixed in the frame, the fixed frame is located on the upper side of the first intelligent mobile platform and the second intelligent mobile platform, the fixed frame is installed with an electric shaft, the electric shaft is fixed with a fixed slide rail, the fixed slide rail is installed with a slider, the fixed slide rail is slidably connected to the fixed frame, the A sliding block on the fixed slide rail is fixedly connected to a swing arm, a side of the swing arm away from the fixed slide rail is fixedly connected to an electric telescopic rod, the swing arm is rotatably connected to a swing frame, the fixed part of the electric telescopic rod is slidably connected to a sliding rod through a bracket, the sliding rod is rotatably connected to the swing frame, the swing frame is slidably connected to a sliding frame, the sliding frame is fixedly connected to a heat conducting plate, the swing arm is fixedly connected to a heating element that contacts and cooperates with the heat conducting plate, and the telescopic end of the electric telescopic rod is fixedly connected to a swing mechanism for controlling the swing of the swing frame and a pressure regulating mechanism for controlling the squeezing force between the wafer and the substrate.

[0005] In addition, it is particularly preferred that a temperature sensor is fixedly connected inside the heating element, the temperature sensor is in contact with the heat conducting plate, and the heating element is provided with a groove for keeping the heat conducting plate warm.

[0006] In addition, it is particularly preferred that the swing mechanism includes a first limit member, the first limit member is slidably connected to the telescopic end of the electric telescopic rod, the first limit member is limitedly matched with the sliding rod, a spring is installed between the first limit member and the telescopic end of the electric telescopic rod, an air duct for sucking the wafer by negative pressure is provided in the telescopic end of the electric telescopic rod, the sliding connection between the first limit member and the telescopic end of the electric telescopic rod is connected to the air duct, and the swing frame is provided with a retraction component for controlling the sliding of the sliding frame.

[0007] In addition, it is particularly preferred that the swing arm is slidably connected to a second limit member, a spring is installed between the second limit member and the swing arm, and the second limit member is limitedly matched with the swing frame.

[0008] In addition, it is particularly preferred that the contraction assembly includes a first hydraulic telescopic rod, the first hydraulic telescopic rod is fixed to a side of the swing frame close to the sliding frame, the sliding frame is fixed with a magnetic block, the telescopic end of the first hydraulic telescopic rod is magnetically matched with the magnetic block, a spring is installed between the sliding frame and the swing frame, the fixed part of the electric telescopic rod is fixed with a second hydraulic telescopic rod, the second hydraulic telescopic rod is connected to the first hydraulic telescopic rod through a hose, and a spring is installed between the telescopic rod of the second hydraulic telescopic rod and its fixed part.

[0009] In addition, it is particularly preferred that the pressure regulating mechanism includes pneumatic telescopic rods uniformly distributed in the circumferential direction, the pneumatic telescopic rods are fixedly connected to the telescopic ends of the electric telescopic rods, the telescopic ends of the pneumatic telescopic rods are slidingly connected to the telescopic ends of the electric telescopic rods, the telescopic ends of the pneumatic telescopic rods are ball-jointed with extrusion plates, the extrusion plates are extrusion-fitted with the telescopic ends of the electric telescopic rods, the fixed portion of the electric telescopic rods is fixedly connected with an air guide ring, and the pneumatic telescopic rods are connected to the air guide ring via a hose.

[0010] In addition, it is particularly preferred that the telescopic end of the second hydraulic telescopic rod is extrusion-fitted with the adjacent extrusion plate.

[0011] In addition, it is particularly preferred that an elastic rope is installed between the extrusion plate and the telescopic end of the electric telescopic rod.

[0012] In addition, it is particularly preferred that it also includes a fixing mechanism for stably fixing the substrate, the fixing mechanism is arranged on the second intelligent mobile platform, the fixing mechanism includes a sliding block, the sliding block is slidably connected to the upper side of the second intelligent mobile platform, the upper side of the sliding block is fixed with evenly distributed fixing columns, the fixing columns are slidably connected to a circumferentially evenly distributed positioning plate through a spring telescopic rod, the sliding block is fixed with a first pneumatic push rod near the evenly distributed fixing columns, the telescopic end of the first pneumatic push rod is fixed with a moving ring, the moving ring is fixed with first extrusion blocks that are evenly distributed circumferentially and are respectively extruded and matched with adjacent positioning plates, the fixing columns are slidably connected to circumferentially evenly distributed fixing plates through a spring telescopic rod, the sliding block is fixed with a circumferentially evenly distributed second pneumatic push rod near the evenly distributed fixing columns, the telescopic end of the second pneumatic push rod is fixed with a second extrusion block that is extruded and matched with adjacent fixing plates.

[0013] In addition, it is particularly preferred that a chip-universal hot pressing method is applied to the above-mentioned chip-universal die bonding equipment with pressure regulating function, and the specific method is as follows: S1: Mounting the wafer plate on the upper side of the first intelligent mobile platform, and mounting the substrate on the upper side of the second intelligent mobile platform by sequentially activating the first pneumatic push rod and the second pneumatic push rod; S2: starting the heating element to heat the heat conducting plate, and rotating the electric telescopic rod to the top of the wafer by controlling the electric rotating shaft; S3: By controlling the electric telescopic rod, the telescopic end of the electric telescopic rod drives the adjacent components to move downward to the contact position with the adjacent wafer, and then the air guide channel is pumped into a negative pressure state, and the wafer is fixed on the lower side of the telescopic end of the electric telescopic rod. The first limiter is driven by the negative pressure to cooperate with the sliding rod; S4: by controlling the electric telescopic rod, the telescopic end of the electric telescopic rod drives the wafer and adjacent components to move upward, and the telescopic end of the electric telescopic rod drives the swing frame to rotate through the first limiter and the sliding rod. When the electric telescopic rod is reset, the heat conducting plate is located at the lower side of the wafer and the two contact each other, so as to heat the wafer; S5: The electric telescopic rod is rotated to the top of the substrate by controlling the electric rotating shaft, and the telescopic end of the electric telescopic rod is controlled to drive the adjacent components to extend downward, and the swing frame drives the heat conducting plate to rotate away from the wafer, and the wafer is driven by the telescopic end of the electric telescopic rod to the contact position with the substrate; S6: Stop maintaining the negative pressure state in the air guide channel, guide air into the air guide ring, control the telescopic end of the pneumatic telescopic rod to extend, provide a fixed squeezing force on the wafer, and install the wafer on the substrate; S7: After the telescopic end of the electric telescopic rod is controlled to retract, the above process is repeated to install wafers at other positions. When the substrate is fully installed, the substrate is replaced; S8: After all the wafers have been hot-pressed, turn off the heating element and other electrical components.

[0014] Compared with the prior art, the present invention has the following advantages: the present invention heats the wafer by contacting the heat-conducting plate with the wafer, directly heating the contact surface between the wafer and the substrate, thereby avoiding the problem of temperature difference between the contact surface between the wafer and the substrate and the heated surface when heating the wafer as a whole in the traditional heating method, thereby more safely controlling the heating temperature of the wafer and reducing the probability of accidental scrapping of the wafer.

[0015] The present invention arranges the heating element and other equipment separately and uses a heat conducting plate to conduct heat, thereby reducing the impact of high temperature on the heating element on other equipment, thereby ensuring the operating accuracy of the pneumatic equipment and electric equipment thereon, so as to ensure the accuracy of the device in clamping the chip.

[0016] The present invention introduces gas into the air guide ring, and the gas controls the pneumatic telescopic rods and the extrusion plates evenly distributed circumferentially to apply pressure to the wafer. The pressure applied to the wafer is more uniform, and it is convenient for workers to adjust the pressure received by the wafer.

[0017] The present invention positions the substrate by a positioning plate and a fixing plate, so that only the fixing plate is worn when the sliding block drives the substrate to move, thereby ensuring the positioning accuracy of the positioning plate to the substrate and increasing the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a three-dimensional structural schematic diagram of the frame, crystal plate and fixing frame of the present invention; Figure 3It is a schematic diagram of the three-dimensional structure of the first intelligent mobile platform and the second intelligent mobile platform of the present invention; Figure 4 It is a three-dimensional structural schematic diagram of the fixing frame, the electric rotating shaft and the fixing slide rail of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the crystal plate, the swing arm and the electric telescopic rod of the present invention; Figure 6 It is a three-dimensional structural schematic diagram of the swing arm, the electric telescopic rod and the swing frame of the present invention; Figure 7 An exploded view of the swing frame, the sliding rod and the sliding frame of the present invention; Figure 8 It is a special state diagram of the swing frame, the sliding rod and the sliding frame of the present invention; Fig. 9 It is a detailed display diagram of the swing frame, the sliding frame and the magnetic block of the present invention; Fig.10 is a cross-sectional view of the electric telescopic rod and the extrusion plate of the present invention; Fig.11 It is a schematic diagram of the three-dimensional structure of the air guide channel, the extrusion plate and the elastic rope of the present invention; Fig.12 It is a schematic diagram of the three-dimensional structure of the second intelligent mobile platform and the sliding block of the present invention; Fig.13 It is a schematic diagram of the three-dimensional structure of the sliding block, the fixing column and the positioning plate of the present invention; Fig.14 It is a schematic diagram of the three-dimensional structure of the fixing column, the positioning plate and the fixing plate of the present invention.

[0019] Marked in the figure: 1, rack, 101, crystal disk, 102, wafer, 2, first intelligent mobile platform, 3, second intelligent mobile platform, 4, fixed frame, 5, electric shaft, 6, fixed slide rail, 7, swing arm, 8, electric telescopic rod, 81, air guide duct, 9, swing frame, 10, sliding rod, 11, sliding frame, 12, heat conduction plate, 13, heating element, 131, temperature sensor, 14, first limit member, 15, second limit member, 16, first hydraulic telescopic rod, 17, magnetic block, 18, second hydraulic telescopic rod, 19, pneumatic telescopic rod, 20, extrusion plate, 21, air guide ring, 22, elastic rope, 23, sliding block, 24, fixed column, 25, positioning plate, 26, first pneumatic push rod, 27, moving ring, 28, first extrusion block, 29, fixed plate, 30, second pneumatic push rod, 31, second extrusion block. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0021] Embodiment 1: When the existing device heats the chip, it can only heat the back side of the contact surface between the chip and the substrate. Since temperature transfer requires a certain process, there is a temperature difference between the two surfaces of the chip. Therefore, the temperature of the heated surface of the chip is usually higher than the temperature of the contact surface between the chip and the substrate. As a result, the existing device needs to control the temperature of the heated chip with extremely high accuracy. Otherwise, the heated surface of the chip is easily heated too much and melted.

[0022] In view of the above problems, the present invention proposes a chip universal die bonding device with pressure regulating function, referring to Figure 1-Figure 7, including a frame 1, a control terminal is installed outside the frame 1, a first intelligent mobile platform 2 and a second intelligent mobile platform 3 are installed inside the frame 1, the first intelligent mobile platform 2 and the second intelligent mobile platform 3 are both electrically connected to the control terminal, the first intelligent mobile platform 2 and the second intelligent mobile platform 3 are both intelligent devices, the first intelligent mobile platform 2 is used to install a crystal plate 101, the crystal plate 101 includes a plurality of uniformly distributed wafers 102, the first intelligent mobile platform 2 is used to drive the crystal plate 101 to move according to a program, so that other components can absorb the wafers 102 through negative pressure, and the second intelligent mobile platform 3 is used to drive the substrate to move according to a program (the second intelligent mobile platform in Example 1 The platform 3 is installed with a substrate through an existing electric control chuck), which is convenient for continuously hot-pressing the wafer 102 on the substrate. A fixed frame 4 is fixedly connected in the frame 1, and the fixed frame 4 is located on the upper side of the first intelligent mobile platform 2 and the second intelligent mobile platform 3. An electric shaft 5 electrically connected to the control terminal is installed on the right side of the fixed frame 4, and a fixed slide rail 6 is fixedly connected to the left side of the electric shaft 5. The fixed slide rail 6 is installed with a slider. The fixed slide rail 6 is slidably connected to the fixed frame 4, which is convenient for the fixed slide rail 6 and the components thereon to rotate more stably along the fixed frame 4. A swing arm 7 is fixedly connected to the slider on the fixed slide rail 6. The slider on the fixed slide rail 6 is used to drive the swing arm 7 to move, so as to facilitate the staff to adjust the swing arm 7 and the electric shaft 5. The distance between the moving shafts 5 increases the applicability of the swing arm 7. The left side of the swing arm 7 is fixedly connected with an electric telescopic rod 8 electrically connected to the control terminal. The left side of the swing arm 7 is rotatably connected with a swing frame 9. The fixed part of the electric telescopic rod 8 is slidably connected with a sliding rod 10 through a bracket. The sliding rod 10 is rotatably connected with the swing frame 9. The sliding rod 10 is controlled to slide up and down, and then the sliding rod 10 controls the swing frame 9 to swing. The front side of the swing frame 9 is slidably connected with a sliding frame 11. The rear side of the sliding frame 11 is fixedly connected with a heat conducting plate 12. The heat conducting plate 12 is used to heat the contact surface between the chip 102 and the substrate, ensuring the heating accuracy of the chip 102 while avoiding other damages to the chip 102. The position has an adverse effect, the swing arm 7 is fixedly connected with a heating element 13 which is in contact with the heat conducting plate 12, the heating element 13 is electrically connected to the control terminal, a temperature sensor 131 which is electrically connected to the control terminal is fixedly connected inside the heating element 13, the temperature sensor 131 is in contact with the heat conducting plate 12, and is used to detect the temperature on the heat conducting plate 12, the heating element 13 is provided with a groove for keeping the heat conducting plate 12 warm, the heat conducting plate 12 is heated by being inserted into the groove of the heating element 13, the telescopic end of the electric telescopic rod 8 is fixedly connected with a swing mechanism for controlling the swing of the swing frame 9 and a pressure regulating mechanism for controlling the squeezing force between the chip 102 and the substrate, the swing mechanism and the pressure regulating mechanism are both electrically connected to the control terminal.

[0023] Reference Figure 6 and Figure 8The swing mechanism includes a first limiter 14 slidably connected to the telescopic end of the electric telescopic rod 8. A groove is provided on the left side of the first limiter 14. The first limiter 14 limits the sliding rod 10 through the groove on it, driving the sliding rod 10 to move up and down together. A spring is installed between the first limiter 14 and the telescopic end of the electric telescopic rod 8. An air duct 81 is provided in the telescopic end of the electric telescopic rod 8. The air duct 81 is connected to an external air pump, and the air pump is connected to the control terminal. The air pump draws air into the air duct 81 to a negative pressure state, so that the telescopic end of the electric telescopic rod 8 absorbs air. The wafer 102, the sliding connection between the first limit piece 14 and the telescopic end of the electric telescopic rod 8 is connected to the air duct 81, so the first limit piece 14 will also be sucked by the negative pressure in the air duct 81 and move toward the telescopic end of the electric telescopic rod 8. The swing arm 7 is slidably connected with the second limit piece 15, and a spring is installed between the second limit piece 15 and the swing arm 7. The second limit piece 15 limits the swing frame 9 so that the swing frame 9 remains in a fixed state when it is not limited by the sliding rod 10. The swing frame 9 is provided with a retracting component for controlling the sliding of the sliding frame 11.

[0024] Reference Figure 7 , Fig. 9 and Fig.10 The contraction assembly includes a first hydraulic telescopic rod 16 fixed to the front side of the swing frame 9, a magnetic block 17 magnetically matched with the telescopic end of the first hydraulic telescopic rod 16 is fixed to the rear side of the sliding frame 11, a spring is installed between the sliding frame 11 and the swing frame 9, and the initial state of the spring on the sliding frame 11 is in a compressed state, and the fixed part of the electric telescopic rod 8 is fixed with a second hydraulic telescopic rod 18 connected to the first hydraulic telescopic rod 16 through a hose. When the telescopic end of the second hydraulic telescopic rod 18 is extended, the second hydraulic telescopic rod 18 extracts the hydraulic oil in the first hydraulic telescopic rod 16, thereby controlling the telescopic end of the first hydraulic telescopic rod 16 to retract inward, and a spring is installed between the telescopic rod of the second hydraulic telescopic rod 18 and its fixed part, and the initial state of the spring on the second hydraulic telescopic rod 18 is in a compressed state.

[0025] Reference Fig.10 and Fig.11The pressure regulating mechanism includes four pneumatic telescopic rods 19 which are evenly distributed in the circumference and fixed to the telescopic end of the electric telescopic rod 8. The telescopic end of the pneumatic telescopic rod 19 is slidably connected to the telescopic end of the electric telescopic rod 8. The telescopic end of the pneumatic telescopic rod 19 is ball-connected with an extrusion plate 20. The extrusion plate 20 is used to provide an extrusion force to the wafer 102. The extrusion plate 20 is extruded and matched with the telescopic end of the electric telescopic rod 8. When the telescopic end of the pneumatic telescopic rod 19 is fully retracted, the extrusion plate 20 does not affect the sealing match between the telescopic end of the electric telescopic rod 8 and the wafer 102. The fixed part of the electric telescopic rod 8 is fixed with an air guide ring 21. The air guide ring 21 is connected to an external air pump. The pneumatic telescopic rod 19 It is connected to the air guide ring 21 through a hose. The staff adjusts the extrusion force applied by the four extrusion plates 20 to the wafer 102 by controlling the air pressure in the air guide ring 21. The telescopic end of the second hydraulic telescopic rod 18 is squeezed and matched with the adjacent extrusion plates 20. When the telescopic end of the electric telescopic rod 8 retracts upward, the telescopic end of the electric telescopic rod 8 drives the adjacent extrusion plates 20 to squeeze the telescopic end of the second hydraulic telescopic rod 18 to retract. An elastic rope 22 is installed between the extrusion plate 20 and the telescopic end of the electric telescopic rod 8. The elastic rope 22 is used to drag the adjacent extrusion plates 20, so that the adjacent extrusion plates 20 squeeze the edge position of the wafer 102, providing a more stable extrusion force on the wafer 102.

[0026] When the staff uses this device to produce chips, they first install the crystal plate 101 on the first intelligent mobile platform 2, and install the substrate on the second intelligent mobile platform 3. The first intelligent mobile platform 2 is used to drive the crystal plate 101 to move according to the program, and move the wafer 102 on the crystal plate 101 to the lower side of the telescopic end of the electric telescopic rod 8 in turn, so that the electric telescopic rod 8 and adjacent components can continuously grab the wafer 102. The second intelligent mobile platform 3 is used to drive the substrate to move according to the program, and move the substrate on which the wafer 102 needs to be installed to the lower side of the telescopic end of the electric telescopic rod 8 in turn, so that the wafer 102 can be continuously hot-pressed on the substrate. After the staff has installed the crystal plate 101 and the substrate, they start the program for continuous production of hot-pressed chips through the control terminal, and start to gradually hot-press the wafer 102 on the substrate according to the following steps.

[0027] The control terminal first starts the heating element 13, and the heating element 13 heats the heat conducting plate 12. The control terminal identifies the temperature of the heat conducting plate 12 through the temperature sensor 131. When the temperature of the heat conducting plate 12 reaches the temperature for heating the wafer 102, the control terminal turns off the heating element 13. When starting the heating element 13, the control terminal simultaneously heats the substrate through the existing heating device to ensure that the temperature of the substrate is always at a temperature suitable for hot pressing the wafer 102. After the control terminal turns off the heating element 13, the control terminal controls the electric shaft 5 to drive the fixed slide rail 6 to rotate. The fixed slide rail 6 drives the swing arm 7 and the electric telescopic rod 8 and other components to rotate together through its upper slider. When the electric telescopic rod 8 moves to the upper side of the wafer 102, the control terminal turns off the electric shaft 5, and the electric telescopic rod 8 and adjacent components stop moving.

[0028] After the control terminal turns off the electric rotating shaft 5, the control terminal controls the telescopic end of the electric telescopic rod 8 to extend downward, and the telescopic end of the electric telescopic rod 8 drives the extrusion plate 20, the four pneumatic telescopic rods 19 and other components to move downward together. At this time, the extrusion plate 20 no longer squeezes the telescopic end of the second hydraulic telescopic rod 18. The telescopic end of the second hydraulic telescopic rod 18 extends downward under the action of the adjacent spring, and the second hydraulic telescopic rod 18 extracts the hydraulic oil in the first hydraulic telescopic rod 16 through the hose. The telescopic end of the first hydraulic telescopic rod 16 retracts backward. At this time, the distance between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 gradually becomes farther, and the magnetic attraction between the magnetic block 17 and the telescopic end of the first hydraulic telescopic rod 16 gradually becomes smaller than the elastic force of the spring on the sliding frame 11. Under the action of the spring, the sliding frame 11 drives the magnetic block 17 and the heat conducting plate 12 to move forward together, and the heat conducting plate 12 is out of contact with the heating element 13.

[0029] When the telescopic end of the electric telescopic rod 8 moves downward to contact the wafer 102, the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving. At this time, the wafer 102 only contacts the telescopic end of the electric telescopic rod 8, and the first limiter 14 is just aligned with the sliding rod 10. The control terminal controls the air pump to extract air from the air duct 81, and a negative pressure chamber is formed in the air duct 81. The wafer 102 is fixed on the lower side of the telescopic end of the electric telescopic rod 8 by the suction force of the negative pressure of the air duct 81. At this time, the first limiter 14 is sucked by the negative pressure of the air duct 81. The electric telescopic rod 8 gradually moves into the telescopic end, the spring on the first limiter 14 is compressed and stored, the first limiter 14 and the sliding rod 10 slide relative to each other, so that the sliding rod 10 is gradually inserted into the groove of the first limiter 14. At this time, the sliding rod 10 and the first limiter 14 are in a state of mutual connection. When the telescopic end of the electric telescopic rod 8 absorbs the wafer 102, the control terminal controls the telescopic end of the electric telescopic rod 8 to drive the wafer 102 and the extrusion plate 20 and other components to move upward and reset. At this time, the telescopic end of the electric telescopic rod 8 drives the first limiter 14 to slide relative to each other, so that the sliding rod 10 is gradually inserted into the groove of the first limiter 14. At this time, the sliding rod 10 and the first limiter 14 are in a state of mutual connection. The limiting member 14 moves upward together, the telescopic end of the first limiting member 14 drives the sliding rod 10 to move upward, and the sliding rod 10 drives the swing frame 9 and the heat conducting plate 12 and other components to rotate downward 90°, and the swing frame 9 moves by squeezing the second limiting member 15 to release the limiting relationship between the two. When the swing frame 9 passes through the second limiting member 15, the second limiting member 15 is reset under the drive of the adjacent spring, and when the squeezing plate 20 contacts the telescopic end of the second hydraulic telescopic rod 18 again, the hydraulic oil in the second hydraulic telescopic rod 18 flows to the first hydraulic The telescopic rod 16 is squeezed out, and the telescopic end of the first hydraulic telescopic rod 16 extends downward. When the electric telescopic rod 8 is completely reset, the magnetic force between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is just greater than the elastic force of the spring on the sliding frame 11. The sliding frame 11 moves upward under the drive of the magnetic force of the magnetic block 17, and the spring on the sliding frame 11 is compressed and stored until the heat conducting plate 12 on the sliding frame 11 contacts the chip 102, and the sliding frame 11 stops moving upward, and the heat conducting plate 12 heats the chip 102 by its own temperature.

[0030] Because when the heat conducting plate 12 heats the chip 102, the heating surface is the contact surface between the chip 102 and the substrate, which avoids the problem that when the chip 102 is heated as a whole in the traditional heating method, the temperature is not transferred in time, resulting in the contact surface between the chip 102 and the substrate being heated to a sufficient temperature, and the other side of the chip 102 may be damaged due to excessive heating. In addition, during the process, the distance between the heating element 13 and the electric telescopic rod 8 is relatively far, which reduces the influence of high temperature on the electric telescopic rod 8 and increases the accuracy of the device during operation.

[0031] When the telescopic end of the electric telescopic rod 8 is completely reset, the control terminal controls the electric shaft 5 to drive the fixed slide rail 6, the swing frame 9 and the electric telescopic rod 8 and other components to rotate toward the second intelligent mobile platform 3 until the electric telescopic rod 8 is located directly above the position of the chip to be installed on the substrate. At this time, the control terminal controls the telescopic end of the electric telescopic rod 8 to extend downward. At this time, the heat conducting plate 12 just heats the lower side of the chip 102 to a temperature suitable for hot pressing. The heat conducting plate 12 and the sliding frame 11 are pushed downward by the chip 102 and the telescopic end of the electric telescopic rod 8, and the extrusion plate 20 stops squeezing the telescopic end of the second hydraulic telescopic rod 18. The second hydraulic telescopic rod 18 re-extracts the hydraulic pressure in the first hydraulic telescopic rod 16 according to the same principle as above. The oil is applied, and the distance between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is rapidly increased. When the magnetic attraction between the telescopic end of the first hydraulic telescopic rod 16 and the magnetic block 17 is less than the spring force on the sliding frame 11, the sliding frame 11 rapidly moves downward under the action of the adjacent spring force, so that the heat conducting plate 12 is out of contact with the wafer 102. During the downward movement, the telescopic end of the electric telescopic rod 8 drives the swing frame 9 and adjacent components to swing upward and reset through the first limit member 14 and the sliding rod 10. The swing frame 9 moves by squeezing the second limit member 15 and resumes the limit cooperation with the second limit member 15. When the wafer 102 moves downward to the position in contact with the substrate, the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving downward.

[0032] When the control terminal controls the telescopic end of the electric telescopic rod 8 to stop moving downward, the control terminal controls the air pump to stop extracting air from the air duct 81, and the negative pressure environment is no longer maintained in the air duct 81, and the air pump is controlled to inflate the air guide ring 21. The gas in the air guide ring 21 is passed into the four pneumatic telescopic rods 19 through the hose. The telescopic end of the pneumatic telescopic rod 19 drives the adjacent extrusion plates 20 to extend downward and squeeze the wafer 102 downward. At this time, there is pressure between the wafer 102 and the substrate, and the pressure between the wafer 102 and the substrate is equal to the air pressure in the air guide ring 21, which is convenient for the staff to control the pressure between the wafer 102 and the substrate during hot pressing. At this time, the elastic rope 22 drags the adjacent extrusion plates 20 so that the four extrusion plates 20 apply force to the wafer 102, close to the edge of the wafer 102, thereby promoting rapid consolidation around the wafer 102.

[0033] When the negative pressure environment is no longer maintained in the air guide channel 81, the first limiter 14 is reset under the drive of the adjacent spring, the first limiter 14 is released from the cooperation with the sliding rod 10, the swing frame 9 and the sliding rod 10 are limited by the second limiter 15, and no longer move with the telescopic end of the electric telescopic rod 8. When the extrusion plate 20 maintains the extrusion of the chip 102 for a certain period of time, the chip is firmly fixed on the substrate through hot pressing, and the control terminal controls the telescopic end of the electric telescopic rod 8 and the adjacent components to reset upwards, and the control terminal simultaneously controls the air pump to move the air guide ring 21 The internal gas is extracted, and the air guide ring 21 extracts the gas in the four pneumatic telescopic rods 19, and the telescopic ends of the pneumatic telescopic rods 19 retract and reset. When the telescopic end of the electric telescopic rod 8 is completely reset, the extrusion plate 20 squeezes the telescopic end of the second hydraulic telescopic rod 18 again, and the second hydraulic telescopic rod 18 drives the telescopic end of the first hydraulic telescopic rod 16 to extend according to the same principle as above, so as to drive the sliding frame 11 and the heat conducting plate 12 to slide backward, and the heat conducting plate 12 is inserted into the heating element 13, and the control terminal starts the heating element 13 again to heat the heat conducting plate 12.

[0034] The control terminal controls the device to continuously repeat the above steps, hot pressing the wafer 102 on the crystal disk 101 onto the substrate in turn. The staff removes the substrate with the wafer 102 installed and moves the substrate to the next process. When the staff has produced all the chips, the staff turns off the electrical controls such as the heating element 13 through the control terminal.

[0035] Embodiment 2: The existing electric control chuck usually fixes the substrate by inserting the fixing pin into the positioning hole of the substrate, and during the hot pressing process of the chip 102, the existing intelligent mobile platform needs to drive the substrate to move frequently through the electric control chuck to ensure that the chip 102 is correctly installed in the hot pressing position of the substrate during the hot pressing process. When the electric control chuck drives the substrate to move frequently, it is bound to cause wear between the fixing pin on the electric control chuck and the substrate. When the fixing pin is worn, the electric control chuck can no longer drive the substrate to move accurately. If the fixing pin on the electric control chuck is not replaced in time, it is easy to make it difficult to accurately install the chip 102 at the expected position on the substrate.

[0036] In view of the above problems, based on Example 1, Figure 12-14, also includes a fixing mechanism arranged on the second intelligent mobile platform 3, the fixing mechanism is used to replace the existing electric control chuck to stably fix the substrate, the fixing mechanism includes a sliding block 23, the sliding block 23 is slidably connected to the upper side of the second intelligent mobile platform 3, the second intelligent mobile platform 3 can intelligently control the sliding block 23 to move in the up, down, left, right, front and back directions, and then control the movement of the substrate, the upper side of the sliding block 23 is fixedly connected to a plurality of evenly distributed fixing columns 24, the fixing columns 24 are fixedly connected to two groups of circumferentially evenly distributed spring telescopic rods, one group of spring telescopic rods are fixedly connected to the telescopic ends of each group of spring telescopic rods are fixedly connected to the positioning plates 25, the sliding block 23 is fixedly connected to the first pneumatic push rod 26 near the evenly distributed fixing columns 24, the first pneumatic push rod 26 is electrically connected to the control terminal, and the telescopic end of the first pneumatic push rod 26 is fixedly connected to the moving The movable ring 27 has first extrusion blocks 28 evenly distributed in the circumference fixedly connected to its upper side, which are respectively squeezed and matched with the adjacent positioning plates 25. The first extrusion blocks 28 move and open by squeezing the adjacent positioning plates 25, thereby making all the positioning plates 25 on the same fixed column 24 open together to position the adjacent positioning holes. The telescopic ends of another group of spring telescopic rods on the fixed column 24 are all fixedly connected with fixed plates 29. The sliding blocks 23 are all fixedly connected with second pneumatic push rods 30 evenly distributed in the circumference near the evenly distributed fixed columns 24. The second pneumatic push rods 30 are electrically connected to the control terminal. The telescopic ends of the second pneumatic push rods 30 are fixedly connected with second extrusion blocks 31 squeezed and matched with the adjacent fixed plates 29. The second extrusion blocks 31 move by squeezing the adjacent fixed plates 29, thereby controlling the adjacent fixed plates 29 to fix the substrate.

[0037] When the staff installs the substrate on the second intelligent mobile platform 3, the staff first places the substrate on the sliding block 23 and ensures that the positioning holes of the substrate correspond one by one to the adjacent fixed columns 24. Then the staff starts all the first pneumatic push rods 26 through the control terminal. The telescopic end of the first pneumatic push rod 26 drives the adjacent moving ring 27 and all the first extrusion blocks 28 thereon to extend upward together. The first extrusion block 28 squeezes the adjacent positioning plates 25. The positioning plates 25 on the same fixed column 24 extend at the same time, and the adjacent spring telescopic rods stretch and accumulate force to position the adjacent positioning holes. After all the positioning plates 25 are respectively in contact with the adjacent positioning holes, the control terminal closes all the first pneumatic push rods 26, and the substrate is fixed on the upper side of the sliding block 23 and cannot move. At this time, the control terminal starts all the second pneumatic push rods 30, and the extension of the second pneumatic push rods 30 The retracted end drives the second extrusion block 31 to move upward together, and the second extrusion block 31 squeezes the adjacent fixed plate 29 to open, and the adjacent spring telescopic rods are stretched and force is accumulated until the fixed plate 29 contacts the adjacent positioning hole and cannot move, and the control terminal closes all the second pneumatic push rods 30, and then the control terminal controls the first pneumatic push rods 26 to drive the adjacent parts to move and reset, and the positioning plate 25 moves and resets under the drive of the adjacent spring telescopic rods. At this time, the substrate is supported by all the fixed plates 29, and the substrate is still in a relatively fixed state with the sliding block 23. After all the wafers 102 to be installed on the substrate are installed with wafers 102, the control terminal controls all the second pneumatic push rods 30 to drive the adjacent parts to move and reset, and the fixed plate 29 moves and resets under the drive of the adjacent spring telescopic rods. The staff removes the substrate in time and installs a new substrate on the sliding block 23.

[0038] When the fixed plate 29 is worn out due to long-term use, since the relative position between each base plate and the sliding block 23 is determined by the positioning plate 25, and each fixed plate 29 is individually driven by the adjacent second pneumatic push rod 30 and the second extrusion block 31, the relative position between each base plate and the sliding block 23 will not change due to the wear of the fixed plate 29, thereby increasing the service life of the sliding block 23 and adjacent components.

[0039] Example 3: A general hot pressing method for chips, referring to Figure 1-Figure 14 , a chip-universal die bonding device with pressure regulating function applied to the embodiment 2, the specific method is as follows: S1: Mount the crystal plate 101 on the upper side of the first intelligent mobile platform 2, and mount the substrate on the upper side of the second intelligent mobile platform 3 by activating the first pneumatic push rod 26 and the second pneumatic push rod 30 in sequence; S2: starting the heating element 13 to heat the heat conducting plate 12, and controlling the electric rotating shaft 5 to rotate the electric telescopic rod 8 to above the wafer 102; S3: By controlling the electric telescopic rod 8, the telescopic end of the electric telescopic rod 8 drives the adjacent components to move downward to the contact position with the adjacent wafer 102, and then the air guide channel 81 is pumped into a negative pressure state, and the wafer 102 is fixed on the lower side of the telescopic end of the electric telescopic rod 8. The first limiter 14 is driven by the negative pressure to cooperate with the sliding rod 10; S4: By controlling the electric telescopic rod 8, the telescopic end of the electric telescopic rod 8 drives the wafer 102 and adjacent components to move upward, and the telescopic end of the electric telescopic rod 8 drives the swing frame 9 to rotate through the first limiter 14 and the sliding rod 10. When the electric telescopic rod 8 is reset, the heat conducting plate 12 is located at the lower side of the wafer 102 and the two are in contact with each other, so that the wafer 102 is heated; S5: The electric telescopic rod 8 is rotated to the top of the substrate by controlling the electric rotating shaft 5, and the telescopic end of the electric telescopic rod 8 is controlled to drive the adjacent components to extend downward, and the swing frame 9 drives the heat conducting plate 12 to rotate away from the wafer 102, and the wafer 102 is driven by the telescopic end of the electric telescopic rod 8 to the contact position with the substrate; S6: Stop maintaining the negative pressure state in the air guide channel 81, guide air into the air guide ring 21, control the telescopic end of the pneumatic telescopic rod 19 to extend, provide a fixed squeezing force to the wafer 102, and install the wafer 102 on the substrate; S7: After the telescopic end of the electric telescopic rod 8 is controlled to retract, the above process is repeated to install the wafers 102 at other positions. When the substrate is fully installed, the substrate is replaced; S8: After all the wafers 102 have been hot-pressed, the heating element 13 and other electrical components are turned off.

[0040] The above embodiments are provided for persons familiar with the art to implement or use the present invention. Persons familiar with the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the present invention.

Claims

1. A chip-universal crystal bonding device with a pressure regulating function, comprising a frame (1), wherein a first intelligent mobile platform (2) and a second intelligent mobile platform (3) are installed in the frame (1), wherein the first intelligent mobile platform (2) is used to install a crystal plate (101), wherein the crystal plate (101) comprises a plurality of evenly distributed crystals (102), wherein a fixed frame (4) is fixedly connected in the frame (1), wherein the fixed frame (4) is located on the upper side of the first intelligent mobile platform (2) and the second intelligent mobile platform (3), wherein the fixed frame (4) is installed with an electric rotating shaft (5), wherein the electric rotating shaft (5) is fixedly connected with a fixed slide rail (6), wherein a slider is installed on the fixed slide rail (6), wherein the fixed slide rail (6) is slidably connected with the fixed frame (4), wherein a swing arm (7) is fixedly connected to the slider on the fixed slide rail (6), wherein an electric telescopic rod (8) is fixedly connected to the side of the swing arm (7) away from the fixed slide rail (6), Its characteristics are: The invention also comprises a swing frame (9), wherein the swing frame (9) is rotatably connected to the swing arm (7), the fixed part of the electric telescopic rod (8) is slidably connected to a sliding rod (10) via a bracket, the sliding rod (10) is rotatably connected to the swing frame (9), the swing frame (9) is slidably connected to a sliding frame (11), the sliding frame (11) is fixedly connected to a heat conducting plate (12), the swing arm (7) is fixedly connected to a heating element (13) contacting and cooperating with the heat conducting plate (12), and the telescopic end of the electric telescopic rod (8) is fixedly connected to a swing mechanism for controlling the swing of the swing frame (9) and a pressure regulating mechanism for controlling the squeezing force between the wafer (102) and the substrate.

2. A chip-universal die bonding device with pressure regulating function according to claim 1, Its characteristics are: A temperature sensor (131) is fixedly connected inside the heating element (13), the temperature sensor (131) is in contact with the heat conducting plate (12), and the heating element (13) is provided with a groove for keeping the heat conducting plate (12) warm.

3. The chip-universal die bonding device with pressure regulating function according to claim 2, Its characteristics are: The swing mechanism comprises a first limit member (14), the first limit member (14) is slidably connected to the telescopic end of the electric telescopic rod (8), the first limit member (14) and the sliding rod (10) are limitedly matched, a spring is installed between the first limit member (14) and the telescopic end of the electric telescopic rod (8), an air guide (81) for sucking the wafer (102) by negative pressure is arranged in the telescopic end of the electric telescopic rod (8), the sliding connection between the first limit member (14) and the telescopic end of the electric telescopic rod (8) is communicated with the air guide (81), and the swing frame (9) is provided with a contraction component for controlling the sliding of the sliding frame (11).

4. The chip-universal die bonding device with pressure regulating function according to claim 3, Its characteristics are: The swing arm (7) is slidably connected to a second limit member (15), a spring is installed between the second limit member (15) and the swing arm (7), and the second limit member (15) is in position-limiting cooperation with the swing frame (9).

5. The chip-universal die bonding device with pressure regulating function according to claim 4, Its characteristics are: The retracting assembly comprises a first hydraulic telescopic rod (16), the first hydraulic telescopic rod (16) being fixedly connected to a side of the swing frame (9) close to the sliding frame (11), the sliding frame (11) being fixedly connected to a magnetic block (17), the telescopic end of the first hydraulic telescopic rod (16) being magnetically matched with the magnetic block (17), a spring being installed between the sliding frame (11) and the swing frame (9), the fixed portion of the electric telescopic rod (8) being fixedly connected to a second hydraulic telescopic rod (18), the second hydraulic telescopic rod (18) being connected to the first hydraulic telescopic rod (16) via a hose, and a spring being installed between the telescopic rod of the second hydraulic telescopic rod (18) and its fixed portion.

6. The chip-universal die bonding device with pressure regulating function according to claim 5, Its characteristics are: The pressure regulating mechanism comprises pneumatic telescopic rods (19) uniformly distributed in the circumferential direction, the pneumatic telescopic rods (19) being fixedly connected to the telescopic ends of the electric telescopic rods (8), the telescopic ends of the pneumatic telescopic rods (19) being slidably connected to the telescopic ends of the electric telescopic rods (8), the telescopic ends of the pneumatic telescopic rods (19) being ball-connected with extrusion plates (20), the extrusion plates (20) being extrusion-fitted with the telescopic ends of the electric telescopic rods (8), the fixed portion of the electric telescopic rods (8) being fixedly connected with an air guide ring (21), and the pneumatic telescopic rods (19) being connected to the air guide ring (21) via a hose.

7. The chip-universal die bonding device with pressure regulating function according to claim 6, Its characteristics are: The telescopic end of the second hydraulic telescopic rod (18) is extruded and matched with the adjacent extrusion plate (20).

8. The chip-universal die bonding device with pressure regulating function according to claim 7, Its characteristics are: An elastic rope (22) is installed between the extrusion plate (20) and the telescopic end of the electric telescopic rod (8).

9. The chip-universal die bonding device with pressure regulating function according to claim 8, Its characteristics are: The invention also comprises a fixing mechanism for stably fixing the base plate, the fixing mechanism being arranged on the second intelligent mobile platform (3), the fixing mechanism comprising a sliding block (23), the sliding block (23) being slidably connected to the upper side of the second intelligent mobile platform (3), the upper side of the sliding block (23) being fixedly connected with evenly distributed fixing columns (24), the fixing columns (24) being slidably connected with circumferentially evenly distributed positioning plates (25) via spring telescopic rods, the sliding blocks (23) being fixedly connected with first pneumatic push rods (26) near the evenly distributed fixing columns (24), the first pneumatic push rods (26) being fixedly connected with the first pneumatic push rods (26) and ... evenly distributed fixing columns (24) via spring telescopic rods. The telescopic end of the movable push rod (26) is fixedly connected to a movable ring (27), and the movable ring (27) is fixedly connected to first extrusion blocks (28) which are evenly distributed in the circumference and respectively extruded and matched with the adjacent positioning plates (25). The fixed column (24) is slidably connected to a fixed plate (29) evenly distributed in the circumference through a spring telescopic rod. The sliding blocks (23) are fixedly connected to second pneumatic push rods (30) evenly distributed in the circumference near the evenly distributed fixed columns (24). The telescopic end of the second pneumatic push rod (30) is fixedly connected to a second extrusion block (31) which is extruded and matched with the adjacent fixed plate (29).

10. A chip-universal hot pressing method, applied to the chip-universal die bonding device with pressure regulating function as claimed in claim 9, Its characteristics are: The specific method is as follows: S1: mounting a crystal plate (101) on the upper side of a first intelligent mobile platform (2), and mounting a substrate on the upper side of a second intelligent mobile platform (3) by sequentially activating a first pneumatic push rod (26) and a second pneumatic push rod (30); S2: starting the heating element (13) to heat the heat conducting plate (12), and controlling the electric rotating shaft (5) to rotate the electric telescopic rod (8) to the top of the wafer (102); S3: by controlling the electric telescopic rod (8), the telescopic end of the electric telescopic rod (8) drives the adjacent components to move downward to a position where the adjacent wafer (102) is in contact, and then the air guide channel (81) is evacuated to a negative pressure state, the wafer (102) is fixed to the lower side of the telescopic end of the electric telescopic rod (8), and the first limiter (14) is driven by the negative pressure to cooperate with the sliding rod (10) in a limited manner; S4: by controlling the electric telescopic rod (8), the telescopic end of the electric telescopic rod (8) drives the wafer (102) and adjacent components to move upward, and the telescopic end of the electric telescopic rod (8) drives the swing frame (9) to rotate through the first limiter (14) and the sliding rod (10), and when the electric telescopic rod (8) is reset, the heat conducting plate (12) is located at the lower side of the wafer (102) and the two are in contact with each other, thereby heating the wafer (102); S5: controlling the electric rotating shaft (5) to rotate the electric telescopic rod (8) to the position directly above the substrate, controlling the telescopic end of the electric telescopic rod (8) to drive adjacent components to extend downward, and the swing frame (9) drives the heat conducting plate (12) to rotate away from the wafer (102), and the wafer (102) is driven by the telescopic end of the electric telescopic rod (8) to a position where it contacts the substrate; S6: stopping maintaining the negative pressure state in the air guide channel (81), guiding air into the air guide ring (21), controlling the telescopic end of the pneumatic telescopic rod (19) to extend, providing a fixed squeezing force on the wafer (102), and mounting the wafer (102) on the substrate; S7: After the telescopic end of the electric telescopic rod (8) is controlled to retract, the above process is repeated to install wafers (102) at other positions. When the substrate is fully installed, the substrate is replaced; S8: When all the chips (102) have been hot-pressed, the heating element (13) and other electrical components are turned off.

Images