Light-emitting component, display panel and preparation method of light-emitting component

Abstract

The embodiment of the present disclosure provides a light-emitting assembly, a display panel and a preparation method of the light-emitting assembly. The light-emitting assembly comprises: a light-emitting unit comprising a first electrode, a second electrode and a light-emitting part; a driving unit comprising a third electrode, a fourth electrode and a driving part, the third electrode and the fourth electrode are located on the side of the driving unit facing the light-emitting unit, the third electrode is electrically connected with the first electrode, and the fourth electrode is electrically connected with the second electrode; a plurality of pins are located on the side of the driving unit away from the light-emitting unit and are electrically connected with a driving circuit; the light-emitting unit and the driving unit comprise a first filling part, a second filling part and a third filling part; the first filling part surrounds the second filling part and the third filling part, and the thickness of the first filling part is greater than the thickness of the second filling part and the third filling part; the second filling part is in contact with the first electrode and the third electrode respectively; and the third filling part is in contact with the second electrode and the fourth electrode respectively.

Description

Technical Field

[0001] This disclosure relates to the field of displays, and in particular to a light-emitting component, a display panel, and a method for manufacturing the light-emitting component. Background Technology

[0002] Micro LED (micro light emitting diode) display panels include a driving unit integrated into the display backplane and light-emitting chips bonded to the driving unit. The driving unit is located within the display backplane and is integrated into a single structure using semiconductor processing technology. However, individual defects in the driving unit are difficult to repair, resulting in low production yield of the display backplane and ultimately a large number of dead pixels in the display panel. Summary of the Invention

[0003] In view of this, the present disclosure provides a light-emitting component, a display panel, and a method for manufacturing the light-emitting component to solve the following problems in the prior art: difficulty in repairing individual defects in the driving unit during the manufacturing process of existing Micro LED display panels, and a large number of dead pixels in the display panel.

[0004] On one hand, embodiments of this disclosure provide a light-emitting component, comprising: a light-emitting unit, the light-emitting unit including a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; a driving unit, the driving unit including a third electrode, a fourth electrode, and a driving portion, the third electrode and the fourth electrode being located on the side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode being electrically connected to a driving circuit in the driving portion, the third electrode being electrically connected to the first electrode, and the fourth electrode being electrically connected to the second electrode; and a plurality of pins, the plurality of pins being located on the side of the driving unit away from the light-emitting unit and electrically connected to the driving circuit; wherein, a first filling portion, a second filling portion, and a third filling portion are included between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode and the third electrode, and is in contact with the first electrode and the third electrode respectively; the third filling portion is located between the second electrode and the fourth electrode, and is in contact with the second electrode and the fourth electrode respectively.

[0005] In some embodiments, at least one of the plurality of pins includes a first metal layer and a second metal layer stacked together, the first metal layer being located between the second metal layer and the drive unit; wherein the material of the first metal layer includes nickel, and the material of the second metal layer includes gold.

[0006] In some embodiments, the first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; the first filling portion is in direct contact with the second filling portion; the first filling portion is in direct contact with the third filling portion; a portion of the first filling portion is located between the second filling portion and the third filling portion.

[0007] In some embodiments, the density of the first filling portion is less than the density of the second filling portion; the density of the first filling portion is less than the density of the third filling portion.

[0008] In some embodiments, the light-emitting component includes a transparent substrate located on the side of the light-emitting unit away from the driving substrate; the orthographic projection of the first filling portion onto the plane of the transparent substrate is located within the transparent substrate.

[0009] In some embodiments, the outer contour of the first filling portion projected onto the plane of the transparent substrate coincides with the outer contour of the transparent substrate.

[0010] In some embodiments, the light-emitting component includes a transparent substrate located on the side of the light-emitting unit away from the driving substrate; the light-emitting unit includes a light-emitting portion, the light-emitting portion including: a raised electrode, a first insulating layer, and a first doped layer, a multiple quantum well layer, and a second doped layer sequentially stacked away from the transparent substrate; wherein, the second electrode is located on the side of the second doped layer away from the multiple quantum well layer, and the second doped layer is electrically connected to the second electrode; the raised electrode is located between the first doped layer and the first electrode, and is electrically connected to the first doped layer and the first electrode respectively; the first insulating layer is located on the side of the first doped layer away from the transparent substrate and is in contact with the first doped layer.

[0011] In some embodiments, the first filling portion includes a first sub-filling portion and a second sub-filling portion; the orthographic projection of the first sub-filling portion on the plane where the transparent substrate is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate is located; wherein, the second sub-filling portion is at least partially located between the raised electrode and the multiple quantum well layer, and the first sub-filling portion is disposed around the entire arrangement of the raised electrode, the multiple quantum well layer, and the second sub-filling portion.

[0012] In some embodiments, the thickness of the first sub-fill portion is greater than or equal to the distance between the first insulating layer and the driving portion; the thickness of the second sub-fill portion is equal to the maximum distance between the first insulating layer and the driving portion.

[0013] In some embodiments, the first sub-filling portion includes at least a portion located between the transparent substrate and the driving portion; the thickness T1 of the portion located between the transparent substrate and the driving portion and the thickness T2 of the second sub-filling portion satisfy the following relationship: 0.5T1 <T2<0.95T1。

[0014] In some embodiments, the light-emitting component includes a plurality of light-emitting units and a driving unit corresponding to the plurality of light-emitting units; the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit, and a third color light-emitting unit, wherein the first color, the second color, and the third color are different from each other; the light-emitting unit includes a color filter layer (1014), a color transfer layer, and a light-emitting part sequentially stacked along a direction away from the transparent substrate; the light-emitting part emits blue light; wherein the light-emitting part includes a first light-emitting part, a second light-emitting part, and a third light-emitting part, the first light-emitting part being located in the first color light-emitting unit, the second light-emitting part being located in the second color light-emitting unit, and the third light-emitting part being located in the third color light-emitting unit.

[0015] In some embodiments, the driving unit further includes a substrate and a connection structure, the substrate having a connection via, the connection structure being located within the connection via, the driving circuit being located on one side of the substrate; the pin being located on the side of the substrate away from the driving circuit, and the pin being in contact with the connection structure, the pin being connected to the driving circuit through the connection structure.

[0016] In some embodiments, the driving circuit includes a plurality of thin-film transistors and at least one storage capacitor, each thin-film transistor including a gate, a source, and a drain; one of the plurality of pins is connected to the source of one of the plurality of thin-film transistors for providing the driving circuit with a data driving signal transmitted from the display backplane in the display panel.

[0017] In some embodiments, the driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer stabilizing layer, a source-drain layer, and a planarization layer, all stacked sequentially on one side of the substrate; the third electrode and the fourth electrode are located on the side of the planarization layer away from the substrate; the active layer includes a plurality of active patterns corresponding to the plurality of thin-film transistors, each active pattern including a source region, a drain region, and a channel region; the source and drain of the thin-film transistors are located in the source-drain layer, the source and source region of the thin-film transistors are connected, and the drain and drain region of the thin-film transistors are connected; the first gate layer includes a plurality of gate patterns corresponding to the plurality of thin-film transistors, and the channel region is the overlapping region of the orthographic projection of the gate pattern on the substrate and the orthographic projection of the active pattern on the substrate.

[0018] In some embodiments, the area of ​​the orthographic projection of the pin on the substrate is greater than the area of ​​the orthographic projection of the connection structure on the substrate, and the orthographic projection of the pin on the substrate covers the orthographic projection of the connection structure on the substrate.

[0019] On the other hand, embodiments of this disclosure provide a display panel, the display panel including a display back panel and a plurality of light-emitting components as described in any embodiment of this disclosure located on one side of the display back panel and arranged in an array; wherein, the display back panel is used to provide driving signals to a driving unit through a plurality of pins in the light-emitting components, so that the driving unit drives the light-emitting components to emit light.

[0020] On the other hand, embodiments of this disclosure provide a method for fabricating a light-emitting component, used to prepare the light-emitting component provided in any embodiment of this disclosure, comprising: pressing an anisotropic conductive film (ACF), a light-emitting unit, and a driving unit to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive film includes: a first filling portion, a second filling portion, and a third filling portion; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between a first electrode of the light-emitting unit and a third electrode of the driving unit, and is in contact with the first electrode and the third electrode respectively; the third filling portion is located between a second electrode of the light-emitting unit and a fourth electrode of the driving unit, and is in contact with the second electrode and the fourth electrode respectively; the bonded light-emitting component is placed in a target solution for electroplating or chemical plating to obtain a light-emitting component having multiple pins on the driving unit.

[0021] This disclosure provides a light-emitting component that bonds a light-emitting unit and a driving unit to form a new active chip with its own driving circuit. The light-emitting component and the display backplane only require a one-time transfer bonding, simplifying the process and improving product yield. Furthermore, a first filling portion is filled in the gap between the electrical connection portion of the light-emitting unit and the driving unit. The thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion, thereby protecting the second and third filling portions from corrosion during the electroplating of the pins. By controlling the thickness of the first filling portion, it can be ensured that the second and third filling portions, and even the electrodes of the light-emitting component, are not corroded by the electroplating solution. The light-emitting component will not have short circuits or device failures, thus improving product performance. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A cross-sectional structural diagram of the light-emitting component provided in an embodiment of this disclosure;

[0024] Figure 2 A cross-sectional structural diagram of a light-emitting component without a first filling portion provided in an embodiment of this disclosure;

[0025] Figure 3 A schematic diagram showing the enclosure between the first filling portion and the light-emitting unit provided in an embodiment of this disclosure;

[0026] Figure 4 A process flow diagram for fabricating a light-emitting component provided in this disclosure embodiment;

[0027] Figure 5 A cross-sectional structural diagram of the light-emitting component provided in an embodiment of this disclosure;

[0028] Figure 6 A flowchart illustrating a method for fabricating a light-emitting component according to an embodiment of this disclosure.

[0029] Figure label:

[0030] First electrode 1, second electrode 2, third electrode 3, fourth electrode 4, light-emitting part 5, driving part 6, pin 7, second filling part 8, third filling part 9, first filling part 10, first thickness part 101, second thickness part 102, first sub-filling part 11, second sub-filling part 12, thickness T1 of the first sub-filling part, thickness T2 of the second sub-filling part.

[0031] Elevation electrode 51, first doped layer 52, multiple quantum well layer 53, second doped layer 54, color conversion layer 55, color filter layer 56, transparent substrate 57, first insulating layer 58, first part 581, second part 582, third part 583;

[0032] Substrate 61, planarization layer 62, driving circuit 63, connection structure 64. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0034] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0035] To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.

[0036] This disclosure provides a light-emitting component, the cross-sectional structure of which is shown in the figure below. Figure 1 As shown, it includes:

[0037] The light-emitting unit includes a first electrode 1, a second electrode 2, and a light-emitting part 5 that is electrically connected to the first electrode 1 and the second electrode 2, respectively.

[0038] The driving unit includes a third electrode 3, a fourth electrode 4 and a driving part 6. The third electrode 3 and the fourth electrode 4 are both located on the side of the driving unit facing the light-emitting unit. The third electrode 3 and the fourth electrode 4 are electrically connected to the driving circuit 63 in the driving part 6. The third electrode 3 is electrically connected to the first electrode 1 and the fourth electrode 4 is electrically connected to the second electrode 2.

[0039] Multiple pins 7 are located on the side of the driving unit away from the light-emitting unit and are electrically connected to the driving circuit 63.

[0040] The light-emitting unit and the driving unit include a first filling part 10, a second filling part 8, and a third filling part 9; the first filling part 10 surrounds the second filling part 8 and the third filling part 9, and the thickness of the first filling part 10 is greater than the thickness of the second filling part 8 and the third filling part 9; the second filling part 8 is located between the first electrode 1 and the third electrode 3, and is in contact with the first electrode 1 and the third electrode 3 respectively; the third filling part 9 is located between the second electrode 2 and the fourth electrode 4, and is in contact with the second electrode 2 and the fourth electrode 4 respectively.

[0041] In the fabrication of Micro LED display panels, to achieve color display, related technologies require transferring and bonding light-emitting chips of different colors to a display backplane integrated with driving units. Chips of the same color are transferred in the same step, while chips of different colors are transferred in multiple steps. In other words, the number of transfers corresponds to the number of colors of the light-emitting chips. Optionally, the light-emitting chips include three colors, such as red (R), green (G), and blue (Blue), requiring three transfers. This approach involves a large number of transfers and is therefore more complex in fabricating Micro LED display panels.

[0042] Furthermore, to reduce the manufacturing cost of Micro LED display panels, the size of the display backplane cannot be designed to be too large. If the size is too large, and some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, resulting in high costs. Therefore, if this solution needs to achieve a large-size display, it can only be achieved through splicing, resulting in a poor display effect.

[0043] This disclosure embodiment separately bonds the display chip and the driving unit. For RGB Micro LED chips, they can be bonded to the driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit 63. This AM-LED chip includes red, green, and blue light-emitting chips and a driving unit that drives these chips. Therefore, the required number of AM-LED chips is transferred and bonded to the display backplane in a single operation to fabricate the glass-based color light-emitting diode (LED) display panel, depending on the desired display panel size. This method requires only one transfer process, making the process simpler. Furthermore, it enables large-size displays without splicing, improving the glass utilization rate of the display backplane and thus reducing costs.

[0044] Furthermore, this AM-LED chip utilizes detection technology to achieve dual electrical and optical detection, screening out chips that meet both optical and driving performance requirements. Therefore, compared to integrating the driving circuit 63 onto the display backplane to form the display panel, this approach is more conducive to improving the chip yield on the display panel and also facilitates the repair and replacement of defective chips.

[0045] Before bonding the AM-LED chip to the display backplane, bonding pins 7 (bumps) need to be fabricated on the AM-LED chip. The fabrication of these pins 7 typically employs electroplating or electroless plating processes. During the electroplating or electroless plating process, the AM-LED chip needs to be immersed in a specific solution. Since the electrodes of the AM-LED chip and driving unit come into contact with the solution after bonding, this can lead to short circuits, open circuits, or device failure. The cross-sectional structure of the aforementioned light-emitting component without the first filling portion 10 can be as follows... Figure 2 As shown, the gaps in the plated pins will allow the plating solution to seep in during the plating process.

[0046] However, in this embodiment, the gap between the light-emitting unit and the driving unit is filled with a first filling part 10. The thickness of the first filling part 10 is greater than the thickness of the second filling part 8 and the third filling part 9. This can at least protect the second filling part 8 and the third filling part 9 from corrosion during the electroplating of the pin 7. By controlling the thickness of the first filling part 10, it can be ensured that the second filling part 8, the third filling part 9, and even the electrode of the light-emitting component are not corroded by the electroplating solution. The light-emitting component will not have short circuits or device failures, further improving product performance.

[0047] In specific implementation, the thicker the first filling portion 10, the less the first electrode 1 and the second electrode 2 are exposed. In the subsequent electroplating process of the pin 7, the less the first electrode 1 and the second electrode 2 are corroded by the electroplating solution. In an optional embodiment, the thickness of the first filling portion 10 is set to be greater than the sum of the thickness of the first electrode 1, the thickness of the third electrode 3, and the thickness of the second filling portion 8. Since the thickness of the second electrode 2 is the same as the thickness of the first electrode 1, the thickness of the fourth electrode 4 is the same as the thickness of the third electrode 3, and the thickness of the third filling portion 9 is the same as the thickness of the second filling portion 8, the thickness of the first filling portion 10 can also be greater than the sum of the thickness of the second electrode 2, the thickness of the fourth electrode 4, and the thickness of the third filling portion 9.

[0048] In some embodiments, the thickness of the first filling portion 10 is greater than the sum of the thickness of the first electrode 1, the thickness of the third electrode 3, and the thickness of the second filling portion 8. (See reference...) Figure 1 The first filling portion 10 has at least a first thickness and a second thickness. The first thickness is greater than the distance between the first surface of the light-emitting portion 5 and the first surface of the driving portion 6, and less than or equal to the distance between the second surface of the light-emitting portion 5 and the first surface of the driving portion 6. The second thickness is less than or equal to the distance between the first surface of the light-emitting portion 5 and the first surface of the driving portion 6. The second surface of the light-emitting portion 5 is the side of the light-emitting portion 5 away from the driving portion 6, and the first surface of the driving portion 6 and the first surface of the light-emitting portion 5 are arranged opposite to each other.

[0049] In some embodiments, the first filling portion 10 surrounds the light-emitting unit, which includes a plurality of electrodes connected to the driving unit, the plurality of electrodes including a first electrode 1 and a second electrode 2. (Reference) Figure 3 The number of electrodes is, for example, four, including three first electrodes 1 and one second electrode 2. The three first electrodes 1 correspond to the red, green, and blue sub-pixels of the light-emitting unit, providing driving signals to each of the three sub-pixels. The one second electrode 2 is electrically connected to each of the three sub-pixels, serving as a common electrode. Correspondingly, the driving unit also has four electrodes, each electrically connected to one of the four electrodes of the light-emitting unit. For example, the first electrode 1 can be the anode of the light-emitting unit, and the second electrode 2 can be the cathode of the light-emitting unit. For example, the first electrode 1 can be the cathode of the light-emitting unit, and the second electrode 2 can be the anode of the light-emitting unit. For example, to ensure that the first filling portion 10 has a better protective effect, refer to... Figure 3The first filling portion 10 has a first thickness and a second thickness, wherein the first thickness portion 101 is disposed around the second thickness portion 102, and the first thickness portion 101 and the second thickness portion 102 are in contact, wherein the minimum distance n between the inner boundary and the outer boundary of the first thickness portion 101 is greater than or equal to 20 micrometers. In a specific embodiment, the orthographic projection of the inner boundary of the first thickness portion 101 onto the plane where the driving portion 6 is located coincides with the orthographic projection of the light-emitting portion 5 onto the plane where the driving portion 6 is located. It should be noted that the plane where the driving portion 6 is located can be understood as a plane perpendicular to the film layer stacking direction of the driving portion 6.

[0050] In some embodiments, the first filling portion 10 is in direct contact with the second filling portion 8, and the first filling portion 10 is also in direct contact with the third filling portion 9. A portion of the first filling portion 10 is located between the second filling portion 8 and the third filling portion 9, that is, in the gap between the anode and cathode of the light-emitting unit where they cannot contact each other (i.e., Figure 2 The gaps in the middle will also be filled by the first filling part 10. The first filling part 10 surrounds the second filling part 8 and the third filling part 9 completely.

[0051] To ensure the basic function of the light-emitting component is not compromised, the first filling portion 10 should be insulating, the second filling portion 8 should be conductive, and the third filling portion 9 should also be conductive. The first filling portion 10, the second filling portion 8, and the third filling portion 9 can be made of different materials or the same material. If the first filling portion 10, the second filling portion 8, and the third filling portion 9 are made of different materials, an additional process of preparing the first filling portion 10 is required compared to using the same material.

[0052] Since the first filling part 10, the second filling part 8 and the third filling part 9 have different conductivity, when selecting the same preparation material, it is necessary to consider that the material should have different conductivity in different states. In this embodiment, anisotropic conductive film (ACF) is selected as an example. Anisotropic conductive film has insulation in normal state or when it is not compressed to a certain proportion, and begins to have conductivity after being compressed to a certain proportion.

[0053] In some embodiments, the process for fabricating light-emitting components using anisotropic conductive adhesive can be as follows: Figure 4As shown, first, prepare an independent driving unit, a light-emitting unit, and an anisotropic conductive film. Then, bond the light-emitting unit and the driving unit according to a predetermined processing technology to compress the anisotropic conductive film between the first electrode 1 and the third electrode 3 into the second filling part 8, and compress the anisotropic conductive film between the second electrode 2 and the fourth electrode 4 into the third filling part 9. The other anisotropic conductive films form the first filling part 10. Subsequently, remove the glass substrate on the lower side of the driving unit, and prepare pins 7 connected to the electrodes of the driving unit on the surface after removing the glass substrate. Then, connect to the data line through the pins 7 to receive control signals.

[0054] In order to ensure that the first filling part 10 can play a sufficient protective role, the density of the first filling part 10 should be less than the density of the second filling part 8, and the density of the first filling part 10 should also be less than the density of the third filling part 9. Thus, the first filling part 10 can closely wrap the outside of the second filling part 8 and the third filling part 9 to avoid the corrosion of the electroplating solution during the electroplating process.

[0055] In some embodiments, the second thickness part 102, the second filling part 8, and the third filling part 9 are formed by compressing the anisotropic conductive film. The relationship between the thickness M1 of the second thickness part 102 before being compressed and the second thickness M2 satisfies: 0.5M1 < M2 < 0.95M1. M2 being less than 95% of M1 can avoid defects such as bubbles and delamination caused by insufficient filling of the second sub-filling part 12 in the thickness direction. At the same time, M2 being greater than 50% of M1 can avoid the overflow of the second sub-filling part 12 caused by the excessive thickness of the filling part, resulting in fewer conductive particles in the second filling part 8 and the third filling part 9, thus causing poor conductivity. For example, the second thickness can be determined as follows: M2 = k * d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting part 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving part 6. Therefore, k * d is the minimum compression degree that makes the conductive particles have conductivity in the compression direction. For example, if the average particle size in the compression direction is 2 microns, and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 microns and k1 is taken as 80%. In this way, it can guide how to design the second thickness M2.

[0056] Since the embodiments of the present disclosure involve the first electrode 1 and the second electrode 2 of the light-emitting unit, and the third electrode 3 and the fourth electrode 4 of the driving unit, so Figure 1The main structure of the light-emitting part 5 and the driving part 6 is shown only schematically. The specific structure of the light-emitting unit and the driving unit does not limit the embodiments of this disclosure. As long as the first electrode 1 and the third electrode 3 are electrically connected, the second electrode 2 and the fourth electrode 4 are electrically connected, and there is a gap around the two electrically connected parts after connection, the solution provided by the embodiments of this disclosure is applicable.

[0057] This disclosure provides a light-emitting component that bonds a light-emitting unit and a driving unit to form a new active chip with a built-in driving circuit 63. The light-emitting component and the display backplane only require a one-time transfer bonding, simplifying the process and improving product yield. Furthermore, the gap between the light-emitting unit and the driving unit's electrical connection portion is filled with a first filling portion 10. The thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the third filling portion 9, thereby protecting the second filling portion 8 and the third filling portion 9 from corrosion during the electroplating of the pins 7. By controlling the set thickness of the first filling portion 10, it can be ensured that the second filling portion 8, the third filling portion 9, and even the electrodes of the light-emitting component are not corroded by the electroplating solution. The light-emitting component will not have short circuits or device failures, thus improving product performance.

[0058] The pins 7 in this embodiment are formed by electroplating. At least one of the plurality of pins 7 includes a first metal layer and a second metal layer stacked together, with the first metal layer located between the second metal layer and the driving unit. The material of the first metal layer may include nickel, and the material of the second metal layer may include gold. Subsequent processes may use a soldering process to fix the designed pins 7 to the pads on the backplane.

[0059] like Figure 4 As shown, the light-emitting component of this embodiment includes a transparent substrate 57, which is located on the side of the light-emitting unit away from the driving substrate. The transparent substrate 57 can be, for example, a glass substrate. Figure 4 As shown, in an optional embodiment, the orthographic projection of the first filling portion 10 onto the plane where the transparent substrate 57 is located is within the transparent substrate 57, and the outer contour of the orthographic projection of the first filling portion 10 onto the plane where the transparent substrate 57 is located coincides with the outer contour of the transparent substrate 57.

[0060] In some embodiments, the structure of the light-emitting portion 5 of the light-emitting unit can be as follows: Figure 5As shown, the light-emitting part 5 includes: a raised electrode 51, a first insulating layer 58, and a first doped layer 52, a multi-quantum well layer 53, and a second doped layer 54 sequentially stacked in the direction away from the transparent substrate 57; wherein, the second electrode 2 is located on the side of the second doped layer 54 away from the multi-quantum well layer 53, and the second doped layer 54 is electrically connected to the second electrode 2; the raised electrode 51 is located between the first doped layer 52 and the first electrode 1, and is electrically connected to the first doped layer 52 and the first electrode 1 respectively; the first insulating layer 58 is located on the side of the first doped layer 52 away from the transparent substrate 57 and is in contact with the first doped layer 52.

[0061] The orthographic projection of the aforementioned raised electrode 51 onto the transparent substrate 57 is located inside the orthographic projection of the first doped layer 52 onto the transparent substrate 57; the orthographic projection of the second doped layer 54 onto the transparent substrate 57 is located inside the orthographic projection of the first doped layer 52 onto the transparent substrate 57; the first insulating layer 58 includes a first portion 581, a second portion 582, and a third portion 583. A first via is provided on the first portion 581, and a portion of the first electrode 1 is filled in the first via. The first portion 581 and the portion of the first electrode 1 together wrap the raised electrode 51; a second via is provided on the second portion 582, and a portion of the second electrode 2 is filled in the second via. The second portion 582 and the portion of the second electrode 2 together wrap the first doped layer 52 and the multiple quantum well layer 53; the third portion 583 is respectively in contact with the first portion 581 and the second portion 582, forming a continuous film layer. For example, the distance between the third part 583 and the driving part 6 is greater than the distance between the first part 581 and the driving part 6; the distance between the third part 583 and the driving part 6 is greater than the distance between the second part 582 and the driving part 6 and the third part 583; for example, the third part 583 is in direct contact with the second doped layer 54.

[0062] For example, the first doped layer 52 is n-type doped and the second doped layer 54 is p-type doped.

[0063] In some embodiments, based on Figure 5 Further explanation of the first filling portion 10: the first filling portion 10 includes a first sub-filling portion 11 and a second sub-filling portion 12; wherein, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate 57 is located; the second sub-filling portion 12 is at least partially located between the padding electrode 51 and the multi-quantum well layer 53, and the first sub-filling portion 11 is disposed around the entire padding electrode 51, the multi-quantum well layer 53, and the second sub-filling portion 12.

[0064] For example, to ensure that the first filling portion 10 has a better protection effect, the first sub-filling portion 11 and the second sub-filling portion 12 are arranged in contact with each other. Among them, the minimum distance n between the inner peripheral boundary and the outer peripheral boundary of the first sub-filling portion 11 is greater than or equal to 20 micrometers.

[0065] For example, the thickness of the first sub-filling portion 11 is greater than or equal to the distance between the first insulating layer 58 and the driving portion 6; the thickness of the second sub-filling portion 12 is equal to the maximum distance between the first insulating layer 58 and the driving portion 6. Thus, the first sub-filling portion 11 protects the electrodes surrounded by it due to its greater thickness compared to the first sub-filling portion 11. The second sub-filling portion 12 exactly fills the gap between the first insulating layer 58 and the driving portion 6, preventing the solution from contacting the electrodes through the gap during electroplating or electroless plating operations, thereby ensuring the reliability of the device. Preferably, the gaps in the internal space surrounded by the first sub-filling portion 11, the light-emitting portion 5, and the driving portion 6 are all filled with the second sub-filling portion 12. In this way, the solution erosion can be better isolated.

[0066] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film. The relationship between the thickness H1 of the second sub-filling portion 12 before compression and the thickness H2 of the second sub-filling portion 12 satisfies: 0.5H1 < H2 < 0.95H1. H2 being less than 95% of H1 can avoid defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction; at the same time, H2 being greater than 50% of H1 can avoid the second sub-filling portion 12 overflowing due to excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined as follows: H2 = k * d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting portion 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving portion 6. Therefore, k * d is the minimum compression degree that makes the conductive particles conductive in the compression direction. For example, if the average particle size in the compression direction is 2 micrometers and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 micrometers and k1 is taken as 80%. In this way, it can guide how to design the thickness H2 of the second sub-filling portion 12.

[0067] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film; the first sub-filling portion 11 at least includes a portion located between the transparent substrate 57 and the driving portion 6. The relationship between the thickness T1 of the first sub-filling portion 11 located between the transparent substrate 57 and the driving portion 6 and the thickness T2 of the second sub-filling portion 12 satisfies: 0.5T1 < T2 < 0.95T1. Among them, the portion of the first sub-filling portion 11 located between the transparent substrate 57 and the driving portion 6 can be slightly compressed (still in an insulating state) or not compressed. The thickness T2 of the second sub-filling portion 12 being less than 95% of the thickness T1 of the first sub-filling portion 11 can avoid defects such as bubbles and delamination caused by insufficient filling in the thickness direction of the second sub-filling portion 12; at the same time, the thickness T2 of the second sub-filling portion 12 being greater than 50% of the thickness T1 of the first sub-filling portion 11 can avoid the second sub-filling portion 12 overflowing due to the excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thus causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined in the following manner: T2 = k*d + l, where k is the upper limit of the compression ratio that enables the conductive particles in the ACF conductive adhesive to have good conductivity, d is the average particle diameter of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting portion 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving portion 6. Therefore, k*d is the minimum compression degree that enables the conductive particles to have conductivity in the compression direction. For example, if the average particle diameter in the compression direction is 2 micrometers and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 micrometers and k1 is taken as 80%. In this way, it can guide how to design the thickness T2 of the second sub-filling portion 12.

[0068] For example, the first sub-filling portion 11 can all be located between the transparent substrate 57 and the driving portion 6; for example, a part of the first sub-filling portion 11 is located between the transparent substrate 57 and the driving portion 6, and another part protrudes from the transparent substrate 57, that is, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the first substrate.

[0069] Since the light-emitting component includes multiple light-emitting units and corresponding driving units, the multiple light-emitting units will include a first-color light-emitting unit, a second-color light-emitting unit, and a third-color light-emitting unit. The first, second, and third colors are all different, and these three colors are typically red, green, and blue. To emit different colors of light onto the screen, the light-emitting unit needs to include a color filter layer 56, a color transfer layer 55, and the light-emitting part 5 as described in the above embodiment, sequentially stacked along a direction away from the transparent substrate 57. The light-emitting part 5 emits blue light. The light-emitting part 5 includes a first light-emitting part 5, a second light-emitting part 5, and a third light-emitting part 5. The first light-emitting part 5 is located in the first-color light-emitting unit, the second light-emitting part 5 is located in the second-color light-emitting unit, and the third light-emitting part 5 is located in the third-color light-emitting unit. Since the light to be emitted is red, blue and green, but the light-emitting part 5 only emits blue light, a color conversion layer 55 is needed to convert the blue light into green and red light so that it can emit green and red light. For the blue light part, the color conversion layer 55 does not need to perform color conversion, so it can be made of transparent material and then displayed through the color film layer 56.

[0070] For the drive unit, the settings of each level can be configured according to actual needs, such as... Figure 5 As shown, the driving unit includes a driving section 6, a third electrode 3, and a fourth electrode 4. The third electrode 3 and the fourth electrode 4 are located on the side of the driving section 6 near the light-emitting unit. The driving section 6 includes a substrate 61, a connection structure 64, a driving circuit 63, and a planarization layer 62. The substrate 61 has a connection via, the connection structure 64 is located within the connection via, the driving circuit 63 is located on the side of the substrate 61 near the light-emitting unit, and the planarization layer 62 is located on the side of the driving circuit 63 near the light-emitting unit. The planarization layer 62 has a via, and the third electrode 3 and the fourth electrode 4 are electrically connected to the driving circuit 63 through the via. For example, at least a portion of the third electrode 3 and the fourth electrode 4 protrudes from the planarization layer 62 on the side of the driving unit facing the light-emitting unit. A pin 7 is located on the side of the substrate 61 away from the driving circuit 63, and the pin 7 contacts the connection structure 64. The pin 7 and the driving circuit 63 are connected through the connection structure 64. For example, the area of ​​the orthogonal projection of the pin 7 on the substrate 61 is greater than the area of ​​the orthogonal projection of the connection structure 64 on the substrate 61, and the orthogonal projection of the pin 7 on the substrate 61 covers the orthogonal projection of the connection structure 64 on the substrate 61.

[0071] The aforementioned driving circuit 63 includes a plurality of thin-film transistors and at least one storage capacitor. Each thin-film transistor includes a gate, a source, and a drain. One of the plurality of pins 7 is connected to the source of one of the plurality of thin-film transistors to provide the driving circuit 63 with a data driving signal transmitted from the display backplane in the display panel. The driving circuit 63 may specifically include a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer stabilizing layer, a source-drain layer, and a planarization layer 62, which are stacked sequentially on one side of the substrate 61. The third electrode 3 and the fourth electrode 4 are located on the side of the planarization layer 62 away from the substrate 61. The active layer includes multiple active patterns corresponding to multiple thin-film transistors, and each active pattern includes a source region, a drain region, and a channel region. The source and drain of the thin-film transistors are located in the source-drain layer, and the source and source regions of the thin-film transistors are connected, and the drain and drain regions of the thin-film transistors are connected. The first gate layer includes multiple gate patterns corresponding to multiple thin-film transistors, and the channel region is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate 61 and the orthographic projection of the active pattern on the substrate 61. Since the specific structure of the driving circuit 63 is similar to the design concept of the driving circuit 63 in related technologies, it will not be described in detail here.

[0072] This disclosure also provides a display panel, which includes at least a display backplate and a plurality of the aforementioned light-emitting components arranged in an array on one side of the display backplate; wherein the display backplate is used to provide driving signals to a driving unit through a plurality of pins 7 in the light-emitting components, so that the driving unit drives the light-emitting components to emit light. The structure of the aforementioned light-emitting components will not be described in detail here.

[0073] In this embodiment, the complex driving circuit 63 is separated from the display substrate. The driving substrate only needs to be set with basic data lines, and there is no need to perform complex wiring of the driving circuit 63. The wiring structure on the driving substrate is very simple, and the wiring difficulty of the driving substrate is reduced exponentially, which also reduces the difficulty of processing and manufacturing, and is conducive to industrial development.

[0074] This disclosure also provides a method for preparing a light-emitting component, the process of which is as follows: Figure 6 As shown, steps S601 to S602 are included:

[0075] S601, the anisotropic conductive adhesive film to be compressed, the light-emitting unit, and the driving unit are pressed together to obtain a bonded light-emitting component. The pressed anisotropic conductive adhesive film includes: a first filling portion 10, a second filling portion 8, and a third filling portion 9. The first filling portion 10 surrounds the second filling portion 8 and the third filling portion 9, and the thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the third filling portion 9. The second filling portion 8 is located between the first electrode 1 of the light-emitting unit and the third electrode 3 of the driving unit, and is in contact with the first electrode 1 and the third electrode 3 respectively. The third filling portion 9 is located between the second electrode 2 of the light-emitting unit and the fourth electrode 4 of the driving unit, and is in contact with the second electrode 2 and the fourth electrode 4 respectively.

[0076] S602, the bonded light-emitting components are placed in an electroplating solution for electroplating to obtain a light-emitting component with multiple pins 7 on the driving unit.

[0077] In the bonding process of the light-emitting unit and the driving unit in this embodiment, an anisotropic conductive film bonding method is used. The anisotropic conductive film can serve two purposes: (1) the bonding position serves as the circuit connection between the LED and the backplane; (2) the anisotropic conductive film at the non-bonding position is non-conductive and serves as an encapsulation and isolation function to prevent the electroplating solution from immersing between the light-emitting unit and the driving unit during the electroplating process of preparing the pin 7, thus playing a role in corrosion prevention.

[0078] Furthermore, although exemplary embodiments have been described herein, their scope includes any and all embodiments based on this disclosure that have equivalent elements, modifications, omissions, combinations (e.g., schemes involving intersections of various embodiments), adaptations, or alterations. Elements in the claims will be interpreted broadly based on the language used in the claims and are not limited to the examples described in this specification or during the implementation of this application, and such examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered illustrative only, and the true scope and spirit are indicated by the full scope of the following claims and their equivalents.

[0079] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more thereof) can be used in combination with each other. Other embodiments may be used by those skilled in the art upon reading the above description. Furthermore, in the above detailed description, various features may be grouped together to simplify the disclosure. This should not be construed as an intention that a feature of the disclosure that is not claimed is necessary for any claim. Rather, the subject matter of this disclosure may be less than all the features of a particular disclosed embodiment. Thus, the following claims are incorporated herein by reference as examples or embodiments, wherein each claim is an independent, separate embodiment, and these embodiments are contemplated to be combined with each other in various combinations or arrangements. The scope of this disclosure should be determined by reference to the appended claims and the full scope of their equivalents.

[0080] The foregoing has provided a detailed description of several embodiments of this disclosure. However, this disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications based on the concept of this disclosure, and all such variations and modifications should fall within the scope of protection claimed by this disclosure.

Claims

1. A light-emitting component, characterized in that, include: A light-emitting unit, the light-emitting unit comprising a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; A driving unit, comprising a third electrode, a fourth electrode, and a driving section, wherein the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode are respectively electrically connected to the driving circuit in the driving section, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode; Multiple pins, all of which are located on the side of the driving unit away from the light-emitting unit and are electrically connected to the driving circuit; The light-emitting unit and the driving unit include a first filling portion, a second filling portion, and a third filling portion; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode and the third electrode, and is in contact with the first electrode and the third electrode respectively; the third filling portion is located between the second electrode and the fourth electrode, and is in contact with the second electrode and the fourth electrode respectively. The first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; The first filling portion is in direct contact with the second filling portion; The first filling portion is in direct contact with the third filling portion; A portion of the first filling portion is located between the second filling portion and the third filling portion; The light-emitting component includes a transparent substrate, which is located on the side of the light-emitting unit away from the driving substrate; The light-emitting unit includes a light-emitting part, and the light-emitting part includes: The raised electrode, the first insulating layer, and the first doped layer, the multiple quantum well layer, and the second doped layer are sequentially stacked in the direction away from the transparent substrate; The first filling portion includes a first sub-filling portion and a second sub-filling portion; The orthographic projection of the first sub-filling portion on the plane of the transparent substrate does not overlap with the orthographic projection of the light-emitting unit on the plane of the transparent substrate; Wherein, the second sub-fill portion is at least partially located between the raised electrode and the multi-quantum well layer, and the first sub-fill portion is disposed around the entire raised electrode, the multi-quantum well layer, and the second sub-fill portion; The thickness of the first sub-filling portion is greater than or equal to the distance between the first insulating layer and the driving portion; The thickness of the second sub-filling portion is equal to the maximum distance between the first insulating layer and the driving portion.

2. The light-emitting component according to claim 1, characterized in that, At least one of the plurality of pins includes a first metal layer and a second metal layer stacked together, wherein the first metal layer is located between the second metal layer and the driving unit; The first metal layer is made of nickel, and the second metal layer is made of gold.

3. The light-emitting component as described in claim 1, characterized in that, The density of the first filling portion is less than the density of the second filling portion; The density of the first filling portion is less than the density of the third filling portion.

4. The light-emitting component as described in claim 1, characterized in that, The light-emitting component includes a transparent substrate, which is located on the side of the light-emitting unit away from the driving substrate; The first filling portion is projected onto the plane of the transparent substrate and lies within the transparent substrate.

5. The light-emitting component as described in claim 4, characterized in that, The outer contour of the first filling portion, projected onto the plane of the transparent substrate, coincides with the outer contour of the transparent substrate.

6. The light-emitting component as described in claim 1, characterized in that, The second electrode is located on the side of the second doped layer away from the multiple quantum well layer, and the second doped layer is electrically connected to the second electrode; The raised electrode is located between the first doped layer and the first electrode, and is electrically connected to the first doped layer and the first electrode respectively; The first insulating layer is located on the side of the first doped layer away from the transparent substrate and is in contact with the first doped layer.

7. The light-emitting component as described in claim 1, characterized in that, The first sub-filling portion includes at least the portion located between the transparent substrate and the driving portion; The relationship between the thickness T1 of the portion located between the transparent substrate and the driving part and the thickness T2 of the second sub-filling part satisfies: 0.5T1 <T2<0.95T1。 8. The light-emitting component as described in any one of claims 1 to 7, characterized in that, The light-emitting component includes a plurality of light-emitting units and a driving unit corresponding to the plurality of light-emitting units; the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit, and a third color light-emitting unit, wherein the first color, the second color, and the third color are different from each other; The light-emitting unit includes a color filter layer (1014), a color transfer layer, and a light-emitting part, which are sequentially stacked in a direction away from the transparent substrate; the light-emitting part emits blue light. The light-emitting part includes a first light-emitting part, a second light-emitting part, and a third light-emitting part. The first light-emitting part is located in the first color light-emitting unit, the second light-emitting part is located in the second color light-emitting unit, and the third light-emitting part is located in the third color light-emitting unit.

9. The light-emitting component according to any one of claims 1 to 7, characterized in that, The driving unit further includes a substrate and a connection structure. The substrate has a connection via, the connection structure is located within the connection via, and the driving circuit is located on one side of the substrate. The pin is located on the side of the substrate away from the driving circuit, and the pin is in contact with the connection structure. The pin and the driving circuit are connected through the connection structure.

10. The light-emitting component according to claim 9, characterized in that, The driving circuit includes a plurality of thin-film transistors and at least one storage capacitor, each of the thin-film transistors including a gate, a source and a drain; One of the plurality of pins is connected to the source of one of the plurality of thin-film transistors, for providing the driving circuit with a data driving signal transmitted from the display backplane in the display panel.

11. The light-emitting component according to claim 10, characterized in that, The driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer stabilizing layer, a source / drain layer, and a planarization layer, all stacked sequentially on one side of the substrate; the third electrode and the fourth electrode are located on the side of the planarization layer away from the substrate. The active layer includes multiple active patterns corresponding to the plurality of thin-film transistors, and each active pattern includes a source region, a drain region, and a channel region. The source and drain of the thin-film transistor are located in the source-drain layer, the source and the source region of the thin-film transistor are connected, and the drain and the drain region of the thin-film transistor are connected. The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin-film transistors, and the channel region is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate and the orthographic projection of the active pattern on the substrate.

12. The light-emitting component according to claim 9, characterized in that, The area of ​​the orthogonal projection of the pin on the substrate is greater than the area of ​​the orthogonal projection of the connection structure on the substrate, and the orthogonal projection of the pin on the substrate covers the orthogonal projection of the connection structure on the substrate.

13. A display panel, characterized in that, The display panel includes a display back panel and a plurality of light-emitting components as described in any one of claims 1 to 12, located on one side of the display back panel and arranged in an array. The display backplane is used to provide driving signals to the driving unit through multiple pins in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

14. A method for preparing a light-emitting component, used to prepare the light-emitting component according to any one of claims 1 to 12, characterized in that, include: An anisotropic conductive adhesive film, a light-emitting unit, and a driving unit are pressed together to obtain a bonded light-emitting component. The pressed anisotropic conductive adhesive film includes a first filling portion, a second filling portion, and a third filling portion. The first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion. The second filling portion is located between a first electrode of the light-emitting unit and a third electrode of the driving unit, and is in contact with both the first electrode and the third electrode. The third filling portion is located between a second electrode of the light-emitting unit and a fourth electrode of the driving unit, and is in contact with both the second electrode and the fourth electrode. The bonded light-emitting components are placed in a target solution for electroplating or chemical plating processes to obtain a light-emitting component with multiple pins on the driving unit.

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