A method for manufacturing a liquid cooling plate for energy storage

Abstract

The present invention relates to a method for manufacturing a liquid cooling plate for energy storage, which comprises the following steps in sequence: step S1, blank preparation; step S2, surface pretreatment; step S3, solder resist treatment; step S4, diffusion welding; step S5, liquid filling molding; step S6, shape processing; step S7, making inlet and outlet holes; step S8, cleaning and drying; step S9, sealing the liquid filling port; step S10, and welding the inlet and outlet nozzles.

Description

Technical Field

[0001] The present invention relates to the technical field related to liquid cooling plate processing, and in particular to a method for manufacturing a liquid cooling plate for energy storage. Background Art

[0002] Liquid cooling technology, due to its efficient heat dissipation and low energy consumption, is becoming a mainstream technology in the energy storage field. It is primarily used in liquid-cooled containerized energy storage systems and lithium battery energy storage systems. Compared to traditional air cooling, liquid cooling technology offers superior heat dissipation efficiency, temperature uniformity, and energy consumption. It effectively controls battery system temperature, improves battery reliability, and reduces energy consumption, thereby extending battery life and increasing system stability and reliability.

[0003] After extensive searching, I discovered Chinese patent publication number CN115295928B, which discloses a composite liquid cooling plate for heat dissipation in battery systems and its preparation method. The composite liquid cooling plate comprises: a liquid cooling plate body and a carbon coating disposed on the liquid cooling plate body; the liquid cooling plate body is made of aluminum, and the carbon coating is made of a graphene-carbon nanotube composite material; the liquid cooling plate body comprises a lower cold plate, an upper cold plate, and a liquid inlet and outlet disposed on the lower cold plate; the upper cold plate is disposed above the lower cold plate, and the carbon coating is disposed on the upper top surface of the upper cold plate; the lower cold plate is provided with a groove, the bottom surface and two side surfaces of the groove forming a flow channel with the lower bottom surface of the upper cold plate, and the flow channel is filled with coolant, and the liquid inlet, flow channel, and liquid outlet are connected in sequence to form a loop. By providing a carbon coating on the liquid cooling plate body, the present invention can quickly dissipate heat from the battery system, which has a positive effect on the performance and safety of the battery system.

[0004] In summary, the primary process for existing liquid cooling plates for energy storage is brazing. The cooling channels are manufactured using profile extrusion and sheet metal stamping processes, and the cover and cooling channel plates are brazed together to form an integrated structure. The main disadvantages of brazing liquid cooling plates are high cost, poor sealing and corrosion resistance of the brazed welds, and the brazing material's tendency to react with certain cooling media, limiting its application. Furthermore, the chemicals used in the brazing process pose risks to the environment and worker health.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a manufacturing method for liquid cooling plates for energy storage, making them more valuable for industrial use. Summary of the Invention

[0006] In order to solve any of the above technical problems, an object of the present invention is to provide a method for manufacturing a liquid cooling plate for energy storage.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A method for manufacturing a liquid cooling plate for energy storage, wherein the liquid cooling plate comprises, from top to bottom, a cover plate and a cooling plate, wherein an inlet nozzle and an outlet nozzle are respectively installed on both sides of a diagonal line of the cover plate, and a cooling channel is opened on the cooling plate, wherein the inlet nozzle and the outlet nozzle are respectively connected to the inlet and outlet holes of the cooling channel;

[0009] The manufacturing method of the liquid cooling plate comprises the following steps in sequence:

[0010] Step S1, blank preparation:

[0011] Cutting the rolled cover plates and cooling plates;

[0012] Step S2: surface pretreatment:

[0013] Remove burrs or spatter from the edge cover and cooling plate after cutting, and then remove the oxide layer on the surface of the cover and cooling plate;

[0014] Step S3: solder mask treatment:

[0015] Apply solder resist to the second solder resist area at the cooling channel of the cooling plate and the first solder resist area of ​​the cover plate directly above the second solder resist area;

[0016] Step S4, diffusion welding:

[0017] The cover plate and the cooling plate are buckled together to form a liquid cooling plate blank. The solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the reserved liquid filling port of the liquid cooling plate blank. Then, the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding.

[0018] Step S5: Liquid filling and molding:

[0019] The liquid-cooling plate blank is clamped and positioned using a liquid-filling molding machine and a liquid-expansion tooling. A liquid-filling interface is provided on the liquid-filling molding machine or the hydraulic tooling. Liquid is filled into the liquid-cooling plate blank through the liquid-filling port reserved in the liquid-cooling plate blank to form the cooling channel and fit the mold forming surface.

[0020] Step S6: shape processing:

[0021] Remove excess from the liquid cooling plate blank and remove edge burrs;

[0022] Step S7: Making the inlet and outlet holes:

[0023] The cooling inlet and outlet holes are made by drilling and milling on the flat side of the liquid cooling plate blank, and burrs are removed and excess debris is cleaned;

[0024] Step S8, cleaning and drying:

[0025] Clean the inner and outer surfaces of the parts with degreaser water and dry them;

[0026] Step S9: sealing the liquid filling port:

[0027] The reserved liquid filling port of the liquid cooling plate blank is sealed by welding;

[0028] Step S10: Welding the inlet and outlet nozzles:

[0029] The inlet nozzle and outlet nozzle connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.

[0030] As a further improvement of the present invention, the method further includes step S11, leak detection: connecting the inlet nozzle and the outlet nozzle, and detecting the reliability of welds at various locations of the liquid cooling plate using a hydraulic or airtight method.

[0031] As a further improvement of the present invention, step S12 is further included, surface post-treatment: the surface of the liquid cooling plate is subjected to sand blasting treatment, requiring the surface state to be uniform, and the surface of the energy storage cell is subjected to insulation treatment.

[0032] As a further improvement of the present invention, in step S1 and step S6, laser cutting or punching is adopted.

[0033] As a further improvement of the present invention, in step S2, the oxide layer on the surface of the cover plate and the cooling plate is removed by acid washing or alkaline washing or a combination of the two.

[0034] As a further improvement of the present invention, in step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes but is not limited to boron nitride and graphite.

[0035] As a further improvement of the present invention, the diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 - 2 Pa.

[0036] As a further improvement of the present invention, the molding pressure in step S5 is 30-150 MPa.

[0037] As a further improvement of the present invention, the mold in step S5 includes a mold upper plate and a mold lower plate from top to bottom, the liquid cooling plate blank is located between the mold upper plate and the mold lower plate, and filling nozzles compatible with the filling ports reserved for the liquid cooling plate blank are installed on the left and right sides of the mold lower plate. A mold flushing channel compatible with the above-mentioned cooling channel is opened on the mold lower plate directly below the cooling channel on the cooling plate, and the cooling channel fits the mold flushing channel during molding.

[0038] As a further improvement of the present invention, in step S9, argon arc welding or brazing is used to seal the liquid filling port reserved for the liquid cooling plate blank; in step S10, argon arc welding, laser welding or brazing is used to weld the inlet nozzle and the outlet nozzle.

[0039] By means of the above solution, the present invention has at least the following advantages:

[0040] The present invention can ensure reliable welding quality and good corrosion resistance of the liquid cooling plate for energy storage, and is applicable to large-scale and batch production.

[0041] The production process of the present invention is relatively environmentally friendly and can greatly reduce the risks of chemicals to the environment and workers' health during the welding process.

[0042] The present invention can be applied to the processing and use of liquid cooling plates including but not limited to aluminum and aluminum alloys, stainless steel, copper and copper alloys, titanium and titanium alloys, etc.

[0043] The present invention is also applicable to the interface form of the cooling liquid in the side-opening structure.

[0044] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0046] Figure 1 This is a schematic flow chart of a method for manufacturing a liquid cooling plate for energy storage according to the present invention;

[0047] Figure 2 It is a structural schematic diagram of the front side of the liquid cooling plate of the present invention;

[0048] Figure 3 It is a structural schematic diagram of the back side of the liquid cooling plate of the present invention;

[0049] Figure 4 yes Figure 2 Cross-sectional view of the liquid cooling plate;

[0050] Figure 5 This is a schematic diagram of the solder resist treatment of the cover plate in step 3 of the present invention;

[0051] Figure 6 This is a schematic diagram of the solder resist treatment of the cooling plate in step 3 of the present invention;

[0052] Figure 7 This is a schematic diagram of the liquid-forming mold in step 5 of the present invention before processing;

[0053] Figure 8 It is a schematic diagram of the liquid-forming mold during processing in step 5 of the present invention.

[0054] The meanings of the reference numerals in the figures are as follows.

[0055] Cover plate 1, inlet nozzle 2, outlet nozzle 3, cooling plate 4, cooling channel 5, first solder resist area 6, second solder resist area 7, mold upper plate 8, mold lower plate 9, mold flushing channel 10, and liquid filling nozzle 11. DETAILED DESCRIPTION

[0056] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0057] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0058] Example

[0059] like Figures 1 to 8 As shown,

[0060] A method for manufacturing a liquid cooling plate for energy storage, the liquid cooling plate comprising, from top to bottom, a cover plate 1 and a cooling plate 4, an inlet nozzle 2 and an outlet nozzle 3 being mounted on both sides of a diagonal line of the cover plate 1, a cooling channel 5 being formed on the cooling plate 4, the inlet nozzle 2 and the outlet nozzle 3 being connected to the inlet and outlet holes of the cooling channel 5, respectively;

[0061] The manufacturing method of the liquid cooling plate comprises the following steps in sequence:

[0062] Step S1, blank preparation:

[0063] Cutting the rolled cover plate 1 and cooling plate 4;

[0064] Step S2: surface pretreatment:

[0065] Remove burrs or spatter from the edge of the cover plate 1 and the cooling plate 4 after cutting, and then remove the oxide layer on the surface of the cover plate 1 and the cooling plate 4;

[0066] Step S3: solder mask treatment:

[0067] Solder resist is applied to the second solder resist area 7 at the cooling channel 5 of the cooling plate 4 and the first solder resist area 6 of the cover plate 1 directly above the second solder resist area 7 ;

[0068] Step S4, diffusion welding:

[0069] The cover plate 1 and the cooling plate 4 are buckled together to form a liquid cooling plate blank, and solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the reserved liquid filling port of the liquid cooling plate blank. Then, the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding;

[0070] Step S5: Liquid filling and molding:

[0071] The liquid-cooling plate blank is clamped and positioned using a liquid filling molding machine and a liquid expansion tooling. A liquid filling interface is provided on the liquid filling molding machine or the hydraulic tooling. Liquid is filled into the liquid-cooling plate blank through the liquid filling port reserved in the liquid-cooling plate blank to form the cooling channel 5 and fit the mold forming surface.

[0072] Step S6: shape processing:

[0073] Remove excess from the liquid cooling plate blank and remove edge burrs;

[0074] Step S7: Making the inlet and outlet holes:

[0075] The cooling inlet and outlet holes are made by drilling and milling on the flat side of the liquid cooling plate blank, and burrs are removed and excess debris is cleaned;

[0076] Step S8, cleaning and drying:

[0077] Clean the inner and outer surfaces of the parts with degreaser water and dry them;

[0078] Step S9: sealing the liquid filling port:

[0079] The reserved liquid filling port of the liquid cooling plate blank is sealed by welding;

[0080] Step S10: Welding the inlet and outlet nozzles:

[0081] The inlet nozzle 2 and the outlet nozzle 3 connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.

[0082] Preferably, the method further includes step S11, leak detection: connecting the inlet nozzle 2 and the outlet nozzle 3, and detecting the reliability of the welds at various locations of the liquid cooling plate using a hydraulic or airtight method.

[0083] Preferably, the method further includes step S12, surface post-treatment: performing sandblasting treatment on the surface of the liquid cooling plate, requiring the surface state to be uniform, and performing insulation treatment on the surface of the energy storage cell.

[0084] Preferably, in step S1 and step S6, laser cutting or punching is adopted.

[0085] Preferably, in step S2, the oxide layers on the surfaces of the cover plate 1 and the cooling plate 4 are removed by acid washing or alkali washing or a combination of the two.

[0086] Preferably, in step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes but is not limited to boron nitride and graphite.

[0087] Preferably, the diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 -2 Pa.

[0088] Preferably, the molding pressure in step S5 is 30-150 MPa.

[0089] Preferably, the mold in step S5 includes a mold upper plate 8 and a mold lower plate 9 from top to bottom, the liquid-cooled plate blank is located between the mold upper plate 8 and the mold lower plate 9, and liquid filling nozzles 11 adapted to the liquid filling ports reserved for the liquid-cooled plate blank are installed on the left and right sides of the mold lower plate 9. A mold flushing channel 10 adapted to the above-mentioned cooling channel 5 is provided on the mold lower plate 9 directly below the cooling channel 5 on the cooling plate 4, and the cooling channel 5 fits the mold flushing channel 10 during molding.

[0090] Preferably, in step S9, argon arc welding or brazing is used to seal the liquid filling port reserved for the liquid cooling plate blank; in step S10, argon arc welding, laser welding or brazing is used to weld the inlet nozzle 2 and the outlet nozzle 3.

[0091] The first embodiment of the present invention:

[0092] The liquid cooling plate is a hollow structure, which is divided into a cover plate 1 and a cooling plate 4. Figure 2 and Figure 3As shown in the figure, the cover plate 1 and cooling plate 4 are both blanked from flat sheets before processing, manufactured by punching or laser cutting. Solder resist or other materials are applied or printed to the corresponding hollow areas within the assembly. The components are then interlocked based on their outer shapes and diffusion welded to form a single unit. The hollow areas are then expanded using a liquid-filling process along the reserved liquid filling ports. Finally, excess material is removed by punching or laser cutting. The inlet and outlet nozzles 2 and 3 are then welded and leak-tested.

[0093] 1. Preparation of cover plate and cooling plate blanks

[0094] The rolled sheet is cut by laser or punched out, with a certain process margin reserved for the shape.

[0095] 2. Surface pretreatment

[0096] Remove burrs or spatter from the edges of blanks produced by punching or laser cutting, and then remove the oxide layer on the surface of the sheet by pickling or alkali washing.

[0097] 3. Solder mask treatment

[0098] By using a template or glue engraving method, solder resist is applied to the area of ​​the cover plate and the cooling plate corresponding to the cooling channel. The solder resist materials include boron nitride, graphite, etc. The solder resist diagram is as follows Figure 5 and 6 .

[0099] 4. Diffusion welding

[0100] The cover plate and cooling plate are fastened together to form a liquid cooling plate blank. Solder resist is evenly applied to the upper and lower surfaces to prevent adhesion to tooling and parts during welding. Multiple layers can be placed in a single furnace. The liquid cooling plate blank is then loaded into the diffusion bonding equipment, centered in the main cylinder or pressure head. A monitoring thermocouple is placed in the center of the part or tooling before welding begins. Different parameters are set for different materials, and diffusion bonding is completed under specific conditions: temperature, pressure, time, and environment (vacuum or inert gas).

[0101] The following are some common welding parameters for materials:

[0102] 1) 3 series aluminum alloy (taking 3003 as an example), welding temperature: 580~600℃; welding pressure: 6~10 MPa; welding time: 360~480 min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0103] 2) 5 series aluminum alloy (taking 5A06 as an example), welding temperature: 560℃; welding pressure: 4~6MPa; welding time: 240~360min; welding environment: argon protection or vacuum degree greater than 6×10-2Pa.

[0104] 3) 6 series aluminum alloy (taking 6061 as an example), welding temperature: 530~550℃; welding pressure: 4~6 MPa; welding time: 240~360 min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0105] 4) 304 stainless steel, welding temperature: 1040~1060℃; welding pressure: 15~20 MPa; welding time: 240~360min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0106] 5) 316 stainless steel, welding temperature: 1080~1100℃; welding pressure: 15~20 MPa; welding time: 240~360min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0107] 6) Copper, welding temperature: 940~960℃; welding pressure: 4~6 MPa; welding time: 240~360 min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0108] 7) Titanium alloy (taking TA1 as an example), welding temperature: 880~900℃; welding pressure: 4~6 MPa; welding time: 240~360 min; welding environment: argon protection or vacuum greater than 6×10-2Pa.

[0109] 5. Liquid filling molding

[0110] The liquid cooling plate blank is clamped and positioned using a liquid filling molding machine and a liquid expansion tooling. The liquid filling molding machine or tooling is equipped with a liquid filling interface. Liquid is filled into the liquid cooling plate blank through the reserved liquid filling port (weld resist treatment is performed here before welding) to form the cooling channel and fit the mold surface. The pressure is generally 30-150MPa (pressure depends on the material and plate thickness). The filling pressure matches the pressure of the liquid filling molding machine, that is, the internal pressure of the liquid cooling plate should be less than the pressure applied by the pressure platform of the liquid filling molding machine. See the liquid filling mold. Figure 7 and 8 .

[0111] The following are some common liquid molding parameters for materials:

[0112] 1) 3 series aluminum alloy (taking 3003 as an example), the sheet thickness is 1mm, the forming pressure is 40~100 MPa, and the forming time is 2~5 minutes.

[0113] 2) 5 series aluminum alloy (taking 5A06 as an example), the sheet thickness is 1 mm, the forming pressure is 40~100 MPa, and the forming time is 2~5 min.

[0114] 3) 6 series aluminum alloy (taking 6061 as an example), the sheet thickness is 1 mm, the forming pressure is 40~100 MPa, and the forming time is 2~5 min.

[0115] 4) 304 stainless steel, sheet thickness is 1mm, forming pressure is 60~120 MPa, and forming time is 3~5 minutes.

[0116] 5) 316 stainless steel, sheet thickness is 1mm, forming pressure is 80~150 MPa, and forming time is 3~5 minutes.

[0117] 6) Red copper, sheet thickness is 1 mm, forming pressure is 60-80 MPa, and forming time is 3-5 min.

[0118] 7) Titanium alloy (taking TA1 as an example), the plate thickness is 1 mm, the forming pressure is 80~150 MPa, and the forming time is 5~10 min.

[0119] 6. Shape processing

[0120] Use cutting methods such as punching dies or laser cutting to remove the excess of the blank shape and remove impurities such as edge burrs.

[0121] 7. Make inlet and outlet holes

[0122] The cooling inlet and outlet are made by drilling and milling on the flat side of the liquid cooling plate, and burrs are removed and excess materials are cleaned.

[0123] 8. Cleaning and drying

[0124] Connect the cleaning equipment, clean the inner and outer surfaces of the parts with degreaser water, and dry them.

[0125] 9. Seal the filling port

[0126] Use argon arc welding, brazing and other methods to seal the liquid filling port.

[0127] 10. Welding inlet and outlet nozzles

[0128] The inlet and outlet nozzles of the radiator are welded to the inlet and outlet holes of the liquid cooling plate by argon arc welding, laser welding, brazing, etc.

[0129] 11. Leak detection

[0130] Connect the inlet and outlet nozzles at the inlet and outlet holes, and use hydraulic or airtight methods to test the reliability of the welds at various locations on the liquid cooling plate.

[0131] 12. Surface treatment

[0132] The surface of the liquid cooling plate is sandblasted or otherwise treated, requiring the surface to be uniform and consistent, and the surface of the energy storage cell is insulated.

[0133] The present invention can ensure reliable welding quality and good corrosion resistance of the liquid cooling plate for energy storage, and is applicable to large-scale and batch production.

[0134] The production process of the present invention is relatively environmentally friendly and can greatly reduce the risks of chemicals to the environment and workers' health during the welding process.

[0135] The present invention can be applied to the processing and use of liquid cooling plates including but not limited to aluminum and aluminum alloys, stainless steel, copper and copper alloys, titanium and titanium alloys, etc.

[0136] The present invention is also applicable to the interface form of the cooling liquid in the side-opening structure.

[0137] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0138] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0139] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for manufacturing a liquid cooling plate for energy storage, wherein the liquid cooling plate comprises, from top to bottom, a cover plate (1) and a cooling plate (4), an inlet nozzle (2) and an outlet nozzle (3) are respectively installed on both sides of a diagonal line on the cover plate (1), a cooling channel (5) is opened on the cooling plate (4), and the inlet nozzle (2) and the outlet nozzle (3) are respectively connected to the inlet and outlet holes of the cooling channel (5); Its characteristics are: The manufacturing method of the liquid cooling plate comprises the following steps in sequence: Step S1, blank preparation: Cutting the rolled cover plate (1) and cooling plate (4); Step S2: surface pretreatment: removing burrs or spatter from the edge of the cover plate (1) and the cooling plate (4) after cutting, and then removing the oxide layer on the surface of the cover plate (1) and the cooling plate (4); Step S3: solder mask treatment: Applying solder resist to the second solder resist area (7) at the cooling channel (5) of the cooling plate (4) and the first solder resist area (6) of the cover plate (1) directly above the second solder resist area (7); Step S4, diffusion welding: The cover plate (1) and the cooling plate (4) are buckled together to form a liquid cooling plate blank, solder resist is evenly applied on the upper and lower surfaces of the liquid cooling plate blank and the liquid filling port reserved for the liquid cooling plate blank, and then the liquid cooling plate blank is placed in a diffusion welding device for diffusion welding; Step S5: Liquid filling and molding: The liquid-cooling plate blank is clamped and positioned using a liquid-filling molding machine and a liquid expansion tooling, and a liquid-filling interface is provided on the liquid-filling molding machine or the hydraulic tooling, and liquid is filled into the liquid-cooling plate blank through the liquid-filling port reserved in the liquid-cooling plate blank to form the cooling channel (5) and fit the mold forming surface; Step S6: shape processing: Remove excess from the liquid cooling plate blank and remove edge burrs; Step S7: Making the inlet and outlet holes: The cooling inlet and outlet holes are made by drilling and milling on the flat side of the liquid cooling plate blank, and burrs are removed and excess debris is cleaned; Step S8, cleaning and drying: Clean the inner and outer surfaces of the parts with degreaser water and dry them; Step S9: sealing the liquid filling port: The reserved liquid filling port of the liquid cooling plate blank is sealed by welding; Step S10: Welding the inlet and outlet nozzles: The inlet nozzle (2) and the outlet nozzle (3) connected to the radiator are respectively welded to the inlet and outlet holes of the liquid cooling plate blank.

2. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: The method further includes step S11, leak detection: connecting the inlet nozzle (2) and the outlet nozzle (3), and detecting the reliability of the welds at various locations of the liquid cooling plate using a hydraulic or airtight method.

3. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: The process also includes step S12, surface post-processing: performing sandblasting on the surface of the liquid cooling plate, requiring the surface state to be uniform, and performing insulation treatment on the surface of the energy storage cell.

4. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: In step S2, the oxide layer on the surface of the cover plate (1) and the cooling plate (4) is removed by acid washing or alkali washing or a combination of the two.

5. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: In step S3, the solder resist is applied by using a template or a glue-coated pattern, and the solder resist includes boron nitride and graphite.

6. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: The diffusion welding processing conditions in step S4 are as follows: welding temperature: 530-1100°C; welding pressure: 4-20 MPa; welding time: 240-480 min; welding environment: argon protection or vacuum greater than 6×10 -2 Pa.

7. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: The molding pressure in step S5 is 30-150 MPa.

8. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: The mold in step S5 includes a mold upper plate (8) and a mold lower plate (9) from top to bottom, the liquid cooling plate blank is located between the mold upper plate (8) and the mold lower plate (9), and liquid filling nozzles (11) adapted to the liquid filling ports reserved for the liquid cooling plate blank are installed on both the left and right sides of the mold lower plate (9), and a mold flushing channel (10) adapted to the above-mentioned cooling channel (5) is opened on the mold lower plate (9) directly below the cooling channel (5) on the cooling plate (4), and the cooling channel (5) fits the mold flushing channel (10) during molding.

9. The method for manufacturing a liquid cooling plate for energy storage according to claim 1, wherein: In step S9, argon arc welding or brazing is used to seal the reserved liquid filling port of the liquid cooling plate blank; in step S10, argon arc welding, laser welding or brazing is used to weld the inlet nozzle (2) and the outlet nozzle (3).

Images