Matrix material for diamond cutter head, sharp diamond uniformly distributed saw blade and preparation process thereof
By using a specific ratio of matrix material and diamond segment structure design, the problem of decreased holding force caused by binder volatilization is solved, and efficient cutting and durability of the diamond saw blade are achieved.
Patent Information
- Application Number
- CN202411000052.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2044-07-24
AI Technical Summary
During the sintering process of existing diamond saw blades, the volatilization of the binder causes gaps to form between the diamond particles and the matrix powder, reducing the holding force of the matrix material on the diamond particles, resulting in premature wear of the saw blade and reduced cutting efficiency.
Dendritic electrolytic copper powder, cobalt powder, tin powder and copper-tin alloy are used as the matrix material. By adjusting their content, the holding force and self-sharpening property of diamond particles are improved. Inward concave structure and cross drainage grooves are set on the diamond bit to facilitate the discharge of debris and cooling water.
It improves the positioning accuracy and retention of diamond particles, enhances the self-sharpening and cutting efficiency of the saw blade, reduces cutting resistance and heat accumulation, and extends the service life of the saw blade.
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Figure CN119101823B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of diamond tools, and more specifically, to a matrix material for a diamond cutter head, a sharp diamond uniformly distributed saw blade, and a preparation process thereof. Background Art
[0002] Diamond saw blades are widely used in mechanical processing for buildings, bridges, and pavements, including cutting brittle and hard materials like stone and concrete. Diamond saw blades primarily consist of a circular base and a diamond segment welded to the base. The diamond segment is typically composed of a matrix alloy and a certain proportion of diamond particles. During use, the diamond segment performs the cutting function, and the segment is continuously consumed during the cutting process. The diamonds within the segment perform the cutting function, utilizing the matrix alloy's grip on the diamond particles to achieve cutting of stone and other materials. In order to improve the cutting performance and service life of diamond saw blades and reduce their production costs, increasing the grip between the matrix alloy and the diamond particles has been a hot topic of research.
[0003] In the prior art, the Chinese invention patent with application number CN2018108838299 discloses a method for orderly arrangement of diamonds in a diamond saw blade segment, comprising the following steps: S1: raw material mixing: selecting a certain amount of matrix powder, passing the matrix powder into a stirring device for stirring, and after stirring, passing the matrix powder into a high-speed mixer, and passing a binder and a solvent into the high-speed mixer to obtain a mixture; S2: thin layer preparation: passing the mixture described in S1 into a drying box and drying it. After drying, the mixture is passed into a rolling machine to obtain a thin layer; S3: template preparation: selecting a diamond plate, and sequentially excavating gourd holes with spacings of 2, 3, 4, and 5 mm around the diamond plate; S4: size measurement: determining the size of the orderly arrangement of diamonds, and selecting gourd holes with appropriate spacings described in S3.
[0004] In the above-mentioned diamond cutter head, a binder is used to combine the diamond and matrix powder and then arrange them evenly. Since the binder is mostly organic, it will volatilize at a higher sintering temperature. Due to the volatilization of the binder during the sintering process, a gap is formed between the diamond particles and the matrix powder. This gap will cause the matrix powder to reduce its grip on the diamond particles, causing the matrix material to wear and fall off prematurely, and it is impossible to obtain good self-sharpening and cutting efficiency. Summary of the Invention
[0005] In order to improve the precise grip of diamond particles by the matrix material, prevent the diamond particles from sliding, and achieve precise positioning of the diamond particles, the present application provides a matrix material for a diamond cutter head, a sharp diamond uniformly distributed saw blade, and a preparation process thereof.
[0006] In a first aspect, the present application provides a matrix material for a diamond bit, which adopts the following technical solution:
[0007] A matrix material for a diamond tool head comprises the following raw materials in percentage by weight: 50-60% of dendritic electrolytic copper powder, 20-40% of copper-tin alloy, 0-5% of cobalt powder, 0-15% of tin powder and 5-10% of iron powder.
[0008] By adopting the above technical solution, dendritic electrolytic copper powder is used, which can prevent the rolling of diamond particles during the uniform distribution of diamond particles, so that the diamond particles can be accurately positioned. By adjusting the content of copper-tin alloy and tin powder, the strength and brittleness of the matrix can be adjusted, the self-sharpening property of the matrix material can be improved, the cutting speed of the diamond can be increased, and the sharpness of the diamond can be increased. The cobalt powder can improve the retention of the matrix material on the diamond particles, making the diamond less likely to fall off. Moreover, the cobalt powder is a sub-dendritic powder, which can hold the diamond particles during the uniform distribution of diamond particles and increase the mechanical meshing ability of the cold-pressed blank in the cold-pressed layer. The iron powder is oxidized during the sintering process to form iron oxide, which can react with the surface of the diamond particles to roughen the surface of the diamond particles, thereby increasing the self-sharpening property of the diamond and the retention of the diamond by the matrix material.
[0009] Optionally, the matrix material includes the following raw materials in the following weight percentages: 50-60% dendritic electrolytic copper powder, 20-40% copper-tin alloy, 3-5% cobalt powder, 10-15% tin powder, and 5-10% iron powder.
[0010] By adopting the above technical solution, the dendritic morphology of electrolytic copper powder and cobalt powder can improve the holding force of the matrix material on the diamond particles, increase self-sharpening and cutting efficiency.
[0011] Optionally, the matrix material includes the following raw materials in weight percentage: 50-60% dendritic electrolytic copper powder, 20-40% copper-tin alloy, 10-15% tin powder, and 5-10% iron powder.
[0012] By adopting the above technical solution and using tin powder and copper-tin alloy, the strength and brittleness of the matrix are adjusted and the self-sharpening property is improved.
[0013] In a second aspect, the present application provides a sharp diamond uniformly distributed saw blade, which adopts the following technical solution:
[0014] A sharp diamond uniformly distributed saw blade, comprising a disc-shaped base and a plurality of diamond segments evenly arranged on the radial outer edge of the disc-shaped base, wherein the disc-shaped base between adjacent diamond segments is provided with a chip removal groove, and wherein the circumference of the diamond segments is inwardly concave;
[0015] The diamond tool head comprises a plurality of overlapping carcass layers and a diamond layer arranged between adjacent carcass layers, wherein the carcass layers are formed by pressing carcass materials, and the diamond layer is formed by evenly distributed diamond particles;
[0016] The thickness of the multi-layer carcass layer gradually decreases from the middle position of the diamond bit to the sides of the diamond bit. The diamond particle concentration in the multi-layer diamond layer is set to two or more types, and the diamond layers with different diamond particle concentrations are alternately arranged on both sides of the carcass layer.
[0017] The surface of the diamond segment is provided with two drainage grooves that penetrate the surface of the diamond segment. The two drainage grooves are arranged in parallel or crosswise, with the intersection being located on the side of the diamond segment close to the disc-shaped base.
[0018] A U-shaped groove is provided on the peripheral surface of the diamond bit away from the disc-shaped base, and the U-shaped groove is located between the two drainage grooves.
[0019] By adopting the above technical solution, the disc-shaped substrate is processed from a metal substrate into a circle with a predetermined diameter and thickness. As the main body supporting the diamond bit, it should have high strength, be not easy to deform under the conditions of use, and have good toughness. The disc-shaped substrate must have good rigidity under cutting operation conditions to prevent it from deforming during cutting. Moreover, the disc-shaped substrate will be elastically deformed by the combined action of tangential force and normal force during use, so the disc-shaped substrate is required to have certain elasticity and toughness; due to the cutting action, the diamond bit and the cutting object, such as concrete, will be accompanied by a large amount of frictional heat during cutting, so the disc-shaped substrate and the diamond bit are required to have a basically equivalent thermal friction coefficient, especially under dry cutting without forced coolant, so the disc-shaped substrate is preferably a steel-based substrate. For example, for a circular metal substrate for high-frequency welding, 50Mn2V, 65Mn, 75Cr1, 8CrV, etc. can be used, and for a circular metal substrate for laser welding, 25CrMo, 28CrMo, 35CrMo, etc. can be used.
[0020] The circumference of the diamond head is concave inward, presenting a concave structure. The diamond particles in the diamond head are different, with at least two types set, and diamond layers of different concentrations are alternately arranged between the matrix layers. The thickness of the matrix layer gradually decreases toward both sides along the thickness direction of the diamond head. During cutting, part of the stone will protrude from the concave part. The stone in the protruding part can be squeezed and crushed by the vibration of the saw blade during cutting, and discharged in the channel formed through the middle concave position along with the cooling water.
[0021] When cutting, the diamond head will produce debris, which may be diamond chips, stone chips or matrix chips. Diamond chips are relatively hard. During the cutting process, if they are not discharged in time, they will be pressed into the processing object with the horizontal movement of the saw blade, the local hardness of the processing object will increase, and the resistance to the horizontal movement of the saw blade will increase, resulting in a decrease in the sharpness of the saw blade; matrix material chips and stone chips are relatively soft. During the cutting process, the diamond head cuts the stone first, and the horizontal forward resistance of the saw blade is small, but the softer stone chips and matrix chips will act as solid lubricants in the cutting process, so that the diamond head cannot cut the stone. The horizontal movement of the saw blade changes from cutting to impact, and the cutting resistance increases. A U-shaped groove is set on the diamond head to facilitate the discharge of debris, which can reduce the impact of debris on the saw blade cutting process.
[0022] Two cross-drainage grooves are opened on the diamond cutter head to facilitate the outflow and discharge of cooling water, so that the cutter head can be cooled as quickly as possible and the debris can be discharged in time. When the saw blade has a high rotation speed during cutting, the cooling water moves upward along the groove of the drainage groove relative to the saw blade. At this time, the chips can be discharged in the groove of the drainage groove along with the cooling water. When the cutter head is out of the cutter, the cooling water can flow into the groove at the bottom of the drainage groove on the other side. The backflow of cooling water can take away the heat generated during the cutting process, reduce the temperature of the cutter head, and prevent the tire body from softening due to high temperature.
[0023] Optionally, the distance between the intersection of the drainage grooves and the bottom of the U-shaped groove is 0.1-0.4 times the height of the diamond bit.
[0024] By adopting the above technical solution, when the debris in the drainage groove pops out of the drainage groove due to the rotation of the cutter head during the flow of cooling water, the bottom of the U-shaped groove is at an appropriate distance from the drainage groove, and the popped debris can be discharged from the U-shaped groove.
[0025] Optionally, the depth of the U-shaped groove is 0.4-0.7 times the height of the diamond bit, and the width of the U-shaped groove is 3-6 mm.
[0026] By adopting the above technical solution, the heat dissipation and heat transfer capabilities of the U-shaped groove can be optimized, so that the cutter head can complete cutting more smoothly and ensure the cutting effect.
[0027] Optionally, the angle between the two drainage grooves close to the U-shaped groove is 90-135 degrees.
[0028] By adopting the above technical solution and the setting method of the above angles, by adjusting the formation angle of the drainage groove, the effect of reducing cutting resistance and improving cutting sharpness can be better exerted. During high-speed cutting, the high heat generated by the cutting head and the material can be carried out to ensure the sharpness of the cutting head.
[0029] Optionally, the width of the drainage groove is 2-4 mm.
[0030] By adopting the above technical solution, the drainage groove of this width can facilitate the discharge of debris and cooling water, thereby reducing the heat generated during cutting.
[0031] Optionally, the distance between the intersection of the drainage grooves and the disc-shaped base is 2-4 mm.
[0032] By adopting the above technical solution, as the diamond cutter head is continuously worn, when it reaches the intersection of the drainage groove, it means that the diamond cutter head has been used up, which is convenient for protecting the disc-shaped substrate.
[0033] In a second aspect, the present application provides a process for preparing a sharp diamond uniformly distributed saw blade, which adopts the following technical solution:
[0034] A process for preparing a sharp diamond uniformly distributed saw blade comprises the following steps:
[0035] Preparation of carcass material: Dendritic electrolytic copper powder, copper-tin alloy, cobalt powder, tin powder and iron powder are uniformly mixed to obtain the carcass material; Preparation of carcass layer: The carcass material is cold pressed to obtain carcass layers of different thicknesses, with the height of the carcass layer decreasing as the thickness increases, and a U-shaped groove is provided on the carcass layer;
[0036] Diamond layer preparation: Diamond particles of different concentrations are evenly distributed on carcass layers of different thicknesses to form a diamond layer, with the diamond layer and carcass layer spaced apart;
[0037] Sintering: During the sintering process, two intersecting drainage grooves are opened on the diamond bit. The two drainage grooves run through the surface of the diamond bit. The sintering temperature is 750-800℃ and the holding time is 1-2 minutes.
[0038] Appearance treatment: sandblast the sintered diamond segment;
[0039] Welding: Weld the sandblasted diamond segment onto the disc-shaped substrate for 4-7 seconds. If the welding strength is greater than 300 MPa, the welding is complete and the diamond saw blade is obtained.
[0040] Sharpening: scrape, polish and oil the diamond saw blade.
[0041] By adopting the above technical solution, carcass layers of different heights and thicknesses are arranged, with the carcass layer with the largest thickness and smallest height as the center of the diamond bit, and diamond particles are symmetrically distributed. Then, the thickness and height of the carcass layers are adjusted so that the thickness of the carcass layers gradually decreases from the carcass layer at the center position to both sides, while the height gradually increases, thereby forming a concave structure. The concentration of diamond particles in different diamond layers is different, and at least two different concentrations are set. The diamond layers of the two concentrations are alternately arranged between the carcass layers, thereby improving the hardness and self-sharpening performance of the diamond bit.
[0042] The middle carcass layer is the thickest, while the outermost carcass layer is thinner, so the middle carcass layer will be worn faster than the carcass layers on both sides. Therefore, during use, the cutter head can always maintain an inward concave shape, so that the cutting resistance of the cutter head is small and the self-sharpening property is good. It is used in the processing of granite, marble and other stone materials and the cutting of concrete pavements. It has fast cutting speed, high cutting sharpness, stable performance, and helps to reduce energy consumption.
[0043] In summary, this application has the following beneficial effects:
[0044] 1. Since the present application uses dendritic electrolytic copper powder, cobalt powder, tin powder, copper-tin alloy and iron powder to prepare the matrix material, the dendritic electrolytic copper powder, cobalt powder and titanium powder can improve the retention of the matrix material on the diamond particles, so that the diamond particles can be accurately positioned and evenly distributed on the matrix material, and are not easy to fall off. At the same time, the self-sharpening and strength of the diamond blade are increased, thereby improving the cutting efficiency.
[0045] 2. The peripheral surface of the diamond segment in the sharp diamond uniformly distributed saw blade of the present application presents an inwardly concave structure, and by adjusting the concentration of the matrix layer and diamond particles, the diamond segment always maintains an inwardly concave structure during use, which can improve cutting efficiency and heat dissipation effect.
[0046] 3. The sharp diamond uniformly distributed saw blade of the present application is provided with a U-shaped groove and two mutually intersecting drainage grooves, which can increase the cooling water flow, facilitate the discharge of debris and cooling water, and accelerate the dissipation of heat. BRIEF DESCRIPTION OF THE DRAWINGS
[0047] Figure 1 This is a schematic diagram of the planar structure of the sharp diamond uniformly distributed saw blade in this application;
[0048] Figure 2 This is a schematic diagram of the planar structure of the sharp diamond uniformly distributed saw blade in this application;
[0049] Figure 3 for Figure 1 A cross-sectional view of the diamond bit peripheral surface structure along the AA axis.
[0050] In the figure, 1. Disc-shaped base; 11. Chip groove; 12. Mounting hole; 2. Diamond bit; 21. U-shaped groove; 22. Drainage groove; 23. Carcass layer; 24. Diamond layer; 25. Middle part; 26. Second outer part; 27. Outermost part; B. Cooling water direction when entering the tool; C. Cooling water direction when exiting the tool. DETAILED DESCRIPTION
[0051] The following examples further illustrate the present application in detail.
[0052] Example
[0053] Example 1-4: A matrix material for a diamond bit 2, the weight percentages of the raw materials are shown in Table 1, the particle size of the dendritic electrolytic copper powder is 500 mesh, the average particle size of the cobalt powder is 1-6 microns, the particle size of the copper-tin alloy is 1000 mesh, the particle size of the tin powder is 300 mesh, and the particle size of the iron powder is 200 mesh. The dendritic electrolytic copper powder and sub-dendritic cobalt powder can prevent the diamond particles from rolling, allowing the diamond particles to be precisely positioned.
[0054] Table 1 Amount of raw materials used for the matrix material of the diamond segment 2 in Examples 1-4 and Comparative Examples 1-2
[0055]
[0056] Example 5: A sharp diamond uniformly distributed saw blade, see Figure 1 It includes a disc-shaped base 1 and diamond segments 2 evenly arranged on the radial outer edge of the disc-shaped base 1. There are no less than two diamond segments 2. A chip removal groove 11 is provided between each two adjacent diamond segments 2. A mounting hole 12 is provided in the center of the disc-shaped base 1. The mounting hole 21 is used to mount the diamond saw blade on the drive shaft or working spindle of the working equipment. The diameter of the disc-shaped base 1 can be designed to be 100-300mm according to needs.
[0057] See also Figure 2 A U-shaped groove 21 is formed on the circumference of the diamond segment 2, away from the disc-shaped base 1. The depth of the U-shaped groove 21 is 0.4-0.7 times the height of the diamond segment, with 0.5 times being used as an example in this embodiment. The width of the U-shaped groove 21 is 3-6 mm, with 4 mm being used as an example in this embodiment. When the saw blade is cutting, a certain amount of debris is generated, including diamond debris, workpiece debris, and matrix debris. The U-shaped groove 21 increases the cooling water flow rate, facilitates debris removal and cooling water circulation, reduces the impact of debris on the sharpness of the diamond saw blade, and also helps reduce processing temperatures.
[0058] See also Figure 2Two drainage grooves 22 are provided on the diamond segment 2, and the two ends of the two drainage grooves 22 respectively pass through the radial direction of the diamond segment 2, connecting the circumferential surface of the diamond segment 2 away from the disc-shaped substrate 1 and the circumferential surface of the diamond segment 2 close to the disc-shaped substrate 1; the two drainage grooves 22 can be arranged in parallel or in a cross-arrangement, and the present embodiment takes the cross-arrangement as an example; the intersection of the two drainage grooves 22 is located on the side of the diamond segment 2 close to the disc-shaped substrate 1, and the distance between the intersection and the disc-shaped substrate 1 is 2-4 mm, and 3 mm is taken as an example in this embodiment.
[0059] During the use of the diamond saw blade, the side of the diamond head 2 away from the disc-shaped base 1 is the outer side of the diamond saw blade, which is first involved in cutting, grinding and other operations. The rotation circumference of the outer side of the diamond saw blade is larger, and the interval between the two drainage grooves 21 is larger, which can achieve more uniform circulation of cooling water to achieve the purpose of cooling; the axial thickness of the diamond head 2 near the intersection of the two drainage grooves 22 is lower, and the density of the grooves is high, which will affect the hardness of the diamond head 2 itself, and in combination with the diamond head 2, a U-shaped groove 21 is also provided. The intersection of the U-shaped groove 21 and the two drainage grooves 22 are close to the center line of the diamond head 2. Therefore, the intersection of the two drainage grooves 22 is set on the side close to the disc-shaped base 1, and the U-shaped groove 21 is located on the other side away from the disc-shaped base 1, which also helps to reduce the impact on the hardness of the diamond head 2 itself.
[0060] The width of the two drainage grooves 22 is 2-4 mm, and 4 mm is used as an example in this embodiment. The angle between the two drainage grooves 22 near the side of the U-shaped groove is 90-135°, and 90° is used as an example in this embodiment. The distance between the intersection of the drainage grooves 22 and the bottom of the U-shaped groove 21 is 0.1-0.4 times the thickness of the diamond cutter head, and 0.2 times is used as an example in this embodiment. The cooling water refluxes in the two drainage grooves 22, which is beneficial to the cooling of the diamond cutter head 2 and the removal of debris. When the cooling water enters the cutter, due to the high rotation speed of the saw blade, the cooling water moves upward along the drainage grooves 22 relative to the saw blade. At this time, the chips can be discharged in the drainage grooves 22 along with the cooling water; when the cutter head is out of the cutter head, the cooling water can flow into the drainage groove 22 at one end of the other drainage groove 22 near the disc-shaped base 1. The reflux of the cooling water takes away the heat generated during the cutting process, thereby reducing the temperature of the cutter head and preventing the carcass material from softening due to high temperature.
[0061] See also Figure 1 and Figure 3The circumference of the diamond cutter head 2 is concave inwards and is concave-shaped. The diamond cutter head 2 includes multiple overlapping carcass layers 23 and diamond layers 24 arranged between adjacent carcass layers 23. The carcass layer 23 is formed by pressing the carcass material made in Example 1. The diamond layer 24 is formed by uniformly distributing diamond particles on the carcass layer 23 using a uniform distribution device. The carcass layer 23 located in the middle of the thickness direction of the diamond cutter head 2 has the largest thickness, and the thickness of the multi-layer carcass layer 23 gradually decreases from the middle of the diamond cutter head 3 to the thickness sides of the diamond cutter head 2. The concentration of diamond particles in all diamond layers 24 is set to 2 or more, and the concentration of diamond particles in different diamond layers 24 is set alternately, and each diamond layer 24 is located between two carcass layers 23. At least one layer located in the middle of the thickness of the diamond cutter head 2 As the middle part 25, the middle part 25 is located in the middle part of the diamond bit 2 when it is in operation, and the multiple layers located on the outermost side of the diamond bit 2 are the outermost part 27. The several layers located between the outermost part 27 and the middle part 25 are the connecting part of the outermost part 27 and the middle part 25. As the secondary outer part 26, in this embodiment, the carcass layer 23 located in the middle position of the diamond bit 2 and the diamond layers 24 on both sides of the carcass layer 23 are the middle part 25, the carcass layer 23 located on the side of the middle part 25 away from the middle position of the thickness of the diamond bit 2, and the diamond layer 24 in contact with the carcass layer 23 are the secondary outer part 26, and the three carcass layers 23 located on the side of the secondary outer part 26 away from the middle position of the thickness of the diamond bit 2, and the diamond layers 24 spaced apart from the three carcass layers 23 are the outermost part 27. During cutting, part of the stone will protrude from the concave part of the diamond head 2. The protruding part of the stone can be squeezed and crushed by the vibration of the saw blade during cutting, and then discharged through the channel formed by the inward concave surface of the diamond head 2 along with the cooling water.
[0062] The preparation process of the sharp diamond uniformly distributed saw blade comprises the following steps:
[0063] S1. Preparation of a disc-shaped substrate 1: A disc-shaped blank with a mounting hole 12 in the center and a diameter of 300 mm is obtained by laser cutting. A chip groove is machined on the outer edge of the disc-shaped blank, and the flat surface, inner hole, and outer circle are polished and deburred to obtain a disc-shaped substrate 1. The material of the disc-shaped substrate 1 is 25CrMo steel plate.
[0064] S2. Preparation of carcass material: According to the raw material dosage in Example 1, various raw materials of the carcass material are weighed and mixed in a three-dimensional mixer for 70 minutes to obtain the carcass material.
[0065] S3. Preparation of the carcass layer 23: Place the carcass material in a mold for forming a U-shaped groove 21, and perform cold pressing of the green body to obtain a carcass layer 23 with a U-shaped groove 21. Repeat this step to form multiple carcass layers 23 with different thicknesses and heights. The height of the carcass layer 23 decreases with increasing thickness. The depth of the U-shaped groove 21 on carcass layers 23 of different thicknesses is 0.5 times the height of the diamond bit 2, and the width of the U-shaped groove is 4 mm.
[0066] S4. Preparation of diamond layer 24: The thickest carcass layer 23 is used as the center position of the diamond bit 2, and diamond particles are evenly distributed on both sides of the carcass layer 2 to form diamond layers 24 located on both sides of the carcass layer 23, and the whole is used as the middle part 25; then a carcass layer 23 is placed on both sides of the middle part 25, and diamond particles are evenly distributed on the carcass layer 23 to obtain the sub-outer part 26; three carcass layers 23 are placed on both sides of the sub-outer part 26, and diamond particles are evenly distributed at intervals between the three carcass layers 23 to obtain the outermost part 27 composed of three carcass layers 23 and two diamond layers 24, the thickness of the carcass layer 23 in the middle part 25 is greater than the thickness of the carcass layer 23 in the sub-outer part 26, and the carcass layer 23 in the sub-outer part 26 is greater than the thickness of the carcass layer 23 in the sub-outer part The thickness of 23 is greater than the thickness of the carcass layer 23 in the outermost part 27, and the thickness of the carcass layer 23 in the outermost part 27 gradually decreases toward both sides along the thickness direction of the diamond bit 2; the concentration of diamond particles in the diamond layers 24 on both sides of each carcass layer 23 is different, and there are two types of diamond particle concentrations in all diamond layers 24 in the diamond bit 2, namely 1.5% and 3.5%, and the two diamond layers 24 with different concentrations are alternately arranged between the carcass layers 23; according to the height adjustment of the carcass material, the position of the carcass layer 23 in the outermost part 27, the sub-outer part 26 and the middle part 25 makes the circumferential interface of the diamond bit 2 concave, and the structure on both sides of the carcass layer 23 in the center position of the diamond bit 2 is the same in the thickness direction.
[0067] S5, sintering: During the sintering process of the product obtained in step S4, two mutually intersecting drainage grooves 22 are formed, both ends of the two drainage grooves 22 pass through the surface of the diamond bit 2, the intersection of the two drainage grooves 22 is located at the bottom of the U-shaped groove 21, and the distance from the bottom of the U-shaped groove 21 is 0.2 times the height of the diamond bit 2, the angle between the two drainage grooves 22 and the side close to the U-shaped groove 21 is 90°, the sintering temperature is 760°C, and the sintering time is 2 minutes;
[0068] S6, appearance treatment: sandblasting the sintered diamond segment 2, and then grinding the working surface with a grinding wheel to expose the diamond;
[0069] S7, welding: placing the diamond segment 2 and the disc-shaped substrate 1 in corresponding positions, laser welding the diamond segment 2 and the disc-shaped substrate 1 together at the moment the laser penetrates, the welding time is 4 seconds, and the welding strength of each diamond segment 2 is tested at a strength standard of 300 MPa to produce a diamond saw blade;
[0070] S8. Sharpening: scrape, polish and soak the diamond saw blade in oil.
[0071] Example 6: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the carcass layer 23 adopts the raw material formula in Example 2.
[0072] Example 7: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the carcass layer 23 adopts the raw material formula in Example 3.
[0073] Example 8: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the carcass layer 23 adopts the raw material formula in Example 4.
[0074] Comparative Example
[0075] Comparative Example 1-4: A matrix material for a diamond bit, which differs from Example 1 in that the weight percentages of the raw materials are as shown in Table 1.
[0076] Comparative Example 5: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the diamond segment 2 is not configured to have a concave circumferential surface, and the circumferential surface height of the diamond segment 2 is the same.
[0077] Comparative Example 6: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the two drainage grooves 22 are not provided.
[0078] Comparative Example 7: A sharp diamond uniformly distributed saw blade, which differs from Example 5 in that the U-shaped groove 21 is not provided.
[0079] Performance testing
[0080] I. Performance test of matrix material: The raw materials in Examples 1-4 and Comparative Examples 1-4 were mixed, pressed and formed, and then sintered at 760°C for 2 minutes to prepare matrix material samples. The matrix materials prepared in Examples 1-4 and Comparative Examples 1-4 were pressed, and diamond particles (particle size of 50 / 60) with a concentration of 20% were evenly distributed on the pressed matrix layer 23, and then sintered at 760°C for 2 minutes. The test results were as follows: GB / T5319-2002 "Determination of transverse rupture strength of sintered metal materials (excluding cemented carbide)"
[0081] The bending strength was tested and the test results were recorded in Table 2.
[0082] Table 2 Test of the holding force of matrix materials on diamond particles
[0083]
[0084] Table 2 shows that after diamond particles were added to the matrix material prepared in Example 1, its diamond holding force was good and the compressive strength loss rate was small; in Example 2, no cobalt powder was added, and the matrix material prepared had a slightly lower diamond particle holding force than that in Example 1; in Example 3, no tin powder was added, and the flexural strength loss rate was slightly increased; in Example 4, no tin powder and cobalt powder were added, and the matrix material's diamond particle holding force was affected to a certain extent.
[0085] Compared with Example 1, in Comparative Example 1, cobalt powder and tin powder were not added, and copper-tin alloy was used instead of cobalt powder and tin powder. It can be seen that the bending strength of the matrix material is affected, and the holding force of the matrix material on the diamond particles is reduced.
[0086] In Comparative Example 2, only copper-tin alloy and iron powder are used as the matrix material. Compared with Example 1, the bending strength of the matrix material is reduced, and the holding force on the diamond particles is significantly reduced.
[0087] Comparative Example 3, compared with Example 1, uses tin powder instead of copper-tin alloy. Table 2 shows that the matrix material prepared in Comparative Example 3 has a decreased retention force on diamond particles and an increased rate of change in flexural strength.
[0088] Compared with Example 1, in Comparative Example 4, copper-tin alloy is used instead of iron powder. It can be seen that the holding force of the matrix material on the diamond particles is slightly weakened.
[0089] 2. Performance test of sharp diamond uniformly distributed saw blade:
[0090] Sharp diamond uniformly distributed saw blades were prepared according to the structures and processes of Examples 5-8 and Comparative Examples 5-7. The thickness of the diamond segment 2 was 2 mm, and the thickness of the disc-shaped substrate 1 was 2 mm. The impact toughness was tested according to GB / T 5318-1985 "Unnotched impact specimens of sintered metal materials (excluding cemented carbide)", and the bending strength was tested according to GB / T5319-2002 "Determination of transverse fracture strength of sintered metal materials (excluding cemented carbide)". Concrete was cut at a cutting rate of 2.2 m / min and a cutting depth of 80 mm. The total cutting length of each saw blade was 100 m. The current and power during the cutting process were tested. Ten saw blade specimens were tested for each Example and Comparative Example, and the average current and average density were recorded in Table 3.
[0091] Table 3 Performance test of sharp diamond uniformly distributed saw blade
[0092]
[0093] It can be seen from the data in Table 3 that the sharp diamond uniformly distributed saw blades prepared in Examples 5-8 have lower cutting currents and consume less electrical energy than those prepared in Comparative Examples 5-7, and have higher impact toughness and bending strength.
[0094] In Comparative Example 5, the peripheral surface of the diamond head 2 is set to a plane, and no concave surface is set. Therefore, the debris is not easily discharged during cutting, and the sharpness is reduced. In Comparative Examples 6 and 7, no drainage groove or U-shaped groove is set, and the debris and cooling water are not easily discharged, the cutting efficiency is reduced, and the cutting energy consumption is increased.
[0095] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but as long as they are within the scope of the claims of the present application, they are protected by the patent law.
Claims
1. A sharp diamond uniformly distributed saw blade, comprising a disc-shaped base (1) and a plurality of diamond segments (2) uniformly arranged on the radial outer edge of the disc-shaped base (1), wherein the disc-shaped base (1) between adjacent diamond segments (2) is provided with a chip removal groove (11), characterized in that: The circumference of the diamond bit (2) is concave inwards; The diamond bit (2) comprises a plurality of overlapping carcass layers (23), and a diamond layer (24) provided between adjacent carcass layers (23), wherein the carcass layers (23) are formed by pressing a carcass material, and the diamond layer (24) is formed by uniformly distributed diamond particles; The matrix material comprises the following raw materials in weight percentage: 50-60% dendritic electrolytic copper powder, 20-40% copper-tin alloy, 3-5% cobalt powder, 10-15% tin powder, and 5-10% iron powder; The thickness of the multi-layer carcass layer (23) gradually decreases from the middle position of the diamond bit (2) toward both sides of the diamond bit (2), and the multi-layer diamond layer (24) has two or more diamond particle concentrations, and the diamond layers (24) with different diamond particle concentrations are alternately arranged on both sides of the carcass layer (23); The surface of the diamond bit (2) is provided with two drainage grooves (22) penetrating the surface of the diamond bit (2), and the two drainage grooves (22) are arranged crosswise or in parallel. When arranged crosswise, the intersection point is located on the side of the diamond bit (2) close to the disc-shaped base (1); A U-shaped groove (21) is provided on the peripheral surface of the diamond bit (2) away from the disc-shaped base (1), and the U-shaped groove (21) is located between the two drainage grooves (22).
2. The sharp diamond uniformly distributed saw blade according to claim 1, characterized in that: The distance between the intersection of the drainage groove (22) and the bottom of the U-shaped groove (21) is 0.1-0.4 times the height of the diamond bit (2).
3. The sharp diamond uniformly distributed saw blade according to claim 1, characterized in that: The depth of the U-shaped groove (21) is 0.4-0.7 times the height of the diamond bit (2), and the width of the U-shaped groove (21) is 3-6 mm.
4. The sharp diamond uniformly distributed saw blade according to claim 1, characterized in that: The angle between the two drainage grooves (22) and the side close to the U-shaped groove (21) is 90-135 degrees.
5. The sharp diamond uniformly distributed saw blade according to claim 1, characterized in that: The opening width of the drainage groove (22) is 2-4 mm.
6. The sharp diamond uniformly distributed saw blade according to claim 1, characterized in that: The distance between the intersection of the drainage grooves (22) and the disc-shaped base (1) is 2-4 mm.
7. A process for preparing a sharp diamond uniformly distributed saw blade according to any one of claims 1 to 6, characterized in that: The following steps are involved: Preparation of matrix material: uniformly mixing dendritic electrolytic copper powder, copper-tin alloy, cobalt powder, tin powder and iron powder to prepare matrix material; Preparation of carcass layer (23): cold pressing the carcass material to obtain carcass layers (23) of different thicknesses, wherein the height of the carcass layer (23) decreases as the thickness increases, and a U-shaped groove (21) is opened on the carcass layer (23); Preparation of the diamond layer (24): Diamond particles of different concentrations are evenly distributed on the matrix layers (23) of different thicknesses to form the diamond layer (24), wherein the diamond layer (24) and the matrix layer (23) are spaced apart; Sintering: During the sintering process, two mutually intersecting drainage grooves (22) are formed on the diamond bit (2), and the two drainage grooves (22) penetrate the surface of the diamond bit (2). The sintering temperature is 750-800° C., and the holding time is 1-2 minutes. Appearance treatment: sandblasting the sintered diamond bit (2); Welding: welding the sandblasted diamond segment (2) to the disc-shaped base (1) for 4-7 seconds. If the welding strength is greater than 300 MPa, the welding is completed and a diamond saw blade is obtained. Sharpening: scrape, polish and oil the diamond saw blade.
Citation Information
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Energy-saving efficient diamond sawblade and manufacturing method thereof
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