Flexible conductive structure and preparation method thereof, electronic component and electronic equipment

Abstract

The invention relates to a flexible conductive structure and a preparation method thereof, an electronic component and electronic equipment, and relates to the technical field of flexible electronics. The flexible conductive structure comprises a conductive adhesive layer located on one side of a substrate and a conductive layer located on the surface, away from the substrate, of the conductive adhesive layer. The conductive adhesive layer comprises a colloidal matrix, liquid metal particles and conductive nanowires, wherein the liquid metal particles and the conductive nanowires are dispersed in the colloidal matrix. The conductive adhesive layer in the flexible conductive structure can avoid the influence of external stress on the electrical properties of the conductive layer, and the electrical properties of the electronic component and the electronic equipment with the flexible conductive structure are improved.

Description

Technical Field

[0001] The present disclosure relates to the field of flexible electronic technology, and in particular to a flexible conductive structure and a preparation method thereof, an electronic component and an electronic device. Background Art

[0002] With the development of health monitoring, smart skin, virtual reality and other fields, flexible electronics have attracted widespread attention due to their high flexibility and deformability, and flexible electrodes, as one of the most basic building blocks, have become the research focus of flexible electronics. According to actual needs, flexible electrodes need to have high electrical conductivity and maintain stable electrical properties under various deformations such as bending and stretching, that is, have good electromechanical properties.

[0003] Traditional rigid electrodes such as gold (Au), silver (Ag), copper (Cu), indium tin oxide (ITO), etc. have high electrical conductivity, but due to their inherent rigidity and low ductility, the electrodes are very prone to cracking under small tensile strains, and their resistance increases sharply. In order to improve the electromechanical properties of this type of rigid electrode, the structure is designed to be serpentine, origami-shaped, etc., so that the resistance of this type of electrode can remain stable under 20% strain, but the fine electrode structure makes the processing cost high and the strain insensitivity of the rigid electrode still needs to be further improved. In addition, conductors are often compounded with elastomers to prepare flexible electrodes, but due to the introduction of insulating materials, the electrical properties of the electrodes are usually reduced. In addition, this method is only applicable to a few conductor materials. Therefore, how to give rigid electrodes high flexibility at low cost and high efficiency and make them widely applicable to various rigid electrodes is a great challenge.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned prior art and to provide a flexible conductive structure and a preparation method thereof, an electronic component and an electronic device. By means of a conductive adhesive layer comprising liquid metal particles and conductive nanowires, the flexible conductive structure can still have good electrical properties when subjected to external stress.

[0006] According to one aspect of the present disclosure, there is provided a flexible conductive structure, the flexible conductive structure comprising a conductive adhesive layer located on one side of a substrate, and a conductive layer located on a surface of the conductive adhesive layer away from the substrate;

[0007] The conductive adhesive layer comprises a colloidal matrix and liquid metal particles and conductive nanowires dispersed in the colloidal matrix.

[0008] In an exemplary embodiment of the present disclosure, in the conductive adhesive layer, the mass proportion of liquid metal particles is 10%-25%, and the mass proportion of conductive nanowires is 6.9%-15%.

[0009] In an exemplary embodiment of the present disclosure, in the conductive adhesive layer, the mass ratio of the liquid metal particles is 12.5%-22.2%.

[0010] In an exemplary embodiment of the present disclosure, the material of the conductive layer is one of a gold conductive layer, a silver conductive layer, a copper conductive layer, an ITO conductive layer, a PEDOT:PSS composite conductive layer, and a carbon nanotube conductive layer.

[0011] In an exemplary embodiment of the present disclosure, the liquid metal particles are gallium-indium alloys; and the conductive nanowires are silver nanowires.

[0012] In an exemplary embodiment of the present disclosure, the colloidal matrix is ​​formed by polymerizing a colloidal matrix precursor liquid; the colloidal matrix precursor liquid includes a binder and an elastomer;

[0013] The adhesive comprises at least one of formula (1) and formula (2);

[0014]

[0015] Among them, n 1 to n 6 Each independently takes any integer from 20 to 40;

[0016] The elastomer comprises at least one of formula (3), formula (4), and formula (5);

[0017]

[0018] Among them, m 1 To m 5 Each independently takes an integer from 100 to 300.

[0019] According to another aspect of the present disclosure, an electronic component is provided, comprising the above-mentioned flexible conductive structure.

[0020] According to another aspect of the present disclosure, an electronic device is provided, comprising the above electronic component.

[0021] According to another aspect of the present disclosure, a method for preparing a flexible conductive structure is provided, the method comprising:

[0022] Forming a conductive adhesive precursor solution; the conductive adhesive precursor solution includes a colloidal matrix precursor solution and liquid metal particles and conductive nanowires dispersed in the colloidal matrix precursor solution;

[0023] Forming a conductive adhesive precursor layer on a substrate using a conductive adhesive precursor liquid;

[0024] forming a conductive layer on the conductive adhesive precursor layer;

[0025] The conductive adhesive precursor layer is processed so that the adhesive matrix precursor liquid is solidified to form an adhesive matrix.

[0026] In an exemplary embodiment of the present disclosure, the colloidal matrix precursor solution includes a binder and an elastomer;

[0027] In the conductive adhesive precursor liquid, the mass proportion of the adhesive is 19%-24%, the mass proportion of the elastomer is 44%-56%, the mass proportion of the liquid metal particles is 10%-25%, and the mass proportion of the conductive nanowires is 6.9%-15%.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0030] Figure 1 It is a cross-sectional schematic diagram of a flexible conductive structure in one embodiment of the present disclosure.

[0031] Figure 2 FIG. 1 is a top view of a flexible conductive structure in one embodiment of the present disclosure.

[0032] Figure 3 This is a transmission electron microscope image of a conductive adhesive layer in one embodiment of the present disclosure.

[0033] Figure 4 The figure is a schematic diagram of the preparation process of a flexible conductive structure in one embodiment of the present disclosure.

[0034] Figure 5 In some embodiments of the present disclosure, microscope images of the surface of the electrode layer of the flexible electrode under 60% tensile strain; wherein (A) is a flexible electrode with a conductive adhesive layer, and (B) is a flexible electrode without a conductive adhesive layer.

[0035] Figure 6The present invention discloses a microscope image of an electrode layer of a flexible electrode under different tensile strains in one embodiment of the present invention; wherein (a) is a microscope image of a flexible electrode with a conductive adhesive layer under 80% tensile strain, (b) is a microscope image of a flexible electrode with a conductive adhesive layer under 120% tensile strain, and (c) is a further enlarged microscope image of (b).

[0036] Figure 7 for Figure 6 Enlarged transmission electron micrograph of Figure (b).

[0037] Figure 8 This is a transmission electron microscope image of a conductive adhesive layer in one embodiment of the present disclosure.

[0038] Fig. 9 This is a schematic diagram of a fitting curve of liquid metal content and interface adhesion energy in some embodiments of the present disclosure.

[0039] Fig.10 This is a schematic diagram of a fitting curve of liquid metal content and fracture strain in some embodiments of the present disclosure.

[0040] Fig.11 This is a schematic diagram of a fitting curve of liquid metal content and electrical conductivity in some embodiments of the present disclosure.

[0041] Fig.12 This is a schematic diagram of a field effect transistor structure in one embodiment of the present disclosure.

[0042] Fig.13 Schematic diagram of comparison of carrier transport performance of a field effect transistor under no strain and 100% tensile strain in one embodiment of the present disclosure.

[0043] The reference numerals are as follows:

[0044] 1. Substrate, 2. Conductive adhesive layer, 201. First conductive adhesive layer, 202. Second conductive adhesive layer, 3. Conductive layer, SUB1. First substrate, SUB2. Second substrate, SE. Source, DE. Drain, SCL. Semiconductor layer, GI. Gate insulating layer, GT. Gate layer. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0046] The terms "a", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second", etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0047] The present disclosure provides a flexible conductive structure, such as Figure 1 and Figure 2 As shown, the flexible conductive structure includes a conductive adhesive layer 2 located on one side of a substrate 1, and a conductive layer 3 located on a surface of the conductive adhesive layer 2 away from the substrate 1. The conductive adhesive layer 2 includes a conductive adhesive, and the conductive adhesive includes a gelatinous matrix and liquid metal particles and conductive nanowires dispersed in the gelatinous matrix. Figure 3 In the transmission electron microscope image of the conductive adhesive layer 2 shown, adjacent liquid metal particles distributed in the colloidal matrix are electrically connected to each other, or the liquid metal particles are electrically connected through conductive nanowires. In this way, the liquid metal particles and the conductive nanowires form a conductive network in the conductive adhesive layer, so that the conductive adhesive layer has good conductive properties.

[0048] When the flexible conductive structure is bent, stretched and deformed by external force, the conductive adhesive layer can play a stress buffering role and stabilize the electrical performance of the conductive layer with greater rigidity. Specifically, when the flexible conductive structure is subjected to a low intensity of strain, the conductive adhesive layer bonded to the conductive layer can prevent cracks from appearing on the surface of the conductive layer. This is because the stress generated by the external force applied to the conductive layer acts on the conductive adhesive layer, preventing the conductive layer with greater rigidity from being damaged by the external force. When the flexible conductive structure is subjected to a high intensity of strain and cracks are generated in the conductive layer due to the strain, the liquid metal particles can be filled in the cracks of the conductive layer, so that the conductive layer can maintain relatively stable electrical properties when subjected to a strong external force.

[0049] In one embodiment of the present disclosure, the mass proportion of the liquid metal particles in the conductive adhesive layer is 10%-25%, and the mass proportion of the conductive nanowires is 6.9%-15%.

[0050] In one embodiment of the present disclosure, the mass ratio of the liquid metal particles is 12.5%-22.2%. In the flexible conductive structure, the performance of the conductive adhesive needs to be evaluated simultaneously: 1. The interfacial adhesion energy between the conductive adhesive layer and the conductive layer; 2. The tensile properties of the conductive adhesive layer (fracture strain of the conductive adhesive layer); 3. The conductivity of the conductive adhesive layer. By analyzing the mass fraction of the liquid metal particles as a single factor variable, it is found that the content of the liquid metal particles is linearly negatively correlated with the interfacial adhesion energy, nonlinearly negatively correlated with the tensile properties of the conductive adhesive layer, and nonlinearly positively correlated with the conductivity of the conductive adhesive layer. In other words, when the content of the liquid metal particles in the conductive adhesive layer is increased, the conductivity of the conductive adhesive layer can be increased, but the adhesion energy of the interface and the tensile properties of the conductive adhesive layer will also be reduced (it is easier to break when subjected to the same stress). Conversely, when the content of the liquid metal particles in the conductive adhesive layer is reduced, the adhesion energy of the interface and the tensile properties of the conductive adhesive layer can be increased, but the conductivity of the conductive adhesive layer will also be reduced. In this embodiment, the mass proportion of the liquid metal particles is set to 12.5%-22.2%, so that the above-mentioned interface adhesion energy, tensile properties and electrical conductivity are all at a relatively good level.

[0051] In one embodiment of the present disclosure, the conductive layer may be a metal conductive layer or a non-metal conductive layer. The conductive layer is a rigid conductive layer. Exemplarily, the material of the conductive layer may be one of a gold conductive layer, a silver conductive layer, a copper conductive layer, an ITO (indium tin oxide) conductive layer, a PEDOT:PSS composite conductive layer, and a carbon nanotube conductive layer. Among them, the PEDOT:PSS composite includes two substances, PEDOT (poly (3, 4-ethylenedioxythiophene)) and PSS (polystyrene sulfonate), and has a high conductivity.

[0052] In one embodiment of the present disclosure, the liquid metal particles may be a gallium-indium alloy, for example, a liquid gallium-indium alloy having a gallium content of 75wt% and an indium content of 25wt%. In one example, other metals may be added to the gallium-indium alloy to synthesize a liquid metal alloy that is liquid at room temperature. In another example, other liquid metals may also be used.

[0053] In one embodiment of the present disclosure, the conductive nanowire may be a metal conductive nanowire or a non-metal conductive nanowire. Exemplarily, the conductive nanowire is a silver nanowire.

[0054] In one embodiment of the present disclosure, the colloidal matrix is ​​formed by polymerization of a colloidal matrix precursor liquid; the colloidal matrix precursor liquid includes a binder and an elastomer. The binder includes at least one of four-arm amine-terminated polyethylene oxide (Formula 1) and polyethylene oxide-b-polybutylene oxide (Formula 2), wherein b represents a block. That is, Formula 2 is a block copolymer of polyethylene oxide and polybutylene oxide.

[0055]

[0056] Among them, n 1 to n 6 Each independently takes an arbitrary integer from 20 to 40.

[0057] The elastomer includes at least one of ethylene-terminated poly(dimethylsiloxane-co-diphenylsiloxane) (Formula 3), ethylene-terminated poly(dimethylsiloxane-co-methylphenylsiloxane) (Formula 4), and ethylene-terminated polydimethylsiloxane (Formula 5), ​​wherein co represents random copolymerization. That is, in Formula 3, dimethylsiloxane and diphenylsiloxane are randomly distributed in the polymer chain; in Formula 4, dimethylsiloxane and methylphenylsiloxane are randomly distributed in the polymer chain.

[0058]

[0059]

[0060] Among them, m 1 To m 5 Each independently takes an integer from 100 to 300.

[0061] The disclosed embodiment also provides an electronic component, which includes the above-mentioned flexible conductive structure.

[0062] In one example, the electronic component may be a flexible electrode. In the flexible electrode having the above-mentioned flexible conductive structure, such as Figure 1 and Figure 2 As shown, it includes a substrate 1, a conductive adhesive layer 2 and a conductive layer 3 stacked in sequence. In the flexible electrode, the substrate 1 can be a flexible substrate, which can reduce the damage to the flexible electrode caused by deformation such as bending and stretching caused by external stress, and improve the electrical performance stability of the flexible electrode. For example, the material of the flexible substrate can be poly (styrene-butadiene).

[0063] In one example, the electronic component may be a field effect transistor. At least one of the source electrode SE, the drain electrode DE and the gate electrode in the field effect transistor adopts the above-mentioned flexible conductive structure. That is, the source electrode SE and / or the drain electrode DE and / or the gate electrode may be used as a conductive layer to form a flexible conductive structure with a conductive adhesive layer, so that during use of the field effect transistor, even if the field effect transistor is bent or stretched by external forces, the source electrode SE, the drain electrode DE and the gate electrode as a conductive layer may maintain a relatively high conductivity, thereby improving the electrical performance of the field effect transistor.

[0064] The disclosed embodiment also provides an electronic device, which includes the above electronic element. The electronic device may be a wearable device, a medical implantable device, an electronic skin, a smart electronic fabric, a foldable and curved display panel, etc.

[0065] The present disclosure also provides a method for preparing a flexible conductive structure. Figure 4 As shown, the method includes:

[0066] S10, forming a conductive adhesive precursor solution; the conductive adhesive precursor solution includes a colloidal matrix precursor solution and liquid metal particles and conductive nanowires dispersed in the colloidal matrix precursor solution.

[0067] In one embodiment of the present disclosure, the preparation method of the liquid metal particles is: using ultrasound to crush the liquid metal to form liquid metal particles. The liquid metal particles are of a core-shell structure, the central core region is a highly conductive liquid metal alloy, and the shell is an insulating metal oxide. When the external stress is greater than the shell crushing stress of the insulating metal oxide, the liquid metal particles are crushed and fused to form a rich conductive path inside the material. When the external stress is less than the shell crushing stress of the insulating metal oxide, the liquid metal particles remain intact. In this embodiment, the colloidal matrix precursor liquid can make the liquid metal particles and conductive nanowires evenly distributed in the conductive glue precursor liquid. When the external force is greater than the shell crushing stress of the insulating metal oxide, the liquid metal particles are crushed and electrically connected to adjacent liquid metal particles or conductive nanowires, and an electrically connected network is formed in the conductive glue layer. For example, a liquid metal composed of a gallium-indium alloy is placed in an ethanol solution, and is broken by ultrasound for 1 minute to form liquid metal particles. The liquid metal particles are allowed to stand to settle at the bottom of the solution, and the ethanol in the upper layer is removed. The ethanol is slowly evaporated at room temperature to obtain gallium-indium liquid metal particles.

[0068] Exemplarily, the conductive nanowires are silver nanowires, which are obtained by centrifuging an ethanol suspension of the silver nanowires at 2000 rpm for 5 min, removing the upper ethanol solution, and leaving it at room temperature until the ethanol evaporates completely to obtain the silver nanowires.

[0069] S20, forming a conductive adhesive precursor layer on a substrate using a conductive adhesive precursor liquid. Exemplarily, a conductive adhesive precursor layer can be formed on a substrate by spin coating. The substrate can be a flexible substrate, for example, the substrate can be a SEBS substrate (flexible substrate), and the material of the SEBS substrate is poly (styrene-butadiene). A suitable substrate can also be selected according to the application scenario of the flexible conductive structure.

[0070] S30, forming a conductive layer on the conductive glue precursor layer. For example, a gold conductive layer, a silver conductive layer, a copper conductive layer, and an ITO conductive layer can be formed on the conductive glue precursor layer by transfer printing; a PEDOT:PSS composite conductive layer can be formed on the conductive glue precursor layer by spin coating; and a carbon nanotube conductive layer can be formed on the conductive glue precursor layer by spray coating.

[0071] S40, treating the conductive glue precursor layer so that the colloidal matrix precursor liquid solidifies to form a colloidal matrix. For example, the conductive glue precursor layer / conductive layer can be heated to solidify the conductive glue precursor layer, and at the same time, the outer shell of the insulating metal oxide in the liquid metal particles in the conductive glue precursor layer is broken, and an interactive conductive network is formed in the conductive glue precursor layer with adjacent liquid metal particles or conductive nanowires.

[0072] In one embodiment of the present disclosure, the colloidal matrix precursor liquid includes an adhesive and an elastomer. In one example, in the conductive adhesive precursor liquid, the mass proportion of the adhesive is 19%-25%, the mass proportion of the elastomer is 44%-56%, the mass proportion of the liquid metal particles is 10%-25%, and the mass proportion of the conductive nanowires is 6.9%-15%. In the colloidal matrix precursor liquid provided in this embodiment, the elastomer is the main material, which provides high flexibility and high stretchability for the prepared conductive adhesive layer. The adhesive provides a higher viscosity for the conductive adhesive layer, so that the conductive adhesive layer and the conductive layer interface have greater adhesion. In this way, when the conductive layer with greater rigidity is subjected to external stress, the stress can be transferred to the conductive adhesive layer to avoid the rigid conductive layer from breaking under stress and thus causing a decrease in electrical performance. Liquid metal particles and conductive nanowires serve as conductive fillers for the conductive adhesive layer, so that the conductive adhesive layer has conductivity. The conductive adhesive precursor liquid provided in this embodiment can make the prepared conductive adhesive layer reach a higher level in conductivity, interface adhesion and tensile properties.

[0073] The application of the flexible conductive structure provided by the present disclosure is further described below in conjunction with specific embodiments.

[0074] 1. Flexible electrodes with flexible conductive structures

[0075] In the flexible electrodes prepared in the following embodiments, the electrode layer is equivalent to the conductive layer in the flexible conductive structure.

[0076] Comparative Example 1 (without conductive adhesive layer)

[0077] The Ag electrode material is directly evaporated onto the SEBS flexible substrate through a mask to form a SEBS flexible substrate / Ag electrode layer (conductive layer) to obtain a flexible electrode C1.

[0078] Comparative Example 2 (Conductive Adhesive Layer Does Not Contain Conductive Nanowires)

[0079] 8.00 g of a molecular weight of 30 kg mol -1 Elastomer (Formula 5), ​​3.00 g molecular weight 10 kg mol -1 The adhesive (Formula 2) and 3.00 g of gallium-indium liquid metal particles were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0080] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.2 μm and free of silver nanowires.

[0081] The PEDOT:PSS electrode layer was formed on the conductive glue precursor layer by spin coating, specifically: the PEDOT:PSS solution was spin coated on the side of the conductive glue precursor layer away from the SEBS flexible substrate at a speed of 1200 rpm for 1 minute. A uniformly distributed PEDOT:PSS electrode layer with a thickness of 120 nm was formed on the conductive glue precursor layer, and a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / PEDOT:PSS electrode layer was obtained.

[0082] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / PEDOT:PSS electrode layer was heated at 100°C for 30 minutes to obtain the flexible electrode C2.

[0083] Comparative Example 3 (without conductive adhesive layer)

[0084] The Au electrode material is directly evaporated onto the SEBS flexible substrate through a mask to form a SEBS flexible substrate / Au electrode layer (conductive layer) to obtain a flexible electrode C3.

[0085] Comparative Example 4 (Conductive Adhesive Layer Does Not Contain Liquid Metal)

[0086] According to the mass ratio of adhesive: elastomer: silver nanowire = 1:2:0.5, that is, 8.00g molecular weight is 30kgmol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The adhesive (Formula 1) and 2.00 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0087] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.5 μm.

[0088] The Au electrode layer is formed on the conductive glue precursor layer by transfer printing, specifically: first, the Au electrode material is evaporated on the glass substrate through a mask, and the glass substrate is an OTS-modified glass sheet; the prepared Au electrode layer is 2 cm long, 1 cm wide, and 80 nm thick. Then, the Au electrode layer is transferred from the glass substrate to the surface of the conductive glue precursor layer away from the SEBS flexible substrate, obtaining a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer.

[0089] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer was heated at 100°C for 30 minutes to obtain flexible electrode C4.

[0090] 1. Preparation method and performance test analysis of flexible electrodes with flexible conductive structures

[0091] Example 1

[0092] 8.00 g of a molecular weight of 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The adhesive (Formula 1), 3.00 g of gallium-indium liquid metal particles, and 1.50 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0093] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.5 μm.

[0094] The Au electrode layer is formed on the conductive glue precursor layer by transfer printing, specifically: first, the Au electrode material is evaporated on the glass substrate through a mask, and the glass substrate is an OTS-modified glass sheet; the prepared Au electrode layer is 2 cm long, 1 cm wide, and 80 nm thick. Then, the Au electrode layer is transferred from the glass substrate to the side of the conductive glue precursor layer away from the SEBS flexible substrate, obtaining a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer.

[0095] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer was heated at 100°C for 30 minutes to obtain flexible electrode A1.

[0096] Example 2

[0097] 8.00 g of a molecular weight of 60 kg mol -1 Elastomer (Formula 4), 3.50 g molecular weight 10 kg mol -1The adhesive (Formula 2), 2.00 g of gallium-indium liquid metal particles, and 1.20 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0098] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.0 μm.

[0099] The Ag electrode layer is formed on the conductive glue precursor layer by transfer printing, specifically: first, the Ag electrode material is evaporated on the glass substrate through a mask, and the glass substrate is an OTS-modified glass sheet. The prepared Ag electrode layer has a diameter of 1.5 cm and a thickness of 80 nm. Then, the Ag electrode layer is transferred from the glass substrate to the side of the conductive glue precursor layer away from the SEBS flexible substrate, and a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Ag electrode layer is obtained.

[0100] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Ag electrode layer was heated at 100°C for 30 minutes to obtain flexible electrode A2.

[0101] Example 3

[0102] 8.00 g of a molecular weight of 60 kg mol -1 The elastomer (Formula 4) has a molecular weight of 10 kg mol -1 The adhesive (Formula 2), 3.00 g of gallium-indium liquid metal particles, and 1.50 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0103] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.0 μm.

[0104] The ITO electrode layer is formed on the conductive adhesive precursor layer by transfer printing, specifically: first, the ITO electrode material is grown on a glass substrate by magnetron sputtering through a mask, and the glass substrate is an OTS-modified glass sheet. The prepared ITO electrode layer has a triangular shape with a side length of 1.5 cm and a thickness of 100 nm. Then, the ITO electrode layer is transferred from the glass substrate to the side of the conductive adhesive precursor layer away from the SEBS flexible substrate, and a three-layer structure of SEBS flexible substrate / conductive adhesive precursor layer / ITO electrode layer is obtained.

[0105] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / ITO electrode layer was heated at 100° C. for 30 min to obtain flexible electrode A3.

[0106] Example 4

[0107] 8.00 g of a molecular weight of 30 kg mol -1 Elastomer (Formula 5), ​​3.00 g molecular weight 10 kg mol -1 The adhesive (Formula 2), 3.00 g of gallium-indium liquid metal particles, and 1.50 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0108] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.3 μm.

[0109] The PEDOT:PSS electrode layer was formed on the conductive glue precursor layer by spin coating, specifically: the PEDOT:PSS solution was spin coated on the side of the conductive glue precursor layer away from the SEBS flexible substrate at a speed of 1200 rpm for 1 minute. A uniformly distributed PEDOT:PSS electrode layer with a thickness of 120 nm was formed on the conductive glue precursor layer, and a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / PEDOT:PSS electrode layer was obtained.

[0110] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / PEDOT:PSS electrode layer was heated at 100°C for 30 minutes to obtain flexible electrode A4.

[0111] Example 5

[0112] 8.00 g of a molecular weight of 30 kg mol -1 Elastomer (Formula 5), ​​3.00 g molecular weight 10 kg mol -1 The adhesive (Formula 2), 2.50 g of liquid metal particles, and 1.00 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0113] The obtained conductive adhesive precursor solution was spin-coated on a 5 cm×5 cm SEBS flexible substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 2.9 μm.

[0114] Preparation of CNT (carbon nanotube) electrode layer: CNT solution is sprayed on the conductive glue precursor layer through a mask, and the prepared CNT electrode layer is 2 cm long, 1 cm wide and 100 nm thick, obtaining a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / CNT electrode layer.

[0115] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / CNT electrode layer was heated at 100° C. for 30 min to obtain flexible electrode A5.

[0116] The performance test results of the flexible electrodes A1-A5 prepared in Examples 1 to 5 are shown in Table 1.

[0117] Table 1. Performance test results of flexible electrodes A1 to A5

[0118]

[0119]

[0120] ① Fracture strain

[0121] By performing tensile measurement on the flexible substrate / conductive adhesive layer, the fracture strain of the conductive adhesive layer is obtained and the tensile properties of the conductive adhesive are tested.

[0122] The fracture strain was measured using a universal mechanical testing machine, with a test sample width of 30 mm, a sample length of 50 mm between the fixtures, and a thickness equal to the sum of the thickness of the SEBS flexible substrate and the thickness of the conductive adhesive layer. As shown in Table 1, the fracture strain of the conductive adhesive layer of the flexible electrodes A1-A5 is higher than 150% tensile stress, indicating that the flexible substrate / conductive adhesive layer structure has high tensile properties and can provide a tensile basis for the rigid electrode to reduce the influence of strain on the electrical properties when the rigid electrode layer is subjected to external force.

[0123] ② Conductivity

[0124] The conductive properties of the conductive adhesive are detected by measuring the conductivity of the conductive adhesive layer.

[0125] The resistance of the conductive adhesive layer was measured by a multimeter, and the conductivity was calculated by the resistance. The resistance test area was 20 mm long, 10 mm wide, and the thickness was the thickness of the conductive adhesive layer in each embodiment. Referring to Table 1, the conductivity of the conductive adhesive layer in the flexible substrate / conductive adhesive layer double-layer structure obtained by the methods of Embodiments 1 to 5 was 10 4 S cm -1 The above results indicate that the conductive adhesive prepared by the above method has good conductivity.

[0126] ③Interfacial adhesion energy of flexible electrodes

[0127] The interfacial adhesion energy (interfacial adhesion energy between the conductive adhesive layer and the electrode layer) of the corresponding flexible electrodes in Examples 1 to 5 was measured by peeling test. The test sample was 10 mm wide and 30 mm long, and peeled at 180°. The results are shown in Table 1. The interfacial adhesion energy of the flexible electrodes prepared in Examples 1 to 5 was higher than 600 J m 2 Compared with Comparative Example 2 (without conductive adhesive layer), the interfacial adhesion energy between the flexible substrate and the Au electrode layer (23 J m 2), which shows that the conductive adhesive layer can greatly increase the adhesion energy between the flexible substrate and the rigid electrode layer.

[0128] ④Flexible electrodes under different tensile strain states, changes in the structure and square resistance of the electrode layer

[0129] like Figure 5 As shown, Figure 5 (A) is a microscope image of the surface of the Ag electrode layer away from the SEBS flexible substrate at a tensile strain of 60% prepared in Example 2; Figure 5 (B) is a microscope image of the surface of the Ag electrode layer away from the SEBS flexible substrate of the flexible electrode C1 prepared in Comparative Example 1 under 60% tensile strain, wherein the Ag electrode layer of the flexible electrode A2 has the same thickness as that of the flexible electrode C1. Figure 5 It can be seen that under the same tensile strain conditions, obvious cracks are formed on the surface of the Ag electrode layer of the flexible electrode C1, while due to the conductive adhesive layer, no cracks appear on the surface of the Ag electrode layer of the flexible electrode A2. In this way, it is shown that the presence of the conductive adhesive layer can effectively prevent the rigid electrode layer located on one side of the conductive adhesive layer from being destroyed by external force. This is because the strong adhesion energy between the two interfaces of the conductive adhesive layer and the electrode layer will cause the stress generated under the action of external force to act on the conductive adhesive layer rather than the electrode layer. In other words, a flexible electrode with high tensile properties can be prepared by modifying the flexible substrate and the electrode layer through the conductive adhesive layer interface. In addition, the square resistance of the flexible electrode A2 at 60% tensile strain is measured to be 5.1mΩ / □, and the square resistance of the flexible electrode C1 at 60% tensile strain is 105mΩ / □; wherein, the square resistance measures the square resistance of the electrode layer of the flexible electrode A2 or the flexible electrode C1. In this way, it is shown that after the flexible electrode without the conductive adhesive layer forms cracks, its electrical performance is significantly reduced; while the flexible electrode with the conductive adhesive is less affected by the same tensile stress.

[0130] like Figure 6 and Figure 7 As shown, Figure 6 (a) is a microscope image of the surface of the PEDOT:PSS electrode layer of the flexible electrode A4 prepared in Example 4 under 80% tensile strain. The figure shows that under 80% tensile strain, due to the presence of the conductive adhesive layer, the surface of the electrode layer has no cracks, and the square resistance of the tested electrode layer is 10.8mΩ / □, while the initial square resistance of the electrode layer of the flexible electrode A4 before stretching is 10.5mΩ / □. In other words, before and after 80% tensile strain, the square resistance of the flexible electrode A4 is not much different, indicating that the flexible electrode with a flexible conductive structure still maintains stable electrical properties under 80% tensile strain. Figure 6(b) is a microscope image of the surface of the PEDOT:PSS electrode layer of the flexible electrode A4 under 120% tensile strain. This image shows that cracks appear on the surface of the flexible electrode A4 under 120% tensile strain, but the square resistance of the electrode layer of the flexible electrode A4 is measured to be 11.2mΩ / □, which is not much different from the initial square resistance of the flexible electrode A4. Figure 6 (c) and Figure 7 It can be seen from the high-magnification microscope image and transmission electron microscope image of the electrode layer under 120% tensile strain that the cracks in the electrode layer of the flexible electrode A4 are filled with liquid metal particles. In other words, when the flexible electrode is subjected to a large tensile strain and cracks appear, the liquid metal particles can be filled in the cracks, so that the flexible electrode still maintains stable electrical properties, which is conducive to the flexible electrode maintaining stable electrical properties under deformation such as bending and stretching caused by large stress.

[0131] The difference between Comparative Example 2 and Example 4 is that the conductive adhesive layer does not contain silver nanowires. Figure 8 As shown, the transmission electron microscope image of the conductive adhesive layer of the flexible electrode C2 prepared in comparative example 2 shows that the liquid metal particles in the conductive adhesive layer are not completely connected. Through the conductivity test, the conductive adhesive layer of the flexible electrode C2 is almost non-conductive. Under 120% tensile strain, the square resistance of the electrode layer of the flexible electrode C2 is 23.2mΩ / □, which is significantly higher than the flexible electrode A4 prepared in example 4 under the same tensile strain of 120% (square resistance is 11.2mΩ / □). In other words, the conductive adhesive layer has good conductivity (for example, the conductive adhesive layer conductivity of the flexible electrode A4 prepared in example 4 is 7.6×10 4 S cm -1 ) can still maintain stable electrical properties under high tensile strain, while the flexible electrode with poor conductivity of the conductive adhesive layer (for example, the conductive adhesive layer of the flexible electrode C2 prepared in Example 2 is almost non-conductive) has a significant increase in the resistance value of the electrode layer under high tensile strain, and the electrical properties are reduced. This shows that the high conductivity of the conductive adhesive layer is conducive to the flexible electrode prepared therefrom maintaining stable electrical properties under high tensile strain.

[0132] Figures 5 to 8 The tensile strains shown are all tensile performance tests for the three-layer structure of the flexible electrode A2, the three-layer structure of the flexible electrode A4, the double-layer structure of the flexible electrode C1 or the double-layer structure of the flexible electrode C2. The square resistance is the square resistance, which is measured using a four-probe tester.

[0133] 2. The influence of the content of liquid metal particles in conductive adhesive on the performance of conductive adhesive

[0134] Example 6

[0135] According to the mass ratio of adhesive: elastomer: silver nanowire: liquid metal = 1:2:0.5:0.7, that is, 8.00g molecular weight is 30kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The adhesive (Formula 1), 2.80 g of gallium-indium liquid metal particles, and 2.00 g of silver nanowires were added into a 50 mL glass bottle and stirred evenly to obtain a conductive adhesive precursor solution.

[0136] The conductive adhesive precursor liquid was spin-coated on a 5 cm×5 cm SEBS substrate at a rotation speed of 1500 rpm for 2 minutes to obtain a conductive adhesive precursor layer with a thickness of 3.5 μm.

[0137] The Au electrode layer is formed on the conductive glue precursor layer by transfer printing, specifically: first, the Au electrode material is evaporated on the glass substrate through a mask, and the glass substrate is an OTS-modified glass sheet; the prepared Au electrode layer is 2 cm long, 1 cm wide, and 80 nm thick. Then, the Au electrode layer is transferred from the glass substrate to the side of the conductive glue precursor layer away from the SEBS flexible substrate, obtaining a three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer.

[0138] The three-layer structure of SEBS flexible substrate / conductive glue precursor layer / Au electrode layer was heated at 100°C for 30 minutes to obtain a flexible electrode B3.

[0139] Example 7

[0140] The difference from Example 6 is that the mass ratio of adhesive: elastomer: silver nanowire: liquid metal is 1:2:0.5:0.5, that is, 8.00 g of molecular weight is 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The binder (Formula 1), 2.00 g of liquid metal particles, and 2.00 g of silver nanowires were prepared in the same manner as in Example 6 to obtain a flexible electrode B1.

[0141] Example 8

[0142] The difference from Example 6 is that the mass ratio of adhesive: elastomer: silver nanowire: liquid metal is 1:2:0.5:0.6, that is, 8.00 g of molecular weight is 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The binder (Formula 1), 2.40 g of liquid metal particles, and 2.00 g of silver nanowires were prepared. The rest was the same as in Example 6 to obtain a flexible electrode B2.

[0143] Example 9

[0144] The difference from Example 6 is that the mass ratio of adhesive: elastomer: silver nanowire: liquid metal is 1:2:0.5:0.8, that is, 8.00 g of molecular weight is 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The binder (Formula 1), 3.20 g of liquid metal particles, and 2.00 g of silver nanowires were prepared. The rest was the same as in Example 6 to obtain a flexible electrode B4.

[0145] Example 10

[0146] The difference from Example 6 is that the mass ratio of adhesive: elastomer: silver nanowire: liquid metal is 1:2:0.5:0.9, that is, 8.00 g of molecular weight is 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The binder (Formula 1), 3.60 g of liquid metal particles, and 2.00 g of silver nanowires were prepared. The rest was the same as in Example 6 to obtain a flexible electrode B5.

[0147] Embodiment 11

[0148] The difference from Example 6 is that the mass ratio of adhesive: elastomer: silver nanowire: liquid metal is 1:2:0.5:1, that is, 8.00 g of the molecular weight is 30 kg mol -1 Elastomer (Formula 3), 4.00g molecular weight is 10kg mol -1 The binder (Formula 1), 4.00 g of liquid metal particles, and 2.00 g of silver nanowires were prepared. The rest was the same as in Example 6 to obtain a flexible electrode B6.

[0149] The interfacial adhesion energy, fracture strain and electrical conductivity of each flexible electrode prepared in Example 6 to Example 11 were measured, and the relationship between the interfacial adhesion energy, fracture strain and electrical conductivity and the liquid metal content was analyzed.

[0150] ①Interface Adhesion Energy

[0151] like Fig. 9 The figure shows the fitting curve of liquid metal content and interfacial adhesion energy, which is Fig. 9 It can be seen that the liquid metal content and the interface adhesion energy are linearly negatively correlated, and the relationship is a=-15.22x+981.6, R 2=0.97, where x is the mass fraction of liquid metal and a is the interfacial adhesion energy at this mass fraction. That is to say, as the liquid metal content increases, the interfacial adhesion energy decreases linearly. The reason is that when the liquid metal content increases, the content of the adhesive that provides the adhesion function decreases relatively, so the liquid metal content and the interfacial adhesion energy show a negative correlation.

[0152] For example, the interfacial adhesion energy of the flexible electrode C4 (without liquid metal particles) prepared in Comparative Example 4 was measured to be 990.7 J m 2 The measurement result is very close to the fitting formula when x=0 and a=981.6, which further verifies the rationality of the linear relationship between liquid metal content and interface adhesion energy.

[0153] ②Fracture strain

[0154] like Fig.10 The figure shows the fitting curve of liquid metal content and fracture strain, where the fracture strain test sample is a double-layer structure of SEBS flexible substrate / conductive adhesive layer. The relationship between liquid metal content and fracture strain is b=1354x -0.65 , R 2 =0.98, where x is the mass fraction of liquid metal and b is the fracture strain at this mass fraction. The fracture strain is nonlinearly negatively correlated with the liquid metal content, that is, as the liquid metal content increases, the fracture strain first decreases rapidly and then decreases slowly. This shows that although the increase in liquid metal content will reduce the fracture strain of the flexible electrode, after the liquid metal content increases to a certain extent, the fracture strain begins to decrease slowly, indicating that the flexible electrode has the potential to maintain good tensile properties at a relatively high liquid metal content.

[0155] ③ Conductivity

[0156] like Fig.11 The figure shows the fitting curve of liquid metal content and conductivity, where the test area of ​​conductivity is the conductive glue layer of each flexible electrode. The functional relationship between the two is c = -15.9exp(-x / 5.48) + 5.80, R 2 =0.99, where x is the mass fraction of liquid metal and c is the conductivity at this mass fraction. The conductivity is nonlinearly positively correlated with the liquid metal content, that is, as the liquid metal content increases, the conductivity increases rapidly first and then increases slowly.

[0157] From the above analysis, it can be seen that the change of liquid metal content can significantly affect the viscosity, tensile properties and conductivity of the conductive adhesive. Similarly, changes in other components, such as changes in the content of elastomers, adhesives or conductive nanowires, will also lead to changes in the content of liquid metal, which can be calculated by the fitting curves of the above liquid metal content and interfacial adhesion energy, the fitting curves of liquid metal content and fracture strain, and the fitting curves of liquid metal content and conductivity to evaluate the performance of the prepared flexible electrode.

[0158] ④. Taking the flexible electrode B3 prepared in Example 6 as an example, the performance analysis was carried out: under 80% tensile strain, no cracks appeared on the surface of the flexible electrode, and the square resistance at this time was measured to be 10.6mΩ / □, which was not much different from the initial square resistance (10.5mΩ / □). Under 120% tensile strain, cracks appeared on the surface, but the square resistance was tested to be 10.9mΩ / □, which was still not much different from the initial square resistance.

[0159] The tensile performance test results of the flexible electrode B3 are basically consistent with those of the flexible electrode A4 prepared in Example 4. At relatively small strains (<80%), the conductive adhesive layer has a high interfacial adhesion energy (the interfacial adhesion energy of the flexible electrode B3 is 733 Jm 2 ), so that the conductive adhesive layer and the electrode layer adhere closely. When subjected to external force, the stress is dispersed in the conductive adhesive layer, reducing the damage to the rigid electrode layer. Under higher strain (80-120%), although the rigid electrode layer cracks due to stress, the liquid metal particles in the conductive adhesive layer can fill in the cracks, thus avoiding the increase in the resistance of the electrode layer caused by the cracks. In the flexible electrode C3 (flexible substrate / Au electrode layer) prepared in comparative example 3 without a conductive adhesive layer, the interface adhesion energy is only 21 Jm 2 ), the initial square resistance of the Au electrode layer is 10.4mΩ / □. At only 10% tensile strain, obvious cracks appear on the surface of the electrode layer, and the square resistance increases to 65.9mΩ / □. This shows that the flexible electrode prepared by modifying the flexible substrate and the electrode layer with conductive glue can reduce the damage of the flexible electrode under external forces. In addition, when the flexible electrode is subjected to large strain and cracks appear, the liquid metal particles in the conductive glue can also be filled into the cracks, thereby achieving the electrical stability of the flexible electrode under high strain.

[0160] 3. Analysis of electrical properties of flexible electrodes with different electrode layer materials

[0161] In Example 12, Example 13, Example 14, and Example 15, silver (Ag), indium tin oxide (ITO), PEDOT:PSS, and carbon nanotubes (CNT) are used to prepare electrode layers, respectively, and other processes are the same as in Example 6. The thickness of the prepared flexible electrodes is 80 nm. The flexible electrodes prepared in Example 6, Example 12 to Example 15 are measured under 100% tensile strain. The tensile strain of each flexible electrode is not much different before and after, as shown in Table 2, indicating that the interface modified by the conductive glue containing liquid metal is suitable for flexible electrodes prepared by various rigid electrode layers.

[0162] Table 2. Comparison of square resistance of flexible electrodes before and after 100% tensile strain

[0163]

[0164] 2. Stretchable field-effect transistor with flexible conductive structure

[0165] Example 16

[0166] The first flexible electrode is prepared by the same preparation method as in Example 6 (the conductive layer pattern is different from that in Example 6), and the first flexible electrode includes a first substrate SUB1, a first conductive adhesive layer 201, and an Au electrode layer (as a source-drain metal layer SD). The Au electrode layer includes two parallel gold electrodes, each of which is 500 microns long and 250 microns wide, and the distance between the two gold electrodes is 700 microns. Thus, the two gold electrodes serve as a source electrode SE and a drain electrode DE, respectively.

[0167] A semiconductor layer SCL and a gate insulating layer GI are sequentially formed on the source-drain metal layer SD, and a second flexible electrode is prepared by the same preparation method as in Example 6 to obtain a stretchable field effect transistor. Fig.12 The second flexible electrode includes an Au electrode layer (as a gate layer GT), a second conductive adhesive layer 202 and a second substrate SUB2 which are stacked in sequence, and the Au electrode of the Au electrode layer has a length of 800 microns and a width of 250 microns.

[0168] A semiconductor parameter tester was used to test the carrier transport performance of the obtained field effect transistor before and after tensile strain. Fig.13As shown, the curves of the field effect transistor are almost overlapped when there is no strain and 100% tensile strain, indicating that the carrier transport of the field effect transistor has not been significantly reduced. It can be understood that the performance test of the flexible electrode B3 of Example 6 shows that the square resistance is almost unchanged under 80-120% tensile strain, so the electrical properties of the field effect transistor prepared using the flexible electrode B3 are also basically stable under 100% tensile strain. In this way, it is explained that the flexible conductive structure provided by the present disclosure can be used in electronic components such as field effect transistors, for example, the flexible conductive structure can be used in thin film transistors.

[0169] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A flexible conductive structure, characterized in that: The flexible conductive structure includes a conductive adhesive layer located on one side of the substrate, and a conductive layer located on a surface of the conductive adhesive layer away from the substrate; The conductive adhesive layer comprises a colloidal matrix and liquid metal particles and conductive nanowires dispersed in the colloidal matrix.

2. The flexible conductive structure according to claim 1, characterized in that: In the conductive adhesive layer, the mass proportion of liquid metal particles is 10%-25%, and the mass proportion of conductive nanowires is 6.9%-15%.

3. The flexible conductive structure according to claim 2, characterized in that: In the conductive adhesive layer, the mass ratio of the liquid metal particles is 12.5%-22.2%.

4. The flexible conductive structure according to claim 1, characterized in that: The material of the conductive layer is one of a gold conductive layer, a silver conductive layer, a copper conductive layer, an ITO conductive layer, a PEDOT:PSS composite conductive layer, and a carbon nanotube conductive layer.

5. The flexible conductive structure according to claim 1, characterized in that: The liquid metal particles are gallium-indium alloy; and the conductive nanowires are silver nanowires.

6. The flexible conductive structure according to any one of claims 1 to 5, characterized in that: The colloidal matrix is ​​formed by polymerization of a colloidal matrix precursor liquid; the colloidal matrix precursor liquid includes a binder and an elastomer; The adhesive comprises at least one of formula (1) and formula (2); Wherein, n1 to n6 are independently any integers from 20 to 40; The elastomer comprises at least one of formula (3), formula (4), and formula (5); Wherein, m1 to m5 are independently any integers ranging from 100 to 300.

7. An electronic component, characterized in that: The flexible conductive structure comprises any one of claims 1 to 6.

8. An electronic device, characterized in that: The electronic component comprising the electronic component according to claim 7.

9. A method for preparing a flexible conductive structure, characterized in that: include: Forming a conductive adhesive precursor solution; the conductive adhesive precursor solution includes a colloidal matrix precursor solution and liquid metal particles and conductive nanowires dispersed in the colloidal matrix precursor solution; Forming a conductive adhesive precursor layer on a substrate using a conductive adhesive precursor liquid; forming a conductive layer on the conductive adhesive precursor layer; The conductive adhesive precursor layer is processed so that the adhesive matrix precursor liquid is solidified to form an adhesive matrix.

10. The method for preparing a flexible conductive structure according to claim 9, characterized in that: The colloidal matrix precursor solution includes a binder and an elastomer; In the conductive adhesive precursor liquid, the mass proportion of the adhesive is 19%-24%, the mass proportion of the elastomer is 44%-56%, the mass proportion of the liquid metal particles is 10%-25%, and the mass proportion of the conductive nanowires is 6.9%-15%.

Images