Alloy thermal fuse

Abstract

The alloy thermal fuse is made of an alloy material, which includes tin, lead, bismuth, antimony, and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.03% to 0.5%. The weight percentage of antimony is 0.03% to 0.3%. The weight percentage of nickel is 0.03% to 0.3%. Due to this special composition ratio, the alloy thermal fuse generates heat evenly when heated and is more sensitive to temperature changes, thereby improving its thermal conductivity. Therefore, the alloy thermal fuse can quickly melt when heated. In addition, because the alloy thermal fuse is a long alloy strip without an insulating shell or other complex components, it does not cause heat conduction losses due to multiple media, further enhancing the above-mentioned technical effects.

Description

Technical Field

[0001] The invention relates to a temperature fuse, in particular to an alloy temperature fuse. Background Art

[0002] Typically, a cartridge-type thermal fuse has one pin inserted into a circuit board, then wave soldered and secured to a heating device or other heat-prone component (such as a pin). This allows the cartridge-type thermal fuse to be placed between the protected circuit and the power supply. However, cartridge-type thermal fuses still have several drawbacks that require improvement.

[0003] For example, the alloy material of a cartridge thermal fuse is prone to melting due to reaching its melting point during wave soldering, causing it to lose its protective function prematurely. Similarly, a cartridge thermal fuse has an insulating shell and other complex components, which are prone to heat loss due to multiple media.

[0004] Furthermore, during installation, the user needs to reshape the alloy material of the cartridge thermal fuse at least once, and the pins connecting the cartridge thermal fuse to the circuit board need to be insulated. Furthermore, the distance between the pins and the circuit board needs to be further adjusted, which may also require another reshaping step. Furthermore, the cartridge thermal fuse also needs to be fixed to the circuit board with adhesive. These factors increase the complexity of cartridge thermal fuse installation. Summary of the Invention

[0005] According to one embodiment of the present invention, an alloy thermal fuse is provided. The alloy thermal fuse is made of an alloy material, and the alloy material includes tin, lead, bismuth, antimony, and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%.

[0006] In one embodiment, the weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel.

[0007] In one embodiment, the sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth.

[0008] In one embodiment, the specific gravity of the alloy material is between 7 and 8.

[0009] In one embodiment, the alloy material further comprises copper, silver, and zinc, wherein the weight percentage of copper is 0.0001% to 0.05%, the weight percentage of silver is 0.0001% to 0.05%, and the weight percentage of zinc is 0.001% to 0.002%.

[0010] In one embodiment, the alloy material further comprises iron and aluminum, wherein the weight percentage of iron is 0.0001% to 0.002% and the weight percentage of aluminum is 0.0001% to 0.002%.

[0011] In one embodiment, the alloy material further comprises arsenic and cadmium, wherein the weight percentage of arsenic is 0.0001% to 0.002% and the weight percentage of cadmium is 0.0001% to 0.002%.

[0012] In one embodiment, the weight percentage of any one of bismuth, antimony, and nickel is greater than the weight percentage of any one of copper, silver, zinc, iron, aluminum, arsenic, and cadmium.

[0013] In one embodiment, the weight percentage of copper is greater than the weight percentage of any of silver, zinc, iron, aluminum, arsenic, and cadmium.

[0014] In one embodiment, the weight percentage of silver is greater than the weight percentage of any of zinc, iron, aluminum, arsenic, and cadmium.

[0015] As described above, the alloy thermal fuse according to the embodiments of the present invention may have one or more of the following advantages:

[0016] (1) In one embodiment of the present invention, the alloy temperature fuse is made of an alloy material, and the alloy material includes tin, lead, bismuth, antimony and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. Through the above-mentioned special component ratio, the alloy temperature fuse heats evenly when heated and is more sensitive to temperature changes, thereby improving the thermal conductivity of the alloy temperature fuse. Therefore, the alloy temperature fuse can be quickly melted when heated. In addition, since the structure of the alloy temperature fuse is a long strip of alloy without an insulating shell and other complex components, it will not cause heat conduction loss due to multiple media, so that the above-mentioned technical effects can be further improved.

[0017] (2) In one embodiment of the present invention, the alloy temperature fuse can be directly soldered to a circuit board or semi-finished product, so it will not melt due to wave soldering and lose its protection function prematurely. In this way, the reliability of the alloy temperature fuse can be greatly improved to ensure that the alloy temperature fuse can normally provide the temperature protection function. Therefore, the alloy temperature fuse can meet the needs of practical applications.

[0018] (3) In one embodiment of the present invention, the alloy temperature fuse is structured as a long strip of alloy without an insulating shell or other complex components. The alloy temperature fuse does not need to be fixed to the circuit board by adhesive. In this way, the alloy temperature fuse can be installed using automated equipment, which greatly reduces the installation cost and complexity of the alloy temperature fuse. Therefore, the application of the alloy temperature fuse can be more extensive and can better meet the needs of different applications.

[0019] (4) In one embodiment of the present invention, the alloy thermal fuse is constructed as a long strip of alloy without an insulating housing or other complex components. Therefore, the alloy thermal fuse can be very small and does not occupy the internal space of the device. Therefore, the device can be more compact, which not only reduces manufacturing costs but also saves transportation costs.

[0020] (5) In one embodiment of the present invention, the alloy temperature fuse has a special composition ratio. This special composition ratio enables the alloy temperature fuse to achieve excellent conductivity. Thus, the alloy temperature fuse can not only provide temperature protection when the circuit board is overheated, but also provide temperature protection when the circuit board is overcurrent. Therefore, the safety of the alloy temperature fuse can be greatly improved.

[0021] (6) In one embodiment of the present invention, the alloy temperature fuse can achieve the desired effect while reducing costs. In this way, the practicality of the alloy temperature fuse can be greatly improved, and it can be applied to various electronic devices and improve the safety of these electronic devices. Therefore, the alloy temperature fuse can meet the trend of future development. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 1 is a first schematic diagram of the installation process of the alloy temperature fuse according to the first embodiment of the present invention.

[0023] Figure 2 This is a second schematic diagram of the installation process of the alloy temperature fuse according to the first embodiment of the present invention.

[0024] Figure 3 FIG. 3 is a third schematic diagram of the installation process of the alloy thermal fuse according to the first embodiment of the present invention.

[0025] Figure 4 FIG4 is a fourth schematic diagram of the installation process of the alloy thermal fuse according to the first embodiment of the present invention.

[0026] Figure 5 FIG. 4 is a flow chart of a method for installing an alloy thermal fuse according to a fifth embodiment of the present invention.

[0027] Description of reference numerals:

[0028] TS-alloy temperature fuse; MR-alloy material; LH-lamp holder; S51~S54-step process.

[0029] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient to enable anyone skilled in the relevant art to understand the technical content of the present invention and implement it accordingly. Moreover, based on the content, claims and drawings disclosed in this specification, anyone skilled in the relevant art can easily understand the purposes and advantages of this creation. DETAILED DESCRIPTION

[0030] The following describes embodiments of the alloy thermal fuse according to the present invention with reference to the relevant drawings. For clarity and convenience, the dimensions and proportions of the components in the drawings may be exaggerated or reduced. In the following description and / or claims, when a component is referred to as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component or there may be intervening components. When a component is referred to as being "directly connected" or "directly coupled" to another component, there are no intervening components. Other words used to describe the relationship between components or layers should be interpreted similarly. For ease of understanding, identical components in the following embodiments are labeled with the same symbols.

[0031] See also Figure 1 This is a first schematic diagram of the installation process of the alloy thermal fuse according to the first embodiment of the present invention. As shown in the figure, the user can use automated equipment to cut the alloy material MR into appropriate lengths. In this embodiment, the alloy material MR is cut to a length that matches the lamp base LH.

[0032] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0033] See also Figure 2 This is a second schematic diagram of the installation process of the alloy thermal fuse according to the first embodiment of the present invention. As shown, the user can wave solder the circuit board MB (power supply or semi-finished product) and then use automatic soldering equipment to solder the alloy material MR to the pads on the circuit board MB.

[0034] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0035] See also Figure 3, which is a third schematic diagram illustrating the installation process of the alloy thermal fuse according to the first embodiment of the present invention. As shown in the figure, the user can insert the alloy material MR into the pins of the lamp holder LH, then rivet and trim off the excess portion of the alloy material MR.

[0036] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0037] See also Figure 4 , which is a fourth schematic diagram of the installation process of the alloy temperature fuse of the first embodiment of the present invention. As shown in the figure, the alloy material MR can then be used as the alloy temperature fuse TS to provide temperature protection function.

[0038] This embodiment discloses an alloy temperature fuse made of an alloy material MR. This alloy material includes tin (Sn), lead (Pb), bismuth (Bi), antimony (Sb), and nickel (Ni). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth. For example, the weight percentage of tin is 63%; the weight percentage of lead is 36.5%; the weight percentage of bismuth is 0.2%; the weight percentage of antimony is 0.15%; and the weight percentage of nickel is 0.15%. For example, the weight percentage of tin is 63.5%; the weight percentage of lead is 36.3%; the weight percentage of bismuth is 0.08%; the weight percentage of antimony is 0.07%; and the weight percentage of nickel is 0.05%. For example, the weight percentage of tin is 63.5%; the weight percentage of lead is 36.3%; the weight percentage of bismuth is 0.09%; the weight percentage of antimony is 0.08%; and the weight percentage of nickel is 0.03%. The specific gravity of the alloy material MR is between 7 and 8. The solidus temperature of the alloy material MR is between 181° and 185°. The liquidus temperature of the alloy material MR is between 181° and 185°.

[0039] This unique compositional ratio allows the Alloy Thermal Fuse TS to generate heat evenly when heated and is more sensitive to temperature changes, enhancing its thermal conductivity. Consequently, the Alloy Thermal Fuse TS can quickly fuse when heated. Furthermore, since the Alloy Thermal Fuse TS is constructed as a single, long alloy strip without an insulating housing or other complex components, it eliminates the heat loss associated with multiple media, further enhancing the aforementioned technical benefits.

[0040] Furthermore, in this embodiment, the alloy thermal fuse TS can be directly soldered to the circuit board MB or semi-finished product. Therefore, it will not prematurely lose its protective function due to melting during wave soldering. This significantly improves the reliability of the alloy thermal fuse TS, ensuring that it can properly provide thermal protection. Therefore, the alloy thermal fuse TS can meet the needs of practical applications.

[0041] Furthermore, in this embodiment, the alloy thermal fuse TS is constructed as a long alloy strip, lacking an insulating housing or other complex components. It also does not require adhesive attachment to the circuit board MB. This allows for automated installation, significantly reducing installation costs and complexity. Consequently, the alloy thermal fuse TS can be used in a wider range of applications, better meeting the needs of diverse applications.

[0042] Furthermore, in this embodiment, the alloy thermal fuse TS is constructed as a long strip of alloy, without an insulating housing or other complex components. Therefore, the alloy thermal fuse TS can be very small, not occupying the internal space of the device. This allows for a more compact device, which not only reduces manufacturing costs but also shipping costs.

[0043] Furthermore, in this embodiment, the alloy thermal fuse TS has a unique composition ratio. This unique composition ratio enables the alloy thermal fuse TS to achieve excellent conductivity. Thus, the alloy thermal fuse TS not only provides thermal protection against overheating of the circuit board MB, but also against overcurrent conditions. Consequently, the safety of the alloy thermal fuse TS is significantly enhanced.

[0044] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0045] It's worth noting that the alloy material MR portion of a cartridge-type thermal fuse is prone to melting due to reaching its melting point during wave soldering, prematurely losing its protective function. Similarly, a cartridge-type thermal fuse has an insulating housing and other complex components, which are prone to heat loss due to multiple dielectrics. Furthermore, during installation, the user needs to perform at least one shaping step on the alloy material MR portion of the cartridge-type thermal fuse, and the pins connecting the cartridge-type thermal fuse to the circuit board need to be insulated. Furthermore, the distance between the pins and the circuit board requires further adjustment, which may also require another shaping step. Furthermore, the cartridge-type thermal fuse also needs to be secured to the circuit board with adhesive. These factors increase the complexity of cartridge-type thermal fuse installation. In contrast, according to an embodiment of the present invention, the alloy material MR of the thermal fuse TS is made of tin, lead, bismuth, antimony, and nickel. The weight percentage of tin is 62% to 63.5%, the weight percentage of lead is 36% to 37%, and the weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of bismuth is greater than the weight percentage of antimony and the weight percentage of nickel. The sum of the weight percentages of antimony and nickel is greater than the weight percentage of bismuth. Due to the above-mentioned special component ratio, the alloy temperature fuse TS generates heat evenly when heated and is more sensitive to temperature changes, thereby improving the thermal conductivity of the alloy temperature fuse TS. Therefore, the alloy temperature fuse TS can melt quickly when heated. In addition, since the structure of the alloy temperature fuse TS is a long strip of alloy without an insulating shell and other complex components, it will not cause heat conduction loss due to multiple media, so that the above-mentioned technical effects can be further improved.

[0046] According to the embodiments of the present invention, the alloy thermal fuse TS can be directly soldered to a circuit board or semi-finished product, preventing it from prematurely losing its protective function due to melting during wave soldering. This significantly improves the reliability of the alloy thermal fuse TS, ensuring that it can properly provide thermal protection. Therefore, the alloy thermal fuse TS can meet the needs of practical applications.

[0047] Furthermore, according to an embodiment of the present invention, the alloy thermal fuse TS is constructed as a single, long alloy strip, without an insulating housing or other complex components. It also does not require adhesive attachment to the circuit board. This allows the TS to be installed using automated equipment, significantly reducing installation costs and complexity. Consequently, the TS alloy thermal fuse can be used in a wider range of applications, better meeting the needs of diverse applications.

[0048] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS is constructed as a single, long alloy strip, without an insulating housing or other complex components. Consequently, the alloy thermal fuse TS can be very compact, eliminating the need to occupy internal space within the device. This allows for a more compact device, reducing both manufacturing and shipping costs.

[0049] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS has a unique composition ratio. This unique composition ratio enables the alloy thermal fuse TS to achieve excellent conductivity. As a result, the alloy thermal fuse TS not only provides thermal protection against circuit board overheating but also against circuit board overcurrent. Consequently, the safety of the alloy thermal fuse TS is significantly enhanced.

[0050] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS can achieve desired functionality while reducing costs. This significantly enhances the practicality of the alloy thermal fuse TS, allowing its application in a wide variety of electronic devices and improving their safety. Therefore, the alloy thermal fuse TS is well-suited to future development trends. As can be seen from the foregoing, the alloy thermal fuse TS according to embodiments of the present invention can indeed achieve excellent technical results.

[0051] A second embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS includes not only tin, lead, bismuth, antimony, and nickel, but may also include copper (Cu), silver (Ag), and zinc (Zn). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentages of antimony and nickel. The sum of the weight percentages of antimony and nickel is greater than the weight percentage of bismuth.

[0052] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.03%; and the weight percentage of zinc is 0.001%. For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.029%; and the weight percentage of zinc is 0.002%.

[0053] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0054] A third embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS includes not only tin, lead, bismuth, antimony, nickel, copper, silver, and zinc, but also iron (Fe) and aluminum (Al). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of iron is 0.0001% to 0.002%. The weight percentage of aluminum is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentages of antimony and nickel. The sum of the weight percentage of antimony and the weight percentage of nickel is greater than the weight percentage of bismuth.

[0055] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.028%; the weight percentage of zinc is 0.001%; ​​the weight percentage of iron is 0.001%; ​​and the weight percentage of aluminum is 0.001%. For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.027%; the weight percentage of zinc is 0.002%; the weight percentage of iron is 0.001%; ​​and the weight percentage of aluminum is 0.001%.

[0056] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0057] A fourth embodiment of the present invention discloses that the alloy material MR of the alloy temperature fuse TS includes not only tin, lead, bismuth, antimony, nickel, copper, silver, zinc, iron, and aluminum, but may also include arsenic (As) and cadmium (Cd). The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.0001% to 0.5%. The weight percentage of antimony is 0.0001% to 0.3%. The weight percentage of nickel is 0.0001% to 0.3%. The weight percentage of copper is 0.0001% to 0.05%. The weight percentage of silver is 0.0001% to 0.05%. The weight percentage of zinc is 0.0001% to 0.002%. The weight percentage of iron is 0.0001% to 0.002%. The weight percentage of aluminum is 0.0001% to 0.002%. The weight percentage of arsenic is 0.0001% to 0.002%. The weight percentage of cadmium is 0.0001% to 0.002%. The weight percentage of bismuth is greater than the weight percentages of antimony and nickel. The sum of the weight percentages of antimony and nickel is greater than the weight percentage of bismuth. The weight percentage of copper is greater than the weight percentage of any one of silver, zinc, iron, aluminum, arsenic, and cadmium. The weight percentage of silver is greater than the weight percentage of any one of zinc, iron, aluminum, arsenic, and cadmium.

[0058] For example, the weight percentage of tin is 63.02%; the weight percentage of lead is 36.05%; the weight percentage of bismuth is 0.4%; the weight percentage of antimony is 0.3%; the weight percentage of nickel is 0.159%; the weight percentage of copper is 0.04%; the weight percentage of silver is 0.026%; the weight percentage of zinc is 0.001%; ​​the weight percentage of iron is 0.001%; ​​the weight percentage of aluminum is 0.001%; ​​the weight percentage of arsenic is 0.001%; ​​and the weight percentage of cadmium is 0.001%. For example, the weight percentage of tin is 63.0012%; the weight percentage of lead is 36.9939%; the weight percentage of bismuth is 0.0013%; the weight percentage of antimony is 0.0009%; the weight percentage of nickel is 0.0009%; the weight percentage of copper is 0.0006%; the weight percentage of silver is 0.0005%; the weight percentage of zinc is 0.0001%; ​​the weight percentage of iron is 0.0003%; the weight percentage of aluminum is 0.0001%; ​​the weight percentage of arsenic is 0.0001%; ​​and the weight percentage of cadmium is 0.0001%. The specific gravity of the alloy thermal fuse TS can be 7.41. The fixed line temperature of the alloy thermal fuse TS can be 183°. The liquidus temperature of the alloy thermal fuse TS can be 183°.

[0059] As mentioned above, the alloy thermal fuse TS features a unique compositional ratio. This allows the fuse to heat evenly when heated and is more sensitive to temperature changes, enhancing its thermal conductivity. Consequently, the fuse can quickly fuse when heated. Furthermore, since the fuse TS is constructed as a single, long alloy strip without an insulating housing or other complex components, it avoids heat loss due to multiple media, further enhancing the aforementioned technical benefits.

[0060] The Alloy Thermal Fuse TS can achieve the desired effect while reducing costs. This significantly increases the practicality of the Alloy Thermal Fuse TS, allowing its application in a wide variety of electronic devices and enhancing their safety. Therefore, the Alloy Thermal Fuse TS is well-suited to future development trends.

[0061] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the alloy temperature fuse according to this embodiment should still be included in the patent scope of the present invention.

[0062] See also Figure 5 , which is a flow chart of the method for installing the alloy temperature fuse of the fifth embodiment of the present invention. As shown in the figure, the method for installing the alloy temperature fuse of this embodiment includes the following steps:

[0063] Step S51: Cut the alloy material MR into appropriate lengths.

[0064] Step S52: Welding the alloy material MR onto the pads of the circuit board.

[0065] Step S53: inserting the alloy material MR into the pins of the lamp holder LH.

[0066] Step S54: performing riveting and trimming off the excess portion of the alloy material MR.

[0067] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made according to the installation method of the alloy temperature fuse of this embodiment should still be included in the patent scope of the present invention.

[0068] Although the steps of the method described in the present invention are shown and described in a particular order, the order of operation of each method can be changed, and some steps can be performed in a reverse order, or some steps can be performed simultaneously with other steps. In another embodiment, different steps can be implemented in an intermittent and / or alternating manner.

[0069] In summary, according to an embodiment of the present invention, an alloy thermal fuse TS is made of an alloy material MR, which includes tin, lead, bismuth, antimony, and nickel. The weight percentage of tin is 62% to 63.5%. The weight percentage of lead is 36% to 37%. The weight percentage of bismuth is 0.03% to 0.5%. The weight percentage of antimony is 0.03% to 0.3%. The weight percentage of nickel is 0.03% to 0.3%. The weight percentage of bismuth is greater than the weight percentages of antimony and nickel. The sum of the weight percentages of antimony and nickel is greater than the weight percentage of bismuth. Due to this special composition ratio, the alloy thermal fuse TS generates heat evenly when heated and is more sensitive to temperature changes, thereby improving the thermal conductivity of the alloy thermal fuse TS. Therefore, the alloy thermal fuse TS can quickly fuse when heated. Furthermore, because the alloy thermal fuse TS is constructed as a long alloy strip without an insulating shell or other complex components, it avoids heat conduction losses caused by multiple media, further enhancing the aforementioned technical effects.

[0070] According to the embodiments of the present invention, the alloy thermal fuse TS can be directly soldered to a circuit board or semi-finished product, preventing it from prematurely losing its protective function due to melting during wave soldering. This significantly improves the reliability of the alloy thermal fuse TS, ensuring that it can properly provide thermal protection. Therefore, the alloy thermal fuse TS can meet the needs of practical applications.

[0071] Furthermore, according to an embodiment of the present invention, the alloy thermal fuse TS is constructed as a single, long alloy strip, without an insulating housing or other complex components. It also does not require adhesive attachment to the circuit board. This allows the TS to be installed using automated equipment, significantly reducing installation costs and complexity. Consequently, the TS alloy thermal fuse can be used in a wider range of applications, better meeting the needs of diverse applications.

[0072] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS is constructed as a single, long alloy strip, without an insulating housing or other complex components. Consequently, the alloy thermal fuse TS can be very compact, eliminating the need to occupy internal space within the device. This allows for a more compact device, reducing both manufacturing and shipping costs.

[0073] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS has a unique composition ratio. This unique composition ratio enables the alloy thermal fuse TS to achieve excellent conductivity. As a result, the alloy thermal fuse TS not only provides thermal protection against circuit board overheating but also against circuit board overcurrent. Consequently, the safety of the alloy thermal fuse TS is significantly enhanced.

[0074] Furthermore, according to embodiments of the present invention, the alloy thermal fuse TS can achieve desired functionality while reducing costs. This significantly enhances the practicality of the alloy thermal fuse TS, allowing its application in a variety of electronic devices and improving their safety. Therefore, the alloy thermal fuse TS is well-suited to future development trends.

[0075] It should be noted that although the above embodiments have been described herein, this does not limit the scope of patent protection of the present invention. Therefore, based on the innovative concept of the present invention, changes and modifications to the embodiments described herein, or equivalent structural or equivalent process transformations made using the contents of the present invention's description and drawings, and direct or indirect application of the above technical solutions to other related technical fields are all included in the scope of protection of the present invention's patent.

Claims

1. An alloy temperature fuse, characterized in that: The alloy temperature fuse is made of an alloy material, which includes tin, lead, bismuth, antimony and nickel, wherein the weight percentage of the tin is 62% to 63.5%, the weight percentage of the lead is 36% to 37%, the weight percentage of the bismuth is 0.0001% to 0.5%, the weight percentage of the antimony is 0.0001% to 0.3%, and the weight percentage of the nickel is 0.0001% to 0.3%, the weight percentage of the bismuth is greater than the weight percentage of the antimony and the weight percentage of the nickel, and the sum of the weight percentage of the antimony and the weight percentage of the nickel is greater than the weight percentage of the bismuth.

2. The alloy thermal fuse according to claim 1, characterized in that: The alloy material further includes copper, silver and zinc. The weight percentage of copper is 0.0001% to 0.05%, the weight percentage of silver is 0.0001% to 0.05%, and the weight percentage of zinc is 0.0001% to 0.002%.

3. The alloy thermal fuse according to claim 2, characterized in that: The alloy material further includes iron and aluminum, wherein the weight percentage of the iron is 0.0001% to 0.002%, and the weight percentage of the aluminum is 0.0001% to 0.002%.

4. The alloy thermal fuse according to claim 3, characterized in that: The alloy material further includes arsenic and cadmium. The weight percentage of the arsenic is 0.0001% to 0.002%, and the weight percentage of the cadmium is 0.0001% to 0.002%.

5. The alloy thermal fuse according to claim 4, characterized in that: The weight percentage of any one of the bismuth, the antimony, and the nickel is greater than the weight percentage of any one of the copper, the silver, the zinc, the iron, the aluminum, the arsenic, and the cadmium.

6. The alloy thermal fuse according to claim 5, characterized in that: The weight percentage of the copper is greater than the weight percentage of any one of the silver, the zinc, the iron, the aluminum, the arsenic, and the cadmium.

7. The alloy thermal fuse according to claim 6, characterized in that: The weight percentage of the silver is greater than the weight percentage of any one of the zinc, the iron, the aluminum, the arsenic, and the cadmium.

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