Positioning method, device for deconstructing electronic component, computer program product and computer readable storage medium

Abstract

The invention provides a positioning method, which comprises the following steps: providing a control object image, providing a subject matter, generating a subject matter image from the subject matter, comparing the subject matter image with the control object image to determine the difference of the subject matter image relative to the control object image, and generating a positioning instruction based on the difference, and positioning to the difference of the subject matter relative to the control image. An apparatus for deconstructing an electronic component, a computer program product, and a computer readable storage medium in which a program is stored are also provided.

Description

Technical Field

[0001] The invention relates to a positioning method and a device for deconstructing electronic components. Background Art

[0002] With the development of the manufacturing process of electronic components (such as microelectronic components, LEDs or microLEDs), a process for transferring a large number of electronic components, LEDs or microLEDs from one substrate to another substrate has been developed, which is conducive to the mass production of electronic components.

[0003] However, in the process of transferring an electronic component, LED or micro LED from one substrate to another, or removing an electronic component, LED or micro LED from one substrate, the system needs to know the position of the electronic component, LED or micro LED, and the transfer or removal process may not always be smooth. Therefore, locating the electronic component, LED or micro LED or judging whether the electronic component, LED or micro LED exists, has been transferred or has been removed is an important issue in this process. Summary of the invention

[0004] The present invention is directed to a positioning method, which can accurately locate the difference between a target object and a reference object image.

[0005] The present invention is directed to a device for deconstructing electronic components, which can accurately position an energy beam to a desired location.

[0006] An embodiment of the present invention provides a positioning method, which includes: providing a reference object image, providing a target object, generating a target object image from the target object, comparing the target object image with the reference object image to determine the difference between the target object image and the reference object image, and generating a positioning instruction based on the difference to locate the target object at the difference between the target object image and the reference object image.

[0007] An embodiment of the present invention provides a device for deconstructing electronic components, which includes a platform, an energy generating mechanism, and a control unit. The platform is used to carry a substrate of the electronic component. The energy generating mechanism is used to generate an energy beam on the substrate carried by the platform, and the energy generating mechanism can move relative to the platform. The control unit is used to execute the positioning method, control the relative movement between the platform and the energy generating mechanism, so as to position the energy beam to a desired position.

[0008] An embodiment of the present invention provides a computer program product, which includes a computer program. After the computer program is loaded and executed by a computer, the above positioning method can be completed.

[0009] The embodiment of the present invention provides a computer-readable storage medium storing a program. After the program is loaded and executed by a computer, the above positioning method can be completed.

[0010] In the positioning method, the device for deconstructing electronic components, the computer program product and the computer-readable storage medium storing the program in the embodiments of the present invention, since the target object image is compared with the reference object image to determine the difference between the target object image and the reference object image, the positioning method, the computer program product and the computer-readable storage medium storing the program in the embodiments of the present invention can accurately locate the difference between the target object image and the reference object image, and the device for deconstructing electronic components in the embodiments of the present invention can accurately position the energy beam to the desired position. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of a device for deconstructing electronic components according to an embodiment of the present invention;

[0012] FIG. 2A to FIG. 2C A schematic diagram for illustrating the process of a positioning method according to an embodiment of the present invention;

[0013] Figure 3 for FIG. 2A to FIG. 2C Flowchart of the positioning method.

[0014] Description of Reference Numerals

[0015] 100: Device for deconstructing electronic components;

[0016] 110: platform;

[0017] 120: Energy generating mechanism;

[0018] 122: Energy beam;

[0019] 130: control unit;

[0020] 132: Camera;

[0021] 140: Computer;

[0022] 142: Computer readable storage medium;

[0023] 200: substrate;

[0024] 202: alignment mark;

[0025] 210: Electronic components;

[0026] 212: Electrode;

[0027] 214: solder;

[0028] 220: welding pad;

[0029] 300: control image;

[0030] 400: Subject matter;

[0031] 410: target object image;

[0032] S110, S120, S130, S140, S150: steps. DETAILED DESCRIPTION

[0033] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0034] Figure 1 is a schematic diagram of a structure of a device for deconstructing electronic components according to an embodiment of the present invention, and FIG. 2A to FIG. 2C is a schematic diagram for illustrating the process of a positioning method according to an embodiment of the present invention, wherein Figure 1 is a side view schematic diagram, and FIG. 2A to FIG. 2C All are schematic diagrams viewed from above. Figure 3 for FIG. 2A to FIG. 2C Please refer to the flowchart of the positioning method. Figure 1 , FIG. 2A to FIG. 2C and Figure 3 , the positioning method of the present embodiment can be implemented by the device 100 for deconstructing electronic components of the present embodiment, and can be applied to the device 100 for deconstructing electronic components of the present embodiment, but the present invention is not limited thereto. The device 100 for deconstructing electronic components of the present embodiment includes a platform 110, an energy generating mechanism 120 and a control unit 130. The platform 110 is used to carry a substrate 200 of an electronic component 210. In the present embodiment, the electronic component 210 is a light emitting diode, and the electronic component 210 includes an electrode 212 and a solder 214, and the solder 214 is formed on the electrode 212, and the material of the solder 214 is, for example, tin. However, in other embodiments, the electronic component 210 may also be other appropriate electronic components. In the present embodiment, the substrate 200 is, for example, a circuit substrate. In other embodiments, the substrate 200 may also be a temporary substrate. In the present embodiment, the electronic component 210 is fixed on the substrate 200 by soldering the solder 214 with the solder pad 220. For example, each electronic component 210 may be fixed on the substrate 200 via two soldering pads 220. In other embodiments, solder 214 may be formed on the soldering pads 220. Alternatively, in another embodiment, the electronic component 210 includes an electrode 212, and the electronic component 210 is fixed on the substrate 200 via soldering of the electrode 212 and the soldering pad 220.

[0035] The energy generating mechanism 120 is used to generate an energy beam 122 on the substrate 200 carried by the platform 110, and can move relative to the platform 110. In this embodiment, the energy generating mechanism 120 is a laser generating mechanism, and the energy beam 122 is, for example, a laser beam.

[0036] The control unit 130 is used to execute the positioning method of this embodiment, and the positioning method of this embodiment includes the following steps. First, Figure 2A and Figure 3 As shown, step S110 is performed to provide a reference image 300. In this embodiment, the reference image 300 is an image of the welding pad 220. Figure 2B and Figure 3 As shown, step S120 is performed, which is to provide a target object 400. In this embodiment, the target object is a soldering pad 220 having an electronic component 210 thereon.

[0037] Afterwards, if Figure 2C and Figure 3 As shown, step S130 is performed, which is to generate a target image 410 from the target 400. In this embodiment, a camera 132 is provided in the control unit 130, by which the target image 410 is generated from the target 400. Specifically, the camera 132 can first photograph the alignment mark 202 on the substrate 200 to determine the relative position of the camera 132 and the substrate 200. Then, since the position of the welding pad 220 on the substrate 200 relative to the position of the alignment mark 202 is known, the control unit 130 can move the welding pad 220 to the bottom of the camera 132 and photograph the target 400 to generate the target image 410. In this embodiment, the camera 132 can be a charge coupled device (CCD) camera or a complementary metal oxide semiconductor (CMOS) camera. In another embodiment, the control unit 130 can move the camera 132 above the welding pad 220.

[0038] Then, step S140 is performed to compare the target image 410 with the reference image 300 to determine the difference between the target image 410 and the reference image 300. For example, the reference image 300 is an image without the electronic component 210 disposed on the soldering pad 220, and if the target image 410 is an image with the electronic component 210 disposed on the soldering pad 220, then the difference between the target image 410 and the reference image 300 will be the image of the electronic component 210 (e.g., a light emitting diode). For example, in one embodiment, if the target image 410 and the reference image 300 have a threshold ratio (e.g., 80%) of pixels that are the same, the control unit 130 regards the target image 410 and the reference image 300 as the same, and if the target image 410 and the reference image 300 have less than the threshold ratio (e.g., less than 80%) of pixels that are the same, the control unit 130 regards the target image 410 and the reference image 300 as different, and determines the difference between the target image 410 and the reference image 300. In another embodiment, the threshold ratio may also be 100%, that is, the control unit 130 regards the target image 410 and the reference image 300 as the same only if all pixels are the same, otherwise they are considered different.

[0039] Afterwards, step S150 is executed, which is to generate a positioning instruction based on the above difference (such as the image of the electronic component 210), and position the target 400 to the difference of the reference image 300, such as positioning to the image of the electronic component 210. In this embodiment, there are two methods for positioning the image of the electronic component 210. One is to directly record the coordinates of the image where the difference is found after the difference is compared as above; and the other is that since the relative position of the welding pad 220 relative to the alignment mark 202 is known, and the relative position of the electronic component 210 relative to the welding pad 220 is also known, the electronic component 210 originally has a preset coordinate position, and the above-mentioned difference in the image can determine that there is an electronic component 210 here, and then record this preset coordinate position as the positioning coordinate position of the electronic component 210. On the contrary, if there is no difference between the compared images, it means that there is no electronic component 210 on the welding pad 220, and there is no need to locate the electronic component 210 in this image.

[0040] In the present embodiment, the control unit 130 is used to control the relative movement between the platform 110 and the energy generating mechanism 120 so as to position the energy beam 122 to a desired position. Specifically, after the electronic component 210 is positioned by the above positioning method, the control unit 130 can make the energy generating mechanism 120 align with the electronic component 210 and emit the energy beam 122 toward the electronic component 210 (i.e., the energy beam 122 is positioned to a desired position as mentioned above) to melt the solder 214. For example, the electronic component 210 can be removed by blowing air to the electronic component 210 with a nozzle or picking up the electronic component 210 with a picking mechanism, so that the electronic component 210 is separated from the substrate 200, thereby achieving the effect of deconstructing the electronic component 210. In another embodiment, the energy beam 122 melts the electrode 212 or the solder pad 220, and then removes the electronic component 210, so that the electronic component 210 is separated from the substrate 200, thereby achieving the effect of deconstructing the electronic component 210. Alternatively, in another embodiment, the energy beam 122 may also destroy the electronic component 210 to open the circuit of the electronic component 210 , such as destroying the epitaxial layer of the light-emitting diode and making the light-emitting diode not emit light, thereby achieving the effect of deconstructing the electronic component 210 .

[0041] The relative movement between the platform 110 and the energy generating mechanism 120 may be that the platform 110 is stationary and the energy generating mechanism 120 is moving, or the platform 110 is moving and the energy generating mechanism 120 is stationary, or both the platform 110 and the energy generating mechanism 120 are moving. In addition, in this embodiment, after positioning one electronic component 210, the next electronic component 210 may be positioned again until all the electronic components 210 on the substrate 200 are positioned or the electronic component 210 to be deconstructed is positioned.

[0042] In this embodiment, the energy generating mechanism 120 and the camera 132 are both electrically connected to the control unit 130. In this embodiment, the control unit 130 is a controller. In one embodiment, the control unit 130 is, for example, a central processing unit (CPU), a microprocessor (microprocessor), a digital signal processor (DSP), a programmable controller, a programmable logic device (PLD) or other similar devices or a combination of these devices, and the present invention is not limited thereto. In addition, in one embodiment, each function of the control unit 130 can be implemented as a plurality of program codes. These program codes are stored in a memory and executed by the control unit 130. Alternatively, in one embodiment, each function of the control unit 130 can be implemented as one or more circuits. The present invention is not limited to implementing each function of the control unit 130 in software or hardware.

[0043] In the present embodiment, the control unit 130 may be disposed in a computer 140, which may be, for example, a desktop computer, a laptop computer, various personal computers, a supercomputer, a tablet computer, a server, a work platform, a smart phone, a personal digital assistant, or any other form of computer. Here, a computer refers to a computer in a broad sense, and computers (or calculators) including various examples of the control unit 130 may be the computers referred to in the present embodiment.

[0044] The above positioning method can be implemented by using a computer program product or a computer-readable storage medium with a program stored therein. The computer program product of this embodiment includes a computer program, which can complete the steps of the above positioning method after being loaded and executed by the computer 140, for example, completing the steps S110, S120, S130, S140 and S150. The computer-readable storage medium 142 with a program stored therein of this embodiment can complete the steps of the above positioning method after being loaded and executed by the computer 140, for example, completing the steps S110, S120, S130, S140 and S150. The computer-readable storage medium 142 is, for example, a hard disk, a solid-state hard disk, a memory card, a flash memory, other non-volatile memory, an optical disk, a random access memory or any other form of storage. The above-mentioned "loading via the computer 140" can be loading the program in the computer-readable storage medium 142 into the control unit 130, and then executing the functions of the program via the control unit 130.

[0045] In summary, in the positioning method, the device for deconstructing electronic components, the computer program product and the computer-readable storage medium storing the program according to the embodiments of the present invention, since the target object image is compared with the reference object image to determine the difference between the target object image and the reference object image, the positioning method, the computer program product and the computer-readable storage medium storing the program according to the embodiments of the present invention can accurately locate the difference between the target object image and the reference object image, and the device for deconstructing electronic components according to the embodiments of the present invention can accurately position the energy beam to the desired position.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A positioning method, characterized in that: include: Providing images of control objects; Provide the subject matter; generating a target image from the target; Comparing the target object image with the reference object image to determine a difference between the target object image and the reference object image; as well as Based on the difference, a positioning instruction is generated to locate the target object at the difference between the target object image and the reference object image.

2. The positioning method according to claim 1, characterized in that: The subject matter is a solder pad having an electronic component thereon.

3. The positioning method according to claim 2, characterized in that: The electronic component is a light emitting diode.

4. The positioning method according to claim 2, characterized in that: The reference image is a welding pad image.

5. A device for deconstructing electronic components, characterized in that: include: A platform for carrying a substrate of the electronic component; An energy generating mechanism, used for generating an energy beam on the substrate carried by the platform, and the energy generating mechanism is suitable for moving relative to the platform; as well as A control unit is used to execute the positioning method according to any one of claims 1 to 4, and control the relative movement between the platform and the energy generating mechanism to position the energy beam to a desired position.

6. The device for deconstructing electronic components according to claim 5, characterized in that: The energy generating mechanism is a laser generating mechanism.

7. The device for deconstructing electronic components according to claim 6, characterized in that: A camera is arranged in the control unit, and the target object image is generated from the target object by the camera.

8. A computer program product, comprising a computer program, characterized in that After the computer program is loaded and executed by a computer, the positioning method according to any one of claims 1 to 4 can be completed.

9. A computer-readable storage medium storing a program, which can complete the positioning method according to any one of claims 1 to 4 after the program is loaded and executed by a computer.

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