Display device and preparation method thereof

Abstract

The invention provides a display device and a preparation method thereof, the display device comprises a substrate, an MIP packaging chip arranged on the substrate and a first packaging glue layer covering the substrate and the MIP packaging chip, the MIP packaging chip comprises a circuit substrate, a light-emitting chip layer and a micro lens, the circuit substrate is electrically connected to the substrate, the light-emitting chip layer is electrically connected to the substrate, and the micro lens is electrically connected to the substrate. A plurality of mounting surfaces are arranged on one side, far away from the substrate, of the circuit substrate; the light-emitting chip layer is arranged on the mounting surfaces, and the optical axis directions of light-emitting chips arranged on the mounting surfaces are different; the micro lens covers the light-emitting chip layer. The problems that an existing display device does not have multiple visual angles, and mutual switching of the multiple visual angles cannot be achieved are solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device and a method for preparing the same. Background Art

[0002] A display device is a device that can convert computer data into various text, numbers, symbols or intuitive images for display, and is widely used in mobile phones, computers and other fields.

[0003] With the continuous advancement of liquid crystal display technology, the viewing angle of displays is becoming wider and wider. Existing display devices usually have only one viewing angle, and most of them are wide viewing angles. However, while people enjoy the visual experience brought by a wide viewing angle, they also hope to effectively protect business secrets and personal privacy to avoid business losses or embarrassment caused by the leakage of screen information. In addition, in some occasions, display devices are required to have other viewing angles in addition to wide viewing angles to meet users' screen viewing needs of display devices. Obviously, existing display devices cannot meet the above requirements. Summary of the invention

[0004] The embodiment of the present application provides a display device and a method for preparing the same. By configuring a circuit substrate to have multiple mounting surfaces, and the optical axis directions of the light-emitting chips arranged on each mounting surface are different, the problem that the existing display device does not have multiple viewing angles and cannot switch between multiple viewing angles is solved.

[0005] The present invention is implemented as follows: a display device includes a substrate, a MIP packaged chip arranged on the substrate, and a first packaging glue layer covering the substrate and the MIP packaged chip, wherein the MIP packaged chip includes a circuit substrate, a light-emitting chip layer and a microlens, the circuit substrate is electrically connected to the substrate, and the circuit substrate has a plurality of mounting surfaces on a side away from the substrate; the light-emitting chip layer is arranged on the mounting surface, and the optical axis direction of each light-emitting chip arranged on the mounting surface is different; and the microlens covers the light-emitting chip layer.

[0006] In one embodiment, the light emitting chip layer includes a plurality of light emitting chips, a light shielding layer and a second encapsulation adhesive layer;

[0007] A plurality of the light emitting chips are arranged on the mounting surface at intervals;

[0008] The light shielding layer is arranged between two adjacent light emitting chips on the mounting surface;

[0009] The second packaging glue layer is filled between two adjacent light-emitting chips.

[0010] In one embodiment, the second encapsulation adhesive layer covers the light shielding layer, and a surface of the second encapsulation adhesive layer away from the light shielding layer is flush with a surface of the light emitting chip away from the mounting surface.

[0011] In one embodiment, the second packaging glue layer covers the light shielding layer and the light emitting chip.

[0012] In one of the embodiments, a surface of the microlens on one side away from the light-emitting chip layer and a surface of the microlens on one side close to the light-emitting chip layer are both provided with a protruding structure.

[0013] In one embodiment, the circuit substrate has three interconnected mounting surfaces on a side away from the substrate, one of the mounting surfaces is parallel to the substrate, and the other two mounting surfaces are respectively located on both sides of one of the mounting surfaces and inclined in different directions.

[0014] In one embodiment, the circuit substrate has five interconnected mounting surfaces on a side away from the substrate, one of the mounting surfaces is parallel to the substrate, and the other four mounting surfaces are respectively connected to four sides of one of the mounting surfaces and are inclined in different directions.

[0015] In one embodiment, the display device further includes a protective film layer, and the protective film layer is disposed on the first packaging adhesive layer.

[0016] The beneficial effect of the display device provided by the present application is that: compared with the prior art, the MIP packaged chip of the present application includes a circuit substrate, a light-emitting chip layer and a microlens, and the circuit substrate is set to have multiple mounting surfaces, and the optical axis direction of the light-emitting chip set on each mounting surface is different, so that the display device can have a variety of different viewing angles, and by individually controlling the light-emitting chips set on different mounting surfaces, it is also possible to switch between a variety of different viewing angles to meet the user's viewing angle requirements for the display device in different occasions. In addition, the setting of the microlens can make the light emitted by the light-emitting chip gather as much as possible, closer to the optical axis direction, and improve the display effect of the display device at each viewing angle.

[0017] The present application also provides a method for preparing a display device, which is used to prepare the display device as described in any of the above embodiments, including:

[0018] Manufacturing an array of circuit substrates, each of the circuit substrates having a plurality of mounting surfaces;

[0019] forming a light-emitting chip layer on each of the mounting surfaces;

[0020] Laminating microlenses on the light-emitting chip layer to obtain an array MIP packaged chip;

[0021] Cutting the MIP packaged chips in the array to obtain a plurality of independent MIP packaged chips;

[0022] Transferring a plurality of the MIP packaged chips onto a substrate;

[0023] Forming a first packaging glue layer on the MIP packaging chip;

[0024] A protective film layer is formed on the first packaging adhesive layer.

[0025] In one embodiment, the circuit substrate for making the array includes:

[0026] Etching an array of MIP substrates on a substrate, each of the MIP substrates having a plurality of mounting surfaces;

[0027] A plurality of through holes are provided on each of the mounting surfaces;

[0028] A circuit is laid in each of the through holes, and the circuit connects the mounting surface and the bottom surface of the substrate.

[0029] In one embodiment, forming a light-emitting chip layer on each of the mounting surfaces includes:

[0030] Spraying black ink on the installation surface to form a light-shielding layer;

[0031] Expose the black ink so that the black ink at a position on the mounting surface for mounting the light-emitting chip is removed;

[0032] Transferring the light-emitting chip to the position on the mounting surface where the black ink is removed;

[0033] A second packaging glue layer is filled between the light-emitting chips.

[0034] The beneficial effect of the method for preparing the display device provided by the present application is that: for preparing the above-mentioned display device, the MIP packaged chip of the present application includes a circuit substrate, a light-emitting chip layer and a microlens, and the circuit substrate is set to have multiple mounting surfaces, and the optical axis direction of the light-emitting chip set on each mounting surface is different, so that the display device can have a variety of different viewing angles, and by individually controlling the light-emitting chips set on different mounting surfaces, it is also possible to switch between a variety of different viewing angles to meet the user's viewing angle requirements for the display device in different occasions. In addition, the setting of the microlens can make the light emitted by the light-emitting chip gather as much as possible, closer to the optical axis direction, and improve the display effect of the display device at each viewing angle. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1is a schematic diagram of the structure of a display device provided in Embodiment 1 of the present application;

[0036] Figure 2 yes Figure 1 AA cross section in;

[0037] Figure 3 is a schematic diagram of the structure of the MIP packaged chip of the display device provided in the first embodiment of the present application;

[0038] Figure 4 is a schematic diagram of the structure of a display device provided in Embodiment 2 of the present application;

[0039] Figure 5 yes Figure 4 Front view of the MIP packaged chip;

[0040] Figure 6 is a schematic flow chart of a method for preparing a display device provided in Embodiment 3 of the present application;

[0041] Figure 7 yes Figure 6 Specific flow diagram of step S101;

[0042] Figure 8-1 is a schematic diagram of the device structure for completing step S1011;

[0043] Figure 8-2 is a schematic diagram of the device structure for completing step S1013;

[0044] Fig. 9 yes Figure 6 Specific flow diagram of step S102;

[0045] Figure 10-1 is a schematic diagram of the device structure for completing step S1021;

[0046] Figure 10-2 is a schematic diagram of the device structure for completing step S1022;

[0047] Figure 10-3 is a schematic diagram of the device structure for completing step S1023;

[0048] Figure 10-4 is a schematic diagram of the device structure for completing step S1024;

[0049] Fig.11 It is a schematic diagram of the device structure for completing step S103.

[0050] Reference numerals: 1, substrate;

[0051] 2. MIP packaged chip; 21. circuit substrate; 210. mounting surface; 211. substrate; 212. MIP substrate; 213. through hole; 22. light-emitting chip layer; 221. light-emitting chip; 222. light-shielding layer; 223. second packaging adhesive layer; 23. microlens; 230. protruding structure;

[0052] 3. The first packaging adhesive layer; 4. The protective film layer. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0054] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0055] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0057] It should also be noted that, in the embodiments of the present application, the same figure mark is used to represent the same component or the same part. For the same parts in the embodiments of the present application, the figure may only mark one of the parts or components as an example. It should be understood that the figure mark also applies to other identical parts or components.

[0058] The embodiments of the present application provide a display device and a method for manufacturing the same, which solve the problem that the existing display device does not have multiple viewing angles and cannot switch between multiple viewing angles.

[0059] Embodiment 1

[0060] refer to Figure 1-Figure 3 The display device provided in the first embodiment of the present application includes a substrate 1, a MIP packaged chip 2 arranged on the substrate 1, and a first packaging glue layer 3 covering the substrate 1 and the MIP packaged chip 2. The MIP packaged chip 2 includes a circuit substrate 21, a light-emitting chip layer 22 and a microlens 23. The circuit substrate 21 is electrically connected to the substrate 1, and the side of the circuit substrate 21 away from the substrate 1 has multiple mounting surfaces 210; the light-emitting chip layer 22 is arranged on the mounting surface 210, and the optical axis direction of the light-emitting chip 221 arranged on each mounting surface 210 is different; the microlens 23 covers the light-emitting chip layer 22.

[0061] Among them, the first packaging glue layer 3 is formed by transparent packaging glue, which has low shrinkage, small warping, high light transmittance, high refraction, and high light output rate of the light-emitting chip. This can not only protect the MIP packaged chip 2, but also will not affect the light output rate of the light-emitting chip 221, and will not affect the display effect of the display device.

[0062] MIP (Micro LED in Package) is a new packaging architecture based on Micro LED. It is derived from the long-tested small-pitch display products. In essence, it is an organic combination of Micro LED and discrete devices, that is, the entire large-area display panel is packaged separately. In this way, the yield control will be greatly improved in a smaller area. At the same time, the testing link is moved from the chip to the packaging stage, which will effectively reduce the cost increase rate.

[0063] The light-emitting chip layer 22 includes a plurality of light-emitting chips 221, and the light-emitting chips 221 include a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip. A red light-emitting chip, a green light-emitting chip and a blue light-emitting chip are arranged together at intervals to form a pixel, and the optical axis direction of each light-emitting chip 221 is perpendicular to the mounting surface 210 where the light-emitting chip 221 is located.

[0064] In the embodiment of the present application, the circuit substrate 21 of the MIP packaged chip 2 is configured to have multiple mounting surfaces 210, and a light-emitting chip layer 22 is arranged on each mounting surface 210, so that the optical axis direction of the light-emitting chip 221 on each mounting surface 210 is different. In this way, by controlling the turning on and off of the light-emitting chips 221 on different mounting surfaces 210, the effect of controlling the light-emitting chips 221 on different mounting surfaces 210 to emit light separately can be achieved, so that the display device has a variety of different viewing angles, and different viewing angles can be switched freely, satisfying the user's need to have different viewing angles for the display device in different occasions.

[0065] In addition, a microlens 23 is provided on the light emitting chip layer 22, and the microlens 23 can gather the light emitted by the light emitting chip 221, so that all the light emitted by the light emitting chip 221 can be emitted in the optical axis direction of the light emitting chip 221, thereby improving the display effect of each viewing angle of the display device.

[0066] It should be noted that the above-mentioned substrate 1 is a substrate 1 with integrated circuits, the electronic substrate of the MIP packaged chip 2 also integrates circuits, and the circuits in the electronic substrate are electrically connected to the light-emitting chip 221. After the MIP packaged chip 2 is placed on the substrate 1, the circuits in the electronic substrate of the MIP packaged chip 2 will be electrically connected to the circuits in the substrate 1, thereby realizing independent control of the light-emitting chip 221 of the MIP packaged chip 2.

[0067] Specifically, by electrically connecting the circuit in the electronic substrate and the circuit integrated in the substrate 1, a control chip can be separately connected to each light-emitting chip 221, so that each light-emitting chip 221 can be separately controlled. When the display device needs to display a wide viewing angle, the control chip can be used to control the light-emitting chips 221 set on each mounting surface 210 to emit light, which not only can achieve a wide viewing angle, but also can improve the display brightness and display effect of the display device; when the display device needs to achieve a narrow viewing angle, the control chip can be used to control the light-emitting chips 221 set on a certain mounting surface 210 or several mounting surfaces 210 to emit light, and the light-emitting chips 221 set on other mounting surfaces 210 are all turned off, so that only a part of the light-emitting chips 221 will emit light, thereby narrowing the viewing angle of the display device.

[0068] In some embodiments, in addition to each of the above-mentioned light-emitting chips 221 being individually connected to a control chip to realize individual control of the light-emitting chip 221 so as to achieve switching between wide viewing angle and narrow viewing angle of the display device, the light-emitting chips 221 with the same light-emitting color arranged on each mounting surface 210 can also be connected to the same control chip. In this way, the light-emitting chips 221 arranged on the same mounting surface 210 can be controlled to achieve switching between wide viewing angle and narrow viewing angle of the display device, and the number of control chips used can be reduced, which not only saves costs, but also reduces the wiring complexity of the circuit integrated in the substrate 1.

[0069] The control methods described above are just a few examples, which do not mean that the light-emitting chip 221 can only be controlled by the above two control methods. Other control methods that can achieve the same purpose are also possible, and the embodiments of the present application do not make specific limitations.

[0070] In some embodiments, reference Figure 3The circuit substrate 21 has three interconnected mounting surfaces 210 on one side away from the substrate 1 , one mounting surface 210 is parallel to the substrate 1 , and the other two mounting surfaces 210 are respectively located on both sides of one mounting surface 210 and inclined in different directions.

[0071] Through the above settings, the circuit substrate 21 is set to have three mounting surfaces 210, and the three mounting surfaces 210 are not in the same plane. The light-emitting chips 221 arranged on the three mounting surfaces 210 can be controlled to emit light, so that the display device has a wide viewing angle; the light-emitting chip 221 arranged on a mounting surface 210 parallel to the substrate 1 among the three mounting surfaces 210 can also be controlled to emit light, so that the display device has a narrow viewing angle; the light-emitting chip 221 arranged on an inclined mounting surface 210 among the three mounting surfaces 210 can also be controlled to emit light, so that the display device has an inclined narrow viewing angle; by controlling the light-emitting chips 221 arranged on different mounting surfaces 210 to emit light, the display device can have multiple different viewing angles, and the required viewing angle can be freely switched according to different application occasions of the display device, so that the display device has a wider range of application and stronger practicality.

[0072] Specifically, refer to Figure 3 The cross section of the circuit substrate 21 can be a trapezoid, one surface of the trapezoid is in contact with the substrate 1, and the other three surfaces form three mounting surfaces 210. At least one pixel can be set on each mounting surface 210, that is, at least one red light-emitting chip, one green light-emitting chip and one blue light-emitting chip are set. For example, Figure 1 In the embodiment, two pixels are arranged on each mounting surface 210, that is, six light-emitting chips 221 are arranged. The number of pixels arranged on each mounting surface 210 can be selected according to actual requirements, and the embodiment of the present application does not make a specific limitation. It should be noted that when arranging the light-emitting chips 221, it is necessary to ensure that the light-emitting chips 221 are evenly distributed on the mounting surface 210 as much as possible, which is conducive to improving the display effect of the display device.

[0073] In some embodiments, reference Figure 3The light emitting chip layer 22 includes a plurality of light emitting chips 221, a light shielding layer 222, and a second packaging adhesive layer 223; the plurality of light emitting chips 221 are arranged at intervals on the mounting surface 210; the light shielding layer 222 is disposed between two adjacent light emitting chips 221 on the mounting surface 210; and the second packaging adhesive layer 223 is filled between two adjacent light emitting chips 221. In this way, the light emitting chips 221 included in the light emitting chip layer 22 are not easily displaced after being disposed on the mounting surface 210, and the light emitted by the light emitting chips 221 will be emitted from the second packaging adhesive layer 223, and the light shielding layer 222 will cover all positions on the mounting surface 210 except the position where the light emitting chips 221 are disposed, so that the circuit lines in the surface circuit substrate 21 may be exposed, which may affect the display effect of the display device.

[0074] It should be noted that when the light-emitting chips 221 are set on the mounting surface 210, they can be arranged in an array, that is, along the row direction, red light-emitting chips, green light-emitting chips and blue light-emitting chips are arranged in sequence, so that the light-emitting colors of the light-emitting chips 221 in each column are the same. In this way, the light-emitting chips 221 set on the circuit substrate 21 of the same MIP packaged chip 2 can be evenly arranged, which is beneficial to improving the display effect of the display device.

[0075] The shading layer 222 can be formed by black ink. Specifically, a layer of black ink is directly coated on the mounting surface 210, and then the position where the light-emitting chip 221 is to be set is reserved on the mounting surface 210 through exposure treatment, and the black ink at the reserved position is removed. The shading layer 222 set in this way is not only low in cost and simple to make, but also the position where the light-emitting chip 221 is to be installed can be determined when the black ink is exposed, which is conducive to quickly setting the light-emitting chip 221 at the reserved position on the mounting surface 210 and welding it to the P / N welding area at the reserved position.

[0076] The second encapsulation glue layer 223 is filled between two adjacent light-emitting chips 221, which can fix the light-emitting chip 221 and effectively prevent the light-emitting chip 221 from shifting. The second encapsulation glue layer 223 can use a transparent encapsulation glue of the same material as the first encapsulation glue layer 3, so that the light-emitting chip 221 can be fixed without affecting the light extraction rate of the light-emitting chip 221 and the display effect of the display device. Moreover, using the same material to make the first encapsulation glue layer 3 and the second encapsulation glue layer 223 can reduce material waste and reduce costs.

[0077] In some embodiments, reference Figure 3, the second encapsulation glue layer 223 covers the light shielding layer 222, and the surface of the second encapsulation glue layer 223 on one side away from the light shielding layer 222 is flush with the surface of the light emitting chip 221 on one side away from the mounting surface 210. In this way, the light emitting chip 221 can be fixed by the second encapsulation glue without displacement, and when the microlens 23 is arranged on the light emitting chip layer 22, the surface of the light emitting chip layer 22 on one side contacting the microlens 23 is a plane, which is conducive to the stable and reliable arrangement of the microlens 23 on the light emitting chip layer 22.

[0078] It should be noted that, since the side surface of the light-emitting chip 221 away from the mounting surface 210 is the light-emitting surface of the light-emitting chip 221, the side surface of the second packaging glue layer 223 away from the light-shielding layer 222 is flush with the side surface of the light-emitting chip 221 away from the mounting surface 210, so that the light-emitting surface of the light-emitting chip 221 does not have the second packaging glue layer 223, that is, the light emitted by the light-emitting chip 221 directly irradiates the microlens 23 for gathering, which can effectively avoid the light emitted by the light-emitting chip 221 from being lost in the emission light path, affecting the light output rate, thereby reducing the display brightness of the display device.

[0079] In some embodiments, the second encapsulation adhesive layer 223 covers the light shielding layer 222 and the light emitting chip 221. This is equivalent to the second encapsulation adhesive layer 223 wrapping the light emitting chip 221, which can not only fix the light emitting chip 221, but also protect the light emitting chip 221 from damage. In addition, when setting the second encapsulation adhesive layer 223, it is only necessary to ensure that the surface of the second encapsulation adhesive layer 223 is parallel to the mounting surface 210, and it is not necessary to observe whether the second encapsulation adhesive layer 223 is flush with the surface of the side of the light emitting chip 221 away from the mounting surface 210, which greatly reduces the difficulty of setting the second encapsulation adhesive layer 223, thereby improving the manufacturing efficiency of the MIP packaged chip 2.

[0080] In some embodiments, reference Figure 3 A protruding structure 230 is provided on a surface of the microlens 23 that is away from the light emitting chip layer 22 and a surface of the microlens 23 that is close to the light emitting chip layer 22 .

[0081] It should be noted that the microlens 23 is made of a material that can focus and shrink light and has a high light transmittance, such as PMMA, PET, etc.; a protrusion structure 230 is provided on the upper and lower surfaces of the microlens 23, and the convex lens principle of geometric optics is used to focus the light emitted by the light-emitting chip 221, so that the light emitted by the light-emitting chip 221 can be emitted as much as possible in the direction of the optical axis of the light-emitting chip 221, thereby improving the display brightness of the display device and enhancing the display effect of the display device at different viewing angles.

[0082] In some embodiments, reference Figure 2The display device further includes a protective film layer 4 , which is disposed on the first packaging adhesive layer 3 .

[0083] It should be noted that the protective film layer 4 is a film layer formed by combining AG and AF coatings, and the protective film layer 4 can play the role of anti-fingerprint and anti-dizziness.

[0084] Embodiment 2

[0085] refer to Figure 4 and Figure 5 The display device provided in the second embodiment of the present application is different from that in the first embodiment only in that the structure of the circuit substrate 21 is different. In the second embodiment of the present application, the circuit substrate 21 has five interconnected mounting surfaces 210 on the side away from the substrate 1, one of the mounting surfaces 210 is parallel to the substrate 1, and the other four mounting surfaces 210 are respectively connected to the four sides of one of the mounting surfaces 210 and are inclined in different directions.

[0086] Through the above settings, the circuit substrate 21 is set to have five mounting surfaces 210, and the five mounting surfaces 210 are not in the same plane. The light-emitting chips 221 arranged on the five mounting surfaces 210 can be controlled to emit light, so that the display device has a wide viewing angle; the light-emitting chip 221 arranged on a mounting surface 210 parallel to the substrate 1 among the five mounting surfaces 210 can also be controlled to emit light, so that the display device has a narrow viewing angle; the light-emitting chip 221 arranged on any inclined mounting surface 210 among the five mounting surfaces 210 can also be controlled to emit light, so that the display device has an inclined narrow viewing angle; by controlling the light-emitting chips 221 arranged on different mounting surfaces 210 to emit light, the display device can have multiple different viewing angles, and the required viewing angle can be freely switched according to different application occasions of the display device, so that the display device has a wider range of application and stronger practicality.

[0087] The circuit substrate 21 in the second embodiment of the present application has five mounting surfaces 210, and the circuit substrate 21 in the first embodiment has three mounting surfaces 210. Therefore, compared with the first embodiment, the display device in the second embodiment of the present application has more visible viewing angles, and the angle difference between each viewing angle is smaller, and can be adapted to use in more different occasions, and the application scope of the display device becomes wider.

[0088] refer to Figure 5 One surface of the circuit substrate 21 is in contact with the substrate 1, and the five surfaces of the circuit substrate 21 on the other side away from the substrate 1 form five mounting surfaces 210. At least one pixel can be set on each mounting surface 210, that is, at least one red light-emitting chip, one green light-emitting chip and one blue light-emitting chip are set. For example, Figure 5In the embodiment, one pixel is arranged on each mounting surface 210, that is, three light emitting chips 221 are arranged. The number of pixels arranged on each mounting surface 210 can be selected according to actual requirements, and the embodiment of the present application does not make a specific limitation. It should be noted that when arranging the light emitting chips 221, it is necessary to ensure that the light emitting chips 221 are evenly distributed on the mounting surface 210 as much as possible, which is conducive to improving the display effect of the display device.

[0089] Embodiment 3

[0090] refer to Figure 6 , Embodiment 3 of the present application provides a method for preparing a display device, comprising the following steps:

[0091] S101 , manufacturing an array of circuit substrates 21 , each circuit substrate 21 having a plurality of mounting surfaces 210 .

[0092] S102 , forming a light emitting chip layer 22 on each mounting surface 210 .

[0093] S103 , attaching the microlens 23 to the light emitting chip layer 22 to obtain the MIP packaged chip 2 of the array.

[0094] Fig.11 It is a schematic diagram of the device structure for completing step S103.

[0095] S104 , cutting the MIP packaged chips 2 in the array to obtain a plurality of independent MIP packaged chips 2 .

[0096] The schematic diagram of the device structure for completing step S104 can be referred to Figure 3 .

[0097] It should be noted that the MIP packaged chips 2 of the array, that is, multiple rows and columns of MIP packaged chips 2, are cut between two adjacent rows of the MIP packaged chips 2 of the array, and then cut between two adjacent columns of the MIP packaged chips 2 of the array, so as to divide the MIP packaged chips 2 of the array into multiple independent MIP packaged chips 2.

[0098] S105 , transferring a plurality of MIP packaged chips 2 onto the substrate 1 .

[0099] It should be noted that the substrate 1 is integrated with a circuit, and after the multiple MIP packaged chips 2 are transferred to the substrate 1, each MIP packaged chip 2 needs to be electrically connected to the substrate 1. Specifically, a welding piece can be provided at the position where the MIP packaged chip 2 is electrically connected when the integrated circuit is in the substrate 1, so that when the MIP packaged chip 2 is transferred to the substrate 1, it can be directly welded to the welding piece on the surface of the substrate 1 to realize the electrical connection between the MIP packaged chip 2 and the substrate 1, and this connection method is simpler.

[0100] S106 , forming a first packaging adhesive layer 3 on the MIP packaging chip 2 .

[0101] S107 , forming a protective film layer 4 on the first packaging adhesive layer 3 .

[0102] For further reference, Figure 7 Step S101 specifically includes the following steps:

[0103] S1011 , etching an array of MIP substrates 212 on a substrate 211 , each MIP substrate 212 having a plurality of mounting surfaces 210 .

[0104] Figure 8-1 Schematic diagram of the device structure after completing step S1011 . Specifically, a substrate 211 with a certain thickness, such as a glass plate, may be provided first, and then a plurality of mutually adjacent MIP substrates 212 may be etched on the substrate 211 .

[0105] S1012 , opening a plurality of through holes 213 on each mounting surface 210 .

[0106] It should be noted that the purpose of opening the through hole 213 on the mounting surface 210 is to lay a circuit to electrically connect the light-emitting chip 221 disposed on the mounting surface 210 with the circuit in the substrate 1, so as to facilitate the control of the light-emitting chip 221 to emit light. Therefore, the number of through holes 213 can be determined according to the number of light-emitting chips 221 that need to be disposed on the mounting surface 210, and the position of each through hole 213 opened on the mounting surface 210 also corresponds to the position of the light-emitting chip 221 that needs to be disposed on the mounting surface 210. The through hole 213 can be disposed perpendicular to the substrate 1, which is conducive to better laying of the circuit in the through hole 213.

[0107] S1013 , laying a circuit in each through hole 213 , and connecting the mounting surface 210 and the bottom surface of the substrate 211 .

[0108] Figure 8-2: is a schematic diagram of the device structure after completing step S1013. A soldering piece can be set at the position of the through hole 213 on the mounting surface 210, and a soldering piece can also be set at the position of the through hole 213 on the bottom surface of the substrate 211. After the circuit is laid in the through hole 213, one end of the circuit connected to the mounting surface 210 can be welded to the soldering piece on the mounting surface 210, and one end of the circuit connected to the bottom surface of the substrate 211 can be welded to the soldering piece on the bottom surface of the substrate 211. In this way, when the light-emitting chip 221 is set on the mounting surface 210, the electrode of the light-emitting chip 221 can be directly electrically connected to the soldering piece on the mounting surface 210. Similarly, when the MIP packaged chip 2 is transferred to the substrate 1, the soldering piece on the bottom surface of the substrate 211 can be directly welded to the soldering piece on the substrate 1, which greatly reduces the workload of setting the light-emitting chip 221 on the mounting surface 210 and the workload of transferring the MIP packaged chip 2 to the substrate 1.

[0109] For further reference, Fig. 9 Step S102 specifically includes the following steps:

[0110] S1021 , spray black ink on the mounting surface 210 to form a light shielding layer 222 .

[0111] Figure 10-1 It is a schematic diagram of the device structure for completing step S1021.

[0112] S1022 , performing exposure processing on the black ink so that the black ink at the position on the mounting surface 210 for mounting the light emitting chip 221 is removed.

[0113] Figure 10-2 It is a schematic diagram of the device structure for completing step S1022.

[0114] S1023 , transferring the light emitting chip 221 to the position on the mounting surface 210 where the black ink is removed.

[0115] Figure 10-3 It is a schematic diagram of the device structure for completing step S1023.

[0116] S1024 , filling a second packaging glue layer 223 between the light emitting chips 221 .

[0117] Figure 10-4 It is a schematic diagram of the device structure for completing step S1024.

[0118] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display device, comprising a substrate (1), a MIP packaged chip (2) arranged on the substrate (1), and a first packaging adhesive layer (3) covering the substrate (1) and the MIP packaged chip (2), It is characterized in that The MIP packaged chip (2) comprises: A circuit substrate (21) electrically connected to the substrate (1), wherein a side of the circuit substrate (21) away from the substrate (1) has a plurality of mounting surfaces (210); A light-emitting chip layer (22) is arranged on the mounting surface (210), wherein the optical axis directions of the light-emitting chips (221) arranged on each mounting surface (210) are different; A microlens (23) covers the light-emitting chip layer (22).

2. The display device according to claim 1, It is characterized in that The light-emitting chip layer (22) comprises a plurality of light-emitting chips (221), a light-shielding layer (222) and a second packaging adhesive layer (223); A plurality of the light-emitting chips (221) are arranged at intervals on the mounting surface (210); The light shielding layer (222) is provided between two adjacent light emitting chips (221) on the mounting surface (210); The second packaging glue layer (223) is filled between two adjacent light-emitting chips (221).

3. The display device according to claim 2, It is characterized in that The second encapsulation adhesive layer (223) covers the light shielding layer (222), and a surface of a side of the second encapsulation adhesive layer (223) away from the light shielding layer (222) is flush with a surface of a side of the light emitting chip (221) away from the mounting surface (210); Alternatively, the second encapsulation adhesive layer (223) covers the light shielding layer (222) and the light emitting chip (221).

4. The display device according to claim 2, It is characterized in that A surface of the microlens (23) on one side away from the light-emitting chip layer (22) and a surface of the microlens (23) on one side close to the light-emitting chip layer (22) are both provided with a protruding structure (230).

5. The display device according to any one of claims 1 to 4, It is characterized in that The circuit substrate (21) has three mounting surfaces (210) connected to each other on one side away from the substrate (1), one of the mounting surfaces (210) being parallel to the substrate (1), and the other two mounting surfaces (210) being located on both sides of one of the mounting surfaces (210) and inclined in different directions.

6. The display device according to any one of claims 1 to 4, It is characterized in that The circuit substrate (21) has five mutually connected mounting surfaces (210) on one side away from the substrate (1), one of the mounting surfaces (210) being parallel to the substrate (1), and the other four mounting surfaces (210) being respectively connected to four sides of one of the mounting surfaces (210) and inclined in different directions.

7. The display device according to any one of claims 1 to 4, It is characterized in that Also includes: The protective film layer (4) is arranged on the first packaging adhesive layer (3).

8. A method for preparing a display device, for preparing the display device according to any one of claims 1 to 7, It is characterized in that include: Manufacturing an array of circuit substrates (21), each of the circuit substrates (21) having a plurality of mounting surfaces (210); forming a light-emitting chip layer (22) on each of the mounting surfaces (210); Laminating a microlens (23) on the light-emitting chip layer (22) to obtain an array MIP packaged chip (2); Cutting the MIP packaged chips (2) in the array to obtain a plurality of mutually independent MIP packaged chips (2); Transferring a plurality of the MIP packaged chips (2) onto a substrate (1); Forming a first packaging glue layer (3) on the MIP packaging chip (2); A protective film layer (4) is formed on the first packaging adhesive layer (3).

9. The method for manufacturing a display device according to claim 8, It is characterized in that The circuit substrate (21) for manufacturing the array comprises: Etching an array of MIP substrates (212) on a substrate (211), each of the MIP substrates (212) having a plurality of mounting surfaces (210); A plurality of through holes (213) are provided on each of the mounting surfaces (210); A circuit is laid in each through hole (213), and the circuit connects the mounting surface (210) and the bottom surface of the substrate (211).

10. The method for manufacturing a display device according to claim 9, It is characterized in that The step of forming a light-emitting chip layer (22) on each of the mounting surfaces (210) comprises: Spraying black ink on the installation surface (210) to form a light shielding layer (222); performing an exposure process on the black ink so that the black ink at a position on the mounting surface (210) for mounting a light-emitting chip (221) is removed; Transferring the light-emitting chip (221) to the position on the mounting surface (210) where the black ink is removed; A second packaging glue layer (223) is filled between the light-emitting chips (221).

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