Cooling system for power electronics

Abstract

The invention relates to a cooling system for a power electronic device, in particular to a cooling system for cooling at least one heat-generating electronic device, the cooling system comprising: a heat removal device having a surface thermally coupleable to the at least one heat-generating electronic device. The heat removal device includes an inlet region and at least one jet impingement feature fluidly coupled to the inlet region. The at least one jet impingement feature is positioned to direct a primary cooling fluid to the surface thermally coupled to the at least one heat-generating electronic device.

Description

Technical Field

[0001] Exemplary embodiments relate to the field of heat exchangers, and more particularly, to heat exchangers for cooling power electronics. Background Art

[0002] Power electronics devices, such as motor drives, generate waste heat during device operation. In addition, as the power electronics devices heat up, the operating efficiency of the device decreases, thereby increasing the amount of heat generated. When used in a refrigeration system to drive, for example, a compressor for a refrigeration system, effective thermal integration of these devices can be an important aspect of the overall efficiency and reliability of the system. Therefore, it is a goal of the system integrator to keep these components within an operating temperature range that will maximize system efficiency. Therefore, there remains a need in the art for a heat exchanger that is configured to be tightly integrated with the power electronics devices, which heat exchanger is capable of maintaining an optimal temperature for these components under various load conditions. Summary of the invention

[0003] According to one embodiment, a cooling system for cooling at least one heat generating electronic device includes: a heat removal device having a surface that can be thermally coupled to the at least one heat generating electronic device. The heat removal device includes an inlet region and at least one jet impingement feature fluidly coupled to the inlet region. The at least one jet impingement feature is positioned to direct a primary cooling fluid to the surface that is thermally coupled to the at least one heat generating electronic device.

[0004] In addition to one or more of the above features, or as an alternative, in further embodiments the heat removal device comprises a heat exchanger having an outlet header, and the surface thermally coupled to the at least one heat generating electronic device is arranged in the outlet header. The primary cooling fluid and the secondary cooling fluid are arranged in heat transfer relationship in the at least one heat exchanger.

[0005] In addition to or as an alternative to one or more of the above features, in further embodiments the heat exchanger includes an inlet header and a plurality of heat exchange tubes extending between the inlet header and the outlet header. The at least one jet impingement feature is separate from and fluidically coupled to the plurality of heat exchange tubes.

[0006] In addition to one or more of the above features, or as an alternative, in other embodiments the heat exchanger further comprises an inlet header and a plurality of heat exchange tubes extending between the inlet header and the outlet header. The at least one jet impingement feature is integral with at least one of the plurality of heat exchange tubes.

[0007] In addition to, or as an alternative to, one or more of the above features, in further embodiments a fluid moving device is operable to move the secondary cooling fluid through the heat removal device.

[0008] In addition to or instead of one or more of the above features, in further embodiments the fluid moving device is a fan and the secondary cooling fluid is air.

[0009] In addition to one or more of the above features, or as an alternative, in another embodiment the heat removal device further comprises a plurality of heat exchangers. Each heat exchanger in the plurality of heat exchangers is located at a corresponding heat generating electronic device and is thermally coupled to the corresponding heat generating electronic device.

[0010] In addition to or as an alternative to one or more of the above features, in further embodiments at least some of the plurality of heat exchangers are arranged in series with respect to the flow of the primary cooling fluid.

[0011] In addition to or as an alternative to one or more of the above features, in further embodiments at least some of the plurality of heat exchangers are arranged in parallel with respect to the flow of the primary cooling fluid.

[0012] In addition to or as an alternative to one or more of the above features, in further embodiments the primary cooling fluid provided to the inlet region is a two-phase liquid.

[0013] In addition to or as an alternative to one or more of the above features, in further embodiments the primary cooling fluid provided to the heat removal device is a single-phase liquid.

[0014] According to one embodiment, a method for cooling a component includes at least one heat-generating electronic device and at least one peripheral heat-generating device, the method comprising: cooling a secondary cooling fluid via a primary cooling fluid; flowing the cooled secondary cooling fluid over the at least one peripheral heat-generating device; and discharging the primary cooling fluid at a surface of a heat removal device that is thermally coupled to the at least one heat-generating electronic device via at least one jet impingement feature to cool the at least one heat-generating electronic device.

[0015] In addition to or as an alternative to one or more of the above features, in further embodiments, the heat removal device is a heat exchanger, and cooling of the secondary cooling fluid via the primary cooling fluid occurs within a plurality of heat exchanger tubes of the heat exchanger.

[0016] In addition to or as an alternative to one or more of the above features, in further embodiments, a secondary cooling fluid is provided to the heat exchanger via a fluid moving device.

[0017] In addition to one or more of the above features, or as an alternative, in further embodiments, the primary cooling fluid is provided to another heat removal device, the other heat removal device being located at and thermally coupled to the at least one heat generating electronic device. The other heat removal device is arranged downstream of the heat removal device with respect to the flow of the primary cooling fluid and arranged in series with the heat removal device.

[0018] In addition to one or more of the above features, or as an alternative, in further embodiments, the primary cooling fluid is provided to another heat removal device, the other heat removal device being located at the at least one heat generating electronic device and thermally coupled to the at least one heat generating electronic device. The other heat removal device is arranged downstream of the heat removal device with respect to the flow of the primary cooling fluid and arranged in parallel with the heat removal device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The following description should not be considered limiting in any way. Referring to the drawings, similar elements are numbered the same:

[0020] Figure 1 is a schematic diagram of an example of a refrigeration system according to an embodiment;

[0021] Figure 2 is a schematic diagram of another example of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system according to an embodiment;

[0022] Figure 3 is a diagram of an embodiment of a cooling system for cooling a heat generating device according to an embodiment;

[0023] Figure 4 is a cross-sectional view of a heat removal device of a cooling system according to an embodiment;

[0024] Figure 5 is a cross-sectional view of a heat removal device of a cooling system according to another embodiment;

[0025] Figure 6 is a perspective view of a prior art cooling system for a variable frequency drive according to an embodiment. DETAILED DESCRIPTION

[0026] A detailed description of one or more embodiments of the disclosed apparatus and methods is presented herein by way of example and not limitation with reference to the accompanying figures.

[0027] refer to Figure 1, schematically illustrates an example of a refrigeration system, such as a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 20. Exemplary refrigeration systems 20 include, but are not limited to, residential, split, packaged, chiller, rooftop, supermarket, transportation, and fuel cell systems, for example. In the non-limiting embodiment shown, refrigeration system 20 includes a refrigeration circuit 22 that includes a compressor 24, a condenser 26, an expansion device 28, and an evaporator 30 arranged in series, and having a volume of a refrigeration fluid, such as, for example, a refrigerant, flowing therethrough.

[0028] Another example of a refrigeration system 20 is Figure 2 2. In addition to the previously described compressor 24, condenser 26, expansion device 28, and evaporator 30, the refrigeration circuit 22 also includes an economizer heat exchanger 32. The economizer heat exchanger 32 may be positioned between the condenser 26 and the expansion device 28 relative to the flow of refrigeration fluid through the refrigeration circuit 22. Although the economizer heat exchanger 32 is illustrated as being located directly downstream of the outlet 34 of the condenser 26, it should be understood that embodiments in which one or more other components of the refrigeration system 20 are located between the condenser 26 and the inlet of the economizer heat exchanger 32 are also contemplated herein.

[0029] In one embodiment, the economizer heat exchanger 32 is a brazed electroplated fin heat exchanger. However, other suitable types of heat exchangers are also within the scope of the present disclosure. In addition, the economizer heat exchanger 32 is a refrigeration fluid-refrigeration fluid heat exchanger and therefore has a plurality of different fluid flow paths formed therein. In the non-limiting embodiment shown, the economizer heat exchanger 32 has a first flow path and a second flow path, respectively.

[0030] In the non-limiting embodiment shown, the inlet 36 of the first flow path (also referred to herein as the "main flow path") of the economizer heat exchanger 32 is arranged in direct fluid communication with the outlet 34 of the condenser 26. Alternatively or additionally, the outlet 38 of the main flow path of the economizer heat exchanger 32 may be arranged directly upstream of and in fluid communication with the inlet of the expansion device 28.

[0031] In operation, a first portion R1 of the refrigerant fluid output from the condenser 26 is provided to a main flow path of the economizer heat exchanger 32 via a main conduit 40. Although the main flow path is illustrated as a single passage through the economizer heat exchanger 32, it should be understood that in other embodiments, the main flow path may include multiple passages through the economizer heat exchanger 32. At an outlet 38 of the main flow path of the economizer heat exchanger 32, the first portion R1 of the refrigerant fluid is configured to flow to the expansion device 28. From the expansion device 28, the refrigerant fluid is expanded within the evaporator 30. The first portion R1 of the refrigerant fluid output from the evaporator 30 is provided to a main suction port 42 of the compressor 24 via a first compressor inlet path. Thus, the fluid circuit of the first portion R1 of the refrigerant fluid includes the compressor 24, the condenser 26, the main flow path of the economizer heat exchanger 32, the expansion device 28, and the evaporator 30.

[0032] An economizer expansion device 44 may be disposed within the refrigeration circuit 22 in fluid communication with the condenser 26. The economizer expansion device 44 is operable to expand and cool the refrigeration fluid provided thereto. Although the economizer expansion device 44 is shown as being disposed within an economizer conduit 45 that is fluidly coupled to an extension of the main conduit 40 at a location upstream of the first inlet 36, it should be understood that an economizer conduit 45 that is fluidly coupled to the outlet 34 of the condenser 26 in another suitable manner is also contemplated herein.

[0033] The inlet 46 of the second flow path of the economizer heat exchanger 32 is located downstream of the economizer expansion device 44, and the second flow path of the economizer heat exchanger 32 is also referred to herein as the "economizer flow path". In addition, the outlet 48 of the second flow path of the economizer heat exchanger 32 can be, but is not necessarily, directly connected to the economizer inlet or port 50 of the compressor 24. In the non-limiting embodiment shown, the inlet 36 of the main flow path and the inlet 46 of the economizer flow path are arranged at adjacent sides of the economizer heat exchanger 32. However, in other embodiments, it should be understood that the inlets 36, 46 of the two flow paths may alternatively be arranged at the same side of the economizer heat exchanger 32 or at opposite sides thereof. Similarly, depending on the desired flow configuration of the economizer heat exchanger 32, the outlets 38, 48 of both the main flow path and the economizer flow path may be arranged at opposite sides, the same side, or adjacent sides. In addition, although the economizer flow path is illustrated as a single passage, it should be understood that in some embodiments, the economizer flow path may include multiple passages through the economizer heat exchanger 32.

[0034] In the economizer flow path, the second portion R2 of the refrigerant fluid is configured to absorb heat from the first portion R1 of the refrigerant fluid in the main flow path, thereby cooling the first portion R1 of the refrigerant fluid. Due to this heat transfer, the second portion R2 of the refrigerant fluid in the economizer flow path can become vapor. The second portion R2 of the refrigerant fluid is provided from the outlet 48 of the economizer flow path to the economizer suction port 50 located at the middle portion of the compressor 24. Therefore, the second portion R2 of the refrigerant fluid bypasses the expansion device 28 and the evaporator 30 of the refrigeration circuit 22. In the compressor 24, the first portion R1 and the second portion R2 of the refrigerant fluid are mixed before being provided to the discharge port 52 to repeat the cycle. Therefore, the fluid circuit of the second portion R2 of the refrigerant fluid includes the economizer flow path of the compressor 24, the condenser 26, the economizer expansion device 44 and the economizer heat exchanger 32. It should be understood that the refrigeration system 20 shown and described herein is intended to be an example only, and a refrigeration system 20 having another configuration is within the scope of the present disclosure.

[0035] Continue to refer Figure 1 and Figure 2 In one embodiment, the refrigeration system 20 includes at least one cooling system 60 for cooling one or more heat generating devices 62. The term "heat generating device" as used herein may refer to any electronic component that generates heat during its operation. Examples of heat generating devices 62 include, but are not limited to, processors, power electronics devices, or another device (e.g., variable frequency drive, power rectifier, power converter, etc.) that can provide controlled output power by modulating and / or converting the input power provided. Such heat generating devices 62 can be used to control the speed of the compressor and / or the speed of the fan associated with the refrigeration system based on various predetermined system conditions. In one embodiment, at least one heat generating device 62 includes a variable frequency drive operably coupled to the compressor 24 of the refrigeration system 20. As shown, at least a portion R3 of the refrigerant output from the outlet of the condenser 26 can be diverted to the cooling system 60. Depending on the cooling demand to be met by the cooling system 60, a portion R3 of the refrigerant can pass through the expansion valve 54, or can bypass the expansion valve before reaching the heat removal device 74 of the cooling system 60, which will be described in more detail below.

[0036] In other embodiments, cooling system 60 need not be integrated with or part of the vapor compression cycle of refrigeration system 20. Instead, cooling system 60 may be a separate fluid circuit and any suitable cooling fluid may be used therein. Figure 3In the illustrated non-limiting embodiment of the present invention, the circuit of the cooling system 60 has a closed loop configuration and includes a pump 70 for moving the primary cooling fluid C1 therethrough. A filter 72 may be located upstream of at least one heat removal device 74, which is positioned to directly cool a corresponding heat-generating electronic device, such as the heat-generating device 62. Downstream of the one or more heat removal devices 74 is a cooling heat exchanger 76, which is configured to remove heat from the primary cooling fluid C1. The circuit may also include a reservoir or accumulator 78 in which excess primary cooling fluid C1 is stored. As shown, the circuit may include a plurality of valves, such as disposed directly upstream of the heat removal device 74 (V1), directly downstream of the heat removal device 74 (V2), associated with a bypass conduit 80 for bypassing the cooling heat exchanger 76 (V3), and / or associated with another bypass conduit 82 for bypassing the heat removal device 74 and the cooling heat exchanger 76 (V4). Although the non-limiting embodiment shown includes a single heat removal device 74 associated with a single heat generating device 62, it should be understood that embodiments including multiple heat removal devices 74 operably coupled to one or more heat generating devices 62 may be arranged in series or parallel with respect to the flow of primary cooling fluid C1.

[0037] Reference now Figure 4 , an example of at least a portion of a cooling system 60 for cooling one or more heat generating devices 62 is shown. As shown in the figure, the heat removal device 74 can be a heat exchanger, such as a microchannel heat exchanger, having a plurality of substantially parallel microchannel heat exchange tubes 100 extending between an inlet header 102 and an outlet header 104, each of the plurality of heat exchange tubes 100 defining a plurality of fluid flow paths (not shown). However, examples of other types of heat exchangers that can be used include, but are not limited to, microtube, double tube, shell and tube, tube and fin, plate, plate and shell, insulated shell, plate fin, pillow plate, and fluid heat exchangers. The type of heat exchanger 74 selected can depend at least in part on the type of fluid provided thereto.

[0038] The primary cooling fluid C1 and the secondary cooling fluid C2 are arranged in a heat transfer relationship at the heat exchanger 74. Figure 4 In the non-limiting embodiment shown in , the heat exchanger 74 has a single passage configuration for both the primary cooling fluid C1 and the secondary cooling fluid C2. However, in other embodiments, at least one of the primary cooling fluid C1 and the secondary cooling fluid C2 may pass through the heat exchanger 74 multiple times. In addition, the primary cooling fluid C1 and the secondary cooling fluid C2 may be arranged at the heat exchanger in any suitable flow configuration, such as cross flow, parallel flow, counter flow, or any combination thereof.

[0039] In one embodiment, at least one jet impact feature, such as a nozzle, orifice or orifice, hole or opening formed in the plate 110, and in some embodiments, a plurality of jet impact features 110 are arranged within the outlet header 104, such as within the inlet region of the outlet header 104. Each jet impact feature 110 is fluidly coupled to at least one fluid flow path of one or more heat exchanger tubes 100. The outlet end of the jet impact feature 110 can be aligned with a surface of the outlet header 104 that is thermally coupled to at least one selected heat generating device 62, such as the bottom surface of the outlet header 104. Although one or more jet impact features 110 are shown and described herein as being separate from the heat exchange tube 100, in one embodiment, the outlet end of the heat exchange tube 100 can be shaped so that one or more jet impact features 110 are integral therewith. The jet impact feature 110 can be configured as a free surface type or an immersed type or a restricted immersed type. In addition, the jet or stream discharged from the jet impact feature 110 can be any geometric shape in cross section, such as a circle, a polygon, a star, etc.

[0040] In some embodiments, the heat exchanger 74 is directly coupled to a surface of at least one selected heat generating device 62. In such a direct connection, a thermal interface material may be, but is not necessarily, disposed between a surface 112 of at least one selected heat generating electronic device 62 and an adjacent surface 114 of the heat removal device 74 to facilitate transfer of heat from the at least one selected heat generating device 62 to the heat removal device 74.

[0041] The inlet header 102 of the heat exchanger 74 may be fluidly connected to the first fluid inlet 120, and the outlet header 104 may be fluidly connected to the first fluid outlet 122 to form a first flow path for the primary cooling fluid C1. In operation, the primary cooling fluid C1, such as, for example, a refrigerant, is provided from the first fluid inlet 120 to the inlet header 102 of the heat exchanger 74. The primary cooling fluid C1 provided to the inlet header 102 may be a single phase, such as a cool or cold liquid, or may be a two-phase (i.e., a combination of liquid and vapor). The primary cooling fluid C1 flows through the plurality of heat exchange tubes 100 of the heat exchanger 74 from the inlet header 102 toward the outlet header 104.

[0042] The secondary cooling fluid C2 is configured to flow through the gaps 106 defined between adjacent heat exchanger tubes 100. In the non-limiting embodiment shown, the secondary cooling fluid C2 is a stream of air moved (in a direction extending into the plane of the page) by at least one fluid moving device (e.g., a fan 31). In one embodiment, it is associated with at least one of the condenser 26 or the evaporator 30 of the refrigeration system 20. However, it should be understood that any fluid, including liquids, can be used as the secondary cooling fluid C2. In the non-limiting embodiment shown, a plurality of fins 126 are arranged within the gaps 106 defined between adjacent heat exchanger tubes 100; however, embodiments that do not include such fins are also contemplated herein. Within the plurality of channels of the heat exchange tubes 100, heat from the secondary cooling fluid C2 is transferred to the primary cooling fluid C1. The resulting cooled secondary cooling fluid C2 provided at the outlet of the heat exchanger 74 can be configured to flow over an adjacent or surrounding heat generating device, such as, for example, within a variable frequency drive.

[0043] At least a portion of the now slightly warmed primary cooling fluid C1 is output from the plurality of heat exchange tubes 100 to one or more jet impingement features 110 disposed within the outlet header 104. Within the jet impingement features 110, the flow rate of the primary cooling fluid C1 is increased such that the primary cooling fluid C1 is discharged from the outlet of the jet impingement feature at a surface of the outlet header 104 that is vertically aligned with the selected heat generating device 62.

[0044] At least a portion of the heat from the at least one selected heat generating device 62 is transferred from the heat generating device 62 to the primary cooling fluid C1. Continuous impingement of the primary cooling fluid C1 on the surface of the outlet header 104 thermally coupled to the heat generating device 62 transfers heat from the surface of the outlet header 104 to the primary cooling fluid C1, thereby cooling the at least one selected heat generating device 62.

[0045] Depending on the temperature of the secondary cooling fluid C2, the primary cooling fluid C1 may partially evaporate or remain in a liquid state as it flows through the plurality of heat exchange tubes 100 of the heat exchanger 74 toward the outlet header 104. If the primary cooling fluid C1 is partially evaporated, the velocity of the primary cooling fluid C1 discharged from the one or more jet impingement features 110 will enhance the heat transfer that occurs from the surface of the outlet header 104 to the primary cooling fluid C1. In one embodiment, after impinging on the surface 114, the primary cooling fluid C1 is configured to begin to boil or evaporate, and in some embodiments is in a fully vaporous state. After contacting the surface of the outlet header 104, the resulting warm, superheated vapor primary cooling fluid C1 then exits the outlet header 104 of the heat exchanger 74 and flows toward the first fluid outlet 122.

[0046] Reference now Figure 5, shows another example of a heat removal device 74 suitable for use in the cooling system 60. The heat removal device 74 can be similar to the above Figure 4 The heat removal device described. However, in the non-limiting embodiment shown, the heat removal device does not include a heat exchanger portion for receiving the secondary cooling fluid C2. As shown, the heat removal device 74 includes an inlet region 200 and at least one jet impact feature 210, and in some embodiments includes a plurality of jet impact features 210 fluidly connected to the inlet region 200. Similar to the heat exchangers previously described herein, the outlet end of the jet impact feature 210 is aligned with a surface of the heat removal device 74 that is thermally coupled to at least one selected heat generating electronic device 62, such as, for example, the bottom surface 202 of the heat removal device 71.

[0047] exist Figure 4 and Figure 5 In each of the configurations disclosed in , at least one valve may be disposed within the first fluid inlet 120 and / or the first fluid outlet 122 to control the flow of the primary cooling fluid C1 into and out of the heat exchanger 74. In one embodiment, the position of the one or more flow control valves V and thus the flow through the heat exchanger 74 is actively managed based on one or more conditions at the heat exchanger 74 (e.g., conditions indicative of a heat load). The heat load may be determined using information collected by one or more sensors schematically represented at T and P. In the non-limiting embodiment shown, a first sensor T is operable to monitor the temperature of the heat generating device 62, and a second sensor T is operable to monitor the temperature of the primary cooling fluid C1 in conjunction with a pressure sensor P at the outlet header 104. The combination of the temperature sensor and the pressure sensor will allow the superheat of the exiting primary cooling fluid C1 to be determined. The flow control valve V may be adjustable to increase or decrease the flow rate based on the determined superheat of the primary cooling fluid C1. At least one sensor T or P may be operable to measure temperature and / or pressure directly, or may be configured to monitor another parameter that is related thereto or from which temperature and / or pressure may be derived.

[0048] Figure 6 An existing cooling system for cooling one or more heat generating components of a variable frequency drive (VFD) is shown. As shown, the cooling system includes two cold plates to which the heat generating device(s) 62 that require the most cooling are mounted. In addition, an air-cooled heat exchanger is used to cool peripheral components, such as those that are not mounted on the cold plates. If a heat removal device 74 is integrated into the cooling system of the VFD, a separate air-cooled heat exchanger can be eliminated because the heat exchanger will be mounted directly to the heat generating components that are also mounted to the cold plates. Such a combination results in a more compact, low-cost and efficient cooling system. Eliminating a separate air-cooled heat exchanger results in significant cost savings.

[0049] The term "about" is intended to include the degree of error associated with the measurement of the particular quantity based on the equipment available at the time the application was filed.

[0050] The terms used herein are only used to describe specific embodiments and are not intended to limit the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are also intended to include plural forms. It should be further understood that when the terms "comprise" and / or "include" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts is specified, but the presence or addition of one or more other features, integers, steps, operations, elements and / or groups thereof is not excluded.

[0051] Although the present disclosure has been described with reference to one or more exemplary embodiments, it will be appreciated by those skilled in the art that various changes may be made and equivalents may be substituted for its elements without departing from the scope of the present disclosure. In addition, many modifications may be made to adapt specific circumstances or materials to the teachings of the present disclosure without departing from the basic scope of the present disclosure. Therefore, it is intended that the present disclosure is not limited to the specific embodiments disclosed as the best mode for implementing the present disclosure, but that the present disclosure will include all embodiments that fall within the scope of the claims.

Claims

1. A cooling system for cooling at least one heat-generating electronic device, the cooling system comprising: A heat removal device comprising a surface thermally coupleable to the at least one heat generating electronic device, the heat removal device comprising an inlet region and at least one jet impingement feature fluidly coupled to the inlet region, wherein the at least one jet impingement feature is positioned to direct a primary cooling fluid toward the surface thermally coupled to the at least one heat generating electronic device.

2. The cooling system according to claim 1, wherein: The heat removal device includes a heat exchanger having an outlet header, the surface thermally coupled to the at least one heat generating electronic device being disposed within the outlet header, wherein the primary cooling fluid and the secondary cooling fluid are disposed in heat transfer relationship within at least one of the heat exchangers.

3. The cooling system according to claim 2, wherein: The heat exchanger also includes: an inlet header, the inlet region being defined by the inlet header; and A plurality of heat exchange tubes extend between the inlet header and the outlet header, the at least one jet impingement feature being separate from and fluidly coupled to the plurality of heat exchange tubes.

4. The cooling system according to claim 2, wherein: The heat exchanger also includes: an inlet header, the inlet region being defined by the inlet header; and A plurality of heat exchange tubes extend between the inlet header and the outlet header, the at least one jet impingement feature being integral to at least one of the plurality of heat exchanger tubes.

5. A cooling system according to any preceding claim, further comprising a fluid moving device operable to move the secondary cooling fluid through the heat removal device.

6. The cooling system according to claim 5, wherein: The fluid moving device is a fan and the secondary cooling fluid is air.

7. A cooling system according to any one of the preceding claims, wherein: The heat removal device also includes a plurality of heat exchangers, each of the plurality of heat exchangers being located at and thermally coupled to a corresponding heat generating electronic device.

8. The cooling system according to claim 7, wherein: At least some of the plurality of heat exchangers are arranged in series with respect to the flow of the primary cooling fluid.

9. The cooling system according to claim 7, wherein: At least some of the plurality of heat exchangers are arranged in parallel with respect to the flow of the primary cooling fluid.

10. The cooling system according to claim 1, wherein: The primary cooling fluid provided to the inlet region is a two-phase liquid.

11. The cooling system according to claim 1, wherein: The primary cooling fluid provided to the heat removal device is a single-phase liquid.

12. A method for cooling a component, the component comprising at least one heat-generating electronic device and at least one peripheral heat-generating device, the method comprising: cooling a secondary cooling fluid via the primary cooling fluid; flowing a cooled secondary cooling fluid over the at least one peripheral heat generating device; and The primary cooling fluid is discharged at a surface of a heat removal device thermally coupled to the at least one heat generating electronic device via at least one jet impingement feature to cool the at least one heat generating electronic device.

13. The method according to claim 12, wherein: The heat removal device is a heat exchanger, and cooling of the secondary cooling fluid via the primary cooling fluid occurs within a plurality of heat exchanger tubes of the heat exchanger.

14. The method of claim 13, further comprising providing the secondary cooling fluid to the heat exchanger via a fluid moving device.

15. The method according to any one of claims 12-14, further comprising providing the primary cooling fluid to another heat removal device, the other heat removal device being located at and thermally coupled to the at least one heat generating electronic device, the other heat removal device being arranged downstream of the heat removal device relative to the flow of the primary cooling fluid and arranged in series with the heat removal device.

16. The method of any one of claims 12-14, further comprising providing the primary cooling fluid to another heat removal device, the other heat removal device being located at and thermally coupled to the at least one heat generating electronic device, the other heat removal device being arranged downstream of the heat removal device relative to the flow of the primary cooling fluid and arranged in parallel with the heat removal device.

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