Method and system for detecting adhesion of elastomer and wafer and wafer sorting device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a method and system for detecting adhesion of an elastomer and a wafer and a wafer sorting device.Wafer transfer is conducted between a wafer box and a wafer calibration device through a mechanical arm, and in the wafer transfer process, a vibration signal of the mechanical arm is obtained; preprocessing the obtained vibration signal of the manipulator arm to enable the vibration signal to meet an analog-to-digital conversion input condition; performing analog-to-digital conversion on the preprocessed vibration signal of the manipulator arm to generate a digital signal and obtain vibration data of the manipulator arm; and comparing the obtained vibration data of the manipulator arm with standard vibration data of the manipulator arm in a vibration database, and determining whether the elastomer is adhered to the wafer or not. According to the invention, the online detection of the adhesion between the elastomer and the wafer can be realized, and compared with the method for determining whether the elastomer is adhered or not through manual observation or engineering experience, the online detection and judgment are more accurate and timely.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method and system for detecting adhesion between an elastomer and a wafer, and a wafer sorting device. Background Art

[0002] In the semiconductor manufacturing process, wafer handling is a necessary step in the semiconductor process technology, and the wafer sorter is the key equipment to achieve this function. In the wafer sorter, wafer handling relies on the robot arm to take the wafer out of the wafer cassette, and then send it back to the wafer cassette after calibration by the wafer alignment device.

[0003] The robot arm is equipped with an elastomer, and the friction between the elastomer and the wafer is used to transfer the wafer, which is a way of wafer handling. The elastomer is made of polymer materials and has high friction and wear resistance. However, as the number of wafers handled by the robot arm increases, the contact surface of the elastomer will change. Especially when the number of wafers handled reaches hundreds of thousands or even millions, the contact surface of the elastomer will stick to the wafer, and the elastomer must be replaced.

[0004] Currently, whether the contact surface of the elastomer and the wafer is sticky is determined by manual observation of the elastomer or engineering experience. This may be inaccurate or untimely, affecting the sorting and manufacturing of wafers. Summary of the invention

[0005] The present invention provides a method and system for detecting adhesion between an elastomer and a wafer, and a wafer sorting device, so as to solve the defect of inaccurate or untimely judgment in the prior art of determining whether an elastomer has adhesion through manual observation or engineering experience, and realize online detection of whether an elastomer and a wafer have adhesion.

[0006] The present invention provides a method for detecting adhesion between an elastomer and a wafer, comprising S1, transferring a wafer between a wafer box and a wafer calibration device by a robot arm; S2, obtaining a vibration signal of the robot arm during wafer transfer in step S1; S3, preprocessing the vibration signal of the robot arm obtained in step S2 to satisfy an analog-to-digital conversion input condition; S4, performing analog-to-digital conversion on the vibration signal of the robot arm preprocessed in step S3 to generate a digital signal and obtain vibration data of the robot arm; S5, comparing the vibration data of the robot arm obtained in step S4 with standard vibration data of the robot arm in a vibration database to determine whether adhesion occurs between the elastomer and the wafer.

[0007] According to a method for detecting adhesion between an elastomer and a wafer provided by the present invention, in step S2, a vibration signal of the robot arm is obtained by a vibration sensor fixed to the robot arm.

[0008] According to a method for detecting adhesion between an elastomer and a wafer provided by the present invention, in step S3, the step of preprocessing the vibration signal of the robot arm obtained in step S2 includes: filtering, voltage dividing, limiting and signal amplification processing of the vibration signal of the robot arm, eliminating clutter interference, and enhancing the driving ability and anti-interference ability of the vibration signal of the robot arm.

[0009] According to a method for detecting adhesion between an elastomer and a wafer provided by the present invention, in step S4, the step of performing analog-to-digital conversion on the vibration signal of the robot arm preprocessed in step S3 includes: collecting the vibration signal of the robot arm preprocessed in step S3 by an analog signal collector, and then converting it into a digital signal by an analog-to-digital converter, and then processing it by a digital signal processor to obtain the vibration data of the robot arm.

[0010] According to a method for detecting adhesion between an elastomer and a wafer provided by the present invention, in step S2, the vibration signal of the robot arm obtained includes: the vibration signal of the robot arm when moving without load, the vibration signal of the robot arm when moving with the wafer, and the vibration signal of the robot arm when placing the wafer on a wafer calibration device.

[0011] A method for detecting adhesion between an elastomer and a wafer provided in accordance with the present invention also includes S6, based on the result of step S5 determining whether adhesion between the elastomer and the wafer occurs. When it is determined that adhesion between the elastomer and the wafer occurs, adhesion between the elastomer and the wafer is displayed on the machine and a warning message and information indicating the need to replace the elastomer are issued.

[0012] The present invention also provides a system for detecting adhesion between an elastomer and a wafer, which is suitable for executing any one of the above-mentioned methods for detecting adhesion between an elastomer and a wafer, and the system for detecting adhesion between an elastomer and a wafer comprises a vibration sensor, a preprocessing module, an analog-to-digital conversion module, a vibration database and a comparison module, wherein the vibration sensor is fixed to a manipulator arm, and is used to obtain a vibration signal of the manipulator arm; the preprocessing module is connected to the vibration sensor, and the preprocessing module comprises a filtering circuit, a limiting circuit and an amplifying circuit, and is used to filter, divide the voltage and limit the amplitude, and amplify the signal of the vibration signal of the manipulator arm; the analog-to-digital conversion module The module is connected to the preprocessing module, the analog-to-digital conversion module includes an analog signal collector, an analog-to-digital converter and a digital signal processor, the analog-to-digital conversion module receives the signal processed by the preprocessing module and performs analog-to-digital conversion to generate a digital signal to obtain the vibration data of the manipulator arm; the vibration database stores the standard vibration data of the manipulator arm; the comparison module is respectively connected to the analog-to-digital conversion module and the vibration database, and is used to compare the vibration data of the manipulator arm obtained by the analog-to-digital conversion module with the standard vibration data of the manipulator arm stored in the vibration database, and output the comparison result.

[0013] According to the present invention, a system for detecting adhesion between an elastomer and a wafer also includes a machine display module, which is connected to the comparison module. The machine display module includes a display and an alarm. The display is used to display the comparison results of the comparison module, and the alarm is used to issue an alarm prompt when it is determined that adhesion between the elastomer and the wafer occurs.

[0014] The present invention also provides a wafer sorting device, comprising any of the above-mentioned systems for detecting adhesion between an elastomer and a wafer, or a method for detecting adhesion between an elastomer and a wafer that can execute any of the above-mentioned methods.

[0015] A wafer sorting device provided according to the present invention includes a frame, a wafer box, a wafer calibration device and a robot, wherein the wafer box is arranged on the side of the frame for storing wafers; the wafer calibration device is located in the frame; the robot is movably arranged in the frame, the robot is suitable for moving between the wafer box and the wafer calibration device, the robot is provided with a robot arm, the front end of the robot arm is equipped with an elastomer, and a vibration sensor is fixed to the position of the robot arm near the front end.

[0016] The present invention provides a method and system for detecting adhesion between an elastomer and a wafer, and a wafer sorting device. When a robot arm transfers a wafer between a wafer box and a wafer calibration device, the robot arm detects the vibration signal of the robot arm, performs preprocessing and analog-to-digital conversion, generates vibration data of the robot arm, and then compares the data with the standard vibration data of the robot arm in a vibration database to determine whether adhesion between the elastomer and the wafer occurs, thereby realizing online detection of adhesion between the elastomer and the wafer. Compared with determining whether the elastomer has adhesion through manual observation or engineering experience, the online detection and judgment of the present invention is more accurate and timely. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic flow chart of the method for detecting adhesion between an elastomer and a wafer provided by the present invention.

[0019] Figure 2 It is a schematic diagram of the principle of the system for detecting the adhesion between an elastomer and a wafer provided by the present invention.

[0020] Figure 3 It is a structural schematic diagram of the wafer sorting device provided by the present invention.

[0021] Figure 4 It is a schematic diagram of vibration detection at the wafer calibration device provided by the present invention.

[0022] Figure numerals: 1. vibration sensor; 2. robot arm; 3. preprocessing module; 4. analog-to-digital conversion module; 5. vibration database; 6. comparison module; 7. machine display module; 8. rack; 9. wafer box; 10. wafer calibration device; 11. robot; 12. elastomer. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0025] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0026] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0028] Combine the following Figures 1 to 4 The invention describes a method and system for detecting adhesion between an elastomer and a wafer, and a wafer sorting device.

[0029] An embodiment of the present invention provides a method for detecting adhesion between an elastic body and a wafer, see Figure 1 As shown, it includes S1, transferring wafers between a wafer box and a wafer calibration device by a robot arm; S2, obtaining a vibration signal of the robot arm during wafer transfer in step S1; S3, preprocessing the vibration signal of the robot arm obtained in step S2 to satisfy an analog-to-digital conversion input condition; S4, performing analog-to-digital conversion on the vibration signal of the robot arm preprocessed in step S3 to generate a digital signal and obtain vibration data of the robot arm; S5, comparing the vibration data of the robot arm obtained in step S4 with the standard vibration data of the robot arm in a vibration database to determine whether adhesion occurs between the elastomer and the wafer.

[0030] It can be understood that in the method of detecting the adhesion between the elastomer and the wafer of the present embodiment, when the robot arm transfers the wafer between the wafer box and the wafer calibration device, the vibration signal of the robot arm is detected, and pre-processed and analog-to-digital converted to generate the vibration data of the robot arm, and then compared with the standard vibration data of the robot arm in the vibration database to make a judgment on whether the elastomer and the wafer are sticky, thereby realizing the online detection of the adhesion between the elastomer and the wafer. Compared with determining whether the elastomer has adhesion through manual observation or engineering experience, the online detection judgment of the present application is more accurate and timely.

[0031] Specifically, in some embodiments of the method for detecting adhesion between an elastomer and a wafer of the present invention, in step S2, a vibration signal of the robot arm is obtained by a vibration sensor fixed to the robot arm. The vibration signal of the robot arm obtained includes: a vibration signal when the robot arm moves without load, a vibration signal when the robot arm moves with a wafer, and a vibration signal when the robot arm places the wafer on a wafer calibration device.

[0032] It should be understood that the vibration sensor can detect the vibration of the robot arm when it is unloaded and in motion with a wafer (with a wafer), especially when the robot arm is detached from the wafer calibration device. The vibration signal of the robot arm when it is unloaded and in motion with a wafer can be used as a reference signal. The vibration sensor detects the vibration signal during the separation of the elastomer and the wafer. After preprocessing and analog-to-digital conversion, the vibration data of the robot arm is obtained, mainly the vibration displacement data I, which is compared with the reference threshold I0 of the vibration database from time to time to determine the situation of △I. When the elastomer and the wafer are stuck, the elastomer and the wafer are not easy to separate. Then, when the elastomer and the wafer are separated, the vibration displacement data I will have abnormal changes, and the △I change is obvious, which can determine that the elastomer and the wafer are stuck.

[0033] In step S3, the step of preprocessing the vibration signal of the manipulator arm obtained in step S2 includes: filtering, voltage limiting and signal amplification processing of the vibration signal of the manipulator arm, eliminating clutter interference, enhancing the driving ability and anti-interference ability of the vibration signal of the manipulator arm, improving the resolution and measurement accuracy, and at the same time using isolation, protection and other circuits to avoid damage to the internal components of subsequent modules due to overvoltage and other phenomena that may occur in the input signal.

[0034] In step S4, the step of performing analog-to-digital conversion on the vibration signal of the manipulator arm preprocessed in step S3 includes: collecting the vibration signal of the manipulator arm preprocessed in step S3 by an analog signal collector, then converting it into a digital signal by an analog-to-digital converter, and then processing it by a digital signal processor to obtain the vibration data of the manipulator arm.

[0035] Furthermore, in some other embodiments of the method for detecting adhesion between an elastomer and a wafer of the present invention, step S6 is further included, based on the result of determining whether adhesion between the elastomer and the wafer occurs in step S5, when it is determined that adhesion between the elastomer and the wafer occurs, the adhesion between the elastomer and the wafer is displayed on the machine, and a warning message and information that the elastomer needs to be replaced are issued. It can be understood that when adhesion between the elastomer and the wafer is detected by the method for detecting adhesion between an elastomer and a wafer of the present invention, this embodiment performs adhesion display and warning, specifically, the comparison result is fed back to the machine for display, and while displaying the comparison result, it is reminded that adhesion between the elastomer and the wafer has occurred and the elastomer must be replaced, thereby achieving online detection and online warning.

[0036] Another aspect of the present invention provides a system for detecting adhesion between an elastomer and a wafer, which is suitable for executing the method for detecting adhesion between an elastomer and a wafer according to any one of the above embodiments. In some embodiments, see Figure 2 As shown, the system for detecting the adhesion between the elastomer and the wafer includes a vibration sensor 1, a preprocessing module 3, an analog-to-digital conversion module 4, a vibration database 5 and a comparison module 6, wherein the vibration sensor 1 is fixed to the manipulator arm 2, and is used to obtain the vibration signal of the manipulator arm 2; the preprocessing module 3 is connected to the vibration sensor 1, and the preprocessing module 3 includes a filtering circuit, a limiting circuit and an amplifying circuit, which are used to filter, divide the voltage and limit the amplitude, and amplify the signal of the manipulator arm 2; the analog-to-digital conversion module 4 is connected to the preprocessing module 3, and the analog-to-digital conversion module 4 includes an analog signal collector, an analog-to-digital converter and a digital signal processor, and the analog-to-digital conversion module 4 receives the signal processed by the preprocessing module 3 and performs analog-to-digital conversion to generate a digital signal to obtain the vibration data of the manipulator arm; the vibration database 5 stores the standard vibration data of the manipulator arm; the comparison module 6 is respectively connected to the analog-to-digital conversion module 4 and the vibration database 5, and is used to compare the vibration data of the manipulator arm obtained by the analog-to-digital conversion module 4 with the standard vibration data of the manipulator arm stored in the vibration database 5, and output the comparison result.

[0037] It can be understood that the working process of the system for detecting the adhesion between the elastomer and the wafer of the present embodiment can refer to the method for detecting the adhesion between the elastomer and the wafer in the above-mentioned embodiment, wherein, by fixing the vibration sensor 1 on the robot arm 2, the robot arm 2 transfers the wafer between the wafer box and the wafer calibration device, and during the wafer transfer process, the vibration sensor 1 can obtain the vibration signal of the robot arm 2; the vibration signal of the robot arm 2 obtained by the vibration sensor 1 is preprocessed by the preprocessing module 3, and the vibration signal of the robot arm 2 is filtered, voltage-limited and amplified to meet the analog-to-digital conversion input conditions; the vibration signal of the preprocessed robot arm 2 is converted into digital form by the analog-to-digital conversion module 4 to generate a digital signal to obtain the vibration data of the robot arm; the obtained vibration data of the robot arm is compared with the standard vibration data of the robot arm in the vibration database 5 in the comparison module 6, so as to determine whether the elastomer and the wafer are adhered, thereby realizing online detection of the adhesion between the elastomer and the wafer.

[0038] Furthermore, in other embodiments of the system for detecting adhesion between an elastomer and a wafer of the present invention, a machine display module 7 is further included, the machine display module 7 is connected to the comparison module 6, the machine display module 7 includes a display and an alarm, the display is used to display the comparison result of the comparison module 6, and the alarm is used to issue an alarm prompt when it is determined that the elastomer and the wafer are adhered. The system for detecting adhesion between an elastomer and a wafer of this embodiment displays the comparison result through the machine display module 7, and when the comparison confirms that the elastomer and the wafer are adhered, an alarm is issued through the alarm, indicating that the elastomer needs to be replaced, thereby realizing online detection and online alarm of adhesion between the elastomer and the wafer.

[0039] On the other hand, the present invention further provides a wafer sorting device, including the system for detecting the adhesion between the elastomer and the wafer of the above-mentioned embodiment, or the method for detecting the adhesion between the elastomer and the wafer that can execute any one of the above-mentioned embodiments. It can be understood that since the wafer sorting device of the present invention includes the system for detecting the adhesion between the elastomer and the wafer of the above-mentioned embodiment, it can execute the method for detecting the adhesion between the elastomer and the wafer of the above-mentioned embodiment. Therefore, the wafer sorting device of the present application must have the function of realizing online detection and online early warning of the adhesion between the elastomer and the wafer, and obtains the vibration signal of the manipulator arm 2 through the vibration sensor 1. After preprocessing and analog-to-digital conversion, it is compared with the standard vibration data of the manipulator arm in the vibration database 5, and the comparison result is displayed. If necessary, an early warning is issued, so that the online detection and online early warning of the adhesion between the elastomer and the wafer can be realized.

[0040] Specifically, in some specific embodiments of the wafer sorting device of the present invention, combined with Figure 3 and Figure 4As shown, the wafer sorting device includes a frame 8, a wafer box 9, a wafer calibration device 10 and a robot 11, wherein the wafer box 9 is arranged on the side of the frame 8 for storing wafers; the wafer calibration device 10 is located in the frame 8; the robot 11 is movably arranged in the frame 8, and the robot 11 is suitable for moving between the wafer box 9 and the wafer calibration device 10. The robot 11 is provided with a robot arm 2, and an elastomer 12 is installed at the front end of the robot arm 2, and a vibration sensor 1 is fixed near the front end of the robot arm 2.

[0041] It can be understood that in the wafer sorting device of this embodiment, wafer handling relies on the robot arm 2 of the robot 11 to take the wafer out of the wafer box 9, transfer it to the wafer calibration device 10, and then rely on the robot arm 2 of the robot 11 to return the wafer box 9 after detection and calibration by the wafer calibration device 10. In this process, the robot arm 2 is the actuator at the front end of the robot 11. In the case of no load and strip movement, the robot arm 2 will vibrate. The front end of the robot arm 2 is arranged with an elastic body 12 for supporting the wafer, and the vibration sensor 1 is fixed on the robot arm 2, and the position is opened as far as possible into the front end of the robot arm 2, and it cannot interfere with the position of the elastic body 12 and the wafer.

[0042] During the wafer sorting process, the vibration sensor 1 can detect the vibration of the robot arm 2 when it is unloaded and in the movement of the wafer. In particular, the vibration signal is most obvious when the robot arm 2 releases the wafer from the wafer at the wafer calibration device 10. The wafer placement process at the wafer calibration device 10 is as follows: the elastic body 12 of the robot arm 2 supports the wafer to move from the wafer box 9 to the position above the wafer calibration device 10, the robot arm 2 descends in the vertical direction, and the lower surface of the wafer is supported by the support tray of the wafer calibration device 10, and the wafer placement is completed; the robot arm 2 continues to descend in the vertical direction, and after the elastic body 12 is completely separated from the wafer, the robot arm 2 stops after descending a set distance in the vertical direction and walks other tracks.

[0043] When the above-mentioned robot arm 2 is placing the wafer at the wafer calibration device 10, the vibration sensor 1 detects the vibration signal during the separation process of the elastomer 12 from the wafer. After signal preprocessing and analog-to-digital conversion, the vibration data of the robot arm is obtained, mainly the vibration displacement data I, which is compared with the reference threshold value I0 of the vibration database from time to time to determine the situation of △I. When the elastomer and the wafer are stuck, the elastomer and the wafer are not easy to separate, then the vibration displacement data I will have an abnormal change when the elastomer and the wafer are separated, and the △I change is obvious, which can determine that the elastomer and the wafer are stuck. When it is determined that the elastomer and the wafer are stuck, the machine display module 7 displays the elastomer sticking warning information and the information that the elastomer needs to be replaced, realizing the online detection and online warning of the adhesion between the elastomer and the wafer during the wafer sorting process.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting adhesion between an elastomer and a wafer, characterized in that: include: S1. Transferring wafers between a wafer cassette and a wafer calibration device by a robot arm; S2, during the wafer transfer process in step S1, obtaining a vibration signal of the robot arm; S3, preprocessing the vibration signal of the manipulator arm obtained in step S2 to make it meet the analog-to-digital conversion input conditions; S4, performing analog-to-digital conversion on the vibration signal of the manipulator arm preprocessed in step S3 to generate a digital signal and obtain vibration data of the manipulator arm; S5. Compare the vibration data of the robot arm obtained in step S4 with the standard vibration data of the robot arm in the vibration database to determine whether the elastomer and the wafer are sticky.

2. The method for detecting adhesion between an elastic body and a wafer according to claim 1, characterized in that: In step S2, a vibration signal of the robot arm is obtained through a vibration sensor fixed to the robot arm.

3. The method for detecting adhesion between an elastic body and a wafer according to claim 1, characterized in that: In step S3, the step of preprocessing the vibration signal of the manipulator arm obtained in step S2 includes: filtering, voltage dividing, limiting and signal amplification processing of the vibration signal of the manipulator arm, eliminating clutter interference, and enhancing the driving ability and anti-interference ability of the vibration signal of the manipulator arm.

4. The method for detecting adhesion between an elastic body and a wafer according to claim 1, characterized in that: In step S4, the step of performing analog-to-digital conversion on the vibration signal of the manipulator arm preprocessed in step S3 includes: collecting the vibration signal of the manipulator arm preprocessed in step S3 by an analog signal collector, then converting it into a digital signal by an analog-to-digital converter, and then processing it by a digital signal processor to obtain the vibration data of the manipulator arm.

5. The method for detecting adhesion between an elastic body and a wafer according to any one of claims 1 to 4, characterized in that: In step S2, the vibration signals of the robot arm obtained include: the vibration signal of the robot arm when it moves without load, the vibration signal of the robot arm when it moves with the wafer, and the vibration signal of the robot arm when it places the wafer on the wafer calibration device.

6. The method for detecting adhesion between an elastic body and a wafer according to any one of claims 1 to 4, characterized in that: Also includes: S6. Based on the result of step S5 determining whether the elastomer and the wafer are sticky, when it is determined that the elastomer and the wafer are sticky, a display indicating that the elastomer and the wafer are sticky is displayed on the machine and a warning message and information indicating that the elastomer needs to be replaced are issued.

7. A system for detecting adhesion between an elastomer and a wafer, characterized in that: A method for detecting adhesion between an elastomer and a wafer according to any one of claims 1 to 6, wherein the system for detecting adhesion between an elastomer and a wafer comprises: A vibration sensor (1) is fixed to the manipulator arm (2) and is used to obtain a vibration signal of the manipulator arm (2); A preprocessing module (3) connected to the vibration sensor (1), the preprocessing module (3) comprising a filtering circuit, a limiting circuit and an amplifying circuit, and used for filtering, dividing and limiting the voltage and amplifying the vibration signal of the manipulator arm (2); an analog-to-digital conversion module (4) connected to the preprocessing module (3), the analog-to-digital conversion module (4) comprising an analog signal collector, an analog-to-digital converter and a digital signal processor, the analog-to-digital conversion module (4) receiving the signal processed by the preprocessing module (3) and performing analog-to-digital conversion to generate a digital signal, thereby obtaining vibration data of the robot arm; A vibration database (5), wherein the vibration database (5) stores standard vibration data of the robot arm; A comparison module (6) is connected to the analog-to-digital conversion module (4) and the vibration database (5), respectively, and is used to compare the vibration data of the manipulator arm obtained by the analog-to-digital conversion module (4) with the standard vibration data of the manipulator arm stored in the vibration database (5), and output a comparison result.

8. The system for detecting adhesion between an elastic body and a wafer according to claim 7, characterized in that: The machine also comprises a machine display module (7), the machine display module (7) being connected to the comparison module (6), the machine display module (7) comprising a display and an alarm, the display being used to display the comparison result of the comparison module (6), the alarm being used to issue an alarm prompt when it is determined that the elastomer and the wafer are sticky.

9. A wafer sorting device, characterized in that: A system for detecting adhesion between an elastomer and a wafer comprising the system described in claim 7 or 8, or a method for detecting adhesion between an elastomer and a wafer capable of executing any one of claims 1 to 6.

10. The wafer sorting device according to claim 9, characterized in that: include: Rack (8); A wafer box (9), arranged on the side of the frame (8) and used for storing wafers; A wafer calibration device (10), located in the frame (8); A robot (11) is movably arranged in the frame (8), and the robot (11) is suitable for moving between the wafer box (9) and the wafer calibration device (10). The robot (11) is provided with a robot arm (2), and an elastic body (12) is installed at the front end of the robot arm (2), and a vibration sensor (1) is fixed near the front end of the robot arm (2).

Images