Spray boom adjustment device and spray boom adjustment method

Abstract

The present application provides a spray bar adjustment device and a spray bar adjustment method, wherein the spray bar is used in a wafer cleaning device, and the spray bar adjustment device includes: a landing point calibration member, which is detachably installed in the wafer cleaning device and is provided with a landing point mark that matches the preset liquid spray landing point on the wafer; and a direction adjustment member, which includes a connecting portion detachably connected to the spray bar and a positioning portion connected to the connecting portion, the extending direction of the direction adjustment member matches the spray direction of the cleaning liquid sprayed from the spray bar, and the direction adjustment member is configured to drive the spray bar to rotate around its axis until the positioning portion is aligned with the landing point mark, so that the spray bar can spray the cleaning liquid to the preset liquid spray landing point. According to the technical solution of the present application, the accuracy and convenience of the spray bar angle adjustment are improved through the matching adjustment design of the landing point calibration member and the direction adjustment member.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafer processing technology, and in particular, to a spray bar adjustment device and a spray bar adjustment method. Background Art

[0002] In the semiconductor field, the cleanliness of the wafer surface is one of the important factors affecting the reliability of semiconductor devices. During the wafer manufacturing process, such as deposition, plasma etching, photolithography, electroplating, etc., contamination or particles may be introduced onto the wafer surface, resulting in reduced cleanliness of the wafer surface and low yield of manufactured semiconductor devices. In order to achieve the goal of a contaminant-free wafer surface, contaminants on the wafer surface need to be removed to prevent contaminants from remaining on the wafer surface before the process. Therefore, multiple surface cleanings are required during the wafer manufacturing process to remove contaminants such as metal ions, atoms, organic matter, and particles attached to the wafer surface.

[0003] The wafer cleaning method that usually adopts roller brush cleaning is to clean the wafer by utilizing the friction between the roller brush and the wafer. In order to better clean the wafer, a spray bar is introduced into the brush cleaning module to spray deionized water for double cleaning. The spray angle of the spray bar directly affects the process effect of the brush cleaning module. However, the current method of adjusting the angle of the spray bar is generally to observe the spray angle of deionized water with the naked eye. Since deionized water is a colorless and transparent liquid, it is difficult to clearly see its spray landing point with the naked eye. Moreover, everyone has different criteria for judging the landing point, which makes it easy for the spray angle to deviate. In addition, since the wafer is inside the box and there is a certain amount of back and forth shaking, the landing point obtained by each wafer adjustment is deviated, resulting in uneven process effects. Summary of the Invention

[0004] The present application provides a spray boom adjustment device and a spray boom adjustment method to solve or alleviate at least some of the above-mentioned problems.

[0005] According to one aspect of the present application, a spray bar adjustment device is provided, wherein the spray bar is used in a wafer cleaning device, and the spray bar adjustment device includes:

[0006] a landing point calibration member, which is detachably mounted in the wafer cleaning device and is provided with a landing point mark that matches a preset liquid spray landing point on the wafer; and

[0007] A directional adjustment member includes a connecting portion detachably connected to the spray boom and a positioning portion connected to the connecting portion. The extension direction of the directional adjustment member matches the spray direction of the cleaning liquid sprayed by the spray boom. The directional adjustment member is configured to drive the spray boom to rotate around its axis until the positioning portion is aligned with the landing point mark, so that the spray boom can spray the cleaning liquid to the preset spray landing point.

[0008] In an optional or alternative embodiment, the positioning portion is a retractable structure, and the positioning portion is configured to retract when installed on or removed from the spray boom, and to extend toward the landing point marking member to align with the landing point mark when the directional adjustment member drives the spray boom to rotate around its axis.

[0009] In an optional or alternative embodiment, the positioning portion includes a telescopic sleeve and a positioning push rod; one end of the positioning push rod is slidably sleeved into the telescopic sleeve, and the other end is constructed with an alignment portion that matches the landing point mark.

[0010] In an optional or alternative embodiment, the landing point calibration piece includes a plate-shaped body, which is arranged along a vertical plane, the landing point mark includes a calibration boss protruding from the body along a thickness direction perpendicular to the vertical plane, and the alignment portion includes an alignment platform that matches the shape of the upper surface of the calibration boss, and the alignment platform is configured to abut against the upper surface of the calibration boss.

[0011] In an optional or alternative embodiment, the body is configured with a calibration bevel recessed inwardly from the surface of the body, the calibration bevel extending in a horizontal direction and comprising: a bottom surface flush with the upper surface of the calibration boss; a vertical surface extending upward from an inner edge of the bottom surface; and an inclined surface extending obliquely from an edge of the vertical surface away from the bottom surface to the surface of the body;

[0012] The landing point mark includes a marking line extending horizontally on the vertical surface, and the alignment portion includes an alignment tip configured to be aligned with the marking line.

[0013] In an optional or alternative embodiment, the vertical distance between the marking line and the center of the wafer to be cleaned is 10 to 100 mm.

[0014] In an optional or alternative embodiment, the plane where the vertical surface is located coincides with the mid-section of the wafer in the thickness direction.

[0015] In an optional or alternative embodiment, the thickness at the vertical surface is not less than 2 mm.

[0016] In an optional or alternative embodiment, the axial telescopic sliding range of the telescopic sleeve and the positioning ejector rod is 0 to 30 mm.

[0017] In an optional or alternative embodiment, the wafer cleaning device has two parallel spray bars, and the spray bar adjustment device includes a landing point calibration member arranged between the two spray bars and two direction adjustment members detachably connected to the two spray bars respectively, and the landing point calibration member is mounted to the axle of the rotating wheel of the wafer cleaning device for supporting the wafer.

[0018] In an optional or alternative embodiment, the landing point calibration member has a first side facing one spray boom and a second side facing the other spray boom, and includes two calibration bosses and two calibration chutes respectively arranged on the first side and the second side, and the two calibration bosses are arranged at different vertical positions.

[0019] In an optional or alternative embodiment, the connecting portion includes a first connecting member fixedly connected to the positioning portion and a second connecting member docked with the first connecting member, the first connecting member is constructed with a first semicircular recessed away from the second connecting member, the second connecting member is constructed with a second semicircular recessed away from the first connecting member, the inner diameters of the first semicircular recess and the second semicircular recess are the same and match the outer diameter of the spray boom, the first connecting member and the second connecting member are detachably clamped on the outside of the spray boom with the first semicircular recess and the second semicircular recess respectively.

[0020] According to another aspect of the present application, a method for adjusting a spray boom is provided, which is performed using the spray boom adjusting device according to the above aspect, and the method includes:

[0021] Installing the landing point calibration component in a wafer cleaning device;

[0022] Connecting the directional adjustment member to the spray boom;

[0023] rotating the directional adjustment member and stretching the positioning portion until the positioning portion is aligned with the landing point mark; and

[0024] The positioning portion is retracted and the boom adjustment device is disassembled.

[0025] According to the spray bar adjustment device and spray bar adjustment method of the present application, by equating the desired preset liquid drop point on the wafer to the drop point mark on the drop point calibration member, and by matching the extension direction of the directional adjustment member with the spray direction of the cleaning liquid sprayed from the spray bar, the preset liquid drop point and the difficult-to-observe spray direction of the cleaning liquid are respectively concretized as the drop point mark and the extension direction of the directional adjustment member, providing a specific physical standard for spray bar angle adjustment. The design of the spray bar adjustment device uses physical structures and marks such as the positioning part and the drop point mark to define the adjustment standard, avoiding adjustment errors caused by naked eye observation and improving adjustment accuracy. Furthermore, the connection between the directional adjustment member and the spray bar enables the synchronous rotation of the directional adjustment member and the spray bar, as well as the rotation adjustment of the spray bar. In addition, the retractable design of the pointing adjustment part avoids interference between the spray boom adjustment device and the landing point calibration part or other components during installation or disassembly. The pointing adjustment part in the retracted state can save more operable controls for the spray boom adjustment device or the wafer cleaning device, thereby improving the operational flexibility and convenience of the spray boom adjustment device; the pointing adjustment part in the extended state can be closer to or close to the landing point mark, thereby achieving accurate alignment between the positioning part and the landing point mark, reducing errors caused by human observation, and improving the accuracy of the spray boom adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a three-dimensional schematic diagram of a wafer cleaning device;

[0028] Figure 2 is a schematic diagram of a spray boom adjustment device according to one embodiment of the present application;

[0029] Figure 3 yes Figure 2 A side view of the boom adjustment mechanism in FIG.

[0030] Figure 4 yes Figure 3 A magnified view of point A in FIG;

[0031] Figure 5 yes Figure 2 A schematic diagram of a directional adjustment member of a boom adjustment device;

[0032] Figure 6 Shown Figure 5 The enlarged view of point B in FIG.

[0033] Figure 7 is a flow chart of a method for adjusting a spray boom according to one embodiment of the present application;

[0034] Figure 8 is a flow chart of a wafer post-processing method according to an embodiment of the present application;

[0035] Figure 9 is a schematic block diagram of a wafer post-processing system according to an embodiment of the present application; and

[0036] Figure 10 is a schematic diagram of an electronic device according to an embodiment of the present application.

[0037] Reference numerals :

[0038] Wafer post-processing system 1000, wafer W, wafer cleaning device 1, housing 10, support portion 20, driving wheel 21, driven wheel 22, cleaning brush 30, spray bar 40, spray bar mounting base 50;

[0039] Spray boom adjustment device 100, landing point calibration member 110, body 111, landing point marker 112, calibration boss 1121, calibration chute 1122, bottom surface 1122a, upright surface 1122b, inclined surface 1122c, pointing adjustment member 120, connecting portion 121, first connecting member 1211, connecting head 1211a, connecting seat 1211b, second connecting member 1212, positioning portion 122, telescopic sleeve 1221, positioning ejector 1222, alignment portion 1223, alignment platform 1223a, alignment tip 1223b, connecting part 130;

[0040] Actuating device 200, actuator 210, controller 220;

[0041] Electronic device 300 , processor 310 , memory 320 , communication interface 330 , communication bus 340 . DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0043] In the description of this application, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0044] In addition, in the description of this application, unless otherwise specified and limited, it should be noted that the terms "install", "connect" and "connect" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0045] Figure 1 Schematic diagram of a wafer cleaning device. The wafer cleaning device 1 includes:

[0046] The shell 10 provides a relatively closed space for wafer cleaning operations ( Figure 1 For the purpose of illustration, one side wall and top cover of the housing 10 are hidden);

[0047] a support portion 20 disposed on the housing 10 and supporting the wafer W;

[0048] a pair of cleaning brushes 30 for cleaning the front and back surfaces of the wafer W;

[0049] A pair of spray bars 40 are provided with a plurality of nozzles and / or spray holes for supplying cleaning liquid toward the surface of the wafer W.

[0050] exist Figure 1 In the illustrated embodiment, the support portion 20 vertically supports (or horizontally supports in other embodiments) and positions the wafer W to be cleaned, and cleaning brushes 30 are provided on both sides of the wafer W. The ends of the cleaning brushes 30 are connected to drive motors (not shown), and the drive motor drives the cleaning brushes 30 to rotate around their axes. When the wafer W is cleaned, the support portion 20 rotates, and under the action of friction, the wafer W vertically arranged on the support portion 20 rotates around the axis of the wafer W. Specifically, the support portion 20 includes a driving wheel 21 and a driven wheel 22. The driving wheel 21 and the driven wheel 22 are provided with circumferentially surrounding card slots, and the wafer W is clamped in the card slots. Under the action of friction, the rotation of the driving wheel 21 can drive the wafer W to rotate around its axis. A spray bar 40 is provided on the upper part of the housing 10 to spray cleaning liquid onto the surface of the wafer W. The spray bar 40 is fixed to the housing 10 via a spray bar mounting seat 50.

[0051] Figure 2 1 is a schematic diagram of a spray bar adjustment device 100 according to an embodiment of the present application, wherein the spray bar adjustment device 100 is installed in a wafer cleaning device 1 that is not loaded with wafers. The spray bar adjustment device 100 mainly includes a landing point calibration member 110 and a direction adjustment member 120. The landing point calibration member 110 is detachably installed in the wafer cleaning device 1, and is provided with a landing point mark 112 that matches the preset spray landing point on the wafer. The direction adjustment member 120 includes a connecting portion 121 that is detachably connected to the spray bar 40 and a positioning portion 122 connected to the connecting portion 121 (for specific structure, see Figure 5 ), the extending direction of the directional adjustment member 120 matches the spray direction of the cleaning liquid sprayed from the spray boom 40. The directional adjustment member 120 is configured to drive the spray boom 40 to rotate about its (spray boom 40) axis until the positioning portion 122 is aligned with the landing point mark 112, so that the spray boom 40 can spray the cleaning liquid to a predetermined spray landing point. The positioning portion 122 is configured to be retractable and is configured to retract to avoid striking the landing point mark 110 when being installed on or removed from the spray boom 40, and to extend toward the landing point mark 110 to align with the landing point mark 112 when the directional adjustment member 120 drives the spray boom 40 to rotate about its axis.

[0052] According to the technical solution of the present application, by equating the desired predetermined liquid drop point on the wafer to the drop point mark 112 on the drop point calibration member 110, and by matching the extension direction of the directional adjustment member 120 with the spray direction of the cleaning liquid sprayed from the spray bar 40, the predetermined liquid drop point and the difficult-to-observe spray direction of the cleaning liquid are embodied as the drop point mark 112 and the extension direction of the directional adjustment member 120, providing a specific physical standard for adjusting the angle of the spray bar 40. Furthermore, the connection between the directional adjustment member 120 and the spray bar 40 enables the synchronous rotation of the directional adjustment member 120 and the spray bar 40, as well as the rotation adjustment of the spray bar 40. In addition, the positioning portion 122 of the pointing adjustment member 120 is designed to be retractable, which avoids interference between the spray boom adjustment device 100 and the landing point calibration member 110 or other components during installation or disassembly. The positioning portion 122 in the retracted state can save more operable controls for the spray boom adjustment device 100 or the wafer cleaning device 1, thereby improving the operational flexibility and convenience of the spray boom adjustment device 100; the positioning portion 122 in the extended state can be closer to or close to the landing point mark 112, thereby achieving accurate alignment of the positioning portion 122 with the landing point mark 112, reducing errors caused by human observation, and improving the accuracy of spray boom adjustment.

[0053] In a specific embodiment, combined with Figure 2 as well as Figure 3As can be seen from the side view of the spray bar adjustment device 100 shown, the landing point calibration member 110 includes a plate-shaped body 111, which is arranged along a vertical plane. The mid-section of the body 111 in the thickness direction can coincide with the mid-section of the wafer in the thickness direction when the wafer is installed in the wafer cleaning device. The upper part of the body 111 can be configured as a semicircular plate, and the lower part of the body 111 can be configured as a roughly rectangular plate. The two corners of the rectangle can be connected to the axle of the driving wheel 21 via connecting parts 130 (such as locking nuts). In optional embodiments, the landing point calibration member 110 can be configured into other shapes suitable for calibration and operation, and can also be installed to the rotating shaft of other wheels (such as the driven wheel 22) or installed at other locations according to the needs of fixing and setting.

[0054] The landing point marker 112 includes a calibration boss 1121 protruding from the body 111 of the landing point calibration member 110 along a thickness direction perpendicular to the vertical plane. One or more (e.g., two as shown) calibration bosses 1121 can be provided on a first side of the landing point calibration member 110 facing one spray bar 40, and one or more (e.g., two) calibration bosses 1121 can be provided on a second side of the landing point calibration member 110 facing the other spray bar. The two or more calibration bosses 1121 on the same side have the same vertical position. The upper surface of the calibration boss 1121 can be set horizontally, and the calibration bosses 1121 on both sides of the landing point calibration member 110 can be set at different vertical positions to accommodate different cleaning requirements on both sides of the wafer.

[0055] Combine Figure 2 and Figure 4As can be seen from the partially enlarged view, the body 111 of the landing point calibration member 110 also includes a calibration bevel 1122 recessed inward from the surface of the body 111, for example, two calibration bevels 1122 are respectively provided on the first side and the second side of the landing point calibration member 110. The calibration bevel 1122 extends in the horizontal direction and includes a bottom surface 1122a flush with the upper surface of the calibration boss 1121, a vertical surface 1122b extending upward from the inner edge of the bottom surface 1122a, and an inclined surface 1122c extending outward from the edge of the vertical surface away from the bottom surface 1122a to the surface of the body 111 (for example, the inclination angle is 1° to 10°, preferably 2° to 8°). The plane of the vertical surface 1122b can coincide with the mid-section of the wafer in the thickness direction so as to simulate the installation position of the wafer in the wafer cleaning device. The landing point mark 112 includes an identification line (not marked) extending horizontally on the vertical surface 1122b. The marking line is 10 to 100 mm vertically from the center of the wafer to be cleaned, for example, 10 to 100 mm above the center of the wafer. The marking lines on both sides of the landing point calibration member 110 can be staggered in the vertical direction, that is, located at different vertical heights. In addition, to ensure the structural strength of the landing point calibration member 110, the thickness of the vertical surface 1122b can be set to no less than 2 mm.

[0056] Combine Figure 4 The enlarged view of the part shown and Figure 5 It can be seen that the specific structure and specific alignment method of the pointing adjustment member 120. Figure 5 As shown, the direction adjustment member 120 mainly includes a connecting portion 121 for detachably connecting to the spray rod 40 and a retractable positioning portion 122 connected to the connecting portion 121. The positioning portion 122 includes a telescopic sleeve 1221 and a positioning push rod 1222. The telescopic sleeve 1221 can be telescopically slidably connected to the connecting portion 121 or fixedly connected. One end of the positioning push rod 1222 is slidably sleeved into the telescopic sleeve 1221, and the other end is configured with an alignment portion 1223 that matches the landing point mark 112 (see Figure 6 ).

[0057] Figure 6 Shown Figure 5 The enlarged view of B in FIG. 1 shows the specific structure of the alignment portion 1223. The alignment portion 1223 may include an alignment platform 1223a that matches the shape of the upper surface of the calibration boss 1121, and the alignment platform 1223a is configured to abut against the upper surface of the calibration boss 1121. The alignment portion 1223 may also include an alignment tip 1223b, and the alignment tip 1223b is configured to align with the identification line. Figure 4As shown, when adjusting the spray boom, the positioning rod 1222 extends toward the calibration chute 1122, so that the alignment platform 1223a abuts against the upper surface of the calibration boss 1121, and the alignment tip 1223b is aligned with the marking line. Figure 5 The tip 1223b has a certain length in the vertical direction of the paper, thereby forming an edge, so that the alignment between the alignment tip 1223b and the identification line is a line-to-line alignment, thereby improving the accuracy of the alignment.

[0058] The alignment of the alignment platform 1223a with the calibration boss 1121, and the alignment of the alignment tip 1223b with the marking line, provide dual alignment standards for adjusting the angle of the spray boom 40. The two alignment methods can complement and verify each other, avoiding errors caused by human observation, providing dual guarantees for the accuracy of the angle adjustment of the spray boom 40, and improving the accuracy and adjustment efficiency of the angle adjustment of the spray boom 40. In addition, the calibration chute 1122 and the calibration boss 1121 are relatively easy to observe, facilitating rapid adjustment of the position of the pointing adjustment member 120, and then fine-tuning it, thereby improving adjustment efficiency. Furthermore, the calibration boss 1121 can also provide a vertical limit for the pointing adjustment member 120, so that the pointing adjustment member 120 can be stably maintained in the adjusted position, preventing the pointing adjustment member 120 from deviating from the adjusted position when adjusting another spray boom or in other situations.

[0059] In a more specific embodiment, Figure 5 As shown, the connecting portion 121 includes a first connecting member 1211 fixedly connected to the positioning portion 122 and a second connecting member 1212 docked with the first connecting member 1211. The first connecting member 1211 can specifically include a connecting head 1211a and a connecting seat 1211b. The connecting head 1211a is arranged opposite to the second connecting member 1212 and clamps the spray rod 40 therebetween. The connecting seat 1211b is used to be telescopically or fixedly connected to the telescopic sleeve 1221 (for example, via a fixing bolt). The connecting head 1211a is configured with a first semicircular recess that is recessed away from the second connecting member 1212, and the second connecting member 1212 is configured with a second semicircular recess that is recessed away from the first connecting member 1211. Figure 5 As shown, the connector 1211a is generally U-shaped, and the second connector 1212 is generally semicircular. The inner diameters of the first and second semicircular recesses are identical and match the outer diameter of the spray boom, so that the first and second connectors 1211, 1212 are respectively clamped onto the outside of the spray boom with the first and second semicircular recesses. During installation, the first connector 1211 can be first clamped onto the outside of the spray boom 40, and then the second connector 1212 can be pressed onto the outside of the spray boom 40 relative to the first connector 1211. The first and second connectors 1211, 1212 can then be fixed relative to each other and fixed to the spray boom 40.

[0060] The inner diameter of telescopic sleeve 1221 matches the outer diameter of positioning push rod 1222. In actual manufacturing, the inner diameter tolerance of telescopic sleeve 1221 can be, for example, 0 to 0.018 mm, and the outer diameter tolerance of positioning push rod 1222 can be, for example, -0.018 mm to -0.005 mm. This creates a small gap between the inner diameter and outer diameter of positioning push rod 1222. This small gap allows for smooth sliding, ensuring a stable, rock-free telescopic sliding process. The axially retractable sliding range of telescopic sleeve 1221 and positioning push rod 1222 is, for example, 0 to 30 mm, meaning that positioning push rod 1222 can slide outward from telescopic sleeve 1221 by a maximum of 30 mm.

[0061] The spray boom adjustment device 100 of the present application can be used to adjust the spray boom. Figure 7 A flow chart showing a method for adjusting a spray boom according to an embodiment of the present application is shown, the method comprising:

[0062] S1: Install the landing point calibration component 110 in the wafer cleaning device 1;

[0063] S2: Connect the directional adjustment member 120 to the spray boom 40;

[0064] S3: rotating the pointing adjustment member 120 and stretching the positioning portion 122 until the positioning portion 122 is aligned with the landing mark 112; and

[0065] S4: Retract the positioning portion 122 and disassemble the spray boom adjustment device 100.

[0066] In step S2, when the directional adjustment member 120 is connected to the spray boom, the directional adjustment member 120 can be retracted to its shortest position to facilitate installation and prevent interference between the directional adjustment member 120 and other components. Furthermore, before the directional adjustment member 120 is fixed relative to the spray boom, the position of the directional adjustment member 120 can be adjusted so that the axial extension direction of the directional adjustment member 120 matches the spray direction of the cleaning fluid sprayed from the spray boom, i.e., the extension direction of the directional adjustment member 120 can simulate the spray direction of the cleaning fluid sprayed from the spray boom. Furthermore, step S3 can include first adjusting the directional adjustment member 120 and positioning portion 122 on one spray boom, and then adjusting the directional adjustment member 120 and positioning portion 122 on the other spray boom after adjusting the angle of the spray boom.

[0067] In a further embodiment, Figure 8 The following schematically shows a flow chart of a wafer post-processing method according to an embodiment of the present application. The method mainly includes:

[0068] S10: adjusting the spray bar 40, which may specifically include: S11: installing a spray bar adjusting device 100 in the wafer cleaning apparatus; S12: adjusting the spray bar 40 of the wafer cleaning apparatus via the spray bar adjusting device 100, wherein the spray bar adjusting device 100 includes a landing point calibration member 110 and a direction adjustment member 120; and S13: removing the spray bar adjusting device 100; and

[0069] S20: Cleaning the wafer W, which may specifically include: S21: Positioning the wafer W in the wafer cleaning device 1 and performing wafer cleaning.

[0070] The step S11 of “arranging the spray bar adjustment device 100 in the wafer cleaning device 1 ” may include:

[0071] S111: Arrange the plate-shaped body 111 of the landing point calibration member 110 along a vertical plane, wherein the vertical plane corresponds to the position of the wafer in the wafer cleaning device 1; and S112: Removably connect the connecting portion 121 of the pointing adjustment member 120 to the spray bar 40.

[0072] According to the wafer post-processing method of the present application, by matching the landing point mark on the landing point calibration part with the desired preset spray landing point on the wafer, and by matching the extension direction of the pointing adjustment part with the spray direction of the cleaning liquid sprayed out of the spray rod, a concrete operation of adjusting the spray rod angle is realized using a specific physical standard, thereby reducing the adjustment error, improving the accuracy of the adjustment, and thereby improving the effectiveness of wafer post-processing.

[0073] In a further embodiment, step S12 of "adjusting the spray rod 40 of the wafer cleaning device via the spray rod adjustment device 100" may include: S121: matching the landing point mark 112 on the landing point calibration member 110 with a preset liquid spray landing point position on the wafer; and S122: actuating the pointing adjustment member 120 to drive the spray rod 40 to rotate around its axis until the positioning portion 122 of the pointing adjustment member 120 is aligned with the landing point mark 112, wherein the extension direction of the positioning portion 122 matches the spray direction of the cleaning liquid sprayed out of the spray rod 40.

[0074] More specifically, in step S122, "actuating the pointing adjustment member 120 to drive the spray boom 40 to rotate about its axis until the positioning portion 122 of the pointing adjustment member 120 is aligned with the landing point mark 112" may include: retracting the positioning portion 122 along its extension direction, and then extending the positioning portion 122 toward the landing point calibration member 110 to align with the landing point mark 112 when the pointing adjustment member 120 drives the spray boom 40 to rotate about its axis. "Extending the positioning portion 122 toward the landing point calibration member 110 to align with the landing point mark 112 when the pointing adjustment member 120 drives the spray boom 40 to rotate about its axis" may include aligning the alignment portion 1223a against the upper surface of the calibration boss 1121, or may also include aligning the alignment tip 1223b of the alignment portion with the marking line.

[0075] It should be understood that the above-described wafer post-processing method may include a step of adjusting the spray bar before performing wafer cleaning, i.e., pre-cleaning calibration, or may include a step of adjusting the spray bar after a predetermined number of wafers have been cleaned, to correct for any deviation in the spray bar's spray angle after the wafer cleaning apparatus has operated for a period of time, thereby ensuring the effectiveness of subsequent cleaning operations. In other words, the step of adjusting the spray bar may be performed once or multiple times at one or more points where adjustment is required, such as after the wafer cleaning apparatus is manufactured, before initial use, or during its service life.

[0076] Figure 9 A schematic block diagram of a wafer post-processing system 1000 according to an embodiment of the present application is shown, wherein a dotted line represents a detachable connection between two devices, and a bidirectional hollow arrow represents a communication connection or an electrical connection. The wafer post-processing system 1000 is configured to perform the aforementioned wafer post-processing method, which may include:

[0077] A wafer cleaning apparatus 1 configured to clean wafers and comprising a spray bar 40 for spraying a cleaning liquid onto the wafers;

[0078] A boom adjustment device 100 for adjusting the boom 40; and

[0079] The actuating device 200 is configured to actuate the boom adjusting device 100 to adjust the boom.

[0080] The specific structures of the wafer cleaning device 1 and the spray bar adjustment device 100 can be found in Figure 1-6As described above. The actuator 200 may include an actuator 210 and a controller 220 in communication with the actuator 210. The controller 220 may be configured to send a control signal to the actuator 210 to instruct the actuator 210 to perform an operation of adjusting the spray bar. In one embodiment, the actuator 210 may include a manipulator for adjusting the spray bar 40, including moving the spray bar adjustment device 100 into, installing, and moving it out of the wafer cleaning device 1, causing the directional adjustment member 120 of the spray bar adjustment device 100 to drive the spray bar 40 to rotate around its axis, and aligning the positioning portion 122 of the directional adjustment member 120 with the landing point mark 112, for example, with the help of a built-in or external device such as an image sensor. Alternatively, in an alternative embodiment, the actuator 210 may further include a driver (not shown) integrated into the spray boom adjustment device 100. The driver may be used to perform operations such as aligning the positioning portion 122 of the pointing adjustment member 120 with the landing mark 112, such as extending and retracting the positioning portion 122. In this case, the robot arm may only perform operations such as moving the spray boom adjustment device 100 into, installing, and removing the wafer cleaning apparatus 1. It should be understood that the wafer post-processing system 1000 may also not include the actuator 200, but rather utilize manual operation to perform the spray boom adjustment operation.

[0081] Figure 10 is a schematic diagram of an electronic device 300 according to one embodiment of the present application. The electronic device 300 may include a processor 310, a memory 320, a communication interface 330, and a communication bus 340. The processor 310, the memory 320, and the communication interface 330 communicate with each other via the communication bus 340. The processor 310 may be a CPU, an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application. The processor 310 may be communicatively coupled to the controller 220 described above. Upon receiving an executable signal from the processor 310, the controller 220 may control the actuator 210 to perform a corresponding operation. The processor 310 may also be communicatively coupled to the execution controller 220 of a wafer cleaning device to control the wafer cleaning device. The memory 320 is used to store at least one executable instruction that causes the processor 310 to issue an executable signal to execute an operation corresponding to a wafer post-processing method. The communication interface 330 is used to communicate with other electronic devices 300 or a server.

[0082] The present application also provides a storage medium (not shown), which stores a computer program that can be executed by the processor 310 to implement the aforementioned wafer post-processing method. Specifically, a system or device equipped with a storage medium can be provided, on which a software program code for implementing the function of any one of the embodiments of the above-mentioned wafer post-processing method is stored, and the computer (or CPU or MPU) of the system or device is made to read out and execute the program code stored in the storage medium. In this case, the program code read from the storage medium itself can be used to implement the operation of any one of the embodiments described above, so the program code and the storage medium storing the program code constitute a part of the present application. The storage medium embodiment for providing the program code includes a floppy disk, a hard disk, a magneto-optical disk, an optical disk (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), a magnetic tape, a non-volatile memory card, and a ROM.

[0083] The above describes the spray boom adjustment device and the spray boom adjustment method of the application. It should be understood that the above implementation mode is only used to illustrate the embodiments of the present application, and is not a limitation to the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A spray bar adjustment device, the spray bar is used in a wafer cleaning device, characterized in that: The boom adjustment system includes: a landing point calibration member, which is detachably mounted in the wafer cleaning device and is provided with a landing point mark that matches a preset liquid spray landing point on the wafer; and a direction adjustment member, comprising a connecting portion detachably connected to the spray boom and a positioning portion connected to the connecting portion, wherein an extending direction of the direction adjustment member matches a spray direction of the cleaning fluid sprayed from the spray boom, and the direction adjustment member is configured to drive the spray boom to rotate about its axis until the positioning portion is aligned with the landing point mark, so that the spray boom can spray the cleaning fluid to the preset liquid landing point; The landing point calibration member includes a plate-shaped body arranged along a vertical surface, and the landing point mark includes a calibration boss protruding from the body perpendicular to the vertical surface; the positioning portion includes a telescopic sleeve and a positioning push rod, one end of the positioning push rod is slidably sleeved into the telescopic sleeve, and the other end is configured with an alignment portion that matches the landing point mark, and the alignment portion includes an alignment platform that matches the shape of the upper surface of the calibration boss, and the alignment platform is configured to abut against the upper surface of the calibration boss; The body is configured with a calibration bevel recessed inwardly from the surface of the body, the calibration bevel extending in the horizontal direction and comprising: a bottom surface flush with the upper surface of the calibration boss; a vertical surface extending upwardly from the inner edge of the bottom surface; and an inclined surface extending obliquely from the edge of the vertical surface away from the bottom surface to the surface of the body; the landing mark comprises a marking line extending horizontally on the vertical surface, and the alignment portion comprises an alignment tip having an edge to form a line-to-line alignment with the marking line; The landing point calibration member is provided with two or more calibration bosses on a first side facing one spray bar and two or more calibration bosses on a second side facing the other spray bar; the two or more calibration bosses on the same side of the landing point calibration member are in the same vertical position; the calibration bosses on both sides of the landing point calibration member are arranged at different vertical positions to meet different cleaning requirements on both sides of the wafer; The plane where the vertical surface is located coincides with the mid-section of the wafer in the thickness direction, and the thickness of the vertical surface is not less than 2 mm; The identification line is set 10 to 100 mm above the center of the wafer.

2. The spray bar adjustment device according to claim 1, characterized in that: The positioning portion is a retractable structure, which is configured to contract when installed on or removed from the spray boom, and extend toward the landing point marking member to align with the landing point mark when the direction adjustment member drives the spray boom to rotate around its axis.

3. The spray bar adjustment device according to claim 2, characterized in that: The axial telescopic sliding range of the telescopic sleeve and the positioning push rod is 0 to 30 mm.

4. The spray boom adjustment device according to claim 1, characterized in that: The wafer cleaning device has two parallel spray bars, and the spray bar adjustment device includes a landing point calibration component arranged between the two spray bars and two direction adjustment components detachably connected to the two spray bars respectively. The landing point calibration component is installed to the axle of the rotating wheel of the wafer cleaning device for supporting the wafer.

5. The spray bar adjustment device according to claim 4, characterized in that: The landing point marking component includes two marking inclined grooves respectively arranged on the first side and the second side.

6. The spray boom adjustment device according to any one of claims 1 to 5, characterized in that: The connecting portion includes a first connecting member fixedly connected to the positioning portion and a second connecting member docking with the first connecting member, the first connecting member is constructed with a first semicircular recessed away from the second connecting member, the second connecting member is constructed with a second semicircular recessed away from the first connecting member, the inner diameters of the first semicircular recess and the second semicircular recess are the same and match the outer diameter of the spray boom, the first connecting member and the second connecting member are detachably clamped on the outside of the spray boom with the first semicircular recess and the second semicircular recess respectively.

7. A method for adjusting a spray boom, performed using the spray boom adjustment device according to any one of claims 1 to 6, the method comprising: Installing the landing point calibration component in a wafer cleaning device; Connecting the directional adjustment member to the spray boom; Rotate the direction adjustment member and stretch the positioning portion until the positioning portion is aligned with the landing point mark; as well as The positioning portion is retracted and the boom adjustment device is disassembled.

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