Device and method for online measurement and closed-loop feedback of laser processing temperature field

Abstract

The invention relates to a laser processing temperature field on-line measurement and closed-loop feedback device and method.The laser processing temperature field on-line measurement and closed-loop feedback device comprises a laser processing unit, a temperature field on-line detection unit and a control unit, and the laser processing unit comprises a laser, a lens assembly and a motion platform; the motion platform is used for bearing a machining material, laser emitted by the laser reaches the surface of the machining material through the lens assembly, and the machining material is excited to form an infrared spectrum in the machining process; the temperature field on-line detection unit comprises an infrared temperature measurement probe, and the infrared temperature measurement probe is used for detecting an infrared spectrum; the control unit is in communication connection with the infrared temperature measurement probe and the laser, the control unit can receive the infrared spectrum transmitted by the infrared temperature measurement probe and calculate an actual temperature field value according to the infrared spectrum, and the control unit can dynamically compare the actual temperature field value with a preset temperature field threshold; and parameters of the laser are adjusted through closed-loop feedback according to the comparison result.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a device and method for online measurement and closed-loop feedback of a laser processing temperature field. Background Art

[0002] Laser processing is a high-efficiency and high-precision processing method. Existing laser processing technologies include macro-processing and micro-processing, such as laser cladding, laser welding, laser quenching, laser cutting, laser additive manufacturing, laser etching, laser drilling, laser micro-nano processing, laser peeling, laser transfer, laser direct writing and other technologies. During the laser processing process, the surface of the material heats up rapidly due to the action of the laser, and melting, vaporization, and even splashing occur simultaneously, causing the temperature field on the surface of the material to change sharply. However, when the temperature accumulation exceeds a certain threshold range, it will have a direct impact on the performance of the material itself. For example, when laser processing flexible circuit boards, it is required to selectively remove the surface copper layer and retain the bottom flexible polyimide film layer. Once the temperature of the processing area exceeds 500°C, the bottom polyimide film layer will lose its original function due to high-temperature carbonization, resulting in a decrease in the performance of the flexible circuit board; for example, when laser cutting soda-lime glass, the temperature field distribution of the processing area must be strictly controlled. Once the temperature of the cutting area exceeds 280°C, the soda-lime glass will directly explode and splash due to temperature imbalance, which not only has poor cutting quality but is also very dangerous. Therefore, it is necessary to monitor the temperature field distribution during laser processing online and perform closed-loop control based on the monitoring results.

[0003] One of the current solutions to this problem is to install a temperature monitoring unit in the laser processing system. For example, the public patent CN201710273179.1 proposes a laser preheating processing system that integrates real-time temperature field measurement and feedback control functions. A laser preheating system is added to the traditional mechanical processing system to assist in reducing the hardness and strength of the processed material; an infrared temperature measurement laser head is used to measure the preheating temperature, and temperature monitoring and power feedback compensation of the preheating laser are performed. However, in this patent, the temperature measurement point is not coaxial with the processing head, and it is in a paraxial measurement state rather than in-situ measurement. There is a certain offset between the measurement area and the processing area, resulting in a certain deviation in the in-situ measurement of the temperature field in the processing area. For example, the public patent CN202210141374.X proposes a femtosecond laser processing system and a three-dimensional surface morphology and temperature online measurement method, which achieves indirect measurement of the temperature field by measuring the reflectivity of the material surface during laser processing. Although this patent adopts the method of coaxial in-situ detection, the processing method is single-point processing, which requires the auxiliary movement of the translation table, and it is difficult to realize the rapid measurement of the temperature field in the two-dimensional processing area; at the same time, the system only realizes the temperature field measurement during laser processing, and does not perform closed-loop feedback adjustment on the temperature monitoring results, making it difficult to realize temperature field regulation during laser processing.

[0004] Based on the above-mentioned defects and deficiencies, the art urgently needs to make further improvements and optimization designs on existing laser processing devices and methods to solve the problem that existing laser processing devices are difficult to achieve high-speed, synchronous, in-situ, and large-range temperature field precision measurement and closed-loop control, and to provide an intelligent processing device and method with high detection accuracy, fast response speed, high feedback efficiency, and online closed-loop feedback. Summary of the invention

[0005] In view of the defects of the prior art and the need for improvement, the present invention proposes a method and device for online measurement and closed-loop feedback of the temperature field in laser processing. By coaxial / paraxial online monitoring of the infrared spectral distribution during the laser scanning processing and combining with a control unit, in-situ monitoring and closed-loop feedback of the temperature field during the laser scanning processing can be achieved.

[0006] A device for online measurement and closed-loop feedback of laser processing temperature field, the device for online measurement and closed-loop feedback of laser processing temperature field comprising:

[0007] A laser processing unit, comprising a laser, a lens assembly and a motion platform, wherein the motion platform is used to carry a processing material, and the laser light emitted by the laser can reach the surface of the processing material through the lens assembly, so as to excite the processing material to form an infrared spectrum during the processing;

[0008] A temperature field online detection unit, comprising an infrared temperature measuring probe, wherein the infrared temperature measuring probe is used to detect the infrared spectrum;

[0009] A control unit is communicatively connected to the infrared temperature measuring probe and the laser, the control unit is capable of receiving the infrared spectrum transmitted by the infrared temperature measuring probe, and calculating an actual temperature field value based on the infrared spectrum, and the control unit is capable of dynamically comparing the actual temperature field value with a preset temperature field threshold, and adjusting the parameters of the laser through closed-loop feedback based on the comparison result.

[0010] The above-mentioned device for online measurement and closed-loop feedback of the temperature field of laser processing, by setting a laser processing unit, the laser energy emitted by the laser can pass through the lens assembly and reach the processing material, thereby processing the processing material. Moreover, the laser energy reaching the processing material can excite the processing material to form an infrared spectrum. At this time, the infrared temperature measuring probe of the temperature field online detection unit detects the infrared spectrum and transmits the infrared spectrum to the control unit. The control unit calculates the actual temperature field value according to the infrared spectrum, and dynamically compares the actual temperature field value with the preset temperature field threshold, and adjusts the parameters of the laser according to the comparison result of the actual temperature field value and the preset temperature field threshold by closed-loop feedback, thereby adjusting the actual temperature field of the processing material. This application realizes infrared spectral imaging and temperature field analysis of points, lines, and surfaces synchronously by setting a temperature field online detection unit and a control unit, and performs closed-loop control on the parameters and states of laser processing according to the detection results, completes high-speed analysis and online feedback of the temperature field during laser processing, and realizes temperature field control in the laser processing area. At the same time, combined with the processing unit, the temperature field online detection unit and the control unit, the temperature field online control in the laser processing process is realized, which greatly improves the temperature field detection range and the intelligence of the temperature control in the processing area compared with the traditional independent infrared temperature measurement system. It can realize on-site, fast, high-precision temperature measurement and closed-loop control in the laser processing area, providing a new solution for online monitoring of the temperature field, high-temperature suppression, and material performance control in laser processing.

[0011] In one embodiment, the lens assembly comprises:

[0012] Dichroic mirror;

[0013] A reflector, comprising a broadband scanning galvanometer, wherein the broadband scanning galvanometer is used to reflect the laser and provide coaxial reflection of the laser band and the broadband infrared spectrum band;

[0014] A dimming element, comprising a broadband field mirror, which is used to focus the laser beam emitted by the reflector on the surface of the processing material and provide coaxial transmission of the laser band and the infrared spectrum band. The reflector and the dimming element act on light with a band of 200nm-14um;

[0015] The infrared temperature measuring probe is arranged on a side of the dichroic mirror away from the reflecting element, and the detection light of the infrared temperature measuring probe coincides with the infrared spectrum reflected by the dichroic mirror.

[0016] In one embodiment, the reflective element includes a first galvanometer lens and a second galvanometer lens, and the laser light emitted by the dichroic mirror passes through the first galvanometer lens and the second galvanometer lens in sequence to reach the light modulating element;

[0017] The first galvanometer lens and the second galvanometer lens are both provided with coatings, and the coatings are used for coaxial reflection of the laser band and the infrared spectrum wide band.

[0018] In one embodiment, the lens assembly comprises:

[0019] Dichroic mirror;

[0020] A reflective component, including a reflective galvanometer;

[0021] A light modulating element, comprising a field lens, the field lens is used to focus the laser beam emitted by the reflective element on the surface of the processing material and allow a single-wavelength band of laser light to pass through;

[0022] The infrared temperature measuring probe is arranged on one side of the infrared spectrum excited by the processing material to collect the infrared spectrum information.

[0023] In one embodiment, the lens assembly comprises:

[0024] Dichroic mirror;

[0025] A reflector, comprising a broadband reflector, wherein the broadband reflector is used to reflect the laser and provide coaxial reflection of the laser band and the infrared spectrum broadband band;

[0026] A dimming element, comprising a broadband focusing objective lens, which is used to focus the laser beam emitted by the reflector on the surface of the processing material and provide coaxial transmission of the laser band and the infrared spectrum band. The reflector and the dimming element act on light with a wavelength of 200nm-14um;

[0027] The infrared temperature measuring probe is arranged on a side of the dichroic mirror away from the reflecting element, and the detection light of the infrared temperature measuring probe coincides with the infrared spectrum reflected by the dichroic mirror.

[0028] In one embodiment, the lens assembly comprises:

[0029] Dichroic mirror;

[0030] Reflective parts, including reflectors;

[0031] A light modulating element, comprising a focusing lens, wherein the focusing lens is used to focus the laser beam emitted by the reflecting element on the surface of the processing material and allow a single-wavelength band of the laser to pass through;

[0032] The infrared temperature measuring probe is arranged on one side of the infrared spectrum excited by the processing material to collect the infrared spectrum information.

[0033] The present application also provides a method for online measurement and closed-loop feedback of a laser processing temperature field based on the device for online measurement and closed-loop feedback of a laser processing temperature field as described in any one of the above items, and the method for online measurement and closed-loop feedback of a laser processing temperature field comprises:

[0034] Turning on the laser processing unit, the temperature field online detection unit and the control unit, so that the laser emits laser light that reaches the surface of the processing material through the lens assembly;

[0035] Detecting the infrared spectrum by the infrared temperature measuring probe and transmitting the infrared spectrum to the control unit;

[0036] The control unit calculates an actual temperature field value according to the infrared spectrum, dynamically compares the actual temperature field value with a preset temperature field threshold, and adjusts the parameters of the laser according to the comparison result.

[0037] In the above-mentioned method of online measurement and closed-loop feedback of the laser processing temperature field, the laser processing unit, the online temperature field detection unit and the control unit cooperate with each other. When the laser processing unit excites the processing material to form an infrared spectrum, the infrared temperature measuring probe of the online temperature field detection unit can detect the infrared spectrum and transmit the information to the control unit. The control unit calculates the actual temperature field value based on the infrared spectrum, and dynamically compares the actual temperature field value with the preset temperature field threshold. The control unit uses the comparison result to adjust the parameters of the laser, thereby adjusting the actual temperature field on the surface of the processing material.

[0038] In one of the embodiments, when the control unit dynamically compares the actual temperature field value with the preset temperature field threshold, the resolution and visualization infrared spectrum of the surface temperature field of the processed material is reconstructed according to the mapping relationship between the laser scanning dot matrix path and the signal excitation dot matrix data, and the infrared spectrum amplitude distribution.

[0039] In one of the embodiments, if the actual temperature field value is less than the preset temperature field threshold, the control unit controls the laser to continue processing;

[0040] If the actual temperature field value is greater than the preset temperature field threshold, the control unit controls the laser to stop processing, and the control unit adjusts the processing parameters and / or operating state of the laser.

[0041] In one embodiment, when the temperature field is detected by the online detection unit, the reflector uses a broadband scanning galvanometer, the dimming element uses a broadband field mirror, the reflector and the dimming element both act on light with a wavelength of 200nm-14um, and the infrared temperature measuring probe is arranged on the side of the dichroic mirror away from the reflector, so that the detection light of the infrared temperature measuring probe coincides with the infrared spectrum reflected by the dichroic mirror; or,

[0042] When the temperature field online detection unit performs detection, the reflective element uses a reflective galvanometer, the dimming element uses a field mirror, and the infrared temperature measuring probe is set on the side of the infrared spectrum excited by the processing material to collect the infrared spectrum information; or,

[0043] When the temperature field online detection unit performs detection, the reflector uses the broadband reflector, the dimming element uses a broadband focusing objective lens, the reflector and the dimming element act on light with a wavelength of 200nm-14um, and the infrared temperature measuring probe is arranged on the side of the dichroic mirror away from the reflector, so that the detection light of the infrared temperature measuring probe coincides with the infrared spectrum reflected by the dichroic mirror; or,

[0044] When the temperature field online detection unit performs detection, the reflector is selected as the reflector, the dimming element is selected as the focusing objective lens, and the infrared temperature measuring probe is arranged on the side of the infrared spectrum excited by the processing material to collect the infrared spectrum information. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG1 is a schematic diagram of the structure of a device for online measurement and closed-loop feedback of the laser processing temperature field provided in Example 1 of the present application.

[0046] FIG2 is a schematic diagram of the structure of a device for online measurement and closed-loop feedback of the laser processing temperature field provided in Example 2 of the present application.

[0047] FIG3 is a schematic diagram of the structure of the device for online measurement and closed-loop feedback of the laser processing temperature field provided in Example 3 of the present application.

[0048] FIG4 is a schematic diagram of the structure of the device for online measurement and closed-loop feedback of the laser processing temperature field provided in Example 4 of the present application.

[0049] FIG5 is a schematic diagram of temperature field analysis based on infrared spectrum detection in the present application.

[0050] In the figure:

[0051] 100. Laser;

[0052] 200. Collimation and beam expansion module;

[0053] 300, reflector module;

[0054] 400, dichroic mirror; 500, reflector; 510, first galvanometer lens; 520, second galvanometer lens;

[0055] 600, dimming parts

[0056] 700, motion platform; 710, processing materials; 720, infrared spectrum;

[0057] 800, infrared temperature probe; 810, industrial computer;

[0058] 900. Closed-loop feedback unit. DETAILED DESCRIPTION

[0059] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0060] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0061] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0062] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0063] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0064] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0065] The present application provides a device for online measurement and closed-loop feedback of laser processing temperature field, as shown in Figures 1 to 5, the device for online measurement and closed-loop feedback of laser processing temperature field includes a laser processing unit, an online temperature field detection unit and a control unit, the laser processing unit includes a laser 100, a lens assembly and a motion platform 700, the motion platform 700 is used to carry a processing material 710, the laser emitted by the laser 100 can reach the surface of the processing material 710 through the lens assembly, so as to excite the processing material 710 to form an infrared spectrum 720 during the processing; the online temperature field detection unit includes an infrared temperature measuring probe 800, and the infrared temperature measuring probe 800 is used to detect the infrared spectrum 720; the control unit is communicatively connected to the infrared temperature measuring probe 800 and the laser 100, the control unit can receive the infrared spectrum 720 transmitted by the infrared temperature measuring probe 800, and calculate the actual temperature field value according to the infrared spectrum 720, and the control unit can dynamically compare the actual temperature field value with the preset temperature field threshold, and adjust the parameters of the laser 100 according to the comparison result through closed-loop feedback.

[0066] The above-mentioned device for online measurement and closed-loop feedback of the temperature field of laser processing is provided with a laser processing unit, and the laser energy emitted by the laser 100 reaches the processing material 710 through the lens assembly, thereby processing the processing material 710. Moreover, the laser energy reaching the processing material 710 excites the processing material 710 to form an infrared spectrum 720. At this time, the infrared temperature measuring probe 800 of the temperature field online detection unit detects the infrared spectrum 720 and transmits the infrared spectrum 720 to the control unit. The control unit calculates the actual temperature field value according to the infrared spectrum 720, and dynamically compares the actual temperature field value with the preset temperature field threshold, and adjusts the parameters of the laser 100 according to the comparison result of the actual temperature field value and the preset temperature field threshold through closed-loop feedback, thereby adjusting the actual temperature field of the processing material 710. The present application realizes the imaging and temperature field analysis of the infrared spectrum 720 of points, lines and surfaces simultaneously by providing the temperature field online detection unit and the control unit, and performs closed-loop control on the parameters and state of the laser processing according to the detection results, completes the high-speed analysis and online feedback of the temperature field during the laser processing, and realizes the temperature field control of the laser processing area. At the same time, the combination of the processing unit, the temperature field online detection unit and the control unit realizes the online control of the temperature field during the laser processing process. Compared with the traditional independent infrared temperature measurement system, it greatly improves the temperature field detection range and the intelligence of the temperature control in the processing area. It can realize on-site, fast, high-precision temperature measurement and closed-loop control in the laser processing area, providing a new solution for online monitoring of the temperature field, high temperature suppression, and material performance control in laser processing.

[0067] Specifically, as shown in FIG. 1 to FIG. 4 , the motion platform 700 is a three-dimensional motion platform 700 .

[0068] Specifically, the infrared temperature measurement probe 800 can analyze the infrared spectrum 720 signal into a temperature signal or temperature field distribution information, including but not limited to high-speed infrared thermometers, high-speed infrared thermal imagers, infrared detectors, infrared detection modules, infrared photodiodes and other devices or modules with infrared high-speed detection capabilities.

[0069] Furthermore, the control unit includes an industrial computer 810 and a closed-loop feedback unit 900 that are communicatively connected, and the industrial computer 810 is communicatively connected to the temperature field online detection unit.

[0070] Specifically, the closed-loop feedback unit 900 can adjust the processing parameters or operating status of the laser 100 according to the temperature change closed-loop feedback, including but not limited to field programmable gate array FPGA (Field Programmable Gate Array), single-chip microcomputer, embedded module, programmable logic controller PLC (Programmable Logic Controller) and other devices or modules with logical judgment and feedback output.

[0071] Further, as shown in Figures 1 to 4, the lens assembly includes a collimating and expanding module 200, a reflector module 300, a dichroic mirror 400, a reflector 500 and a dimming element 600. The laser emitted by the laser 100 passes through the collimating and expanding module 200 and the reflector module 300 in sequence to reach the dichroic mirror 400. The laser beam emitted by the laser 100 is expanded and transformed by the collimating and expanding module 200, and the transmission direction of the beam is deflected 90° after reaching the reflector module 300. The deflected laser beam passes through the dichroic mirror 400 and enters the reflector 500 to realize two-dimensional scanning, and then is focused on the surface of the processing material 710 by the dimming element 600. A continuous infrared spectrum 720 is synchronously formed during the laser scanning process. The infrared temperature measuring probe 800 captures the excited infrared spectrum 720 and transmits the information to the industrial computer 810. The industrial computer 810 can realize the actual temperature field analysis of the processing material 710 by online monitoring of the infrared spectrum 720, and dynamically compares it with the preset temperature field threshold. The closed-loop feedback unit 900 adjusts the parameters and state of the laser processing online according to the comparison result, thereby realizing the closed-loop control of the temperature field during the laser processing process.

[0072] Specifically, as shown in FIG. 1 and FIG. 3 , the dichroic mirror 400 is a broadband transflective mirror, which can achieve efficient reflection of the laser band and efficient coaxial transmission of the infrared spectrum 720 .

[0073] In one embodiment, as shown in FIG. 1 , the reflector 500 includes a broadband scanning galvanometer, which is used to reflect laser light and provide coaxial reflection of a laser band and a wide band of an infrared spectrum 720; the dimming element 600 includes a broadband field mirror, which is used to focus the laser beam emitted by the reflector 500 on the surface of a processing material 710 and provide coaxial transmission of a laser band and a wide band of an infrared spectrum 720; the reflector 500 and the dimming element 600 act on light with a wavelength of 200nm-14um; the infrared temperature measuring probe 800 is disposed on a side of the dichroic mirror 400 away from the reflector 500, and the detection light of the infrared temperature measuring probe 800 coincides with the infrared spectrum 720 reflected by the dichroic mirror 400.

[0074] FIG1 is a schematic diagram of the structure of the online measurement (scanning coaxial) and closed-loop feedback unit 900 of the laser processing temperature field. The reflector 500 includes a broadband scanning galvanometer, and the dimming element 600 includes a broadband field mirror. Both the reflector 500 and the dimming element 600 act on light with a wavelength of 200nm-14um. The reflector 500 can reflect laser and infrared spectrum 720, while the dimming element 600 can allow laser and infrared spectrum 720 to pass through. The surface of the processed material 710 heats up rapidly due to laser irradiation, and synchronously radiates outward to form a continuous infrared spectrum 720. Based on the reversible principle of the optical path, the detection light of the infrared temperature measuring probe 800 coincides with the infrared spectrum 720 reflected by the dichroic mirror 400. The infrared spectrum 720 is coaxially reversely transmitted through the broadband field mirror, the broadband scanning galvanometer, and the dichroic mirror 400 in sequence, and then collected by the infrared temperature measuring probe 800, and transmitted online to the industrial computer 810 for temperature field analysis, and dynamically compared with the preset temperature threshold; the closed-loop feedback unit 900 adjusts the parameters (energy / repetition rate / pulse width) or state (on / off) of the device for online measurement and closed-loop feedback of the laser processing temperature field according to the comparison result, thereby realizing online measurement, precise regulation, and closed-loop feedback control of the temperature field during laser processing, and effectively adjusting the influence of temperature field changes on material properties.

[0075] Specifically, as shown in FIG1 , the reflector 500 includes a first galvanometer lens 510 and a second galvanometer lens 520. The laser light emitted by the dichroic mirror 400 passes through the first galvanometer lens 510 and the second galvanometer lens 520 in sequence to reach the dimming element 600. The first galvanometer lens 510 and the second galvanometer lens 520 are both provided with a coating, and the coating is used for coaxial reflection of the laser band and the infrared spectrum 720 wide band. The coating is specially customized on the first galvanometer lens 510 and the second galvanometer lens 520. The coating can simultaneously realize coaxial high-efficiency reflection of the laser band and the infrared spectrum 720 wide band, regulate the high-speed scanning processing of the laser in the processing plane, and then realize scanning temperature detection in a two-dimensional plane.

[0076] It should be noted that when the infrared spectrum 720 is coaxially reflected, it passes through the light modulator 600 , the second galvanometer lens 520 , the first galvanometer lens 510 in sequence and then reflects to the dichroic mirror 400 .

[0077] In one embodiment, as shown in FIG2 , the reflector 500 includes a reflective galvanometer, and the dimming element 600 includes a field mirror. The field mirror is used to focus the laser beam emitted by the reflector 500 on the surface of the processing material 710 and allow the laser single band to pass through. The infrared temperature probe 800 is arranged on the side of the infrared spectrum 720 excited by the processing material 710 to collect information of the infrared spectrum 720. FIG2 is a structural schematic diagram of the laser processing temperature field online measurement (scanning paraxial) and closed-loop feedback unit 900. The reflector 500 includes a reflective galvanometer, and the dimming element 600 includes a field mirror. The reflective galvanometer and the field mirror act on the laser single band. The infrared temperature probe 800 is arranged on the side of the processing material 710, that is, the infrared temperature probe 800 is in the scanning paraxial detection mode. Although the scanning paraxial detection mode cannot achieve the effect of laser pulse in-situ monitoring, it can simplify the device of laser processing temperature field online measurement and closed-loop feedback, and reduce processing cost and production cost.

[0078] In one embodiment, as shown in FIG. 3 , the reflector 500 includes a broadband reflector, which is used to reflect laser light and provide coaxial reflection of a wide band of the laser light and an infrared spectrum 720; the dimming element 600 includes a broadband focusing objective lens, which is used to focus the laser beam emitted by the reflector 500 on the surface of the processing material 710 and provide coaxial transmission of the laser light and the infrared spectrum 720; the reflector 500 and the dimming element 600 act on light with a wavelength of 200 nm-14 um; the infrared temperature measuring probe 800 is arranged on the side of the dichroic mirror 400 away from the reflector 500, and the detection light of the infrared temperature measuring probe 800 coincides with the infrared spectrum 720 reflected by the dichroic mirror 400.

[0079] FIG3 is a schematic diagram of the structure of the online measurement (single-point coaxial) and closed-loop feedback unit 900 of the laser processing temperature field. The reflective element 500 includes a broadband reflector, which can simultaneously realize coaxial high-efficiency reflection of the laser band and the infrared spectrum 720 wide band; the dimming element 600 includes a broadband focusing objective lens, which can simultaneously realize coaxial high-efficiency transmission of the laser band and the infrared spectrum 720 wide band. The working process of the device for online measurement and closed-loop feedback of the temperature field of laser processing is as follows: the laser beam emitted by the laser 100 is expanded and transformed by the collimating and expanding module 200, and the transmission direction of the beam is deflected by 90° after reaching the reflector module 300. The deflected laser beam passes through the dichroic mirror 400 and the broadband reflector, and then is focused on the surface of the processing material 710 by the broadband focusing objective lens. The motion platform 700 carries the processing material 710 to realize three-dimensional processing in space; a continuous infrared spectrum 720 is synchronously formed during laser processing, and the infrared temperature measuring probe 800 captures the infrared spectrum 720 of coaxial excitation and transmits it to the industrial computer 810. The temperature field analysis of the processing area can be realized by online monitoring of the coaxial infrared spectrum 720, and dynamically compared with the preset temperature threshold. The closed-loop feedback reaction adjusts the parameters and state of the laser processing online according to the comparison result, thereby realizing the closed-loop control of the temperature field during the laser processing.

[0080] In one embodiment, as shown in FIG4 , the reflector 500 includes a reflector, and the dimming element 600 includes a focusing lens. The focusing lens is used to focus the laser beam emitted by the reflector 500 on the surface of the processing material 710 and allow the laser single band to pass through. The infrared temperature probe 800 is arranged on the side of the infrared spectrum 720 excited by the processing material 710 to collect information of the infrared spectrum 720. FIG4 is a structural schematic diagram of the laser processing temperature field online measurement (single point paraxial) and closed-loop feedback unit 900. The infrared temperature probe 800 is a single point paraxial detection mode. The reflector 500 includes a reflector, and the dimming element 600 includes a focusing lens. Although the single point paraxial detection mode cannot achieve the effect of laser pulse in-situ monitoring, it can simplify the device for online measurement and closed-loop feedback of the laser processing temperature field (the reflector and the focusing lens can use a single band of laser, without broadband).

[0081] Preferably, in the embodiments of scanning coaxial (FIG. 1) and single-point coaxial (FIG. 3), the reflector 500 can simultaneously and efficiently reflect the laser processing light band and the infrared spectrum 720 band, including but not limited to laser galvanometers, acousto-optic deflectors, electro-optic deflectors, piezoelectric ceramic deflection mirror groups and other devices with two-dimensional scanning capabilities.

[0082] Preferably, in the embodiments of scanning coaxial (FIG. 1) and single-point coaxial (FIG. 3), the dimming element 600 can simultaneously and efficiently transmit the laser processing light band and the infrared spectrum 720 band, including but not limited to laser field mirrors, broadband lenses, objective lenses and other devices or lens groups with optical focusing capabilities.

[0083] Further, as shown in FIG5 , FIG5 is a schematic diagram of temperature field analysis based on infrared spectrum 720 detection in the present application, mainly including (a) a two-dimensional dot matrix distribution diagram of laser pulses in FIG5 , and (b) a two-dimensional reconstruction distribution diagram of infrared spectrum 720 in FIG5 ; wherein,

[0084] (a) in FIG5 is a two-dimensional dot matrix distribution diagram of laser pulses. By combining a broadband scanning galvanometer, a broadband field lens and a motion platform 700, or combining a broadband reflector, a broadband focusing lens and a motion platform 700, two-dimensional scanning processing of the laser on the surface of the processing material 710 is achieved, and the laser pulse dot matrix presents an M×N distribution;

[0085] (b) in Figure 5 is a two-dimensional reconstruction distribution diagram of the infrared spectrum 720. According to the mapping relationship between the laser scanning dot matrix path and the signal excitation dot matrix data, as well as the infrared spectrum 720 amplitude distribution, the M×N pulse dot matrix corresponds to the M'×N' infrared spectrum 720 dot matrix, which can realize high-resolution and visualized infrared spectrum reconstruction of the two-dimensional temperature field on the material surface in the processing area.

[0086] Furthermore, the device for online measurement and closed-loop feedback of the temperature field of laser processing of the present application also provides an embodiment of processing FPC flexible circuit boards (i.e., the processing material 710 is FPC): as shown in FIG1 , the temperature field online monitoring and closed-loop control of the FPC flexible circuit board processed by laser are realized based on the infrared spectrum 720 monitoring-scanning coaxial monitoring mode;

[0087] The FPC (Flexible Printed Circuit) flexible circuit board is composed of a polyimide flexible substrate and a copper-clad layer. In the process of manufacturing flexible circuits, it is often necessary to selectively remove the surface copper-clad layer and retain the flexible substrate. Once the temperature of the processing area exceeds 500°C, the bottom polyimide film layer will lose its original function due to high-temperature carbonization, resulting in a decrease in the performance of the flexible circuit board. In combination with the device for online measurement and closed-loop feedback of the laser processing temperature field of the present invention, a 355nm, 10ns pulse width ultraviolet nanosecond laser 100 is used as the light source. The repetition frequency of the laser 100 is set to 40kHz. A broadband scanning galvanometer and a fused quartz telecentric field mirror with a focal length of 100mm are used to focus the laser beam spot to the micron level. A 5mm×5mm square is scanned and removed on the FPC surface. The scanning speed of the broadband scanning galvanometer is set to 800mm / s. The infrared temperature measuring probe 800 is placed at The dichroic mirror 400 is located on the side away from the broadband scanning galvanometer, and the excited infrared spectrum 720 is coaxially monitored in situ. The industrial computer 810 analyzes the amplitude distribution of the infrared spectrum 720 and dynamically compares it with the preset temperature threshold. Once it is found that the temperature of the laser processing area of ​​the FPC is close to 500°C, the closed-loop feedback unit 900 adjusts the power parameters or operating status (on / off) of the laser 100 processing, effectively avoiding carbonization failure of the polyimide flexible substrate, based on which the temperature field in the laser processing process can be monitored online and closed-loop controlled.

[0088] Furthermore, the device for online measurement and closed-loop feedback of the temperature field in laser processing of the present application also provides an embodiment for processing soda-lime glass (i.e., the processing material 710 is soda-lime glass): as shown in FIG3 , online monitoring and closed-loop control of the temperature field in laser non-destructive cutting of soda-lime glass are realized based on infrared spectrum 720 monitoring—single-point coaxial monitoring mode;

[0089] Soda-lime glass is widely used in the fields of mobile phones, tablets, and wearable electronic devices due to its high hardness, good wear resistance, and excellent optical properties. Before use, soda-lime glass usually needs to be cut into specific shapes, such as long / square, arc chamfers, arc curves, and other special styles. During the cutting process of the laser 100, the temperature field distribution of the processing area must be strictly controlled. Once the temperature of the cutting area exceeds 280°C, the soda-lime glass will directly explode and splash due to temperature imbalance, which not only has poor cutting quality but is also very dangerous. In combination with the device for online measurement and closed-loop feedback of the laser processing temperature field of the present invention, a 1064nm, 30ns pulse width infrared nanosecond laser 100 is used as the light source, the repetition frequency of the laser 100 is set to 100kHz, and a 10× broadband focusing objective lens is used to focus the light spot to the micron level. A motion platform 700 is used to carry a 10mm×50mm rectangular soda-lime glass to achieve three-dimensional motion. The laser 100 emits light, and the motion platform 700 carries the soda-lime glass and moves 20mm at a speed of 10mm / s to achieve transverse cutting of the soda-lime glass. At the same time, the infrared temperature probe 800 is placed on the side of the dichroic mirror 400 away from the broadband reflector, and the infrared spectrum 720 excited is coaxially monitored in situ. The industrial computer 810 analyzes the amplitude distribution of the infrared spectrum 720 and dynamically compares it with the preset temperature threshold. Once the temperature of the laser processing area is found to be close to 280°C, the closed-loop feedback unit 900 adjusts the power parameters or operating status (on / off) of the laser 100 processing, effectively avoiding the soda-lime glass from bursting due to high temperature, based on which the temperature field online monitoring and closed-loop control during the laser processing process are achieved.

[0090] In summary, compared with the prior art, the device for online measurement and closed-loop feedback of the laser processing temperature field of the present application has the following technical advantages:

[0091] 1. The device for online measurement and closed-loop feedback of the laser processing temperature field of the present application adopts the coaxial / paraxial infrared spectrum 720 online detection mode, which can synchronously realize point, line and surface infrared spectrum 720 imaging and temperature field analysis during the laser processing process, and perform closed-loop control of the laser processing parameters and state according to the detection results, complete high-speed analysis and online feedback of the temperature field during the laser processing process, and realize temperature field control in the laser processing area.

[0092] 2. At the same time, the device for online measurement and closed-loop feedback of the laser processing temperature field of the present application, the laser spot diameter generated by the system is in the micron range, that is, the resolution of the temperature detection system provided by the present invention can reach the micron level; at the same time, combined with the temperature field closed-loop feedback unit 900, the online regulation of the temperature field in the laser processing process is realized, compared with the traditional independent infrared temperature measurement system, the temperature field detection range and the intelligence of the temperature control in the processing area are greatly improved.

[0093] 3. In addition, the device for online measurement and closed-loop feedback of the laser processing temperature field of the present application provides an "in-situ, online and fast" industrial online detection technology, which can realize on-site, fast, coaxial in-situ high-precision temperature measurement and closed-loop control in the laser processing area, and provides a new solution for online monitoring of the temperature field, high-temperature suppression, and material performance control of laser processing.

[0094] Furthermore, the present application also provides a method for online measurement and closed-loop feedback of a laser processing temperature field based on any of the above-mentioned devices for online measurement and closed-loop feedback of a laser processing temperature field, and the method for online measurement and closed-loop feedback of a laser processing temperature field includes:

[0095] The laser processing unit, the temperature field online detection unit and the control unit are turned on, and the laser 100 emits laser light and reaches the surface of the processing material 710 through the mirror assembly;

[0096] The infrared spectrum is detected by the infrared temperature measuring probe 800, and the infrared spectrum is transmitted to the control unit;

[0097] The control unit calculates the actual temperature field value according to the infrared spectrum, dynamically compares the actual temperature field value with the preset temperature field threshold, and adjusts the parameters of the laser 100 according to the comparison result.

[0098] In the above method for online measurement and closed-loop feedback of the temperature field of laser processing, the laser processing unit, the online temperature field detection unit and the control unit cooperate with each other. When the laser processing unit excites the processing material 710 to form an infrared spectrum 720, the infrared temperature measuring probe 800 of the online temperature field detection unit can detect the infrared spectrum 720 and transmit the information to the control unit. The control unit calculates the actual temperature field value according to the infrared spectrum 720 and dynamically compares the actual temperature field value with the preset temperature field threshold. The control unit adjusts the parameters of the laser 100 using the comparison result, and then adjusts the actual temperature field on the surface of the processing material 710.

[0099] Specifically, as shown in FIG5 , when the industrial computer 810 of the control unit dynamically compares the actual temperature field value with the preset temperature field threshold, the resolution and visualization infrared spectrum of the surface temperature field of the processed material 710 are reconstructed according to the mapping relationship between the laser scanning lattice path and the signal excitation lattice data, as well as the amplitude distribution of the infrared spectrum 720. The industrial computer 810 of the control unit reconstructs the resolution and visualization infrared spectrum of the surface temperature field of the processed material 710 according to the mapping relationship between the laser scanning lattice path and the signal excitation lattice data, as well as the amplitude distribution of the infrared spectrum 720, so as to facilitate the deriving of the actual temperature field value and compare the actual temperature field value with the preset temperature field threshold.

[0100] Further, if the actual temperature field value is less than the preset temperature field threshold, the control unit controls the laser 100 to continue processing; if the actual temperature field value is greater than the preset temperature field threshold, the control unit controls the laser 100 to stop processing, and the control unit adjusts the processing parameters and / or operating state of the laser 100. If the actual temperature field value is less than the preset temperature field threshold, it is judged that the actual temperature field value of the current processing material 710 is small, and the surface temperature of the processing material 710 is within the controllable range, and processing can be continued at this time; if the actual temperature field value is greater than the preset temperature field threshold, it is judged that the actual temperature field value of the current processing material 710 is large, and the surface temperature of the processing material 710 is uncontrollable, and the success rate of continuing processing is low. At this time, the closed-loop feedback unit 900 of the control unit controls the laser 100 to stop processing, and the closed-loop feedback unit 900 adjusts the processing parameters and / or operating state of the laser 100.

[0101] Furthermore, as shown in FIG. 1 to FIG. 4 , the method for online measurement and closed-loop feedback of the laser processing temperature field includes: the infrared spectrum 720 detection mode can be a combination of multiple modes such as galvanometer scanning processing coaxial / paraxial detection, or laser single-point processing coaxial / paraxial detection.

[0102] Specifically, as shown in Figure 1, when the temperature field online detection unit performs detection, the reflector 500 uses a broadband scanning galvanometer, the dimming element 600 uses a broadband field mirror, the reflector 500 and the dimming element 600 act on light with a wavelength band of 200nm-14um, and the infrared temperature measuring probe 800 is set on the side of the dichroic mirror 400 away from the reflector 500, so that the detection light of the infrared temperature measuring probe 800 coincides with the infrared spectrum 720 reflected by the dichroic mirror 400. At this time, the device for online measurement and closed-loop feedback of the laser processing temperature field adopts a scanning coaxial mode.

[0103] Specifically, as shown in FIG2 , when the temperature field online detection unit performs detection, the reflective element 500 uses a reflective galvanometer, the dimming element 600 uses a field mirror, and the infrared temperature measuring probe 800 is set on the side of the infrared spectrum 720 excited by the processing material 710 to collect the information of the infrared spectrum 720. At this time, the device for online measurement and closed-loop feedback of the laser processing temperature field adopts a scanning paraxial mode.

[0104] Specifically, as shown in FIG3 , when the temperature field online detection unit performs detection, the reflector 500 uses a broadband reflector, the dimming element 600 uses a broadband focusing objective lens, the reflector 500 and the dimming element 600 act on light with a wavelength of 200nm-14um, and the infrared temperature measuring probe 800 is arranged on the side of the dichroic mirror 400 away from the reflector 500, so that the detection light of the infrared temperature measuring probe 800 coincides with the infrared spectrum 720 reflected by the dichroic mirror 400. At this time, the device for online measurement and closed-loop feedback of the laser processing temperature field adopts a single-point coaxial mode.

[0105] Specifically, as shown in FIG4 , when the temperature field online detection unit performs detection, the reflector 500 uses a reflector, the dimming component 600 uses a focusing objective lens, and the infrared temperature measuring probe 800 is set on the side of the infrared spectrum 720 excited by the processing material 710 to collect the information of the infrared spectrum 720. At this time, the device for online measurement and closed-loop feedback of the laser processing temperature field adopts a single-point paraxial mode.

[0106] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A device for online measurement and closed-loop feedback of laser processing temperature field, characterized in that: The device for online measurement and closed-loop feedback of the laser processing temperature field comprises: A laser processing unit comprises a laser (100), a lens assembly and a motion platform (700), wherein the motion platform (700) is used to carry a processing material (710), and laser energy emitted by the laser (100) reaches the surface of the processing material (710) through the lens assembly, so as to excite the processing material (710) to form an infrared spectrum (720) during the processing; A temperature field online detection unit, comprising an infrared temperature measuring probe (800), wherein the infrared temperature measuring probe (800) is used to detect the infrared spectrum (720); A control unit is communicatively connected to the infrared temperature measuring probe (800) and the laser (100), the control unit being capable of receiving the infrared spectrum (720) transmitted by the infrared temperature measuring probe (800), and calculating an actual temperature field value based on the infrared spectrum (720), and the control unit being capable of dynamically comparing the actual temperature field value with a preset temperature field threshold, and adjusting the parameters of the laser (100) through closed-loop feedback according to the comparison result.

2. The device for online measurement and closed-loop feedback of laser processing temperature field according to claim 1, characterized in that: The lens assembly comprises: a dichroic mirror (400); The reflector (500) comprises a broadband scanning galvanometer, the broadband scanning galvanometer is used to reflect the laser and provide coaxial reflection of the laser band and the broadband infrared spectrum (720); The light modulator (600) comprises a broadband field mirror, the broadband field mirror is used to focus the laser beam emitted by the reflector (500) on the surface of the processing material (710), and to provide coaxial transmission of the laser band and the infrared spectrum (720) band, the reflector (500) and the light modulator (600) acting on light in the band of 200nm-14um; The infrared temperature measuring probe (800) is arranged on a side of the dichroic mirror (400) away from the reflecting element (500), and the detection light of the infrared temperature measuring probe (800) overlaps with the infrared spectrum (720) reflected by the dichroic mirror (400).

3. The device for online measurement and closed-loop feedback of laser processing temperature field according to claim 2, characterized in that: The reflector (500) comprises a first galvanometer lens (510) and a second galvanometer lens (520), and the laser light emitted by the dichroic mirror (400) passes through the first galvanometer lens (510) and the second galvanometer lens (520) in sequence to reach the light modulating element (600); The first galvanometer lens (510) and the second galvanometer lens (520) are both provided with coatings, and the coatings are used for coaxial reflection of the laser band and the infrared spectrum (720) wide band.

4. The device for online measurement and closed-loop feedback of laser processing temperature field according to claim 1, characterized in that: The lens assembly comprises: a dichroic mirror (400); A reflective member (500), comprising a reflective galvanometer; The light modulating element (600) comprises a field lens, the field lens being used to focus the laser beam emitted by the reflecting element (500) onto the surface of the processing material (710) and to allow a single-wavelength band of laser light to pass through; The infrared temperature measuring probe (800) is arranged on one side of the infrared spectrum (720) excited by the processing material to collect information of the infrared spectrum (720).

5. The device for online measurement and closed-loop feedback of laser processing temperature field according to claim 1, characterized in that: The lens assembly comprises: a dichroic mirror (400); A reflector (500) comprising a broadband reflector, the broadband reflector being used to reflect the laser and provide coaxial reflection of the laser wavelength band and the broadband wavelength band of the infrared spectrum (720); The light modulator (600) comprises a broadband focusing objective lens, the broadband focusing objective lens is used to focus the laser beam emitted by the reflector (500) on the surface of the processing material (710), and to provide coaxial transmission of the laser band and the infrared spectrum (720) band, the reflector (500) and the light modulator (600) acting on light in the band of 200nm-14um; The infrared temperature measuring probe (800) is arranged on a side of the dichroic mirror (400) away from the reflecting element (500), and the detection light of the infrared temperature measuring probe (800) overlaps with the infrared spectrum (720) reflected by the dichroic mirror (400).

6. The device for online measurement and closed-loop feedback of laser processing temperature field according to claim 1, characterized in that: The lens assembly comprises: a dichroic mirror (400); A reflective member (500) comprising a reflector; The light modulating element (600) comprises a focusing lens, wherein the focusing lens is used to focus the laser beam emitted by the reflecting element (500) onto the surface of the processing material (710) and to allow a single-wavelength band of the laser to pass through; The infrared temperature measuring probe (800) is arranged on a side of the infrared spectrum (720) excited by the processing material (710) to collect information of the infrared spectrum (720).

7. A method for online measurement and closed-loop feedback of laser processing temperature field based on the device for online measurement and closed-loop feedback of laser processing temperature field according to any one of claims 1 to 6, characterized in that: The method for online measurement and closed-loop feedback of the laser processing temperature field comprises: Turning on the laser processing unit, the temperature field online detection unit and the control unit, so that the laser (100) emits laser light that reaches the surface of the processing material (710) through the lens assembly; Detecting the infrared spectrum (720) by means of the infrared temperature measuring probe (800), and transmitting the infrared spectrum (720) to the control unit; The control unit calculates an actual temperature field value based on the infrared spectrum (720), dynamically compares the actual temperature field value with a preset temperature field threshold, and adjusts the parameters of the laser (100) based on the comparison result.

8. The method for online measurement and closed-loop feedback of laser processing temperature field according to claim 7, characterized in that: When the control unit dynamically compares the actual temperature field value with the preset temperature field threshold, the resolution and visualization infrared spectrum of the surface temperature field of the processed material (710) are reconstructed based on the mapping relationship between the laser scanning lattice path and the signal excitation lattice data, as well as the amplitude distribution of the infrared spectrum (720).

9. The method for online measurement and closed-loop feedback of laser processing temperature field according to claim 7, characterized in that: If the actual temperature field value is less than the preset temperature field threshold, the control unit controls the laser (100) to continue processing; If the actual temperature field value is greater than the preset temperature field threshold, the control unit controls the laser (100) to stop processing, and the control unit adjusts the processing parameters and / or operating state of the laser (100).

10. The method for online measurement and closed-loop feedback of laser processing temperature field according to claim 7, characterized in that: When the temperature field online detection unit performs detection, the reflector (500) uses a broadband scanning galvanometer, the dimming element (600) uses a broadband field mirror, the reflector (500) and the dimming element (600) both act on light with a wavelength of 200 nm-14 um, and the infrared temperature measuring probe (800) is arranged on a side of the dichroic mirror (400) away from the reflector (500), so that the detection light of the infrared temperature measuring probe (800) overlaps with the infrared spectrum (720) reflected by the dichroic mirror (400); or, When the temperature field online detection unit performs detection, the reflective element (500) uses a reflective galvanometer, the light modulating element (600) uses a field mirror, and the infrared temperature measuring probe (800) is arranged on the side of the infrared spectrum (720) excited by the processed material (710) to collect information of the infrared spectrum (720); or, When the temperature field online detection unit performs detection, the reflector (500) uses the broadband reflector, the dimming element (600) uses a broadband focusing lens, the reflector (500) and the dimming element (600) act on light with a wavelength of 200 nm-14 um, and the infrared temperature measuring probe (800) is arranged on a side of the dichroic mirror (400) away from the reflector (500), so that the detection light of the infrared temperature measuring probe (800) overlaps with the infrared spectrum (720) reflected by the dichroic mirror (400); or, When the temperature field online detection unit performs detection, the reflector (500) is selected as the reflector, the light modulating element (600) is selected as a focusing lens, and the infrared temperature measuring probe (800) is arranged on the side of the infrared spectrum (720) excited by the processed material (710) to collect information of the infrared spectrum (720).

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