A method for light-cured 3D printing high-temperature-resistant mold

Abstract

This invention provides a method for photopolymer 3D printing of high-temperature resistant molds, comprising the following steps: synthesizing a high-temperature resistant photopolymer 3D printing resin, wherein the high-temperature resistant photopolymer 3D printing resin comprises the following components by weight percentage: 50-80% ethoxylated bisphenol A diacrylate, 15-35% ethoxylated trimethylolpropane triacrylate, 3-10% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1-5% filler, and 0-2% additives; constructing a mold model using 3D modeling software, the mold model structure including conformal cooling water pipes; slicing the mold model using slicing software and setting printing parameters to generate a slice file; importing the generated slice file into a photopolymer 3D printing device, using the high-temperature resistant photopolymer 3D printing resin as the 3D printing material, and forming the high-temperature resistant mold using photopolymer 3D printing technology. The method of this invention for photopolymer 3D printing of high-temperature resistant molds can effectively improve the high-temperature resistance and compression resistance of photopolymer 3D printed high-temperature resistant molds.

Description

Technical Field

[0001] This invention relates to the field of mold manufacturing technology, and specifically to a method for photopolymerization 3D printing of high-temperature resistant molds. Background Technology

[0002] Molds, often referred to as the "mother of industry," are the cornerstone of industrial production. Traditional molds are characterized by high manufacturing costs, long production cycles, and low iteration efficiency. Therefore, directly printing molds using 3D printing can effectively shorten the mold-making cycle, reduce costs, minimize material waste, significantly increase the freedom of mold design, and achieve integrated molding of conformal cooling water pipes that are difficult to manufacture using traditional processing techniques. This greatly improves mold cooling efficiency, reduces stress deformation, and further enhances printing accuracy.

[0003] Currently, 3D printed molds are mainly based on metal molds, which have rough surfaces and low precision. Photopolymer 3D printing can greatly improve surface precision; however, current photopolymer 3D printing resins have poor high-temperature resistance and low compressive strength, making it difficult to meet the performance requirements of metal powder injection molding molds and plastic injection molding molds.

[0004] Therefore, it is necessary to provide a new process to solve the above-mentioned technical problems. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method for photopolymer 3D printing of high temperature resistant molds, which can effectively improve the high temperature resistance and compression resistance of photopolymer 3D printed high temperature resistant molds.

[0006] The technical solution of the present invention is as follows:

[0007] A method for photopolymer 3D printing of high-temperature resistant molds includes the following steps:

[0008] Step S1: Synthesize a high-temperature resistant photocurable 3D printing resin, wherein the high-temperature resistant photocurable 3D printing resin comprises the following components by weight percentage:

[0009] Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, additives 0-2%;

[0010] Step S2: Construct a mold model using 3D modeling software. The mold model structure includes conformal cooling water pipes.

[0011] Step S3: Use slicing software to slice the mold model and set printing parameters to generate a slice file;

[0012] Step S4: Import the generated slice file into the photopolymer 3D printing equipment, use the high-temperature resistant photopolymer 3D printing resin as the 3D printing material, and use photopolymer 3D printing technology to form a high-temperature resistant mold.

[0013] Furthermore, in step S1, the filler is silica particles or alumina particles with a particle size of 50-100 nm.

[0014] Further, in step S1, the additive is at least one of defoamer, polymerization inhibitor, leveling agent or dispersant.

[0015] Furthermore, the method for synthesizing the high-temperature photocurable 3D printing resin in step S1 is as follows:

[0016] Ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate were stirred in a water bath at 55-65°C until completely mixed.

[0017] Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed;

[0018] Finally, add the filler and additives and continue stirring until completely mixed.

[0019] Furthermore, in step S2, the conformal cooling water pipes are arranged inside the mold, fitting against the mold wall, and changing with the shape of the mold's internal surface.

[0020] Furthermore, in step S3, the printing parameters include exposure time, layer thickness, and lift-up speed.

[0021] Furthermore, in step S4, a high-temperature resistant mold is formed using LCD photopolymerization 3D printing technology.

[0022] Furthermore, it also includes step S5, which involves treating the surface of the formed high-temperature resistant mold by methods such as grinding and polishing, chemical plating, or electroplating.

[0023] Furthermore, chemical copper plating is performed on the surface of the formed high-temperature resistant mold.

[0024] Compared with existing technologies, the method for photopolymerization 3D printing of high-temperature resistant molds provided by this invention has the following advantages:

[0025] I. The method for photopolymerization 3D printing of high-temperature resistant molds provided by this invention improves the high-temperature resistance and compressive strength of 3D printing resin materials by designing a new photosensitive resin material for high-temperature resistant molds. The prepared high-temperature resistant molds can achieve a compressive strength of up to 275 MPa and a thermal weight loss of T0.05. 5％ =392.83℃, T max =448.45℃ and T91％ =553.69℃. Therefore, the high-temperature resistant mold formed by the method of the present invention can meet the performance requirements of metal powder injection molding and plastic injection molding molds, and has good application value.

[0026] II. The method for photopolymer 3D printing of high-temperature resistant molds provided by this invention uses photopolymer 3D printing technology to create molds with excellent high-temperature resistance and compression resistance. It enables personalized customization of molds, offers high design freedom, and has high molding accuracy. Photopolymer 3D printing technology can effectively shorten the mold manufacturing cycle, improve production efficiency, reduce material waste, and lower mold manufacturing costs. Compared with traditional mold processing technology, photopolymer 3D printing technology can easily achieve integrated molding of conformal cooling water pipes in the mold structure, which can significantly improve cooling efficiency and reduce stress deformation of the product.

[0027] Third, the method for photopolymerization 3D printing of high-temperature resistant molds provided by the present invention can treat the surface of the formed high-temperature resistant mold by grinding and polishing, chemical plating or electroplating, thereby improving the appearance quality of the mold and further improving the precision, smoothness and service life of the mold. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a thermogravimetric analysis diagram of the high-temperature resistant mold prepared in Example 1 of the present invention;

[0030] Figure 2 This is a diagram showing the compressive strength effect of the high-temperature resistant mold prepared in Example 1 of the present invention. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be further described below.

[0032] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and should be understood to include those approximate. For numerical ranges, the endpoint values ​​of the ranges, the endpoint values ​​of the ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0033] A method for photopolymer 3D printing of high-temperature resistant molds includes the following steps:

[0034] Step S1: Synthesize a high-temperature resistant photocurable 3D printing resin, wherein the high-temperature resistant photocurable 3D printing resin comprises the following components by weight percentage:

[0035] Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, additives 0-2%;

[0036] The filler is silica particles or alumina particles with a particle size of 50-100 nm; the additive is at least one of defoamer, polymerization inhibitor, leveling agent or dispersant.

[0037] The synthesis method of high-temperature photocurable 3D printing resin is as follows:

[0038] Ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate were stirred in a water bath at 55-65°C until completely mixed.

[0039] Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed;

[0040] Finally, add the filler and additives and continue stirring until completely mixed.

[0041] Step S2: Construct a mold model using 3D modeling software. The mold model structure includes conformal cooling water pipes. Specifically, the conformal cooling water pipes are arranged inside the mold, conforming to the mold wall, and changing with the shape of the mold's internal surface.

[0042] Step S3: The mold modeling model is sliced ​​using slicing software, and printing parameters are set to generate a slice file; the printing parameters include exposure time, layer thickness, and lifting speed.

[0043] Step S4: Import the generated slice file into the photopolymer 3D printing equipment, use the high-temperature resistant photopolymer 3D printing resin as the 3D printing material, and use photopolymer 3D printing technology to form a high-temperature resistant mold.

[0044] Step S5: If a mold with a high gloss surface is required, the surface of the formed high-temperature resistant mold can be treated by grinding and polishing, chemical plating or electroplating.

[0045] In this invention, the high-temperature photocurable 3D printing resin uses ethoxylated bisphenol A diacrylate as a prepolymer, ethoxylated trimethylolpropane triacrylate as an active diluent, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide as a photoinitiator. The photoinitiator 2,4,6-trimethylbenzoyl-diphenylphosphine oxide generates free radicals under 405nm ultraviolet light irradiation, which initiates the polymerization reaction between the multifunctional monomer ethoxylated trimethylolpropane triacrylate and the prepolymer ethoxylated bisphenol A diacrylate, forming a highly cross-linked three-dimensional structure. In this process, the acrylate groups of ethoxylated bisphenol A diacrylate form a cross-linked network through free radical polymerization. Due to the high reactivity of the acrylate groups, the photocuring rate of the prepolymer ethoxylated bisphenol A diacrylate is relatively fast, and the cured ethoxylated bisphenol A diacrylate-based material typically exhibits high hardness. Its benzene ring structure also provides intramolecular thermal stability. The multifunctional structure of ethoxylated trimethylolpropane triacrylate significantly increases the cross-linking density of the polymer, and the resulting highly cross-linked three-dimensional network structure greatly improves the material's thermal stability and mechanical properties. The filling of silica / alumina particles not only provides mechanical reinforcement but also improves the material's thermal conductivity and rigidity, further enhancing its high-temperature resistance and stability. Therefore, the synergistic effect of each component ensures excellent mechanical strength and thermal stability under high-temperature conditions, meeting the requirements of metal powder injection molding and plastic injection molding.

[0046] The method for photopolymer 3D printing of high-temperature resistant molds according to the present invention will be described in detail below through specific embodiments.

[0047] Example 1

[0048] A method for photopolymer 3D printing of high-temperature resistant molds includes the following steps:

[0049] Step S1, Synthesis of High-Temperature Photocurable 3D Printing Resin: The resin prepolymer, reactive diluent, photoinitiator, filler, and other additives are mixed and stirred evenly according to a certain ratio to obtain the high-temperature photocurable 3D printing resin. In this embodiment, 60% by mass of ethoxylated bisphenol A diacrylate and 27% by mass of ethoxylated trimethylolpropane triacrylate are weighed and stirred in a 60°C water bath until they are evenly mixed. Then, 8% by mass of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide is weighed and added to the system, and heated and stirred until evenly mixed. Finally, 5% by mass of silica particles is weighed and added to the system, and heated and stirred until evenly mixed, thereby obtaining the high-temperature photosensitive resin, which is stored away from light.

[0050] Step S2, Design and model the mold model: According to actual needs, use Solidworks modeling software to design the mold model, including the conformal cooling water pipes in its internal structure, and export the STL file of the mold model.

[0051] Step S3, Slicing Processing: Import the STL file of the mold modeling model into the photopolymer 3D printing slicing software, set the printing parameters, including layer exposure time of 8s, layer thickness of 0.05mm and lifting speed of 65mm / min, and generate the slicing file;

[0052] Step S4: Use photopolymer 3D printing technology to form a high-temperature resistant mold: Import the generated slice file into an LCD photopolymer 3D printing device for LCD photopolymer 3D printing to obtain a high-temperature resistant mold.

[0053] The high-temperature resistant mold formed by 3D printing technology in this embodiment has the following thermogravimetric analysis diagram: Figure 1 As shown in the diagram, the compressive strength effect is as follows: Figure 2 As shown. The high-temperature resistant mold of this embodiment has high-temperature resistance and compressive strength that meet the requirements of metal powder injection molding molds and plastic injection molding molds (common molds for plastic and metal powder feeding have a temperature resistance of 150-250℃ and a compressive strength of 50-200MPa), wherein the mold's compressive strength reaches 256MPa, and the thermal loss T... 5％ =386.86℃, T max =438.40℃ and T 91％ =541.62℃, the mold surface has slight layering.

[0054] Example 2

[0055] A method for photopolymer 3D printing of high-temperature resistant molds includes the following steps:

[0056] Steps S1-S4 are the same as in Example 1;

[0057] Step S5, surface chemical copper plating treatment: First, the high-temperature resistant mold formed by photopolymerization 3D printing is immersed in sodium hydroxide solution at 60°C for 10 minutes to remove oil. Then, it is placed in sulfuric acid solution at room temperature for 2 minutes to further remove impurities. After that, it is immersed in cationic surfactant at 60°C for 10 minutes. Then, it is immersed in silver ammonia solution at room temperature for 2 minutes. Finally, it is placed in copper salt plating solution for copper plating treatment.

[0058] This embodiment presents a high-temperature resistant mold manufactured using 3D printing technology. The high-temperature resistance and compressive strength meet the requirements of both metal powder injection molding molds and plastic injection molds. Specifically, the mold's compressive strength reaches 256 MPa, and its thermal loss T0 is [not specified in the original text]. 5％ =386.86℃, T max=438.40℃ and T 91％ =541.62℃. In addition, by plating copper on the surface of the high-temperature resistant mold formed by photopolymer 3D printing, a higher surface finish was achieved, and the service life of the mold was also significantly extended.

[0059] Example 3

[0060] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin while keeping other processes and parameters unchanged, Example 3 is obtained.

[0061] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0062] The composition includes 70% ethoxylated bisphenol A diacrylate, 20% ethoxylated trimethylolpropane triacrylate, 5% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 3% filler, and 2% additives.

[0063] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 260 MPa and a thermal weight loss of T0.05. 5％ =390.44℃, T max =440.52℃ and T 91％ =545.88℃.

[0064] Example 4

[0065] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin while keeping other processes and parameters unchanged, Example 4 is obtained.

[0066] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0067] The composition includes 75% ethoxylated bisphenol A diacrylate, 20% ethoxylated trimethylolpropane triacrylate, 3% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1% filler, and 1% additives.

[0068] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 266 MPa and a thermal weight loss of T0.05. 5％ =395.31℃, T max =445.83℃ and T 91％ =549.37℃.

[0069] Example 5

[0070] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin, while keeping other processes and parameters unchanged, Example 5 is obtained.

[0071] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0072] Ethoxylated bisphenol A diacrylate 60%, ethoxylated trimethylolpropane triacrylate 30%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 6%, filler 4%.

[0073] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 245 MPa and a thermal weight loss of T0.05. 5％ =365.49℃, T max =422.83℃ and T 91％ =518.84℃.

[0074] Example 6

[0075] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin, while keeping other processes and parameters unchanged, Example 6 is obtained.

[0076] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0077] Ethoxylated bisphenol A diacrylate 65%, ethoxylated trimethylolpropane triacrylate 23%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 10%, filler 1%, and additives 1%.

[0078] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 275 MPa and a thermal weight loss of T0.05. 5％ =392.83℃, T max =448.45℃ and T 91％ =553.69℃.

[0079] Example 7

[0080] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin while keeping other processes and parameters unchanged, Example 7 is obtained.

[0081] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0082] The composition includes 50% ethoxylated bisphenol A diacrylate, 35% ethoxylated trimethylolpropane triacrylate, 8% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 5% filler, and 2% additives.

[0083] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 232 MPa and a thermal weight loss of T0.05. 5％ =355.14℃, T max =417.62℃ and T 91％ =514.22℃.

[0084] Example 8

[0085] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin while keeping other processes and parameters unchanged, Example 7 is obtained.

[0086] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0087] The composition includes 80% ethoxylated bisphenol A diacrylate, 15% ethoxylated trimethylolpropane triacrylate, 3% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 1% filler, and 1% additives.

[0088] The high-temperature resistant mold produced in this embodiment using 3D printing technology has a compressive strength of 240 MPa and a thermal weight loss of T0.05. 5％ =366.45℃, T max =425.88℃ and T 91％ =522.73℃.

[0089] Comparative Example 1

[0090] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin, while keeping other processes and parameters unchanged, Comparative Example 1 is obtained.

[0091] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0092] The composition includes 20% silicone-modified polyurethane acrylate, 35% bisphenol A type epoxy resin, 25% dipropylene glycol diacrylate, 15% 1,6-hexanediol diglycidyl ether, 3.8% diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate, and 1.2% additives. Silicone-modified polyurethane acrylate and bisphenol A type epoxy resin are used as prepolymers, dipropylene glycol diacrylate and 1,6-hexanediol diglycidyl ether are used as reactive diluents, and diphenyl-(4-phenylthio)phenylsulfonium hexafluoroantimonate is used as a photoinitiator.

[0093] In this embodiment, the mold formed using 3D printing technology, employing other resin materials as prepolymers and combined with different reactive diluents and photoinitiators, only achieved a heat distortion temperature of 78°C, failing to meet the requirements for metal powder injection molding molds and plastic injection molds. The main reason is that the silicone-modified polyurethane acrylate and bisphenol A epoxy resin in the formulation did not provide sufficient crosslinking density and thermal stability. Furthermore, while the silicone-modified polyurethane acrylate imparts some elasticity to the material, it reduces heat resistance, ultimately failing to meet the requirements of high-temperature molds. This demonstrates that the selection of prepolymer and reactive diluent components directly affects the high-temperature resistance of the prepared mold.

[0094] Comparative Example 2

[0095] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin, while keeping other processes and parameters unchanged, Comparative Example 2 is obtained.

[0096] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0097] The composition comprises 50% poly(carbamate) urea acrylate, 45% ethyl 2-(tert-butylamino)methacrylate, and 5% 2,4,6-trimethylbenzoyl-diphenylphosphine oxide. Poly(carbamate) urea acrylate is used as a prepolymer, ethyl 2-(tert-butylamino)methacrylate as a reactive diluent, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide as a photoinitiator.

[0098] In this embodiment, a mold formed using 3D printing technology was produced. Other resin materials were used as prepolymers, along with different reactive diluents and photoinitiators. The temperature at which it lost 5% of its weight was 289°C. However, because the molded mold is an elastomer, its compressive strength is extremely low, failing to meet the requirements of metal powder injection molding molds and plastic injection molds. The low compressive strength of this 3D-printed mold mainly stems from the elastomeric properties of the materials. Poly(urethane) urea acrylate, as a prepolymer, has high elasticity; its flexible segments cause the material to easily deform under pressure, lacking sufficient rigidity and compressive strength. Furthermore, ethyl 2-(tert-butylamino)methacrylate, as a reactive diluent, reduced the system viscosity but also decreased the crosslinking density of the material, further weakening its mechanical strength. Although the mold exhibited good heat resistance (289°C at 5% of its weight loss), its elastomeric properties and the influence of the diluent prevented it from meeting the high compressive strength requirements of metal powder injection molding and plastic injection molds. This demonstrates that the selection of prepolymer and reactive diluent components directly affects the compressive strength of the prepared mold.

[0099] Comparative Example 3

[0100] A method for photopolymer 3D printing of high-temperature resistant molds is based on the method of Example 2. By changing the formulation of the high-temperature resistant photopolymer 3D printing resin, while keeping other processes and parameters unchanged, Comparative Example 2 is obtained.

[0101] Specifically, in this embodiment, the high-temperature photocurable 3D printing resin comprises the following components by weight:

[0102] Bisphenol A type epoxy resin 60%, ethoxytrimethylolpropane triacrylate 27%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 8%, silicon dioxide 5%.

[0103] The mold formed by 3D printing technology in this embodiment has a compressive strength of 120 MPa and a thermal loss T5% = 200.35℃. max =225.64℃ and T 91％ =282.37℃. The photocurable 3D printing resin of Comparative Example 3 differs from that of Example 2 only in its prepolymer; however, its compressive strength and high-temperature resistance are significantly lower than those of Example 2. The bisphenol A type epoxy resin exhibits lower compressive strength and high-temperature resistance compared to ethoxylated bisphenol A diacrylate. This is mainly because ethoxylated bisphenol A diacrylate forms a higher crosslinking density through free radical polymerization, giving it higher hardness, compressive strength, and heat resistance; while epoxy resin has a lower crosslinking density, resulting in lower high-temperature resistance and mechanical strength after curing compared to acrylic resins. Therefore, ethoxylated bisphenol A diacrylate exhibits superior high-temperature resistance and compressive strength.

[0104] The test results from the above embodiments show that the present invention uses specific prepolymers and reactive diluents, and through the action of photoinitiators, the polymerized product can significantly improve the high-temperature resistance and compression resistance of the mold. In contrast, the molds formed from photocurable 3D resin materials synthesized using other prepolymers and reactive diluents in the comparative examples exhibit significantly lower high-temperature resistance and compression resistance than those formed from the photocurable 3D resin materials of the present invention.

[0105] The embodiments of the present invention have been described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A method for photopolymerization 3D printing of high-temperature resistant molds, characterized in that, Includes the following steps: Step S1: Synthesize a high-temperature resistant photocurable 3D printing resin, wherein the high-temperature resistant photocurable 3D printing resin comprises the following components by weight percentage: Ethoxylated bisphenol A diacrylate 50-80%, ethoxylated trimethylolpropane triacrylate 15-35%, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide 3-10%, filler 1-5%, additives 0-2%; the filler is silica particles or alumina particles with a particle size of 50-100nm. Step S2: Construct a mold model using 3D modeling software. The mold model structure includes conformal cooling water pipes. Step S3: Use slicing software to slice the mold model and set printing parameters to generate a slice file; Step S4: Import the generated slice file into the photopolymer 3D printing equipment, use the high-temperature resistant photopolymer 3D printing resin as the 3D printing material, and use LCD photopolymer 3D printing technology to form a high-temperature resistant mold.

2. The method for photopolymerization 3D printing of high-temperature resistant molds according to claim 1, characterized in that, In step S1, the additive is at least one of defoamer, polymerization inhibitor, leveling agent or dispersant.

3. The method for photopolymerization 3D printing of high-temperature resistant molds according to claim 1, characterized in that, The synthesis method of the high-temperature photocurable 3D printing resin in step S1 is as follows: Ethoxylated bisphenol A diacrylate and ethoxylated trimethylolpropane triacrylate were stirred in a water bath at 55-65°C until completely mixed. Then add 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and stir in a water bath at 55-65°C in the dark until completely mixed; Finally, add the filler and additives and continue stirring until completely mixed.

4. The method for photopolymerization 3D printing of high-temperature resistant molds according to claim 1, characterized in that, In step S2, the conformal cooling water pipes are arranged inside the mold, fitting against the mold wall, and changing with the shape of the mold's internal surface.

5. The method for photopolymerization 3D printing of high-temperature resistant molds according to claim 1, characterized in that, In step S3, the printing parameters include exposure time, layer thickness, and lift-up speed.

6. The method for photopolymerization 3D printing of high-temperature resistant molds according to any one of claims 1-5, characterized in that, It also includes step S5, which involves treating the surface of the formed high-temperature resistant mold by grinding, polishing, chemical plating, or electroplating.

7. The method for photopolymerization 3D printing of high-temperature resistant molds according to claim 6, characterized in that, Chemical copper plating is performed on the surface of the formed high-temperature resistant mold.

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