Light absorption film, shooting module and electronic equipment

Abstract

The invention relates to a light absorption film, a shooting module and electronic equipment. The light absorption film comprises a first titanium film layer and two anti-reflection film layers, the two anti-reflection film layers are arranged on the two sides of the first titanium film layer respectively, each anti-reflection film layer comprises a titanium dioxide layer and a silicon dioxide layer, and the silicon dioxide layer is arranged on the side, opposite to the first titanium film layer, of the titanium dioxide layer. The titanium dioxide layer and the silicon dioxide layer in the anti-reflection film layer are attached to each other. The light absorption film can effectively absorb light rays and reduce reflection of the light rays on the light absorption film, so that stray light and interference light in a light path are reduced, the phenomena of glare, halo and the like in light path imaging are reduced, and the imaging quality of the light rays passing through the light absorption film is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a light-absorbing film, a shooting module and an electronic equipment. Background Art

[0002] Smartphones, tablet computers, e-readers and other electronic devices may be equipped with a camera module to realize the image acquisition function. The camera module usually includes a lens and an image sensor. The light collected by the lens can be projected to the image sensor for imaging. A shading element is usually required in the camera module to block stray light. However, in the camera module in the related art, the shading effect of the shading element is poor, which affects the imaging quality of the camera module. Summary of the invention

[0003] The embodiments of the present application provide a light-absorbing film, a shooting module and an electronic device to solve the problem of poor light-shielding effect of a light-shielding element.

[0004] A light-absorbing film, comprising:

[0005] a first titanium film layer; and

[0006] Two anti-reflection film layers, the two anti-reflection film layers are respectively arranged on both sides of the first titanium film layer, the anti-reflection film layers include a titanium dioxide layer and a silicon dioxide layer, the silicon dioxide layer is arranged on the side of the titanium dioxide layer facing away from the first titanium film layer, and the titanium dioxide layer and the silicon dioxide layer in the anti-reflection film layers are attached to each other.

[0007] The above-mentioned light-absorbing film is provided with a first titanium film layer to play a major light-absorbing role, which can effectively reduce the transmittance and reflectivity of the light-absorbing film. Anti-reflection film layers are respectively provided on both sides of the first titanium film layer. The titanium dioxide layer and silicon dioxide layer adjacently provided in the anti-reflection film layer can effectively reduce the reflectivity of the light-absorbing film. Therefore, when the light-absorbing film is used as a light-shielding element in the light path, it can effectively absorb light and reduce the reflection of light on the light-absorbing film, thereby reducing stray light and interference light in the light path, reducing glare, halo and other phenomena in the light path imaging, and improving the imaging quality of light passing through the light-absorbing film. In addition, the first titanium film layer is used in conjunction with the anti-reflection film layer, which is conducive to reducing the thickness of the light-absorbing film while improving the light-shielding effect. When the light-absorbing film is adhered to the optical element through optical glue, it is conducive to avoiding the phenomenon that the optical glue has too large a height difference in the light-absorbing film and non-light-absorbing film regions, thereby helping to avoid the problems of bubbles or uneven distribution of the optical glue and affecting the imaging quality.

[0008] A shooting module comprises a conducting element, an image sensor and the light absorbing film as described above, wherein the conducting element is used to conduct incident light to the image sensor, and the light absorbing film is arranged on the conducting element.

[0009] An electronic device comprises the shooting module as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0011] Figure 1 Schematic diagram of the structure of electronic equipment in some embodiments.

[0012] Figure 2 Schematic diagram of the structure of the shooting module in some embodiments.

[0013] Figure 3 Schematic diagram of the structure of the shooting module in some other embodiments.

[0014] Figure 4 Schematic diagram of the structure in which a light-absorbing film is disposed between the first sub-prism and the second sub-prism in some embodiments.

[0015] Figure 5 Schematic diagram of the structure in which the light-absorbing film presents a hollow structure in some embodiments.

[0016] Figure 6 Schematic cross-sectional view of the film structure of the light-absorbing film in some embodiments.

[0017] Figure 7 Graph showing the reflectivity of light absorbing films in some embodiments.

[0018] Figure 8 OD value curve of the light-absorbing film in some embodiments.

[0019] Fig. 9 Schematic diagram of the structure of other components of the electronic device in some embodiments.

[0020] 10. Electronic device; 11. Shooting module; 111. Camera lens; 1111. Lens; 112. Image sensor; 113. Transmitting element; 1131. First reflecting surface; 1132. Second reflecting surface; 1133. Third reflecting surface; 1134. Fourth reflecting surface; 1135. Fifth reflecting surface; 1136. Sixth reflecting surface; 1137. Seventh reflecting surface; 1138. First sub-prism; 1139. Second sub-prism; 114. Light-absorbing film; 1141. Anti-reflection film layer; 1142. First titanium film layer; 1143. Second titanium film layer; 1144. First protective film layer; 1145. Second protective film layer; 1146. Titanium dioxide layer; 1147. Silicon dioxide layer; 12. Shell; 121. Light inlet. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0022] As used herein, "electronic device" refers to a device that can receive and / or send communication signals, including but not limited to a device that is connected via any one or more of the following connection methods:

[0023] (1) Connection via wired lines, such as Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, and direct cable connection;

[0024] (2) Via wireless interfaces, such as cellular networks, wireless local area networks (WLAN), digital television networks such as DVB-H networks, satellite networks, and AM-FM broadcast transmitters.

[0025] An electronic device configured to communicate via a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0026] (1) Satellite phone or cellular phone;

[0027] (2) Personal Communications System (PCS) terminals that can combine cellular radio telephones with data processing, fax, and data communications capabilities;

[0028] (3) Radiotelephone, pager, Internet / intranet access, Web browser, notepad, calendar, Personal Digital Assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0029] (4) conventional laptop and / or palmtop receivers;

[0030] (5) Conventional laptop and / or palmtop radio telephone transceivers, etc.

[0031] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of the structure of the electronic device 10 in some embodiments, Figure 2 Schematic diagram of the structure of the shooting module 11 in some embodiments. The electronic device 10 provided in this application includes but is not limited to a smart phone, a tablet computer, an e-reader, a wearable device and the like. In the embodiments of this application, the electronic device 10 is exemplified by taking a smart phone as an example.

[0032] In some embodiments, the electronic device 10 includes a housing 12 and a shooting module 11, and the shooting module 11 is accommodated in the housing 12. The shooting module 11 may include a lens 111 and an image sensor 112. The lens 111 is used to collect light. The lens 111 may include multiple lenses 1111 with optical power. The cooperation of the multiple lenses 1111 can correct aberrations while collecting light, thereby improving the imaging quality of the shooting module 11. The image sensor 112 includes but is not limited to a charge coupled device (CCD) or a complementary metal oxide semiconductor device (CMOS Sensor). The light from the lens 111 can be projected onto the image sensor 112 for imaging, so that the electronic device 10 can realize the image acquisition function. In some embodiments, a light inlet 121 that penetrates the housing 12 is opened on the housing 12. When the shooting module 11 is accommodated in the housing 12, the light incident surface of the lens 111 corresponds to the light inlet 121, so as to collect light.

[0033] Furthermore, in some embodiments, the camera module 11 further includes a conductive element 113, the conductive element 113 has at least one reflective surface, the light from the lens 111 can be projected onto the reflective surface of the conductive element 113, and the conductive element 113 can transmit at least part of the light to the image sensor 112 through reflection from the reflective surface. Figure 2As shown, in some embodiments, the lens 111 and the image sensor 112 are disposed on the same side of the conductive element 113, and the conductive element 113 includes a first reflective surface 1131, a second reflective surface 1132, and a third reflective surface 1133. The first reflective surface 1131 is disposed opposite to the light-emitting side of the lens 111, the second reflective surface 1132 is disposed corresponding to the photosensitive surface of the image sensor 112, and the third reflective surface 1133 is disposed on the side of the conductive element 113 facing the lens 111 and the image sensor 112. The lens 111 can project at least part of the collected light onto the first reflective surface 1131, the first reflective surface 1131 can reflect at least part of the light projected onto the first reflective surface 1131 onto the third reflective surface 1133, the third reflective surface 1133 can reflect at least part of the light projected onto the third reflective surface 1133 onto the second reflective surface 1132, and the second reflective surface 1132 can reflect at least part of the light projected onto the second reflective surface 1132 onto the image sensor 112. Thus, the conductive element 113 can guide at least part of the light from the lens 111 to form an image on the image sensor 112 .

[0034] In the above-mentioned shooting module 11, the transmission element 113 is provided with a first reflection surface 1131, a second reflection surface 1132 and a third reflection surface 1133, which can guide the light from the lens 111 to the image sensor 112 located on the same side as the lens 111, so that the lens 111 and the image sensor 112 can be arranged on the same side of the transmission element 113, so that the lens 111 and the image sensor 112 at least partially overlap in the optical axis direction of the lens 111, which is conducive to reducing the size of the shooting module 11 in the thickness direction of the electronic device 10, reducing the occupied space of the lens 111 and the image sensor 112 in the electronic device 10, and also enabling the focusing function to be realized by moving the transmission element 113, thereby reducing the focusing stroke of the electronic device 10. In addition, the transmission element 113 is set to reflect the light three times, which can extend the propagation path of the light at the rear end of the lens 111, so that the transmission element 113 can adapt to the telephoto lens 111, and compress the occupied space of the shooting module 11 while obtaining sufficient optical magnification.

[0035] The specific setting of the lens 111 in the shooting module 11 is not limited. In some embodiments, the lens 111 includes four lenses 1111 spaced apart from each other in sequence along the optical axis. The first lens 1111 of the lens 111, that is, the lens 1111 closest to the light inlet 121, can be made of glass and processed by grinding, mainly for correcting aberrations and eliminating temperature drift. The other three lenses 1111 of the lens 111 can be made of plastic and processed by injection molding, which is mainly used to correct aberrations. It should be understood that this embodiment only exemplarily lists the materials and processing methods of the above-mentioned lenses 1111, but is not limited thereto. Those skilled in the art can flexibly select according to actual needs.

[0036] In some embodiments, the third reflective surface 1133 is arranged perpendicular to the optical axis of the lens 111, and the first reflective surface 1131 and the second reflective surface 1132 are both at an angle of 30 degrees to the third reflective surface 1133, which can reasonably configure the propagation path of the light on the conductive element 113, so that the incident angle of the light on the third reflective surface 1133 after being reflected by the first reflective surface 1131 meets the requirement of the critical angle of total reflection, so that at least part of the light can be totally reflected on the third reflective surface 1133 and hit the second reflective surface 1132, which is beneficial to improving the utilization efficiency of the light.

[0037] Please refer to Figure 2 As shown, when the conductive element 113 has a first reflective surface 1131, a second reflective surface 1132 and a third reflective surface 1133, the conductive element 113 can be a prism, and the angle between the first reflective surface 1131 and the second reflective surface 1132 and the third reflective surface 1133 is not limited to 30°, but can be any angle less than 45°, as long as the conductive element 113 can guide at least the light from the lens 111 to the image sensor 112.

[0038] Figure 2 The conductive element 113 shown can reflect at least part of the light three times and then emit it to the image sensor 112. The conductive element 113 is suitable for a lens 111 with a magnification of 2x-4x (equivalent focal length is approximately 40mm-90mm). When the lens 111 of the shooting module 11 has a higher magnification, the conductive element 113 can also deflect the light more times to further extend the propagation path of the light in the conductive element 113, so as to adapt to the telephoto design of the lens 111.

[0039] For example, refer to Figure 3As shown, in other embodiments, the conductive element 113 includes a fourth reflective surface 1134 and a fifth reflective surface 1135 which are arranged opposite to each other, and the conductive element 113 also includes a sixth reflective surface 1136 and a seventh reflective surface 1137 which are arranged opposite to each other. The fourth reflective surface 1134 is arranged opposite to the light-emitting side of the lens 111, and the fifth reflective surface 1135 is arranged opposite to the photosensitive surface of the image sensor 112. The fourth reflective surface 1134 can reflect at least part of the light emitted by the lens 111 onto the fourth reflective surface 1134 to the sixth reflective surface 1136, the sixth reflective surface 1136 can reflect at least part of the light emitted onto the sixth reflective surface 1136 to the seventh reflective surface 1137, the seventh reflective surface 1137 can reflect at least part of the light emitted onto the seventh reflective surface 1137 to the fifth reflective surface 1135, and the fifth reflective surface 1135 can reflect at least part of the light emitted onto the fifth reflective surface 1135 to the image sensor 112.

[0040] exist Figure 8 In the illustrated embodiment, the conductive element 113 may be a quadrangular prism, the sixth reflective surface 1136 and the seventh reflective surface 1137 are parallel to each other and perpendicular to the optical axis of the lens 111, the fourth reflective surface 1134 and the fifth reflective surface 1135 are parallel to each other, the angle between the fourth reflective surface 1134 and the sixth reflective surface 1136 is 30°, and the angle between the fifth reflective surface 1135 and the seventh reflective surface 1137 is 30°. Of course, the angle setting of the conductive element 113 is not limited thereto, as long as it can reflect at least part of the light from the lens 111 four times and then guide it to the image sensor 112.

[0041] Figure 8 In the illustrated embodiment, the conductive element 113 is capable of reflecting at least part of the light from the lens 111 four times and then projecting it onto the image sensor 112, thereby extending the propagation path of the light in the conductive element 113, which is conducive to adapting to a lens 111 with a higher magnification, for example, Figure 8 The conductive element 113 in the illustrated embodiment may be used for a lens 111 having a magnification of 3x to 10x (equivalent focal length is approximately 65mm to 200mm).

[0042] Combination Figure 3 , Figure 4 and Figure 5As shown, in one embodiment, the conducting element 113 takes a prism as an example, and the conducting element 113 may include a single integrated or a combination of multiple sub-prisms. When the conducting element 113 includes multiple sub-prisms, it is beneficial to set a light-absorbing film 114 as a light-shielding element at the junction of the multiple sub-prisms. The light-absorbing film 114 may be generally hollow structured to define the light aperture of the shooting module 11. The light-absorbing film 114 can absorb stray light, thereby reducing or avoiding glare, halo and other phenomena in the imaging of the shooting module 11, and improving the imaging quality of the shooting module 11. For example, in some embodiments, the conducting element 113 may include a first sub-prism 1138 and a second sub-prism 1139, and the shooting module 11 further includes a light-absorbing film 114 disposed between the first sub-prism 1138 and the second sub-prism 1139. The first sub-prism 1138 and the second sub-prism 1139 may be bonded to each other by optical glue, and the light absorption film 114 may be disposed on one of the first sub-prism 1138 and the second sub-prism 1139 , or disposed on the optical glue between the first sub-prism 1138 and the second sub-prism 1139 .

[0043] refer to Figure 5 As shown, in some embodiments, the light absorbing film 114 is roughly in the shape of a hollow frame. When the light is transmitted from the first sub-prism 1138 to the second sub-prism 1139, the light can pass through the hollow area of ​​the light absorbing film 114, and the light incident on the light absorbing film 114 will be absorbed by the light absorbing film 114, thereby reducing the stray light in the shooting module 11 and improving the imaging quality of the shooting module 11.

[0044] Furthermore, combined with Figure 2 and Figure 6 As shown, in some embodiments, the light absorbing film 114 includes a first titanium film layer 1142 and two anti-reflection film layers 1141. The two anti-reflection film layers 1141 are respectively arranged on both sides of the first titanium film layer 1142. Each anti-reflection film layer 1141 includes a titanium dioxide layer 1146 and a silicon dioxide layer 1147. The titanium dioxide layer 1146 and the silicon dioxide layer 1147 in each anti-reflection film layer 1141 are adjacent and attached to each other.

[0045] The above-mentioned light-absorbing film 114 is provided with a first titanium film layer 1142 which plays a major light-absorbing role and can effectively reduce the transmittance and reflectivity of the light-absorbing film 114. Anti-reflection film layers 1141 are respectively provided on both sides of the first titanium film layer 1142. The titanium dioxide layer 1146 and the silicon dioxide layer 1147 adjacently provided in the anti-reflection film layer 1141 can effectively reduce the reflectivity of the light-absorbing film 114. Therefore, when the light-absorbing film 114 is used as a shading element in the light path, it can effectively absorb light and reduce the reflection of light on the light-absorbing film 114, thereby reducing stray light and interference light in the light path, reducing glare, halo and other phenomena in the light path imaging, and improving the imaging quality of the light passing through the light-absorbing film 114. In addition, the first titanium film layer 1142 is used in conjunction with the anti-reflection film layer 1141. While improving the shading effect, it is also helpful to significantly reduce the thickness of the light-absorbing film 114 compared to the traditional use of an ink layer as a shading element. When the light-absorbing film 114 is adhered to the first sub-prism 1138 and the second sub-prism 1139 through optical glue, it is helpful to avoid the phenomenon of excessive height difference between the light-absorbing film 114 and the non-light-absorbing film 114 area of ​​the optical glue, thereby helping to avoid problems such as bubbles or uneven distribution of the optical glue that affect the imaging quality.

[0046] Table 1 below shows the layer structure of the light absorbing film 114 and the thickness of each layer structure in some embodiments. When the light absorbing film 114 is disposed between the first sub-prism 1138 and the second sub-prism 1139, the media on both sides of the light absorbing film 114 can be the first sub-prism 1138 and the second sub-prism 1139 respectively. The light from the lens 111 is incident on the first sub-prism 1138, and is incident on the second sub-prism 1139 through the light absorbing film 114 from between the first sub-prism 1138 and the second sub-prism 1139. It can be seen from Table 1 that the total thickness of the light absorbing film 114 is 774.48 nm, which is much smaller than the thickness of the ink layer as a light shielding element, and can effectively reduce the height difference between the optical glue between the first sub-prism 1138 and the second sub-prism 1139 in the light absorbing film 114 and the non-light absorbing film 114 area, thereby avoiding the situation where the optical glue generates bubbles or has uneven thickness and affects the imaging quality.

[0047] Table 1

[0048]

[0049]

[0050] Combination Figure 6As shown in Table 1, in some embodiments, the light absorbing film 114 further includes two first protective film layers 1144, which are respectively arranged on both sides of the first titanium film layer 1142, and are both located between the first titanium film layer 1142 and the anti-reflection film layer 1141. The two first protective film layers 1144 can protect the first titanium film layer 1142, prevent the first titanium film layer 1142 from being oxidized and affecting the reflectivity, thereby improving the performance stability and service life of the light absorbing film 114. In some embodiments, the material of the first protective film layer 1144 can be metal oxide, which has good anti-oxidation properties and can effectively prevent the first titanium film layer 1142 from being oxidized. For example, in some embodiments, the material of the first protective film layer 1144 can be silicon dioxide, which can not only provide effective protection for the first titanium film layer 1142, but also can be closely combined with the first titanium film layer 1142, thereby improving the structural stability and service life of the light absorbing film 114.

[0051] In some embodiments, the light absorbing film 114 further includes two second titanium film layers 1143, which are respectively disposed on both sides of the first titanium film layer 1142 and are both disposed between the first protective film layer 1144 and the anti-reflection film layer 1141. The second titanium film layer 1143 is arranged to cooperate with the first titanium film layer 1142 to effectively improve the reflectivity and transmittance of the light absorbing film 114, and the second titanium film layer 1143 and the first protective film layer 1144 are adjacent to and attached to each other, so that the second titanium film layer 1143 cooperates with the silicon dioxide of the first protective film layer 1144, which can effectively reduce the reflectivity of the light absorbing film 114, thereby effectively reducing the stray light in the shooting module 11.

[0052] In some embodiments, the thickness of the second titanium film layer 1143 is less than that of the first titanium film layer 1142, so that the second titanium film layer 1143 can effectively reduce the reflectivity of the light-absorbing film 114 while also reducing the thickness of the light-absorbing film 114, which is beneficial to reducing the space occupied by the shooting module 11, and further avoiding the risk of bubbles forming in the optical glue between the first sub-prism 1138 and the second sub-prism 1139 due to the height difference, thereby improving the imaging quality of the shooting module 11.

[0053] In some embodiments, the light absorbing film 114 further includes two second protective film layers 1145, which are respectively disposed on both sides of the first titanium film layer 1142 and are both disposed between the anti-reflection film layer 1141 and the second titanium film layer 1143. The material of the second protective film layer 1145 can also be a metal oxide, such as silicon dioxide, and the second protective film layer 1145 is adjacent to and attached to the titanium dioxide layer 1146 and the second titanium film layer 1143. The second protective film layer 1145 can provide protection for the second titanium film layer 1143, prevent the second titanium film layer 1143 from being oxidized, and is conducive to improving the light shielding effect, performance stability and service life of the light absorbing film 114. At the same time, the design of the silicon dioxide of the second protective film layer 1145 and the titanium dioxide layer 1146 in the anti-reflection film layer 1141 fitting each other enables the titanium dioxide layer 1146 to cooperate with the second protective film layer 1145 to further enhance the anti-reflection effect of the light-absorbing film 114, which is beneficial to reduce stray light in the shooting module 11 and improve imaging quality.

[0054] Furthermore, in some embodiments, the thickness of the silicon dioxide layer 1147 is greater than the thickness of the first protective film layer 1144, and the thickness of the first protective film layer 1144 is greater than the thickness of the second protective film layer 1145. Thus, the first protective film layer 1144 has sufficient thickness to form a good match with the first titanium film layer 1142 and the second titanium film layer 1143, thereby effectively reducing the reflectivity and transmittance of the light absorbing film 114 and improving the light shielding effect. The larger thickness of the first protective film layer 1144 can also make the light reasonably transition between the first titanium film layer 1142 and the second titanium film layer 1143, which is conducive to improving the stability of the reflectivity and transmittance of the light absorbing film 114 to light of different wavelengths, thereby improving the performance stability of the light absorbing film 114 to light of different spectra. While the second protective film layer 1145 effectively protects the second titanium film layer 1143, the thickness will not be too large, which is conducive to reducing the thickness of the light absorbing film 114. In addition, the silicon dioxide layer 1147, as the outermost structure of the light-absorbing film 114, has a sufficient thickness to protect the various layer structures within the light-absorbing film 114 and improve the structural strength of the light-absorbing film 114. At the same time, it can also make the light transition reasonably in the silicon dioxide layer 1147, which is beneficial to improving the stability of the reflectivity and transmittance of the light-absorbing film 114 to light of different wavelengths, thereby improving the performance stability of the light-absorbing film 114 to light of different spectra.

[0055] In some embodiments, the thickness of the first titanium film layer 1142 is greater than or equal to 100 nm and less than or equal to 200 nm, for example, it can be 150 nm. The first titanium film layer 1142 has sufficient thickness to absorb light, thereby improving the light absorption capacity of the light absorption film 114, so that the light absorption film 114 can effectively absorb stray light and improve the imaging quality of the camera module 11. In some embodiments, the thickness of the silicon dioxide layer 1147 is greater than or equal to 50 nm and less than or equal to 200 nm, for example, it can be 177.71 nm, which is conducive to improving the structural strength of the light absorption film 114 and the performance stability of the light absorption film 114 to different spectral lights. When the material of the first protective film layer 1144 and the second protective film layer 1145 is the silicon dioxide layer 1147, the thickness of the first protective film layer 1144 and the second protective film layer 1145 can be greater than or equal to 12nm and less than or equal to 200nm. In some embodiments, the thickness of the titanium dioxide layer 1146 is greater than or equal to 6nm and less than or equal to 150nm. The specific design can be based on the anti-reflection effect and structural strength of the light-absorbing film 114, which will not be repeated here.

[0056] In some embodiments, the refractive index of the first sub-prism 1138 and the second sub-prism 1139 of the conductive element 113 is greater than or equal to 1.5 and less than or equal to 2. The reasonable configuration of the refractive index of the conductive element 113 can form a good match with the light absorbing film 114. By reasonably configuring the refractive index difference between the conductive element 113 and the light absorbing film 114, it is also helpful to reduce the reflectivity and transmittance of the light absorbing film 114 to the light emitted from the conductive element 113 to the light absorbing film 114. In Tables 1 and Figure 6 In the corresponding embodiment, the refractive index of the conductive element 113 may be 1.62, and the material of the conductive element 113 may be H-BAF6 glass.

[0057] Combination Figure 6 , Figure 7 and Figure 8 As shown, Figure 7 : is a reflectivity curve diagram of the light absorbing film 114 in some embodiments, where the abscissa is the wavelength and the ordinate is the reflectivity. Figure 8 FIG. 1 is a graph showing the optical density value of the light absorbing film 114 in some embodiments, wherein the horizontal axis is the wavelength and the vertical axis is the OD value. Figure 7 and Figure 8It can be known that the maximum reflectivity of the light absorbing film 114 to the light with a wavelength of 400nm-700nm is 0.14% (at 400nm), and the average reflectivity is 0.05%. The reflectivity of the light absorbing film 114 to the light is low enough to effectively absorb the light and reduce the reflection of the light on the light absorbing film 114, thereby effectively reducing the stray light component in the shooting module 11 and improving the imaging quality. At the same time, the maximum OD value of the light absorbing film 114 to the light with a wavelength of 400nm-700nm is 4.4 (at 414nm), and the average OD value is 4.3. The light absorbing film 114 has a sufficiently low light transmittance and can effectively absorb the light, thereby effectively reducing the stray light in the shooting module 11, reducing the risk of glare and halo, and improving the imaging quality.

[0058] refer to Fig. 9 , Fig. 9 The electronic device 10 is a schematic diagram of the structure of the electronic device 10 provided in the embodiment of the present application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509. Those skilled in the art will understand that Fig. 9 The structure of the electronic device 10 shown in the figure does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or less components than those shown in the figure, or combine certain components, or arrange the components differently.

[0059] The radio frequency circuit 501 can be used to send and receive information, or receive and send signals during a call. In particular, after receiving the downlink information of the base station, it is handed over to one or more processors 508 for processing; in addition, the data related to the uplink is sent to the base station. Usually, the radio frequency circuit 501 includes but is not limited to an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, etc. In addition, the radio frequency circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to the global system for mobile communications (GSM), the general packet radio service (GPRS), the code division multiple access (CDMA), the wideband code division multiple access (WCDMA), the long term evolution (LTE), email, the short message service (SMS), etc.

[0060] The memory 502 can be used to store applications and data. The applications stored in the memory 502 contain executable codes. The applications can be composed of various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the electronic device 10 (such as audio data, a phone book, etc.), etc. In addition, the memory 502 can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other volatile solid-state storage devices. Accordingly, the memory 502 can also include a memory controller to provide the processor 508 and the input unit 503 with access to the memory 502.

[0061] The input unit 503 can be used to receive input digital, character information or user feature information (such as fingerprints), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control. Specifically, in a specific embodiment, the input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display screen or a touch pad, can collect user touch operations on or near it (such as operations performed by users using fingers, styluses, or any other suitable objects or accessories on or near the touch-sensitive surface), and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch orientation, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into touch point coordinates, and then sends it to the processor 508, and can receive and execute commands sent by the processor 508.

[0062] The display unit 504 can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device 10, which can be composed of graphics, text, icons, videos and any combination thereof. The display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like. Furthermore, the touch-sensitive surface may cover the display panel, and when the touch-sensitive surface detects a touch operation on or near it, it is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in Fig. 9 In the embodiment, the touch sensitive surface and the display panel are used as two independent components to implement input and output functions, but in some embodiments, the touch sensitive surface and the display panel can be integrated to implement input and output functions. It can be understood that the display screen 110 can include an input unit 503 and a display unit 504.

[0063] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel according to the brightness of the ambient light, and the proximity sensor may turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when stationary. It can be used for applications that identify the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc.; as for other sensors that the electronic device 10 can also be configured with, such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, etc., they will not be repeated here.

[0064] The audio circuit 506 can provide an audio interface between the user and the electronic device 10 through a speaker and a microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit it to the speaker, and convert it into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is output to the processor 508 for processing, and then sent to another electronic device 10 through the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earphone socket to provide communication between an external earphone and the electronic device 10.

[0065] Wireless Fidelity (WiFi) is a short-range wireless transmission technology. The electronic device 10 can help users send and receive emails, browse web pages, and access streaming media through the wireless fidelity module 507, which provides users with wireless broadband Internet access. Fig. 9 The wireless fidelity module 507 is shown, but it is understandable that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the essence of the invention.

[0066] The processor 508 is the control center of the electronic device 10. It uses various interfaces and lines to connect various parts of the entire electronic device 10. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it executes various functions of the electronic device 10 and processes data, thereby monitoring the electronic device 10 as a whole. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 508.

[0067] The electronic device 10 also includes a power supply 509 for supplying power to various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so that the power management system can manage charging, discharging, and power consumption. The power supply 509 can also include one or more DC or AC power supplies, recharging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0068] although Fig. 9 Not shown, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or can be arbitrarily combined and implemented as the same or several entities. The specific implementation of the above modules can refer to the previous method embodiment, which will not be described in detail here.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A light-absorbing film, It is characterized in that The light absorbing film comprises: a first titanium film layer; and Two anti-reflection film layers, the two anti-reflection film layers are respectively arranged on both sides of the first titanium film layer, the anti-reflection film layers include a titanium dioxide layer and a silicon dioxide layer, the silicon dioxide layer is arranged on the side of the titanium dioxide layer facing away from the first titanium film layer, and the titanium dioxide layer and the silicon dioxide layer in the anti-reflection film layers are attached to each other.

2. The light-absorbing film according to claim 1, It is characterized in that The light absorption film further includes two first protective film layers, which are respectively arranged on both sides of the first titanium film layer and between the first titanium film layer and the anti-reflection film layer.

3. The light-absorbing film according to claim 2, It is characterized in that The material of the first protective film layer includes silicon dioxide.

4. The light-absorbing film according to claim 2, It is characterized in that The light absorption film further comprises two second titanium film layers, and the two second titanium film layers are respectively arranged between the two first protection film layers and the two anti-reflection film layers.

5. The light-absorbing film according to claim 4, It is characterized in that The thickness of the second titanium film layer is smaller than the thickness of the first titanium film layer.

6. The light-absorbing film according to claim 5, It is characterized in that The light absorbing film also includes two second protective film layers, which are respectively arranged between the two anti-reflection film layers and the two second titanium film layers. The material of the second protective film layer includes silicon dioxide, and the second protective film layer is attached to the titanium dioxide layer and the second titanium film layer.

7. The light-absorbing film according to claim 1, It is characterized in that The thickness of the first titanium film layer is 100nm-200nm, the thickness of the silicon dioxide layer is 50nm-200nm, and the thickness of the titanium dioxide layer is 6nm-150nm.

8. The light-absorbing film according to claim 1, It is characterized in that The light-absorbing film also includes two first protective film layers, two second titanium film layers and two second protective film layers, wherein one of the anti-reflection film layers, one of the second protective film layers, one of the second titanium film layers, one of the first protective film layers, the first titanium film layer, another first protective film layer, another second titanium film layer, another second protective film layer and another anti-reflection film layer are stacked in sequence, and the material of the first protective film layer includes silicon dioxide, and the material of the second protective film layer includes silicon dioxide.

9. The light-absorbing film according to claim 8, It is characterized in that The thickness of the silicon dioxide layer is greater than the thickness of the first protective film layer, and the thickness of the first protective film layer is greater than the thickness of the second protective film layer.

10. A shooting module, It is characterized in that It comprises a conducting element, an image sensor and the light absorbing film as claimed in any one of claims 1 to 9, wherein the conducting element is used to conduct incident light to the image sensor, and the light absorbing film is arranged on the conducting element.

11. The shooting module according to claim 10, It is characterized in that The shooting module also includes a lens for collecting light, and the conducting element includes a first sub-prism and a second sub-prism, the first sub-prism is configured to be able to conduct light from the lens to the second sub-prism, and the second sub-prism is configured to be able to conduct light to the image sensor, and the light-absorbing film is arranged at the junction of the first sub-prism and the second sub-prism.

12. The shooting module according to claim 10, It is characterized in that The refractive index of the conductive element is 1.5-2.

13. The shooting module according to claim 10, It is characterized in that The light-absorbing film is generally in a hollow structure, and defines a light aperture of the shooting module.

14. An electronic device, It is characterized in that Comprising a shooting module as described in any one of claims 10-13.

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