Dimming panel, preparation method and dimming structure

Abstract

The embodiment of the invention provides a dimming panel, a preparation method and a dimming structure, relates to the technical field of dimming, and aims to improve the preparation speed of the dimming panel. The preparation method of the dimming panel comprises the following steps: preparing a dimming panel mother board; and cutting the dimming panel mother board to form an initial dimming panel, and cutting the dimming panel mother board to form an initial dimming panel. The second transition plate is cut along a first cutting line to form a second substrate, the second substrate exposes a first area of the first transition plate, the first area forms a first binding area, and the dye liquid crystal layer is located between the first transition plate and the second substrate. Forming first edge sealing glue along the first cutting line; the first edge sealing adhesive comprises a first sub-part, and the first sub-part is located between the first transition plate and the second substrate and is arranged along the edge, close to the first binding area, of the second substrate. The dimming panel is used for adjusting the light transmittance.

Description

Technical Field

[0001] The present disclosure relates to the field of dimming technology, and in particular to a dimming panel and a preparation method and a dimming structure. Background Art

[0002] Dimming panels have been widely used in residential buildings, rail transit vehicles, automobiles, and agricultural greenhouses due to their privacy protection, projection, environmental protection, and sound insulation advantages. Summary of the invention

[0003] On the one hand, a method for preparing a dimming panel is provided. The preparation method includes preparing a dimming panel motherboard, the dimming panel motherboard includes a first substrate motherboard, a second substrate motherboard, a dye liquid crystal layer, a plurality of spacers, and a sealant; the first substrate motherboard and the second substrate motherboard are arranged oppositely; the dye liquid crystal layer is located between the first substrate motherboard and the second substrate motherboard; a plurality of spacers are located between the first substrate motherboard and the second substrate motherboard, and the sealant is located between the first substrate motherboard and the second substrate motherboard and surrounds the dye liquid crystal layer. The dimming panel motherboard is cut to form an initial dimming panel, and the dimming panel motherboard is cut to form an initial dimming panel. The initial dimming panel includes a first transition plate and a second transition plate, the orthographic projection of the second transition plate on a reference surface coincides with the orthographic projection of the first transition plate on the reference surface, and at least part of the side wall of the first transition plate is flush with at least part of the side wall of the dye liquid crystal layer; the reference surface is parallel to the surface of the first substrate motherboard close to the liquid crystal layer. The second transition plate is cut along the first cutting line to form a second substrate, the second substrate exposes the first area of ​​the first transition plate, and the first area forms a first binding area; the dye liquid crystal layer is located between the first transition plate and the second substrate. A first edge sealing glue is formed along the first cutting line; the first edge sealing glue includes a first sub-portion, the first sub-portion is located between the first transition plate and the second substrate, and is arranged along the edge of the second substrate close to the first binding area.

[0004] In the above preparation method, the size and shape of the frame sealant in the dimming panel motherboard are consistent. In the process of forming the frame sealant, the time for the coating device to form the frame sealant is consistent, and there is no need to frequently switch the parameters of the frame sealant in the coating device and reduce the speed of the production line. When any specification of dimming panels is produced again, the dimming panel motherboards in the warehouse can be reused, which can reduce the inventory of the warehouse, that is, reduce the inventory cycle.

[0005] In some embodiments, the orthographic projection of the first cutting line on the reference plane is located in the orthographic projection of the frame sealing glue on the reference plane.

[0006] In some embodiments, a portion of the frame sealant located on a side of the first cutting line away from the dye liquid crystal layer is removed along the first cutting line, and a portion of the frame sealant located on a side of the first cutting line and the dye liquid crystal layer forms the first sub-portion.

[0007] In some embodiments, the orthographic projection of the first cutting line on the reference plane is located in the orthographic projection of the dye liquid crystal layer on the reference plane.

[0008] In some embodiments, glue is applied to form a first edge-sealing glue; the glue portion is located between the dye liquid crystal layer and the first cutting line to form a first sub-portion; the first edge-sealing glue also includes a second sub-portion, the glue portion is located in the first binding area, and extends along the side wall of the second substrate close to the first binding area to form a second sub-portion; wherein the second sub-portion is connected to the first sub-portion.

[0009] In some embodiments, after forming the first edge-sealing adhesive, the preparation method further includes binding a first circuit board to a first binding area of ​​the first transition plate; and a gap is provided between the first circuit board and the first edge-sealing adhesive.

[0010] In some embodiments, after binding the first circuit board, the preparation method further includes forming a first protective adhesive between the first circuit board and the first edge sealing adhesive, and bonding the first edge sealing adhesive and the first circuit board, the first protective adhesive also covering a second area, and the area of ​​the first binding area exposed by the first circuit board and the first edge sealing adhesive forms the second area.

[0011] In some embodiments, cutting the dimming panel motherboard to form an initial dimming panel includes: using a press to press the dimming panel motherboard; cutting the dimming panel motherboard along a second cutting line to form an initial dimming panel; the press is spaced apart from the second cutting line.

[0012] In some embodiments, during the process of cutting the second transition plate to form the second substrate, the second transition plate is cut along the outer boundary of the press, and the second substrate also exposes a third area of ​​the first transition plate, the width of the third area is smaller than the width of the second area; the second substrate has a second side wall, the first transition plate has a first side wall, the second side wall is substantially parallel to the first side wall, and the orthographic projection of the second side wall on the first substrate is spaced from the first side wall. During the process of forming the first edge sealing glue, the preparation method further includes: applying glue to form the second edge sealing glue, the glue part is located between the dye liquid crystal layer and the second side wall to form a third sub-portion, the glue part is located in the third area, and extends along the second side wall to form a fourth sub-portion, wherein the fourth sub-portion is bonded to the second side wall, and the third sub-portion is connected, and in the orthographic projection to the first transition plate, the fourth sub-portion covers the area between the first side wall and the second side wall.

[0013] In some embodiments, the second substrate has a fourth side wall, the first substrate has a third side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the first side wall on the reference surface coincides with the orthographic projection of the second side wall on the reference surface. In the process of forming the first edge-sealing glue, the preparation method further includes: applying glue to form the third edge-sealing glue, the glue portion is located between the dye liquid crystal layer and the third side wall to form a fifth sub-portion, the glue portion extends along the third side wall and the fourth side wall to form a sixth sub-portion, wherein the sixth sub-portion is bonded to the third side wall and the fourth side wall, and connected to the fifth sub-portion.

[0014] In some embodiments, the step of cutting the dimming panel motherboard to form an initial dimming panel includes: the step of cutting the dimming panel motherboard to form an initial dimming panel includes: cutting the dimming panel motherboard along a third cutting line to form the first dimming panel; the first dimming panel has a panel area and a liquid leakage area, the liquid leakage area is at least located on one side of the panel area, and in the liquid leakage area, there is no dye liquid crystal layer and frame sealing glue between the first substrate and the second substrate. The step of cutting the first dimming panel along a fourth cutting line to form the initial dimming panel; the fourth cutting line is located in the panel area.

[0015] In some embodiments, the first substrate has a fifth side wall, the second substrate has a sixth side wall, the fifth side wall is substantially parallel to the sixth side wall, and in the orthographic projection onto the first substrate, the fifth side wall, the sixth side wall, and a portion of the side wall of the dye liquid crystal layer are substantially flush. In the process of forming the first edge-sealing glue, the preparation method further includes: applying glue to form a fourth edge-sealing glue, the glue extending along the fifth side wall, the sixth side wall, and the side wall of the dye liquid crystal layer to form the fourth edge-sealing glue, and bonding to the fifth side wall and the sixth side wall.

[0016] In some embodiments, preparing the dimming panel motherboard includes forming an initial support layer on the first substrate motherboard, performing direct writing exposure on the initial support layer using a digital mask, and developing, cleaning, and curing the initial support layer to form a plurality of spacers.

[0017] On the other hand, a dimming panel is provided. The dimming panel includes a first substrate, a second substrate, a dye liquid crystal layer, a plurality of spacers, and a first edge-sealing adhesive. The first substrate and the second substrate are arranged opposite to each other; the first substrate has a first binding area. The orthographic projection of the second substrate on the first substrate does not overlap with the first binding area. The dye liquid crystal layer is located between the first substrate and the second substrate. The plurality of spacers are located between the first substrate and the second substrate. The first edge-sealing adhesive includes a first sub-portion, the first sub-portion is located between the first substrate and the second substrate, and is arranged along the edge of the second substrate close to the first binding area.

[0018] The first edge sealing glue also includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the side wall of the second substrate close to the first binding area.

[0019] In some embodiments, the first edge sealing glue also includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the side wall of the second substrate close to the first binding area.

[0020] In some embodiments, the dimming panel further includes a first circuit board and a first protective adhesive. The orthographic projection of the first circuit board on the first substrate is located in the first binding area. At least a portion of the first protective adhesive is located between the first edge sealing adhesive and the first circuit board, and is bonded to the first edge sealing adhesive and the first circuit board.

[0021] In some embodiments, in an orthographic projection onto the first substrate, an area formed by the first edge sealing adhesive, the first protective adhesive, and the first circuit board covers the first binding area.

[0022] In some embodiments, the first substrate has a first side wall, the second substrate has a second side wall, the second side wall is substantially parallel to the first side wall, and the orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall. The dimming panel further includes a second edge-sealing adhesive. The second edge-sealing adhesive includes a third sub-section and a fourth sub-section, the third sub-section being located between the first substrate and the second substrate and being arranged along an edge of the second substrate close to the second side wall. The fourth sub-section is arranged along the second side wall and is bonded to the second side wall and the side wall of the third sub-section close to the fourth sub-section. In the orthographic projection onto the first substrate, the fourth sub-section covers the area between the first side wall and the second side wall.

[0023] In some embodiments, the first substrate has a third side wall, the second substrate has a fourth side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the third side wall on the reference plane coincides with the orthographic projection of the fourth side wall on the reference plane. The dimming panel further includes a third edge sealing adhesive. The third edge sealing adhesive includes a fifth sub-portion, the fifth sub-portion is located between the first substrate and the second substrate, and is arranged along the edge of the first substrate close to the third side wall.

[0024] In some embodiments, the third edge sealing adhesive further includes a sixth sub-portion, which is disposed along the third side wall and the fourth side wall and is bonded to the third side wall, the fourth side wall and the side wall of the fifth sub-portion close to the third side wall.

[0025] In some embodiments, the second substrate has a second binding area, and the orthographic projection of the first substrate on the second substrate does not overlap with the second binding area. The dimming panel also includes a fifth edge-sealing adhesive and a second circuit board. The fifth edge-sealing adhesive includes a seventh sub-section and an eighth sub-section. The seventh sub-section is located between the first substrate and the second substrate and is arranged along the edge of the first substrate close to the second binding area. The orthographic projection of the eighth sub-section on the second substrate is located in the second binding area. The eighth sub-section is arranged along the edge of the second binding area close to the second substrate and is bonded to the side wall of the seventh sub-section close to the second binding area and the side wall of the second substrate close to the second binding area. The orthographic projection of the second circuit board on the second substrate is located in the second binding area.

[0026] In some embodiments, the dimming panel further includes a second protective adhesive, at least a portion of which is located between the third edge sealing adhesive and the second circuit board, and is bonded to the second edge sealing adhesive and the second circuit board.

[0027] In some embodiments, in an orthographic projection onto the second substrate, an area formed by the second edge sealing adhesive, the second protective adhesive and the second circuit board covers the second binding area.

[0028] In some embodiments, the second substrate includes a second substrate and a second electrode layer. The second substrate is provided with a through hole. The second electrode layer is located on a side of the second substrate close to the dye liquid crystal layer, and the second electrode layer covers the second substrate. The dimming panel also includes a second circuit board, which is located on a side of the second substrate away from the first substrate, and is at least partially electrically connected to the second electrode layer through the through hole.

[0029] In some embodiments, the spacer is disposed on the first substrate, and an orthographic projection of the spacer on the plane where the second substrate is located is at least partially located outside the second substrate.

[0030] In some embodiments, at least one spacer is located in the first binding area.

[0031] In another aspect, a dimming structure is provided, wherein the dimming structure comprises: a dimming panel as described in any of the above embodiments, and the dimming structure comprises at least one of a curtain wall, a skylight, a rail vehicle, and a passenger car. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0033] Figure 1A to Figure 16B A diagram showing the steps of manufacturing a dimming panel according to some embodiments;

[0034] Fig.17 A structural diagram showing a first circuit board and a second circuit board arranged on the same side according to some embodiments;

[0035] Fig.18A for Fig.17 A cross-sectional view along section line II;

[0036] Fig.18B for Fig.17 Another cross-sectional view along section line II;

[0037] Fig.18C for Fig.17 Another cross-sectional view along section line II;

[0038] Fig.18D for Fig.17 Another cross-sectional view along section line II;

[0039] Fig.18E for Fig.17 A cross-sectional view along section line II;

[0040] Fig.18F for Fig.17 Another cross-sectional view along section line II;

[0041] Figure 18G for Fig.17 Another cross-sectional view along section line II;

[0042] Fig.18H for Fig.17 Another cross-sectional view along section line II;

[0043] Fig.19 for Fig.17 Another cross-sectional view along section line JJ;

[0044] Fig. 20 A structural diagram of a first circuit board and a second circuit board arranged adjacent to each other according to some embodiments;

[0045] Fig.21 is a structural diagram of the relative positions of a first circuit board and a second circuit board according to some embodiments;

[0046] Fig. 22 is a structural diagram of the sizes of the first binding area and the second binding area according to some embodiments;

[0047] Fig.23 A structural diagram showing a second substrate provided with a through hole according to some embodiments;

[0048] Fig.24 is a structural diagram of a car according to some embodiments. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0050] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0051] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0052] When describing some embodiments, the expression "connection" and its derivatives may be used. The term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0053] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0054] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0055] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0056] As used herein, "approximately" includes the stated values ​​and averages that are within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0057] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0058] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0059] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the regions are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0060] The directional words such as "up", "down", "left" and "right" described in the embodiments of this document are described based on the angles shown in the accompanying drawings and should not be construed as limitations on the embodiments of this application.

[0061] In the related art, the manufacturing method of the dimming panel is as follows: a plurality of frame sealants distributed in an array are formed on the first substrate motherboard; a plurality of dye liquid crystal layers corresponding to the plurality of frame sealants are formed on the second substrate motherboard, and then the first substrate motherboard and the second substrate motherboard are boxed to form a dimming panel motherboard, and finally the dimming panel motherboard is cut along the edge of each frame sealant to obtain a dimming panel. In the process of preparing the dimming panel motherboard, the specifications of the dimming panel are various, resulting in inconsistent shapes and circumferences of the frame sealants. Therefore, in the process of preparing the dimming panel motherboard, it is necessary to frequently switch the parameters of the frame sealant in the coating equipment, resulting in waste of coating equipment production capacity. When producing a smaller size of dimming panel, the total circumference of the frame sealant on the dimming panel motherboard is longer, resulting in a longer time for the coating equipment to form the frame sealant, which in turn causes the speed of the entire production line to decrease, resulting in a lower production capacity of the production line. In addition, in the process of producing dimming panels, considering the product qualification rate, the actual number of products produced is greater than the required number. The excess dimming panels need to be put into the warehouse. Only when the dimming panels of the same specification are produced again can the dimming panels in the warehouse be reused, which leads to more inventory materials in the warehouse and a longer inventory cycle.

[0062] In order to solve the above problems, an embodiment of the present disclosure provides a method for preparing a dimming panel 100 , and the preparation method includes S100 to S400 .

[0063] S100, such as Figure 1A As shown, a dimming panel motherboard 1100 is prepared.

[0064] Figure 1B for Figure 1A The cross-sectional view along the section line AA is as follows: Figure 1B As shown, the dimming panel motherboard 1100 includes a first substrate motherboard 111 , a second substrate motherboard 112 , a dye liquid crystal layer 113 , a plurality of spacers 114 and a sealing glue 115 .

[0065] like Figure 1BAs shown, the first substrate motherboard 111 and the second substrate motherboard 112 are arranged opposite to each other. The first substrate motherboard 111 includes a first substrate 11, a first electrode layer 12 and a first orientation layer 13. The first electrode layer 12 is located on the side of the first substrate 11 close to the second substrate motherboard 112, the first electrode layer 12 covers the first substrate 11, and the first orientation layer 13 is located on one side of the first electrode layer. The second substrate motherboard 112 includes a second substrate 21, a second electrode layer 22 and a second orientation layer 23. The second electrode layer 22 is located on the side of the second substrate 21 close to the first substrate motherboard 111, the second electrode layer 22 covers the second substrate 21, and the second orientation layer 23 is located on the side of the second electrode layer 23 away from the second substrate 21. Among them, the materials of the first substrate 11 and the second substrate 12 may include materials with high light transmittance (for example, a light transmittance greater than 85%). The materials of the first substrate 11 and the second substrate 21 may include glass or plastic. The first substrate 11 and the second substrate 12 may include polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), tri-cellulose acetate (TAC), cellulose acetate propionate (CAP), polyphenylene sulfone resins (PPSU), cycloolefin polymers (Cyclo One or more of poly(ethylene methacrylate; abbreviated as COP) and poly(methyl methacrylate) (English: Polymethyl Methacrylate, abbreviated as PMMA). For example, the material of the first substrate 11 and the second substrate 21 is polyimide. The material of the first electrode layer 12 and the second electrode layer 22 includes a conductive material with high light transmittance, for example, the material of the first electrode layer 12 and the second electrode layer 22 includes indium tin oxide (English: Indium Tin Oxides, abbreviated as ITO). For example, the material of the first orientation layer 13 and the second orientation layer 23 includes polyimide.

[0066] like Figure 1B As shown, the dye liquid crystal layer 113 is located between the first substrate motherboard 111 and the second substrate motherboard 112. That is, the first electrode layer 12 is located on the side of the first substrate 11 close to the dye liquid crystal layer 113, and the second electrode layer 22 is located on the side of the second substrate 21 close to the dye liquid crystal layer 113. The dye liquid crystal layer 113 includes dye molecules and liquid crystal molecules. The first orientation layer 13 and the second orientation layer 23 are used to arrange the liquid crystal molecules in a certain direction and angle, that is, the first orientation layer 13 and the second orientation layer 23 can arrange the liquid crystal molecules according to the set pre-tilt angle. The angle formed by the long axis direction of the dye molecule and the first substrate 11 is different, and the amount of light absorbed by the dye molecule is also different. Changing the voltage value between the first electrode layer 12 and the second electrode layer 22 can change the angle formed by the long axis direction of the liquid crystal molecule and the first substrate 11, that is, the angle formed by the long axis direction of the dye molecule and the first substrate 11 can be changed, thereby changing the amount of light absorbed by the dye molecule, and then the light transmittance of the dye liquid crystal layer 113 can be adjusted, and the light transmittance of the dimming panel 100 can be adjusted.

[0067] like Figure 1B As shown, multiple spacers 114 are distributed in an array. The spacing between two adjacent spacers 114 ranges from 0.2mm to 1mm. For example, the spacing between two adjacent spacers 114 is 0.2mm, 0.5mm or 1mm, and the embodiments of the present disclosure are not listed one by one. The height of the spacer 114 ranges from 5μm to 30μm. For example, the height of the spacer 114 is 5μm, 8μm, 12μm, 15μm, 18μm, 20μm, 25μm or 30μm. The embodiments of the present disclosure are not listed one by one. For example, the shape of the spacer 114 is a truncated cone, that is, the shape of the longitudinal cross-section of the spacer 114 is a trapezoid, and the diameter of the spacer 114 ranges from 5μm to 25μm. For example, the diameter of the spacer 114 is 5μm, 15μm or 25μm, and the embodiments of the present disclosure are not listed one by one.

[0068] like Figure 1B As shown, the sealant 115 is located between the first substrate motherboard 111 and the second substrate motherboard 112, and surrounds the dye liquid crystal layer 113. The material of the sealant 115 can be a sealant. The dimming panel motherboard 1100 in the embodiment of the present application is only provided with the sealant 115 at the edge, and the interior of the dimming panel motherboard 1100 is not provided with the sealant 115.

[0069] In some embodiments, S100 includes S110 to S140 .

[0070] S110, such as Figure 2A As shown, an initial support layer 401 is formed on the first substrate motherboard 111 .

[0071] For example, the support material can be coated on the first substrate motherboard 111 in a roll-to-roll slit method or a micro-dimpled method, and the thickness of the coated material is 30 μm to 100 μm. The coated material is pre-cured to form an initial support layer 401, and the pre-curing heating temperature is 90° C. to 120° C., the heating time is 80s to 150s, and the thickness of the initial support layer 401 after pre-curing is 5 μm to 30 μm.

[0072] S120, such as Figure 2A As shown, the initial support layer 401 is exposed by direct writing using a digital mask.

[0073] Laser may be used to perform direct writing exposure on the initial support layer 401 .

[0074] S130, such as Figure 2B As shown, the initial support layer 401 is developed, cleaned, and cured to form a plurality of spacers 114 .

[0075] Exemplarily, the developing time is 120s to 300s. The height, spacing and diameter of the spacers 114 are as described above and will not be described again here.

[0076] S140, such as Figure 1B As shown, the first substrate motherboard 111 and the second substrate motherboard 112 are assembled into a dimming panel motherboard 1100 .

[0077] The embodiment of the present disclosure uses a laser and a digital mask to expose the initial support layer 401. The laser has good straightness, which can make the exposure amount of the initial support layer 401 roughly the same in the direction perpendicular to the first substrate motherboard 111. The angle between the side wall of the spacer 141 and the first substrate motherboard 111 is greater than 80°, and / or the diameter of the end of the spacer 141 away from the first substrate motherboard 111 is greater than the product of the diameter of the end of the spacer 141 close to the first substrate motherboard 111 and 0.9. In this way, along the direction perpendicular to the first substrate motherboard 111 and from the first substrate motherboard 111 to the second substrate motherboard 112, the cross-sectional area difference of the spacer 114 parallel to the first substrate motherboard 111 is small, thereby making the contact stress and maximum shear stress between the second substrate motherboard 112 and the spacer 114 small, which can reduce the risk of cracks in the second substrate motherboard 112. The life of the second substrate motherboard 112 is shortened. The laser has good straightness and can be directly used in a digital mask plate without complicated processing, thereby reducing the preparation cost of the dimming panel motherboard 1100.

[0078] S200 , cutting the dimming panel motherboard 1100 to form an initial dimming panel 220 .

[0079] Since the dye liquid crystal has fluidity, in order to reduce the loss of the dye liquid crystal, the following method can be used to prepare the initial dimming panel 220.

[0080] In some embodiments, S200 includes S210 and S220.

[0081] S210, such as Figure 3A and Figure 3B As shown, a press 1 is used to press the dimming panel motherboard 1100 .

[0082] like Figure 3B As shown, a press 1 is placed on the dimming panel motherboard 1100 , and a force is applied to the press 1 so that the first substrate motherboard 111 and the second substrate motherboard 112 are in contact at the press 1 .

[0083] S220, such as Figure 4A and Figure 4B As shown, along the second cutting line X 2 The dimming panel motherboard 1100 is cut to form an initial dimming panel 220 .

[0084] Figure 4B For along Figure 4A The cross-sectional view along the section line CC is as follows: Figure 4B As shown, the initial dimming panel 220 includes a first transition plate 221 and a second transition plate 222, the orthographic projection of the second transition plate 222 on the reference plane coincides with the orthographic projection of the first transition plate 221 on the reference plane, at least a portion of the sidewall of the first transition plate 221 is flush with at least a portion of the sidewall of the dye liquid crystal layer 113, and the first transition plate 221 is flush with at least a portion of the dye liquid crystal layer 113. The shape of the initial dimming panel 220 can be circular, triangular, rectangular or irregular. The reference plane is parallel to the plane of the first transition plate 221 close to the dye liquid crystal layer 113.

[0085] The first transition plate 221 and the second transition plate 222 are in contact at the press 1, thereby isolating the dye liquid crystal layer 113 in the contact position between the first transition plate 221 and the second transition plate 222 from the atmosphere, thereby reducing the risk of air intrusion into the dye liquid crystal layer 113 and maintaining the vacuum state of the dye liquid crystal layer 113.

[0086] In some other embodiments, S200 includes S230 and S240.

[0087] like Figure 5A As shown, along the third cutting line X 3 The dimming panel motherboard 1100 is cut to form a first dimming panel 330 .

[0088] like Figure 5BAs shown, the first dimming panel 330 has a panel area 331 and a liquid leakage area 332. In the liquid leakage area 332, there is no dye liquid crystal layer 113 and a sealant 115 between the first substrate motherboard 111 and the second substrate motherboard 112. Figure 5A As shown, the leakage area 332 surrounds the panel area 331 and is formed along the third cutting line X 3 The dye liquid crystal layer 113 of the first dimming panel 330 is exposed to the air, and the air will invade the dye liquid crystal layer 113. The dye liquid crystal has fluidity, and the dye liquid crystal at the edge of the first dimming panel 330 will leak. Since the dye liquid crystal has viscosity, after a certain amount of the dye liquid crystal at the edge is lost, the air pressure of the dye liquid crystal layer 113 is equal to the pressure of the air, and the dye liquid crystal will no longer leak. The area where the dye liquid crystal leaks is the leakage area 332, and the remaining area is the panel area 331.

[0089] S240, such as Figure 5A As shown, along the fourth cutting line X 4 The first dimming panel 330 is cut to form an initial dimming panel 220 .

[0090] like Figure 5C As shown, the initial dimming panel 220 includes a first transition plate 221 and a second transition plate 222. The orthographic projection of the second transition plate 222 on the reference plane coincides with the orthographic projection of the first transition plate 221 on the reference plane. At least a portion of the sidewall of the first transition plate 221 is flush with at least a portion of the sidewall of the dye liquid crystal layer 113. The first transition plate 221 is flush with at least a portion of the dye liquid crystal layer 113. Fig. 6A As shown, the fourth cutting line X 4 Located in the panel area 331. In S230, the air pressure of the dye liquid crystal layer 113 is equal to the air pressure of the air, that is, the air pressure of the dye liquid crystal layer 113 and the air pressure of the air have reached equilibrium. 4 During the process of cutting the first dimming panel 330 to form the initial dimming panel 220 , the dye liquid crystal layer 113 will no longer leak.

[0091] S300, such as Fig. 6A , Figure 6B , Fig. 7A and Figure 7B As shown, along the first cutting line X 1 The second transition plate 222 is cut to form the second base plate 20 .

[0092] The second substrate 20 exposes the first region 2 of the first transition plate 221, and the first region 2 forms the first binding region 102. The other regions of the first transition plate 221 form the first main region 101, and the first binding region 102 is located on one side of the first main region 101. Fig. 6A As shown, the first binding area 102 is located at the lower side of the first main body area 101, or as shown in Fig. 7A As shown, the first binding area 102 is located on the upper side of the first main body area 101 .

[0093] In addition, the size and shape of the first binding area 102 may be set according to actual conditions, for example, Fig. 8A As shown, the shape of the first binding area 102 is rectangular, and the dimension of the first binding area 102 along the width direction of the first transition plate 221 is equal to the width of the first transition plate 221. Figure 8B As shown, the dimension of the first binding area 102 along the width direction of the first transition plate 221 is smaller than the width of the first transition plate 221. The dye liquid crystal layer 113 is located between the first transition plate 221 and the second substrate 20.

[0094] In some embodiments, Fig. 7A and Figure 7B As shown, the first cutting line X 1 The orthographic projection of the reference surface is located in the orthographic projection of the sealing glue 115 on the reference surface, along the first cutting line X 1 Remove the second transition plate 222 located at the first cutting line X 1 The portion away from the dye liquid crystal layer 113 forms the second substrate 20. In the process of forming the second substrate 20, any part of the dye liquid crystal layer 113 will not be removed, so that the area of ​​the dye liquid crystal layer 113 can be made larger to the greatest extent, and the dimming area in the dimming panel 100 can be made larger. The dimming area refers to the area in the dimming panel 100 that can adjust the transmittance.

[0095] In other embodiments, Fig. 9 As shown, the first cutting line X 1 The orthographic projection of the reference surface is located in the orthographic projection of the dye liquid crystal layer 113 on the reference surface, along the first cutting line X 1 The portion of the second transition plate 222 in contact with the dye liquid crystal layer 113 is removed to form the second substrate 20 .

[0096] In some embodiments, Figure 1A As shown, the dimming panel motherboard 1100 can be cut along different cutting lines X according to actual needs. Figure 1A A structural diagram showing the shape of the cutting line X.

[0097] In some embodiments, the cutting line X includes a, and the cutting line a intersects with two opposite side edges, that is, three sides of the initial dimming panel 220 obtained along the cutting line a include the frame sealant 115 .

[0098] In other embodiments, the cutting line X is located at the corner of the dimming panel motherboard 1100, that is, the cutting line X includes b, and the cutting line b intersects with two adjacent sides, that is, the adjacent two sides of the initial dimming panel 220 obtained along this cutting line X both include frame sealing glue.

[0099] In some other embodiments, the cutting line X is located at the edge of the dimming panel motherboard 1100 and does not pass through the corner of the dimming panel motherboard 1100. The cutting line X includes c, and the cutting line c intersects with a side edge, that is, one side of the initial dimming panel 220 obtained along this cutting line c includes frame sealing glue.

[0100] In some other embodiments, the cutting line X is located inside the dimming panel motherboard 1100, the cutting line X includes d, and the cutting line d does not intersect with the side, that is, the initial dimming panel 220 obtained along the cutting line d does not include a sealing glue. The shape surrounded by the cutting line X is a circle, a rectangle, a diamond, a pentagon or a cross, and the embodiments of the present disclosure are listed one by one.

[0101] When cutting the dimming panel motherboard 1100, the shapes of the four cutting lines X can be reasonably combined to maximize the use of the dimming panel motherboard 1100. The embodiment of the present disclosure is described by taking the cutting line X as c.

[0102] Different cutting tools can be used to cut the dimming panel motherboard 1100 according to the material of the first substrate 11. When the materials of the first substrate 11 and the second substrate 21 are hard materials, a cutting wheel can be used to cut the dimming panel motherboard 1100. When the materials of the first substrate 11 and the second substrate 21 are flexible materials, a laser or a mold cutter head can be used to cut the dimming panel motherboard 1100.

[0103] In some implementations, such as Fig. 10A and Fig. 10B As shown, in the case where the preparation method includes the press 1, in the process of cutting the second transition plate 222 to form the second substrate 20 at S300, the second transition plate 222 is also cut along the outer boundary of the press 1, and the second substrate 20 also exposes the third region 4 of the second transition plate 222, and the width of the third region 4 is less than the width of the first region 2. The second substrate 20 has a second side wall 203, and the first transition plate 221 has a first side wall 103, the second side wall 203 is substantially parallel to the first side wall 103, and the orthographic projection of the second side wall 203 on the first substrate 10 is spaced from the first side wall 103.

[0104] In other embodiments, Fig.11A and Fig. 11BAs shown, in the case where the preparation method includes the press 1, in the process of cutting the second transition plate 222 to form the second substrate 20 at S300, the first transition plate 221 has a third side wall 104, the second substrate 20 has a fourth side wall 204, the third side wall 104 is substantially parallel to the fourth side wall 204, and the orthographic projection of the third side wall 104 on the reference plane coincides with the orthographic projection of the fourth side wall 204 on the reference plane.

[0105] In some other embodiments, Fig. 6A and Figure 6B As shown, in the process of cutting the second transition plate 222 to form the second substrate 20 at S300, the first transition plate 221 has a fifth side wall 105, the second substrate 20 has a sixth side wall 205, the fifth side wall 105 is substantially parallel to the sixth side wall 205, and in the orthographic projection onto the reference plane, the fifth side wall 105, the sixth side wall 205, and the orthographic projection of the dye liquid crystal layer 113 onto the reference plane coincide.

[0106] S400, such as Fig. 6A , Figure 6B and Fig. 9 As shown, a first edge sealing adhesive 50 is formed along the first cutting line X1.

[0107] In some embodiments, Fig. 6A and Figure 6B As shown, the first edge sealing adhesive 50 includes a first sub-portion 51 , which is located between the first transition plate 221 and the second substrate 20 and is disposed along the edge of the second substrate 20 close to the first binding area 102 .

[0108] At the first cutting line X 1 In the case where the orthographic projection of the reference surface is located in the orthographic projection of the frame sealant 115 on the reference surface, the above S300 is performed along the first cutting line X 1 In the process of cutting the second transition plate 222 to form the second substrate 20, the first cutting line X 1 Remove the sealant 115 at the first cutting line X 1 The portion away from the dye liquid crystal layer 113 is located at the first cutting line X in the sealant 115. 1 The first sub-portion 51 is formed by the dye liquid crystal layer 113. The first edge sealant 50 uses the frame sealant 115 of the dimming panel motherboard 1100, and no additional glue is needed to form the first edge sealant 50, so the manufacturing cost of the dimming panel 100 can be reduced.

[0109] In other embodiments, Fig. 9As shown, the first edge-sealing adhesive 50 includes a first sub-portion 51 and a second sub-portion 52. The first sub-portion 51 is located between the first transition plate 221 and the second substrate 20, and is arranged along the edge of the second substrate 20 close to the first binding area 102. The second sub-portion 52 is arranged along the edge of the first binding area 102 close to the second substrate 20, and the second sub-portion 52 is also bonded to the side wall of the second substrate 20 close to the first binding area 102. The second sub-portion 52 wraps the side wall of the second substrate 20 close to the first binding area 102, that is, the second sub-portion 52 separates the side wall of the second substrate 20 close to the first binding area 102 from the air, which can reduce the risk of water vapor invading the dimming panel 100 from the side wall of the second substrate 20 close to the first binding area 102, reduce the risk of material aging of the dimming panel 100, and thus increase the service life.

[0110] At the first cutting line X 1 In the case where the orthographic projection of the reference surface is located in the orthographic projection of the dye liquid crystal layer 113 on the reference surface, glue is applied to the first binding area 102, and the glue is located between the dye liquid crystal layer 113 and the first cutting line X 1 The portion between the first and second substrates 20 forms a first sub-portion 51. The first edge sealing glue 50 further includes a second sub-portion 52. The portion where the glue is located in the first binding region 102 and extends along the side wall of the second substrate 20 close to the first binding region 102 forms the second sub-portion 52.

[0111] The material of the first edge sealant 50 can be the same as that of the frame sealant 115, for example, the materials of the first edge sealant 50 and the frame sealant 115 include sealant. Alternatively, the material of the first edge sealant 50 can be different from that of the frame sealant, for example, the material of the frame sealant 115 is sealant, and the material of the first edge sealant 50 is UV glue.

[0112] In some embodiments, Fig.12 As shown, when the second substrate 20 has a second side wall 203 and the first transition plate 221 has a first side wall 103, in the process of forming the first edge-sealing glue 50, a second edge-sealing glue 80 is also formed. The second edge-sealing glue 80 includes a third sub-portion 81 and a fourth sub-portion 82. The third sub-portion 81 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the second substrate 20 close to the second side wall 203. The third sub-portion 81 is used to separate the dye liquid crystal and the air.

[0113] The fourth sub-portion 82 is arranged along the second side wall 203 and bonded to the second side wall 203, so that the fourth sub-portion 82 wraps the second side wall 203, that is, the second sub-portion 52 separates the second side wall 203 from the air, which can reduce the risk of water vapor intruding into the dimming panel 100 from the second side wall 203 and reduce the risk of material aging of the dimming panel 100. The fourth sub-portion 82 is connected to the side wall of the third sub-portion 81 close to the fourth sub-portion 82.

[0114] The fourth sub-portion 82 also covers the third region 4. In this way, the fourth sub-portion 82 separates the first transition plate 221 located in the third region 4 from the air, which can reduce the risk of water vapor corroding the first transition plate 221.

[0115] Exemplarily, the second edge-sealing glue 80 can be formed by the following method. The dye liquid crystal in the third region 4 is removed by dust-free cloth or plasma, and glue is applied to the third region 4. The glue part is located between the dye liquid crystal layer 113 and the second side wall 203 to form a third sub-portion 81, and the glue part is located in the third region 4 and extends along the second side wall 203 to form a fourth sub-portion 82. The third region 4 has only the first transition plate 221, that is, there is no second substrate 20 above the first transition plate 221, which can make it easier to clean the dye liquid crystal and apply glue.

[0116] In other embodiments, Fig.13 As shown, when the first transition plate 221 has the third side wall 104 and the second substrate 20 has the fourth side wall 204 , the third edge sealing adhesive 90 is also formed during the process of forming the first edge sealing adhesive 50 .

[0117] The third edge-sealing adhesive 90 includes a fifth sub-portion 91 and a sixth sub-portion 92. The fifth sub-portion 91 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the first substrate 10 close to the third side wall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal and the air. The sixth sub-portion 92 is arranged along the third side wall 104 and is bonded to the third side wall 104. The sixth sub-portion 92 wraps around the third side wall 104, that is, the sixth sub-portion 92 separates the third side wall 104 from the air, which can reduce the risk of material aging in the dimming panel 100. The sixth sub-portion 92 is arranged along the fourth side wall 204 and is bonded to the fourth side wall 204. The sixth sub-portion 92 wraps around the fourth side wall 204, that is, the sixth sub-portion 92 separates the fourth side wall 204 from the air, which can reduce the risk of material aging in the dimming panel 100. The sixth sub-portion 92 is also connected to the side wall of the fifth sub-portion 91 close to the third side wall 104.

[0118] For example, Fig.13As shown, the third edge-sealing glue 90 can be formed in the following directions. First, a force is applied to the portion of the second substrate 20 located between the boundary of the press 1 and the second substrate 20, so that the portion of the second substrate 20 located between the boundary of the press 1 and the second substrate 20 is bent in a direction away from the first transition plate 221 to obtain a larger cleaning space. Next, a dust-free cloth or plasma is used to clean the dye liquid crystal between the boundary of the press and the first transition plate 221. Then, glue is applied to the area of ​​the above-mentioned cleaned dye liquid crystal. Finally, a force is applied to the portion of the second substrate 20 located between the boundary of the press 1 and the second substrate 20, so that the portion of the second substrate 20 located between the boundary of the press 1 and the second substrate 20 is bent in a direction close to the first substrate 10, so that the first transition plate 221 and the second substrate 20 can squeeze the glue, thereby forming the third edge-sealing glue 90. The glue portion is located between the dye liquid crystal layer 113 and the third side wall 104 to form the fifth sub-portion 91, and the glue portion extends along the third side wall 104 and the fourth side wall 204 to form the sixth sub-portion 92.

[0119] Alternatively, the third edge sealing adhesive 90 only includes the fifth sub-portion 91. The fifth sub-portion 91 is located between the first substrate 10 and the second substrate 20 and is disposed along the edge of the first substrate 10 close to the third side wall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal and air.

[0120] In some other embodiments, Fig.14 As shown, when the first transition plate 221 has a fifth side wall 105 and the second substrate 20 has a sixth side wall 205, a fourth edge sealing adhesive 110 is also formed during the process of forming the first edge sealing adhesive 50. The fourth edge sealing adhesive 110 is arranged along the fifth side wall 105, the sixth side wall 205 and along the edge of the first substrate 10 close to the fifth side wall 105.

[0121] Among them, the fourth edge-sealing glue 110 is bonded to the fifth side wall 105, and the fourth edge-sealing glue 110 wraps the fifth side wall 105, that is, the fourth edge-sealing glue 110 separates the fifth side wall 105 from the air, which can reduce the risk of water vapor intruding from the fifth side wall 105 into the dimming panel 100, and reduce the risk of material aging of the dimming panel 100. The fourth edge-sealing glue 110 is bonded to the sixth side wall 205, and the fourth edge-sealing glue 110 wraps the sixth side wall 205, that is, the fourth edge-sealing glue 110 separates the sixth side wall 205 from the air, which can reduce the risk of water vapor intruding from the sixth side wall 205 into the dimming panel 100, and reduce the risk of material aging of the dimming panel 100.

[0122] Exemplarily, the fourth edge-sealing glue 110 may be formed in the following directions. For example, the fifth side wall 105 and the sixth side wall 205 are placed below the liquid surface of the glue, and under the action of the surface tension of the glue, the glue will wrap the fifth side wall 105, the sixth side wall 205 and part of the side wall of the dye liquid crystal layer 113 to form the fourth edge-sealing glue 110. For another example, the fourth edge-sealing glue 110 is formed by applying glue to the edge of the fifth side wall 105, the sixth side wall 205 and the dye liquid crystal layer 113 close to the fifth side wall 105.

[0123] The size and shape of the sealant 115 in the dimming panel motherboard 1100 provided in the embodiment of the present disclosure are consistent. In the process of forming the sealant 115, the coating device forms the sealant 115 at the same time, and there is no need to frequently switch the parameters of the sealant in the coating device and reduce the speed of the production line. When any specification of the dimming panel 100 is produced again, the dimming panel motherboard 1100 in the warehouse can be reused, which can reduce the inventory of the warehouse, that is, reduce the inventory cycle.

[0124] In some embodiments, at S400, along the first cutting line X 1 After the first edge sealing adhesive 50 is formed, the preparation method further includes S500 and S600.

[0125] S600, such as Fig.15 As shown, the first circuit board 60 is bound to the first binding area 102 of the first transition plate 221 .

[0126] There is a gap between the first circuit board 60 and the first edge-sealing adhesive 50. Exemplarily, the first circuit board 60 and the first transition plate 221 are bonded using anisotropic conductive adhesive.

[0127] S700 , forming a first protective adhesive 70 between the first circuit board 60 and the first edge sealing adhesive 50 .

[0128] like Fig.16A As shown, in the case where the first edge sealant 50 includes the first sub-portion 51 and the second sub-portion 52, the first protective adhesive 70 is bonded to the first edge sealant 50 and the first circuit board 60, and the first protective adhesive 70 can enhance the firmness of the first circuit board 60 and the first electrode layer 12. The first protective adhesive 70 also covers the second area, and the area of ​​the first binding area 102 exposed by the first circuit board 60 and the first edge sealant 50 forms the second area. That is, in the orthographic projection to the first substrate 10, the area formed by the first edge sealant 50, the first protective adhesive 70 and the first circuit board 60 covers the first binding area 102. In this way, the first edge sealant 50, the first protective adhesive 70 and the first circuit board 60 work together to separate the first transition plate 221 located in the first binding area 102 from the air, thereby reducing the risk of oxidation of the first transition plate 221 located in the first binding area 102. The material of the first protective adhesive 70 includes ultraviolet adhesive.

[0129] like Fig. 16B As shown, in the case where the first edge sealing glue 50 only includes the first sub-portion 51, unlike the above, the first protective glue 70 is bonded to the side wall of the second substrate 20 close to the first binding area 102, so that the first protective glue 70 wraps the side wall of the second substrate 20 close to the first binding area 102, that is, the first protective glue 70 separates the side wall of the second substrate 20 close to the first binding area 102 from the air, thereby reducing the risk of water vapor invading the dimming panel 100 from the side wall of the second substrate 20 close to the first binding area 102, and reducing the risk of material aging of the dimming panel 100.

[0130] The embodiment of the present disclosure further provides a dimming panel 100, and the dimming panel 100 includes a polymer dispersed liquid crystal (English: Polymer Dispersed Liquid Crystal, referred to as: PDLC) dimming panel 100, an electrochromic (English: Electro Chromism, referred to as: EC) dimming panel 100, a dye liquid crystal dimming panel 100, or a suspended particle device (Suspended Particle Device) dimming panel 100. The embodiment of the present disclosure takes the dimming panel 100 as an example of a dye liquid crystal dimming panel 100 for illustration.

[0131] In some embodiments, Fig.17 and Figures 18A to 18H As shown, the dimming panel 100 includes a first substrate 10 , a second substrate 20 , a dye liquid crystal layer 30 , a plurality of spacers 40 and a first edge sealing adhesive 50 .

[0132] like Figures 18A to 18HAs shown, the first substrate 10 and the second substrate 20 are arranged opposite to each other. The first substrate 10 includes a first substrate 11 and a first electrode layer 12. The material of the first substrate 11 may include a material with high light transmittance (for example, a light transmittance greater than 85%). The materials of the first substrate 11 and the second substrate 21 may include glass or plastic. The first substrate 11 and the second substrate 12 may include polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polycarbonate (PC), tri-cellulose acetate (TAC), cellulose acetate propionate (CAP), polyphenylene sulfone resins (PPSU), cycloolefin polymers (Cyclo Olefin) and polyvinyl alcohol (PVA). Polymer (abbreviated as COP) and polymethyl methacrylate (English: Polymethyl Methacrylate, abbreviated as PMMA) or more. For example, the material of the first substrate 11 and the second substrate 21 is polyimide.

[0133] The first electrode layer 12 is located on a side of the first substrate 11 close to the second substrate 20 . The first electrode layer 12 covers the first substrate 11 . The material of the first electrode layer 12 includes a conductive material with high light transmittance. For example, the material of the first electrode layer 12 includes indium tin oxide (ITO).

[0134] The first substrate 10 has a first main body area 101 and a first binding area 102, the first binding area 102 is located on one side of the first main body area 101, and the orthographic projection of the second substrate 20 on the first substrate 10 is located in the first main body area 101 and does not overlap with the first binding area 102. The sizes and shapes of the first main body area 101 and the first binding area 102 are as described above.

[0135] The shape of the first substrate 10 may be circular, triangular, rectangular or irregular. The embodiments of the present disclosure are not listed one by one. The implementation of the present disclosure is illustrated by taking the shape of the first substrate 10 as a rectangle.

[0136] like Figures 18A to 18H As shown, the second substrate 20 includes a second substrate 21 and a second electrode layer 22. The material of the second substrate 21 can be the same as that of the first substrate 11. For example, the materials of the first substrate 11 and the second substrate 21 both include glass. This can improve the identity of the materials in the dimming panel 100 and reduce the preparation cost of the dimming panel 100.

[0137] The second electrode layer 22 is located on a side of the second substrate 21 close to the first substrate 10, and covers the second substrate 21. The material of the second electrode layer 22 can be the same as that of the first electrode layer 12, for example, both the material of the first electrode layer 12 and the material of the second electrode layer 22 include ITO.

[0138] The dye liquid crystal layer 30 is located between the first substrate 10 and the second substrate 20 , that is, the first electrode layer 12 is located on the side of the first substrate 11 close to the dye liquid crystal layer 30 , and the second electrode layer 22 is located on the side of the second substrate 21 close to the dye liquid crystal layer 30 .

[0139] like Figures 18A to 18H As shown, a plurality of spacers 40 are located between the first substrate 10 and the second substrate 20, and are disposed on the first substrate 10. The plurality of spacers 40 are used to support the first substrate 10 and the second substrate 20 to reduce the risk of uneven spacing between the first substrate 10 and the second substrate 20. In the case where the first substrate 10 includes the first electrode layer 12, the plurality of spacers 40 are disposed on the first electrode layer 12.

[0140] In some embodiments, Figures 18A to 18H As shown, a plurality of spacers 40 are arranged in an array. The height, spacing and shape of the spacers 40 are as described above and will not be repeated here. Exemplarily, the spacers 40 are in the shape of a truncated cone.

[0141] FIG. 18A to FIG. 18D FIG. 5 is a structural diagram of the first edge sealing adhesive 50 including the first sub-section 51. FIG. 18A to FIG. 18D As shown, the first edge sealing glue 50 includes a first sub-portion 51, which is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the second substrate 20 close to the first binding area 102. The first sub-portion 51 is used to separate the dye liquid crystal and the air. At the same time, the first sub-portion 51 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0142] Figures 18E to 18HFIG. 5 is a structural diagram of the first edge sealing adhesive 50 including a first sub-section 51 and a second sub-section 52. In other embodiments, as Figures 18E to 18H As shown, the first edge-sealing glue 50 includes a first sub-portion 51 and a second sub-portion 52. The first sub-portion 51 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the second substrate 20 close to the first binding area 102. The first sub-portion 51 is used to separate the dye liquid crystal and the air. At the same time, the first sub-portion 51 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0143] The orthographic projection of the second sub-portion 52 on the first substrate 10 is located in the first binding area 102, and the second sub-portion 52 is arranged along the edge of the first binding area 102 close to the second substrate 20. The second sub-portion 52 is connected to the side wall of the first sub-portion 51 close to the first binding area 102, so that the size of the first edge sealing glue 50 along the first direction Y1 is larger, which can further improve the problem of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail. The second sub-portion 52 is also bonded to the side wall of the second substrate 20 close to the first binding area 102, so that the second sub-portion 52 wraps the side wall of the second substrate 20 close to the first binding area 102, that is, the second sub-portion 52 separates the side wall of the second substrate 20 close to the first binding area 102 from the air, which can reduce the risk of water vapor entering the dimming panel 100 from the side wall of the second substrate 20 close to the first binding area 102, reduce the risk of material aging in the dimming panel 100, and thus improve the service life of the dimming panel 100. The first direction Y1 is parallel to the first substrate 10 and perpendicular to the first edge sealing adhesive 50 .

[0144] In some embodiments, Figures 18A to 18H As shown, the dimming panel 100 further includes a first circuit board 60. The first circuit board 60 is located on a side of the first substrate 10 close to the second substrate 20, and the orthographic projection of the first circuit board 60 on the first substrate 10 is located in the first binding area 102, so that the first circuit board 60 and the first electrode layer 12 can be electrically connected.

[0145] In some embodiments, Figures 18A to 18H As shown, the dimming panel 100 also includes a first anisotropic conductive film 5 (Anisotropic Conductive Film, ACF for short), which is located between the first circuit board 60 and the first electrode layer 12 , and is used to bond the first circuit board 60 and the first electrode layer 12 .

[0146] In some embodiments, Figures 18A to 18HAs shown, the dimming panel 100 further includes a first protective glue 70. At least part of the first protective glue 70 is located between the first edge sealing glue 50 and the first circuit board 60, and is bonded to the first edge sealing glue 50 and the first circuit board 60. The first protective glue 70 can enhance the firmness of the first circuit board 60 and the first electrode layer 12. At the same time, the first protective glue 70 separates part of the first electrode layer 12 from the air, which can reduce the risk of oxidation of the first electrode layer 12, thereby increasing the service life of the first electrode layer 12. Exemplarily, the material of the first protective glue 70 includes ultraviolet glue.

[0147] Figures 18A to 18H The area formed by the first edge sealing glue 50, the first protective glue 70 and the first circuit board 60 covers the structural diagram of the first binding area 102. In some embodiments, as Figures 18A to 18H As shown, in the orthographic projection onto the first substrate 10, the area formed by the first edge sealing glue 50, the first protective glue 70 and the first circuit board 60 covers the first binding area 102. In this way, the first edge sealing glue 50, the first protective glue 70 and the first circuit board 60 work together to separate the first electrode layer 12 located in the first binding area 102 from the air, thereby reducing the risk of oxidation of the first electrode layer 12 located in the first binding area 102.

[0148] like FIG. 18A to FIG. 18D As shown, when the first edge-sealing glue 50 only includes the first sub-portion 51, the first protective glue 70 is also bonded to the side wall of the second substrate 20 close to the first binding area 102, so that the first protective glue 70 wraps the side wall of the second substrate 20 close to the first binding area 102, that is, the first protective glue 70 separates the side wall of the second substrate 20 close to the first binding area 102 from the air, which can improve the problem that water vapor in the air can enter the dimming panel 100 through the side wall of the second substrate 20 close to the first binding area 102 and cause the material aging in the dimming panel 100, and can reduce the risk of the dimming panel 100 failing due to the aging of the material in the dimming panel 100. In this way, the service life of the dimming panel 100 can be improved.

[0149] Fig.18A FIG. 1 is a structural diagram of a first substrate 10 having a first side wall 103 and a second substrate 20 having a second side wall 203. In some embodiments, as Fig.18AAs shown, the first substrate 10 has a first side wall 103, and the second substrate 20 has a second side wall 203, the second side wall 203 is substantially parallel to the first side wall 103, and the orthographic projection of the second side wall 203 on the first substrate 10 is spaced apart from the first side wall 103. The dimming panel 100 further includes a second edge sealing adhesive 80, and the second edge sealing adhesive 80 includes a third sub-portion 81 and a fourth sub-portion 82, the third sub-portion 81 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the second substrate 20 close to the second side wall 203. The third sub-portion 81 is used to separate the dye liquid crystal and the air, and the third sub-portion 81 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0150] like Fig.18A As shown, the fourth sub-portion 82 is arranged along the second side wall 203 and is bonded to the second side wall 203. In this way, the fourth sub-portion 82 wraps the second side wall 203, that is, the second sub-portion 52 separates the second side wall 203 from the air, which can reduce the risk of water vapor invading the dimming panel 100 from the second side wall 203, and reduce the risk of material aging in the dimming panel 100. In this way, the service life of the dimming panel 100 can be improved. The fourth sub-portion 82 is connected to the side wall of the third sub-portion 81 close to the fourth sub-portion 82. In this way, the size of the second edge sealing glue 80 along the second direction Y2 is larger, which can further improve the problem that water vapor in the air enters the dye liquid crystal layer 30 and causes the dimming panel 100 to fail. Among them, the second direction Y2 is parallel to the first substrate 10 and perpendicular to the second edge sealing glue 80.

[0151] like Fig.18A As shown, in the orthographic projection onto the first substrate 10, the fourth sub-portion 82 covers the area between the first side wall 103 and the second side wall 203. In this way, the fourth sub-portion 82 separates the first substrate 10 between the first side wall 103 and the second side wall 203 from the air, which can improve the problem of water vapor in the air entering the dimming panel 100 from the first substrate between the first side wall 103 and the second side wall 203, thereby causing aging of the materials in the dimming panel 100.

[0152] like Fig.18A As shown, in the case where the first substrate 10 includes a first underlayer 11 and a first electrode layer 12, the fourth sub-portion 82 separates the first electrode layer 12 between the first side wall 103 and the second side wall 203 from the air, which can improve the problem of the first electrode layer 12 being oxidized and causing the first electrode layer 12 to fail, reduce the risk of the dimming panel 100 failing due to the failure of the first electrode layer 12, and increase the service life of the dimming panel 100.

[0153] Fig.18B FIG. 1 is a structural diagram showing a first substrate 10 having a third side wall 104 and a second substrate 20 having a fourth side wall 204. Fig.21 As shown, the first substrate 10 has a third side wall 104, the second substrate 20 has a fourth side wall 204, the third side wall 104 is substantially parallel to the fourth side wall 204, and the orthographic projection of the third side wall 104 on the reference plane coincides with the orthographic projection of the fourth side wall 204 on the reference plane. The dimming panel 100 also includes a third edge-sealing adhesive 90, and the third edge-sealing adhesive 90 includes a fifth sub-portion 91, which is located between the first substrate 10 and the second substrate 20 and is arranged along the edge of the first substrate 10 close to the third side wall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal and the air, and the fifth sub-portion 91 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0154] Fig.18C FIG. 9 is a structural diagram of the third edge sealing adhesive 90 including a fifth sub-section 91 and a sixth sub-section 92. Fig.18C As shown, the third edge sealing glue 90 includes a fifth sub-portion 91 and a sixth sub-portion 92, and the fifth sub-portion 91 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the first substrate 10 close to the third side wall 104. The fifth sub-portion 91 is used to separate the dye liquid crystal and the air, and the fifth sub-portion 91 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail. The sixth sub-portion 92 is arranged along the third side wall 104 and the fourth side wall 204.

[0155] like Fig.18C As shown, the sixth sub-portion 92 is bonded to the third side wall 104, so that the sixth sub-portion 92 wraps the third side wall 104, that is, the sixth sub-portion 92 separates the third side wall 104 from the air, which can reduce the risk of water vapor invading the dimming panel 100 from the third side wall 104 and reduce the risk of material aging in the dimming panel 100.

[0156] The sixth sub-portion 92 is also bonded to the fourth side wall 204, that is, the sixth sub-portion 92 is bonded to the fourth side wall 204, so that the sixth sub-portion 92 wraps the fourth side wall 204, that is, the sixth sub-portion 92 separates the fourth side wall 204 from the air, which can reduce the risk of water vapor invading the dimming panel 100 from the fourth side wall 204, and reduce the risk of aging of the materials in the dimming panel 100. In this way, the service life of the dimming panel 100 is improved.

[0157] like Fig.18C As shown, the sixth sub-section 92 is also connected to the side wall of the fifth sub-section 91 close to the third side wall 104, so that the second edge-sealing glue 80 has a larger size along the third direction Y3, which can further improve the problem of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail, wherein the third direction Y3 is parallel to the first substrate 10 and perpendicular to the third edge-sealing glue 90.

[0158] Fig.18D The first substrate 10 has a fifth side wall 105, and the second substrate 20 has a sixth side wall 205. Fig.18D As shown, the first substrate 10 has a fifth side wall 105, and the second substrate 20 has a sixth side wall 205. The fifth side wall 105 is substantially parallel to the sixth side wall 205. In the orthographic projection to the first substrate 10, the fifth side wall 105, the sixth side wall 205 and part of the side wall of the dye liquid crystal layer 30 are substantially flush. The dimming panel 100 further includes a fourth edge-sealing adhesive 110, which is arranged along the fifth side wall 105, the sixth side wall 205 and along the edge of the first substrate 10 close to the fifth side wall 105. In this way, the fourth edge-sealing adhesive 110 is used to separate the dye liquid crystal and the air, and the fourth edge-sealing adhesive 110 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0159] The fourth edge-sealing adhesive 110 is bonded to the fifth side wall 105, so that the fourth edge-sealing adhesive 110 wraps the fifth side wall 105, that is, the fourth edge-sealing adhesive 110 separates the fifth side wall 105 from the air, which can reduce the risk of water vapor intruding the dimming panel 100 from the fifth side wall 105, and reduce the risk of material aging in the dimming panel 100. The fourth edge-sealing adhesive 110 is also bonded to the sixth side wall 205, so that the fourth edge-sealing adhesive 110 wraps the sixth side wall 205, that is, the fourth edge-sealing adhesive 110 separates the sixth side wall 205 from the air, which can reduce the risk of water vapor intruding the dimming panel 100 from the sixth side wall 205, and reduce the risk of material aging in the dimming panel 100.

[0160] In some embodiments, the second substrate 20 has a structure diagram of a second main area 201 and a second binding area 202. Fig.17 As shown, the second substrate 20 has a second main body area 201 and a second binding area 202, and the second binding is located on one side of the second main body area 201, for example, the second binding area 202 is located on the upper side, lower side, left side or right side of the second main body area 201. The orthographic projection of the first substrate 10 on the second substrate 20 is located in the second main body area 201 and does not overlap with the second binding area 202. The shape of the second substrate 20 can be the same as that of the first substrate 10.

[0161] The size of the second binding area 202 can be set according to actual conditions. For example, the shape of the second binding area 202 is rectangular, and the size of the second binding area 202 along the length direction of the second substrate 20 is equal to the length of the second substrate 20, or the size of the second binding area 202 along the width direction of the second substrate 20 is equal to the width of the second substrate 20. For example, the size of the second binding area 202 along the length direction of the second substrate 20 is smaller than the length of the second substrate 20, or the size of the second binding area 202 along the width direction of the second substrate 20 is smaller than the width of the second substrate 20.

[0162] like Fig.19 As shown, the dimming panel 100 also includes a fifth edge sealing glue 120, and the fifth edge sealing glue 120 includes a seventh sub-section 121 and an eighth sub-section 122. The seventh sub-section 121 is located between the first substrate 10 and the second substrate 20, and is arranged along the edge of the first substrate 10 close to the second binding area 202. In this way, the seventh sub-section 121 is used to separate the dye liquid crystal and the air. At the same time, the seventh sub-section 121 can also reduce the risk of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail.

[0163] like Fig.19 As shown, the orthographic projection of the eighth sub-portion 122 on the second substrate 20 is located in the second binding area 202, and the eighth sub-portion 122 is arranged along the second binding area 202 close to the edge of the second substrate 20, and is close to the side wall of the second binding area 202 with the seventh sub-portion 121, so that the size of the fifth edge-sealing glue 120 along the fourth direction Y4 is larger, which can further improve the problem of water vapor in the air entering the dye liquid crystal layer 30 and causing the dimming panel 100 to fail. Among them, the fourth direction Y4 is parallel to the first substrate 10, and perpendicular to the fifth edge-sealing glue 120.

[0164] like Fig.19 As shown, the eighth sub-portion 122 is bonded to the side wall of the first substrate 10 near the second binding area 202, so that the eighth sub-portion 122 wraps the side wall of the first substrate 10 near the second binding area 202, that is, the eighth sub-portion 122 separates the side wall of the first substrate 10 near the second binding area 202 from the air, which can reduce the risk of water vapor entering the dimming panel 100 from the side wall of the second binding area 202 and reduce the risk of material aging of the dimming panel 100.

[0165] In some embodiments, Fig.19 The dimming panel 100 also includes a second circuit board 130, as shown in FIG. Fig.19 As shown, the dimming panel 100 also includes a second circuit board 130, which is located on the side of the second substrate 20 close to the first substrate 10, and the part of the positive projection of the second circuit board 130 on the second substrate 20 is located in the second binding area 202, so that the second circuit board 130 can be bound to the second electrode layer 22.

[0166] In some embodiments, Fig.19 As shown, the dimming panel 100 also includes a second anisotropic conductive film 6 (Anisotropic Conductive Film, ACF for short), which is located between the second circuit board 130 and the second electrode layer 22 , and is used to bond the second circuit board 130 and the second electrode layer 22 .

[0167] In some embodiments, Fig.19 As shown, the dimming panel 100 also includes a second protective glue 140. At least part of the second protective glue 140 is located between the third edge sealing glue 90 and the second circuit board 130, and is bonded to the third edge sealing glue 90 and the second circuit board 130. The second protective glue 140 can enhance the firmness of the second circuit board 130 and the second electrode layer 22. At the same time, the second protective glue 140 separates part of the second electrode layer 22 from the air, which can reduce the risk of oxidation of the second electrode layer 22, thereby increasing the service life of the second electrode layer 22. The material of the second electrode layer 22 can be the same as that of the first electrode layer 12. For example, the material of the first electrode layer 12 includes ultraviolet glue.

[0168] In some embodiments, Fig.19 As shown, in the orthographic projection onto the second substrate 20, the area formed by the fifth edge sealant 120, the second protective sealant 140 and the second circuit board 130 covers the second binding area 202. In this way, the third edge sealant 90, the second protective sealant 140 and the second circuit board 130 work together to separate the second electrode layer 22 located in the second binding area 202 from the air, thereby reducing the risk of oxidation of the second electrode layer 22 located in the second binding area 202

[0169] In some embodiments, the relative positions of the first circuit board 60 and the second circuit board 130 can be set according to actual conditions.

[0170] For example, Fig.17 The first circuit board 60 and the second circuit board 130 are arranged on the same side. Fig.17 As shown, the first circuit board 60 and the second circuit board 130 are arranged on the same side, for example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the left side of the second main body area 201. For another example, the first circuit board 60 is located on the right side of the first main body area 101, and the second circuit board 130 is located on the right side of the second main body area 201. For another example, the first circuit board 60 is located on the upper side of the first main body area 101, and the second circuit board 130 is located on the upper side of the second main body area 201. For another example, the first circuit board 60 is located on the lower side of the first main body area 101, and the second circuit board 130 is located on the lower side of the second main body area 201. In this way, when the dimming panel 100 is rectangular, since the first circuit board 60 and the second circuit board 130 are only located on one side of the dimming panel 100, it is possible to realize the three-side narrow frame design of the dimming panel 100.

[0171] Or, for example, Fig. 20 The first circuit board 60 and the second circuit board 130 are arranged adjacent to each other. Fig. 20As shown, the first circuit board 60 and the second circuit board 130 are arranged adjacent to each other. The circuit board binding process is simple and the production efficiency is high. For example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the upper side or the lower side of the second main body area 201. For another example, the first circuit board 60 is located on the right side of the first main body area 101, and the second circuit board 130 is located on the upper side or the lower side of the second main body area 201.

[0172] Or, illustratively, Fig.21 FIG. 1 is a structural diagram of a first circuit board 60 and a second circuit board 130 arranged relative to each other. Fig.21 As shown, the first circuit board 60 and the second circuit board 130 are arranged opposite to each other. The circuit board binding process is simple and the production efficiency is high. For example, the first circuit board 60 is located on the left side of the first main body area 101, and the second circuit board 130 is located on the right side of the second main body area 201. For another example, the first circuit board 60 is located on the upper side of the first main body area 101, and the second circuit board 130 is located on the lower side of the second main body area 201.

[0173] In some embodiments, the first binding area 102 and the second binding area 202 can be set according to actual conditions, such as Fig. 22 As shown, the first binding area 102 is rectangular in shape, and the dimension of the first binding area 102 along the width direction of the first substrate 10 is smaller than the width of the first substrate 20. The second binding area 202 is rectangular in shape, and the dimension of the second binding area 202 along the width direction of the second substrate 20 is smaller than the width of the second substrate 20.

[0174] Fig.23 FIG. 2 is a structural diagram of a second substrate 21 having a through hole 2100. In some embodiments, as Fig.23 As shown, the second substrate 21 is provided with a through hole 2100, and the dimming panel 100 further includes a second circuit board 130, which is located on the side of the second substrate 20 away from the first substrate 10, and is at least partially electrically connected to the second electrode layer 22 through the through hole 2100. The orthographic projection of the through hole 2100 on the dye liquid crystal layer 30 is located in the dye liquid crystal layer 30, that is, the through hole 2100 will not reduce the area of ​​the dye liquid crystal layer 30, so that the area of ​​the dye liquid crystal layer 30 can be maximized to the greatest extent, that is, the dimming area of ​​the dimming panel 100 can be maximized to the greatest extent. Among them, the dimming area refers to the area in the dimming panel 100 where the transmittance can be adjusted. The second circuit board 130 is located on the side of the first electrode layer 12 away from the second electrode layer 22, that is, the second circuit board 130 will not occupy the edge area between the first electrode layer 12 and the second electrode layer 22, which is useful for realizing the narrow frame design of the dimming panel 100.

[0175] In some embodiments, Fig.18AAs shown, the spacer 40 is disposed on the first substrate 10 , and the orthographic projection of the spacer 40 on the plane where the second substrate 20 is located is at least partially located outside the second substrate 20 .

[0176] Exemplarily, at least one spacer 40 is located in the first binding area 102. Thus, when the first protective adhesive 70 is formed in the first binding area 102, at least one spacer 40 is located in the first protective adhesive 70, which is sufficient to increase the contact area of ​​the first protective adhesive 70, thereby reducing the risk of the first protective adhesive 70 falling off from the first binding area 102.

[0177] Exemplarily, at least one spacer 40 is located in the first binding area 102. In this way, when the first edge sealing adhesive 50 is formed in the first binding area 102, at least one spacer 40 is located in the first edge sealing adhesive 50, which is enough to increase the contact area of ​​the first edge sealing adhesive 50, thereby reducing the risk of the first edge sealing adhesive 50 falling off from the first binding area 102.

[0178] In some embodiments, the embodiments of the present disclosure further provide a dimming structure, the dimming structure includes a dimming panel 100, and the dimming structure includes one of a skylight, a curtain wall, a rail transportation vehicle, a car, and a billboard.

[0179] The dimming panel 100 can be used in the construction field. For example, the dimming panel 100 is used in a skylight or a curtain wall. The dimming panel 100 can be used in partition glass. Compared with the brick wall in the related art, the dimming panel 100 is thinner. The dimming panel 100 can save space, and the company logo can be displayed on the partition glass.

[0180] The dimming panel 100 can also be applied to the field of transportation, for example, the dimming panel 100 is applied to rail transportation vehicles or cars. Rail transportation vehicles can include subways, light rails, aerial rail trains, trams, and maglev trains, which are not listed one by one in the embodiments of the present disclosure. Cars can include passenger cars, commercial vehicles, trucks, or buses, which are not listed one by one in the embodiments of the present disclosure.

[0181] Fig.24 is the structural diagram of the car. Fig.24 As shown, the automobile 1000 includes a body 1010 and a window glass 1020 installed on the body 1010. The window glass 1020 can be one or more of the front window glass, sunroof glass, rear window glass or side window glass of the automobile. The window glass 1020 includes the dimming panel 100 of any of the above embodiments. The dimming panel 100 can also be applied to the central control touch screen in the automobile 1000.

[0182] The dimming panel 100 may also be applied in the field of advertising. For example, the dimming panel 100 may be applied in billboards.

[0183] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0184] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A method for preparing a dimming panel, characterized in that: include: Prepare dimming panel motherboard; The dimming panel motherboard includes a first substrate motherboard, a second substrate motherboard, a dye liquid crystal layer and a sealing glue; The first substrate motherboard and the second substrate motherboard are arranged opposite to each other; the dye liquid crystal layer is located between the first substrate motherboard and the second substrate motherboard; the frame sealant is located between the first substrate motherboard and the second substrate motherboard and surrounds the dye liquid crystal layer; The dimming panel motherboard is cut to form an initial dimming panel; the initial dimming panel comprises a first transition plate and a second transition plate, the orthographic projection of the second transition plate on a reference plane coincides with the orthographic projection of the first transition plate on the reference plane, and at least a portion of the side wall of the first transition plate is flush with at least a portion of the side wall of the dye liquid crystal layer; the reference plane is parallel to a surface of the first substrate motherboard close to the dye liquid crystal layer; The second transition plate is cut along a first cutting line to form a second substrate, wherein the second substrate exposes a first region of the first transition plate, and the first region forms a first binding region; the dye liquid crystal layer is located between the first transition plate and the second substrate; A first edge-sealing adhesive is formed along the first cutting line; the first edge-sealing adhesive includes a first sub-portion, the first sub-portion is located between the first transition plate and the second substrate, and is arranged along the edge of the second substrate close to the first binding area.

2. The preparation method according to claim 1, characterized in that: The orthographic projection of the first cutting line on the reference surface is located in the orthographic projection of the frame sealing glue on the reference surface.

3. The preparation method according to claim 2, characterized in that: The forming of a first edge sealing glue along the first cutting line comprises: A portion of the frame sealant located on a side of the first cutting line away from the dye liquid crystal layer is removed along the first cutting line, and a portion of the frame sealant located on a side of the first cutting line and the dye liquid crystal layer forms the first sub-portion.

4. The preparation method according to claim 1, characterized in that: The orthographic projection of the first cutting line on the reference plane is located in the orthographic projection of the dye liquid crystal layer on the reference plane.

5. The preparation method according to claim 4, characterized in that: The forming of a first edge sealing glue along the first cutting line comprises: Glue is applied to form a first edge-sealing glue; the glue portion is located between the dye liquid crystal layer and the first cutting line to form a first sub-portion; the first edge-sealing glue also includes a second sub-portion, the glue portion is located in the first binding area, and extends along the side wall of the second substrate close to the first binding area to form a second sub-portion; wherein the second sub-portion is connected to the first sub-portion.

6. The preparation method according to any one of claims 1 to 5, characterized in that After forming the first edge sealing glue along the first cutting line, the preparation method further includes: The first circuit board is bound to the first binding area of ​​the first transition plate; and there is a gap between the first circuit board and the first edge sealing adhesive.

7. The preparation method according to claim 6, characterized in that: After the first binding area of ​​the first transition plate is bound to the first circuit board, the preparation method further includes: A first protective adhesive is formed between the first circuit board and the first edge sealing adhesive; the first protective adhesive is bonded to the first edge sealing adhesive and the first circuit board, the first protective adhesive also covers a second area, and an area of ​​the first binding area exposed by the first circuit board and the first edge sealing adhesive forms the second area.

8. The preparation method according to claim 1, characterized in that: The step of cutting the dimming panel motherboard to form an initial dimming panel comprises: Using a press to press the dimming panel motherboard; The dimming panel motherboard is cut along a second cutting line to form an initial dimming panel; and a gap is formed between the pressing tool and the second cutting line.

9. The preparation method according to claim 8, characterized in that: In the process of cutting the second transition plate to form the second substrate, the second transition plate is cut along the outer boundary of the press, and the second substrate also exposes a third area of ​​the first transition plate, wherein the width of the third area is smaller than the width of the first area; The second substrate has a second side wall, the first transition plate has a first side wall, the second side wall is substantially parallel to the first side wall, and an orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a second edge-sealing glue, wherein the glue portion is located between the dye liquid crystal layer and the second side wall to form a third sub-portion, and the glue portion is located in the third area and extends along the second side wall to form a fourth sub-portion, wherein the fourth sub-portion is bonded to the second side wall and connected to the third sub-portion, and in the orthographic projection to the first transition plate, the fourth sub-portion covers the third area.

10. The preparation method according to claim 8 or 9, characterized in that: The second substrate has a fourth side wall, the first substrate motherboard has a third side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the third side wall on the reference plane coincides with the orthographic projection of the fourth side wall on the reference plane; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a third edge-sealing glue, wherein the glue portion is located between the dye liquid crystal layer and the third side wall to form a fifth sub-portion, and the glue portion extends along the third side wall and the fourth side wall to form a sixth sub-portion, wherein the sixth sub-portion is bonded to the third side wall and the fourth side wall, and connected to the fifth sub-portion.

11. The preparation method according to claim 1, characterized in that: The step of cutting the dimming panel motherboard to form an initial dimming panel comprises: The dimming panel motherboard is cut along the third cutting line to form a first dimming panel; the first dimming panel has a panel area and a liquid leakage area, the liquid leakage area is at least located on one side of the panel area, and in the liquid leakage area, there is no dye liquid crystal layer and frame sealing glue between the first substrate motherboard and the second substrate; The first dimming panel is cut along a fourth cutting line to form the initial dimming panel; the fourth cutting line is located in the panel area.

12. The preparation method according to claim 11, characterized in that: The first substrate motherboard has a fifth side wall, the second substrate has a sixth side wall, the fifth side wall is substantially parallel to the sixth side wall, and in an orthographic projection onto the first substrate motherboard, the fifth side wall, the sixth side wall and a part of the side wall of the dye liquid crystal layer are substantially flush; In the process of forming the first edge sealing glue, the preparation method further comprises: The glue is applied to form a fourth edge-sealing glue, and the glue extends along the fifth side wall, the sixth side wall and the side wall of the dye liquid crystal layer to form the fourth edge-sealing glue, and is bonded to the fifth side wall and the sixth side wall.

13. The preparation method according to any one of claims 1 to 12, characterized in that: The dimming panel motherboard further includes a plurality of spacers, and the plurality of spacers are located between the first substrate motherboard and the second substrate motherboard; Wherein, preparing the dimming panel motherboard includes: forming an initial support layer on the first substrate motherboard; Direct-write exposure of the initial support layer using a digital mask; The initial support layer is developed, cleaned, and cured to form a plurality of spacers.

14. A dimming panel, characterized in that: include: A first substrate and a second substrate arranged opposite to each other; The first substrate has a first binding area, and the orthographic projection of the second substrate on the first substrate does not overlap with the first binding area; A dye liquid crystal layer, located between the first substrate and the second substrate; A plurality of spacers, located between the first substrate and the second substrate; The first edge sealing adhesive comprises a first sub-portion, wherein the first sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the second substrate close to the first binding area.

15. The dimming panel according to claim 14, characterized in that: The first edge sealing glue also includes a second sub-portion, the orthographic projection of the second sub-portion on the first substrate is located in the first binding area, the second sub-portion is arranged along the edge of the first binding area close to the second substrate, and is connected to the side wall of the first sub-portion close to the first binding area, and the second substrate is bonded to the side wall close to the first binding area.

16. The dimming panel according to claim 14 or 15, characterized in that: Also includes: A first circuit board, a portion of an orthographic projection on the first substrate is located in the first binding area; A first protective adhesive, at least a portion of which is located between the first edge sealing adhesive and the first circuit board, and is bonded to the first edge sealing adhesive and the first circuit board.

17. The dimming panel according to claim 16, characterized in that: In an orthographic projection onto the first substrate, an area formed by the first edge sealing adhesive, the first protective adhesive, and the first circuit board covers the first binding area.

18. The dimming panel according to claim 14, characterized in that: The first substrate has a first side wall, the second substrate has a second side wall, the second side wall is substantially parallel to the first side wall, and an orthographic projection of the second side wall on the first substrate is spaced apart from the first side wall; The dimming panel also includes: The second edge sealing adhesive comprises a third sub-section and a fourth sub-section, wherein the third sub-section is located between the first substrate and the second substrate and is arranged along the edge of the second substrate close to the second side wall; the fourth sub-section is arranged along the second side wall and is bonded to the second side wall and connected to the side wall of the third sub-section close to the fourth sub-section; Wherein, in the orthographic projection onto the first substrate, the fourth sub-portion covers the area between the first side wall and the second side wall.

19. The dimming panel according to claim 14, characterized in that: The first substrate has a third side wall, the second substrate has a fourth side wall, the third side wall is substantially parallel to the fourth side wall, and the orthographic projection of the third side wall on the reference plane coincides with the orthographic projection of the fourth side wall on the reference plane; The dimming panel also includes: The third edge sealing adhesive comprises a fifth sub-portion, wherein the fifth sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the first substrate close to the third side wall.

20. The dimming panel according to claim 19, characterized in that: The second edge sealing adhesive further includes a sixth sub-portion, which is disposed along the third side wall and the fourth side wall and is bonded to the third side wall, the fourth side wall and the side wall of the fifth sub-portion close to the third side wall.

21. The dimming panel according to claim 14, characterized in that: The second substrate has a second binding area, and the orthographic projection of the first substrate on the second substrate does not overlap with the second binding area; The dimming panel also includes: a fifth edge-sealing adhesive, comprising a seventh sub-portion and an eighth sub-portion, wherein the seventh sub-portion is located between the first substrate and the second substrate and is arranged along an edge of the first substrate close to the second binding region, an orthographic projection of the eighth sub-portion on the second substrate is located in the second binding region, the eighth sub-portion is arranged along an edge of the second binding region close to the second substrate, and is connected to a side wall of the seventh sub-portion close to the second binding region, and is bonded to a side wall of the second substrate close to the second binding region; The second circuit board has an orthographic projection on the second substrate located in the second binding area.

22. The dimming panel according to claim 21, characterized in that: Also includes: A second protective adhesive, at least a portion of which is located between the fifth edge-sealing adhesive and the second circuit board, and is bonded to the fifth edge-sealing adhesive and the second circuit board.

23. The dimming panel according to claim 22, characterized in that: In the orthographic projection onto the second substrate, the area formed by the fifth edge sealing adhesive, the second protective adhesive and the second circuit board covers the second binding area.

24. The dimming panel according to claim 14, characterized in that: The second substrate comprises: A second substrate having a through hole; A second electrode layer is located on a side of the second substrate close to the dye liquid crystal layer, and the second electrode layer covers the second substrate; The dimming panel also includes: The second circuit board is located at a side of the second substrate away from the first substrate and is at least partially electrically connected to the second electrode layer through the through hole.

25. The dimming panel according to claim 14, characterized in that: The spacer is disposed on the first substrate, and an orthographic projection of the spacer on the plane where the second substrate is located is at least partially located outside the second substrate.

26. The dimming panel according to claim 25, characterized in that: At least one spacer is located in the first binding area.

27. A dimming structure, characterized in that: It comprises a dimming panel as described in any one of claims 14 to 26; the dimming structure comprises at least one of a curtain wall, a skylight, a rail transportation vehicle and a passenger car.

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