Wafer measurement positioning method, electronic device and readable storage medium

Abstract

The present invention provides a wafer measurement positioning method, electronic device and readable storage medium, the method comprising: aligning a wafer to be measured with a measurement machine; dividing the wafer to be measured into multiple chip areas according to a preset chip size; using a chip area that meets a preset measurement condition in the multiple chip areas as a target chip area; for each target chip area, determining the position information of multiple characteristic marking points in the target chip area; for each target chip area, locating the measurement point in the target chip area according to the position information of at least one characteristic marking point in the target chip area. The present invention can realize the measurement of all measurement points that meet the conditions on the wafer, and effectively improve the accuracy and stability of wafer measurement.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer measurement and positioning method, electronic equipment and a readable storage medium. Background Art

[0002] With the development of integrated circuit (IC) manufacturing technology, the diameter of the wafer has reached more than 300mm, and the characteristic line width has reached less than 45nm, so the uniformity of the global planarization of the wafer is increasingly required. After each chemical mechanical polishing planarization process, the global uniformity of the wafer needs to be measured, that is, the film thickness at each point on the wafer needs to be measured using a measuring machine.

[0003] Most measurement machines require fixed-point measurement on the wafer, but the wafer measurement positioning method in the prior art cannot measure incomplete chip areas.

[0004] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a wafer measurement and positioning method, an electronic device and a readable storage medium, which can realize the measurement of all measurement points that meet the conditions on the wafer and effectively improve the accuracy and stability of wafer measurement.

[0006] To achieve the above-mentioned purpose, the present invention provides a wafer measurement and positioning method, which comprises: aligning a wafer to be measured with a measurement machine; dividing the wafer to be measured into multiple chip areas according to a preset chip size; taking a chip area among the multiple chip areas that meets a preset measurement condition as a target chip area; for each of the target chip areas, determining the position information of multiple characteristic mark points in the target chip area; for each of the target chip areas, positioning the measurement point in the target chip area according to the position information of at least one characteristic mark point in the target chip area.

[0007] Optionally, the aligning the wafer to be tested with the measuring machine includes: placing the wafer to be tested on the measuring machine; roughly positioning the wafer to be tested according to a notch and multiple edge points on the wafer to be tested; determining an offset of the measuring machine relative to the wafer to be tested according to at least two alignment figures on the wafer to be tested; and controlling the measuring machine to rotate according to the offset so that the wafer to be tested is aligned with the measuring machine.

[0008] Optionally, the feature marking points are corner points of the target chip area.

[0009] Optionally, for each of the target chip areas, the position information of multiple feature mark points in the target chip area is determined, including: for each feature mark point in each of the target chip areas: according to the position information of the feature mark point relative to the center of the wafer to be measured and the position information of the center of the wafer to be measured on the measuring machine, the position information of the feature mark point on the measuring machine is determined; according to the position information of the measuring machine relative to the measuring instrument and the position information of the feature mark point on the measuring machine, the position information of the feature mark point relative to the measuring instrument is determined.

[0010] Optionally, for each of the target chip areas, the measurement points in the target chip area are positioned according to the position information of at least one characteristic marking point in the target chip area, including: for each of the target chip areas: taking the characteristic marking points in the target chip area located in the wafer to be measured as target characteristic marking points; and positioning the measurement points in the target chip area according to the position information of at least one target characteristic marking point in the target chip area relative to the measuring instrument.

[0011] Optionally, the positioning of the measurement point in the target chip area according to the position information of at least one target feature marker point in the target chip area relative to the measuring instrument includes: for each target feature marker point in the target chip area, determining the target moving distance of the measuring machine according to the position information of the target feature marker point relative to the measuring instrument; using the target feature marker point that makes the target moving distance of the measuring machine the shortest as the positioning feature marker point of the target chip area, and positioning the measurement point in the target chip area according to the positioning feature marker point.

[0012] Optionally, locating the measurement point in the target chip area according to the positioning feature mark point includes: controlling the measuring machine to move a corresponding distance according to the position information of the positioning feature mark point relative to the measuring instrument, so as to move the positioning feature mark point to directly below the measuring instrument; acquiring an actual image at the positioning feature mark point; comparing the actual image at the positioning feature mark point with a corresponding standard image; if the matching score between the actual image at the positioning feature mark point and the corresponding standard image is equal to or higher than a preset matching score, then controlling the measuring machine to move a corresponding distance according to the position information of the measurement point in the target chip area relative to the positioning feature mark point, so as to move the measurement point to directly below the measuring instrument.

[0013] Optionally, the positioning of the measurement point in the target chip area according to the positioning feature marking point also includes: if the matching score between the actual image at the positioning feature marking point and the corresponding standard image is lower than a preset matching score, then the target feature marking point among the remaining target feature marking points in the target chip area that makes the target moving distance of the measuring machine the shortest is used as a new positioning feature marking point for the target chip area.

[0014] To achieve the above object, the present invention further provides an electronic device, including a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the wafer measurement and positioning method described above is implemented.

[0015] To achieve the above object, the present invention further provides a readable storage medium, wherein the readable storage medium stores a computer program, and when the computer program is executed by a processor, the wafer measurement and positioning method described above is implemented.

[0016] Compared with the prior art, the wafer measurement and positioning method, electronic device and readable storage medium provided by the present invention have the following beneficial effects: the wafer measurement and positioning method provided by the present invention first aligns the wafer to be measured with the measurement machine, and then divides the wafer to be measured into multiple chip areas according to the preset chip size, and then uses the chip area that meets the preset measurement conditions in the multiple chip areas as the target chip area, and then for each of the target chip areas, determines the position information of multiple characteristic mark points in the target chip area, and finally for each of the target chip areas, locates the measurement point in the target chip area according to the position information of at least one characteristic mark point in the target chip area, thereby for each target chip area to be measured, the measurement point in the target chip area can be accurately located according to the position information of at least one characteristic mark point in the target area. It can be seen that by adopting the wafer measurement and positioning method provided by the present invention, all the measurement points that meet the conditions on the wafer to be measured can be measured, and the measurement failure will not be caused by incomplete chip areas, thereby effectively improving the accuracy and stability of wafer measurement. In addition, the wafer measurement and positioning method provided by the present invention can achieve accurate positioning of the wafer to be measured by first aligning the wafer to be measured with the measurement machine, thereby effectively ensuring the accuracy of the subsequent measurement point positioning. In addition, the wafer measurement and positioning method provided by the present invention can further improve the accuracy and precision of the measurement point positioning on the wafer by positioning the measurement point in the target chip area according to the position information of at least one characteristic mark point in the target chip area for each target chip area.

[0017] Since the electronic device and the readable storage medium provided by the present invention belong to the same inventive concept as the wafer measurement and positioning method provided by the present invention, the electronic device and the readable storage medium provided by the present invention at least have all the beneficial effects of the wafer measurement and positioning method provided by the present invention. Therefore, for the beneficial effects of the electronic device and the readable storage medium provided by the present invention, reference can be made to the relevant description of the beneficial effects of the wafer measurement and positioning method provided by the present invention in the above text, and they will not be repeated here one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The present invention provides a flowchart of a wafer measurement and positioning method according to an embodiment of the present invention.

[0019] Figure 2 A schematic diagram of chip area division provided for a specific example of the present invention.

[0020] Figure 3 A schematic diagram of an alignment pattern provided for a specific example of the present invention.

[0021] Figure 4 A schematic diagram of characteristic marking points provided in one embodiment of the present invention.

[0022] Figure 5 A schematic diagram of target feature marking points provided by one embodiment of the present invention.

[0023] Figure 6 A schematic diagram of positioning measurement points based on target feature marker points provided in one embodiment of the present invention.

[0024] Figure 7 A schematic diagram of the block structure of an electronic device provided in one embodiment of the present invention.

[0025] The reference numerals are described as follows: wafer to be tested 100 ; notch 110 ; alignment pattern 120 ; chip area 130 ; measurement point 131 ; processor 210 ; communication interface 220 ; memory 230 ; communication bus 240 . DETAILED DESCRIPTION

[0026] The wafer measurement and positioning method, electronic device and readable storage medium proposed in the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Any modification of the structure, change in the proportional relationship or adjustment of the size, under the condition that the effect that can be produced by the present invention and the purpose that can be achieved are the same or similar, should still fall within the scope of the technical content disclosed by the present invention.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements defined by the statement "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. The singular forms "a", "an" and "the" include plural objects, the term "or" is generally used in a sense including "and / or", the term "several" is generally used in a sense including "at least one", and the term "at least two" is generally used in a sense including "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and are not to be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features.

[0028] In addition, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0029] The core idea of ​​the present invention is to provide a wafer measurement and positioning method, an electronic device and a readable storage medium, which can realize the measurement of all measurement points that meet the conditions on the wafer and effectively improve the accuracy and stability of wafer measurement and positioning.

[0030] It should be noted that the wafer measurement and positioning method provided by the present invention can be applied to the electronic device provided by the present invention, and the electronic device can be used to control a measurement machine, wherein the electronic device can be a hardware device with various operating systems.

[0031] To realize the above idea, the present invention provides a wafer measurement positioning method, please refer to Figure 1 , which is a flow chart of a wafer measurement and positioning method provided by one embodiment of the present invention. Figure 1 As shown, the wafer measurement and positioning method provided by the present invention includes the following steps: step S100: aligning the wafer 100 to be measured with the measurement machine; step S200: dividing the wafer 100 to be measured into a plurality of chip areas 130 according to a preset chip size; step S300: taking the chip area 130 that meets the preset measurement conditions among the plurality of chip areas 130 as the target chip area; step S400: for each of the target chip areas, determining the position information of a plurality of characteristic marking points in the target chip area;

[0032] Step S500: For each target chip region, locate the measurement point 131 in the target chip region according to the position information of at least one characteristic mark point in the target chip region.

[0033] Therefore, by adopting the wafer measurement and positioning method provided by the present invention, for each target chip area to be measured, the measurement point 131 in the target chip area can be accurately positioned according to the position information of at least one characteristic mark point in the target area. It can be seen that by adopting the wafer measurement and positioning method provided by the present invention, all the measurement points 131 that meet the conditions on the wafer 100 to be measured can be measured, and the measurement failure will not be caused by an incomplete chip area (partial die), thereby effectively improving the accuracy and stability of wafer measurement. In addition, the wafer measurement and positioning method provided by the present invention can achieve accurate positioning of the wafer 100 to be measured by first aligning the wafer 100 to be measured with the measuring machine, thereby effectively ensuring the accuracy of the subsequent positioning of the measurement point 131.

[0034] Please continue to refer to Figure 2 , which is a schematic diagram of chip area division provided by a specific example of the present invention. Figure 2 As shown, each grid located on the wafer 100 to be tested represents a chip area 130, wherein a grid completely located in the wafer 100 to be tested represents a complete chip area, and a grid partially located in the wafer 100 to be tested represents an incomplete chip area.

[0035] In some exemplary embodiments, the alignment of the wafer 100 to be tested and the measuring machine includes: placing the wafer 100 to be tested on the measuring machine; roughly positioning the wafer 100 to be tested according to the notch 110 and multiple edge points on the wafer 100 to be tested; determining the offset of the measuring machine relative to the wafer 100 to be tested according to at least two alignment figures 120 on the wafer 100 to be tested; and controlling the measuring machine to rotate according to the offset so that the wafer 100 to be tested is aligned with the measuring machine.

[0036] Therefore, the position information of the center of the wafer 100 to be tested can be determined according to the position information of the notch 110 and multiple edge points on the wafer 100 to be tested, so that the rough positioning of the wafer 100 to be tested can be achieved; the offset of the alignment figure 120 can be determined according to the actual position of the alignment figure 120 on the wafer 100 to be tested on the measuring machine and the standard position of the alignment figure 120 on the measuring machine, so that the offset of the measuring machine relative to the wafer 100 to be tested can be determined according to the offset of at least two alignment figures 120, and the alignment between the wafer 100 to be tested and the measuring machine can be achieved by controlling the measuring machine to rotate according to the offset of the measuring machine relative to the wafer 100 to be tested.

[0037] It should be noted that, as can be understood by those skilled in the art, the present invention does not limit the specific graphic structure of the alignment pattern 120. For example, the alignment pattern 120 may be: Figure 3 It should also be noted that, as can be understood by those skilled in the art, the wafer 100 to be tested can be roughly positioned according to the notch 110 on the wafer 100 to be tested and 3 to 4 points on the edge of the wafer (i.e., 3 to 4 edge points), and the wafer 100 to be tested can be precisely positioned according to the 2 to 3 alignment patterns 120 on the wafer 100 to achieve alignment between the wafer 100 to be tested and the measuring machine.

[0038] In some exemplary embodiments, the offset of the measuring platform relative to the wafer 100 to be measured is determined according to two alignment patterns 120 on the wafer 100 to be measured that are located on the same horizontal line.

[0039] Therefore, by selecting two alignment figures 120 located on the same horizontal line on the wafer 100 to be tested, the offset of the measuring platform relative to the wafer 100 to be tested can be quickly and accurately determined, thereby effectively improving the alignment accuracy and efficiency between the wafer 100 to be tested and the measuring platform.

[0040] In some exemplary embodiments, the characteristic marking points are the corner points of the target chip region. Since the corner points of the target chip region are easy to identify, the position information is easier to determine, and no matter whether the target chip region is complete or incomplete, at least one corner point of the target chip region is located within the wafer 100 to be tested, thus selecting the four corner points of the target chip region as characteristic marking points can help further improve the positioning accuracy of the wafer measurement positioning method provided by the present invention.

[0041] Please continue to refer to Figure 4 , which is a schematic diagram of a characteristic marking point provided by an embodiment of the present invention. Figure 4 As shown, points A1, B1, C1 and D1 in the figure represent the four corner points (feature marking points) of the target chip area.

[0042] It should be noted that, as those skilled in the art can understand, the characteristic marking point can be not only the corner point of the target chip area, but also any special graphic part with clear edges and corners and easy to identify in the target chip area, or a graphic part with obvious color difference from the graphic at the measurement point 131, and the present invention is not limited to this.

[0043] In some exemplary embodiments, for each of the target chip areas, the position information of multiple feature mark points in the target chip area is determined, including: for each feature mark point in each of the target chip areas: according to the position information of the feature mark point relative to the center of the wafer 100 to be tested and the position information of the center of the wafer 100 to be tested on the measuring machine, the position information of the feature mark point on the measuring machine is determined; according to the position information of the measuring machine relative to the measuring instrument and the position information of the feature mark point on the measuring machine, the position information of the feature mark point relative to the measuring instrument is determined.

[0044] Therefore, for each of the characteristic mark points, the position information of the characteristic mark point on the measuring machine can be determined according to the position information of the characteristic mark point relative to the center of the wafer 100 to be tested and the position information of the center of the wafer 100 to be tested on the measuring machine. The position information of the characteristic mark point relative to the measuring instrument can be determined according to the position information of the measuring machine relative to the measuring instrument and the position information of the characteristic mark point on the measuring machine. Therefore, according to the position information of the characteristic mark point relative to the measuring instrument, it can be determined how far the measuring machine needs to move to move the characteristic mark point to be directly below the measuring instrument.

[0045] In some exemplary embodiments, for each of the target chip areas, the measurement point 131 in the target chip area is positioned according to the position information of at least one characteristic mark point in the target chip area, including: for each of the target chip areas: taking the characteristic mark point in the target chip area located in the wafer to be measured 100 as the target characteristic mark point; positioning the measurement point 131 in the target chip area according to the position information of at least one target characteristic mark point in the target chip area relative to the measuring instrument.

[0046] Therefore, for each of the target chip areas, by taking the characteristic mark points in the target chip area located in the wafer 100 to be tested as target characteristic mark points, and locating the measurement point 131 in the target chip area according to the position information of at least one target characteristic mark point in the target chip area relative to the measuring instrument, not only can the positioning accuracy of the measuring machine be further improved, but also the coverage capability of the measuring machine for wafer differences can be effectively increased.

[0047] Please continue to refer to Figure 5 , which is a schematic diagram of a target feature marker point provided by an embodiment of the present invention. Figure 5As shown, since the characteristic marking points A2 and D2 in the figure are located outside the wafer, and the characteristic marking points B2 and C2 are located inside the wafer, the characteristic marking points B2 and C2 are used as target characteristic marking points.

[0048] It should be noted that, as can be understood by those skilled in the art, for each characteristic mark point, if the distance between the characteristic mark point and the center of the wafer 100 to be tested is greater than the radius of the wafer 100 to be tested, then the characteristic mark point is determined to be located outside the wafer; if the distance between the characteristic mark point and the center of the wafer 100 to be tested is less than the radius of the wafer 100 to be tested, then the characteristic mark point is determined to be located inside the wafer.

[0049] In some exemplary embodiments, the measuring point 131 in the target chip area is positioned according to the position information of at least one target feature marker point in the target chip area relative to the measuring instrument, including: for each target feature marker point in the target chip area, determining the target moving distance of the measuring machine according to the position information of the target feature marker point relative to the measuring instrument; using the target feature marker point that makes the target moving distance of the measuring machine the shortest as the positioning feature marker point of the target chip area, and positioning the measurement point 131 in the target chip area according to the positioning feature marker point.

[0050] Therefore, by selecting the target characteristic mark point that makes the target moving distance of the measuring machine shortest as the positioning characteristic mark point for positioning the measurement point 131 in the target chip area, the moving distance of the measuring machine can be shortened, and the wafer measurement speed can be effectively improved, thereby facilitating the rapid completion of the measurement of all measurement points 131 on the wafer 100 to be measured.

[0051] In some exemplary embodiments, the positioning of the measurement point 131 in the target chip area according to the positioning feature mark point includes: controlling the measurement machine to move a corresponding distance according to the position information of the positioning feature mark point relative to the measuring instrument, so as to move the positioning feature mark point to directly below the measuring instrument; acquiring an actual image at the positioning feature mark point; comparing the actual image at the positioning feature mark point with a corresponding standard image; if the matching score between the actual image at the positioning feature mark point and the corresponding standard image is equal to or higher than a preset matching score, then controlling the measurement machine to move a corresponding distance according to the position information of the measurement point 131 in the target chip area relative to the positioning feature mark point, so as to move the measurement point 131 to directly below the measuring instrument.

[0052] Therefore, by first moving the positioning feature mark point to directly below the measuring instrument according to the position information of the positioning feature mark point relative to the measuring instrument, and then obtaining the actual image at the positioning feature mark point and comparing the actual image at the positioning feature mark point with the corresponding standard image, if the matching score between the actual image at the positioning feature mark point and the corresponding standard image (that is, the standard image at the positioning feature mark point) is equal to or higher than the preset matching score, it indicates that the positioning of the positioning feature mark point is accurate, so that the position of the measurement point 131 can be accurately located directly according to the positioning feature mark point, that is, through the position information of the measurement point 131 in the target chip area relative to the positioning feature mark point, the measurement point 131 in the target chip area can be accurately moved to directly below the measuring instrument, thereby further ensuring the accuracy of wafer measurement and positioning.

[0053] In some exemplary embodiments, the positioning of the measurement point 131 in the target chip area according to the positioning feature marker point also includes: if the matching score between the actual image at the positioning feature marker point and the corresponding standard image is lower than a preset matching score, then the target feature marker point among the remaining target feature marker points in the target chip area that results in the shortest target moving distance of the measuring machine is used as a new positioning feature marker point for the target chip area.

[0054] Since if the matching score between the actual image at the positioning feature mark point and the corresponding standard image is lower than the preset matching score, it indicates that the positioning of the positioning feature mark point is inaccurate. Therefore, when the matching score between the actual image at the positioning feature mark point and the corresponding standard image is lower than the preset matching score, the target feature mark point that makes the target moving distance of the measuring machine shortest among the remaining target feature mark points of the target chip area is used as the new positioning feature mark point of the target chip area, so that the measuring point 131 in the target chip area can be re-positioned according to the new positioning feature mark point, so as to further ensure that the measuring point 131 in the target chip area can be accurately moved to the bottom of the measuring instrument, thereby further ensuring the accuracy of wafer measurement positioning. In addition, since the target feature mark point that makes the target moving distance of the measuring machine shortest among the remaining target feature mark points of the target chip area is used as the new positioning feature mark point of the target chip area, it can help shorten the moving distance of the measuring machine, effectively improve the wafer measurement speed, and facilitate the rapid completion of the measurement of all measurement points 131 on the wafer 100 to be measured.

[0055] It should be noted that, as can be understood by those skilled in the art, after the measuring platform is controlled to move a corresponding distance according to the position information of the new positioning feature mark point relative to the measuring instrument to move the new positioning feature mark point to directly below the measuring instrument, if the matching score between the actual image at the new positioning feature mark point and the corresponding standard image is equal to or higher than the preset matching score, then according to the position information of the measuring point 131 in the target chip area relative to the new positioning feature mark point, the measuring platform is controlled to move a corresponding distance to move the measuring point 131 to directly below the measuring instrument; if the matching score between the actual image at the new positioning feature mark point and the corresponding standard image is equal to or higher than the preset matching score, If the matching score of the target feature marker point is lower than the preset matching score, the target feature marker point that makes the target moving distance of the measuring machine shortest among the remaining target feature marker points (except the target feature marker points that have been used as the positioning feature marker points) of the target chip area continues to be used as the new positioning feature marker point of the target chip area, and the above steps are repeated until the matching score between the actual image at the new positioning feature marker point and the corresponding standard image is equal to or higher than the preset matching score, then according to the position information of the measurement point 131 in the target chip area relative to the new positioning feature marker point, the measuring machine is controlled to move the corresponding distance to move the measurement point 131 to be directly below the measuring instrument.

[0056] Please continue to refer to Figure 6 , which is a schematic diagram of the principle of positioning the measurement point based on the target feature mark point provided by one embodiment of the present invention. Figure 6As shown, if the target feature marking point A1 is the final positioning feature marking point, then according to the position information (X5-X1, Y5-Y1) of the measuring point 131 relative to the target feature marking point A1, the measuring platform is controlled to move a corresponding distance (X5-X1 along the X-axis, Y5-Y1 along the Y-axis) to move the measuring point 131 to the point directly below the measuring instrument; similarly, if the target feature marking point B1 is the final positioning feature marking point, then according to the position information (X5-X2, Y5-Y2) of the measuring point 131 relative to the target feature marking point B1, the measuring platform is controlled to move a corresponding distance (X5-X2 along the X-axis, Y5-Y2 along the Y-axis) to move the measuring point 131 to the point directly above the measuring instrument. below; if the target feature marking point C1 is the final positioning feature marking point, then according to the position information (X5-X3, Y5-Y3) of the measuring point 131 relative to the target feature marking point C1, the measuring machine is controlled to move a corresponding distance (X5-X3 along the X-axis, Y5-Y3 along the Y-axis) to move the measuring point 131 directly below the measuring instrument; if the target feature marking point D1 is the final positioning feature marking point, then according to the position information (X5-X4, Y5-Y4) of the measuring point 131 relative to the target feature marking point D1, the measuring machine is controlled to move a corresponding distance (X5-X4 along the X-axis, Y5-Y4 along the Y-axis) to move the measuring point 131 directly below the measuring instrument.

[0057] Based on the same inventive concept, the present invention also provides an electronic device, please refer to Figure 7 , which is a schematic diagram of a block structure of an electronic device provided by an embodiment of the present invention. Figure 7 As shown, the electronic device includes a processor 210 and a memory 230, and a computer program is stored on the memory 230. When the computer program is executed by the processor 210, the wafer measurement positioning method described above is implemented. Since the electronic device provided by the present invention and the wafer measurement positioning method provided by the present invention belong to the same inventive concept, the electronic device provided by the present invention at least has all the beneficial effects of the wafer measurement positioning method provided by the present invention. Therefore, the beneficial effects of the electronic device provided by the present invention can refer to the relevant description of the beneficial effects of the wafer measurement positioning method provided by the present invention in the above text, and will not be repeated here one by one.

[0058] Please continue to refer to Figure 7 ,like Figure 7As shown, the electronic device also includes a communication interface 220 and a communication bus 240, wherein the processor 210, the communication interface 220, and the memory 230 communicate with each other through the communication bus 240. The communication bus 240 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus 240 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or one type of bus. The communication interface 220 is used for communication between the above-mentioned electronic device and other devices.

[0059] It should be noted that the processor 210 referred to in the present invention may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor 210 is the control center of the electronic device, and uses various interfaces and lines to connect various parts of the entire electronic device.

[0060] It should also be noted that the memory 230 can be used to store the computer program, and the processor 210 implements various functions of the electronic device by running or executing the computer program stored in the memory 230 and calling the data stored in the memory 230. The memory 230 may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable memory (PROM), electrically programmable memory (EPROM), electrically erasable programmable memory (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, random access memory is available in a variety of forms, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous random access memory (SDRAM), double data rate synchronous random access memory (DDRSDRAM), enhanced synchronous random access memory (ESDRAM), synchronous link (Synchlink) dynamic random access memory (SLDRAM), memory bus (Rambus) direct random access memory (RDRAM), direct memory bus dynamic random access memory (DRDRAM), and memory bus dynamic random access memory (RDRAM), etc.

[0061] The present invention also provides a readable storage medium, wherein a computer program is stored in the readable storage medium, and when the computer program is executed by a processor, the wafer measurement positioning method described above can be implemented. Since the readable storage medium provided by the present invention and the wafer measurement positioning method provided by the present invention belong to the same inventive concept, the readable storage medium provided by the present invention at least has all the beneficial effects of the wafer measurement positioning method provided by the present invention, so the beneficial effects of the readable storage medium provided by the present invention can refer to the relevant description of the beneficial effects of the wafer measurement positioning method provided by the present invention in the above text, and will not be repeated here one by one.

[0062] The readable storage medium provided by the present invention can adopt any combination of one or more computer-readable media. The readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, a system, device or device of electricity, magnetism, light, electromagnetic, infrared or semiconductor, or any combination of the above. More specific examples (non-exhaustive enumeration) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this article, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, a device or a device or used in combination with it.

[0063] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, which carry computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, device, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical cable, etc., or any suitable combination of the above.

[0064] In summary, compared with the prior art, the wafer measurement and positioning method, electronic device and readable storage medium provided by the present invention have the following beneficial effects: (1) The present invention first aligns the wafer 100 to be measured with the measurement machine, and then divides the wafer 100 to be measured into multiple chip areas 130 according to the preset chip size, and then uses the chip area 130 that meets the preset measurement conditions among the multiple chip areas 130 as the target chip area, and then determines the position information of multiple characteristic mark points in the target chip area for each target chip area, and finally locates the measurement point 131 in the target chip area according to the position information of at least one characteristic mark point in the target chip area for each target chip area to be measured. Therefore, for each target chip area to be measured, the measurement point 131 in the target chip area can be accurately located according to the position information of at least one characteristic mark point in the target area. It can be seen that by adopting the present invention, all the measurement points 131 that meet the conditions on the wafer 100 to be measured can be measured, and measurement failure will not occur due to incomplete chip areas, thereby effectively improving the accuracy and stability of wafer measurement.

[0065] (2) The present invention can achieve accurate positioning of the wafer 100 to be measured by first aligning the wafer 100 to be measured with the measuring machine, thereby effectively ensuring the accuracy of the positioning of the subsequent measuring point 131.

[0066] (3) The wafer measurement and positioning method provided by the present invention can further improve the accuracy and precision of positioning the measurement point 131 on the wafer by positioning the measurement point 131 in each target chip area according to the position information of at least one characteristic mark point in the target chip area.

[0067] (4) The present invention can shorten the moving distance of the measuring machine and effectively improve the wafer measurement speed by selecting the target characteristic mark point that makes the target moving distance of the measuring machine shortest as the positioning characteristic mark point used to position the measurement point 131 in the target chip area, thereby facilitating the rapid completion of the measurement of all the measurement points 131 on the wafer 100 to be measured.

[0068] (5) The present invention can not only further improve the positioning accuracy of the measurement machine, but also effectively increase the measurement machine's coverage of wafer differences.

[0069] It should be noted that the computer program code for performing the operation of the present invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet).

[0070] It should be noted that the devices and methods disclosed in the embodiments of this article can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to the multiple embodiments of this article. In this regard, each box in the flowchart or block diagram can represent a module, a part of a program or a code, and the module, a part of a program segment or a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or the flowchart, and the combination of boxes in the block diagram and / or the flowchart, can be implemented by a dedicated hardware-based system for performing a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. In addition, the functional modules in the various embodiments of this document may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0071] It should also be noted that the above description is only a description of the preferred embodiment of the present invention, and is not any limitation on the scope of the present invention. Any changes and modifications made by a person skilled in the art in the field of the present invention based on the above disclosure are within the scope of protection of the present invention. Obviously, a person skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations fall within the scope of the present invention and its equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer measurement and positioning method, characterized in that: include: Align the wafer to be tested with the measuring machine; Dividing the wafer to be tested into a plurality of chip areas according to a preset chip size; Using a chip region that meets a preset measurement condition among the plurality of chip regions as a target chip region; For each of the target chip regions, determining position information of a plurality of characteristic marking points in the target chip region; For each of the target chip regions, positioning the measurement point in the target chip region according to the position information of at least one characteristic mark point in the target chip region; The step of determining, for each target chip region, location information of a plurality of characteristic marking points in the target chip region includes: For each characteristic marker point in each target chip area: Determine the position information of the characteristic mark point on the measuring machine according to the position information of the characteristic mark point relative to the center of the wafer to be measured and the position information of the center of the wafer to be measured on the measuring machine; Determine the position information of the characteristic mark point relative to the measuring instrument according to the position information of the measuring platform relative to the measuring instrument and the position information of the characteristic mark point on the measuring platform; For each of the target chip regions, positioning the measurement point in the target chip region according to the position information of at least one characteristic mark point in the target chip region includes: For each characteristic mark point in each target chip area, determine the position information of the characteristic mark point on the measuring machine according to the position information of the characteristic mark point relative to the center of the wafer to be measured and the position information of the center of the wafer to be measured on the measuring machine; For each of the target chip regions, a characteristic mark point in the target chip region located in the wafer to be tested is used as a target characteristic mark point; For each target feature mark point in the target chip area, the target moving distance of the measuring machine is determined according to the position information of the target feature mark point relative to the measuring instrument, and the target feature mark point that makes the target moving distance of the measuring machine the shortest is used as the positioning feature mark point of the target chip area, and the measuring point in the target chip area is positioned according to the positioning feature mark point.

2. The wafer measurement and positioning method according to claim 1, characterized in that: The aligning of the wafer to be measured and the measuring machine comprises: Placing the wafer to be tested on the measuring machine; Roughly positioning the wafer to be tested according to the notch and multiple edge points on the wafer to be tested; Determining an offset of the measuring platform relative to the wafer to be measured according to at least two alignment patterns on the wafer to be measured; According to the offset, the measuring platform is controlled to rotate so that the wafer to be measured is aligned with the measuring platform.

3. The wafer measurement and positioning method according to claim 1, characterized in that: The characteristic marking points are corner points of the target chip area.

4. The wafer measurement and positioning method according to claim 1, characterized in that: The step of positioning the measurement point in the target chip area according to the positioning feature mark point comprises: According to the position information of the positioning feature mark point relative to the measuring instrument, controlling the measuring machine to move a corresponding distance to move the positioning feature mark point to directly below the measuring instrument; Acquire the actual image at the positioning feature mark point; Comparing the actual image at the positioning feature mark point with the corresponding standard image; If the matching score between the actual image at the positioning feature mark point and the corresponding standard image is equal to or higher than the preset matching score, the measuring machine is controlled to move a corresponding distance based on the position information of the measuring point in the target chip area relative to the positioning feature mark point to move the measuring point directly below the measuring instrument.

5. The wafer measurement and positioning method according to claim 1, characterized in that: The positioning of the measurement point in the target chip area according to the positioning feature mark point also includes: If the matching score between the actual image at the positioning feature mark point and the corresponding standard image is lower than the preset matching score, the target feature mark point among the remaining target feature mark points of the target chip area that makes the target moving distance of the measuring machine the shortest is used as the new positioning feature mark point of the target chip area.

6. An electronic device, characterized in that: The method comprises a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the wafer measurement and positioning method according to any one of claims 1 to 5 is implemented.

7. A readable storage medium, characterized in that: The readable storage medium stores a computer program, and when the computer program is executed by a processor, the wafer measurement and positioning method according to any one of claims 1 to 5 is implemented.

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