Method for detecting placement state of wafer in wafer box and wafer state detection system

Abstract

The invention discloses a wafer placement state detection method in a wafer box and a wafer state detection system, and relates to the technical field of chip manufacturing, the wafer box comprises a box body, one end of the box body in a first direction is open, the box body is provided with a plurality of slots at intervals along a second direction, and the slots are inserted into the slots. The plurality of slots are provided with sockets facing the open end of the box body, so that a plurality of wafers can be correspondingly inserted and installed, a wafer state detection system is arranged on the wafer box, and the wafer state detection system comprises at least one signal transceiver and a controller in telecommunication connection with the signal transceiver; the method for detecting the placement state of the wafer in the wafer box comprises the following steps: after the wafer is inserted into the slot and the signal transceiver is located at a set detection position, controlling the signal transceiver to send out a detection signal; and obtaining a return signal received by the signal transceiver, and determining whether the placement state of the wafer is correct or not according to the return signal. The invention aims to realize automatic detection of the state of the wafer in the wafer box.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a method for detecting the placement status of wafers in a wafer box and a wafer status detection system. Background Art

[0002] In daily production, operators are unable to identify and judge the status of wafers inside the wafer box. As a result, if the wafers are placed abnormally in the wafer box during production, the wafers may crack or even break, affecting production efficiency. Summary of the invention

[0003] The main purpose of the present invention is to provide a method for detecting the placement status of wafers in a wafer box and a wafer status detection system, aiming to realize automatic detection of the wafer status in a wafer box.

[0004] To achieve the above-mentioned purpose, the present invention proposes a method for detecting the placement status of wafers in a wafer box, wherein the wafer box includes a box body, one end of the box body in a first direction is open, the box body is provided with a plurality of slots at intervals along a second direction, the plurality of slots have sockets facing the open end of the box body, so as to correspond to the insertion and installation of a plurality of wafers, the wafer box is provided with a wafer status detection system, the wafer status detection system includes at least one signal transceiver, and a controller connected to the signal transceiver by telecommunication, the method for detecting the placement status of wafers in the wafer box includes:

[0005] After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, controlling the signal transceiver to send a detection signal;

[0006] A return signal received by the signal transceiver is obtained, and whether the placement state of the wafer is correct is determined according to the return signal.

[0007] In one embodiment, the step of obtaining a return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal includes:

[0008] Acquire the return signal received by the signal transceiver, and match the return signal with a setting signal;

[0009] When the matching is successful, it is determined that the placement state of the wafer is correct.

[0010] In one embodiment, the placement status includes whether the wafer is inserted into the bottom of the slot;

[0011] The signal transceiver includes a first signal transceiver, the first signal transceiver includes a first signal transmitter and a first signal receiver, the first signal transceiver has a first detection position, when in the first detection position, the first signal receiver and the first signal transmitter are arranged at intervals along the second direction, and are installed at both ends of the sockets of the plurality of slots, the first signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot;

[0012] After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes:

[0013] After the wafer is inserted into the slot and the first signal transceiver is located at the first detection position, controlling the first signal transmitter to send a first detection signal;

[0014] The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises:

[0015] A first return signal received by the first signal receiver is acquired, and whether the wafer is inserted into the bottom of the slot is determined according to the first return signal.

[0016] In one embodiment, the placement status includes whether the wafer is inserted into the bottom of the slot;

[0017] The signal transceiver includes a bracket and a second signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes two first mounting parts that are opposite and spaced apart, the second signal transceiver has a plurality of second detection positions corresponding to each of the slots, when in the second detection position, the second signal transceiver includes a second signal transmitter and a second signal receiver that are respectively arranged on the two first mounting parts, and the second signal transmitter and the second signal receiver are distributed along the third direction, and the second signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot;

[0018] After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes:

[0019] After the wafer is inserted into the slot and when the second signal transceiver moves to each of the second detection positions, controlling the second signal transmitter to emit a second detection signal;

[0020] The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises:

[0021] A second return signal received by the second signal receiver is obtained, and whether the wafer is inserted into the bottom of the slot is determined according to the second return signal.

[0022] In one embodiment, the placement state includes whether the wafer is inserted in reverse, the signal transceiver includes a third signal transceiver, the third signal transceiver includes a third signal transmitter and a third signal receiver, the third signal transceiver has a third detection position, in the third detection position, the third signal receiver and the third signal transmitter are spaced apart along the second direction and are located at both ends of the sockets of the multiple slots, the third signal transceiver is used to transmit and receive signals to determine whether the wafer is inserted in reverse, wherein the third signal transmitter is used to receive and transmit signals at the same time.

[0023] In one embodiment, the wafer is made of a transparent material, and when the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes:

[0024] After the wafer is inserted into the slot and the third signal transceiver is located at a third detection position, controlling the third signal transmitter to emit a third detection signal;

[0025] The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises:

[0026] A third return signal received by the third signal receiver is obtained, and whether the wafer is inserted in the reverse direction is determined according to the third return signal.

[0027] In one embodiment, the wafer is made of a light-shielding material, and when the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes:

[0028] After the wafer is inserted into the slot and the third signal transceiver is located at a third detection position, controlling the third signal transmitter to emit a third detection signal;

[0029] The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises:

[0030] A third return signal received by the third signal transmitter is obtained, and whether the wafer is inserted in the reverse direction is determined according to the third return signal.

[0031] In one embodiment, the slot includes two groups of sub-slots, the two groups of sub-slots are respectively arranged on both sides of the box body in the third direction, and the two groups of sub-slots are arranged corresponding to the two side ends of the wafer, and the placement state includes whether the two sides of the wafer are inserted into the two sub-slots of the same slot;

[0032] The signal transceiver includes a bracket and a fourth signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes a second mounting portion located at the notch of the plurality of slots, the fourth signal transceiver is installed on the second mounting portion, the fourth signal transceiver has a plurality of fourth detection positions corresponding to each of the slots, when in the fourth detection position, the fourth signal transceiver is located at the notch of the plurality of slots, and is tilted relative to the slots in the second direction, the fourth signal transceiver is used to send and receive signals to determine whether the two sides of the wafer are inserted into the two sub-slots of the same slot;

[0033] After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes:

[0034] After the wafer is inserted into the slot and the fourth signal transceiver is located at a fourth detection position, controlling the fourth signal transceiver to send a fourth detection signal;

[0035] The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises:

[0036] A fourth return signal received by the fourth signal transceiver is obtained, and whether two sides of the wafer are inserted into the two sub-slots of the same slot is determined according to the fourth return signal.

[0037] The present invention also provides a wafer status detection system, which includes:

[0038] at least one signal transceiver; and,

[0039] A controller is electrically connected to the signal transceiver, the controller includes a memory, a processor, and a control program of the wafer status detection system stored in the memory and executable on the processor, the control program of the wafer status detection system is configured to implement the steps of the method for detecting the wafer placement status in the wafer box as described above.

[0040] In one embodiment, the signal transceiver includes a light sensing component.

[0041] In one embodiment, the signal transceiver includes a first signal transceiver, the first signal transceiver includes a first signal transmitter and a first signal receiver, the first signal transceiver has a first detection position, in the first detection position, the first signal receiver and the first signal transmitter are arranged at intervals along the second direction, and are installed at both ends of the sockets of the plurality of slots, the first signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; and / or,

[0042] The signal transceiver includes a bracket and a second signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes two first mounting parts that are opposite and spaced apart, the second signal transceiver has a plurality of second detection positions corresponding to each of the slots, when in the second detection position, the second signal transceiver includes a second signal transmitter and a second signal receiver respectively arranged on the two first mounting parts, and the second signal transmitter and the second signal receiver are distributed along the third direction, the second signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; and / or,

[0043] The signal transceiver includes a third signal transceiver, the third signal transceiver includes a third signal transmitter and a third signal receiver, the third signal transceiver has a third detection position, in the third detection position, the third signal receiver and the third signal transmitter are arranged at intervals along the second direction and are located at both ends of the sockets of the plurality of slots, the third signal transceiver is used to send and receive signals to determine whether the wafer is inserted in reverse, wherein the third signal transmitter is used to receive and transmit signals at the same time; and / or,

[0044] The signal transceiver includes a bracket and a fourth signal transceiver. The bracket is independently movably arranged along the second direction on the outside of the open end of the box body, and the bracket includes a second mounting portion located at the notch of the multiple slots. The fourth signal transceiver is installed on the second mounting portion. The fourth signal transceiver has multiple fourth detection positions corresponding to each of the slots. In the fourth detection position, the fourth signal transceiver is located at the notch of the multiple slots and is inclined relative to the slots in the second direction. The fourth signal transceiver is used to send and receive signals to determine whether the two sides of the wafer are inserted into the two sub-slots of the same slot.

[0045] In the technical solution of the present invention, the wafer status detection system and the corresponding detection method are arranged in the wafer box, so that the wafer status detection system can be used to automatically detect the wafer placement status in the wafer box, so that abnormally placed wafers in the wafer box can be identified, and the operator can be reminded to make adjustments before processing, which can avoid wafer damage on the one hand, and prevent abnormally placed wafers from entering the production system and affecting the production efficiency of the production system on the other hand. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0047] Figure 1 A schematic flow chart of a first embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0048] Figure 2 A schematic flow chart of a second embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0049] Figure 3 A schematic flow chart of a third embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0050] Figure 4 A schematic flow chart of a fourth embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0051] Figure 5 A schematic flow chart of a fifth embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0052] Figure 6 A schematic flow chart of a sixth embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0053] Figure 7 A schematic flow chart of a seventh embodiment of a method for detecting a wafer placement state in a wafer box provided by the present invention;

[0054] Figure 8 for Figure 1 A schematic diagram of the structure of the control system of the hardware operating environment involved in the embodiment scheme;

[0055] Fig. 9 A schematic diagram of a planar structure of an embodiment of a wafer status detection system provided by the present invention;

[0056] Fig.10 Another schematic diagram of the planar structure of the wafer status detection system according to the present invention;

[0057] Fig.11 A schematic diagram of a first signal transceiver detecting that a wafer is not properly inserted into a slot;

[0058] Fig.12 A schematic diagram of a second signal transceiver detection wafer being inserted into a slot;

[0059] Fig.13 A schematic diagram of the second signal transceiver detecting that the wafer is not properly inserted into the slot;

[0060] Fig.14 A schematic diagram of a third signal transceiver detecting a transparent material wafer;

[0061] Fig.15 A schematic diagram of a third signal transceiver detecting a light-shielding material wafer;

[0062] Fig.16 A schematic diagram of a fourth signal transceiver detecting normal wafer insertion;

[0063] Fig.17 A schematic diagram of a fourth signal transceiver detecting a wafer insertion tilt;

[0064] Fig.18 Schematic diagram of the wafer tilted in the slot.

[0065] Description of Figure Numbers:

[0066] 100. Wafer status detection system; 1. First signal transceiver; 11. First signal transmitter; 12. First signal receiver; 2. Second signal transceiver; 21. Second signal transmitter; 22. Second signal receiver; 3. Third signal transceiver; 31. Third signal transmitter; 32. Third signal receiver; 4. Fourth signal transceiver; 200. Wafer box; 210. Slot; 211. Sub-slot; 300. Wafer.

[0067] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0070] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0071] In daily production, operators are unable to identify and judge the status of wafers inside the wafer box. As a result, if the wafers are placed abnormally in the wafer box during production, the wafers may crack or even break, affecting production efficiency.

[0072] In view of this, the present invention proposes a method for detecting the placement status of wafers in a wafer box. Figures 1 to 7 , is an embodiment of the method for detecting the placement status of wafers in the wafer box, and the method for detecting the placement status of wafers in the wafer box will be described in detail below with reference to specific drawings.

[0073] See also Figure 1 The wafer box 200 includes a box body, one end of the box body in the first direction is open, the box body is provided with a plurality of slots 210 at intervals along the second direction, the plurality of slots 210 have sockets facing the open end of the box body, so as to correspond to the insertion and installation of a plurality of wafers 300, the wafer box 200 is provided with a wafer state detection system 100, the wafer state detection system 100 includes at least one signal transceiver, and a controller connected to the signal transceiver by telecommunication, the method for detecting the placement state of the wafer 300 in the wafer box 200 includes:

[0074] S100: After the wafer 300 is inserted into the slot 210 and the signal transceiver is located at a set detection position, controlling the signal transceiver to send a detection signal;

[0075] S200: Acquire the return signal received by the signal transceiver, and determine whether the placement state of the wafer 300 is correct according to the return signal.

[0076] In the technical solution of the present invention, the wafer status detection system 100 and the corresponding detection method are arranged in the wafer box 200, so that the wafer status detection system 100 can be used to automatically detect the placement status of the wafer 300 in the wafer box 200, so that abnormally placed wafers 300 in the wafer box 200 can be identified, and the operator can be reminded to make adjustments before processing, so as to avoid damage to the wafer 300 on the one hand, and avoid abnormally placed wafers 300 from entering the production system and affecting the production efficiency of the production system on the other hand.

[0077] Specifically, the wafer status detection system 100 includes at least one signal transceiver, and the signal transceiver has the detection position located in the wafer box 200. When the wafer 300 is inserted into the slot 210 of the wafer box 200 and the signal transceiver is located at the detection position, the signal transceiver is controlled to send the detection signal, and the return signal is formed after the detection signal passes through the wafer 300. At this time, the return signal is accompanied by some information of the wafer 300. After the signal transceiver receives the return signal, the return signal can be used to analyze the information of the wafer 300 it passes through to obtain whether the placement status of the wafer 300 is normal, thereby realizing the status detection function required by the wafer status detection system 100 and meeting the functional requirements.

[0078] Specifically, see Figure 2 , the step S200 comprises:

[0079] S210: Acquire a return signal received by the signal transceiver, and match the return signal with a setting signal;

[0080] S220: When the matching is successful, it is determined that the placement state of the wafer 300 is correct.

[0081] It can be understood that the method of determining whether the placement state of the wafer 300 is correct through the return signal depends on the type of the signal transceiver and the type of signal it receives and transmits. For example, a visual detection device may be provided to directly obtain the placement image of the wafer 300 in the wafer box 200. At this time, the placement state of the wafer 300 can be intuitively obtained, which can be judged by manual recognition. However, such a setting has a large device size and high cost on the one hand, and requires manual judgment on the other hand, which is not practical. Therefore, in this embodiment, the signal transceiver is set as a light sensing component to judge the placement state of the wafer 300 by receiving and transmitting light signals. At this time, the placement state of the wafer 300 cannot be obtained manually and intuitively. Therefore, the setting signal is preset, and the controller automatically makes a judgment. The preset setting signal is actually the return signal received by the signal transceiver when the wafer 300 is placed normally. Therefore, when the signal transceiver subsequently receives the return signal consistent with the setting signal, it can be judged that the wafer 300 is placed normally. When the received return signal is inconsistent with the setting signal, it can be judged that the placement of the wafer 300 is suspected to be abnormal. At this time, the controller controls the alarm device to sound an alarm or prompts the operator through other measures to avoid the wafer box 200 from going online, thereby realizing the control of the abnormally placed wafer 300 and meeting the functional requirements proposed in this application.

[0082] Specifically, there are various abnormal placement situations of the wafer 300 in the wafer box 200, mainly including that the wafer 300 is not placed in place, the wafer 300 is placed upside down, and the wafer 300 is placed tilted. The following will propose corresponding implementation methods of the signal transceiver for specific abnormal placement situations.

[0083] For the case where the placement state includes whether the wafer 300 is inserted into the bottom of the slot 210, the signal transceiver includes a first signal transceiver 1, the first signal transceiver 1 includes a first signal transmitter 11 and a first signal receiver 12, the first signal transceiver 1 has a first detection position, when in the first detection position, the first signal receiver 12 and the first signal transmitter 11 are arranged at intervals along the second direction, and are installed at both ends of the sockets of the plurality of slots 210, the first signal transceiver 1 is used to send and receive signals to determine whether the wafer 300 is inserted into the bottom of the slot 210;

[0084] See also Figure 3 , Fig. 9 , Fig.10 , Fig.11 , the step S100 comprises:

[0085] S110: After the wafer 300 is inserted into the slot 210 and the first signal transceiver 1 is located at the first detection position, controlling the first signal transmitter 11 to send out a first detection signal;

[0086] The step S200 includes:

[0087] S230 : Acquire a first return signal received by the first signal receiver 12 , and determine whether the wafer 300 is inserted into the bottom of the slot 210 according to the first return signal.

[0088] As for the situation that the wafer 300 is not placed in place, it can be understood that when all the wafers 300 in the wafer box 200 are placed in place, the heights of all the wafers 300 at the sockets of the slots 210 relative to the bottom of the slots 210 should be consistent. If there is an abnormal placement, the height of the abnormal wafer 300 at the sockets of the slots 210 relative to the bottom of the slots 210 must be higher than that of the normally placed wafer 300. Therefore, by utilizing this property, the first signal transmitter 11 and the first signal receiver 12 are installed at the sockets of the slots 210 in this embodiment, and the first signal transmitter 11 and the first signal receiver 12 are spaced apart along the second direction. In this way, the connection line between the transmitting end of the first signal transmitter 11 and the receiving end of the first signal receiver 12 is located at the edge of the normally placed wafer 300. Once the wafer 300 is placed abnormally, causing its above-mentioned height to exceed the normally placed wafer 300, it will definitely interfere with the connection line between the transmitting end of the first signal transmitter 11 and the receiving end of the first signal receiver 12, that is, it will definitely interfere with the signal sent by the first signal transmitter 11, thereby affecting the first return signal received by the first signal receiver 12. Therefore, it is possible to judge whether the wafer 300 is inserted in place in the slot 210 through the difference in the first return signal, thereby meeting the functional requirements.

[0089] In addition, still for the case where the placement state includes whether the wafer 300 is inserted into the bottom of the slot 210; the present application also proposes the following embodiment, that is, the signal transceiver includes a bracket and a second signal transceiver 2, the bracket is independently movably arranged along the second direction on the outside of the open end of the box body, and the bracket includes two first mounting parts (not shown in the figure) that are opposite and spaced apart, the second signal transceiver 2 has a plurality of second detection positions corresponding to each of the slots 210, when in the second detection position, the second signal transceiver 2 includes a second signal transmitter 21 and a second signal receiver 22 that are respectively arranged on two first mounting parts (not shown in the figure), and the second signal transmitter 21 and the second signal receiver 22 are distributed along a third direction (the first direction and the second direction form a plane, and the direction perpendicular to the plane is the third direction), and the second signal transceiver 2 is used to send and receive signals to determine whether the wafer 300 is inserted into the bottom of the slot 210;

[0090] See also Figure 4 , Fig.12 , Fig.13 , the step S100 comprises:

[0091] S120: After the wafer 300 is inserted into the slot 210 and when the second signal transceiver 2 moves to each of the second detection positions, controlling the second signal transmitter 21 to emit a second detection signal;

[0092] The step S200 includes:

[0093] S240 : Acquire a second return signal received by the second signal receiver 22 , and determine whether the wafer 300 is inserted into the bottom of the slot 210 according to the second return signal.

[0094] In this embodiment, the second signal transmitter 21 and the second signal receiver 22 are distributed along the third direction, which is actually basically consistent with the detection method of the first signal transmitter 11 and the first signal receiver 12, that is, the connection line between the transmitting end of the second signal transmitter 21 and the receiving end of the second signal receiver 22 is set to be located at the edge of the normally placed wafer 300. When the wafer 300 is placed abnormally, interference is caused to the signal emitted by the second signal transmitter 21, so that the second return signal received by the second signal receiver 22 is different from the second return signal received by the second signal receiver 22 when the wafer 300 is placed normally, so as to determine whether the wafer 300 is inserted in place.

[0095] For the above two embodiments, the first signal transmitter 11 and the first signal receiver 12 detect all the wafers 300 at the same time, that is, when any wafer 300 is not inserted in place, the first return signal is affected, and the detection efficiency is high, but it cannot locate the position of the abnormal wafer 300 in the wafer box 200, nor can it determine the number of abnormal wafers 300; while the second signal transmitter 21 and the second signal receiver 22 are just the opposite. Driven by the bracket, they move along the second direction to detect the wafers 300 one by one. The detection efficiency is relatively low, but the specific position of the abnormal wafer 300 in the wafer box 200 can be obtained, and the number of abnormal wafers 300 can also be obtained. Both embodiments meet the required functional requirements. The specific setting method is based on actual needs and is not limited here. It can be set by selecting one or the other, or both embodiments can be set at the same time. If the above two embodiments are set at the same time, while the functions are complementary, they can also play a review function to improve the detection accuracy.

[0096] In addition, for the placement state, including whether the wafer 300 is inserted in reverse, the material of the wafer 300 may be a transparent material or a non-transparent light-shielding material. When the wafer 300 is made of a transparent material, due to design requirements, a thin film is coated on one side of the wafer 300, so when the detection signal is irradiated from one side to the other side and from the other side to one side, the return signal is different. Using this principle, the difference in the return signal received by the signal transceiver can be used to identify the front and back sides of the transparent wafer 300. In this regard, the present application proposes the following third signal transceiver 3; and when the wafer 300 is non-transparent When the wafer 300 is made of a light-shielding material, due to design requirements, one side is set to a glossy surface and the other side is set to a frosted surface. As a result, when the detection signal is reflected by the above-mentioned glossy surface and the above-mentioned frosted surface, the return signals are different. Utilizing this principle, the front and back sides of the non-transparent wafer 300 can be identified by the difference in the return signals received by the signal transceiver. To this end, a group of signal transceivers can be independently set up to detect the wafer 300 made of a light-shielding material. However, the present application proposes to set the third signal transmitter 31 to be used for receiving and transmitting signals at the same time so that it can be applicable to the above-mentioned transparent material wafer 300 and the light-shielding material wafer 300.

[0097] Specifically, the third signal transceiver 3 includes a third signal transmitter 31 and a third signal receiver 32. The third signal transceiver 3 has a third detection position. In the third detection position, the third signal receiver 32 and the third signal transmitter 31 are arranged at intervals along the second direction and are located at both ends of the sockets of the plurality of slots 210. The third signal transceiver 3 is used to send and receive signals to determine whether the wafer is inserted in reverse, wherein the third signal transmitter 31 is used to receive and transmit signals at the same time;

[0098] For transparent wafer 300, please refer to Figure 5 , Fig.14 , the step S100 comprises:

[0099] S130: After the wafer 300 is inserted into the slot 210 and the third signal transceiver 3 is located at a third detection position, controlling the third signal transmitter 31 to emit a third detection signal;

[0100] The step S200 includes:

[0101] S250: Acquire a third return signal received by the third signal receiver 32, and determine whether the wafer 300 is inserted in the reverse direction according to the third return signal.

[0102] The third signal transceiver 3 is used to detect the forward and reverse placement state of the transparent wafer 300, which has been described above. Specifically, the third signal transceiver 3 is configured as the third signal transmitter 31 and the third signal receiver 32 that are opposite to each other in the second direction, which is different from the position setting of the first signal transmitter 11 and the first signal receiver 12 that are opposite to each other in the second direction described above. The connection line between the transmitting end of the third signal transmitter 31 and the receiving end of the third signal receiver 32 needs to pass through the wafer 300. Therefore, in this embodiment, the third signal transmitter 31 and the third signal receiver 32 are correspondingly arranged at the positions in the slot 210, and the subsequent detection method is consistent with the above description, that is, by comparing the third return signal, when the wafer 300 is placed in reverse, the third return signal changes, thereby detecting and judging that the transparent wafer 300 is placed in reverse.

[0103] For light-shielding material wafer 300, please refer to Figure 6 , Fig.15 , the step S100 comprises:

[0104] S140: After the wafer 300 is inserted into the slot 210 and the third signal transmitter 31 is located at a third detection position, controlling the third signal transmitter 31 to emit a third detection signal;

[0105] The step S200 includes:

[0106] S260: Acquire a third return signal received by the third signal transmitter 31, and determine whether the wafer 300 is inserted in the reverse direction according to the third return signal.

[0107] The third signal transmitter 31 is used to detect the positive and negative placement status of the wafer 300 made of non-transparent light-shielding material, which has been described above. Here, the wafer 300 made of non-transparent light-shielding material specifically includes a silicon wafer. Since the wafer 300 cannot pass through the detection signal, the third signal transmitter 31 synchronously performs signal transmission and reception. The third signal transmitter 31 is set corresponding to the slot 210 to correspond to the wafer 300 in the slot 210. The subsequent detection method is consistent with the above description, that is, by comparing the third return signal, when the wafer 300 is placed in reverse, the third return signal changes, thereby detecting and judging that the non-transparent wafer 300 is placed in reverse.

[0108] It should be noted here that when the wafer 300 is transparent, the detection signal can pass through multiple wafers 300, that is, the third signal transceiver 3 can be used to synchronously detect multiple wafers 300, and when the wafer 300 is non-transparent, the detection signal cannot pass through the wafer 300, so the third signal transmitter 31 needs to detect the wafer 300 placed in the wafer box 200 one by one, and cannot detect multiple wafers 300 at the same time.

[0109] In addition, finally, regarding the situation where the wafer 300 may be placed at an angle, this situation is actually based on the design requirements of the wafer box 200, that is, the slot 210 in the wafer box 200 is composed of two groups of sub-slots 211, and the two groups of sub-slots 211 are respectively arranged on both sides of the box body in the third direction to correspond to the two side ends of the wafer 300, so that the two side ends of the wafer 300 are inserted into the sub-slots 211 of the two slots 210, which causes the two side ends of the wafer 300 to be misaligned in the second direction, causing the wafer 300 to be tilted.

[0110] Based on this, for the situation where the placement state includes whether the two sides of the wafer 300 are inserted into the two sub-slots 211 of the same slot 210, this embodiment proposes that the signal transceiver includes a bracket and a fourth signal transceiver 4, the bracket is independently movably arranged on the outside of the opening end of the box body along the second direction, and the bracket includes a second mounting portion (not shown in the figure) located at the notch of the multiple slots 210, the fourth signal transceiver 4 is installed on the second mounting portion (not shown in the figure), the fourth signal transceiver 4 has a plurality of fourth detection positions corresponding to each of the slots 210, in the fourth detection position, the fourth signal transceiver 4 is located at the notch of the multiple slots 210, and is tilted relative to the slot 210 in the second direction, the fourth signal transceiver 4 is used to send and receive signals to determine whether the two sides of the wafer 300 are inserted into the two sub-slots 211 of the same slot 210;

[0111] See also Figure 7 , Fig.16 , Fig.17 , the step S100 comprises:

[0112] S150: After the wafer 300 is inserted into the slot 210 and the fourth signal transceiver 4 is located at a fourth detection position, controlling the fourth signal transceiver 4 to send a fourth detection signal;

[0113] The step S200 includes:

[0114] S270 : Acquire the fourth return signal received by the fourth signal transceiver 4 , and determine whether the two sides of the wafer 300 are inserted into the two sub-slots 211 of the same slot 210 according to the fourth return signal.

[0115] The fourth signal transceiver 4 mainly utilizes the difference in the conditions of the detection signal reflected by the tilted or not wafer 300, that is, the principle that the return signal exists differently, to detect whether the wafer 300 is tilted. Specifically, the fourth signal transceiver 4 also utilizes the wafer 300 to detect the reflection of the detection signal, so the signal transmitting end and the signal receiving end of the fourth signal transceiver 4 are located on the same side of the wafer 300. Based on the above description of the third signal transmitter 31, the fourth signal transceiver 4 can also be fixed to the box body. In this embodiment, it is mainly proposed to set the fourth signal transceiver 4 on the bracket, and the bracket drives the fourth signal transceiver 4 to move in the second direction to detect the wafer 300 one by one to meet the functional requirements. It should be noted here that there is no interference between the setting of the fourth signal transceiver 4 and the setting of the second signal transceiver 2 described above, so the second signal transceiver 2 and the fourth signal transceiver 4 can be synchronously set on the bracket, and during the movement of the bracket, the wafers 300 can be detected one by one synchronously.

[0116] See also Figures 8 to 10 The present invention further provides a wafer status detection system 100, wherein the wafer status detection system 100 includes at least one signal transceiver and a controller electrically connected to the signal transceiver. To implement the control method of the wafer status detection system 100 as described above, please refer to Figure 8 , the controller includes: a processor 1001, such as a CPU, a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the user interface 1003 may optionally include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 may be a high-speed RAM memory, or a stable memory (non-volatile memory), such as a disk memory. The memory 1005 may optionally be a storage device independent of the aforementioned processor 1001.

[0117] Those skilled in the art will understand that Figure 8 The structure of the controller shown in the figure does not constitute a limitation of the controller, and the controller may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0118] like Figure 8As shown, the memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a control program of the wafer status detection system 100 .

[0119] exist Figure 8 In the controller shown, the control program of the wafer status detection system 100 stored in the memory 1005 is called by the processor 1001, and the method for detecting the placement status of the wafer 300 in the wafer box 200 is executed.

[0120] Specifically, the first signal transceiver 1, the second signal transceiver 2, the third signal transceiver 3 and the fourth signal transceiver 4 are respectively used to detect an abnormal state of the wafer 300, which has been described above and will not be repeated here. There is no structural interference between the first signal transceiver 1, the second signal transceiver 2, the third signal transceiver 3 and the fourth signal transceiver 4, so the first signal transceiver 1, the second signal transceiver 2, the third signal transceiver 3 and the fourth signal transceiver 4 can be set in the wafer state detection system 100. The third signal transceiver 3 and part of the fourth signal transceiver 4 may also be fully set, based on usage requirements, and are not specifically limited herein. In this embodiment, the wafer status detection system 100 includes the first signal transceiver 1, the second signal transceiver 2, the third signal transceiver 3 and the fourth signal transceiver 4 arranged in the wafer box 200, so as to detect the abnormal placement conditions described above, such as the wafer 300 is not placed in place, the wafer 300 is placed in reverse, and the wafer 300 is placed tilted.

[0121] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for detecting the placement status of wafers in a wafer box, characterized in that: The wafer box includes a box body, one end of the box body in a first direction is open, the box body is provided with a plurality of slots at intervals along a second direction, the plurality of slots have sockets facing the open end of the box body, so as to correspond to a plurality of wafers for insertion and installation, the wafer box is provided with a wafer status detection system, the wafer detection system includes at least one signal transceiver, and a controller connected to the signal transceiver by telecommunication, and the method for detecting the wafer placement status in the wafer box includes: After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, controlling the signal transceiver to send a detection signal; A return signal received by the signal transceiver is obtained, and whether the placement state of the wafer is correct is determined according to the return signal.

2. The method for detecting the wafer placement status in a wafer box according to claim 1, characterized in that: The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: Acquire the return signal received by the signal transceiver, and match the return signal with a setting signal; When the matching is successful, it is determined that the placement state of the wafer is correct.

3. The method for detecting the wafer placement status in a wafer box according to claim 2, characterized in that: The placement status includes whether the wafer is inserted into the bottom of the slot; The signal transceiver includes a first signal transceiver, the first signal transceiver includes a first signal transmitter and a first signal receiver, the first signal transceiver has a first detection position, when in the first detection position, the first signal receiver and the first signal transmitter are arranged at intervals along the second direction, and are installed at both ends of the sockets of the plurality of slots, the first signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes: After the wafer is inserted into the slot and the first signal transceiver is located at the first detection position, controlling the first signal transmitter to send a first detection signal; The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: A first return signal received by the first signal receiver is acquired, and whether the wafer is inserted into the bottom of the slot is determined according to the first return signal.

4. The method for detecting the wafer placement status in a wafer box according to claim 2 or 3, characterized in that: The placement status includes whether the wafer is inserted into the bottom of the slot; The signal transceiver includes a bracket and a second signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes two first mounting parts that are opposite and spaced apart, the second signal transceiver has a plurality of second detection positions corresponding to each of the slots, when in the second detection position, the second signal transceiver includes a second signal transmitter and a second signal receiver that are respectively arranged on the two first mounting parts, and the second signal transmitter and the second signal receiver are distributed along the third direction, and the second signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes: After the wafer is inserted into the slot and when the second signal transceiver moves to each of the second detection positions, controlling the second signal transmitter to emit a second detection signal; The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: A second return signal received by the second signal receiver is obtained, and whether the wafer is inserted into the bottom of the slot is determined according to the second return signal.

5. The method for detecting the wafer placement status in a wafer box according to claim 2, characterized in that: The placement status includes whether the wafer is inserted in reverse; The signal transceiver includes a third signal transceiver, and the third signal transceiver includes a third signal transmitter and a third signal receiver. The third signal transceiver has a third detection position. When in the third detection position, the third signal receiver and the third signal transmitter are spaced apart along the second direction and are located at both ends of the sockets of the multiple slots. The third signal transceiver is used to transmit and receive signals to determine whether the wafer is inserted in reverse, wherein the third signal transmitter is used to receive and transmit signals at the same time.

6. The method for detecting the wafer placement status in a wafer box according to claim 5, characterized in that: The wafer is made of a transparent material. After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes: After the wafer is inserted into the slot and the third signal transceiver is located at a third detection position, controlling the third signal transmitter to emit a third detection signal; The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: A third return signal received by the third signal receiver is obtained, and whether the wafer is inserted in the reverse direction is determined according to the third return signal.

7. The method for detecting the wafer placement status in a wafer box according to claim 5, characterized in that: The wafer is made of a light-shielding material. When the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes: After the wafer is inserted into the slot and the third signal transceiver is located at a third detection position, controlling the third signal transmitter to emit a third detection signal; The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: A third return signal received by the third signal transmitter is obtained, and whether the wafer is inserted in the reverse direction is determined according to the third return signal.

8. The method for detecting the wafer placement status in a wafer box according to claim 2, characterized in that: The slot includes two groups of sub-slots, the two groups of sub-slots are respectively arranged on both sides of the box body in the third direction, and the two groups of sub-slots are arranged corresponding to the two side ends of the wafer, and the placement state includes whether the two sides of the wafer are inserted into the two sub-slots of the same slot; The signal transceiver includes a bracket and a fourth signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes a second mounting portion located at the notch of the plurality of slots, the fourth signal transceiver is installed on the second mounting portion, the fourth signal transceiver has a plurality of fourth detection positions corresponding to each of the slots, when in the fourth detection position, the fourth signal transceiver is located at the notch of the plurality of slots, and is tilted relative to the slots in the second direction, the fourth signal transceiver is used to send and receive signals to determine whether the two sides of the wafer are inserted into the two sub-slots of the same slot; After the wafer is inserted into the slot and the signal transceiver is located at a set detection position, the step of controlling the signal transceiver to send a detection signal includes: After the wafer is inserted into the slot and the fourth signal transceiver is located at a fourth detection position, controlling the fourth signal transceiver to send a fourth detection signal; The step of obtaining the return signal received by the signal transceiver and determining whether the placement state of the wafer is correct according to the return signal comprises: A fourth return signal received by the fourth signal transceiver is obtained, and whether two sides of the wafer are inserted into the two sub-slots of the same slot is determined according to the fourth return signal.

9. A wafer status detection system, characterized in that: include: at least one signal transceiver; as well as, A controller electrically connected to the signal transceiver, the controller comprising a memory, a processor, and a control program of the wafer status detection system stored in the memory and executable on the processor, the control program of the wafer status detection system being configured to implement the steps of the method for detecting the wafer placement status in a wafer box as described in any one of claims 1 to 8.

10. The wafer status detection system according to claim 9, characterized in that: The signal transceiver includes a light sensing component.

11. The wafer status detection system according to claim 9, characterized in that: The signal transceiver includes a first signal transceiver, the first signal transceiver includes a first signal transmitter and a first signal receiver, the first signal transceiver has a first detection position, when in the first detection position, the first signal receiver and the first signal transmitter are arranged at intervals along the second direction, and are installed at both ends of the sockets of the plurality of slots, the first signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; and / or, The signal transceiver includes a bracket and a second signal transceiver, the bracket is independently movably arranged on the outer side of the opening end of the box body along the second direction, and the bracket includes two first mounting parts that are opposite and spaced apart, the second signal transceiver has a plurality of second detection positions corresponding to each of the slots, when in the second detection position, the second signal transceiver includes a second signal transmitter and a second signal receiver respectively arranged on the two first mounting parts, the second signal transmitter and the second signal receiver are distributed along the third direction, and the second signal transceiver is used to send and receive signals to determine whether the wafer is inserted into the bottom of the slot; and / or, The signal transceiver includes a third signal transceiver, the third signal transceiver includes a third signal transmitter and a third signal receiver, the third signal transceiver has a third detection position, in the third detection position, the third signal receiver and the third signal transmitter are arranged at intervals along the second direction and are located at both ends of the sockets of the plurality of slots, the third signal transceiver is used to send and receive signals to determine whether the wafer is inserted in reverse, wherein the third signal transmitter is used to receive and transmit signals at the same time; and / or, The signal transceiver includes a bracket and a fourth signal transceiver. The bracket is independently movably arranged along the second direction on the outside of the open end of the box body, and the bracket includes a second mounting portion located at the notch of the multiple slots. The fourth signal transceiver is installed on the second mounting portion. The fourth signal transceiver has multiple fourth detection positions corresponding to each of the slots. In the fourth detection position, the fourth signal transceiver is located at the notch of the multiple slots and is inclined relative to the slots in the second direction. The fourth signal transceiver is used to send and receive signals to determine whether the two sides of the wafer are inserted into the two sub-slots of the same slot.

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