A high-precision large-size multi-stack chip mounting tooling and mounting method

Abstract

The present invention relates to a high-precision large-size multi-layer chip mounting tooling and a mounting method, comprising: a base, a dispensing positioning sheet, and a plurality of mounting positioning frames. A substrate adsorption table is arranged at the center of the base, and a vacuum adsorption hole is arranged at the center of the substrate adsorption table. The substrate adsorption table is used for adsorbing a substrate. The dispensing positioning sheet is placed on the side of the substrate or the chip facing upwards, and the dispensing positioning sheet is used for determining the dispensing range. The mounting positioning frames are detachably arranged on the top of the base. A placement opening adapted to the chip is formed at the center of the mounting positioning frame. A plurality of limiting baffles are vertically arranged on the inner side wall of the placement opening. The placement openings of the plurality of mounting positioning frames are gradually reduced layer by layer according to the size of the chips for lamination. The present invention can ensure the chip mounting precision, and can meet the requirements of mounting strength and porosity after curing, ensuring the process reliability and having a simple operation process.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated power manufacturing, and particularly to a high-precision large-size multi-layer chip mounting tooling and a mounting method. Background Art

[0002] In the field of ceramic packaging, when installing chips, there are various existing machines that use silver glue for chip mounting, which is only applicable to single chips or small-size chips. At present, with the development of semiconductors, there are new requirements for glue-mounted chips. For some non-conventional products, large-size multi-layer chip stacking, the use of conventional chip mounting methods and processes cannot achieve such chip mounting, and cannot guarantee the mounting accuracy and yield. Summary of the Invention

[0003] The present invention provides a high-precision large-size multi-layer chip mounting tooling and a mounting method to solve the problem that the conventional chip mounting methods and processes mentioned in the background art cannot guarantee the mounting accuracy and yield of large-size multi-layer chips.

[0004] One technical solution of the present invention is as follows: A high-precision large-size multi-layer chip mounting tooling, comprising: a base, a dispensing positioning sheet, and a plurality of mounting positioning frames. A substrate adsorption table is provided at the center of the base, a vacuum adsorption hole is provided at the center of the substrate adsorption table, and the substrate adsorption table is used for adsorbing a substrate. The dispensing positioning sheet is placed on the side of the substrate or the chip facing upward, and the dispensing positioning sheet is used for determining the dispensing range. The mounting positioning frames are detachably arranged on the top of the base. A placement opening adapted to the chip is provided at the center of the mounting positioning frame. A plurality of limiting baffles are vertically arranged on the inner side wall of the placement opening. The placement openings of the plurality of mounting positioning frames are gradually reduced layer by layer according to the size of the chips for lamination.

[0005] Further, positioning pins are installed on the top of the base, and positioning holes adapted to the positioning pins are provided on the mounting positioning frames.

[0006] Further, a positioning pin installation groove is provided on the top of the base, and the positioning pins are installed in the positioning pin installation groove.

[0007] Further, the base includes a bottom plate and a frame-shaped side wall, the frame-shaped side wall is arranged on the bottom plate, and the size of the frame-shaped side wall is adapted to the substrate.

[0008] Further, an opening is provided on the frame-shaped side wall.

[0009] Further, a plurality of dispensing positioning sheets are provided, and the openings of each dispensing positioning sheet correspond to the dispensing positions.

[0010] Further, substrate supports are provided around the substrate adsorption table.

[0011] Further, handles are provided on both sides of the dispensing positioning sheet.

[0012] Another technical solution of the present invention is as follows: A method for mounting a high-precision large-size stacked chip, using any one of the above-mentioned high-precision large-size multi-stacked chip mounting tools, includes:

[0013] S10: Place the substrate in the base and adsorb the substrate through the vacuum adsorption holes;

[0014] S20: Mount the dispensing positioning sheet on the substrate, use a dispenser to dispense glue into the opening of the dispensing positioning sheet, and after the dispensing is completed, remove the dispensing positioning sheet;

[0015] S30: Mount the mounting positioning frame on the base, and place the chip on the substrate from the placement opening of the mounting positioning frame and along the limit baffle of the mounting positioning frame;

[0016] S40: Use an oven to perform preliminary curing on the substrate and the chip, the curing temperature is 50-110°C, and the curing time is 30-60 minutes;

[0017] S50: After the preliminary curing is completed, repeat S20-S40 to perform multi-layer dispensing and multi-layer chip mounting;

[0018] S60: After the multi-layer chip mounting is completed, use a nitrogen oven to perform complete curing on the substrate and the multi-layer chip, the curing temperature is 150-200°C, and the curing time is 60-90 minutes.

[0019] The beneficial effects of the present invention: By processing a base adapted to the substrate, fixing the substrate through vacuum adsorption, and using a dispensing positioning sheet and a mounting positioning frame, the installation of large-size multi-layer stacked chips is realized. This tool can ensure the chip mounting accuracy, and after curing, it can meet the requirements of mounting strength and porosity, ensuring the process reliability, and the operation process is simple. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of the high-precision large-size multi-stacked chip mounting tool of the present invention.

[0021] Figure 2 is a schematic cross-sectional structural diagram of the high-precision large-size multi-stacked chip mounting tool of the present invention.

[0022] Figure 3 is a schematic diagram of the base in the present invention.

[0023] Figure 4 is a schematic diagram of the mounting positioning frame in the present invention.

[0024] Figure 5 is a schematic diagram of secondary chip mounting in the present invention.

[0025] Figure 6 It is a schematic diagram of the dispensing position sheet in the present invention.

[0026] Figure 7 It is a flowchart of the method for mounting high-precision large-size stacked chips in the present invention. Specific embodiments

[0027] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0028] In one technical solution of the present invention, Figure 1 and Figure 2 are structural schematic diagrams provided according to the specific structure of a high-precision large-size multi-layer stacked chip mounting tooling of the present invention. As Figure 1 and Figure 2 shown, the present invention specifically includes:

[0029] A base 1, a dispensing positioning sheet 6, and a plurality of mounting positioning frames 3. Among them, the base 1 is made according to the substrate, and the size of the base 1 is adapted to the substrate to ensure that the substrate can be completely attached inside the base 1.

[0030] As Figure 3 shown, a substrate adsorption table 11 is provided at the center of the base 1, a vacuum adsorption hole 12 is provided at the center of the substrate adsorption table 11, the substrate adsorption table 11 is used to adsorb the substrate 4, the vacuum adsorption hole is connected to a vacuum pumping device, and a negative pressure is formed in the vacuum adsorption hole to adsorb and fix the substrate 4. Substrate supports 14 are provided around the substrate adsorption table 11, and the substrate is supported and fixed through the substrate supports 14 and the substrate adsorption table 11.

[0031] The dispensing positioning sheet 6 is placed on the side where the substrate 4 or the chip 5 faces upward, and the dispensing positioning sheet 6 is used to determine the dispensing range. When arranging the chips 5 in the first layer, the dispensing positioning sheet 6 is placed on the substrate for dispensing positioning. When arranging the chips 5 in the second layer, the dispensing positioning sheet 6 is placed on the chips 5 in the first layer for dispensing positioning, and so on.

[0032] The mounting positioning frame 3 is detachably arranged on the top of the base 1, as Figure 4As shown, a placement opening 31 adapted to the chip is provided at the center of the chip mounting positioning frame 3. A plurality of limiting baffles 32 are vertically arranged on the inner side wall of the placement opening 31. Among them, the chip is placed into the placement opening 31 and slides down along the limiting baffles 32 to the substrate. The limiting baffles 32 can prevent the chip 5 from shaking and ensure the accuracy of chip mounting.

[0033] The placement openings 31 of the plurality of chip mounting positioning frames 3 gradually decrease layer by layer according to the size of the chips to be stacked. Figure 2 and Figure 5 As shown, the placement opening of the chip mounting positioning frame 3 for positioning the first layer of chips is larger than that of the chip mounting positioning frame 3 for positioning the second layer of chips, and so on. The specific size of the placement opening of the chip mounting positioning frame 3 is adapted to the size of the chips at the corresponding layer.

[0034] In an embodiment of the present technical solution, as Figure 3 shown, a positioning pin 2 is installed on the top of the base 1, and a positioning hole 33 adapted to the positioning pin 2 is provided on the chip mounting positioning frame 3. A positioning pin installation groove 13 is provided at the top of the base 1, and the positioning pin is installed in the positioning pin installation groove 13. The chip mounting positioning frame 3 is positioned and installed through the positioning pin.

[0035] In an embodiment of the present technical solution, the base 1 includes a bottom plate 16 and a frame-shaped side wall 17. The frame-shaped side wall 17 is provided on the bottom plate 16, and the size of the frame-shaped side wall 17 is adapted to the substrate. The shape and size enclosed by the frame-shaped side wall 17 are adapted to the substrate. An opening 15 is provided on the frame-shaped side wall 17, and the staff can reach into the base through the opening, which is convenient for taking the chip mounting positioning frame 3.

[0036] In an embodiment of the present technical solution, a plurality of dispensing positioning pieces 6 are provided, and the opening of each dispensing positioning piece 6 corresponds to the dispensing position.

[0037] In an embodiment of the present technical solution, as Figure 6 shown, handles 61 are provided on both sides of the dispensing positioning piece 6, which is convenient for taking and placing the dispensing positioning piece 6.

[0038] In another technical solution of the present invention, Figure 7 is a flowchart provided according to the specific steps of a high-precision large-size stacked chip mounting method. This method uses any one of the above-mentioned high-precision large-size multi-layer stacked chip mounting tools. As Figure 7 shown, the present invention includes:

[0039] S10: Place the substrate in the base 1 and adsorb the substrate through the vacuum adsorption holes 12.

[0040] First, the base 1 needs to be fabricated according to the size of the substrate, and the chip mounting positioning frame 3 needs to be fabricated according to the size of the chip. Measure the size of the substrate, and fabricate the base for substrate fixation according to the measured sizes of the special-shaped substrate and the chip, and formulate the dispensing positioning piece 6 and the chip mounting positioning frame according to the drawings.

[0041] S20: Install the dispensing positioning piece 6 on the substrate, use a dispenser to dispense glue into the opening of the dispensing positioning piece 6. After dispensing is completed, remove the dispensing positioning piece 6.

[0042] After the substrate is fixed by vacuum adsorption, install the dispensing gasket on the substrate, perform the dispensing operation at the fixed position of the substrate. After dispensing is completed, remove the dispensing gasket.

[0043] S30: Install the chip mounting positioning frame 3 on the base 1, and use a suction pen or tweezers to place the chip from the placement opening 31 of the chip mounting positioning frame 3 and along the limit baffle 32 of the chip mounting positioning frame 3 on the substrate.

[0044] With the base positioning pin as the positioning, install the chip mounting positioning frame on the base, put the chip into the placement opening 31 of the chip mounting positioning frame 3, and slide it down along the limit baffle 32 of the chip mounting positioning frame 3 onto the substrate. Use a scrapper or manually rub the chip to make the glue material overflow around the chip. At the same time, check the surface state of the chip. After there is no chip damage and the porosity is qualified, the first-layer chip mounting is completed.

[0045] S40: Use an oven to perform preliminary curing on the substrate and the chip.

[0046] Place the whole substrate in the oven for baking and preliminary curing. The curing temperature is 50~110°C, and the curing time is 30~60 min. Among them, the preliminary curing does not completely cure the mounting glue, and stop curing after the first-layer chip is preliminarily fixed.

[0047] S50: After the preliminary curing of the chip is completed, repeat S20 - S40 to perform multi-layer dispensing and multi-layer chip mounting.

[0048] After preliminary curing, place the dispensing positioning piece 6 on the first-layer chip again, perform the second-layer dispensing and mounting. Note the positions of the second-layer dispensing and mounting, and perform multi-layer dispensing and mounting according to actual needs.

[0049] S60: After the multi-layer chip mounting is completed, use a nitrogen oven to perform complete curing on the substrate and the multi-layer chips.

[0050] After the second-layer dispensing and mounting are completed, place the whole substrate in the nitrogen oven for curing. The curing temperature is 150~200°C, and the curing time is 60~90 min. Perform mounting inspection after curing.

[0051] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A high-precision, large-size, multi-layer chip loading tool, characterized in that: include: A base (1), a dispensing positioning sheet (6) and a plurality of chip positioning frames (3); a substrate adsorption platform (11) is arranged at the center of the base (1); a vacuum adsorption hole (12) is arranged at the center of the substrate adsorption platform (11); the substrate adsorption platform (11) is used to adsorb a substrate (4); the dispensing positioning sheet (6) is placed on the upward side of the substrate (4) or the chip (5); the dispensing positioning sheet (6) is used to determine the dispensing range; the chip positioning frame (3) is detachably arranged on the top of the base (1); a placement opening (31) adapted to the chip (5) is opened at the center of the chip positioning frame (3); a plurality of limit baffles (32) are vertically arranged on the inner side wall of the placement opening (31); the placement openings (31) of the plurality of chip positioning frames (3) are gradually reduced in size according to the size of the stacked chips (5); the base (1) is made according to the substrate; the size of the base (1) is adapted to the substrate to ensure that the substrate can be completely fitted inside the base (1).

2. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: A positioning pin (2) is installed on the top of the base (1), and a positioning hole (33) matching the positioning pin (2) is provided on the film loading positioning frame (3).

3. The high-precision large-size multi-layer chip loading tool as claimed in claim 2, characterized in that: A positioning pin installation groove (13) is provided on the top of the base (1), and the positioning pin (2) is installed in the positioning pin installation groove (13).

4. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: The base (1) comprises a bottom plate (16) and a frame-shaped side wall (17); the frame-shaped side wall (17) is arranged on the bottom plate (16); and the size of the frame-shaped side wall (17) is adapted to the base plate (4).

5. The high-precision large-size multi-layer chip loading tool as claimed in claim 4, characterized in that: An opening (15) is provided on the frame-shaped side wall (17).

6. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: A plurality of the glue dispensing positioning sheets (6) are provided, and an opening of each glue dispensing positioning sheet (6) corresponds to a glue dispensing position.

7. The high-precision large-size multi-layer chip loading tool as claimed in claim 1, characterized in that: Substrate supports (14) are arranged around the substrate adsorption platform (11).

8. The high-precision large-size multi-stack chip loading tool as claimed in claim 1, characterized in that: Handles (61) are provided on both sides of the glue dispensing positioning sheet (6).

9. A high-precision large-size stacked chip mounting method, characterized in that: The high-precision large-size multi-stack chip mounting tooling according to any one of claims 1 to 8 comprises: S10: placing the substrate (4) in the base (1), and adsorbing the substrate (4) through the vacuum adsorption holes (12), wherein the base (1) is manufactured according to the substrate, and the size of the base (1) is adapted to the substrate, so as to ensure that the substrate can be completely attached to the inside of the base (1); S20: installing the glue dispensing positioning sheet (6) on the substrate (4), using a glue dispensing machine to dispense glue on the opening of the glue dispensing positioning sheet (6), and after the glue dispensing is completed, removing the glue dispensing positioning sheet (6); S30: installing the chip mounting and positioning frame (3) on the base (1), and placing the chip (5) on the substrate (4) from the placement opening (31) of the chip mounting and positioning frame (3) and along the limiting baffle (32) of the chip mounting and positioning frame (3); S40: using an oven to preliminarily cure the substrate (4) and the chip (5), with the curing temperature being 50-110° C. and the curing time being 30-60 min; S50: after the initial curing is completed, S20-S40 are repeated to perform multi-layer dispensing and multi-layer chip (5) mounting; S60: After the multi-layer chip (5) is mounted, a nitrogen oven is used to completely cure the substrate (4) and the multi-layer chip (5). The curing temperature is 150-200° C. and the curing time is 60-90 minutes.

10. The high-precision large-size stacked chip mounting method according to claim 9, characterized in that: Also includes: The base (1) is manufactured according to the size of the substrate (4), and the chip mounting positioning frame (3) is manufactured according to the size of the chip (5).

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