Power supply and distribution module and method for packaging a power supply and distribution module

Abstract

This disclosure provides a power supply and distribution module and a method for packaging the power supply and distribution module. The power supply and distribution module includes: a transformer; two packaging modules, each packaging module including: a packaging substrate, the bottom surface of which is provided with a conductive layer, the two conductive layers being electrically connected to the top and bottom of the transformer respectively to form a vertical stack; and multiple electrical functional devices packaged inside the packaging substrate; and two side electrode groups, which are electrically connected to both sides of the two packaging modules in a vertical direction to realize electrical connection and signal transmission between the power supply and distribution module and external circuits.

Description

Technical Field

[0001] This disclosure relates to the technical field of microelectronic packaging, and more specifically, to a power supply and distribution module and a method for packaging the power supply and distribution module. Background Technology

[0002] Existing power supply and distribution modules such as Figure 1 As shown, power devices 4 and integrated circuit chips and passive devices are stacked in a package module 100. Both package modules 100 and transformer 1 are mounted on the bottom electrode 200, and the two package modules 100 are located on both sides of transformer 1 in the horizontal direction. However, this horizontally distributed power distribution module structure has a large area and cannot meet the structural requirements of the power distribution module area not exceeding the load chip area and the vertical interconnection between the module port and the load chip pin in the vertical power distribution system. Moreover, in order to meet the high power density requirements, the horizontally distributed power distribution module will generate a large lateral interconnection loss from the power distribution module to the processor under high current conditions. At the same time, the flow from the integrated circuit chip to the passive device and back to the processor will also generate round-trip low voltage and large current loss, which limits the efficiency of the power distribution module. Summary of the Invention

[0003] To address at least one of the technical problems in the prior art, embodiments of this disclosure provide a power supply and distribution module and a method for packaging the power supply and distribution module, which can reduce the area of ​​the power supply and distribution module applied in high current scenarios and reduce losses.

[0004] The present disclosure provides a power supply and distribution module, including: a transformer; two encapsulation modules, each of the encapsulation modules including: an encapsulation substrate, the bottom surface of which is provided with a conductive layer, the two conductive layers being electrically connected to the top and bottom of the transformer respectively to form a vertical stack; and a plurality of electrical functional devices encapsulated inside the encapsulation substrate; and two side electrode groups, the two side electrode groups being electrically connected to both sides of the two encapsulation modules in a vertical direction to realize electrical connection and signal transmission between the power supply and distribution module and an external circuit.

[0005] According to some embodiments of the present disclosure, each of the above-mentioned packaging substrates includes: a first core board; and a second core board, mounted on the lower side of the first core board; wherein, first through holes are formed on both sides of the packaging substrate, and the first through holes are filled with a first electrical connection material to electrically connect the first core board and the second core board; and second through holes are formed on the outer sides of the two first through holes, the second through holes being configured to lead out the side electrode group.

[0006] According to some embodiments of this disclosure, the plurality of the above-mentioned electrical functional devices include: an integrated circuit chip embedded inside the first core board; and a passive device embedded inside the second core board.

[0007] According to some embodiments of this disclosure, the power supply and distribution module further includes: two power devices, each electrically connected to a first surface of the two first core boards; wherein the first surface is configured to have a plurality of spaced insulating gaps for electrical insulation.

[0008] According to some embodiments of this disclosure, the first core board includes: a first metal layer disposed on a second surface of the first core board, the second surface being opposite to the first surface.

[0009] According to some embodiments of this disclosure, the second core board includes a second metal layer disposed on the surface of the second core board away from the conductive layer, the second metal layer being configured to electrically connect the passive device and the two side electrode groups.

[0010] According to some embodiments of this disclosure, the integrated circuit chip and the first surface, as well as the passive device and the second metal layer, are electrically connected by conductive pillars.

[0011] According to some embodiments of this disclosure, the power supply module further includes: a plurality of second electrical connection materials, which are arrayed and electrically connected between the power device and the first surface to electrically connect the power device and the integrated circuit chip.

[0012] According to some embodiments of another aspect of this disclosure, a method for encapsulating the above-mentioned power supply and distribution module is provided, comprising: encapsulating a plurality of electrical functional devices inside an encapsulation substrate to obtain an encapsulation module; symmetrically mounting two of the above-mentioned encapsulation modules on the top and bottom of a transformer to form a vertical stack; and welding side electrode groups on both sides of the two encapsulation modules in a vertical direction to obtain the power supply and distribution module.

[0013] According to some embodiments of this disclosure, the above-described encapsulation of multiple electrical functional devices inside a packaging substrate to obtain a packaging module includes: embedding an integrated circuit chip inside a first core board; embedding passive devices inside a second core board; pressing the first core board and the second core board together to form the packaging substrate; forming first through holes on both sides of the packaging substrate in a vertical direction to electrically connect the integrated circuit chip and the passive devices; forming second through holes on the outside of the first through holes to lead out the side electrode group; cutting the second through holes to form connecting through holes; and mounting power devices on a first surface of the first core board to obtain the packaging module.

[0014] According to an embodiment of this disclosure, a power supply and distribution module and a method for packaging the power supply and distribution module are disclosed. The power supply and distribution module includes a transformer, two packaging modules, and two side electrode groups. Each packaging module includes a packaging substrate and multiple electrical functional devices. A conductive layer is provided on the bottom surface of the packaging substrate. The two conductive layers are electrically connected to the top and bottom of the transformer, respectively, to form a vertical stack. The multiple electrical functional devices are packaged inside the packaging substrate. The two side electrode groups are electrically connected to the two sides of the two packaging modules in a vertical direction, respectively. This reduces the resistance introduced by the large number of through holes used between different electrodes in the multi-layer stack, reduces losses, realizes electrical connection and signal transmission between the power supply and distribution module and external circuits, reduces the area of ​​the power supply and distribution module applied in high current scenarios, and improves the efficiency of the power supply and distribution module. Attached Figure Description

[0015] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0016] Figure 1 It is a cross-sectional view of a horizontally distributed power supply and distribution module in the existing technology;

[0017] Figure 2 This is a schematic diagram of the power supply and distribution module according to one embodiment of the present disclosure;

[0018] Figure 3 This is a block diagram illustrating the composition and distribution of a power supply and distribution module according to an illustrative embodiment of the present disclosure;

[0019] Figure 4 This is a cross-sectional view of a power supply and distribution module according to an illustrative embodiment of the present disclosure;

[0020] Figure 5 This is a cross-sectional view of a packaging substrate according to an illustrative embodiment of the present disclosure;

[0021] Figure 6 This is a cross-sectional view of a first core board and a second core board according to an illustrative embodiment of the present disclosure;

[0022] Figure 7 This is a cross-sectional view of a power device electrically connected to a first surface of a first core board according to an illustrative embodiment of the present disclosure;

[0023] Figure 8 This is a flowchart of a method for packaging a power supply and distribution module according to an illustrative embodiment of the present disclosure;

[0024] Figure 9 This is a cross-sectional view of two encapsulation modules symmetrically mounted on the top and bottom of a transformer according to an illustrative embodiment of the present disclosure;

[0025] Figure 10 This is a flowchart of the sub-steps of encapsulating multiple electrical functional devices inside a packaging substrate to obtain a packaging module according to an illustrative embodiment of the present disclosure;

[0026] Figure 11 This is a top view of a second through hole being cut to form a connecting through hole according to an illustrative embodiment of the present disclosure.

[0027] In the accompanying drawings, the meanings of the reference numerals are as follows:

[0028] 100. Packaging module;

[0029] 200. Bottom electrode;

[0030] 1. Transformer;

[0031] 2. Side electrode assembly;

[0032] 3. Packaging substrate;

[0033] 31. First core board;

[0034] 310. First metal layer;

[0035] 32. Second core board;

[0036] 320. Conductive layer;

[0037] 321. Second metal layer;

[0038] 4. Power devices;

[0039] 5. Integrated circuit chips;

[0040] 6. Passive components;

[0041] 7. First through hole;

[0042] 8. Conductive pillar;

[0043] 9. Second electrical connection material;

[0044] 10. Second through hole;

[0045] 11. Connecting through holes;

[0046] A. First page. Detailed Implementation

[0047] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0048] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0049] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0050] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0051] In high-performance computing and millimeter-wave applications, due to the demands for high computing power density, high energy efficiency, and functional integration, a solution is needed to reduce the area of ​​power supply and distribution modules used in high-current scenarios. Based on one aspect of this invention, a power supply and distribution module includes a transformer, two encapsulation modules, and two side electrode groups, all based on a miniaturized transformer. Each encapsulation module includes an encapsulation substrate and multiple electrical functional devices. A conductive layer is provided on the bottom surface of the encapsulation substrate. The two conductive layers are electrically connected to the top and bottom of the transformer, respectively, to form a vertical stack. Multiple electrical functional devices are encapsulated inside the encapsulation substrate. The two side electrode groups are electrically connected vertically to both sides of the two encapsulation modules. This reduces the resistance introduced by the numerous vias used between different electrodes in the multi-layer stack, reduces losses, and enables electrical connection and signal transmission between the power supply and distribution module and external circuits. This reduces the area of ​​the power supply and distribution module used in high-current scenarios and improves the efficiency of the power supply and distribution module.

[0052] Figure 2 This is a schematic diagram of the power supply and distribution module according to an exemplary embodiment of the present disclosure. Figure 3 This is a block diagram illustrating the composition and distribution of a power supply and distribution module according to an illustrative embodiment of the present disclosure. Figure 4 This is a cross-sectional view of a power supply and distribution module according to an illustrative embodiment of the present disclosure.

[0053] According to embodiments of this disclosure, such as Figure 2 , Figure 3 and Figure 4 As shown, a power supply and distribution module is provided, comprising a transformer 1, two encapsulation modules, and two side electrode groups 2. Each encapsulation module includes an encapsulation substrate 3 and multiple electrical functional devices. A conductive layer 320 is provided on the bottom surface of the encapsulation substrate 3, and the two conductive layers 320 are electrically connected to the top and bottom of the transformer 1, respectively, to form a vertical stack. Multiple electrical functional devices are encapsulated inside the encapsulation substrate 3. The two side electrode groups 2 are electrically connected vertically to both sides of the two encapsulation modules to realize electrical connection and signal transmission between the power supply and distribution module and external circuits.

[0054] According to embodiments of this disclosure, the core structure in transformer 1 can be selected from UI structure, EE structure or EI structure.

[0055] According to the embodiments of this disclosure, the transformer 1 is electrically connected to the two packaging modules through the conductive layer 320, and the multiple electrical functional devices packaged in each packaging substrate 3 are electrically connected through the first through holes 7 on both sides of the packaging substrate 3 (the first through holes 7 are described in detail below) and the wiring layer inside the packaging substrate 3.

[0056] According to embodiments of this disclosure, vertically stacking two encapsulation modules and transformer 1 can optimize space utilization and improve the integration and power density of the power supply and distribution module.

[0057] According to embodiments of this disclosure, each side electrode group 2 includes multiple side electrodes, which can be in the form of an array of copper pillars. The multiple side electrodes are configured to realize electrical connection and signal transmission between the power supply module and the external circuit. Using multiple side electrodes can realize the input and output of large current signals.

[0058] According to embodiments of this disclosure, the power supply and distribution module includes a transformer 1, two encapsulation modules, and two side electrode groups 2. Each encapsulation module includes an encapsulation substrate 3 and multiple electrical functional devices. A conductive layer 320 is provided on the bottom surface of the encapsulation substrate 3. The two conductive layers 320 are electrically connected to the top and bottom of the transformer 1, respectively, to form a vertical stack. Multiple electrical functional devices are encapsulated inside the encapsulation substrate 3. The two side electrode groups 2 are electrically connected to the two sides of the two encapsulation modules in a vertical direction, respectively. This reduces the resistance introduced by the large number of through holes used between different electrodes in the multi-layer stack, reduces losses, realizes electrical connection and signal transmission between the power supply and distribution module and the external circuit, reduces the area of ​​the power supply and distribution module applied in high current scenarios, and improves the efficiency of the power supply and distribution module.

[0059] Figure 5 This is a cross-sectional view of a packaging substrate 3 according to an illustrative embodiment of the present disclosure. Figure 6 This is a cross-sectional view of a first core board 31 and a second core board 32 according to an illustrative embodiment of the present disclosure.

[0060] According to embodiments of this disclosure, such as Figure 5 and Figure 6 As shown, each encapsulation substrate 3 includes a first core plate 31 and a second core plate 32. The second core plate 32 is mounted on the underside of the first core plate 31. First through holes 7 are formed on both sides of the encapsulation substrate 3, and the first through holes 7 are filled with a first electrical connection material to electrically connect the first core plate 31 and the second core plate 32. Second through holes 10 are formed on the outer sides of the two first through holes 7, and the second through holes 10 are configured to lead out the side electrode group 2.

[0061] According to embodiments of this disclosure, the first electrical connection material may be, for example, copper.

[0062] According to the embodiments of this disclosure, the first metal layer 310 of the first core board 31 (the first metal layer 310 is described in detail below) and the second metal layer 321 of the second core board 32 (the second metal layer 321 is described in detail below) are bonded together. First through holes 7 are formed on both sides of the packaging substrate 3, and the first through holes 7 are filled with a first electrical connection material, which enables the first core board 31 and the second core board 32 to be electrically connected, and at the same time interconnects the first metal layer 310 and the second metal layer 321 to form an integrated metal structure, thereby reducing the area of ​​the packaging substrate 3.

[0063] According to embodiments of this disclosure, multiple electrical functional devices include an integrated circuit chip 5 and passive devices 6. For example... Figure 6 As shown, the integrated circuit chip 5 is embedded inside the first core board 31. The passive device 6 is embedded inside the second core board 32.

[0064] According to embodiments of this disclosure, the integrated circuit chip 5 may be selected as, for example, a driver chip, and the passive device 6 may be selected as, for example, a resistor and a capacitor.

[0065] Figure 7 This is a cross-sectional view of a power device 4 electrically connected to a first surface A of a first core board 31 according to an illustrative embodiment of the present disclosure.

[0066] According to embodiments of this disclosure, the power supply and distribution module further includes two power devices 4, such as... Figure 7 As shown, two power devices 4 are electrically connected to the first surfaces A of the two first core boards 31, respectively. The first surfaces A are configured with multiple spaced insulating gaps for electrical insulation.

[0067] According to an embodiment of the present disclosure, the first surface A of the first core board 31 is made of metal, and the first surface A has a plurality of spaced insulating gaps. The insulating gaps are formed by a patterned etching process, and the insulating gaps can prevent electrical connections between wirings on the first surface A.

[0068] In one illustrative embodiment, copper can be deposited on the first surface A of the first core board 31, and then multiple spaced insulating gaps can be formed by a patterned etching process.

[0069] According to embodiments of this disclosure, such as Figure 6 As shown, the first core board 31 includes a first metal layer 310, which is disposed on the second surface of the first core board 31, and the second surface is opposite to the first surface A.

[0070] According to embodiments of this disclosure, such as Figure 6 As shown, the second core board 32 includes a second metal layer 321, which is disposed on the surface of the second core board 32 away from the conductive layer 320. The second metal layer 321 is configured to electrically connect the passive device 6 and the two side electrode groups 2.

[0071] According to embodiments of this disclosure, such as Figure 6 As shown, the integrated circuit chip 5 and the first surface A, as well as the passive device 6 and the second metal layer 321, are electrically connected by conductive pillars 8.

[0072] According to embodiments of this disclosure, the conductive post 8 is made of metal, such as copper.

[0073] According to embodiments of this disclosure, such as Figure 7 As shown, the power supply and distribution module also includes multiple second electrical connection materials 9. The multiple second electrical connection materials 9 are arrayed and electrically connected between the power device 4 and the first surface A to electrically connect the power device 4 and the integrated circuit chip 5.

[0074] In one illustrative embodiment, the power device 4 and the first surface A of the first core board 31 can be connected by an array of solder balls.

[0075] Figure 8 This is a flowchart of a method for packaging a power supply and distribution module according to an illustrative embodiment of the present disclosure.

[0076] According to embodiments of this disclosure, such as Figure 8 As shown, a method for encapsulating a power supply and distribution module is provided, including the following steps S1 to S3.

[0077] Step S1: Encapsulate multiple electrical functional devices inside the packaging substrate 3 to obtain a packaging module.

[0078] Figure 9 This is a cross-sectional view of two encapsulation modules symmetrically mounted on the top and bottom of transformer 1 according to an illustrative embodiment of the present disclosure.

[0079] Step S2: As Figure 9 As shown, two encapsulation modules are symmetrically mounted on the top and bottom of transformer 1 to form a vertical stack.

[0080] According to embodiments of this disclosure, two encapsulation modules are mounted on the top and bottom of transformer 1 using a welding process to form a vertical stack.

[0081] Step S3: As Figure 4 As shown, side electrode groups 2 are welded vertically on both sides of the two encapsulation modules to obtain the power supply and distribution module.

[0082] According to embodiments of this disclosure, the power supply and distribution module obtained by the above-described packaging method is suitable for converting external voltages and outputting them stably, and can be applied to high-voltage, high-power-density power supply in the front end.

[0083] Figure 10 This is a flowchart of a sub-step of encapsulating multiple electrical functional devices inside a packaging substrate 3 to obtain a packaging module, according to an illustrative embodiment of the present disclosure.

[0084] According to embodiments of this disclosure, such as Figure 10 As shown, multiple electrical functional devices are packaged inside the packaging substrate 3 to obtain a packaged module, which includes the following steps 11 to 17.

[0085] Step 11: As Figure 6 As shown, the integrated circuit chip 5 is embedded inside the first core board 31.

[0086] Step 12: As Figure 6 As shown, the passive device 6 is embedded inside the second core board 32.

[0087] Step 13: As Figure 5 As shown, the first core board 31 and the second core board 32 are pressed together to form the encapsulation substrate 3.

[0088] Step 14: Form first through holes 7 in the vertical direction on both sides of the packaging substrate 3 to electrically connect the integrated circuit chip 5 and the passive device 6.

[0089] Step 15: Form a second through hole 10 outside the first through hole 7 to bring out the side electrode group 2.

[0090] Figure 11 This is a top view of a second through hole 10 being cut to form a connecting through hole 11 according to an illustrative embodiment of the present disclosure.

[0091] Step 16: As Figure 11 As shown, the second through hole 10 is cut to form a connecting through hole 11.

[0092] Step 17: As Figure 7 As shown, the power device 4 is mounted on the first surface A of the first core board 31 to obtain the package module.

[0093] According to an embodiment of this disclosure, arrayed copper pillars are welded at the connection through holes 11 on both sides of the packaging substrate 3 to realize electrical connection and signal transmission between the power supply module and the external circuit. At the same time, the arrayed copper pillars can reduce the loss of the electrical connection path.

[0094] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined and / or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0095] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure, and the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but are only schematic representations of the embodiments of this disclosure.

[0096] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to desired characteristics derived from the content of this disclosure. Specifically, all figures used in the specification and claims to indicate composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that a specific amount may vary by ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0097] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0098] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0099] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. A power supply and distribution module, wherein, include: transformer; Two encapsulation modules, each of the encapsulation modules comprising: A packaging substrate, wherein a conductive layer is disposed on the bottom surface of the packaging substrate, and two conductive layers are electrically connected to the top and bottom of the transformer respectively to form a vertical stack; and Multiple electrical functional devices are encapsulated inside the packaging substrate; and Two side electrode groups are electrically connected to both sides of the two encapsulation modules in a vertical direction to realize the electrical connection and signal transmission between the power supply module and the external circuit.

2. The power supply and distribution module according to claim 1, wherein, Each of the package substrates includes: First core board; and The second core board is installed on the underside of the first core board; The packaging substrate has first through holes formed on both sides, and the first through holes are filled with a first electrical connection material to electrically connect the first core board and the second core board. A second through hole is formed outside the two first through holes, and the second through hole is configured to lead out the side electrode group.

3. The power supply and distribution module according to claim 2, wherein, The plurality of said electrical functional devices include: The integrated circuit chip is embedded inside the first core board; and Passive components are embedded inside the second core board.

4. The power supply and distribution module according to claim 3, wherein, Also includes: Two power devices are electrically connected to the first surfaces of the two first core boards, respectively; The first surface is configured to have multiple spaced insulating gaps for electrical insulation.

5. The power supply and distribution module according to claim 4, wherein, The first core board includes: A first metal layer is disposed on the second surface of the first core board, the second surface being opposite to the first surface.

6. The power supply and distribution module according to claim 4, wherein, The second core board includes: A second metal layer is disposed on the surface of the second core plate away from the conductive layer, and the second metal layer is configured to electrically connect the passive device and the two side electrode groups.

7. The power supply and distribution module according to claim 6, wherein, The integrated circuit chip and the first surface, as well as the passive device and the second metal layer, are electrically connected by conductive pillars.

8. The power supply and distribution module according to claim 6, wherein, Also includes: Multiple second electrical connection materials are arrayed and electrically connected between the power device and the first surface to electrically connect the power device and the integrated circuit chip.

9. A method for encapsulating a power supply and distribution module as described in any one of claims 1-8, wherein, include: Multiple electrical functional devices are encapsulated inside a packaging substrate to obtain a packaging module; The two encapsulation modules are symmetrically mounted on the top and bottom of the transformer to form a vertical stack; Side electrode groups are welded vertically on both sides of the two encapsulation modules to obtain the power supply and distribution module.

10. The method according to claim 9, wherein, The process of encapsulating multiple electrical functional devices inside a packaging substrate to obtain a packaging module includes: The integrated circuit chip is embedded inside the first core board; The passive components are embedded inside the second core board; The first core board and the second core board are pressed together to form the packaging substrate; First through holes are formed on both sides of the packaging substrate in a vertical direction to electrically connect the integrated circuit chip and the passive device; A second through hole is formed outside the first through hole to lead out the side electrode group; The second through hole is cut to form a connecting through hole; The power device is mounted on the first surface of the first core board to obtain the packaged module.

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