Power diode device

Abstract

The invention relates to the technical field of diodes, in particular to a power diode device which comprises a body, the upper section of the body is sleeved with a first cover, the lower section of the body is sleeved with a second cover, and a movable space is formed between the opposite ends of the first cover and the second cover. A movable space is formed between the first cover and the second cover, pressing rings are fixed to the opposite ends of the first cover and the second cover, a thin spring located in the movable space is elastically connected between the two pressing rings, the thin spring is arranged on the periphery of the body in a sleeving mode, and when the first cover and the second cover move in the opposite directions, the thin spring is pressed to be compressed and shortened in the movable space. The two pressing rings are used for pushing the first cover and the second cover to move reversely, and fire extinguishing or flame retarding is carried out on the heat source range on the PCB. The inert substances are blocked between the bottom end of the body and the top surface of the PCB, and when high heat is generated on the PCB, the diode is well protected.

Description

Technical Field

[0001] The invention relates to the technical field of diodes, and in particular to a power diode device. Background Art

[0002] A high-power diode consists of a main body and positive and negative terminal pins connected at both ends. It only allows current to flow in one direction. Connecting the positive and negative pins of multiple diodes together has a rectification function, which is commonly known as a rectifier bridge. In most cases, high-power diodes are used independently and can be used in high-power environments.

[0003] When high-power diodes are used on PCB boards, they will generate high heat. In addition, if a component in the PCB circuit fails, the heat of the diode will rise sharply due to the circuit connection relationship. The power diode lacks cooling and automatic protection functions, which affects its service life. Therefore, this defect needs to be improved. Summary of the invention

[0004] In order to solve the above problem, how to improve the service life of the power diode, the present invention provides a power diode device, including a body, a first cover is sleeved on the upper section of the body, a second cover is sleeved on the lower section of the body, an activity space is provided between the opposite ends of the first cover and the second cover, a pressure ring is fixed on the opposite ends of the first cover and the second cover, a thin spring located in the activity space is elastically connected between the two pressure rings, the thin spring is sleeved on the periphery of the body, when the first cover and the second cover move in relative directions, the thin spring is compressed and shortened in the activity space, and when the two ends of the thin spring elastically lengthen, the two pressure rings are used to push the first cover and the second cover to move in opposite directions;

[0005] The first pole pin passes through the first cover upwards, and the second pole pin passes through the second cover downwards. When the first cover moves upwards, it also moves upwards along the first pole pin, and when the second cover moves downwards, it also moves downwards along the second pole pin;

[0006] An inner cavity is provided in the second cover, the lower section of the body passes through the inner cavity, a sandwich cavity is formed between the inner cavity and the outer wall of the second cover, the sandwich cavity is filled with an inert medium, a discharge hole is provided at the bottom end of the second cover, the discharge hole is communicated with the sandwich cavity, a plastic plug is filled in the discharge hole, when the plastic plug moves downward with the second cover, it approaches the PCB board, when the plastic plug is plastically deformed, the inert medium in the sandwich cavity is discharged from the discharge hole to the PCB board;

[0007] An expansion agent is filled between the bottom of the inner cavity of the second cover and the bottom end of the body, and the length of the first pole pin is greater than the length of the second pole pin.

[0008] As a further preferred embodiment, two copper sheets are fixed on the bottom surface of the second cover, the two copper sheets are symmetrically arranged on both sides of the second pole pin, and the two copper sheets extend along both sides of the second pole pin to the bottom end of the second pole pin.

[0009] As a further preferred embodiment, the discharge hole is opened at a side position of the second cover, and the top ends of the two copper sheets are connected to the side positions of the bottom surface of the second cover and are symmetrically arranged on both sides of the plastic plug.

[0010] As a further preferred embodiment, the copper sheet is an arc-shaped thin plate which is gradually bent from one side of the second pole pin to the other side of the second pole pin;

[0011] When the bottom end of the second pole pin is welded on the PCB, the bottom ends of the two copper sheets elastically contact the PCB. When the second cover moves downward, the two copper sheets are pushed to press against the PCB and continue to bend downward.

[0012] As a further preference, the two copper sheets are inclined relative to the direction of the second pole pin.

[0013] As a further preferred embodiment, a connecting piece close to the bottom of the plastic plug is connected between the two copper sheets, a tight hole is opened in the middle of the plastic plug, and the connecting piece moves upward as the two copper sheets bend upward and gradually approaches the tight hole, and a cone thorn cover is provided on the surface of the connecting piece, and the connecting piece can penetrate into the tight hole to expand and open the tight hole as the two copper sheets bend upward and gradually approach the tight hole;

[0014] The cone thorn cover is a cone-shaped cover which gradually becomes thinner from the bottom to the top, and the top end of the cone thorn cover is communicated with the bottom end.

[0015] As further preferred, a through hole is provided on the connecting piece, the bottom end of the cone thorn cover is connected to the through hole, and the bottom end opening of the cone thorn cover is communicated with the through hole in upper and lower directions.

[0016] As a further preferred embodiment, bite openings are provided on both side edges of the two copper sheets, and the portions where the connecting sheet is connected to the two copper sheets are close to the bite openings. When the two copper sheets continue to bend due to the bottom ends pressing against the PCB board, the top ends bend and deform with the bite openings as the deformation portions, and while the bite openings are bent and deformed, the connecting sheet carries the cone thorn cover into the tight hole of the plastic plug.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. When the heat on the PCB reaches the expansion coefficient of the expansion agent, this part of the expansion agent will produce a strong expansion effect, which releases a driving force downward and applies this driving force to the second cover, pushing the second cover down along the main body. While the main body is descending, it also provides a driving force to the plastic plug, and the downward movement of the main body brings the plastic plug close to the PCB. The high-temperature heat on the PCB will be transferred to the plastic plug at a close distance. As the temperature on the plastic plug continues to rise, the plastic plug will undergo plastic deformation. Since the shape of the plastic deformation of the plastic plug is irregular, the plastic plug and the discharge hole will become loose. Since the discharge hole is opened at the bottom of the clamping cavity, and the clamping cavity is filled with an inert medium, for example, when the inert medium is an inert gas mixed with flame-retardant powder, it has pressure due to compression in the clamping cavity. When the plastic plug is loosened due to plastic deformation, the high-pressure inert medium first pushes down the plastic plug, and then is quickly sprayed onto the PCB from the discharge hole, so as to implement fire extinguishing or flame retardancy for the heat source range on the PCB. These inert substances are blocked between the bottom of the body and the top surface of the PCB board, and when high heat is generated on the PCB board, the diode is well protected.

[0019] 2. When the copper sheet bends upward as the second cover descends, the connecting piece will deflect upward and gradually approach the plastic plug with the cone-thorn cover. When the cone-thorn cover leans against the plastic plug, the cone-thorn cover will be gradually inserted into the tight hole of the plastic plug with the tip of the top end to expand the tight hole, which will make the clamping cavity corresponding to the top of the tight hole communicate with the copper sheet through the tight hole. At this time, the inert medium in the clamping cavity will flow into the cone-thorn cover through the tight hole, and then be discharged into the through hole through the cone-thorn cover, and then be discharged to the PCB board through the through hole. At this time, even if the heat on the PCB board is not enough to cause plastic deformation of the plastic plug, even if the plastic plug does not plasticize and falls off from the discharge hole, the copper sheet can be bent and the cone-thorn cover can be inserted into the plastic plug under the descending action of the second cover, so that the inert medium falls on the PCB board to play its flame retardant function, and the service life of the diode can also be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic plan view of a power diode device provided in an embodiment of the present invention;

[0021] Figure 2 A power diode device provided in an embodiment of the present invention comprises Figure 1 The schematic diagram under the rotation perspective is introduced;

[0022] Figure 3 A schematic diagram of a power diode device provided in an embodiment of the present invention from a bottom partial perspective;

[0023] Figure 4A schematic plan view of a power diode device after being cut apart provided by an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of the internal structure of a power diode device provided in an embodiment of the present invention after being cut open from a local perspective.

[0025] In the figure: 1. main body; 2. first cover; 3. second cover; 4. movable space; 5. pressure ring; 6. fine spring; 7. inner cavity; 8. clamping cavity; 9. inert medium; 10. discharge hole; 11. plastic plug; 12. copper sheet; 13. connecting piece; 14. tight hole; 15. cone cover; 16. through hole; 17. bite. DETAILED DESCRIPTION

[0026] The above and other embodiments and advantages of the present invention are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0027] In one embodiment, Figure 1-Figure 5 As shown:

[0028] The present embodiment provides a power diode device, including a body 1, a first cover 2 is sleeved on the upper section of the body 1, a second cover 3 is sleeved on the lower section of the body 1, an activity space 4 is provided between the opposite ends of the first cover 2 and the second cover 3, a pressure ring 5 is fixed on the opposite ends of the first cover 2 and the second cover 3, a thin spring 6 located in the activity space 4 is elastically connected between the two pressure rings 5, the thin spring 6 is sleeved on the outer periphery of the body 1, and the thin spring 6 can be a plastic spring, etc. When the first cover 2 and the second cover 3 move in relative directions, the thin spring 6 is compressed and shortened in the activity space 4, and when the two ends of the thin spring 6 elastically lengthen, the two pressure rings 5 ​​are used to push the first cover 2 and the second cover 3 to move in opposite directions;

[0029] The first pole pin passes through the first cover 2 upwards, and the second pole pin passes through the second cover 3 downwards. When the first cover 2 moves upwards, it also moves upwards along the first pole pin, and when the second cover 3 moves downwards, it also moves downwards along the second pole pin.

[0030] An inner cavity 7 is provided in the second cover 3, and the lower section of the body 1 passes through the inner cavity 7. A sandwich cavity 8 is formed between the inner cavity 7 and the outer wall of the second cover 3. The sandwich cavity 8 is filled with an inert medium 9. A discharge hole 10 is provided at the bottom end of the second cover 3. The discharge hole 10 communicates with the sandwich cavity 8. The discharge hole 10 is filled with a plastic plug 11. When the plastic plug 11 moves downward with the second cover 3 and approaches the PCB board, when the plastic plug 11 is plastically deformed, the inert medium 9 in the sandwich cavity 8 is discharged from the discharge hole 10 to the PCB board.

[0031] The bottom of the inner cavity of the second cover 3 and the bottom end of the body 1 are filled with expansion agent, the top of the inner cavity of the first cover 2 and the top end of the body 1 are filled with expansion agent, and the length of the first pole pin is greater than that of the second pole pin.

[0032] When the diode is actually used, the first pole pin is bent downward along the side of the body 1 and then welded on the PCB board, and the bottom end of the second pole pin is directly welded on the PCB board. The second cover 3 is located on the bottom side and the first cover 2 is located on the upper side. When the current transmitted to the two pins is large due to a circuit or component failure of the PCB board, a high heat will be transferred to the first cover 2 and the second cover 3 in a short time. Under the protective effect of the first cover 2 and the second cover 3, the high heat can make the body 1 have a certain heat insulation effect, so that the heat resistance of the body 1 is improved. As the heat on the PCB gets higher and higher, especially the high heat will be transferred to the second cover 3 at a close distance, and then transferred to the expansion agent at the bottom of the inner cavity of the second cover 3 through the second cover 3. When the heat reaches the expansion coefficient of the expansion agent, this part of the expansion agent will produce a strong expansion effect, which releases a driving force downward and applies this thrust to the second cover 3, pushing the second cover 3 down along the body 1. While the body 1 is descending, it also provides a thrust to the plastic plug 11, and the descending action of the body 1 brings the plastic plug 11 close to the PCB. At this time, the high temperature heat on the PCB will be transferred to the plastic plug 11 at a close distance. As the temperature on the plastic plug 11 increases, As the temperature increases, the plastic plug 11 will be deformed. Since the shape of the plastic deformation of the plastic plug 11 is irregular, the tightness between the plastic plug 11 and the discharge hole 10 will be reduced (loose). Since the discharge hole 10 is located at the bottom of the clamping cavity 8 and the clamping cavity 8 is filled with an inert medium 9, for example, when the inert medium 9 is an inert gas mixed with flame retardant powder, it has pressure due to being compressed in the clamping cavity 8. When the plastic plug 11 is loosened due to plastic deformation, the high-pressure inert medium 9 first pushes down the plastic plug 11, and then is quickly sprayed onto the PCB board through the discharge hole 10, and fire extinguishing or flame retardant is implemented for the heat source range on the PCB board. These inert substances are blocked between the bottom end of the body 1 and the top surface of the PCB board. When high heat is generated on the PCB board, the body 1 (diode) is well protected.

[0033] like Figures 3 to 5As shown, two copper sheets 12 are fixed on the bottom surface of the second cover 3, and the two copper sheets 12 are symmetrically arranged on both sides of the second pole pin. The copper sheet 12 is an arc-shaped thin plate that is gradually bent from one side of the second pole pin to the other side of the second pole pin. The two copper sheets 12 extend along both sides of the second pole pin to the bottom end of the second pole pin. The bottom ends of the two copper sheets 12 are pressed against the PCB board. When the second cover 3 descends, the two copper sheets 12 are brought down with them. The two copper sheets 12 will gradually bend downwards due to the bottom ends pressing against the PCB board. Under the support of the two copper sheets 12, the second cover 3 is prevented from falling completely onto the PCB board. In addition, since the discharge hole 10 is opened in the second cover 3, and the top ends of the two copper sheets 12 are connected to the side positions of the bottom surface of the second cover 3, and the two copper sheets 12 are symmetrically arranged on both sides of the plastic plug 11, and the two copper sheets 12 are inclined relative to the direction of the second pole pin. Therefore, when the discharge hole 10 is opened, in addition to most of the inert medium 9 falling directly on the PCB board, a part of the inert medium 9 falls on the two copper sheets 12 and is distributed on the second pole pin along the arc direction and the inclined style of the two copper sheets 12, directly blocking the heat source on the second pole pin, and also flame retardant the possible fire area of ​​the second pole pin within the range of the PCB board.

[0034] In another embodiment, if Figures 2 to 5 As shown, a connecting piece 13 close to the bottom of the plastic plug 11 is connected between the two copper sheets 12, and a tight hole 14 is opened in the middle of the plastic plug 11. When the connecting piece 13 moves upward as the two copper sheets 12 bend upward, it gradually approaches the tight hole 14. A cone thorn cover 15 is provided on the surface of the connecting piece 13. When the connecting piece 13 bends upward as the two copper sheets 12 and gradually approaches the tight hole 14, it can penetrate into the tight hole 14 to expand and open the tight hole 14.

[0035] The cone thorn cover 15 is a conical cover which tapers from the bottom to the top, and the top and bottom of the cone thorn cover 15 are connected. A through hole 16 is provided on the connecting piece 13, and the bottom end of the cone thorn cover 15 is connected to the through hole 16, and the bottom end opening of the cone thorn cover 15 is connected to the through hole 16 up and down.

[0036] When the two copper sheets 12 bend upward as the second cover 3 descends, the connecting sheet 13 will deflect upward and gradually approach the plastic plug 11 with the cone thorn cover 15. When the cone thorn cover 15 leans against the plastic plug 11, the cone thorn cover 15 will be gradually inserted into the tight hole 14 of the plastic plug 11 with the tip of the top end, so that the tight hole 14 is expanded, which will make the clamping cavity 8 corresponding to the top of the tight hole 14 communicate with the copper sheet 12 through the tight hole 14. At this time, the inert medium 9 in the clamping cavity 8 will flow through the tight hole 14. The inert medium 9 falls on the PCB and is discharged into the conical thorn cover 15 and then into the through hole 16 through the conical thorn cover 15. At this time, even if the heat on the PCB is not enough to cause the plastic plug 11 to undergo plastic deformation, even if the plastic plug 11 does not undergo plastic deformation and falls off from the discharge hole 10, the copper sheet 12 can be bent under the descending action of the second cover 3 to pierce the conical thorn cover 15 into the plastic plug 11, so that the inert medium 9 falls on the PCB and exerts its flame retardant function, thereby increasing the service life of the diode.

[0037] The two copper sheets 12 are provided with bites 17 on both sides, and the parts where the connecting pieces 13 are connected to the two copper sheets 12 are close to the bites 17. When the two copper sheets 12 continue to bend due to the bottom ends being pressed against the PCB board, the top parts are bent and deformed with the bites 17 as the deformation part, and the connecting piece 13 and the cone thorn cover 15 are inserted into the tight hole 14 of the plastic plug 11 while the bites 17 are bent and deformed. The opening of the bites 17 makes it easier for the two copper sheets 12 to bend at the bites 17, so that the two copper sheets 12 and the connecting piece 13 are deflected upward in a short time, and the cone thorn cover 15 is inserted into the plastic plug 11 through the top spike part through the upward deflection action of the connecting piece 13 in a short time, and the inert medium 9 in the second cover 3 is discharged to the PCB board in a short time, that is, when the PCB board is overheated, the time for the inert medium 9 to be discharged to the PCB board is shortened, so that the diode triggers the above-mentioned mechanism in a short time, and the service life of the diode is further improved.

[0038] The above orientation designations do not represent the specific orientations of the components in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme, and the orientations are described relatively with reference to the figures. In essence, the specific orientations of the components are described according to their actual installation and actual use as well as the customary orientations of technicians in this field. This is hereby explained.

[0039] The specific implementation methods described above further describe the invention purpose, technical solutions, and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A power diode device, characterized in that: The invention comprises a body (1), wherein a first cover (2) is sleeved on the upper section of the body (1), and a second cover (3) is sleeved on the lower section of the body (1); an activity space (4) is provided between the opposite ends of the first cover (2) and the second cover (3); a pressure ring (5) is fixed on the opposite ends of the first cover (2) and the second cover (3); a thin spring (6) located in the activity space (4) is elastically connected between the two pressure rings (5); the thin spring (6) is sleeved on the outer periphery of the body (1); when the first cover (2) and the second cover (3) move in relative directions, the thin spring (6) is compressed and shortened in the activity space (4); when the two ends of the thin spring (6) elastically lengthen, the two pressure rings (5) are used to push the first cover (2) and the second cover (3) to move in opposite directions; The first pole pin passes through the first cover (2) upwards, and the second pole pin passes through the second cover (3) downwards; when the first cover (2) moves upwards, it also moves upwards along the first pole pin, and when the second cover (3) moves downwards, it also moves downwards along the second pole pin; An inner cavity (7) is provided in the second cover (3), the lower section of the body (1) passes through the inner cavity (7), a sandwich cavity (8) is formed between the inner cavity (7) and the outer wall of the second cover (3), the sandwich cavity (8) is filled with an inert medium (9), a discharge hole (10) is provided at the bottom end of the second cover (3), the discharge hole (10) is communicated with the sandwich cavity (8), a plastic plug (11) is filled in the discharge hole (10), when the plastic plug (11) moves downward with the second cover (3), it approaches the PCB board, when the plastic plug (11) is plastically deformed, the inert medium (9) in the sandwich cavity (8) is discharged from the discharge hole (10) onto the PCB board; An expansion agent is filled between the bottom of the inner cavity of the second cover (3) and the bottom end of the body (1), and the length of the first pole pin is greater than the length of the second pole pin.

2. A power diode device according to claim 1, characterized in that: Two copper sheets (12) are fixed on the bottom surface of the second cover (3), the two copper sheets (12) are symmetrically arranged on both sides of the second pole pin, and the two copper sheets (12) extend along both sides of the second pole pin to the bottom end of the second pole pin.

3. A power diode device according to claim 2, characterized in that: The discharge hole (10) is opened at a side position of the second cover (3), and the top ends of the two copper sheets (12) are connected to the side positions of the bottom surface of the second cover (3) and are symmetrically arranged on both sides of the plastic plug (11).

4. A power diode device according to claim 3, characterized in that: The copper sheet (12) is an arc-shaped thin plate that is gradually bent from one side of the second pole pin to the other side of the second pole pin; When the bottom end of the second pole pin is welded on the PCB board, the bottom ends of the two copper sheets (12) elastically contact the PCB board, and when the second cover (3) moves downward, the two copper sheets (12) are pushed against the PCB board to continue to bend downward.

5. A power diode device according to claim 4, characterized in that: The two copper sheets (12) are inclined relative to the direction of the second pole pin.

6. A power diode device according to claim 5, characterized in that: A connecting piece (13) close to the bottom of the plastic plug (11) is connected between the two copper sheets (12); a tight hole (14) is provided in the middle of the plastic plug (11); when the connecting piece (13) moves upward as the two copper sheets (12) bend upward, it gradually approaches the tight hole (14); a cone thorn cover (15) is provided on the surface of the connecting piece (13); when the connecting piece (13) bends upward as the two copper sheets (12) bend upward and gradually approaches the tight hole (14), it can penetrate into the tight hole (14) to expand and open the tight hole (14); The cone thorn cover (15) is a cone-shaped cover which gradually tapers from the bottom to the top, and the top end of the cone thorn cover (15) is communicated with the bottom end.

7. A power diode device according to claim 6, characterized in that: The connecting piece (13) is provided with a through hole (16), the bottom end of the cone piercing cover (15) is connected to the through hole (16), and the bottom end opening of the cone piercing cover (15) is in vertical communication with the through hole (16).

8. A power diode device according to claim 7, characterized in that: Both sides of the two copper sheets (12) are provided with bites (17), and the parts where the connecting pieces (13) are connected to the two copper sheets (12) are close to the bites (17). When the two copper sheets (12) continue to bend due to the bottom ends being pressed against the PCB board, the top ends are bent and deformed with the bites (17) as the deformation parts, and while the bites (17) are bent and deformed, the connecting piece (13) carries the cone piercing cover (15) and pierces into the tight hole (14) of the plastic plug (11).

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