Circuit board assembly and electronic device

Abstract

The present application provides a circuit board assembly and an electronic device, relating to the technical field of electronic devices. The electronic device includes a housing, a circuit board assembly, and an electronic component. The circuit board assembly includes a circuit board, and the surface of the circuit board has a first area for arranging the electronic component, and only one electronic component can be arranged in the first area. A plurality of first solder joints and a plurality of second solder joints are arranged in the first area, and the plurality of first solder joints and the plurality of second solder joints are respectively used for connecting different electronic components. The present application is used to solve the problem that different circuit boards are manufactured for different electronic components, resulting in high production costs of the circuit boards.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the evolution of terminal electronic products, it has become common to have a normalized circuit board with a variety of different specifications of electronic devices. Since there are many manufacturers of electronic devices, the specifications of each electronic device are inconsistent. Therefore, different circuit boards need to be made for different electronic devices, resulting in an increase in the production cost of the circuit board. Summary of the Invention

[0003] This application provides a circuit board assembly and an electronic device, which are used to solve the problem that different circuit boards are made for different electronic devices, resulting in a high production cost of the circuit board.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] In a first aspect, this application provides a circuit board assembly, including a circuit board. The surface of the circuit board has a first area for setting an electronic device, and only one electronic device can be set in the first area. The first area is provided with a plurality of first solder joints and a plurality of second solder joints, and the plurality of first solder joints and the plurality of second solder joints are respectively used to connect different electronic devices.

[0006] The circuit board assembly provided in the first aspect of this application realizes that different electronic devices can be selectively connected in the same area of the circuit board by setting the first solder joints and the second solder joints in the first area, thereby improving the applicable range of the circuit board, effectively reducing the production cost of the circuit board, and meeting the normalized design requirements of the circuit board.

[0007] In a possible implementation manner of the first aspect, the plurality of first solder joints are sequentially distributed to form an annular area, and the plurality of second solder joints are arranged in the annular area.

[0008] In this structure, based on the formation of an annulus by the plurality of first solder joints, the range covered by the electronic device connected by the first solder joints on the first area is relatively large. By arranging the second solder joints in the annular area, the range covered by the electronic device connected by the second solder joints in the first area is also relatively large. Compared with dividing the first solder joints and the second solder joints into a left-right layout in the width direction or an up-down layout in the length direction in the first area, the annular area will make the area covered by the electronic device in the first area larger, thus being beneficial to improving the connection strength of the electronic device in the first area.

[0009] In another possible implementation of the first aspect, the multiple second solder joints include multiple first sub-solder joints and multiple second sub-solder joints. The multiple first sub-solder joints are sequentially distributed along the length direction of the annular region, and the multiple second sub-solder joints are sequentially distributed along the length direction of the annular region. The multiple first sub-solder joints and the multiple second sub-solder joints are sequentially and alternately distributed along the length direction of the annular region, and the first sub-solder joints and the second sub-solder joints are distributed along the width direction of the annular region.

[0010] In this way, it is beneficial to increase the distance between two adjacent first sub-solder joints and second sub-solder joints, and can reduce the risk that when the multiple second solder joints are connected to the electronic device, the solder flows on the first sub-solder joints and the second sub-solder joints gather together, resulting in the short circuit of the electronic device or the circuit board due to the connection between the two solder joints, and improves the welding reliability of the second solder joints.

[0011] In another possible implementation of the first aspect, along the width direction of the annular region, the first sub-solder joint and the adjacent first solder joint with the smallest distance are used to connect the same functional circuit of the circuit board.

[0012] In this way, when the electronic device is soldered to the multiple first solder joints in the first region, even if the solder of the first solder joint flows to the second solder joint with a relatively short distance and causes the connection between the two solder joints. Since the two solder joints are connected to the same functional circuit, therefore, the short circuit situation will not occur, which is beneficial to ensuring the stability of the electrical connection between the electronic device and the circuit board, and thus ensuring the reliability of the overall circuit on the circuit board.

[0013] In another possible implementation of the first aspect, along the width direction of the annular region, the second sub-solder joint and the adjacent first solder joint with the smallest distance are used to connect the same functional circuit of the circuit board.

[0014] In this way, when the electronic device is soldered to the multiple first solder joints in the first region, even if the solder of the first solder joint flows to the second solder joint and causes the solder to flow between the solder joints, the circuit board or the electronic device will not be short-circuited due to the solder flow, ensuring the stability of the electrical connection between the electronic device and the circuit board, and thus ensuring the reliability of the overall circuit on the circuit board.

[0015] In another possible implementation of the first aspect, multiple third solder joints are further provided on the first region. The third solder joints are arranged outside the annular region, and the third solder joints and the second solder joints are used to connect the same electronic device.

[0016] In this way, due to the limited space within the annular region, the number of multiple second solder joints is restricted by the annular space. Therefore, third solder joints are provided outside the annular region, and the same electronic device is connected through the second solder joints and the third solder joints, thereby being able to enhance the connection strength between the electronic device and the circuit board, so as to reduce the risk of the solder joints between the electronic device and the circuit board breaking due to bumping or impact, and causing the separation of the electronic device from the circuit board.

[0017] In another possible implementation manner of the first aspect, the circuit board assembly further includes an adapter board, the adapter board has a first surface and a second surface arranged opposite to each other, the first surface is used for connecting with the second solder joints, and a plurality of fourth solder joints are arranged on the second surface, and the fourth solder joints and the first solder joints are used for connecting different electronic devices.

[0018] In this way, based on different specifications of electronic devices with different pin sequences, one electronic device is connected through the circuit board, and another electronic device is connected through the adapter board, realizing the compatibility of the circuit board and the adapter board, which is beneficial to the development trend of the normalization of the circuit board.

[0019] Exemplarily, the electronic device can be a camera module, and the pin wire sequences of different models of camera modules are different. Therefore, the first solder joints on the circuit board can be used to connect one model of camera module, and the fourth solder joints on the adapter board can be used to connect another model of camera module, thereby being beneficial to improving the compatibility of the circuit board assembly and being beneficial to the development trend of the normalization of the circuit board.

[0020] In another possible implementation manner of the first aspect, the circuit board has a hollowed-out area, and the adapter board is fixed within the hollowed-out area.

[0021] In this way, the materials of the adapter board can be provided by the materials in the reserved hollowed-out area of the circuit board. For example, before the production line workers cut off the materials in the hollowed-out area, the materials in the hollowed-out area can be used to process the shape of the adapter board. The materials of the adapter board are completely provided by the board body of the circuit board. Although the structure of the adapter board is increased, no new materials are added, saving the cost of the adapter board and realizing a zero-cost compatible design of the adapter board.

[0022] In another possible implementation manner of the first aspect, a plurality of adapter boards are provided, and all the plurality of adapter boards are arranged within the hollowed-out area.

[0023] In this way, various different types or multiple same types of adapter boards can be processed at any position on the circuit board that needs to be processed into a hollowed-out area, without adding extra materials to process the adapter board, expanding the usage value of the circuit board and saving the cost of the adapter board.

[0024] In another possible implementation of the first aspect, at least one edge of the adapter board is fixedly connected to the side wall of the hollowed-out area. In this way, at least one side of the adapter board is connected to the side wall of the hollowed-out area, which plays a role in fixing the adapter board.

[0025] In another possible implementation of the first aspect, the circuit board further has a second area. The adapter board can cover the first area and the second area, and the first surface of the adapter board can be connected to the solder joints in the second area.

[0026] In this structure, on the one hand, the adapter board is not only connected to the second solder joint and the third solder joint, but also connected to the solder joints in the second area, increasing the connection area between the adapter board and the circuit board and further strengthening the reliability of the connection between the adapter board and the circuit board. On the other hand, the second area can also be used to set other electronic devices. For example, it is used to weld a flash module, a screen, an FPC board, a sensor, a capacitor, a resistor, etc. This expands the practicality of the adapter board and improves its use value.

[0027] In a second aspect, the present application provides an electronic device, which includes a housing, a circuit board assembly, and an electronic device. The circuit board assembly is disposed in the housing, and the electronic device is disposed in the first area of the circuit board of the circuit board assembly.

[0028] For the electronic device provided in the second aspect of the present application, since it includes the circuit board assembly as described in any of the above technical solutions. Therefore, it can solve the same technical problems and achieve the same technical effects. That is, by setting the first solder joint and the second solder joint in the first area, it is possible to selectively connect different electronic devices in the same area of the circuit board, thereby increasing the applicable range of the circuit board, effectively reducing the production cost of the circuit board, and meeting the normalization design requirements of the circuit board.

[0029] In another possible implementation of the second aspect, the electronic device includes a first electronic device, and the first electronic device is fixedly connected to the first solder joint. Exemplarily, the first electronic device can be a camera module, and the pin wire sequence corresponding to the camera module matches the first solder joint.

[0030] In another possible implementation of the second aspect, the electronic device includes a second electronic device, the adapter board of the circuit board assembly is fixedly connected to the second solder joint, and the second electronic device is disposed on the surface of the adapter board away from the circuit board. Exemplarily, the second electronic device can be another camera module, and the pin wire sequence corresponding to the camera module matches the fourth solder joint on the adapter board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of the electronic device provided by the embodiment of the present application;

[0032] Figure 2 Explosion diagram of the electronic device provided by the embodiment of the present application;

[0033] Figure 3 Schematic diagram of the structure where the camera module is connected to the circuit board;

[0034] Figure 4 Schematic diagram of the structure of a circuit board assembly provided by the embodiment of the present application;

[0035] Figure 5 Schematic diagram of the pin sequence of a camera module provided by the embodiment of the present application;

[0036] Figure 6 Schematic diagram of the pin sequence of another camera module provided by the embodiment of the present application;

[0037] Figure 7 Schematic diagram of the structure of another circuit board assembly provided by the embodiment of the present application;

[0038] Figure 8 Schematic diagram of the structure of the first area of another circuit board assembly provided by the embodiment of the present application;

[0039] Figure 9 Schematic diagram of the structure of the adapter board of another circuit board assembly provided by the embodiment of the present application;

[0040] Figure 10 Schematic diagram of the structure of the connection state between the circuit board and the second electronic device through the adapter board in another circuit board assembly provided by the embodiment of the present application;

[0041] Figure 11 Schematic diagram of the structure of the circuit board assembly provided by the related art;

[0042] Figure 12 Schematic diagram of the structure of an adapter board included in the circuit board assembly provided by the related art;

[0043] Figure 13 Schematic diagram of the structure of another adapter board included in the circuit board assembly provided by the related art;

[0044] Figure 14 Schematic diagram of the structure of the hollowed-out area in another circuit board assembly provided by the embodiment of the present application;

[0045] Figure 15 Schematic diagram of the structure of the second area of another circuit board assembly provided by the embodiment of the present application;

[0046] Figure 16 For Figure 15 Schematic diagram of the structure where a flash module is provided on the second area of the provided circuit board assembly.

[0047] Reference Signs

[0048] 100 - Electronic device;

[0049] 1 - Display module; 11 - Display screen; 12 - Translucent cover plate;

[0050] 2 - Housing; 21 - Rear cover; 22 - Frame; 23 - Accommodation cavity; 24 - Middle plate;

[0051] 3 - Camera module;

[0052] 4 - Circuit board assembly; 41 - Circuit board; 411 - First area; 412 - Second area; 42, Adapter board; 42a - First adapter board; 42b - Second adapter board; 421 - First surface; 422 - Second surface; 43 - Hollow area;

[0053] 5 - FPC board;

[0054] 6 - BTB connector; 61 - Male head; 62 - Female socket;

[0055] 7 - Flashlight module; 71 - Elastic piece;

[0056] H - First general soldering point; Q - Second general soldering point;

[0057] F - First soldering point; S - Second soldering point; S1 - First sub - soldering point; S2 - Second sub - soldering point; T - Third soldering point; E - Fourth soldering point; V - Fifth soldering point; X - Sixth soldering point. Detailed Implementation Manner

[0058] In the embodiments of the present application, terms such as "exemplarily" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly, using terms such as "exemplarily" or "for example" aims to present relevant concepts in a specific manner.

[0059] In the description of the embodiments of the present application, the term "and / or" means and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0060] In the description of the embodiments of the present application, unless otherwise clearly defined and limited, the terms "install", "connect", and "couple" shall be understood in a broad sense. For example, "connect" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0061] In the description of the embodiments of the present application, the term "comprise", "include" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0062] The embodiments of the present application provide an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For the convenience of description hereinafter, the electronic device is taken as a mobile phone as an example for illustration.

[0063] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic structural diagram of the electronic device 100 provided by the embodiments of the present application, Figure 2 and which is an exploded view of the electronic device 100 provided by the embodiments of the present application. As can be seen from the above, in this embodiment, the electronic device 100 is a mobile phone, and the electronic device 100 may have an approximately rectangular plate-like structure. The electronic device 100 may include a display module 1, a housing 2, a circuit board assembly 4, and electronic components.

[0064] For the convenience of describing the following embodiments, a coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (i.e., the stacking direction of the display screen 11 and the light-transmitting cover plate 12) is defined as the Z-axis direction (i.e., the second direction), and the directions perpendicular to the Z-axis are the Y-axis direction (i.e., the first direction) and the X-axis direction (i.e., the third direction), respectively, and the Y-axis direction and the X-axis direction are perpendicular. Specifically, in this embodiment, the electronic device 100 has an approximate rectangular plate-like structure, where the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited herein.

[0065] The above display module 1 is used to display images, videos, etc. The display module 1 may include a light-transmitting cover plate 12 and a display screen 11 (English name: panel, also known as the display panel), and the light-transmitting cover plate 12 and the display screen 11 are stacked. The material of the light-transmitting cover plate 12 includes but is not limited to glass. For example, the light-transmitting cover plate 12 can be an ordinary light-transmitting cover plate 12, which is used to protect the display screen 11 to prevent the display screen 11 from being damaged by external forces and can also play a role in dust prevention. Or, the light-transmitting cover plate 12 can also be a light-transmitting cover plate 12 with a touch function, so that the electronic device 100 has a touch function, making it more convenient for users to use. Therefore, the specific material of the light-transmitting cover plate 12 in this application is not specifically limited.

[0066] In addition, the above display screen 11 can be a flexible display screen or a rigid display screen. For example, the display screen 11 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0067] The above-mentioned housing 2 is used to protect the electronic components inside the electronic device 100. The housing 2 may include a rear cover 21 and a frame 22. The rear cover 21 is located on the side of the display screen 11 away from the light-transmitting cover plate 12, and is stacked with the light-transmitting cover plate 12 and the display screen 11. The frame 22 is located between the light-transmitting cover plate 12 and the rear cover 21. The frame 22 is fixed to the rear cover 21. Exemplarily, the frame 22 can be fixed to the rear cover 21 by means such as adhesion, screw connection, welding, snap connection, etc.; alternatively, the frame 22 and the rear cover 21 can also be an integrally formed structure, that is, the frame 22 and the rear cover 21 form a structural member as a whole. The light-transmitting cover plate 12 can be fixed to the frame 22 by gluing, so that the light-transmitting cover plate 12, the rear cover 21 and the frame 22 enclose a receiving cavity 23 inside the electronic device 100, and the above-mentioned circuit board 41 and electronic components are all arranged in the receiving cavity 23.

[0068] In some embodiments, the above-mentioned housing 2 may further include a middle plate 24. The middle plate 24 is arranged in the above-mentioned receiving cavity 23 and is located on the side of the display screen 11 away from the light-transmitting cover plate 12. The middle plate 24 is fixedly connected to the frame 22 to form the middle frame of the electronic device 100. Exemplarily, the middle plate 24 and the frame 22 can be fixedly connected by means such as gluing, screw connection, welding, snap connection, etc.; alternatively, the middle plate 24 and the frame 22 can also be an integrally formed structure, that is, the middle plate 24 and the frame 22 form a structural member as a whole. The middle plate 24 divides the above-mentioned receiving cavity 23 into two independent spaces. One space is between the light-transmitting cover plate 12 and the middle plate 24, and the display screen 11 is located in this space. The other space is between the middle plate 24 and the rear cover 21, and the above-mentioned circuit board assembly 4 is located in this space.

[0069] The above-mentioned electronic components are used to implement various functions of the electronic device 100. For example, the electronic components can be a camera module 3, a flash module, a control chip (such as a system-on-chip, SOC), a graphics control chip (graphics processing unit, GPU), a universal flash storage (UFS), and capacitors, resistors, inductors, etc. In the following embodiments, the electronic component is taken as the camera module 3 as an example for description.

[0070] The above-mentioned circuit board assembly 4 is used to arrange different electronic components of the electronic device 100 to implement different functions of the electronic device 100. The circuit board 41 can be fixed to the middle plate 24 by means such as gluing, screw connection, welding, snap connection, etc. Therefore, the present application does not make special limitations on the fixing method of the circuit board 41.

[0071] Among them, the circuit board assembly 4 may include a circuit board 41. The above camera module 3 may be fixed on the circuit board 41 or electrically connected to the circuit board 41 through an electrical connector. Exemplarily, the electrical connector may be an FPC board 5 (Flexible Printed Circuit Board), a spring piece, or other forms of electrical connectors. Please refer to Figure 3 , Figure 3 which is a schematic structural diagram of the connection between the camera module 3 and the circuit board 41. One end of the FPC board 5 is electrically connected to the camera module 3, and the other end of the FPC board 5 is electrically connected to the circuit board 41 to achieve electrical connection between the camera module 3 and the circuit board 41.

[0072] Among them, the length direction of the circuit board 41 is the Y-axis direction of the aforementioned electronic device 100; the thickness direction of the circuit board 41 is the Z-axis direction of the aforementioned electronic device 100; the width direction of the circuit board 41 is the X-axis direction of the aforementioned electronic device 100.

[0073] In some examples, please continue to refer to Figure 3 , the FPC board 5 and the circuit board 41 may be connected by a connector. For example, the connector may be a BTB connector 6 (Board To Board Connector), an on-board connector, or a modular connector, etc. In this application, the connector is exemplified by the BTB connector 6.

[0074] Specifically, the BTB connector 6 includes a male head 61 and a female socket 62. The male head 61 is used for fixedly connecting to the above FPC board 5, and the corresponding female socket 62 is used for fixedly connecting to the above circuit board 41, which is beneficial to improving the connection reliability between the FPC board 5 and the circuit board 41 and reducing the processing and installation difficulty.

[0075] In some other possible examples, it may also be that the male head 61 is fixedly connected to the circuit board 41, and the corresponding female socket 62 is fixedly connected to the FPC board 5. Therefore, this application does not make special limitations on this.

[0076] In addition, the above BTB connector 6 can be electrically connected to the solder joints on the circuit board 41 through its own pins. The specific process for processing the solder joints on the circuit board 41 is as follows:

[0077] First, the circuit board 41 is subjected to windowing treatment. Among them, windowing treatment refers to removing the solder mask layer (i.e., the protective layer) on the surface of the circuit board 41 at the position where solder joints need to be set on the circuit board 41 through an opening process method (such as drilling, milling, etc.) to expose the substrate inside the circuit board 41.

[0078] Next, a stencil is set on the surface of the circuit board 41, and the mesh holes on the stencil are arranged in one-to-one correspondence with the above-mentioned openings. Then, solder paste is applied to the surface of the stencil away from the circuit board 41, so that the solder paste fills the mesh holes and the above-mentioned openings. After the solder paste solidifies to form solder joints, the stencil can be removed.

[0079] Finally, the pins of the BTB connector 6 are soldered to the solder joints on the circuit board 41. For example, it can be through reflow soldering, thermocompression bonding, etc.

[0080] Exemplarily, please refer to Figure 4 , Figure 4 which is a schematic structural diagram of a circuit board assembly 4 provided by an embodiment of the present application. In this circuit board assembly 4, the surface of the circuit board 41 has a first region 411. The surface of the circuit board 41 can be the surface of the circuit board 41 facing the Figure 2 shown rear cover 21 side; it can also be the surface of the circuit board 41 facing the Figure 2 shown middle plate 24 side. In the embodiment of the present application, the surface of the circuit board 41 facing the rear cover 21 side is taken as an example for illustration.

[0081] A plurality of first general solder joints H processed by the above process are provided in the first region 411. The first general solder joints H are used to connect electronic devices (such as the camera module 3) through the BTB connector 6. However, for different electronic devices, the pin sequences are also different. Please refer to Figure 5 and Figure 6 , Figure 5 which is a schematic diagram of the pin sequence of a camera module 3 provided by an embodiment of the present application, Figure 6 which is a schematic diagram of the pin sequence of another camera module 3 provided by an embodiment of the present application.

[0082] Among them, different pins of the camera module 3 can be used to connect different functional circuits. Therefore, when the pin wire sequences are different, the solder joints corresponding to the pins on the circuit board 41 also need to connect different functional circuits. For example, Figure 5 the signal a1 connected by the corresponding pin A of the camera module 3 shown is different from the signal a2 connected by the pin A of the camera module 3 shown in Figure 6 , that is, the signals a1 and a2 are respectively connected to different functional circuits. Therefore, for these two camera modules 3, corresponding solder joints need to be processed on different circuit boards 41 respectively, that is, two circuit boards 41 need to be processed separately.

[0083] Among them, the functional circuit refers to the circuit in the circuit board 41 used to implement different functions. Exemplarily, for the camera module 3 of the electronic device 100, different functions need to be controlled based on different functional circuits respectively. For example, functions such as autofocus, anti-shake, shooting, or video recording of the camera module 3.

[0084] In this way, when processing the circuit board 41 on the production line, for different camera modules 3, it is necessary to process a variety of different circuit boards 41 for different pin sequences respectively, that is, to process the soldering pins of different circuit boards 41 separately to adapt to a variety of camera modules 3. Such a method will increase the production cost and material cost of the circuit board 41, prolong the development cycle of the electronic device 100, and increase the production cost of the electronic device 100.

[0085] In some examples, to solve the above problems, the circuit board 41 can be selectively connected to different electronic devices by means of jumpers on the circuit board 41. Specifically, solder joints for connecting the camera module 3 are provided on the circuit board 41. In the scenario where the Figure 5 shown camera module 3 is required, the solder joints on the circuit board 41 are connected to the corresponding pins of the camera module 3 through jumpers, thereby realizing the electrical connection between the two. In the scenario where the Figure 6 shown camera module 3 is required, on the circuit board 41, the signals required by the Figure 6 shown camera module 3 are connected through jumpers.

[0086] This requires that the number of pins of the two camera modules 3 be the same to implement the jumper scheme, which narrows the applicable range of the circuit board 41. Moreover, the resistance required for the jumpers is relatively high, resulting in relatively high power consumption requirements for the battery of the electronic device 100.

[0087] In addition, the jumpers need to occupy a relatively large space for wiring on the circuit board 41. Therefore, it affects the distribution of other electronic devices and is not conducive to the miniaturization of the electronic device 100.

[0088] Moreover, the problem of wire aging in the jumper scheme is inevitable. Wire aging will cause the signal quality of the electronic device 100 to deteriorate, and will bring the problem that the high-speed signal eye diagram cannot meet the threshold constraint. Therefore, the jumper scheme has relatively strict requirements on the number of transferred signals, the layer order of the circuit board 41, and the layout area.

[0089] Based on this, the embodiment of the present application provides another circuit board assembly 4. Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of another circuit board assembly 4 provided by the embodiment of the present application. In this circuit board assembly 4, only one electronic device, such as the above-mentioned camera module 3, can be set in the first area 411 on the surface of the circuit board 41. Among them, the camera module 3 is electrically connected to the circuit board 41 through the above-mentioned FPC board 5 and BTB connector 6, that is, the BTB connector 6 is fixed on the first area 411.

[0090] Among them, a plurality of first solder joints F and a plurality of second solder joints S are provided in the first region 411. The plurality of first solder joints F and the plurality of second solder joints S are respectively used to connect different electronic devices. That is to say, the electronic devices may include a first electronic device and a second electronic device. Exemplarily, the first electronic device and the second electronic device may be Figure 5 the camera module 3 shown in Figure 6 and the camera module 3 shown in Figure 5 The BTB connector 6 corresponding to the camera module 3 shown in can be fixedly connected to a plurality of first solder joints F. Figure 6 The camera module 3 shown in can be connected to a plurality of second solder joints S.

[0091] In this way, by providing a plurality of first solder joints F and a plurality of second solder joints S in the first region 411, it is realized that different electronic devices can be selectively connected in the same region of the circuit board 41, thereby improving the applicable range of the circuit board 41 and effectively reducing the production cost of the circuit board 41, meeting the normalization design requirements of the circuit board 41.

[0092] It should be noted that the normalization of the circuit board 41 means that in the same region on the circuit board 41, different types or different models of electronic devices can be selectively connected. For example, the above Figure 5 and Figure 6 The two different models of camera modules 3 shown can both be arranged in the first region 411 of the above circuit board 41 and can be selected based on actual needs, so that the applicable range of the circuit board 41 is wider.

[0093] In addition, the first electronic device and the second electronic device are not limited to the above camera module 3, and may also be other types of electronic devices. For example, a flash module, a capacitor, a resistor, an inductor, etc. Therefore, this application does not make special limitations on this.

[0094] In some examples, the shape of the first solder joint F includes but is not limited to a circle, a polygon, an ellipse, a semi - circle, a racetrack shape, or an irregular shape. And, the shape of the second solder joint S includes but is not limited to a circle, a polygon, an ellipse, a semi - circle, a racetrack shape, or an irregular shape. Therefore, the embodiments of this application do not make special limitations on this.

[0095] Please continue to refer to Figure 7, in some embodiments of the present application, a plurality of first solder joints F are sequentially distributed to form an annular region, and a plurality of second solder joints S are disposed within the annular region. In this structure, the plurality of first solder joints F form a ring. That is, the range covered by the electronic devices connected by the first solder joints F on the first region 411 is relatively large. By disposing the second solder joints S within the annular region, the range covered by the electronic devices connected by the second solder joints S within the first region 411 is also relatively large. Compared with dividing the first solder joints F and the second solder joints S into a left-right layout in the width direction or an up-down layout in the length direction in the first region 411, the area covered by the electronic devices within the first region 411 is larger, which is beneficial to improving the connection strength of the camera module 3 within the first region 411.

[0096] Among them, the plurality of second solder joints S may include a plurality of first sub-solder joints S1 and a plurality of second sub-solder joints S2. The plurality of first sub-solder joints S1 are sequentially distributed along the length direction of the annular region, and the plurality of second sub-solder joints S2 are sequentially distributed along the length direction of the annular region. The plurality of first sub-solder joints S1 and the plurality of second sub-solder joints S2 are sequentially and alternately distributed along the length direction of the annular region, and the plurality of first sub-solder joints S1 and the plurality of second sub-solder joints S2 are distributed along the width direction of the annular region.

[0097] In this way, it is beneficial to increase the distance between two adjacent first sub-solder joints S1 and second sub-solder joints S2, and can reduce the risk that when the plurality of second solder joints S are connected to the electronic devices, the solder flows on the first sub-solder joints S1 and the second sub-solder joints S2 converge together, resulting in a short circuit of the camera module 3 or the circuit board 41 due to the connection between the two solder joints, and improves the soldering reliability of the second solder joints S.

[0098] In some possible examples, the length direction of the annular region may correspond to the length direction of the circuit board 41; the thickness direction of the annular region may correspond to the thickness direction of the circuit board 41; the width direction of the annular region may correspond to the thickness direction of the circuit board 41. This corresponding manner is only one possible example, and the direction of the annular region can be flexibly defined based on actual requirements.

[0099] In addition, along the width direction of the annular region, the plurality of first sub-solder joints S1 and the adjacent first solder joint F with the smallest distance can be used to connect the same functional circuit of the circuit board 41. And, along the width direction of the annular region, the plurality of second sub-solder joints S2 and the adjacent first solder joint F with the smallest distance are used to connect the same functional circuit of the circuit board 41.

[0100] In this way, when the camera module 3 is soldered to a plurality of first solder joints F in the first region 411, even if the solder of the first solder joint F flows to the relatively close second solder joint S and connects the two solder joints together, since the two solder joints are connected to the same functional circuit, short circuit will not occur, ensuring the stability of the electrical connection between the electronic device and the circuit board 41, and thus ensuring the reliability of the circuit on the circuit board 41.

[0101] In some embodiments, please refer to Figure 8 , Figure 8 which is a schematic structural diagram of another first region 411 of the circuit board assembly 4 provided by the embodiment of the present application. A plurality of third solder joints T are further provided on the first region 411, and the plurality of third solder joints T are arranged outside the annular region. The third solder joints T and the second solder joints S are used to connect the same electronic device. Exemplarily, the plurality of third solder joints T and the plurality of second solder joints S can be used to connect the second electronic device (such as Figure 6 the camera module 3 shown).

[0102] In this way, based on the limited space within the annular region, the number of the plurality of second solder joints S is limited by the space within the annular region. Therefore, the third solder joints T are arranged outside the annular region, and the same electronic device is connected through the second solder joints S and the third solder joints T, thereby being able to improve the connection strength between the electronic device (such as Figure 6 the BTB connector 6 corresponding to the camera module 3 shown) and the circuit board 41, so as to reduce the risk that the solder joints between the electronic device and the circuit board 41 are broken due to bumping or impact, causing the electronic device to be separated from the circuit board 41.

[0103] In some examples, at least one row of the plurality of third solder joints T can be arranged in both the length direction and the width direction outside the annular region to enhance the reliability between the circuit board 41 and the second electronic device ( Figure 6 the camera module 3 shown).

[0104] In some examples, the shape of the third solder joint T includes but is not limited to circular, polygonal, elliptical, waist-shaped, semi-circular, racetrack-shaped or special-shaped.

[0105] On this basis, the above circuit board assembly 4 may further include an adapter board 42. Please refer to Figure 9 , Figure 9 which is a schematic structural diagram of another adapter board 42 of the circuit board assembly 4 provided by the embodiment of the present application. The adapter board 42 has a first surface 421 and a second surface 422 which are opposite to each other. The first surface 421 is the surface of the adapter board 42 facing the circuit board 41, and the second surface 422 is the surface of the adapter board 42 away from the circuit board 41.

[0106] The first surface 421 of the adapter board 42 can be fixedly connected to the above-mentioned second solder joint S and third solder joint T. A plurality of fourth solder joints E are provided on the second surface 422 of the adapter board 42, and the fourth solder joints E and the first solder joint F are used to connect different electronic devices.

[0107] Exemplarily, the first solder joint F on the surface of the circuit board 41 can be used to connect a first electronic device (such as Figure 5 the camera module 3 shown). The fourth solder joint E on the second surface 422 of the adapter board 42 can be used to connect a second electronic device (such as Figure 6 the camera module 3 shown).

[0108] Please refer to Figure 10 , Figure 10 FIG. is a schematic structural diagram of the connection state of the circuit board 41 to the second electronic device through the adapter board 42 in another circuit board assembly 4 provided by the embodiment of the present application. Among them, the second electronic device can be a camera module 3 (for example, the pin sequence of the camera module 3 can be Figure 6 the structure shown), and the camera module 3 can be fixedly connected to the fourth solder joint E through the FPC board 5 and the BTB connector 6.

[0109] Thus, based on Figure 5 the pin sequence of the camera module 3 shown is different from Figure 6 the pin sequence of the camera module 3 shown, connect Figure 5 the camera module 3 shown through the first solder joint F of the circuit board 41, and the adapter board 42 connects Figure 6 the camera module 3 shown. Through the adapter board 42, at least two different camera modules 3 can be set in the same area (i.e., the first area 411) on the circuit board 41 to improve the compatibility of the circuit board 41, which is beneficial to the normalization development trend of the circuit board 41.

[0110] In other embodiments of the present application, it can also be that the first surface 421 is connected to a plurality of first solder joints F, or the first surface 421 can also be used to connect to a plurality of third solder joints T.

[0111] It should be noted that during the process of brushing solder paste on the circuit board 41 and the adapter board 42, three stencils are used, namely: stencil a corresponding to the first solder joint F on the surface of the circuit board 41, stencil b corresponding to the fourth solder joint E on the second surface 422 of the adapter board 42, and stencil c corresponding to the second solder joint S and third solder joint T on the surface of the circuit board 41. They are respectively referred to as stencil a, stencil b, and stencil c hereinafter, and stencil a, stencil b, and stencil c are not interchangeable. The specific situation of stencil use is as follows:

[0112] The first solder joint F of the circuit board 41 is connected to Figure 5The shown camera module 3 is connected in a supporting manner. A stencil a can be used to brush solder paste on multiple first solder joints F on the circuit board 41.

[0113] The fourth solder joint E on the second surface 422 of the adapter board 42 is connected in a supporting manner with Figure 5 the shown camera module 3. A stencil b is used to brush solder paste on the fourth solder joint E.

[0114] In order to connect the first area 411 of the circuit board 41 with the first surface 421 of the adapter board 42, a stencil c is used to brush solder paste on the second solder joint S and the third solder joint T.

[0115] Based on this, in the related art, a circuit board assembly 4 is provided. Please refer to Figure 11 , Figure 11 which is a schematic structural diagram of the circuit board assembly 4 provided by the related art. The circuit board assembly 4 includes a circuit board 41 and an adapter board 42. Multiple second common solder joints Q are arranged on the first area 411 of the circuit board 41. The first area 411 of the circuit board 41 is used to arrange different adapter boards 42, and different adapter boards 42 are used to connect different electronic devices (for example, Figure 5 the shown camera module 3 and Figure 6 the shown camera module 3).

[0116] In some examples, please refer to Figure 12 , Figure 12 which is a schematic structural diagram of an adapter board 42 included in the circuit board assembly 4 provided by the related art. The adapter board 42 may include a first adapter board 42a. The first adapter board 42a includes a first surface 421 and a second surface 422. Second common solder joints Q for supporting connection with the first area 411 are arranged on the first surface 421.

[0117] The first area 411 of the circuit board 41 can be electrically connected to the first surface 421 of the first adapter board 42 through the second common solder joints Q. Multiple fifth solder joints V are arranged on the second surface 422 of the first adapter board 42. The multiple fifth solder joints V can be used to connect Figure 5 the shown camera module 3.

[0118] In other examples, please refer to Figure 13 , Figure 13 which is a schematic structural diagram of another adapter board 42 included in the circuit board assembly 4 provided by the related art. The adapter board 42 may further include a second adapter board 42b. The second adapter board 42b includes a first surface 421 and a second surface 422. Second common solder joints Q for supporting connection with the first area 411 are arranged on the first surface 421.

[0119] The first region 411 of the circuit board 41 can be electrically connected to the first surface 421 of the second adapter board 42b through the second common solder joints Q. A plurality of sixth solder joints X are provided on the second surface 422 of the second adapter board 42b, and the plurality of sixth solder joints X are used to connect Figure 6 the camera module 3 shown.

[0120] It can be seen from this that in the circuit board assembly 4 provided by the related art, by replacing different adapter boards 42, that is, the above-mentioned first adapter board 42a and second adapter board 42b, the circuit board 41 can be selectively connected to different camera modules 3. Compared with the embodiments of the present application, the processing cost of the adapter board 42 is increased in the related art.

[0121] In addition, during the process of brushing solder paste on the circuit board 41 and the adapter board 42 (the first adapter board 42a and the second adapter board 42b) provided by the above-mentioned related art, three stencils also need to be used, namely: the stencil d corresponding to the second common solder joint Q on the first region 411 of the circuit board 41 and the first surface 421 of the first adapter board 42a, the stencil e corresponding to the fifth solder joint V on the first adapter board 42a, and the stencil f corresponding to the sixth solder joint X on the second adapter board 42b. They are respectively referred to as stencil d, stencil e, and stencil f hereinafter. Three stencils, namely stencil d, stencil e, and stencil f, are used respectively, and stencil d, stencil e, and stencil f are not universal. The specific situation of stencil use is as follows:

[0122] In order to connect the first region 411 of the circuit board 41 to the first surface 421 of the first adapter board 42a, solder paste can be brushed on the second common solder joint Q on the first region 411 and the first surface 421 using the stencil d.

[0123] In order to connect the first adapter board 42a to Figure 5 the camera module 3 shown, solder paste can be brushed on the fifth solder joint V on the second surface 422 of the first adapter board 42a using the stencil e.

[0124] In order to connect the second adapter board 42b to Figure 6 the camera module 3 shown, solder paste can be brushed on the sixth solder joint X on the second surface 422 of the second adapter board 42b using the stencil f.

[0125] It can be seen from this that compared with this related art, the number of times of using the stencil is the same in the embodiments of the present application, and the cost of the stencil has not increased. However, the embodiments of the present application can connect different camera modules 3 through the circuit board 41 and the adapter board 42 respectively (for example, Figure 5 the camera module 3 shown and Figure 6 the camera module 3 shown), so that it is not necessary to set a variety of different adapter boards 42 (that is, it is not necessary to manufacture the second adapter board 42b). Therefore, it is beneficial to save the processing cost.

[0126] In some embodiments of the present application, the circuit board 41 has a hollowed-out area 43. Please refer to Figure 14 , Figure 14 which is a schematic structural diagram of the hollowed-out area 43 in another circuit board assembly 4 provided by the embodiments of the present application. The adapter board 42 is fixed within the hollowed-out area 43.

[0127] Exemplarily, for the convenience of transportation, the finished product of the adapter board 42 is pre-fixed to the hollowed-out area 43 of the circuit board 41 by the production line workers, and the fixing methods include but are not limited to gluing.

[0128] In this way, the materials of the adapter board 42 can be provided by the materials reserved in the hollowed-out area 43 of the circuit board 41. For example, before the production line workers cut off the materials in the hollowed-out area 43, the shape of the adapter board 42 can be processed using the materials in the hollowed-out area 43. The materials of the adapter board 42 are completely provided by the board body of the circuit board 41. Although the structure of the adapter board 42 is increased, no new materials are added, saving the cost of the adapter board 42 and realizing a zero-cost compatible design for the adapter board 42.

[0129] It should be noted that the hollowed-out area 43 can be an area where holes are opened for installing electronic devices on the circuit board 41. For example, it can be an area where a camera module 3 or a flash module is installed.

[0130] In some embodiments, there are multiple adapter boards 42, and multiple adapter boards 42 are all arranged within the hollowed-out area 43. Exemplarily, multiple adapter boards 42 can all be arranged within the same hollowed-out area 43; or multiple adapter boards 42 can be arranged within multiple hollowed-out areas 43.

[0131] In this way, at any position on the circuit board 41 that needs to be processed into the hollowed-out area 43, multiple different types or multiple of the same type of adapter boards 42 can be processed without adding additional materials to process the adapter boards 42, expanding the usage value of the circuit board 41 and saving the cost of the adapter boards 42.

[0132] Please continue to refer to Figure 14 , in some embodiments, at least one edge of the adapter board 42 is fixedly connected to the side wall of the hollowed-out area 43. In this way, at least one side of the adapter board 42 is connected to the side wall of the hollowed-out area 43, playing a role in fixing the adapter board 42.

[0133] It should be noted that when the electronic device 100 is in a scenario where the camera module 3 as shown in Figure 6 needs to be installed, the board body of the adapter board 42 can be cut off from the hollowed-out area 43 of the circuit board 41, and the cutting methods include but are not limited to milling cutters, etc.

[0134] Exemplarily, the material of the adapter board 42 can be provided by the board body of the circuit board 41; alternatively, the adapter board 42 can be separately processed and formed on other boards.

[0135] In some other embodiments of the present application, the circuit board 41 further has a second area 412. Please refer to Figure 15 , Figure 15 which is a schematic structural diagram of the second area 412 of another circuit board assembly 4 provided by the embodiments of the present application. The adapter board 42 can cover the first area 411 and the second area 412, and the first surface 421 of the adapter board 42 can be connected to the solder joints in the second area 412.

[0136] In this structure, on the one hand, when the adapter board 42 is not only connected to the second solder joint S and the third solder joint T, but also connected to the solder joints in the second area 412, the connection area between the adapter board 42 and the circuit board 41 is increased, further strengthening the reliability of the connection between the adapter board 42 and the circuit board 41; on the other hand, the second area 412 can also be used to set other electronic devices. For example, it is used for soldering a flash module, a display screen 11, an FPC board 5, a sensor, a capacitor, a resistor, etc. The practicability of the adapter board 42 is expanded, and the use value of the adapter board 42 is improved.

[0137] Taking the flash module 7 as an example, please refer to Figure 16 , Figure 16 which is Figure 15 a schematic structural diagram of the flash module 7 provided on the second area 412 of the circuit board assembly 4. The dotted line in the figure is the demarcation line between the first area 411 and the second area 412. The circuit board 41 is elastically connected to the flash module 7 through a spring piece 71. Usually, the flash module 7 is elevated by the spring piece 71 to achieve electrical connection. The distance between the flash module 7 and the circuit board 41 is L1. The larger L1 is, the spring piece 71 with a higher arch height needs to be selected. In order to further ensure the stability of the spring piece 71 supporting the flash module 7, the volume of the spring piece 71 is also correspondingly enlarged.

[0138] However, by providing the adapter board 42 at the second area 412 of the present application, that is, elevating the spring piece of the flash module 7 onto the adapter board 42, the distance L1 between the flash module 7 and the circuit board 41 is shortened, that is, the distance L2 between the flash module 7 and the adapter board 42. Therefore, a spring piece 71 with a smaller arch height can be selected for elastic connection, and then the volume of the spring piece 71 will also be correspondingly reduced. In this way, by providing the second area 412, without additional cost, the manufacturing cost of the spring piece 71 is reduced, and the space of the spring piece 71 is saved.

[0139] It is further worth noting that after the windowing process is performed on the circuit board 41, the copper foil will be exposed on the outside. In some related technologies, the surface treatment process of electroless nickel immersion gold (ENIG) + organic solderability preservative (OSP, also known as copper protector) or full-board OSP is usually adopted to prevent the copper foil at the windowing area from oxidizing.

[0140] Specifically, in the present application, when the surface treatment method of the pads on the circuit board 41 is ENIG + OSP, the surface treatment process of the pads on the adapter board 42 adopts ENIG to prevent the pads from oxidizing during the storage of the adapter board 42 and the circuit board 41.

[0141] When the surface treatment method of the pads on the circuit board 41 is OSP, when welding the adapter board 42, the form of pre-tinned solder can be adopted to tin the solder joints of the adapter board 42. When welding the adapter board 42 to the circuit board 41, there is solder on both sides, improving the welding reliability.

[0142] In the description of this specification, specific features, structures, materials, or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the various embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: The invention comprises a circuit board and an adapter board, wherein the circuit board has a hollow area, the surface of the circuit board has a first area, the first area is used to set an electronic device, and only one electronic device can be set in the first area; the first area is provided with a plurality of first welding points and a plurality of second welding points, and the plurality of the first welding points and the plurality of the second welding points are respectively used to connect different electronic devices; The adapter plate is fixed in the hollow area, and the adapter plate has a first surface and a second surface arranged opposite to each other, the first surface is used to connect with multiple second welding points, and the second surface is provided with multiple fourth welding points, and the multiple fourth welding points and the multiple first welding points are used to connect different electronic devices.

2. The circuit board assembly according to claim 1, characterized in that: The plurality of first welding spots are sequentially distributed to form an annular area, and the plurality of second welding spots are arranged in the annular area.

3. The circuit board assembly according to claim 2, characterized in that: The plurality of second welding points include a plurality of first sub-welding points and a plurality of second sub-welding points, the plurality of first sub-welding points are sequentially distributed along the length direction of the annular region, and the plurality of second sub-welding points are sequentially distributed along the length direction of the annular region; The plurality of first sub-welding points and the plurality of second sub-welding points are alternately distributed in sequence along the length direction of the annular area, and the first sub-welding points and the second sub-welding points are distributed along the width direction of the annular area.

4. The circuit board assembly according to claim 3, characterized in that: Along the width direction of the annular area, the first sub-soldering point and the first soldering point adjacent to each other and with the smallest distance therebetween are used to connect to the same functional circuit of the circuit board.

5. The circuit board assembly according to claim 3, characterized in that: Along the width direction of the annular area, the second sub-soldering point and the first soldering point which is adjacent to each other and has the smallest distance therebetween are used to connect to the same functional circuit of the circuit board.

6. The circuit board assembly according to claim 2, characterized in that: A plurality of third welding points are also arranged on the first area. The third welding points are arranged outside the annular area. The third welding points and the second welding points are used to connect the same electronic device.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: There are multiple adapter plates, and the multiple adapter plates are all arranged in the hollow area.

8. The circuit board assembly according to any one of claims 1 to 6, characterized in that: At least one edge of the adapter plate is fixedly connected to the side wall of the hollow area.

9. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The circuit board also has a second area, the adapter board can cover the first area and the second area, and the first surface of the adapter board can be connected to the solder joints of the second area.

10. An electronic device, characterized in that: include: case; A circuit board assembly, which is the circuit board assembly according to any one of claims 1 to 9, wherein the circuit board assembly is arranged in the housing; The electronic device is arranged in a first area of ​​a circuit board of the circuit board assembly.

11. The electronic device according to claim 10, characterized in that: The electronic device includes a first electronic device, and the first electronic device is fixedly connected to the first welding point.

12. The electronic device according to claim 11, characterized in that: The electronic device includes a second electronic device. The adapter board of the circuit board assembly is fixedly connected to the second solder joint. The second electronic device is arranged on a surface of the adapter board away from the circuit board.

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