Sensing chip packaging structure and method, PCB substrate and microfluidic detection device

Abstract

The invention provides a sensing chip packaging structure and method and a PCB substrate, and the sensing chip packaging structure comprises a packaging substrate; the sensing chip comprises a first surface and a second surface which are opposite to each other; the first surface is covered with a sensing part, the second surface is attached to the packaging substrate, and the sensing chip is electrically connected with the packaging substrate; the sensing chip packaging structure further comprises a plastic packaging body, the plastic packaging body covers the sensing chip, and an opening is formed in the surface, opposite to the sensing part, of the plastic packaging body, so that the sensing chip is wrapped, and at least partial area of the sensing part is exposed. The fluid characteristic of the plastic package body before forming is utilized, the sensing part is partially or completely exposed selectively after the plastic package body is cured, the sensing part is in contact with an external detected object, the complexity of the package structure is simplified, detected data can be obtained conveniently, better signal response is obtained, and the reliability of the package structure is improved. Therefore, the available area of the chip is maximized, and the light weight of the packaging structure is realized.

Description

Sensor chip packaging structure, method, PCB substrate and microfluidic detection device Technical Field

[0001] The present invention relates to semiconductor chip packaging technology, and in particular to a sensor chip packaging structure, method, PCB substrate and microfluidic detection device. Background Art

[0002] Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to place the integrated circuit bare chips produced by the wafer factory on a substrate that serves as a carrier, and then fix the package into a whole.

[0003] Current chip packaging generally uses plastic encapsulation, which is injected into a mold to completely encapsulate the chip to protect it. Alternatively, the chip can be directly covered with a lid to protect it.

[0004] However, there are still many technical problems in the industry that need to be solved for sensor chips. For example, sensor chips have a sensing part that needs to read the outside world, so sensor chips are easily restricted by the packaging structure and its formation process. The existing packaging method of using local chip glue can expose the chip surface, but this method has low production efficiency. Moreover, the existing technology usually uses corresponding pins on the side of the sensor chip. The process is relatively complicated and requires high precision, making packaging difficult.

[0005] Summary of the Invention

[0006] The present invention provides a sensor chip packaging structure, method, PCB substrate and microfluidic detection device to solve the technical problems raised in the background technology.

[0007] A first aspect of the present invention provides a sensor chip packaging structure, comprising: a packaging substrate; a sensor chip, comprising a first surface and a second surface relative to each other; the first surface is covered with a sensing part, the second surface is attached to the packaging substrate, and the sensor chip is electrically connected to the packaging substrate; the sensor chip packaging structure also includes: a plastic package, the plastic package covers the sensor chip and has an opening on the surface relative to the sensing part to encapsulate the sensor chip and expose at least a portion of the sensing part.

[0008] In a further solution of the present application, the upper surface of the plastic package body is higher than the upper surface of the sensing part; or the upper surface of the plastic package body is flush with the upper surface of the sensing part.

[0009] In a further embodiment of the present application, the sensor chip packaging structure includes a first connection layer, which is arranged on the second surface and is used to connect the packaging substrate and the sensor chip; wherein the first connection layer is any one of solder balls, epoxy resin adhesive, and silver glue.

[0010] In a further solution of the present application, the sensor chip packaging structure also includes a second connection layer, which is arranged on the side of the packaging substrate facing away from the sensor chip, and is used to fixedly connect the packaging substrate and the external PCB substrate; the second connection layer is either a solder ball or a solder pad, and the solder balls or solder pads are arranged at intervals on the side of the packaging substrate facing away from the sensor chip.

[0011] In an optional solution of the present application, a high metal coverage area is provided in the portion of the packaging substrate corresponding to the contact portion with the sensor chip, wherein the metal content of the high metal coverage area is higher than that of other areas of the packaging substrate, for dissipating heat from the sensor chip.

[0012] In an optional solution of the present application, the sensor chip packaging structure further includes electronic components, which are mounted on the packaging substrate.

[0013] In a further embodiment of the present application, the sensor chip includes an ASIC chip or a substrate, and the ASIC chip or the substrate is disposed between the packaging substrate and the sensor portion.

[0014] In a further embodiment of the present application, the sensor chip packaging structure further includes a bonding wire, one end of the bonding wire is connected to the sensor chip, and the other end is connected to the packaging substrate, so as to realize electrical connection between the packaging substrate and the sensor chip.

[0015] In an optional solution of the present application, the sensor chip includes multiple through-silicon vias to transmit electrical signals from the sensing part on the first surface of the sensor chip to the packaging substrate on the second surface, thereby achieving electrical connection between the packaging substrate and the sensor chip.

[0016] A second aspect of an embodiment of the present invention also provides a packaging method for a sensor chip, comprising: providing a packaging substrate; providing a sensor chip, comprising a first surface and a second surface relative to each other, wherein the first surface is covered with a sensing part; attaching the second surface of the sensor chip to the packaging substrate, and establishing an electrical connection between the sensor chip and the packaging substrate; forming a plastic package on the packaging substrate, the plastic package surrounding the sensor chip and providing an opening on the surface of the sensing part so that at least a portion of the sensing part is exposed.

[0017] In a further solution of the present application, the plastic encapsulation body surrounds the sensor chip and simultaneously provides an opening on the surface of the sensor part, including: squeezing the plastic encapsulation medium into the mold cavity and embedding all the sensor chips therein, and then forming the opening by making a corresponding cut on the sensor part.

[0018] In an optional solution of the present application, a filling piece is reserved for the sensing part in the mold cavity so that an opening is provided in the sensing part after molding.

[0019] In an optional solution of the present application, a high metal coverage area is provided at the portion where the packaging substrate contacts the sensor chip.

[0020] In an optional solution of the present application, establishing an electrical connection between the sensor chip and the packaging substrate includes: setting a bonding wire between the sensor chip and the packaging substrate to achieve an electrical connection between the packaging substrate and the sensor chip.

[0021] In an optional solution of the present application, a plurality of through-silicon vias are provided inside the sensor chip to transmit electrical signals from the sensing portion on the first surface of the sensor chip to the packaging substrate on the second surface, thereby achieving electrical connection between the packaging substrate and the sensor chip.

[0022] In another aspect of the present application, a PCB substrate is further provided, comprising:

[0023] The PCB substrate also includes the sensor chip packaging structure as described above. The sensor chip packaging structure is welded on the PCB substrate and electrically connected to the PCB substrate.

[0024] Finally, the present application provides a microfluidic detection device, comprising: a fluid component; and a sensor chip packaging structure as described above, wherein the fluid component and the sensor chip packaging structure are assembled to form a reaction chamber.

[0025] In summary, the present invention provides a sensor chip packaging structure that utilizes the fluid properties of the plastic package before molding, selectively exposing part or all of the sensing portion after solidification, allowing the sensing portion to contact the external detection object, simplifying the complexity of the packaging structure and facilitating the acquisition of detection data, as well as obtaining a better signal response, thereby maximizing the chip's available area while achieving a lightweight packaging structure. Furthermore, since the plastic package directly exposes the sensing portion, eliminating the need for dispensing or other complex processes, the overall packaging structure has a small dimensional tolerance, and the fluid package and supporting components can be assembled with high precision, solving the sealing problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] FIG1 is an exemplary diagram showing a sensor chip packaging structure according to an embodiment of the present invention;

[0028] FIG2 is a top view of a sensor chip packaging structure corresponding to an embodiment of the present invention;

[0029] FIG3 is a schematic structural diagram of a sensor chip packaging structure provided in a second embodiment of the present invention;

[0030] FIG4 is a schematic structural diagram of a sensor chip packaging structure provided in a third embodiment of the present invention;

[0031] FIG5 is a schematic structural diagram of a sensor chip packaging structure provided by a fourth embodiment of the present invention;

[0032] FIG6 is a schematic structural diagram of a sensor chip packaging structure provided by a sixth embodiment of the present invention;

[0033] FIG7 is a flow chart of a packaging method for a sensor chip according to an embodiment of the present invention; and

[0034] FIG8 is a schematic structural diagram of a PCB board provided in an embodiment of the present invention.

[0035] Reference numerals

[0036] 100 (a-d), sensor chip packaging structure; 101, packaging substrate;

[0037] 102. Sensor chip; 103. Plastic package;

[0038] 104. First connection layer; 105. Second connection layer;

[0039] 106. Electronic components; 107. Bonding wires;

[0040] 101a, first connecting portion; 101b, second connecting portion;

[0041] 102a, sensing part; 102b, chip body;

[0042] 200. PCB board; 201. PCB substrate. DETAILED DESCRIPTION

[0043] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0046] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0047] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0048] In response to the problems existing in the prior art, the present invention proposes a general inventive concept to solve technical problems such as the currently used packaging structure cannot be well adapted to the sensor chip, even if its specific sensing part is exposed, or the manufacturing process is difficult and inefficient.

[0049]

Overall Inventive Concept

[0050] First, please refer to FIG. 1 , which is an exemplary diagram illustrating a sensor chip package structure 100 according to an embodiment of the present invention. FIG. 2 is a top view of the sensor chip package structure 100 according to an embodiment of the present invention. The sensor chip package structure 100 includes a package substrate 101 and a sensor chip 102.

[0051] In an embodiment of the present invention, the packaging substrate 101 is used to package an IC bare chip (referring to the sensor chip 102 in the embodiment of the present invention). While carrying the sensor chip 102, a circuit structure and electronic components can be arranged inside it to realize specific functions; as an intermediate product between the sensor chip and the PCB substrate, it plays the role of protecting, fixing, supporting the sensor chip 102, and providing a heat dissipation channel.

[0052] The sensor chip 102 includes a sensing portion 102a and a chip body 102b. The sensor chip 102 is not limited to light sensing, temperature sensing, pressure sensing, infrared sensing, and other types, and can be rectangular or in other shapes. It includes a first surface and a second surface facing each other. The sensing portion 102a is attached to the first surface of the sensor chip 102, while the second surface is attached to one side of the package substrate 101. This creates a stacked design of the sensing portion 102a, chip body 102b, and package substrate 101.

[0053] Furthermore, the sensor chip 102 is electrically connected to the packaging substrate 101 to transmit the sensing signal to the packaging substrate 101 .

[0054] In the embodiment of the present invention, the packaging substrate 101 and the sensor chip 102 may not be restricted in terms of connection method, material, morphology, etc., and may be specifically designed based on the type of the sensor chip 102 and the functional adaptability to be achieved.

[0055] In a general inventive concept of an embodiment of the present invention, the sensor chip packaging structure 100 further includes:

[0056] The plastic package 103 is designed to cover the chip body and has an opening 103a on a surface opposite to the sensing portion 102a, so as to completely cover the periphery of the chip body 102b while exposing at least a portion of the sensing portion 102a.

[0057] It is understood that the plastic encapsulation body 103, when unmolded, is a fluid medium. A fluid medium, such as epoxy film molding compound, is extruded into a mold cavity using a transfer molding process. The mold cavity is then embedded in the packaging substrate 101, encapsulating the sensor chip 102 therein and then curing and forming the package structure with a specific structural appearance. Its functions include protecting the sensor chip 102 from the external environment, resisting external moisture, solvents, and impact, and electrically insulating the chip from the external environment. This ensures that the overall package has good sealing properties and resists thermal shock, mechanical vibration, and heat diffusion.

[0058] In the embodiment of the present invention, the material of the packaging substrate 101 may be silicon dioxide, epoxy or other materials, which are different from the PCB substrate in process precision and require higher assembly precision than the PCB substrate.

[0059] On the other hand, the plastic package 103 may be epoxy resin or a mixture of epoxy resins.

[0060] Part or all of the sensing portion 102a can be selectively exposed directly through the plastic package 103, allowing the sensing portion 102a to contact the external detection object, which can simplify the complexity of the packaging structure and facilitate the acquisition of the detected data, thereby maximizing the available area of ​​the chip and achieving a lightweight packaging structure.

[0061] On the other hand, since the sensing part 102a is directly exposed by the plastic package 103, there is no need to use dispensing or other complicated processes. The overall packaging structure has a small dimensional tolerance and can be assembled with the matching fluid components with high precision to solve the sealing problem.

[0062] The sensor chip packaging structure 100 is described in detail below:

[0063] In an embodiment of the present invention, the chip body 102b is an ASIC chip or a substrate. When the chip body 102b is only an ASIC chip, the ASIC chip is integrated into the chip body 102b, which can further process the sensor signal measured by the sensor part 102a and undertake some signal processing functions of the external device; at this time, the corresponding electronic components on the PCB board can be reduced, so that the size of the entire device is greatly reduced; at the same time, the integration of the ASIC chip can also reduce the power consumption of the entire device to achieve energy saving.

[0064] In an alternative solution of the embodiment of the present invention, the chip body 102b can also be just a substrate, and its function is to support the sensor chip 102 and play a role in heat dissipation, so that the sensor chip is stronger. Specifically, it can be adaptively configured according to the type, specifications, application scenarios, etc. of the sensor chip.

[0065] In a further embodiment of the present invention, the sensor chip packaging structure 100 further includes a first connection layer 104. The first connection layer 104 is disposed on the second surface, that is, disposed between the chip body 102b and the packaging substrate 101 and connecting the packaging substrate 101 and the chip body 102b; wherein the first connection layer 104 is any one of solder balls, epoxy resin adhesive, and silver glue.

[0066] It is understood that the specific configuration can be adaptively adjusted according to the characteristics of the material. Solder balls are welding materials that can achieve stable fixed connections while also achieving electrical conductivity. When the first connection layer 104 uses solder balls, since the connection is a point connection, the contact area is small. The gaps between the solder balls can be filled by the plastic package 103 to provide support and sealing, and the solder balls need to pass through the entire chip body 102b to achieve smooth signal transmission. When the first connection layer 104 uses epoxy resin glue or silver glue, the epoxy resin glue is composed of epoxy resin or silicone resin filled with randomly distributed metal or conductive carbon particles. When it is fully cured, it can provide a high-quality conductive path. In another option, silver glue has both electrical and thermal conductivity. Since epoxy resin glue or silver glue are both adhesive-covered connections, bonding wires need to be set up separately to achieve electrical connection between the package substrate and the sensor chip. For details, please refer to the following specific embodiments.

[0067] On the other hand, the sensor chip package structure 100 further includes a second connection layer 105, which is disposed on a side of the package substrate 101 away from the chip body 102b and is used to securely connect the package substrate 101 to an external PCB substrate.

[0068] Furthermore, the second connection layer 105 can optionally be either solder balls or pads. The solder balls or pads are arranged at intervals on the side of the packaging substrate 101 facing away from the sensor chip. While being structurally connected, they can also be used to realize electrical signal transmission between the packaging substrate 101 and the PCB substrate.

[0069] It can be understood that the first connection layer 104 and the second connection layer 105 mentioned above are respectively located on both sides of the packaging substrate 101, thereby achieving the connection between the packaging substrate 101 and the sensor chip 102 and the PCB substrate respectively.

[0070] In an optional solution of the present embodiment, sensor chip package structure 100 further includes electronic components 106. Electronic components 106 are resistors, capacitors, or other electronic components mounted on package substrate 101 and perform electrical signal processing, such as signal amplification and reduction. Electronic components 106 are mounted on the side of package substrate 101 facing away from the PCB and are embedded within plastic package 103 for protection.

[0071] It is understandable that the sensor chip packaging structure 100 can selectively package the electronic components 106 or not, that is, place them on an external PCB substrate or on a circuit board of an external device, as long as the same effect is achieved.

[0072] In order to achieve electrical connection between the packaging substrate 101 and the chip body 102b, in an optional solution of an embodiment of the present invention, the sensor chip packaging structure also includes a bonding wire 107, which is buried in the plastic package 103. At the same time, one end of the bonding wire 107 is connected to the chip body 102b and the other end is connected to the packaging substrate 101, which is used to achieve electrical connection between the packaging substrate 101 and the chip body 102b.

[0073] In another optional solution of the embodiment of the present invention, the chip body is provided with a plurality of through-silicon vias (not shown in FIG1 ), which are used to transmit electrical signals from the chip body to the packaging substrate to achieve electrical connection between the packaging substrate and the chip body.

[0074] In summary, the embodiments of the present invention provide a sensor chip package structure 100 that utilizes the fluid properties of the plastic package 103 before molding to selectively expose part or all of the sensing portion 102a through the plastic package 103, allowing the sensing portion 102a to contact the external object being detected. This simplifies the complexity of the package structure and facilitates the acquisition of detected data, maximizing the available chip area while achieving a lightweight package structure. Furthermore, because the plastic package 103 directly exposes the sensing portion 102a, eliminating the need for dispensing or other complex processes, the overall package structure has a small dimensional tolerance, and the fluid package and supporting components can be assembled with high precision, thus resolving sealing issues.

[0075] The following is described by specific examples:

[0076] [Example 1]

[0077] Continuing to refer to FIG. 1 and FIG. 2 , in the first embodiment of the present invention, the sensor chip packaging structure 100 has the following features:

[0078] The sensor chip packaging structure 100 is a rectangular block structure as a whole, and can also be configured as an anisotropic structure according to needs.

[0079] In a direction away from the PCB substrate, the sensor chip package structure 100 includes a package substrate 101 and a sensor chip 102. The package substrate 101 and the sensor chip 102 form a stacked package structure, connected in the vertical direction. It is understood that the stacking can adopt a pyramid-shaped stacking structure, where the lower package substrate 101 has a larger area than the upper package substrate, forming a pyramid shape. Alternatively, a cross stacking method can be used.

[0080] In the embodiment of the present invention, the sensor chip 102 is composed of an upper exposed sensor portion 102a and a chip body 102b. The plastic package 103 is designed with an opening 103a after molding, which is flush with the upper surface of the sensor portion 102a, making the entire sensor chip packaging structure 100 flat and convenient for installation and transportation.

[0081] In this embodiment, the chip body 102b is an ASIC chip, which reduces the volume of the entire device and saves overall energy consumption.

[0082] Furthermore, the first connection layer 104 is bonded to the package substrate 101 using silver glue to provide good heat dissipation performance.

[0083] Since the first connection layer 104 is silver glue, the chip body and the shell are interconnected by bonding, that is, one end of the bonding wire is connected to the sensor chip 102, and the other end is connected to the packaging substrate 101. The electrical signal is output from the sensor chip 102 to the packaging substrate 101 through the bonding wire 107 (which can be a gold wire or a copper wire).

[0084] The second connection layer 105 is formed of solder balls, which are distributed below the package substrate 101 to be soldered and fixed to the external PCB and to achieve electrical connection between the package substrate 101 and the PCB substrate.

[0085] A plurality of electronic components 106 may be selectively mounted on the packaging substrate 101 . The electronic components 106 may be resistors, capacitors, etc., and are used to process electrical signals.

[0086] That is, the electronic components 106 , the bonding wires 107 , and the non-sensing area of ​​the sensor chip 102 are wrapped and protected by the plastic package 103 , and the upper surface of the sensing portion 102 a is exposed, so that the sensing portion 102 a is in full contact with the external detection object.

[0087] It can be understood that the sensor chip packaging structure 100 provided in the embodiment of the present invention has a simplified structure compared to the prior art. It only utilizes the fluid properties of the plastic package 103 before it is formed, and selectively exposes part or all of the sensing part after it is solidified. On the one hand, it can achieve direct contact between the sensing part 102a and the external detection object, and on the other hand, it is to use the plastic package 103 to directly integrate the shell of the prior art without the need for dispensing or other complex processes. In addition, the fluid package and the supporting components can achieve high-precision assembly to solve the sealing problem.

[0088] [Example 2]

[0089] Please refer to Figure 3, which is a schematic diagram of the structure of a sensor chip package structure 100a provided in accordance with a second embodiment of the present invention. As shown in the figure, sensor chip package structure 100a is similar to that of Example 1 in other structural aspects, differing in that the second connection layer 105 in Example 2 is implemented as a solder pad. The chip is soldered to an external PCB substrate via a screen printing process, achieving a tight connection between the PCB substrate and package substrate 101.

[0090] It can be understood that the pad is the basic component unit of the surface mount assembly. Compared with the solder ball, the pad has a larger connection area, a more stable connection, and can reduce the vertical thickness to achieve overall compactness.

[0091] [Example 3]

[0092] Please refer to Figure 4, which is a schematic diagram of the structure of a sensor chip package structure 100b provided in Embodiment 3 of the present invention. As shown in the figure, the sensor chip package structure 100b is similar to any of Embodiments 1-2, except that the package substrate 101 is designed to have a first connecting portion 101a and a second connecting portion 101b. The first connecting portion 101a is connected to the chip body 102b, and the second connecting portions 101b are located on both sides of the first connecting portion 101a and are used to connect to an external PCB substrate.

[0093] In the third embodiment, the first connection portion 101a is additionally coated with metal. The coated metal may be made of copper, aluminum, or other materials, so that the metal content of this area is higher than that of the second connection portion 101b.

[0094] It can be understood that the first connecting portion 101a corresponds to the contact area between the packaging substrate 101 and the chip body 102b. In an optional solution, the packaging substrate 101 adopts a high copper clad structure in the contact area, so that the copper content in this area is higher, thereby being able to more effectively transfer heat from the chip to the bottom for dissipation. This method has better temperature control and can increase the overall performance and reliability.

[0095] [Example 4]

[0096] Please refer to Figure 5, which is a schematic diagram of the structure of a sensor chip package structure 100c provided in a fourth embodiment of the present invention. The structure features are similar to those of any of the first to third embodiments, with the difference being that the ASIC chip in this fourth embodiment utilizes a through-silicon via (TSV) process. Instead of the wire bonding process employed in the first to third embodiments, the first connection layer 104 utilizes solder balls to achieve signal transmission from the sensor portion 102a to the package substrate 101.

[0097] Specifically, a plurality of through-silicon vias (TSVs) are provided in the chip body 102b. The TSVs are used to transmit electrical signals from the upper surface of the chip body 102b directly to the package substrate 101, so as to achieve electrical connection between the package substrate 101 and the chip body 102b.

[0098] The second connection layer 105 can be either a pad or a solder ball.

[0099] It is understandable that the second connection layer 105 can be changed from solder balls to solder pads, and the package substrate 101 can be soldered to the external PCB substrate through a screen printing process to increase the stability and flatness of the connection.

[0100] A hole is drilled inside the chip body 102b to transmit the electrical signal from the upper surface of the chip body 102b to the lower surface. The chip body 102b is then soldered to the package substrate 101 via a solder pad to transmit the electrical signal to the package substrate 101.

[0101] Example 4 can be understood as replacing the bonding wires with solder balls, and integrating the solder balls on the chip body 102b through silicon vias. At this time, the signal is directly transmitted from the sensing part 102a on the upper part of the chip body 102b through the chip body 102b to the packaging substrate 101, which can increase the compactness of the sensor chip packaging structure 100, reduce the interconnection length of the signal through vertical interconnection, reduce signal delay, reduce capacitance and inductance, and achieve low power consumption and high-speed communication between signal transmission, increase bandwidth and realize miniaturization after sensor chip integration.

[0102] [Example 5]

[0103] Please refer to FIG. 6 , which is a schematic structural diagram of a sensor chip packaging structure 100 d provided in accordance with a sixth embodiment of the present invention.

[0104] The structural features are similar to those of any one of embodiments 1 to 4, but the difference is that the plastic package 103 covers part of the surface of the sensing portion 102a, selectively exposing the surface that needs to be exposed, thereby realizing the basic function of the sensor contacting the object to be measured.

[0105] At this time, the upper surface of the plastic package body 103 can be higher than the upper surface of the sensing part 102a, which can protect the sensing part 102a and avoid scratches during transportation.

[0106] For some targeted sensor chips, such as light sensor chips, a transparent layer can be covered on the basis that the upper surface of the plastic package 103 is higher than the upper surface of the sensor part 102a, so as to better protect the sensor part 102a and increase product reliability.

[0107] [Method Example]

[0108] Please refer to Figure 7, which is a flow chart of a sensor chip packaging method provided by an embodiment of the present invention. The embodiment of the present invention also provides a sensor chip packaging method, which includes the following steps:

[0109] Step S101: providing a packaging substrate;

[0110] Step S102: providing a sensor chip, wherein the sensor chip includes a chip body and a sensor portion;

[0111] Step S103: placing the chip body of the sensor chip on the packaging substrate and establishing an electrical connection between the sensor chip and the packaging substrate;

[0112] Step S104: forming a plastic package with an opening on the packaging substrate, the plastic package covering the chip body and the sensor part, and the opening exposing at least a portion of the sensor part to the plastic package.

[0113] It can be understood that the above provides a step method for single-chip packaging, which realizes stacked packaging after placing the chip body of the sensor chip on the packaging substrate, and directly forms a plastic package with an opening on the packaging substrate, so that part or all of the sensing part can be selectively exposed, thereby simplifying the complexity of the packaging structure and facilitating the acquisition of the detected data, maximizing the available area of ​​the chip while achieving the purpose of lightweight packaging structure.

[0114] Furthermore, the step S104 of forming a plastic package with an opening on the packaging substrate includes:

[0115] Step S1042: reserve a filling piece for the sensing part in the mold cavity so that the plastic package body has an opening at a position corresponding to the sensing part after molding.

[0116] It can be understood that by structurally designing the mold cavity and reserving a filling piece for the sensing portion in the mold cavity, an opening is formed in the region of the sensing portion after the fluid-like plastic package is molded.

[0117] From the above, it can be seen that the packaging substrate has a first connecting portion and a second connecting portion; before placing the chip body of the sensor chip on the packaging substrate, the packaging method also includes: step S1021, providing a metal coating layer on the first connecting portion of the packaging substrate so that the metal content of the first connecting portion is higher than the metal content of the second connecting portion.

[0118] Furthermore, step S103 of establishing an electrical connection between the sensor chip and the packaging substrate includes:

[0119] Step S1031: Setting bonding wires between the sensor chip and the packaging substrate to achieve electrical connection between the packaging substrate and the sensor chip; or

[0120] Step S1032: a plurality of through-silicon vias are provided in the chip body of the sensor chip to transmit electrical signals from the chip body to the packaging substrate, thereby achieving electrical connection between the packaging substrate and the sensor chip.

[0121] The above steps can be used to obtain technical inspiration for their structural features based on the overall inventive concept and Examples 1 to 5, and will not be repeated in this application.

[0122]

PCB board

[0123] Please refer to FIG8 , which is a schematic structural diagram of a PCB board 200 provided in an embodiment of the present invention. The embodiment of the present invention further provides a PCB board 200, including:

[0124] PCB substrate 201; like the sensor chip packaging structure 100 described above, the sensor chip packaging structure is soldered on the PCB substrate 201 and electrically connected.

[0125]

Microfluidic detection device

[0126] The present invention also provides a microfluidic detection device (not shown), comprising:

[0127] Fluid component; as described in the above embodiment of the sensor chip packaging structure 100, the fluid component and the sensor chip packaging structure 100 are assembled to form a reaction chamber at the sensing portion 102a.

[0128] Since the sensing portion 102a of the sensor chip packaging structure 100 of the microfluidic detection device is directly connected to the reaction chamber, it can sense signals faster and more accurately, even if the signal is weak. At the same time, the structure of the sensor chip packaging structure 100 is simplified, which can laterally reduce the overall volume of the microfluidic detection device, making it have the advantages of high sensitivity, strong portability and fast detection.

[0129] Furthermore, those skilled in the art should understand that if all or part of the sub-modules involved in a sensor chip packaging structure 100, a PCB board 200 and a microfluidic detection device provided by an embodiment of the present invention are combined or replaced by fusion, simple changes, mutual conversion, etc., such as the components are placed and moved; or the product they constitute is set as one piece; or a detachable design; all the combined components can form a device / device / system with specific functions, and using such a device / device / system to replace the corresponding components of the present invention also falls within the scope of protection of the present invention.

[0130] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0131] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A sensor chip packaging structure, characterized in that: Including sensor chip, packaging substrate and plastic package; The sensor chip includes a chip body and a sensing portion, wherein the chip body is disposed on the packaging substrate and electrically connected to the packaging substrate, and the sensing portion is disposed on a side of the chip body away from the packaging substrate; The plastic package body is provided with an opening, and the opening is used to expose at least a portion of the sensing part from the plastic package body when the plastic package body covers the chip body and the sensing part.

2. The sensor chip packaging structure according to claim 1, characterized in that: The upper surface of the plastic package body is higher than the upper surface of the sensing part; or The upper surface of the plastic package body is flush with the upper surface of the sensing part.

3. The sensor chip packaging structure according to claim 1, characterized in that: The sensor chip packaging structure further includes a first connection layer, which is disposed between the chip body and the packaging substrate and connects the packaging substrate and the chip body; The first connection layer is any one of solder balls, epoxy resin adhesive, and silver glue.

4. The sensor chip packaging structure according to claim 1, characterized in that: The sensor chip packaging structure further includes a second connection layer, which is arranged on a side of the packaging substrate away from the chip body and is used to fixedly connect the packaging substrate and an external PCB substrate; The second connection layer is any one of solder balls and pads, and the solder balls or pads are arranged at intervals on a side of the packaging substrate facing away from the sensor chip.

5. The sensor chip packaging structure according to claim 1, characterized in that: The package substrate has a first connecting portion and a second connecting portion, the first connecting portion is connected to the chip body, and the second connecting portion is located on both sides of the first connecting portion and is used to connect to an external PCB substrate; The metal content of the first connecting portion is higher than the metal content of the second connecting portion.

6. The sensor chip packaging structure according to claim 1, characterized in that: The sensor chip packaging structure further includes electronic components, which are mounted on the packaging substrate.

7. The sensor chip packaging structure according to claim 1, characterized in that: The chip body is an ASIC chip or a substrate.

8. The sensor chip packaging structure according to any one of claims 1 to 7, characterized in that: The sensor chip packaging structure further includes a bonding wire, one end of which is connected to the chip body and the other end is connected to the packaging substrate, so as to realize electrical connection between the packaging substrate and the chip body.

9. The sensor chip packaging structure according to any one of claims 1 to 7, characterized in that: The chip body is provided with a plurality of through-silicon vias, and the through-silicon vias are used to transmit electrical signals from the chip body to the packaging substrate to achieve electrical connection between the packaging substrate and the chip body.

10. A packaging method for a sensor chip, characterized in that: include: Providing a packaging substrate; A sensor chip is provided, wherein the sensor chip includes a chip body and a sensor portion; Placing the chip body of the sensor chip on the packaging substrate and establishing an electrical connection between the sensor chip and the packaging substrate; A plastic package body with an opening is formed on the packaging substrate, the plastic package body covers the chip body and the sensing part, and the opening enables at least a portion of the sensing part to be exposed from the plastic package body.

11. The packaging method according to claim 10, wherein: Forming a plastic package body with an opening on the packaging substrate includes: A filling piece is reserved for the sensing part in the mold cavity, so that the plastic package body has an opening at a position corresponding to the sensing part after molding.

12. The packaging method according to claim 10, wherein: The packaging substrate has a first connecting portion and a second connecting portion; Before placing the chip body of the sensor chip on the packaging substrate, the packaging method further includes: providing a metal coating layer on the first connection portion of the packaging substrate so that the metal content of the first connection portion is higher than the metal content of the second connection portion.

13. The packaging method according to claim 10, wherein: The step of establishing an electrical connection between the sensor chip and the packaging substrate includes: Arranging bonding wires between the sensor chip and the packaging substrate to achieve electrical connection between the packaging substrate and the sensor chip; or A plurality of through-silicon vias are provided in the chip body of the sensor chip to transmit electrical signals from the chip body to the packaging substrate, thereby achieving electrical connection between the packaging substrate and the sensor chip.

14. A PCB board, characterized in that: include: PCB substrate; The sensor chip packaging structure according to any one of claims 1 to 9, wherein the sensor chip packaging structure is soldered on the PCB substrate and electrically connected.

15. A microfluidic detection device, characterized in that: include: Fluid components; According to the sensor chip packaging structure according to any one of claims 1 to 9, the fluid component and the sensor chip packaging structure are assembled to form a reaction chamber.

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