Display substrate and display device

Abstract

The invention discloses a display substrate and a display device. The display substrate comprises a substrate (100) and a plurality of conductive pads (200), the substrate comprises a display area (101) and a peripheral area (102), the plurality of conductive pads are located in a binding area (1020), and the binding area is located in the peripheral area. Each conductive gasket comprises a first sub-gasket (210), a first insulating layer (220), a second sub-gasket (230), a second insulating layer (240), a first via hole (221) and a second via hole (241). The first via hole penetrates through the first insulating layer, the second sub-gasket is directly connected with the first sub-gasket through the first via hole, and the second via hole penetrates through the second insulating layer to expose part of the second sub-gasket. At least one first via hole is formed between the first sub-gasket and the corresponding second sub-gasket, the orthographic projection of the first via hole on the substrate is overlapped with the orthographic projection of the at least one second via hole on the substrate, and the size of the at least one second via hole in the second direction is larger than that of the second via hole in the first direction. Therefore, when the top sub-gasket falls off, the flexible circuit board can be in better lap joint with the conductive gasket.

Description

Display substrate and display device Technical Field

[0001] Embodiments of the present disclosure relate to a display substrate and a display device. Background Art

[0002] The design of the OLED (Organic Light-Emitting Diode) display panel includes multiple aspects such as pixel design, gate driver on array (GOA) circuit design and packaging design; the OLED display panel includes a conductive pad (Bonding Pad) located in the binding area, which can be used as the drive signal input position of the display panel, and one end of the flexible circuit board (FPC) is connected to the driver circuit board, and the other end is connected to the conductive pad in the binding area, so that the driver circuit board can transmit display data to the display panel through the flexible circuit board to drive the display panel to perform luminous display. For example, the flexible circuit board can be a chip on film (COF) with a chip provided thereon. Therefore, the design of the conductive pad will affect the connection between the flexible circuit board and the display panel, and thus affect the display effect of the display panel. The conductive pad can be designed and adjusted accordingly according to different processes to achieve the best overlap effect and the best display effect of the display panel.

[0003] Summary of the Invention

[0004] Embodiments of the present disclosure provide a display substrate and a display device. When a top sub-gasket of the conductive gasket of the display substrate oxidizes or even falls off, a second sub-gasket with a larger area can be exposed through a second via hole. Furthermore, a flexible printed circuit board can bend at the second via hole and overlap the second sub-gasket through the second via hole. This avoids the problem of poor contact between the flexible printed circuit board and the second sub-gasket caused by an overly small second via hole, thereby enabling the display substrate to provide a better and more stable display effect.

[0005] At least one embodiment of the present disclosure provides a display substrate, comprising a base substrate, comprising a display area and a peripheral area at least partially surrounding the display area; and a plurality of conductive gaskets located in a binding area, wherein the binding area is located in the peripheral area, the plurality of conductive gaskets are arranged along a first direction, and each of the conductive gaskets extends along a second direction intersecting the first direction, and comprises: a first subgasket located on the base substrate; a first insulating layer located on a side of the first subgasket away from the base substrate; a second subgasket located on a side of the first insulating layer away from the first subgasket; a second insulating layer located on a side of the second subgasket away from the first insulating layer; a first via hole penetrating the first insulating layer, wherein the second subgasket is directly connected to the first subgasket through the first via hole; and a second via hole penetrating the second insulating layer to expose a portion of the second subgasket, wherein at least one first via hole is contained between the first subgasket and the corresponding second subgasket, the orthographic projection of the first via hole on the base substrate overlaps with the orthographic projection of at least one second via hole on the base substrate, and the size of at least one second via hole in the second direction is larger than the size of the second via hole in the first direction.

[0006] For example, in the display substrate provided by an embodiment of the present disclosure, a ratio of a size of the second via hole in the second direction to a size of the second via hole in the first direction is greater than or equal to 5.

[0007] For example, in the display substrate provided in an embodiment of the present disclosure, the ratio of the area of ​​the orthographic projection of at least one second via on the base substrate to the area of ​​the orthographic projection of the second sub-gasket on the base substrate is greater than or equal to 0.5.

[0008] For example, in the display substrate provided by an embodiment of the present disclosure, a ratio of a size of at least one second via in the first direction to a size of the second subgasket in the first direction is greater than or equal to 0.5.

[0009] For example, in the display substrate provided by an embodiment of the present disclosure, a ratio of a size of at least one second via in the second direction to a size of the second subgasket in the second direction is greater than or equal to 0.7.

[0010] For example, in the display substrate provided by an embodiment of the present disclosure, the orthographic projection of the second via hole on the base substrate covers the orthographic projection of the first via hole on the base substrate.

[0011] For example, in the display substrate provided in one embodiment of the present disclosure, each of the conductive gaskets further includes: a third subgasket located on a side of the second insulating layer away from the second subgasket, and the third subgasket is directly connected to the second subgasket through the second via.

[0012] For example, in the display substrate provided in one embodiment of the present disclosure, the third subgasket includes a first sublayer, which is at least partially located within the second via hole and directly connected to the second subgasket; and an oxide, which is located on the periphery of the second via hole, within the second via hole, or on the side of the first sublayer away from the second subgasket, and the material of the first sublayer includes a transparent conductive oxide.

[0013] For example, in the display substrate provided by an embodiment of the present disclosure, the first sub-layer includes at least one opening, and the orthographic projection of the opening on the base substrate falls within the orthographic projection of the second via hole on the base substrate.

[0014] For example, in the display substrate provided in one embodiment of the present disclosure, the third subgasket also includes: a second sublayer, located on the side of the first sublayer away from the second subgasket, the material of the second sublayer includes a conductive metal, and the oxide includes an oxide of the conductive metal.

[0015] For example, in the display substrate provided in an embodiment of the present disclosure, the third subgasket further includes: a third sublayer, at least partially located on a side of the second sublayer away from the second subgasket, and the material of the third sublayer includes transparent conductive oxide.

[0016] For example, in the display substrate provided in an embodiment of the present disclosure, each of the conductive gaskets further includes: a fourth subgasket located on a side of the third subgasket away from the second insulating layer, and the material of the fourth subgasket includes transparent conductive oxide.

[0017] For example, in the display substrate provided by an embodiment of the present disclosure, the size of the first via hole in the second direction is larger than the size of the first via hole in the first direction.

[0018] For example, in the display substrate provided in an embodiment of the present disclosure, the ratio of the size of the first via in the second direction to the size of the first via in the first direction is greater than or equal to 5. For example, in the display substrate provided in an embodiment of the present disclosure, the ratio of the area of ​​the orthographic projection of at least one first via on the base substrate to the area of ​​the orthographic projection of the first subgasket on the base substrate is greater than or equal to 0.5.

[0019] For example, in the display substrate provided in an embodiment of the present disclosure, a ratio of a size of at least one first via in the first direction to a size of the first subgasket in the first direction is greater than or equal to 0.5.

[0020] For example, in the display substrate provided by an embodiment of the present disclosure, a ratio of a size of at least one first via in the second direction to a size of the first subgasket in the second direction is greater than or equal to 0.7.

[0021] For example, in the display substrate provided in an embodiment of the present disclosure, the size of the first via hole in the second direction and the size of the first via hole in the first direction are less than or equal to 2.

[0022] For example, in the display substrate provided in one embodiment of the present disclosure, the second insulating layer includes only one second via hole, and the ratio of the size of the second via hole in the second direction to the size of the second subgasket in the second direction is greater than or equal to 0.7, and the first insulating layer includes only one first via hole, and the ratio of the size of the first via hole in the second direction to the size of the first subgasket in the second direction is greater than or equal to 0.7.

[0023] For example, in the display substrate provided in one embodiment of the present disclosure, the second insulating layer includes only one second via hole, the ratio of the size of the second via hole in the second direction to the size of the second subgasket in the second direction is greater than or equal to 0.7, and the first insulating layer includes multiple first via holes.

[0024] For example, the display substrate provided in an embodiment of the present disclosure further includes a plurality of pixel units located in the display area, each of the pixel units including a pixel driving circuit and a light-emitting element, the pixel driving circuit being located on the base substrate, the light-emitting element being located on a side of the pixel driving circuit away from the base substrate, the pixel driving circuit being configured to drive the light-emitting element to emit light, each of the pixel driving circuits including a transistor, the transistor including a first electrode, a second electrode and a gate, the gate being located on the same conductive layer as the first sub-gasket, the first electrode and the second electrode being located on the same conductive layer as the second sub-gasket, each of the light-emitting elements including a first electrode and a second electrode, the third sub-gasket being located on the same conductive layer as the first electrode, and the second electrode being located on a side of the first electrode away from the base substrate.

[0025] At least one embodiment of the present disclosure provides a display device comprising any of the above-mentioned display substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0027] FIG1 is a schematic structural diagram of a conductive gasket of a display substrate;

[0028] FIG2 is a schematic cross-sectional view of the conductive gasket shown in FIG1 along a second direction;

[0029] FIG3 is an electron microscope image of a partial structure of the conductive gasket shown in FIG1 ;

[0030] FIG4 is a microscope image of the conductive gasket shown in FIG1 ;

[0031] FIG5 is a schematic diagram of a dot screen of a display substrate corresponding to the conductive gasket shown in FIG4 ;

[0032] FIG6 is a schematic structural diagram of a display substrate provided in one embodiment of the present disclosure;

[0033] FIG7 is a partially enlarged schematic diagram of a conductive gasket provided in one embodiment of the present disclosure;

[0034] FIG8 is a schematic cross-sectional view of the conductive gasket shown in FIG7 along the second direction;

[0035] FIG9 is another schematic cross-sectional view of the conductive gasket shown in FIG7 along the second direction;

[0036] FIG10 is a partially enlarged schematic diagram of another conductive gasket provided in one embodiment of the present disclosure;

[0037] FIG11 is a schematic cross-sectional view of the conductive gasket shown in FIG10 along the second direction;

[0038] FIG12 is a partially enlarged schematic diagram of another conductive gasket provided in one embodiment of the present disclosure;

[0039] FIG13 is a schematic cross-sectional view of the conductive gasket shown in FIG12 along the second direction;

[0040] FIG14 is another schematic cross-sectional view of the conductive gasket shown in FIG12 along the second direction;

[0041] FIG15 is another schematic cross-sectional view of the conductive gasket shown in FIG12 along the second direction;

[0042] FIG16 is another schematic cross-sectional view of the conductive gasket 200 shown in FIG10 along the second direction Y;

[0043] FIG17 is a partially enlarged schematic diagram of another conductive gasket provided in one embodiment of the present disclosure;

[0044] FIG18 is a schematic cross-sectional view of the conductive gasket shown in FIG17 along the second direction;

[0045] FIG19 is a partially enlarged schematic diagram of another conductive gasket provided in one embodiment of the present disclosure;

[0046] FIG20 is a schematic cross-sectional view of the conductive gasket shown in FIG19 along the second direction;

[0047] FIG21 is a schematic cross-sectional view of a display substrate provided in one embodiment of the present disclosure;

[0048] FIG22 is a partial enlarged schematic diagram of a binding area provided in accordance with the first embodiment of the present disclosure;

[0049] FIG23 is a cross-sectional schematic diagram of a conductive gasket connected to a flexible printed circuit board according to an embodiment of the present disclosure;

[0050] FIG24 is a partially enlarged schematic diagram of another conductive gasket provided in one embodiment of the present disclosure;

[0051] FIG25 is a schematic cross-sectional view of the conductive gasket shown in FIG24 along the second direction; and

[0052] FIG26 is a schematic diagram of a display device provided according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0053] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0054] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0055] Unless otherwise defined, the features such as "parallel", "perpendicular" and "same" used in the embodiments of the present disclosure include the cases of "parallel", "perpendicular", "same" in a strict sense, as well as the cases of "approximately parallel", "approximately perpendicular", "approximately the same" and the like which contain certain errors. For example, the above-mentioned "approximately" may mean that the difference between the compared objects is 10% of the average value of the compared objects, or within 5%. When the number of a component or element is not specifically indicated below in the embodiments of the present disclosure, it means that the component or element may be one or more, or may be understood as at least one. "At least one" refers to one or more, and "multiple" refers to at least two. "Set in the same layer" or "located in the same conductive layer" in the embodiments of the present disclosure refers to the relationship between multiple film layers formed by the same material after the same step (for example, a one-step patterning process). The "same layer" or "same conductive layer" here does not always mean that the thickness of multiple film layers is the same or the height of multiple film layers in the cross-sectional view is the same.

[0056] Figure 1 is a schematic structural diagram of a conductive gasket for a display substrate; Figure 2 is a schematic cross-sectional diagram of the conductive gasket shown in Figure 1 along a second direction. As shown in Figure 1, the conductive gasket 20 of the OLED display substrate is arranged along a first direction X and extends along a second direction Y intersecting the first direction X. The conductive gasket 20 includes a bottom sub-gasket 21, an intermediate sub-gasket 23, and a top sub-gasket 25. The bottom sub-gasket 21 and the intermediate sub-gasket 23 are directly connected via a via 221, and the intermediate sub-gasket 23 and the top sub-gasket 25 are directly connected via a via 241. Typically, the size of the via 221 in the second direction Y is smaller than the size in the first direction X, and the size of the via 241 in the second direction Y is smaller than the size in the first direction X. The orthographic projection of the via 221 on the base substrate 10 is staggered with the orthographic projection of the via 241 on the base substrate, that is, the vias 221 and 241 are staggered in the second direction Y.

[0057] In order to reduce the process of manufacturing, any layer of the conductive gasket can be located on the same layer as the conductive layer of the pixel driving circuit of the display area. For example, the bottom sub-gasket 21 is set on the same layer as the gate layer, the middle sub-gasket 23 is set on the same layer as the source and drain conductive layer, and the top sub-gasket 25 is set on the same layer as the anode layer.

[0058] OLED display substrates can include top emission and bottom emission according to the light emission method. For bottom emission, the anode layer usually uses indium tin oxide (ITO) material, so that the top sub-gasket 25 of the conductive gasket can protect the middle sub-gasket and the bottom sub-gasket from being oxidized. However, for top emission, the material of the anode layer is usually a stacked structure of bottom ITO, silver, and top ITO. The top ITO of the anode layer needs to match the optical design of the OLED and is relatively thin. When the top sub-gasket 25 is set on the same layer as the anode layer, the silver of the top sub-gasket 25 is easily oxidized, and the top sub-gasket 25 will fall off in severe areas, resulting in abnormal overlapping of the conductive gasket.

[0059] Figure 3 is an electron micrograph of a portion of the conductive gasket shown in Figure 1. As shown in Figure 3, silver oxide particles 26 form in portions of conductive gasket 20, with some of these particles concentrating around and within the via. Figure 4 is a micrograph of the conductive gasket shown in Figure 1. As shown in Figure 4, when the silver on top sub-gasket 25 is severely oxidized, portions of top sub-gasket 25 may fall off. The conductive metal in area 27, the light-colored area shown in the figure, has fallen off, while some silver remains in area 28, the dark-colored area shown in the figure. As can be seen in Figure 4, much of the unshed silver remains within via 241. However, the small size of via 241 not only reduces the amount of silver contained within it, but also makes it difficult for the flexible circuit board to bond with the silver within it. This is particularly true given the presence of silver oxide particles around and within via 241, leading to poor bonding. Moreover, the top sub-gasket 25 in some vias 241 is completely detached. Therefore, the smaller vias 241 make it difficult for the flexible circuit board to overlap with the middle sub-gasket 23 exposed by the vias 241, which easily leads to defects such as virtual connection, thereby affecting the display of the display substrate.

[0060] Figure 5 is a schematic diagram of a dot screen of a display substrate corresponding to the conductive gasket shown in Figure 4. As shown in Figure 5, after the display substrate is lit, a large number of vertical dark lines L will appear on the display substrate, thereby affecting the normal display of the display substrate.

[0061] In this regard, an embodiment of the present disclosure provides a display substrate and a display device. The display substrate includes a base substrate, the base substrate includes a display area and a peripheral area at least partially surrounding the display area. A plurality of conductive gaskets are located in the binding area, the binding area is located in the peripheral area, the plurality of conductive gaskets are arranged along a first direction, and each conductive gasket extends along a second direction intersecting the first direction. Each conductive gasket includes a first subgasket, a first insulating layer, a second subgasket, a second insulating layer, a first via, and a second via. The first subgasket is located on the base substrate, the first insulating layer is located on a side of the first subgasket away from the base substrate, the second subgasket is located on a side of the first insulating layer away from the first subgasket, the second insulating layer is located on a side of the second subgasket away from the first insulating layer, the first via penetrates the first insulating layer, the second subgasket is directly connected to the first subgasket through the first via, and the second via penetrates the second insulating layer to expose a portion of the second subgasket. At least one first via is included between the first sub-gasket and the corresponding second sub-gasket, the orthographic projection of the first via on the substrate overlaps with the orthographic projection of at least one second via on the substrate, and the size of at least one second via along the second direction is larger than the size of the second via along the first direction. Exemplarily, the ratio of the size of the second via in the second direction to the size of the second via in the first direction is greater than or equal to 5.

[0062] In a display substrate provided in an embodiment of the present disclosure, both the first sub-gasket and the second sub-gasket of each conductive gasket of the display substrate are conductive gaskets. A first insulating layer is disposed between the first sub-gasket and the second sub-gasket. The first sub-gasket and the second sub-gasket are directly connected via a first via in the first insulating layer. The second insulating layer includes at least one second via, which partially exposes the second sub-gasket. The dimension of the second via in the second direction is greater than the dimension of the second via in the first direction. The orthographic projection of the second via on the base substrate overlaps the orthographic projection of the first via on the base substrate. As a result, not only can each second via expose a larger area of ​​the second sub-gasket, but each conductive gasket can also expose a larger area of ​​the second sub-gasket through the at least one second via. Therefore, even if the top sub-gasket falls off, since each second via exposes a larger area of ​​the second sub-gasket and the second via itself is larger in the second direction, the flexible printed circuit board can bend at the second via and overlap the second sub-gasket through the second via, thereby avoiding the problem of the flexible printed circuit board being unable to contact the second sub-gasket due to the second via being too small. Therefore, the display substrate greatly reduces the phenomenon of poor or no overlap. As a result, the flexible circuit board can better and more easily overlap with the conductive pad, and better connect with the display substrate through the conductive pad, so that the display substrate can have a better and more stable display effect.

[0063] Hereinafter, the display substrate and the display device provided by the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0064] An embodiment of the present disclosure provides a display substrate. Figure 6 is a schematic structural diagram of a display substrate provided by an embodiment of the present disclosure, Figure 7 is a partially enlarged schematic diagram of a conductive gasket provided by an embodiment of the present disclosure, and Figure 8 is a schematic cross-sectional diagram of the conductive gasket shown in Figure 7 along the second direction.

[0065] As shown in FIG6 , the display substrate includes a base substrate, which includes a display area 101 and a peripheral area 102 that at least partially surrounds the display area 101. The display area 101 includes pixel units and scan lines, data lines, and power lines that provide control signals, data signals, voltage signals, etc. to the pixel units. For example, as shown in FIG6 , the display area 101 includes a plurality of gate lines 1010 extending in one direction and data lines 1011 extending in another direction that intersects the direction in which the gate lines extend. The peripheral region 102 of the display substrate includes a fan-out region 1021 and a bonding region 1020. The fan-out region 1021 is closer to the display region 101 than the bonding region 1020. The fan-out region 1021 includes a plurality of leads 1022, and the bonding region 1020 includes a plurality of conductive pads 200. The plurality of leads 1022 correspond one-to-one with the plurality of conductive pads 200. One end of the lead 1022 is connected to the data line 1011, and the other end of the lead 1022 is connected to the conductive pad 200. The conductive pad 200 is connected to the flexible circuit board, for example, to a corresponding conductive pad or pad on the flexible circuit board, so that the driver circuit board can provide a drive signal to the display substrate. For example, the lead 1022 can be located in the same conductive layer as the data line 1011 in the display region 101, or in a different conductive layer. When the lead 1022 and the data line 1011 are located in different conductive layers, they can be directly connected through a via in the insulating layer between them.

[0066] As shown in Figures 6 to 8 , the plurality of conductive pads 200 of the binding region 1020 are arranged along a first direction X, and each conductive pad 200 extends along a second direction Y intersecting the first direction X. Each conductive pad 200 includes a first sub-pad 210, a first insulating layer 220, a second sub-pad 230, a second insulating layer 240, a first via 221, and a second via 241. The first subgasket 210 is located on the base substrate 100, the first insulating layer 220 is located on the side of the first subgasket 210 away from the base substrate 100, the second subgasket 230 is located on the side of the first insulating layer 220 away from the first subgasket 210, the second insulating layer 240 is located on the side of the second subgasket 230 away from the first insulating layer 220, the first via 221 passes through the first insulating layer 220, the second subgasket 230 is directly connected to the first subgasket 210 through the first via 221, and the second via 241 passes through the second insulating layer 240 to expose a portion of the second subgasket 230. At least one first via 221 is included between the first sub-gasket 210 and the corresponding second sub-gasket 230. The orthographic projection of the first via 221 on the base substrate 100 overlaps with the orthographic projection of at least one second via 241 on the base substrate 100. The dimension of the at least one second via 241 along the second direction Y is greater than the dimension of the second via 241 along the first direction X. Exemplarily, the ratio of the dimension of the second via 241 along the second direction Y to the dimension of the second via 241 along the first direction X is greater than or equal to 5.

[0067] In the display substrate provided by the embodiment of the present disclosure, the first sub-gasket 210 and the second sub-gasket 230 of each conductive gasket 200 are both conductive gaskets 200, a first insulating layer 220 is arranged between the first sub-gasket 210 and the second sub-gasket 230, the first sub-gasket 210 and the second sub-gasket 230 are directly connected through a first via 221 in the first insulating layer 220, at least one second via 241 is provided in the second insulating layer 240, the second via 241 exposes a portion of the second sub-gasket 230, the size of the second via 241 along the second direction Y is greater than the size of the second via 241 along the first direction X, the orthographic projection of the second via 241 on the base substrate 100 overlaps with the orthographic projection of the first via 221 on the base substrate 100, so that not only each second via 241 can expose a larger area of ​​the second sub-gasket 230, but also each conductive gasket 200 can expose a larger area of ​​the second sub-gasket 230 through at least one second via 241. Therefore, even if the top sub-gasket described above falls off, the top sub-gasket is located on the side of the second sub-gasket 230 away from the base substrate. Since each second via 241 can expose a larger area of ​​the second sub-gasket 230, and the second via 241 itself has a larger size in the second direction Y, the flexible circuit board can bend at the second via 241 and overlap with the second sub-gasket 230 through the second via 241, thereby avoiding the problem of the flexible circuit board being unable to contact the second sub-gasket 230 due to the second via 241 being too small. Therefore, the display substrate greatly reduces the phenomenon of poor overlap or failure to overlap. As a result, the flexible circuit board can better and more easily overlap with the conductive gasket 200, and better achieve connection with the display substrate through the conductive gasket 200, so that the display substrate can have a better and more stable display effect.

[0068] It should be noted that, in order to clearly illustrate the first sub-gasket 210 and the second sub-gasket 230 of each conductive gasket 200 and their stacking relationship, FIG7 omits the first insulating layer 220 and the second insulating layer 240. The dimensions of the first sub-gasket 210 and the second sub-gasket 230 of each conductive gasket 200 in FIG7 along the second direction Y are only partially shown. The fact that the dimension of the second sub-gasket 230 of each conductive gasket 200 in the first direction X is greater than the dimension of the first sub-gasket 210 in the first direction X is also schematic. The dimension of the second sub-gasket 230 of each conductive gasket 200 in the first direction X may also be less than or equal to the dimension of the first sub-gasket 210 in the first direction X. This is not limited in the present embodiment. For example, the first sub-gasket 210 may further have a buffer layer 330 and an insulating layer 340 on the side close to the base substrate 100. For example, the insulating layer 340 may be a first gate insulating layer.

[0069] In some examples, as shown in FIG7 and FIG8 , the size of the second via 241 along the second direction Y is greater than the size of the second via 241 along the first direction X. For example, the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X can be any value greater than or equal to 5. For example, the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X can be greater than or equal to 10, for example, can also be greater than or equal to 18, for example, can also be greater than or equal to 25. Depending on the design of the size of the conductive gasket 200, the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X can be designed to have different values.

[0070] In some examples, as shown in Figures 7 and 8, the ratio of the area of ​​the orthographic projection of at least one second via 241 in the second insulating layer 240 of each conductive gasket 200 on the base substrate 100 to the area of ​​the orthographic projection of the second sub-gasket 230 of the conductive gasket 200 on the base substrate 100 is greater than or equal to 0.5. Thus, the greater the ratio of the area of ​​the orthographic projection of at least one second via 241 in the second insulating layer 240 on the base substrate 100 to the area of ​​the orthographic projection of the second sub-gasket 230 of the conductive gasket 200 on the base substrate 100, the larger the opening of the second via 241 will be, and the larger the area of ​​the exposed second sub-gasket 230 will be.

[0071] For example, when the second insulating layer 240 of each conductive gasket 200 includes one second via 241, the ratio of the area of ​​the orthographic projection of the second via 241 on the base substrate 100 to the area of ​​the orthographic projection of the second sub-gasket 230 of the conductive gasket 200 on the base substrate 100 is greater than or equal to 0.5. For example, when the second insulating layer of each conductive gasket 200 includes multiple second vias 241, the ratio of the total area of ​​the orthographic projection of the multiple second vias 241 on the base substrate 100 to the area of ​​the orthographic projection of the second sub-gasket 230 of the conductive gasket 200 on the base substrate 100 is greater than or equal to 0.5. For example, the area ratio can be greater than or equal to 0.8. For example, the area ratio can be 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 0.99, etc., which are not listed one by one here. According to the design of the size of different conductive gaskets 200, the ratio of the area of ​​the positive projection of at least one second via 241 in the second insulating layer 240 on the base substrate 100 to the area of ​​the positive projection of the second sub-gasket 230 on the base substrate 100 can be designed to different values.

[0072] In some examples, as shown in Figures 7 and 8 , a ratio of a size of at least one second via 241 in the first direction X to a size of the second subgasket 230 in the first direction X is greater than or equal to 0.5. Thus, a larger ratio of the size of the second via 241 in the first direction X to the size of the second subgasket 230 in the first direction X results in a larger opening size of each second via 241 and a larger exposed area of ​​the second subgasket 230.

[0073] For example, the ratio of the size of the second via 241 in the first direction X to the size of the second subgasket 230 in the first direction X may be 0.5, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 1, etc., which are not listed here one by one.

[0074] For example, the ratio of the size of the second via 241 in the first direction X to the size of the second subgasket 230 in the first direction X, and the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X, can both be relatively large values. For example, the ratio of the size of the second via 241 in the first direction X to the size of the second subgasket 230 in the first direction X can be greater than 0.8, and the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X can be greater than 10. Thus, the larger the opening size of the second via 241, the larger the exposed area of ​​the second subgasket 230.

[0075] In some examples, as shown in FIG7 and FIG8 , the ratio of the size of at least one second via 241 in the second direction Y to the size of the second subgasket 230 in the second direction Y is greater than or equal to 0.7. For example, the size ratio can be 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 0.99, 1, etc., which are not enumerated here. Thus, the closer the ratio of the size of the second via 241 in the second direction Y to the size of the second subgasket 230 in the second direction Y is to 1, the larger the opening size of the second via 241 will be, and the larger the area of ​​the exposed second subgasket 230 will be.

[0076] In some examples, as shown in Figures 7 and 8, the second insulating layer 240 includes only one second via 241. This maximizes the size of the single second via 241 in the second insulating layer 240 in the second direction Y, maximizing the area of ​​the second sub-gasket 230 exposed by the second via 241. This allows the flexible circuit board to better bond with the second sub-gasket 230 if the top sub-gasket becomes detached, resulting in a better and more stable display on the display substrate. Figure 9 is another schematic cross-sectional view of the conductive gasket shown in Figure 7 along the second direction. As shown in Figures 7 and 9, the second insulating layer 240 includes at least two second vias 241. The first insulating layer 220 includes at least two first vias 221. Of course, the disclosed embodiments do not limit the number of first and second vias 221, 241, and the number of first and second vias 221, 241 can be designed based on the size of the conductive gasket 200.

[0077] In some examples, as shown in Figures 7 to 9, the orthographic projection of the first via 221 on the substrate 100 overlaps with the orthographic projection of the second via 241 on the substrate 100. The figures schematically illustrate that the orthographic projection of the first via 221 on the substrate 100 falls within the orthographic projection of the second via 241 on the substrate 100. Of course, the embodiments of the present disclosure are not limited to this. For example, the orthographic projection of the first via 221 on the substrate 100 may overlap with the orthographic projection of the second via 241 on the substrate 100. In this case, the dimensions of the first via 221 in the first direction X and the second direction Y are respectively the same as the dimensions of the second via 241 in the first direction X and the second direction Y. For example, the orthographic projection of the first via 221 on the substrate 100 may also partially fall within the orthographic projection of the second via 241 on the substrate 100 and partially fall outside the orthographic projection of the second via 241 on the substrate 100.

[0078] For example, the first sub-gasket 210 and the second sub-gasket 230 can be made of metal materials such as copper, aluminum, and titanium. For example, the first sub-gasket 210 and the second sub-gasket 230 can be formed into a single-layer structure or a multi-layer structure. For example, the first insulating layer 220 and the second insulating layer 240 can be made of inorganic insulating materials such as silicon oxide, silicon nitride, or silicon oxynitride, or can include organic insulating materials such as polyimide, polyphthalimide, polyphthalamide, acrylic resin, benzocyclobutene, or phenolic resin. Of course, the embodiments of the present disclosure do not limit the materials of the first sub-gasket 210, the first insulating layer 220, the second sub-gasket 230, and the second insulating layer 240.

[0079] For example, the base substrate 100 may be a glass plate, a quartz plate, a metal plate, or a resin plate, etc. For example, the material of the base substrate 100 may include an organic material, such as a resin material such as polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate. The base substrate 100 may be a flexible substrate or a non-flexible substrate, which is not limited in the embodiments of the present disclosure.

[0080] Figure 10 is a partially enlarged schematic diagram of another conductive gasket provided in an embodiment of the present disclosure; Figure 11 is a schematic cross-sectional view of the conductive gasket shown in Figure 10 along the second direction. As shown in Figures 10 and 11, each conductive gasket 200 further includes a third sub-gasket 250. The third sub-gasket 250 is located on a side of the second insulating layer 240 away from the second sub-gasket 230. The third sub-gasket 250 is directly connected to the second sub-gasket 230 via a second via 241. The third sub-gasket 250 of each conductive gasket 200 is a conductive gasket 200. The second insulating layer 240 is disposed between the third sub-gasket 250 and the second sub-gasket 230. The third sub-gasket 250 is directly connected to the second sub-gasket 230 via a second via 241 in the second insulating layer 240. The provision of the third sub-gasket 250 allows a flexible printed circuit board to be directly bonded to the third sub-gasket 250, thereby improving the bond between the flexible printed circuit board and the conductive gasket 200. In addition, by providing the third sub-gasket 250 , the flexible circuit board can be connected to the display substrate through the multi-layer conductive gasket 200 , and the conductive performance of the conductive gasket 200 can also be improved.

[0081] For example, the material of the third subgasket 250 can include a transparent conductive oxide. For example, the third subgasket 250 can have a laminated structure, with the top layer of the laminated structure including a transparent conductive oxide. Thus, the third subgasket 250 can also protect the first subgasket 210 and the second subgasket 230 from oxidation. The first subgasket 210 and the second subgasket 230 can be made of a conductive metal with better conductivity, and the conductive gasket 200 will also have better conductivity. The presently disclosed embodiments do not limit the structure and material of the third subgasket 250.

[0082] For example, as shown in FIG10 , the orthographic projection of the third subgasket 250 on the base substrate 100 covers the orthographic projection of the second subgasket 230 on the base substrate 100. The present disclosure is not limited to this. For example, the orthographic projection of the third subgasket on the base substrate may also be located within the orthographic projection of the second subgasket on the base substrate.

[0083] Figure 12 is a partially enlarged schematic diagram of another conductive gasket provided in an embodiment of the present disclosure; Figure 13 is a schematic cross-sectional view of the conductive gasket shown in Figure 12 along the second direction. As shown in Figures 12 and 13, the third sub-gasket 250 includes a first sub-layer 251 and an oxide 252. The first sub-layer 251 is at least partially located within the second via 241 and is directly connected to the second sub-gasket 230; the oxide 252 is located on the periphery of the second via 241. The material of the first sub-layer 251 includes a transparent conductive oxide. Therefore, when the first sub-layer 250 further includes a conductive material layer on the side away from the base substrate 100, the conductive material layer is prone to oxidation to form oxide 252 or even oxidation and shedding. The flexible circuit board can be connected to the first sub-layer 251 through the second via 241 of larger size and area, thereby reducing the impact of oxide 252 or shedding on the connection between the flexible circuit board and the conductive gasket 200. In addition, the material of the first sublayer 251 includes transparent conductive oxide, which can also protect the first conductive gasket 200 and the second conductive gasket 200 from being oxidized. The first conductive gasket 200 and the second conductive gasket 200 can use conductive metals with better conductive properties, so that the conductive gasket 200 can have better conductive properties.

[0084] In some examples, as shown in Figures 12 and 13, the third subgasket 250 further includes an oxide 252 located within the second via 241. The oxide 252 is also located on the side of the first sublayer 251 away from the second subgasket 230. For example, when the conductive material of the third subgasket 250 oxidizes to form the oxide 252, the flexible circuit board can overlap with the first sublayer 251 through the second via 241 of larger size and area, thereby reducing the impact of the oxide 252 on the overlap between the flexible circuit board and the conductive gasket 200, thereby reducing the impact on the input signal.

[0085] For example, when the first sublayer 250 further includes a conductive material layer on the side away from the base substrate 100, the conductive material layer is susceptible to oxidation to form oxide 252 or oxidation and shedding of the conductive material layer. The oxide 252 can affect the connection between the third subgasket 250 and the flexible circuit board, and the shedding of the conductive material can also affect the connection between the third subgasket 250 and the flexible circuit board, thereby preventing the third subgasket 250 from properly connecting the flexible circuit board to the display substrate, thereby affecting the display effect of the display substrate. Therefore, the larger the size of the second via 241, the more the flexible circuit board can bend at the second via 241 and overlap with the first sublayer 251, thereby reducing the impact of the oxide 252 or the shedding of the conductive material layer on the connection between the flexible circuit board and the conductive gasket 200, allowing the display substrate to have a better and more stable display effect.

[0086] In some examples, as shown in FIG13 , the first sublayer 251 may further include at least one opening 251a, the orthographic projection of the opening 251a on the base substrate 100 falling within the orthographic projection of the second via 241 on the base substrate 100. When the third sub-gasket 250 is severely detached, the first sub-layer 251 may also partially detach, resulting in an opening 251a in the severely detached area of ​​the first sub-layer 251. Therefore, the larger the size or area of ​​the second via 241, the more the flexible circuit board can bend at the second via 241 and overlap with the first sub-layer 251 through the second via 241, or overlap with the second sub-gasket 230 through the opening 251a, thereby enabling the flexible circuit board to better and more easily overlap with the conductive gasket 200.

[0087] In some examples, as shown in FIG. 13 , at least a portion of the first sub-layer 251 may also be located outside the second via hole 241 .

[0088] In some examples, if the first sublayer 250 further includes a conductive material layer on the side away from the base substrate 100, and if the conductive material layer is severely oxidized, the third subgasket 250 may completely fall off, resulting in the conductive gasket 200 including only the first subgasket 210 and the second subgasket 230. Due to the size design of the second via 241, the flexible circuit board can overlap with the second subgasket 230 through the larger second via 241, greatly reducing the possibility of poor or no overlap between the flexible circuit board and the second subgasket 230. Even if the third subgasket 250 falls off, the flexible circuit board can better and more easily overlap with the conductive gasket, thereby achieving a better and more stable display effect for the display substrate.

[0089] For example, the material of the first sub-layer 251 includes indium tin oxide. For example, the material of the oxide 252 includes silver oxide. Of course, the embodiment of the present disclosure does not limit the materials of the first sub-layer 251 and the oxide 252.

[0090] Figure 14 is another schematic cross-sectional view of the conductive gasket shown in Figure 12 along the second direction. As shown in Figure 14, the third sub-gasket 250 further includes a second sub-layer 254, which is located on the side of the first sub-layer 251 away from the second sub-gasket 230. The material of the second sub-layer 254 includes a conductive metal, and the oxide 252 includes an oxide of the conductive metal. Therefore, when a portion of the conductive metal in the second sub-layer 254 undergoes oxidation to form the oxide 252, the flexible circuit board can be bonded to the first sub-layer 251 and the unoxidized second sub-layer 254 through the larger second via 241, significantly reducing the impact of the oxide 252 on the poor or incomplete bonding between the flexible circuit board and the conductive gasket 200.

[0091] In some examples, as shown in FIG. 14 , a portion of the second sub-layer 254 may be located within the second via hole 241 , and a portion of the second sub-layer 254 may also be located outside the second via hole 241 .

[0092] In some examples, as shown in FIG14 , second via 241 includes oxide 252 , which includes an oxide of a conductive metal. For example, oxide 252 is formed by oxidation of a portion of the conductive metal in second sublayer 254 . Consequently, the flexible printed circuit board can overlap with the second sublayer 254 via second via 241 of larger size and area. The larger overlap area of ​​second via 241 can reduce the impact of oxide 252 on the overlap area between the flexible printed circuit board and the conductive gasket 200, thereby reducing the impact on the input signal.

[0093] For example, the material of the second sub-layer includes silver. For example, the material of the oxide 252 includes silver oxide. Of course, the embodiment of the present disclosure does not limit the materials of the second sub-layer and the oxide 252.

[0094] Figure 15 is another schematic cross-sectional view of the conductive gasket shown in Figure 12 along the second direction. As shown in Figure 15 , the third sub-gasket 250 further includes a third sub-layer 255, which is at least partially located on the side of the second sub-layer 254 away from the second sub-gasket 230. The material of the third sub-layer 255 includes a transparent conductive oxide. For example, when the thickness of the third sub-layer 255 is relatively thin, the second sub-layer 254 is prone to partial oxidation or even detachment. As a result, the flexible circuit board can be connected to the second sub-layer 254 through the second via 241 of larger size and area, greatly reducing the possibility of poor or incomplete connection.

[0095] For example, the material of the third sub-layer includes indium tin oxide. Of course, the embodiment of the present disclosure does not limit the materials of the third sub-layer and the oxide 252 .

[0096] Figure 16 is another schematic cross-sectional view of the conductive gasket 200 shown in Figure 10 along the second direction Y. As shown in Figure 16, the third sub-gasket 250 includes a first sub-layer 251, a second sub-layer 254, and a third sub-layer 255. The first sub-layer 251 is at least partially located within the second via 241 and directly connected to the second sub-gasket 230; the second sub-layer 254 is located on the side of the first sub-layer 251 away from the second sub-gasket 230; and the third sub-layer 255 is located on the side of the second sub-layer away from the second sub-gasket 230. The materials of the first sub-layer 251 and the third sub-layer 255 include a transparent conductive oxide, while the material of the second sub-layer 254 includes a conductive metal. The transparent conductive oxide material of the first sub-layer 251 and the third sub-layer 255 protects the conductive material of the second sub-layer 254, the first sub-gasket 210, and the second sub-gasket 230 from oxidation. The materials of the second sub-layer 254, the first sub-gasket 210, and the second sub-gasket 230 can be made of conductive materials with better conductivity. Furthermore, even if oxidation or shedding occurs in a local area of ​​the third sub-gasket 250, the flexible circuit board can be overlapped with the second sub-layer 254 through the second via 241 of larger size and area, which greatly reduces the phenomenon of poor overlap or no overlap.

[0097] For example, the transparent conductive oxide of the first sub-layer 251 and the second sub-layer 254 includes indium tin oxide, and the conductive metal of the third sub-layer 255 includes silver. Of course, the embodiment of the present disclosure is not limited to this.

[0098] FIG17 is a partially enlarged schematic diagram of another conductive gasket provided in an embodiment of the present disclosure; FIG18 is a cross-sectional schematic diagram of the conductive gasket shown in FIG17 along the second direction. As shown in FIG17 and FIG18, each conductive gasket 200 further includes a fourth sub-gasket 260. The fourth sub-gasket 260 is located on the side of the third sub-gasket 250 away from the second insulating layer 240. The material of the fourth sub-gasket 260 includes a transparent conductive oxide. Thus, the fourth sub-gasket 260 can protect the sub-gasket between the fourth sub-gasket 260 and the base substrate 100 from being oxidized. The material of the sub-gasket between the fourth sub-gasket 260 and the base substrate 100 can be a conductive metal with better conductive properties, and the conductive gasket 200 can have better conductive properties. For example, the material of the fourth sub-gasket 260 includes indium tin oxide.

[0099] For example, when the material of the fourth subgasket 260 includes a transparent conductive oxide, the first subgasket 210, the second subgasket 230, and the third subgasket 250 can be made of a metal material such as copper, aluminum, titanium, or silver. For example, the first subgasket 210, the second subgasket 230, and the third subgasket 250 can be formed into a single-layer structure or a multi-layer structure. This is not limited in the present embodiment.

[0100] For example, as shown in Figures 17 and 18 , when the material of the fourth subgasket 260 includes a transparent conductive oxide, the fourth subgasket 260 can protect the subgasket between the fourth subgasket 260 and the base substrate 100 from oxidation. Thus, in this embodiment, there is no restriction on the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X, and there is no restriction on the ratio of the size of the second via 241 in the second direction Y to the size of the second via 241 in the first direction X. Figures 17 and 18 illustrate that the ratio of the size of the first via 221 and the second via 241 in the second direction Y to the size in the first direction X is greater than 5. However, it can also be less than or equal to 5, and this will not be repeated here.

[0101] In some examples, as shown in FIG7 to FIG18 , the first insulating layer 220 includes at least one first via 221. The first via 221 extends along the second direction Y. The size of the first via 221 in the second direction Y is larger than the size of the first via 221 in the first direction X. For example, if the conductive material in or around the first via 221 is partially oxidized, the larger area of ​​the first via 221 can reduce the impact of the oxidation of the conductive material on the conductive performance of the conductive gasket 200. This allows the display substrate to achieve a better and more stable display effect.

[0102] In some examples, as shown in Figures 7 to 18, the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X can be any value greater than or equal to 5. For example, the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X can be greater than or equal to 10, for example, can also be greater than or equal to 18, for example, can also be greater than or equal to 25. Depending on the design of the size of the conductive gasket 200, the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X can be designed to have different values.

[0103] In some examples, as shown in FIG. 7 to FIG. 18 , the number of the first vias 221 can be any positive integer greater than or equal to 1. The number of the first vias 221 can be designed to be different values ​​according to the design of the size of the conductive gasket 200 .

[0104] In some examples, as shown in Figures 7 to 18, the ratio of the area of ​​the orthographic projection of the at least one first via 221 on the base substrate 100 to the area of ​​the orthographic projection of the first subgasket 210 on the base substrate 100 is greater than or equal to 0.5. Thus, the greater the ratio of the area of ​​the orthographic projection of the at least one first via 221 in the first insulating layer 220 on the base substrate 100 to the area of ​​the orthographic projection of the first subgasket 210 of the conductive gasket 200 on the base substrate 100, the larger the area of ​​the first via 221, thereby reducing the impact of oxidation of the conductive material on the conductive performance of the conductive gasket 200.

[0105] For example, when the first insulating layer 220 of each conductive gasket 200 includes one first via 221, the ratio of the area of ​​the orthographic projection of the first via 221 on the base substrate 100 to the area of ​​the orthographic projection of the first sub-gasket 210 of the conductive gasket 200 on the base substrate 100 is greater than or equal to 0.5. For example, when the first insulating layer 220 of each conductive gasket 200 includes multiple first vias 221, the ratio of the total area of ​​the orthographic projection of the multiple first vias 221 on the base substrate 100 to the area of ​​the orthographic projection of the first sub-gasket 210 of the conductive gasket 200 on the base substrate 100 is greater than or equal to 0.5. For example, the area ratio can also be greater than or equal to 0.8. For example, the area ratio can be 0.5, 0.55, 0.6, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 0.99, etc., which are not listed one by one here. According to the design of the size of different conductive gaskets 200, the ratio of the area of ​​the positive projection of at least one first via 221 in the first insulating layer 220 on the base substrate 100 to the area of ​​the positive projection of the first sub-gasket 210 on the base substrate 100 can be designed to be different values.

[0106] In some examples, as shown in Figures 7 to 18 , the ratio of the size of at least one first via 221 in the first direction X to the size of the first subgasket 210 in the first direction X is greater than or equal to 0.5. Thus, the larger the ratio of the size of the first via 221 in the first direction X to the size of the first subgasket 210 in the first direction X, the larger the size and area of ​​the first via 221. For example, if the conductive material within or around the first via 221 undergoes partial oxidation, the larger the size and area of ​​the first via 221, the impact of the oxidation of the conductive material on the conductive performance of the conductive gasket 200 can be reduced. This allows the display substrate to achieve a better and more stable display effect.

[0107] For example, the ratio of the size of the first via 221 in the first direction X to the size of the first subgasket 210 in the first direction X can be 0.5, 0.65, 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 0.99, 1, etc., which are not listed here one by one.

[0108] For example, the ratio of the size of the first via 221 in the first direction X to the size of the first subgasket 210 in the first direction X, and the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X, can both be relatively large values. For example, the ratio of the size of the first via 221 in the first direction X to the size of the first subgasket 210 in the first direction X can be greater than 0.8, and at the same time, the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X can be greater than 10. Thus, the first via 221 can have a larger size and area.

[0109] In some examples, as shown in Figures 8 and 10 to 18, the first insulating layer 220 includes only one first via 221. This maximizes the size of the single first via 221 in the first insulating layer 220 in the second direction Y, and maximizes the area of ​​the first subgasket 210 exposed by the first via 221. For example, the ratio of the size of the first via 221 in the second direction Y to the size of the first subgasket 210 in the second direction Y ranges from 0.7 to 1.0. For example, the size ratio can be 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 0.99, 1, etc.

[0110] For example, the ratio of the size of the first via 221 in the second direction Y to the size of the first subgasket 210 in the second direction Y may be 0.7, 0.75, 0.8, 0.85, 0.9, 0.95, 0.98, 1, etc., which are not listed here one by one.

[0111] For example, as shown in Figures 8 and 10 to 18, the second insulating layer 240 includes only one second via 241, and the first insulating layer 220 includes only one first via 221. Exemplarily, when the second insulating layer 240 includes only one second via 241, the ratio of the size of the second via 241 in the second direction Y to the size of the second subgasket 230 in the second direction Y is greater than or equal to 0.7. Exemplarily, when the first insulating layer 220 includes only one first via 221, the ratio of the size of the first via 221 in the second direction Y to the size of the first subgasket 210 in the second direction Y is greater than or equal to 0.7. This maximizes the size of the single second via 241 in the second direction Y, and also maximizes the size of the single first via 221 in the second direction Y. Consequently, when the conductive material of the conductive gasket 200 oxidizes, the larger areas of the first and second vias 221 and 241 can reduce the impact of oxidation on the conductive performance of the conductive gasket 200.

[0112] Figure 19 is a partially enlarged schematic diagram of another conductive gasket provided in an embodiment of the present disclosure; Figure 20 is a schematic cross-sectional view of the conductive gasket shown in Figure 19 along the second direction. As shown in Figures 19 and 20, the first insulating layer 220 includes a plurality of first vias 221 arranged along the second direction Y. The ratio of the dimensions of the first vias 221 in the second direction Y to the dimensions of the first vias 221 in the first direction X is less than or equal to 2. The second subgasket 230 can be directly connected to the first subgasket 210 via the plurality of first vias 221.

[0113] It should be noted that the embodiment of the present disclosure does not limit the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X. For example, as shown in Figures 7 to 19, the figures schematically show that the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X is greater than 5. However, the ratio of the size of the first via 221 in the second direction Y to the size of the first via 221 in the first direction X may also be less than or equal to 5, which will not be repeated here.

[0114] For example, as shown in FIG19 , the second insulating layer 240 includes only one second via 241, and the first insulating layer 220 includes multiple first vias 221. Exemplarily, when the second insulating layer 240 includes only one second via 241, the ratio of the dimension of the second via 241 in the second direction Y to the dimension of the second sub-gasket 230 in the second direction Y is greater than or equal to 0.7. Consequently, when the conductive material of the conductive gasket 200 oxidizes, the larger area of ​​the second via 241 can reduce the impact of the oxidation of the conductive material on the conductive performance of the conductive gasket 200.

[0115] FIG21 is a schematic cross-sectional view of a display substrate provided in one embodiment of the present disclosure. As shown in FIG6 and FIG21, the display substrate further includes a plurality of pixel units. The plurality of pixel units are located in the display area 101, and each pixel unit includes a pixel driving circuit 310 and a light-emitting element 320. The pixel driving circuit 310 is located on the base substrate 100, and the light-emitting element 320 is located on a side of the pixel driving circuit 310 away from the base substrate 100. The pixel driving circuit 310 is configured to drive the light-emitting element 320 to emit light. For example, the display substrate further includes an encapsulation layer and a touch layer, etc., which are not shown or described in detail here.

[0116] For example, the pixel driving circuit 310 may include a transistor 311, a storage capacitor Cst, etc., and may be implemented in various types, such as a 2T1C type (i.e., including two transistors 311 and one storage capacitor Cst). Furthermore, the 2T1C type may further include more transistors and / or capacitors to provide functions such as compensation, reset, light emission control, and detection. The embodiments of the present disclosure do not limit the pixel driving circuit 310. For example, in some embodiments, the transistor 311 directly electrically connected to the light emitting element 320 may be a driving transistor 311 or a light emission control transistor 311.

[0117] As shown in FIG21 , each pixel unit further includes a buffer layer 330 located on the base substrate 100. The pixel driving circuit 310 includes an active layer 331 located on the side of the buffer layer 330 away from the base substrate 100, a first gate insulating layer 332 located on the side of the active layer 331 away from the base substrate 100, a gate electrode 314 located on the first gate insulating layer 332, a second gate insulating layer 333 located on the side of the gate electrode 314 away from the base substrate 100, an interlayer insulating layer 334 located on the second gate insulating layer 333, and a first electrode 312 and a second electrode 313 located on the interlayer insulating layer 334. For example, the first electrode 312 may be a source electrode and the second electrode 313 may be a drain electrode, or vice versa. The first electrode 312 and the second electrode 313 further include a passivation layer 335 on the side away from the substrate 100. The passivation layer 335 further includes a planarization layer 336 on the side away from the substrate 100. The planarization layer 336 further includes a first electrode 321 on the side away from the substrate 100. The first electrode 321 further includes a light-emitting material 322 and a second electrode 323 on the side away from the substrate 100. For example, the first electrode 321 may be an anode, and the second electrode 323 may be a cathode.

[0118] In an embodiment of the present disclosure, the transistor 311 includes a first electrode 312, a second electrode 313, and a gate 314. The gate 314 and the first subgasket 210 are located in the same conductive layer, and the first electrode 312 and the second electrode 313 are located in the same conductive layer as the second subgasket 230. Each light-emitting element includes a first electrode 321, a light-emitting material 322, and a second electrode 323. The third subgasket 250 and the first electrode 321 are located in the same conductive layer. The gate 314 and the first subgasket 210 are located in the same conductive layer, which means that the gate 314 and the first subgasket 210 are formed from the same conductive material layer and the same patterning process. The first electrode 312 and the second electrode 313 and the second subgasket 230 are located in the same conductive layer, which means that the first electrode 312, the second electrode 313, and the second subgasket 230 are formed from the same conductive material layer and the same patterning process. The third subgasket 250 and the first electrode 321 are located in the same conductive layer, which means that the third subgasket 250 and the first electrode 321 are formed from the same conductive material layer and the same patterning process. For example, the first insulating layer 220 of the binding area 1020 includes a first sub-insulating layer provided in the same layer as the first insulating layer 220 of the display area 101 and a second sub-insulating layer provided in the same layer as the interlayer insulating layer 334. For example, the second insulating layer 240 of the binding area 1020 includes a third sub-insulating layer provided in the same layer as the passivation layer 335 of the display area 101 and a fourth sub-insulating layer provided in the same layer as the planarization layer 336. Of course, the embodiments of the present disclosure are not limited to this. Using the same conductive material layer and the same patterning process to form each film layer can simplify the preparation process, does not lead to an increase in process steps, and reduces the preparation cost of the product.

[0119] In some examples, as shown in FIG21 , when the display panel's light emission mode is bottom emission, the conductive layer where the third subspacer 250 of the conductive spacer 200 and the first electrode 321 of the display area 101 are located is made of a transparent conductive oxide layer. Thus, the third subspacer 250 can prevent oxidation of the first subspacer 210 and the second subspacer 230, resulting in improved conductivity of the conductive spacer 200 and a better, more stable display effect for the display substrate.

[0120] In some examples, as shown in FIG21 , when the display substrate's light emission mode is top emission, the conductive layer comprising the third sub-gasket 250 of the conductive spacer 200 and the first electrode 321 of the display area 101 can be a three-layer stacked structure. The three-layer stacked structure comprises a transparent conductive oxide layer, a conductive metal layer, and a transparent conductive oxide layer. The middle conductive metal layer reflects light emitted by the luminescent material 322 and transmits it to the outside environment through the second electrode 323. In this example, the transparent conductive oxide layer near the second electrode 323 is thinner, causing at least partial oxidation of the conductive metal layer. In severe cases, the third sub-gasket 250 of the conductive spacer 200 may fall off. Therefore, the larger area of ​​the second via 241 can reduce the impact of oxidation or fall-off on the connection between the flexible circuit board and the conductive spacer 200, or even the inability to connect. Even if the third sub-gasket 250 falls off, the flexible circuit board can still connect better and more easily to the conductive spacer, thereby achieving a better and more stable display effect on the display substrate.

[0121] Figure 22 is a partially enlarged schematic diagram of the binding area provided in the first embodiment of the present disclosure. As shown in Figure 22, the conductive gasket 200 includes the conductive gasket 200 in any of the above embodiments, which will not be repeated here. The conductive gasket 200 is connected to the lead 1022 through the via 341. For example, one end of the lead 1022 is connected to a signal line such as the data line 1011 in the display area 101 shown in Figure 6. For example, the other end of the lead 1022 is connected to the dot screen device, so that it can be used to detect the screen. It should be noted that the end of the lead 1022 connected to the dot screen device can be cut off after the screen is detected, and can be used only for dot screen detection in the test phase.

[0122] Figure 23 is a cross-sectional schematic diagram illustrating the connection between a conductive gasket and a flexible printed circuit board according to one embodiment of the present disclosure. As shown in Figure 23 , the flexible printed circuit board 400 is connected to the display substrate via the conductive gasket 200. This allows the driver circuit board to transmit display data to the display substrate via the flexible printed circuit board 400, thereby driving the display substrate to produce a light-emitting display. The conductive gasket 200 includes any of the conductive gaskets 200 described in the aforementioned embodiments and will not be further described here.

[0123] Figure 24 is a partially enlarged schematic diagram of another conductive gasket provided in an embodiment of the present disclosure; Figure 25 is a schematic cross-sectional view of the conductive gasket shown in Figure 24 along the second direction. As shown in Figures 6, 24, and 25, the display substrate comprises multiple conductive gaskets 200 arranged along a first direction X. Each conductive gasket 200 is positioned on the base substrate 100 and extends along a second direction Y. For example, each conductive gasket 200 may be made of a non-oxidizable conductive material. A flexible printed circuit board can be connected to the conductive gaskets 200 to achieve connection with the display substrate.

[0124] For example, as shown in Figures 24 and 25, the conductive gasket 200 can be a single-layer structure. Of course, the embodiments of the present disclosure do not limit this. For example, the material of the conductive gasket 200 can be a laminated structure. For example, the laminated structure of the conductive gasket 200 can be a three-layer structure, and the three-layer structure is a first protective layer, a conductive metal layer and a second protective layer. The conductive metal layer is located between the first protective layer and the second protective layer. The first protective layer is closer to the base substrate 100 than the second protective layer. The material of the second protective layer may include a conductive material that is not easily oxidized, thereby protecting the conductive metal layer. The embodiments of the present disclosure do not limit the specific material of the conductive gasket 200.

[0125] In some examples, as shown in FIG25 , an insulating layer 240 is further provided on a side of the conductive gasket 200 away from the base substrate 100. A via 241 is provided on the insulating layer 240. The orthographic projection of the via 241 on the base substrate 100 falls within the orthographic projection of the conductive gasket 200 on the base substrate 100. Thus, the flexible printed circuit board can directly contact the conductive gasket 200 through the via 241 to achieve connection with the display substrate. The insulating layer 240 can cover at least a portion of the edge or side of the conductive gasket 200. For example, the insulating layer 240 can cover the edge or side of the conductive gasket 200 extending along the first direction X and the second direction Y. Thus, the insulating layer 240 can protect the edge or side of the conductive gasket 200. For example, the insulating layer 240 can prevent the edge or side of the conductive gasket 200 from oxidation.

[0126] 24 and 25 , the conductive pad 200 and the lead 1022 are located on different conductive layers, and the conductive pad 200 is connected to the lead 1022 through a via 341. The insulating layer 240 located on the side of the lead 1022 away from the base substrate 100 can also prevent the lead 1022 from being scratched or other adverse effects.

[0127] It should be noted that in order to clearly show each conductive gasket 200, the insulating layer 240 in Figure 24 only shows the via 241, and the dimensions of each conductive gasket 200 and the via 241 along the second direction Y in Figure 24 are only partially shown. It is also schematic that the dimension of each conductive gasket 200 in the first direction X is smaller than the dimension of the lead 1022 in the first direction X. The dimension of each conductive gasket 200 in the first direction X may also be greater than or equal to the dimension of the lead 1022 in the first direction X. The embodiments of the present disclosure do not limit this.

[0128] In some examples, as shown in Figures 6, 21, and 25, the gate 314 and the lead 1022 are located in the same conductive layer, and the first electrode 312, the second electrode 313, and the conductive gasket 200 are located in the same conductive layer. The gate 314 and the lead 1022 are located in the same conductive layer means that the gate 314 and the lead 1022 are formed by the same conductive material layer through the same patterning process, and the first electrode 312, the second electrode 313, and the conductive gasket 200 are located in the same conductive layer means that the first electrode 312, the second electrode 313, and the conductive gasket 200 are formed by the same conductive material layer through the same patterning process. Of course, the embodiments of the present disclosure are not limited to this. Using the same conductive material layer through the same patterning process to form each film layer can simplify the preparation process, does not lead to an increase in process steps, and reduces the preparation cost of the product.

[0129] One embodiment of the present disclosure also provides a display device. Figure 26 is a schematic diagram of a display device provided in one embodiment of the present disclosure. As shown in Figure 26, the display device includes a display substrate according to any of the above embodiments. Thus, the display device has the same benefits as those of the display substrate, which will not be further elaborated here.

[0130] For example, the display device may be a television, a computer monitor, a laptop computer, a tablet computer, a smart phone, a navigation system, an electronic picture frame, a car display, etc.

[0131] There are a few points to note:

[0132] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to conventional designs.

[0133] (2) Unless there is any conflict, the features of the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0134] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display substrate, comprising: A substrate, comprising a display area and a peripheral area at least partially surrounding the display area; as well as A plurality of conductive pads are located in a binding area, wherein the binding area is located in the peripheral area, the plurality of conductive pads are arranged along a first direction, each of the conductive pads extends along a second direction intersecting the first direction, and comprises: A first sub-gasket, located on the base substrate; A first insulating layer, located on a side of the first sub-gasket away from the substrate; A second sub-gasket is located on a side of the first insulating layer away from the first sub-gasket; a second insulating layer, located on a side of the second sub-gasket away from the first insulating layer; a first via hole, penetrating the first insulating layer, wherein the second sub-pad is directly connected to the first sub-pad through the first via hole; and a second via hole penetrating through the second insulating layer to expose a portion of the second sub-pad, Among them, at least one of the first vias is included between the first sub-gasket and the corresponding second sub-gasket, the orthographic projection of the first via on the base substrate overlaps with the orthographic projection of at least one of the second vias on the base substrate, and the size of at least one of the second vias in the second direction is larger than the size of the second via in the first direction.

2. The display substrate according to claim 1, wherein: A ratio of a size of the second via hole in the second direction to a size of the second via hole in the first direction is greater than or equal to 5.

3. The display substrate according to claim 1, wherein: A ratio of an area of ​​an orthographic projection of at least one of the second via holes on the base substrate to an area of ​​an orthographic projection of the second sub-gasket on the base substrate is greater than or equal to 0.

5.

4. The display substrate according to claim 1, wherein: A ratio of a size of at least one of the second via holes in the first direction to a size of the second sub-gasket in the first direction is greater than or equal to 0.

5.

5. The display substrate according to claim 1, wherein: A ratio of a size of at least one of the second via holes in the second direction to a size of the second sub-pad in the second direction is greater than or equal to 0.

7.

6. The display substrate according to any one of claims 1 to 5, wherein: The orthographic projection of the second via hole on the base substrate covers the orthographic projection of the first via hole on the base substrate.

7. The display substrate according to any one of claims 1 to 5, wherein: Each of the conductive pads further comprises: a third sub-gasket, located on a side of the second insulating layer away from the second sub-gasket, Wherein, the third sub-gasket is directly connected to the second sub-gasket through the second via hole.

8. The display substrate according to claim 7, wherein: The third sub-gasket comprises: A first sublayer, at least partially located within the second via hole and directly connected to the second subpad; and The oxide is located at the periphery of the second via hole, inside the second via hole, or on a side of the first sublayer away from the second subpad, The material of the first sub-layer includes transparent conductive oxide.

9. The display substrate according to claim 8, wherein: The first sub-layer includes at least one opening, and an orthographic projection of the opening on the base substrate falls within an orthographic projection of the second via on the base substrate.

10. The display substrate according to claim 8, wherein: The third sub-gasket also includes: A second sub-layer is located on a side of the first sub-layer away from the second sub-gasket, The material of the second sub-layer includes a conductive metal, and the oxide includes an oxide of the conductive metal.

11. The display substrate according to claim 10, wherein: The third sub-gasket further includes: a third sub-layer, at least partly located on a side of the second sub-layer away from the second sub-gasket, Wherein, the material of the third sub-layer includes transparent conductive oxide.

12. The display substrate according to claim 7, wherein: Each of the conductive pads further comprises: a fourth sub-gasket, located on a side of the third sub-gasket away from the second insulating layer, Wherein, the material of the fourth subgasket includes transparent conductive oxide.

13. The display substrate according to any one of claims 1 to 12, wherein: A size of the first via hole in the second direction is greater than a size of the first via hole in the first direction.

14. The display substrate according to claim 13, wherein: A ratio of a size of the first via hole in the second direction to a size of the first via hole in the first direction is greater than or equal to 5.

15. The display substrate according to claim 14, wherein: A ratio of an area of ​​an orthographic projection of at least one of the first via holes on the base substrate to an area of ​​an orthographic projection of the first sub-gasket on the base substrate is greater than or equal to 0.

5.

16. The display substrate according to claim 14, wherein: A ratio of a size of at least one of the first via holes in the first direction to a size of the first sub-gasket in the first direction is greater than or equal to 0.

5.

17. The display substrate according to claim 14, wherein: A ratio of a size of at least one of the first via holes in the second direction to a size of the first sub-gasket in the second direction is greater than or equal to 0.

7.

18. The display substrate according to any one of claims 1 to 12, wherein: A size of the first via hole in the second direction and a size of the first via hole in the first direction are less than or equal to 2.

19. The display substrate according to any one of claims 1 to 18, wherein: The second insulating layer includes only one second via hole, and a ratio of a size of the second via hole in the second direction to a size of the second sub-pad in the second direction is greater than or equal to 0.7, The first insulating layer includes only one first via hole, and a ratio of a size of the first via hole in the second direction to a size of the first sub-pad in the second direction is greater than or equal to 0.

7.

20. The display substrate according to any one of claims 1 to 18, wherein: The second insulating layer includes only one second via hole, and a ratio of a size of the second via hole in the second direction to a size of the second sub-pad in the second direction is greater than or equal to 0.7, The first insulating layer includes a plurality of the first via holes.

21. The display substrate according to any one of claims 7 to 20, further comprising: A plurality of pixel units are located in the display area. Each of the pixel units includes a pixel driving circuit and a light-emitting element, wherein the pixel driving circuit is located on the substrate, the light-emitting element is located on a side of the pixel driving circuit away from the substrate, and the pixel driving circuit is configured to drive the light-emitting element to emit light. Each of the pixel driving circuits includes a transistor, the transistor includes a first electrode, a second electrode and a gate, the gate and the first sub-pad are located in the same conductive layer, the first electrode and the second electrode and the second sub-pad are located in the same conductive layer, Each light emitting element comprises a first electrode and a second electrode, the third sub-pad and the first electrode are located in the same conductive layer, and the second electrode is located on a side of the first electrode away from the base substrate.

22. A display device comprising the display substrate according to any one of claims 1 to 21.

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