Flexible circuit board cutting system

Abstract

The invention discloses a flexible circuit board cutting system, and relates to the technical field of flexible circuit board cutting, the flexible circuit board cutting system comprises a cutting table and a cutting cover, the top end of the cutting table is provided with a cooling adsorption plate in an embedded manner, and the cooling adsorption plate is provided with adsorption holes distributed in an array manner; the substrate material initial placement area is limited through the square limiting frame, the four sets of L-shaped correction plates are pushed through the pushing mechanism to form a self-centering mechanism, the position of the substrate material to be cut can be automatically corrected, the cut flexible circuit boards do not need to be manually picked out from leftover materials one by one after cutting is completed, and the working efficiency is improved. In addition, a cooling adsorption plate is matched with adsorption holes to adsorb and position the substrate material, then a limiting pressing plate is matched with a first air cylinder to apply pressure, the stability in the cutting process is guaranteed, the cutting precision can be prevented from being affected, finally, the cut substrate material with the high temperature is rapidly cooled through cooling liquid flowing in a cooling liquid cavity, and the cutting efficiency is improved. And overlong high-temperature exposure time of the substrate material can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit board cutting, and in particular to a flexible circuit board cutting system. Background Art

[0002] A printed circuit board (PCB) is one of the core components of electronic devices. It is mainly used to connect electronic components (such as resistors, capacitors, chips, etc.) into a complete circuit system through prefabricated conductive circuits and pads. Its core structure is the substrate, conductive layer, pads, silk screen layer and solder mask layer. The circuit board miniaturizes and visualizes the circuit, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Circuit boards are divided into soft boards, hard boards and soft-hard combination boards according to their characteristics. Among them, soft boards usually refer to flexible circuit boards.

[0003] Flexible printed circuits (FPCs) are printed circuits made from a flexible insulating substrate. They feature three-dimensional wiring capabilities and dynamic bending properties, making them a key technology for the miniaturization and wearability of modern electronic products. Flexible circuits offer excellent electrical performance, meeting the demands of smaller and higher-density designs, while also helping to reduce assembly steps and enhance reliability. FPCs are available in single-sided, double-sided, and multi-layer versions. The substrate used is primarily polyimide copper-clad laminate, a material with high heat resistance and excellent dimensional stability. The final product is formed by laminating it with a cover film that provides both mechanical protection and excellent electrical insulation.

[0004] During the production and processing of flexible circuit boards, it is necessary to cut the entire flexible circuit board substrate material through a corresponding cutting processing system to separate the flexible circuit board and scrap waste. However, most of the existing flexible circuit board cutting systems have a single function. Before cutting, it is generally necessary to manually calibrate the position of the substrate material. After cutting, it is also necessary to manually sort the cut flexible circuit boards one by one and pick them out from the scrap waste, which is time-consuming and labor-intensive, and inefficient. In addition, the traditional single adsorption and fixing method cannot ensure the stability of the substrate material during processing, which easily affects the cutting processing accuracy. The additional limiting structure will cause the structure to be complicated and increase the equipment cost. In addition, the existing flexible circuit board cutting system cannot fully cool the substrate material in time after cutting, which results in a long high-temperature exposure time of the material, further reducing the cutting quality. Therefore, the present invention proposes a flexible circuit board cutting system to solve the problems existing in the prior art. Summary of the Invention

[0005] In response to the above problems, the purpose of the present invention is to propose a flexible circuit board cutting system to solve the problems that the existing flexible circuit board cutting system requires manual position correction of the substrate material, requires manual sorting of the cut flexible circuit boards one by one, and the traditional single adsorption and fixing method cannot guarantee the stability of the substrate material during the processing process, and cannot fully cool the substrate material in time after cutting.

[0006] In order to achieve the objectives of the present invention, the present invention is implemented through the following technical solutions: A flexible circuit board cutting system includes a cutting table and a cutting cover, a cooling adsorption plate is embedded and installed on the top of the cutting table, adsorption holes are arranged in an array on the cooling adsorption plate, an adsorption assembly is provided below the cooling adsorption plate, a cooling liquid chamber is provided inside the cooling adsorption plate, a square limit frame is fixed on the top of the cutting table, L-shaped correction plates driven by a propulsion mechanism are provided on the four sides of the square limit frame, the inner top of the L-shaped correction plate is connected to a limit pressure plate through a first cylinder, a support frame driven by a transverse driving mechanism is symmetrically provided above the square limit frame, an adsorption box driven by a second cylinder to be raised and lowered is provided inside the support frame, vacuum suction cups distributed in an array are fixed to the bottom end of the adsorption box, finished product storage boxes are fixed on both sides of the top of the cutting table, a hanging plate driven by an X-axis moving mechanism to move laterally and by a Y-axis moving mechanism to move longitudinally is provided above the cutting cover, the bottom end of the hanging plate is connected to a mounting plate through a third cylinder, and a laser cutting assembly is fixed to the bottom end of the mounting plate.

[0007] Further improvements are: an interlocking groove adapted to the cooling adsorption plate is opened at the top of the cutting table, and coolant inlet and outlet pipes connected to the cooling liquid cavity and passing through to the outside of the cutting table are fixed on both sides of the cooling adsorption plate, and a dust filter is fixed inside the adsorption hole.

[0008] A further improvement is that the adsorption component includes an adsorption tank opened inside the cutting table and connected to the interlocking groove, and a first vacuum pump fixed to the bottom end of the cutting table, and vacuum pipes penetrating into the adsorption tank are fixed on both sides of the first vacuum pump.

[0009] Further improvements are: the propulsion mechanism includes a driving frame fixed to the inner walls of the four sides of the square limit frame and a screw rod rotatably connected to the inside of the driving frame and driven to rotate by a servo motor, a threaded plate is threadedly sleeved on the screw rod, and a push rod that slides through the side wall of the driving frame is symmetrically fixed between the threaded plate and the L-shaped correction plate.

[0010] Further improvements are: the first cylinder is fixed to the top of the L-shaped correction plate, the top of the limiting pressure plate is symmetrically fixed with a first limiting rod that slides through the top of the L-shaped correction plate, the second cylinder is fixed to the top of the support frame, and both sides of the adsorption box are fixed with a second limiting rod that slides through the top of the support frame.

[0011] Further improvements are: the transverse movement drive mechanism includes a first linear module symmetrically fixed to the top of the cutting table and a first slide fixed between the output end of the first linear module and the support frame, the X-axis moving mechanism includes a second linear module fixed to the top of the inside of the cutting cover and a second slide fixed to the output end of the second linear module, and the Y-axis moving mechanism includes a third linear module fixed to the bottom end of the second slide and a third slide fixed between the output end of the third linear module and the hanging plate.

[0012] A further improvement is that: the third cylinder is fixed to the bottom end of the hanging plate, the mounting plate is fixed to the output end of the third cylinder, the top end of the mounting plate is symmetrically fixed with a sleeve, and the bottom end of the hanging plate is symmetrically fixed with a sliding rod slidably connected to the inside of the sleeve.

[0013] Further improvements are: the laser cutting assembly includes a UV laser cutting head and an ultrafast laser cutting head fixed on both sides of the bottom end of the mounting plate, an annular nitrogen pipe is fixed to the bottom end of the mounting plate, and nitrogen nozzles arranged in an inclined manner are symmetrically fixed to the bottom end of the annular nitrogen pipe, and an air intake pipe passing through the mounting plate is symmetrically fixed to the top end of the annular nitrogen pipe, and a second air pump is fixed to the top end of the air intake pipe, and the input end of the second air pump is connected to the external nitrogen supply equipment through a pipeline.

[0014] Further improvements are: a dust removal and purification box is fixed to the top of the cutting hood, a dust removal pump is fixed to the rear side wall of the cutting hood, the input and output ends of the dust removal pump are respectively fixed with a first T-shaped main pipe and a second T-shaped main pipe, a first dust extraction branch pipe is equidistantly fixed on the side of the first T-shaped main pipe away from the dust removal pump, the end of the first dust extraction branch pipe away from the first T-shaped main pipe passes through the interior of the cutting hood and is fixed with a dust suction hood, and a second dust extraction branch pipe connected to the second T-shaped main pipe is equidistantly fixed to the top of the dust removal and purification box.

[0015] A further improvement is that a fume purification filter is fixed inside the dust removal and purification box, exhaust pipes are fixed to the lower parts of the outer walls on both sides of the dust removal and purification box, and exhaust fans are fixed inside the exhaust pipes.

[0016] The beneficial effects of the present invention are as follows: the present invention defines the initial placement area of the substrate material by a square limit frame, forming a first-level rough positioning; the four sets of L-shaped correction plates are pushed by the propulsion mechanism to form a self-centering mechanism, which can automatically correct the position of the substrate material to be cut without manual operation, forming a second-level fine calibration; and after cutting, the cut flexible circuit board is lifted by the vacuum suction cup, and the lateral driving mechanism is used to drive the support frame to move to the top of the finished product storage box to temporarily store the cut flexible circuit board, thereby relatively realizing automatic sorting without the need for manual picking out of the scraps one by one, saving time and labor, and having high efficiency; In addition, the cooling adsorption plate cooperates with the adsorption hole to adsorb and position the substrate material, forming a first-level limit, and then the limit pressure plate cooperates with the first cylinder to apply pressure to vertically press the substrate material to form a second-level pressing and solidification, thereby achieving a stable positioning of the substrate material, ensuring its stability during the cutting process, and avoiding affecting the cutting accuracy. The pressing structure and the position correction structure are integrated into the design, without the need for an additional limit structure, which reduces the structural complexity and equipment cost to a certain extent. Finally, by connecting the cooling adsorption plate to the external coolant supply and recovery equipment, the coolant flowing in the coolant chamber is used to quickly cool down the substrate material that has been cut and has a high temperature, achieving efficient and timely cooling, thereby avoiding the substrate material from being exposed to high temperature for too long and further ensuring the cutting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the present invention; Figure 2 is a front cross-sectional view of the present invention; Figure 3 is a side view of the present invention; Figure 4 is a top cross-sectional view of the cooling adsorption plate of the present invention; Figure 5 is a cross-sectional view of the mounting plate of the present invention; Figure 6 is a cross-sectional view of the support frame of the present invention; Figure 7 It is a cross-sectional view of the square limiting frame of the present invention.

[0018] Among them: 1. Cutting table; 2. Cutting cover; 3. Cooling adsorption plate; 4. Adsorption hole; 5. Cooling liquid chamber; 6. Square limit frame; 7. L-shaped correction plate; 8. First cylinder; 9. Limit pressure plate; 10. Support frame; 11. Second cylinder; 12. Adsorption box; 13. Vacuum suction cup; 14. Finished product storage box; 15. Hanging plate; 16. Third cylinder; 17. Mounting plate; 18. Fitting groove; 19. Cooling liquid inlet and outlet pipe; 20. Dust filter; 21. Adsorption tank; 22. First vacuum pump; 23. Vacuum pipe; 24. Drive frame; 25. Servo motor; 26. Screw; 27. Threaded plate; 28. Push rod; 29. First Limit rod; 30. Second limit rod; 31. First linear module; 32. First slide; 33. Second linear module; 34. Second slide; 35. Third linear module; 36. Third slide; 37. Sleeve; 38. Slide rod; 39. UV laser cutting head; 40. Ultrafast laser cutting head; 41. Annular nitrogen pipe; 42. Nitrogen nozzle; 43. Inlet pipe; 44. Second air pump; 45. Dust removal and purification box; 46. Dust removal pump; 47. First T-type main pipe; 48. Second T-type main pipe; 49. First dust extraction branch pipe; 50. Dust hood; 51. Second dust extraction branch pipe; 52. Flue gas purification filter; 53. Exhaust pipe. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0020] A flexible circuit board (FPC) is a printed circuit board made of a flexible substrate (usually polyimide or polyester film). Unlike traditional rigid FR-4 PCBs, the core feature of a FPC is its ability to bend, fold, and roll. Simply put, a FPC is a thin, light, and flexible "electronic circuit cloth." It is one of the key enabling technologies for modern electronic products pursuing miniaturization, lightweight, high reliability, and complex functions. It is especially indispensable in applications with limited space, moving parts, or requiring special shapes.

[0021] according to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7As shown, this embodiment provides a flexible circuit board cutting system, which consists of a horizontally arranged cutting table 1 and a cutting cover 2 welded and fixed to the top of the cutting table 1. The bottom end of the cutting table 1 has a bracket, and the front of the cutting cover 2 is open for easy access to materials. A cooling adsorption plate 3 for placing flexible circuit board substrate materials is embedded and installed on the top of the cutting table 1. The upper surface of the cutting table 1 and the upper surface of the cooling adsorption plate 3 are at the same level and are both coated with an anti-reflective coating, which can reduce the laser reflectivity to a certain extent, reduce the laser energy loss, and avoid laser cutting damage. Adsorption holes 4 are provided on the cooling adsorption plate 3, and the adsorption holes 4 are distributed in an array. An adsorption component adapted to the adsorption holes 4 is provided below the cooling adsorption plate 3. The adsorption component can drive the adsorption holes 4 to adsorb and limit the substrate material on the cooling adsorption plate 3. A cooling liquid chamber 5 for the flow of coolant is provided inside the cooling adsorption plate 3 to provide cooling for the high-temperature substrate material after cutting. A square limit frame 6 is fixed to the top of the cutting table 1. When cutting, the substrate material is placed inside the square limit frame 6. The square limit frame 6 defines the initial placement area of the substrate material to form a first-level rough positioning. L-shaped correction plates 7 are provided on the four left and right sides of the front side of the square limit frame 6. The bottom end of the L-shaped correction plate 7 slides and fits with the upper surface of the cooling adsorption plate 3 and is driven to move by a propulsion mechanism. The four groups of L-shaped correction plates 7 are pushed by the propulsion mechanism to form a self-centering mechanism for the substrate material, which can correct the position of the substrate material by pushing the displacement of the substrate material, forming a second-level fine calibration, and realizing automatic position correction of the substrate material. A first cylinder 8 is fixed through the top of the L-shaped correction plate 7, and a limiting pressure plate 9 is fixed to the output end of the first cylinder 8 by bolts. The limiting pressure plate 9 is lifted and displaced under the action of the first cylinder 8 to limit the edge position of the substrate material. The cooling adsorption plate 3 cooperates with the adsorption hole 4 to adsorb and position the substrate material, forming a first-level limit. The limiting pressure plate 9 cooperates with the first cylinder 8 to apply pressure to the substrate material vertically, forming a second-level pressing and consolidation, thereby achieving a stable positioning of the substrate material and ensuring its stability during the cutting process; A support frame 10 with an inverted U-shaped design is symmetrically provided above the square limit frame 6, and the two groups of support frames 10 are driven and displaced laterally left and right by the transverse driving mechanism at the top of the cutting table 1. A second cylinder 11 is fixed through the top of the support frame 10, and the output end of the second cylinder 11 is located on the inner side of the support frame 10 and is fixed with an adsorption box 12 by bolts. The adsorption box 12 is driven to rise and fall by the second cylinder 11, and a vacuum suction cup 13 for adsorbing the flexible circuit board is fixed at the bottom end of the adsorption box 12. The vacuum suction cups 13 are distributed in an array and correspond to the positions of the cut flexible circuit boards. The adsorption box 12 is connected to the external suction equipment through a pipeline, which can extract the air in the adsorption box 12, so that the vacuum suction cups 13 generate suction, which can adsorb the cut flexible circuit board. Finished product storage boxes 14 for placing the cut flexible circuit boards are fixed on both sides of the top of the cutting table 1; A hanging plate 15 is provided on the upper part of the cutting cover 2, and the hanging plate 15 is driven to move horizontally by the X-axis moving mechanism and to move vertically by the Y-axis moving mechanism. The bottom end of the hanging plate 15 is fixed with a third cylinder 16 by bolts, and the output end of the third cylinder 16 is fixed with a mounting plate 17 by bolts. The bottom end of the mounting plate 17 is fixed with a laser cutting component for laser cutting the substrate material.

[0022] A fitting groove 18 is provided at the top of the cutting table 1, and the fitting groove 18 is adapted to the cooling adsorption plate 3 so that the cooling adsorption plate 3 can be fitted and installed. A sealing ring is used to improve the sealing between the cooling adsorption plate 3 and the fitting groove 18. Coolant inlet and outlet pipes 19 are fixed to the left and right side walls of the cooling adsorption plate 3, and the coolant inlet and outlet pipes 19 are connected to the cooling liquid cavity 5. The end of the coolant inlet and outlet pipes 19 away from the cooling adsorption plate 3 passes through the outside of the cutting table 1 and is connected to the external coolant supply and recovery equipment through a quick connector. The coolant is injected into the cooling liquid cavity 5 and discharged through the external coolant supply and recovery equipment, so that the coolant flows in the cooling liquid cavity 5. A dust filter 20 is fixed inside the adsorption hole 4 to play a dust-proof role.

[0023] The adsorption assembly includes an adsorption groove 21 and a first air pump 22, wherein the adsorption groove 21 is opened inside the cutting table 1 and is connected to the interlocking groove 18. The first air pump 22 is fixed to the bottom end of the cutting table 1 by bolts. Air suction pipes 23 are fixed on both sides of the first air pump 22, and the end of the air suction pipe 23 away from the first air pump 22 passes through the adsorption groove 21. Starting the first air pump 22 to exhaust the air in the adsorption groove 21 can enable the cooling adsorption plate 3 to generate suction through the adsorption hole 4, thereby adsorbing and fixing the flexible circuit board substrate material.

[0024] The propulsion mechanism includes a driving frame 24, a servo motor 25 and a screw rod 26, wherein the driving frame 24 is provided with four groups and is respectively fixed to the inner walls of the front, back, left and right sides of the square limit frame 6, the screw rod 26 is rotatably connected to the inside of the driving frame 24 through a bearing and is driven to rotate by the servo motor 25, and a threaded plate 27 located inside the driving frame 24 is threadedly sleeved on the screw rod 26, and a push rod 28 is symmetrically fixed on a side wall of the threaded plate 27 away from the servo motor 25, and one end of the push rod 28 away from the threaded plate 27 slides through the outside of the driving frame 24 and is fixedly connected to the L-shaped correction plate 7. The screw rod 26 is driven to rotate by the servo motor 25, so that the threaded plate 27 threaded on the screw rod 26 is displaced along the screw rod 26, and the L-shaped correction plate 7 is synchronously displaced by the push rod 28 during the displacement of the threaded plate 27.

[0025] A first limiting rod 29 is symmetrically fixed to the top of the limiting pressure plate 9, and the top of the first limiting rod 29 slides through the top of the L-shaped correction plate 7, which limits the limiting pressure plate 9 and makes it more stable during the lifting process. Support blocks are fixed to the outer walls of the left and right sides of the adsorption box 12, and a second limiting rod 30 is fixed on the support block, which slides through the top of the support frame 10, which limits the adsorption box 12 and makes it more stable during the lifting process.

[0026] The lateral drive mechanism includes a first linear module 31 and a first slide 32. The first linear module 31 is fixed to the top of the cutting table 1. The first slide 32 is fixed between the output end of the first linear module 31 and the support frame 10. It can drive the support frame 10 to move horizontally. By providing two sets of support frames 10, the efficiency of sorting flexible circuit boards is improved. The lateral displacement of the two sets of support frames 10 is sufficient to cover the flexible circuit boards. The X-axis movement mechanism includes a second linear module 33 and a second slide 34, wherein the second linear module 33 is fixed to the top of the cutting cover 2 by bolts and is arranged in a transverse direction. The second slide 34 is fixed to the output end of the second linear module 33 by bolts and can move laterally left and right in the cutting cover 2. The Y-axis movement mechanism includes a third linear module 35 and a third slide 36. The third linear module 35 is fixed to the bottom end of the second slide 34 and is longitudinally distributed. The third slide 36 is fixed between the output end of the third linear module 35 and the hanging plate 15 and can move longitudinally back and forth within the cutting cover 2. The transverse movement drive mechanism, X-axis movement mechanism and Y-axis movement mechanism of this embodiment all belong to the existing technology and adopt the ball screw structure commonly used in the existing technology.

[0027] A sleeve 37 is symmetrically fixed to the top of the mounting plate 17, and a slide rod 38 is symmetrically fixed to the bottom of the hanging plate 15, and the lower part of the slide rod 38 is slidably connected to the inside of the sleeve 37. Through the cooperation of the sleeve 37 and the slide rod 38, the mounting plate 17 is limited, making it more stable during the lifting process.

[0028] The laser cutting assembly consists of a UV laser cutting head 39 and an ultrafast laser cutting head 40, which are respectively mounted on the left and right sides of the bottom end of the mounting plate 17. It integrates a dual light source of UV laser (355nm) and ultrafast laser (femtosecond level). The UV laser performs rough cutting (power 15-30W), followed by edge refinement with the ultrafast laser (pulse width <500fs). The composite wavelength lasers work synergistically to improve precision and reduce the heat-affected zone. An annular nitrogen pipe 41 located at the periphery of the laser cutting assembly is fixed to the bottom end of the mounting plate 17, and four groups of symmetrically distributed nitrogen nozzles 42 are fixed to the bottom end of the annular nitrogen pipe 41. The nitrogen nozzles 42 are tilted and facing the cutting position. An air inlet pipe 43 is symmetrically fixed to the top of the annular nitrogen pipe 41. The top of the air inlet pipe 43 passes through the mounting plate 17 and is fixed with a second air pump 44. The input end of the second air pump 44 is connected to the external nitrogen supply equipment through a pipeline. Nitrogen is ejected through the nitrogen nozzle 42 and focused on the laser spot action area to form a nitrogen protective layer to prevent oxygen from reacting with the substrate material, reduce the degree of oxidation and thermal damage, and thus improve the cutting speed and quality.

[0029] A hollow dust removal and purification box 45 is fixed to the top of the cutting hood 2 by bolts, and a dust removal pump 46 is fixed to the outer wall of the rear side of the cutting hood 2 by bolts. A first T-shaped main pipe 47 is fixed to the input end of the dust removal pump 46, and a second T-shaped main pipe 48 is fixed to the output end of the dust removal pump 46. Three groups of evenly distributed first dust extraction branches 49 are fixed on the side of the first T-shaped main pipe 47 away from the dust removal pump 46. The end of the first dust extraction branch pipe 49 away from the first T-shaped main pipe 47 passes through the interior of the cutting hood 2 and is fixed with a dust suction hood 50. Second dust extraction branch pipes 51 are equidistantly fixed to the top of the dust removal and purification box 45, and the end of the second dust extraction branch pipe 51 away from the dust removal and purification box 45 is connected to the second T-shaped main pipe 48. Start the dust removal pump 46 to suck the smoke generated by laser cutting in the cutting hood 2 into the dust removal and purification box 45 for purification.

[0030] A flue gas purification filter 52 is fixed inside the dust removal and purification box 45, which is used to filter and purify the flue gas drawn into the dust removal and purification box 45. Exhaust pipes 53 are fixed to the lower part of the outer walls on both sides of the dust removal and purification box 45, and an exhaust fan is fixed inside the exhaust pipe 53 to assist in discharging the air inside the dust removal and purification box 45.

[0031] When the flexible circuit board cutting system is actually used, the flexible circuit board substrate material to be cut is placed on the cooling adsorption plate 3 inside the square limit frame 6. First, the propulsion mechanism of the four side walls of the square limit frame 6 is used to drive the four groups of L-shaped correction plates 7 to synchronously advance and displace in the direction of the substrate material. During the displacement of the L-shaped correction plates 7, the substrate material is pushed to move synchronously, forming a self-centering mechanism to automatically correct the position of the substrate material. Then, the adsorption component is started to adsorb the substrate material after position correction on the upper surface of the cooling liquid chamber 5. Then, the first cylinder 8 is started to drive the limiting pressure plate 9 to descend and press and fix the edge of the substrate material (which belongs to the position of the scrap corner and will not affect the normal cutting process). Then, the third cylinder 16 is started to drive the mounting plate 17 to drive the laser cutting component to descend to the corresponding position and perform laser cutting on the substrate material. At the same time, the X-axis moving mechanism and the Y-axis moving mechanism are used to drive the hanging plate 15 to move according to the preset path, so as to drive the laser cutting component to move according to the preset cutting path to achieve mobile cutting. During the cutting process, external cooling water is connected to the cooling liquid chamber 5 in the cooling adsorption plate 3 to achieve efficient and timely cooling of the substrate material. After the entire substrate material is cut, the limit pressure plate 9, the L-shaped correction plate 7 and the laser cutting assembly are driven to reset respectively, and the adsorption of the substrate material by the adsorption assembly is released. Then, the support frame 10 is driven to move laterally on the cutting table 1 by the transverse drive mechanism. When it moves to the top of the cut flexible circuit board, the second cylinder 11 is started to drive the adsorption box 12 to descend until the vacuum suction cup 13 contacts the cut flexible circuit board. At this time, the vacuum suction cup 13 is used to adsorb the cut flexible circuit board, and then the adsorption box 12 is driven to rise and reset, and the cut flexible circuit board is The flexible limit plate 6 is raised, and then the support frame 10 is driven by the transverse driving mechanism to move to the top of the finished product storage box 14. At this time, the adsorption of the flexible circuit board is released, so that it falls naturally into the finished product storage box 14. The above operation is repeated until all the flexible circuit boards inside the square limit frame 6 are sorted out, and only scraps remain on the upper surface of the cutting table 1. Finally, it is only necessary to manually collect and clean the scraps remaining on the upper surface of the cutting table 1, which eliminates the need to manually sort out the flexible circuit boards one by one, and completes the efficient cutting processing of the entire flexible circuit board substrate material.

[0032] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the foregoing embodiments. The foregoing embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board cutting system, comprising a cutting table (1) and a cutting cover (2), characterized in that: The top of the cutting table (1) is fitted with a cooling adsorption plate (3), an array of adsorption holes (4) are provided on the cooling adsorption plate (3), an adsorption assembly is provided below the cooling adsorption plate (3), a cooling liquid cavity (5) is provided inside the cooling adsorption plate (3), a square limit frame (6) is fixed on the top of the cutting table (1), four sides of the square limit frame (6) are provided with L-shaped correction plates (7) driven by a propulsion mechanism, the top of the inner side of the L-shaped correction plate (7) is connected to a limiting pressure plate (9) through a first cylinder (8), and the top of the square limit frame (6) is symmetrically provided with a limit plate (9) driven by a transverse movement. A support frame (10) is provided on the inner side of the support frame (10) and is driven to move up and down by a second cylinder (11). The bottom end of the adsorption box (12) is fixed with a vacuum suction cup (13) distributed in an array. Finished product storage boxes (14) are fixed on both sides of the top of the cutting table (1). A hanging plate (15) is provided on the upper part of the cutting cover (2) and is driven to move horizontally by an X-axis moving mechanism and to move vertically by a Y-axis moving mechanism. The bottom end of the hanging plate (15) is connected to a mounting plate (17) through a third cylinder (16). The bottom end of the mounting plate (17) is fixed with a laser cutting component.

2. The flexible circuit board cutting system according to claim 1, characterized in that: The top of the cutting table (1) is provided with an engaging groove (18) adapted to the cooling adsorption plate (3), and both sides of the cooling adsorption plate (3) are fixed with cooling liquid inlet and outlet pipes (19) that are connected to the cooling liquid cavity (5) and pass through the outside of the cutting table (1), and a dustproof filter (20) is fixed inside the adsorption hole (4).

3. The flexible circuit board cutting system according to claim 2, characterized in that: The adsorption assembly comprises an adsorption groove (21) opened inside the cutting table (1) and connected to the interlocking groove (18), and a first air pump (22) fixed to the bottom end of the cutting table (1), and air extraction pipes (23) penetrating into the adsorption groove (21) are fixed on both sides of the first air pump (22).

4. The flexible circuit board cutting system according to claim 1, characterized in that: The propulsion mechanism comprises a driving frame (24) fixed to the inner walls of the four sides of the square limit frame (6) and a screw rod (26) rotatably connected to the inside of the driving frame (24) and driven to rotate by a servo motor (25), a threaded plate (27) being threadedly sleeved on the screw rod (26), and a push rod (28) slidingly penetrating the side wall of the driving frame (24) being symmetrically fixed between the threaded plate (27) and the L-shaped correction plate (7).

5. The flexible circuit board cutting system according to claim 1, characterized in that: The first cylinder (8) is fixed to the top of the L-shaped correction plate (7), and a first limiting rod (29) that slides through the top of the L-shaped correction plate (7) is symmetrically fixed to the top of the limiting pressure plate (9). The second cylinder (11) is fixed to the top of the support frame (10), and second limiting rods (30) that slide through the top of the support frame (10) are fixed on both sides of the adsorption box (12).

6. The flexible circuit board cutting system according to claim 1, characterized in that: The transverse driving mechanism includes a first linear module (31) symmetrically fixed to the top of the cutting table (1) and a first slide (32) fixed between the output end of the first linear module (31) and the support frame (10); the X-axis moving mechanism includes a second linear module (33) fixed to the top of the inside of the cutting cover (2) and a second slide (34) fixed to the output end of the second linear module (33); and the Y-axis moving mechanism includes a third linear module (35) fixed to the bottom end of the second slide (34) and a third slide (36) fixed between the output end of the third linear module (35) and the hanging plate (15).

7. The flexible circuit board cutting system according to claim 1, characterized in that: The third cylinder (16) is fixed to the bottom end of the hanging plate (15), the mounting plate (17) is fixed to the output end of the third cylinder (16), a sleeve (37) is symmetrically fixed to the top end of the mounting plate (17), and a sliding rod (38) slidably connected to the inside of the sleeve (37) is symmetrically fixed to the bottom end of the hanging plate (15).

8. The flexible circuit board cutting system according to claim 1, characterized in that: The laser cutting assembly comprises a UV laser cutting head (39) and an ultrafast laser cutting head (40) fixed on both sides of the bottom end of the mounting plate (17); an annular nitrogen pipe (41) is fixed to the bottom end of the mounting plate (17); a nitrogen nozzle (42) arranged in an inclined manner is symmetrically fixed to the bottom end of the annular nitrogen pipe (41); an air inlet pipe (43) penetrating the mounting plate (17) is symmetrically fixed to the top end of the annular nitrogen pipe (41); a second air pump (44) is fixed to the top end of the air inlet pipe (43); and an input end of the second air pump (44) is connected to an external nitrogen supply device through a pipeline.

9. The flexible circuit board cutting system according to claim 1, characterized in that: A dust removal and purification box (45) is fixed to the top of the cutting hood (2), a dust removal pump (46) is fixed to the rear side wall of the cutting hood (2), a first T-shaped main pipe (47) and a second T-shaped main pipe (48) are fixed to the input end and the output end of the dust removal pump (46), respectively, a first dust extraction branch pipe (49) is fixed equidistantly on the side of the first T-shaped main pipe (47) away from the dust removal pump (46), an end of the first dust extraction branch pipe (49) away from the first T-shaped main pipe (47) passes through the interior of the cutting hood (2) and is fixed to a dust collection hood (50), and a second dust extraction branch pipe (51) connected to the second T-shaped main pipe (48) is fixed equidistantly on the top of the dust removal and purification box (45).

10. The flexible circuit board cutting system according to claim 9, characterized in that: A flue gas purification filter (52) is fixed inside the dust removal and purification box (45), exhaust pipes (53) are fixed to the lower parts of the outer walls on both sides of the dust removal and purification box (45), and exhaust fans are fixed inside the exhaust pipes (53).

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