Pad and manufacturing system and method

Abstract

A gasket and a system and method of manufacturing a gasket. The liner includes a layer disposed on a side of a wire mesh structure including a set of wires. Each member of the set of filaments is looped and joined to at least one other member of the set of filaments. The layer is bonded to at least some of the members of the set of filaments.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 508,300, filed on June 15, 2023, and Danish Patent Application No. PA202370560, filed on November 3, 2023, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] Various embodiments relate to filament mesh structures, such as gaskets, and systems and methods of manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a perspective view of an example of a seat assembly.

[0005] Figure 2 is a perspective view of an example of a cushion for a seat component that is a wire mesh structure.

[0006] Figure 3 is a schematic diagram of an example of a manufacturing system for manufacturing a wire mesh structure.

[0007] Figure 4 and Figure 5 is a schematic diagram of an example of a layer distribution subsystem for distributing layers on a wire mesh structure.

[0008] Figure 6 is an enlarged view of an example of a layer bonded to a wire mesh structure.

[0009] Figure 7 is a flow chart of an example of a method of forming a wire mesh structure.

[0010] Figure 8 is a plan view of an example of a layer disposed on a wire mesh structure, the layer comprising linear wires.

[0011] Fig. 9 is a plan view of an example of a layer disposed on a wire mesh structure, the layer comprising nonlinear wires.

[0012] Fig.10 is a plan view of an example of a layer disposed on a wire mesh structure, the layer comprising contiguous filaments.

[0013] Fig.11 is a perspective view of an example of a layer disposed on a wire mesh structure, the layer including a film.

[0014] Fig.12 is a perspective view of an example of layers disposed on a wire mesh structure, the layers including wires and films.

[0015] Fig.13 is a perspective view of an example of layers disposed on multiple sides of a wire mesh structure.

[0016] Fig.14 is a perspective view of an example of layers disposed on all sides of a wire mesh structure and ports disposed in the layers.

[0017] Figure 15a-Figure 15c An example of distributing layers on multiple sides of a wire mesh structure by rotating the wire mesh structure is illustrated. Detailed Description

[0019] Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. In the detailed description that follows, many specific details are set forth in order to provide a thorough understanding of the various embodiments described. However, it is apparent to one of ordinary skill in the art that the various embodiments described may be practiced without these specific details. In other instances, well-known methods, processes, components, circuits, and networks are not described in detail to avoid unnecessarily obscuring aspects of the embodiments.

[0020] It should be understood that the disclosed embodiments are merely exemplary, and that various forms and alternative forms are possible. The drawings are not necessarily to scale; some features may be exaggerated or minimized to show details of particular components. Therefore, the specific structural details and functional details disclosed herein should not be interpreted as limiting, but merely as a representative basis for teaching those skilled in the art to implement the embodiments according to the present disclosure in various ways.

[0021] “One or more” includes a function performed by one element, a function performed by more than one element (eg, in a distributed manner), several functions performed by one element, several functions performed by several elements, or any combination of the foregoing.

[0022] It should also be understood that, although in some cases, the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first contact may be referred to as a second contact, and similarly, a second contact may be referred to as a first contact without departing from the scope of the various embodiments described. Both the first contact and the second contact are contacts, but they are not the same contact.

[0023] The terms used in the description of the various embodiments described herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. As used in the description of the various described embodiments and the appended claims, the singular forms "a", "an" and "the" are intended to also include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and covers any and all possible combinations of one or more of the associated listed items. It should be further understood that when used in this specification, the terms "includes", "including", "comprises" and / or "comprising" specify the presence of the features, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or groups thereof.

[0024] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," as appropriate to the context. Likewise, the phrases "if it is determined" or "if [the condition or event] is detected" are optionally interpreted to mean "upon determination" or "in response to determining" or "upon detecting [the condition or event]" or "in response to detecting [the condition or event]," as appropriate to the context.

[0025] refer to Figure 1 , an example of a seat assembly 10 is shown. In some embodiments, the seat assembly 10 is a vehicle seat assembly (e.g., for land vehicles, such as cars, trucks, buses, etc.), or for non-land vehicles (e.g., aircraft or ships). For example, the seat assembly 10 for land vehicles can be shaped and sized to be used as a front driver or passenger seat, a second, third, or other rear seat, and can include a bench seat, a bucket seat, or other seat styles as shown in the figure. In addition, the seat assembly 10 can be a non-foldable seat or a foldable seat, and the foldable seat can be foldable and can be folded in a cavity in the vehicle floor. In addition, the seat assembly 10 can be configured to be used for non-vehicle applications, such as furniture.

[0026] exist Figure 1 In the illustrated configuration, the seat assembly 10 includes a seat bottom 20 and a seat back 22. It is contemplated that the seat back 22 may be omitted in some configurations, such as when the seat assembly 10 is configured as a motorcycle seat or stool.

[0027] The seat bottom 20 is configured to receive a seated occupant and support the pelvis and thighs of the seat occupant. The seat bottom 20 includes a seat bottom frame 30, a cushion 32, and a trim cover 34.

[0028] The seat bottom frame 30 is a structure that supports the cushion 32. The seat bottom frame 30 includes one or more structural members and can be made of any suitable material, such as a metal alloy, a polymer material, a fiber reinforced polymer material, or a combination thereof. In one or more configurations, the seat bottom frame 30 includes a panel, a seat pan, a suspension mat, or a suspension wire on which the cushion 32 is disposed.

[0029] The cushion 32 is disposed on the seat bottom frame 30. The cushion 32 is made of a compliant material that supports the seat occupant and distributes load forces from the seat occupant to the seat bottom frame 30. The cushion 32 and associated manufacturing methods will be discussed in more detail below.

[0030] The decorative cover 34 covers at least a portion of the cushion 32. In addition, the decorative cover 34 provides one or more visible exterior surfaces of the seat back 22. When sitting on the seat assembly 10, the seat occupant can be placed on the decorative cover 34. The decorative cover 34 is made of any suitable material or materials (e.g., fabric, leather, artificial leather, vinyl, or a combination thereof). The decorative cover 34 may include a plurality of decorative panels assembled in any suitable manner (e.g., by fusing or sewing). The decorative cover 34 is attached to the seat bottom frame 30, the cushion 32, or both. For example, the decorative cover 34 may include decorative attachment features that are attached to the seat bottom frame 30, the cushion 32, or both to inhibit the removal of the decorative cover 34 and help the decorative cover 34 conform to the contours of the seat bottom frame 30, the cushion 32, or both. It is contemplated that different types of decorative attachment features may be used to attach the decorative cover 34 to the seat bottom frame 30 instead of attaching it to the cushion 32.

[0031] The seat back 22 is configured to support the back of a seated occupant. The seat back 22 is disposed adjacent to the seat bottom 20. For example, the seat back 22 may be disposed above the seat bottom 20 and adjacent to the rear side of the seat bottom 20. The seat back 22 extends in a generally upward direction away from the seat bottom 20. In some configurations, the seat back 22 is mounted to the seat bottom 20 and may pivot relative to the seat bottom 20. In other configurations, the seat back 22 is not mounted to the seat bottom 20. For example, a vehicle seat back may be mounted to a vehicle body structure, such as in some second row seat assemblies. The seat back 22 includes a seat back frame 40, a cushion 42, a decorative cover 44, and an optional headrest 46.

[0032] The seat back frame 40 is a structure that supports the cushion 42. The seat back frame 40 includes one or more structural members and can be made of any suitable material, such as a metal alloy, a polymer material, a fiber reinforced polymer material, or a combination thereof. In one or more configurations, the seat back frame 40 includes a panel, a floor, a suspension pad, or a suspension wire on which the cushion 42 is disposed. It is also contemplated that the seat back frame 40 can be integrally formed with the seat bottom frame 30.

[0033] A cushion 42 is disposed on the seat back frame 40. The cushion 42 is made of a compliant material that supports the seat occupant and distributes load forces from the seat occupant to the seat back frame 40. It is contemplated that the cushion 42 may be integrally formed with the cushion 32 of the seat bottom 20 or may be separate from the cushion 32 of the seat bottom 20. The cushion 42 and associated methods of manufacture will be discussed in greater detail below.

[0034] The decorative cover 44 covers at least a portion of the cushion 42. In addition, the decorative cover 44 provides one or more visible exterior surfaces of the seat back 22. When sitting on the seat assembly 10, the seat occupant can be placed on the decorative cover 44. The decorative cover 44 is made of any suitable material or materials (e.g., fabric, leather, artificial leather, vinyl, or a combination thereof). The decorative cover 44 may include a plurality of decorative panels assembled in any suitable manner (e.g., by fusing or sewing). The decorative cover 44 is attached to the seat back frame 40, the cushion 42, or both. For example, the decorative cover 44 may include decorative attachment features that are attached to the seat back frame 40, the cushion 42, or both to inhibit the removal of the decorative cover 44 and help the decorative cover 44 conform to the contours of the seat back frame 40, the cushion 42, or both. It is contemplated that different types of decorative attachment features may be used to attach the decorative cover 44 to the seat back frame 40 instead of attaching it to the cushion 42.

[0035] A headrest 46, if provided, is configured to support the head of a seat occupant. The headrest 46 is disposed on the top of the seat back 22, or on an end of the seat back 22 opposite the seat bottom 20. The headrest 46 may be movable in one or more directions relative to the seat back 22, or may be integrally formed with the seat back 22.

[0036] refer to Figure 2 , an example of a cushion 50 is shown. For ease of reference, the cushions are generally indicated by the reference numeral 50. It should be understood that the structure and description of the cushion 50 is applicable to the cushion 32 of the seat bottom 20, the cushion 42 of the seat back 22, or both.

[0037] The pad 50 is a non-foam component or includes at least one non-foam component. The non-foam component is mainly called a wire mesh structure, but can also be called a mesh pad, a mesh structure or a twisted mesh. Figure 2 , the cushion 50 is described as a non-foam component that does not include a foam component or foam material (e.g., urethane or polyurethane foam); however, it is contemplated that the cushion 50 may include a foam component or foam material in addition to the non-foam component to provide additional cushioning or localized cushioning to the seat occupant. For example, the foam material may be disposed between the cushion 50 and a trim cover (e.g., trim cover 34, 44) disposed on the cushion 50, within the cushion 50, or a combination thereof. Reducing the amount of foam material provided to the cushion 50 or removing foam material from the cushion 50 may reduce weight and may improve support and comfort for the seat occupant.

[0038] The pad 50 is described below in the context of a pad 50 that does not include a foam material. In this case, the pad 50 is made of filaments 52 of a polymer material that are randomly looped, bent, curled or entangled and bonded together, as will be discussed in more detail below. Figure 6 An enlarged view of a pad 50 is shown with an example of a filament 52. The filaments 52 are bonded directly to one another filament 52, rather than being bonded indirectly with a resin or other intermediate material.

[0039] The filament 52 may also be referred to as a strand or thread, and is made of any suitable material or materials. In some configurations, the filament 52 is made of a polymer material or a thermoplastic material, such as a thermoplastic resin based on polyamide, polyester, polyimide, polyolefin (e.g., polypropylene, polyethylene, etc.), polystyrene or a combination thereof. As an example, a polyethylene-based filament may be made of linear low-density polyethylene (LLPDE). Different from foam materials, the filament material may be recyclable, or more recyclable than foam materials. It is also conceivable that the filament 52 may include reinforcing fibers, and the reinforcing fibers may not be made of thermoplastic materials.

[0040] In some configurations, the filament 52 can be a monofilament made of a single material. In some configurations, the filament 52 is made of multiple materials. For example, the filament 52 made of multiple materials can include a core made of a first thermoplastic material and a sheath (sheath) surrounding the core and made of a second thermoplastic material different from the first thermoplastic material. It is conceivable that the pad 50 can include a combination of monofilaments and filaments made of multiple materials and not monofilaments.

[0041] The randomly looped, bent, looped, curled or entangled filaments 52 are bonded together where one filament 52 contacts another filament 52, thereby creating a lightweight, breathable pad (e.g., pad 32 and / or pad 42) or a mesh structure having openings or gaps between the filaments 52. Figure 3 Also shown is an example of a manufacturing system 60 for making a cushion or mesh structure. In this example, the manufacturing system 60 includes a material supply 70, an extruder 72, and a hopper 74. The manufacturing system 60 also includes a cooling tank 76 and a material handling subsystem 78.

[0042] refer to Figure 3 The material supplier 70 holds the material raw material to be extruded, such as solid beads, flakes, granules, pellets or powders made of the material. In some configurations, the material supplier 70 is configured as a container or a hopper. The material supplier 70 provides the material raw material to the extruder 72.

[0043] The extruder 72 (also referred to as the first tool) melts the material feedstock and extrude the material feedstock into a group of filaments 52. The extruder 72 can have any suitable configuration. In some configurations, the extruder 72 includes a barrel that receives a rotatable screw and a heating element. The rotation of the screw forces the material through the barrel and helps heat the material due to the friction generated when the screw rotates. The material leaves the barrel in a molten state under pressure and is transported to the die 80 of the extruder 72.

[0044] The die 80 (which may also be referred to as a die plate or extrusion die) has a plurality of through holes or openings that form filaments through which the molten material passes. A single filament 52 is extruded from each through hole. The filament 52 falls downward from the die 80 into the funnel 74 under the action of gravity.

[0045] The funnel 74 merges or groups the silk 52 into a more compact arrangement, wherein the silk is bent, curled or looped, and the silk 52 contacts and is bonded to at least one other silk 52. The funnel 74 has a funnel inlet and a funnel outlet smaller than the funnel inlet. The individually separated silk 52 enters the funnel inlet. When the silk 52 accumulates, the silk 52 is bent, curled or looped and moves to contact. The silk 52 moves toward the funnel outlet through the funnel 74. Each member in the group of silks 52 can be bonded to at least one other member in the group of silks 52. The bond between the silks 52 is formed at the contact point, and the opening or gap between the silks 52 exists in other positions where one silk 52 does not contact or is bonded to another silk 52. The wound and bonded silk 52 passes through the funnel outlet of the funnel 74 and enters the cooling tank 76. For ease of reference, the bonded silk 52 is referred to as a wire mesh structure 90.

[0046] Cooling tank 76 holds liquid, for example water or water and the mixture of another fluid.Liquid in cooling tank 76 helps to support the silk 52 of winding and combining, further compacts or consolidates into not too open or not too porous arrangement to limit silk 52, and keeps the desired porosity and density of wire mesh structure 90.Therefore, liquid provides some buoyancy or resistance, and these buoyancy or resistance can cause the extra bending, curling or looping of the silk 52 in adjacent liquid surface or funnel 74, to further build wire mesh structure 90.When silk 52 is in liquid, liquid also cools silk 52.For example, liquid cools silk 52 from outside to solidify silk 52 and prevent silk 52 from combining in additional position.At this moment, silk 52 is relatively stiff (stiff) and is no longer in plastic state, therefore usually keeps shape, and can not be plasticized or reshaped when not being reheated.

[0047] The material handling subsystem 78 conveys the wire mesh structure 90 through the cooling tank 76. The material handling subsystem 78 includes various rollers and conveyors that help move the wire mesh structure 90 through the liquid and out of the liquid. In some configurations, a tractor conveyor 92 is provided in the cooling tank 76 to help pull the wire mesh structure 90 out of the funnel 74 and counteract the buoyancy of the wire 52.

[0048] One or more other rollers (e.g., roller 94) keep the screen structure 90 immersed in the liquid and guide the screen structure 90 through the cooling tank 76. For example, the roller 94 can guide the screen structure 90 toward a conveyor 96 and a shaker table 98 disposed outside the cooling tank 76. The shaker table 98 shakes the screen structure 90 to remove the liquid while the screen structure 90 is on the conveyor 96. Alternatively or additionally, the screen structure 90 can be squeezed to remove the liquid, air can be blown into the screen structure 90 to remove the liquid, or both. It is also contemplated that the screen structure 90 can also be allowed to dry, or dried in ambient air.

[0049] The above-mentioned manufacturing system 60 is a continuous flow process, wherein the wire mesh structure 90 is formed into a continuous structure when the wire extrusion is not interrupted. After leaving the cooling tank 76, further processing of the wire mesh structure 90 is provided to cut the wire mesh structure 90 into individual sheets or blanks for a single liner. This processing is performed by a cutting subsystem of the manufacturing system 60. The cutting subsystem can be of any suitable type. For example, the cutting system can use a blade, a knife, a hot knife, a saw, a fluid jet, etc. to cut the wire 52 of the wire mesh structure 90 into blanks.

[0050] The manufacturing system 60 also includes a layer allocation subsystem 100, an example of which is Figure 4 and Figure 5The layer dispensing subsystem 100 can be part of a continuous process of the manufacturing system 60 and can be disposed downstream of the cooling tank 76, for example, after the shaking table 98. Thus, the layer dispensing subsystem 100 can dispense material onto the wire mesh structure 90 before the wire mesh structure 90 is cut into pieces. In some embodiments, the layer dispensing subsystem 100 is configured to dispense material onto pieces or blanks of the wire mesh structure 90 that have been cut by the cutting subsystem.

[0051] The layer dispensing subsystem 100 dispenses a layer 110 of material on one or more sides 112 of the wire mesh structure 90. The layer 110 can be made of any suitable material or materials. In some embodiments, the layer 110 is made of the same material as the wire mesh structure 90 or the wires 52 of the wire mesh structure 90. Using a common material for the layer 110 and the wire mesh structure 90 or different materials with similar melting points can facilitate the bonding of the layer 110 to the wire mesh structure 90.

[0052] exist Figure 6 , an enlarged view of a portion of the wire mesh structure 90 is shown with the layer 110 disposed on and bonded to the wire mesh structure 90. An example of a bond at the point where the layer 110 contacts the wires 52 of the wire mesh structure 90 is indicated by reference numeral 114.

[0053] The layer dispensing subsystem 100 employs a second tool 120 that is different from the first tool or extruder 72 that extrudes a set of filaments of the wire mesh structure 90. The second tool 120 dispenses the layer 110. In some configurations, the layer dispensing subsystem 100 includes a material supply 130 and an extruder 132, similar to the material supply 70 and extruder 72 discussed above. The layer 110 can be dispensed in a molten state. In some configurations, the layer dispensing subsystem 100 includes a heating device 136. The layer dispensing subsystem 100 can omit the funnel and cooling tank.

[0054] The material supply 130 holds a material that forms the layer 110. In some configurations, the material supply 130 holds a material to be extruded to form the layer 110, such as solid beads, flakes, granules, pellets, or powders made of the material. In other configurations, the material supply 130 includes or holds material that has not been extruded to form the layer 110. For example, the material supply 130 can dispense the layer 110 from a roll. In some embodiments, the layer 110 is a pre-manufactured film or sheet of flexible material that is dispensed by unrolling the film from a roll onto the mesh structure 90. In such a configuration, it is contemplated that the extruder 132 can be omitted.

[0055] Extruder 132 (if provided) melts the material feedstock and extrude the material feedstock into layer 110. Extruder 132 can have a configuration similar to extruder 72 discussed above, and can operate in a similar manner. The layer 110 distributed by extruder 132 is constructed as one or more filaments, films, or both, examples of which will be discussed in further detail below. In some configurations, extruder 132 provides the material in a molten state to die 134, which has one or more through holes or forms an opening through which the molten material passes or forms an opening, thereby extruding layer 110 into a film or filament. Layer 110 falls downward onto the wire mesh structure 90 under gravity.

[0056] In some configurations, the layer dispensing subsystem 100 and the second tool 120 are stationary and the screen structure 90 moves relative to the layer dispensing subsystem 100. For example, the screen structure 90 may be disposed on a conveyor that moves the screen structure 90 relative to the second tool 120.

[0057] In some configurations, the layer dispensing subsystem 100 and the second tool 120 are movable relative to the wire mesh structure 90. For example, the second tool 120 can be disposed on a movable platform or a robotic manipulator that can be moved relative to the wire mesh structure 90 to allow the layer 110 to be dispensed at a desired location on the wire mesh structure 90 or in a desired pattern.

[0058] In some configurations, the layer dispensing subsystem 100 is handheld or manually operated. For example, the second tool 120 can be a handheld device (e.g., a dispensing gun or an extrusion welder) that can dispense the layer 110 through an outlet (e.g., a nozzle 140). The material supply 130 can be mounted to the second tool 120, or can be located away from the second tool 120. The nozzle 140 of the second tool 120 can be positioned near the side 112 of the wire mesh structure 90 onto which the layer 110 will be dispensed. A switch or trigger on the second tool 120 can be actuated to operate the second tool 120 and dispense the layer 110 from the nozzle 140. As previously described, the layer 110 can be dispensed as one or more wires or films.

[0059] The heating device 136 (if provided) provides thermal energy that reheats the wire mesh structure 90. Because the wires 52 of the wire mesh structure 90 have been previously heated when the wires 52 are looped and bonded, the term "reheating" is used. The heating device 136 can be of any suitable type. For example, the heating device 136 can blow or direct a heated fluid (e.g., air) toward the wire mesh structure 90, can direct electromagnetic radiation toward the wire mesh structure 90, and so on. In some configurations, the heating device 136 reheats the wire mesh structure 90 before the layer 110 is bonded to the wire mesh structure 90. In some configurations, the heating device 136 heats the wires 52 to a temperature close to the melting temperature of the wires 52, for example, 5°C to 50°C lower than the melting temperature.

[0060] In some configurations, the heating device 136 is disposed upstream of the extruder 132 and heats the filaments 52 of the mesh structure 90 shortly before or while the layer 110 is dispensed onto the mesh structure 90. In some configurations, the heating device 136 is separate from the second tool 120 for dispensing the layer 110, such as Figure 4 In other configurations, the heating device 136 is provided together with the second tool 120, such as Figure 5 1 and 2. As shown in dashed lines in FIG. 1, the second tool 120 and the heating device 136 can provide the layer 110 and the heated gas through adjacent nozzles.

[0061] refer to Figure 7 , an example of a method for manufacturing a gasket is shown. The gasket is manufactured by a manufacturing system 60.

[0062] At block 200, a wire mesh structure 90 is formed by extruding filaments 52 with an extruder 72 and bending, curling or looping the filaments 52 such that each filament 52 contacts and bonds to at least one other filament 52 as previously described.

[0063] At block 202, the wire mesh structure 90 is cooled to set the shape of the wire mesh structure 90. The wire mesh structure 90 may be cooled using liquid in the cooling tank 76 as previously described.

[0064] At block 204, layer 110 is dispensed onto wire mesh structure 90. As previously described, layer 110 is dispensed using layer dispensing subsystem 100. Layer 110 is dispensed onto one or more sides 112 of wire mesh structure 90 such that layer 110 contacts one or more wires 52 of wire mesh structure 90.

[0065] At block 206, the layer 110 is bonded to at least some of the members of the set of filaments 52 of the wire mesh structure 90. For example, the layer 110 may contact the filaments 52 of the wire mesh structure 90 and transfer heat to the filaments 52. As a result, the transferred heat partially melts the filaments 52 and forms localized bonds 114 that adhere or attach the layer 110 to the filaments 52 at the contact points. The filaments 52 or regions of the wire mesh structure 90 that are not in contact with the layer 110 do not melt, thereby allowing the wire mesh structure 90 to maintain or substantially maintain its shape without creating new bonds from one filament 52 to another filament 52 or from one filament 52 to itself.

[0066] At block 208, the layer 110 and the wire mesh structure 90 are cooled. The layer 110 and the wire mesh structure 90 may be cooled in any suitable manner. In some configurations, the layer 110 and the wire mesh structure 90 are cooled with a gas (e.g., air). It is also contemplated that the layer 110 and the wire mesh structure 90 may be cooled with a liquid (e.g., water or a mixture comprising water). Cooling the layer 110 and the wire mesh structure 90 solidifies the bond between the layer 110 and the wire mesh structure 90. At this point, the layer 110 and the wire 52 are no longer in a plastic state and therefore generally retain their shape when unloaded and are not moldable or re-formable without being reheated.

[0067] Now refer to Figures 8 to 15c Various examples of layer 110 are described. In these figures, for simplicity, the wire mesh structure 90 is depicted as a rectangular block with flat sides; however, it should be understood that the wire mesh structure 90 can have a non-rectangular configuration, and its side or a portion of the side is contoured or curved. One or more sides may be provided with protrusions, recesses, or a combination thereof. Some examples of recesses include holes, grooves, slits, grooves, etc. It should also be understood that the side 112 of the wire mesh structure 90 is defined by portions of a plurality of wires 52 disposed along a common outer region or outer boundary of the wire mesh structure 90, and that openings or gaps will exist between the wires 52 along the side where one wire 52 does not contact another wire 52. In addition, in these figures, the side of the wire mesh structure 90 is represented by the reference numeral 112, but for clarity, not all sides are marked.

[0068] refer to Figure 8-Figure 10 , shows an example of a layer 110 including one or more wires. The wires of the layer 110 are referred to as a second group of wires to distinguish them from the group of wires 52 of the wire mesh structure 90.

[0069] exist Figure 8In the embodiment of the present invention, layer 110 comprises a second group of silk with a linear configuration. A gap 300 is arranged between the adjacent components of the second group of silk. In the configuration shown, the gap 300 separates the adjacent components of the second group of silk so that the components of the second group of silk do not contact each other. It can also be imagined that the components of the second group of silk can contact at least one other component of the second group of silk at one or more discrete points. In this configuration, the gap is arranged between the adjacent components of the second group of silk, and a component of the second group of silk does not contact the adjacent components of the second group of silk.

[0070] exist Fig. 9 In the embodiment of the present invention, layer 110 includes a second group of wires with a nonlinear configuration. When distributing layer 110, a nonlinear configuration can be provided by adopting a relative movement between layer distribution subsystem 100 and wire mesh structure 90. For example, layer distribution subsystem 100 can move along a nonlinear path relative to wire mesh structure 90, wire mesh structure 90 can move along a nonlinear path or multiple axes relative to layer distribution subsystem 100, or layer distribution subsystem 100 and wire mesh structure 90 can move in different directions relative to each other to provide a second group of wires with a nonlinear configuration. Gap 300 is arranged between adjacent components of the second group of wires. In the configuration shown, gap 300 separates adjacent components of the second group of wires so that the components of the second group of wires do not contact each other. It can also be imagined that the components of the second group of wires can contact at least one other component of the second group of wires at one or more discrete points. It can be imagined that layer 110 can include a wire with a linear segment and a nonlinear segment or a combination of a linear wire and a nonlinear wire.

[0071] exist Fig.10 In the embodiment, layer 110 includes a contiguous second set of filaments. In this configuration, each member of the second set of filaments is in continuous contact with an adjacent member of the second set of filaments. This configuration can provide layer 110 with no gaps between members of the second set of filaments. As a result, layer 110 can be airtight. In the embodiment, layer 110 includes a second set of filaments that are contiguous with each other ... Fig.10 , layer 110 is depicted as having linear filaments; however, it is contemplated that the filaments of layer 110 may be non-linear, or include non-linear segments in one or more configurations.

[0072] exist Fig.11 In , layer 110 includes a membrane (e.g., a thin sheet of flexible material) rather than separate wires. In some configurations, layer 110 including the membrane is breathable, such as when the membrane has one or more pores or openings. This configuration can allow air to pass through layer 110, which can facilitate ventilation of the cushion. For example, this configuration can provide a ventilated seat that allows heated or cooled air to pass through the wire mesh structure 90 and layer 110 under negative pressure (i.e., suction) or positive pressure to heat or cool an object or occupant disposed on the cushion. In some configurations, layer 110 including the membrane is impermeable. In Fig.11, layer 110 is illustrated as extending completely across and covering a side of wire mesh structure 90. Thus, layer 110 extends from one edge 310 of wire mesh structure 90 to another edge 310. In some configurations, layer 110 is disposed on and extends across a portion of a side of wire mesh structure 90. In some configurations, layer 110 extends across multiple sides of wire mesh structure 90 or extends across portions of multiple sides of wire mesh structure 90.

[0073] exist Fig.12 In the embodiment, layer 110 includes a film and a wire. The film of layer 110 is depicted as a linear shape and is spaced from the edge 310 of the side of the wire mesh structure 90 on which the film is disposed; however, it is contemplated that the film may extend from the edge and may be provided with a different shape. The wire of layer 110 may be provided in a shape similar to Fig. 9 However, it is contemplated that the filaments of layer 110 may be linear, may include a combination of linear and nonlinear filaments, may include continuous filaments, may include filaments that contact or extend from a film of layer 110, or a combination thereof. Providing layer 110 as a film disposed on a portion of a side of the wire mesh structure 90, on an entire side of the wire mesh structure 90, or on multiple sides of the wire mesh structure 90 may provide a surface on which a bar code or other identification mark may be printed or applied to identify product characteristics, such as a manufacturing date, batch number, part number, etc. Such identification marks may be difficult to provide directly on the filaments 52 of the wire mesh structure 90.

[0074] exist Fig.13 , layer 110 is disposed on multiple sides of the mesh structure 90, but not all sides of the mesh structure 90. The mesh structure 90 has multiple sides, which may be referred to as a set of sides. Layer 110 is depicted as being disposed on two members of a set of sides of the mesh structure 90 and extending over edge 310 of the mesh structure 90. Providing layer 110 at or on edge 310 may help provide reinforcement and reinforcement to the cushion where the sides of the mesh structure 90 intersect or where different contours of the mesh structure 90 meet.

[0075] exist Fig.14In some embodiments, layer 110 is disposed on all sides of wire mesh structure 90. In this way, layer 110 can encapsulate wire mesh structure 90. In some configurations, layer 110 or a portion thereof is airtight. In some configurations, such as when layer 110 is airtight, at least one port 320 is disposed in layer 110. Port 320 allows air to enter and leave wire mesh structure 90. Providing port 320 through airtight layer 110 that encapsulates wire mesh structure 90 allows the air pressure inside layer 110 to be changed relative to the surrounding environment. For example, air can be provided to wire mesh structure 90 through port 320 to increase internal pressure or to inflate a cushion. Air can leave wire mesh structure 90 via port 320 to reduce internal pressure or to deflate a cushion. Reducing the pressure allows layer 110 to act as a vacuum bag, wherein the internal pressure can be reduced to draw layer 110 more tightly against wire mesh structure 90, which can help maintain the position of layer 110 relative to wire mesh structure 90 and help maintain the position of components attached to layer 110, such as a trim cover. After the desired internal pressure is achieved, port 320 can be closed or sealed to maintain the internal pressure.

[0076] The layer 110 may be distributed on multiple sides of the mesh structure 90 in a variety of ways.

[0077] exist Figure 15a-Figure 15c , an example of distributing a layer 110 is shown that includes rotating the wire mesh structure 90 relative to the layer distributing subsystem 100. For clarity, only a portion of the layer distributing subsystem 100 is shown in these figures.

[0078] exist Fig.15a , the wire mesh structure 90 is shown in an initial position in which the layer 110 is dispensed on a first side of the wire mesh structure 90. The layer 110 is bonded to the first side of the wire mesh structure 90, wherein the layer 110 contacts the wires 52 of the wire mesh structure 90. When the layer 110 is dispensed, the wire mesh structure 90 is then rotated, for example about the axis 330, so that the layer 110 extends along the first side and optionally additional sides of the wire mesh structure 90. By comparison Fig.15a and Fig.15b , you can understand this better.

[0079] exist Fig.15b In the wire mesh structure 90 from Fig.15aThe position shown is rotated 90° clockwise about axis 330. This rotation allows layer 110 to extend along a portion of the first side as mesh structure 90 is rotated, and then begin to extend across the second side of mesh structure 90 when the second side is aligned with and below the location where layer dispensing subsystem 100 dispensed layer 110. Thus, layer 110 is dispensed to additional sides of mesh structure 90 after dispensing layer 110 to the first side of mesh structure 90 and bonding layer 110 to the first side of mesh structure 90.

[0080] exist Fig.15c , the wire mesh structure 90 is shown as Fig.15a The position shown is rotated 360° counterclockwise about axis 330 so that layer 110 wraps around mesh structure 90 and meets the original position where layer 110 was dispensed to the first side of mesh structure 90. If overlap is not desired, dispensing of layer 110 may be stopped.

[0081] In some configurations, a cooling fluid (e.g., air) may be blown toward the layer 110 after the layer 110 is bonded to the wire mesh structure 90 to promote solidification of the bond, thereby helping to maintain the position of the layer 110 as the wire mesh structure 90 rotates. It is also contemplated that the rate of dispensing of the layer 110 and the rate of rotation of the wire mesh structure 90 may be slow enough to allow the bond between the layers 110 in the wire mesh structure 90 to solidify sufficiently without the use of a cooling fluid blown toward the layer 110.

[0082] In some configurations, it is contemplated that the mesh structure 90 may be rotated about another axis to distribute layers 110 along additional sides of the mesh structure 90. For example, a mesh structure 90 configured as a rectangular block may be rotated about an axis perpendicular to the axis 330 to distribute layers 110 along one or more sides of the mesh structure 90 through which the axis 330 extends.

[0083] Item 1. A pad comprising: a wire mesh structure comprising: a group of wires, wherein each member of the group of wires is looped and bonded to at least one other member of the group of wires, the wire mesh structure defining a first side; and a layer, the layer being disposed on the first side and bonded to at least some members of the group of wires.

[0084] Clause 2. The pad of clause 1, wherein the layer comprises a second set of filaments.

[0085] Clause 3. The cushion of clause 2, wherein gaps are provided between adjacent members of the second set of wires.

[0086] Clause 4. The pad of clause 2, wherein the second set of filaments are contiguous.

[0087] Clause 5. The liner of Clause 1, wherein the layer comprises a film.

[0088] Clause 6. The liner of Clause 5, wherein the membrane is air impermeable.

[0089] Clause 7. A pad according to any preceding clause, wherein the layer is provided on a portion of the first side.

[0090] Clause 8. The liner of Clause 7, wherein the layer extends from an edge of the first side.

[0091] Clause 9. A pad according to any preceding clause, wherein the mesh structure comprises a set of sides, wherein the first side is one member of the set of sides, and the layer is also disposed on at least one member of the set of sides other than the first side.

[0092] Clause 10. A pad according to any one of clauses 2, 5 and 6 and according to any one of clauses 7-9 when dependent on clauses 2, 5 and 6, wherein the layer is air impermeable and ports are provided in the layer to allow air to enter and leave the wire mesh structure.

[0093] Clause 11. The liner of Clause 10, wherein the mesh structure comprises a set of sides, the first side is one member of the set of sides, and the layer is disposed on all members of the set of sides.

[0094] Item 12. A method comprising: extruding a group of wires; looping each member of the group of wires and bonding to at least one other member of the group of wires to form a wire mesh structure; cooling the wire mesh structure to set the shape of the wire mesh structure; distributing a layer on a first side of the wire mesh structure; and bonding the layer to the first side.

[0095] Clause 13. The method of Clause 12, wherein dispensing the layer comprises dispensing the layer in a molten state.

[0096] Clause 14. The method of any of Clauses 12 to 13, further comprising reheating the wire mesh structure prior to bonding the layers.

[0097] Clause 15. The method of any one of Clauses 12 to 14, wherein the layer is breathable.

[0098] Clause 16. The method according to any one of Clauses 12 to 15, wherein the wire mesh structure and the layer are made of the same material.

[0099] Clause 17. The method of any of Clauses 12 to 16, wherein the layer comprises a second set of wires bonded to the wire mesh structure, wherein members of the second set of wires contact the wire mesh structure.

[0100] Clause 18. The method of any of Clauses 12 to 17, wherein extruding the set of filaments comprises extruding the set of filaments with a first tool, and dispensing the layer comprises dispensing the layer with a second tool.

[0101] Clause 19. The method of any one of clauses 12 to 18, further comprising rotating the wire mesh structure after bonding the layer to the first side, and dispensing the layer to a second side of the wire mesh structure and bonding the layer to the second side of the wire mesh structure.

[0102] Clause 20. The method according to any one of clauses 12 to 19 further includes rotating the wire mesh structure after bonding the layer to the first side, and distributing the layer to an additional side of the wire mesh structure and bonding the layer to the additional side of the wire mesh structure, thereby forming an airtight layer around the wire mesh structure.

[0103] Although exemplary embodiments are described above, this does not mean that these embodiments describe all possible forms of the present invention. Rather, the words used in this specification are descriptive and non-restrictive, and it should be understood that multiple changes can be made without departing from the spirit and scope of the present invention. In addition, the features of the embodiments of the various implementations can be combined to form other embodiments of the present invention.

Claims

1. A pad comprising: a wire mesh structure comprising a set of wires, wherein each member of the set of wires is bonded to at least one other member of the set of wires, the wire mesh structure defining a first side; and A layer is disposed on the first side and bonded to at least some members of the set of filaments.

2. The pad according to claim 1, wherein The layer includes a second set of filaments.

3. The pad according to claim 2, wherein: Gaps are provided between adjacent members of the second set of wires.

4. The pad according to claim 2, wherein: The second set of filaments are contiguous.

5. The pad according to claim 1, wherein The layer comprises a film.

6. The pad according to claim 5, wherein: The membrane is air-impermeable.

7. The pad according to claim 1, wherein: The layer is disposed on a portion of the first side.

8. The pad according to claim 7, wherein: The layer extends from an edge of the first side.

9. The pad according to claim 1, wherein: The wire mesh structure includes a set of sides, wherein the first side is a member of the set of sides, and the layer is further disposed on at least one member of the set of sides other than the first side.

10. The pad according to claim 1, wherein The layer is air impermeable and ports are provided in the layer to allow air to enter and leave the wire mesh structure.

11. The pad according to claim 10, wherein The wire mesh structure includes a set of sides, the first side is a member of the set of sides, and the layer is disposed on all members of the set of sides.

12. A method comprising: Extrude a group of filaments; looping and bonding each member of the set of wires to at least one other member of the set of wires to form a wire mesh structure; cooling the wire mesh structure to set the shape of the wire mesh structure; dispensing a layer on a first side of the wire mesh structure; and The layer is bonded to the first side.

13. The method according to claim 12, wherein: Dispensing the layer includes dispensing the layer in a molten state.

14. The method of claim 12, further comprising reheating the wire mesh structure prior to bonding the layers.

15. The method according to claim 12, wherein: The layer is breathable.

16. The method according to claim 12, wherein: The mesh structure and the layer are made of the same material.

17. The method according to claim 12, wherein: The layer includes a second set of wires bonded to the wire mesh structure, wherein members of the second set of wires contact the wire mesh structure.

18. The method of claim 12, wherein extruding the set of filaments comprises extruding the set of filaments with a first tool, and dispensing the layer comprises dispensing the layer with a second tool.

19. The method of claim 12, further comprising rotating the wire mesh structure after bonding the layer to the first side, and dispensing the layer onto a second side of the wire mesh structure and bonding the layer to the second side of the wire mesh structure.

20. The method of claim 12 further comprising rotating the wire mesh structure after bonding the layer to the first side, and dispensing the layer onto an additional side of the wire mesh structure and bonding the layer to the additional side of the wire mesh structure to form an airtight layer around the wire mesh structure.

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