A kind of polycrystalline silicon wafer magnetic grinding device and method

Abstract

The present invention provides a polycrystalline silicon wafer magnetic grinding device and method, and relates to the technical field of polycrystalline silicon wafer processing. The polycrystalline silicon wafer magnetic grinding device and method, by designing a storage box, an electromagnetic relay, a screen frame and a plugging component, can restart the permanent magnetic disc and the servo motor when the magnetic needle needs to be salvaged, and gradually reduce the magnetic force of the permanent magnetic disc, while increasing the magnetic force of the electromagnetic relay, so that the magnetic needle is gradually collected into the inside of the screen frame through a connecting pipe during the rotation and rolling process, thereby efficiently realizing the collection of the magnetic needle, while improving the efficiency of cleaning the grinding barrel and even the entire polycrystalline silicon wafer grinding operation, and the next grinding can be quickly performed after the cleaning is completed, and by designing an air pump, an annular tube, a conduit and a one-way valve, the air pump can finally pass the external air into the inside of the grinding barrel through the annular tube, the conduit, the storage box and the connecting pipe, so that the magnetic needle rolls more disorderly during rotation and the grinding is more sufficient.

Description

Technical Field

[0001] The invention relates to the technical field of polycrystalline silicon wafer processing, and in particular to a polycrystalline silicon wafer magnetic grinding device and method. Background Art

[0002] Silicon wafers are mainly divided into two types: polycrystalline silicon wafers and monocrystalline silicon wafers. Among them, polycrystalline silicon wafers are a type of silicon wafer. Polycrystalline silicon wafers are thin slices made of high-purity polycrystalline silicon materials through cutting, polishing and cleaning processes. They are widely used in solar panels and integrated circuits and other fields. In the manufacture of solar panels, it converts sunlight into electrical energy through photoelectric conversion. It is an important material in the solar photovoltaic industry. In the manufacture of integrated circuits, polycrystalline silicon wafers are one of the core materials of semiconductor devices, used to conduct and control current, and are one of the main materials of IC chips.

[0003] The magnetic grinding machine is a kind of equipment that uses magnetic field force to drag the stainless steel needles and other abrasives in the grinding groove to rotate rapidly, remove burrs, polish, clean and other treatments on the workpiece. The magnetic grinding machine is a reform and innovation based on the shortcomings and defects of the traditional grinding machine. Its strong and stable magnetic induction effect can fully grind the workpiece in all directions to achieve the purpose of rust removal, dead corners and burrs, oxide film and sintering marks. The magnetic field force is transmitted to the stainless steel grinding needle to make the workpiece rotate at a high frequency. In the grinding and polishing of workpieces with complex shapes, multiple or sandwiched gaps, threads, etc., the effect is more significant. It has the characteristics of fast and efficient, no damage to the workpiece, and no influence on the accuracy of the workpiece. The applicable workpiece materials are also very wide, metals such as gold, copper, silver, magnesium, aluminum, zinc, iron, stainless steel, etc., non-metals such as hard plastics, etc., and it can also release some internal stress of the workpiece to improve mechanical properties and surface quality.

[0004] In the prior art, the grinding of polycrystalline silicon wafers has gradually expanded from the traditional silicon wafer grinder "placing the material to be ground and polished on the grinding disk, and the workpiece and the grinding disk are subjected to relative rotation and friction to achieve grinding and polishing". After the grinding process of the magnetic grinder, the polycrystalline silicon wafers are relatively large in size, so the staff can take them out relatively easily. However, the magnetic needles are mixed in the grinding liquid, and workers are required to salvage and clean them, thereby freeing up the grinding barrel for the next magnetic grinding, and cleaning the magnetic needles. The above-mentioned entire salvage operation is relatively difficult. At the same time, the inner wall of the grinding barrel itself is relatively rough, and the magnetic needles are easily attached to the inner wall of the grinding barrel, making it difficult to clean. The overall work efficiency still has room for improvement.

[0005] To this end, we have developed a new magnetic grinding equipment and method for polycrystalline silicon wafers. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] In view of the deficiencies in the prior art, the present invention provides a polycrystalline silicon wafer magnetic grinding device and method, which solves the problem that after the magnetic grinder in the prior art grinds the polycrystalline silicon wafers, due to their large size, workers can easily take them out, but the magnetic needles are mixed in the grinding liquid, and workers are required to salvage and clean them, so as to free up the grinding barrel for the next magnetic grinding, and clean the magnetic needles. The above-mentioned entire salvaging operation is relatively difficult. At the same time, the inner wall of the grinding barrel itself is also relatively rough, and the magnetic needles are easily stuck to the inner wall of the grinding barrel, making it difficult to clean. There is also still room for improvement in the overall work efficiency.

[0008] (II) Technical solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions: a polycrystalline silicon wafer magnetic grinding device and method, including a support platform and a grinding machine box, the upper surface of the grinding machine box is fixedly connected to a placement platform, the upper surface of the placement platform is provided with a grinding groove, the upper surface of the grinding groove abuts against a grinding barrel, the bottom of the inner wall of the grinding barrel is fixedly connected to a support disc, the outer surface of the grinding barrel is symmetrically fixedly connected to connecting pipes on both sides, one end of the two connecting pipes is fixedly connected to a storage box, and the two storage boxes are fixedly installed with electromagnetic relays on the side away from the outer surface of the grinding barrel;

[0010] Through the above technical solution, the electromagnetic relay is an electrical device that uses input signals (voltage, current) to generate electromagnetic force in the electromagnet core to attract the armature. As long as a certain voltage is applied to both ends of the coil, a certain current will flow through the coil, thereby generating an electromagnetic effect. In this application, the electromagnetic relay can also attract the magnetic needle for grinding polycrystalline silicon wafers.

[0011] The tops of the two storage boxes are hinged with sealing plates, and screen frames are placed on the inner sides of the two storage boxes. The two screen frames are provided with connecting ports on one side close to the connecting pipe, and the inner sides of the two screen frames are installed with sealing components that match the connecting ports.

[0012] Preferably, an annular circular tube is sleeved on the bottom of the outer surface of the grinding barrel, and a conduit is symmetrically fixedly connected to the upper surface of the annular circular tube, one end of each of the two conduits is fixedly connected to the bottom of the storage box, and a one-way valve is fixedly installed on the end of the conduit close to the storage box.

[0013] Through the above technical solution, the main function of the one-way valve is to prevent the fluid from flowing in the opposite direction or backflow, ensuring that the fluid can only flow in one direction, which can protect the system, control the flow and improve safety. Accordingly, during use, regular inspection and maintenance are required to ensure its normal operation and avoid system failures caused by blockage or damage.

[0014] Preferably, an air pump is fixedly mounted on one end of the upper surface of the grinding machine box, an air supply pipe of the air pump is fixedly connected to an air delivery pipe, and one end of the air delivery pipe is fixedly connected to one side of the outer surface of the annular circular pipe.

[0015] Through the above technical scheme, the air pump can transport external air to the inside of the air delivery pipe through the air supply pipe, and then enter the inside of the annular tube through the air delivery pipe and finally pass into the inside of the storage box from the conduit, and then enter the inner bottom of the grinding barrel through the connecting pipe on one side of the storage box. The input gas can drive the magnetic needle to roll, making it convenient for the magnetic needle inside the grinding barrel to grind the polysilicon wafer.

[0016] Preferably, the sealing assembly includes a hinge shaft fixedly connected to the inner side of the screen frame, the outer surface of the hinge shaft is symmetrically sleeved with connecting rods for rotation, one end of the two connecting rods are fixedly connected to a mounting plate, the other end of the two connecting rods are fixedly connected to a semicircular screen plate, and the diameter of the semicircular screen plate is larger than the diameter of the connecting port.

[0017] Through the above technical scheme, when the two semicircular sieve plates are brought together, the connecting port can be blocked, so that the sieve frame and the semicircular sieve plate form a closed structure relative to the magnetic needle, thereby facilitating the removal of the magnetic needle using the sieve frame. At the same time, the apertures of the semicircular sieve plate and the sieve frame are smaller than the diameter of the magnetic needle. When the magnetic needle enters the sieve frame inside the storage box through the connecting tube, it will not leak out.

[0018] Preferably, the blocking assembly also includes hinge seats fixedly connected to the bottom of opposite sides of the two mounting plates and a support rod sleeved and fixedly connected to the outer surface of the hinge shaft, one end of the two hinge seats are hinged with an inclined rod, the middle parts of the outer surfaces of the two inclined rods are slidably connected with a sliding rod, the middle part of the outer surface of the support rod is slidably connected with a second sliding block, and the sliding rod passes through and is fixedly connected to the bottom of the second sliding block, the upper surface of the second sliding block is rotatably connected with a screw, one end of the screw is threadedly connected to the top of the support rod, and the top of the screw is fixedly connected with a rotary handle;

[0019] The tops of the two mounting plates on opposite sides are both slidably connected with first sliders, one end of the two first sliders is respectively hinged to one end of the corresponding inclined rod, and the two inclined rods are in an X-shaped structure;

[0020] Through the above technical solution, the first slider enables one end of the diagonal rod to form a sliding structure with the mounting plate, thereby changing the position of one end of the diagonal rod relative to the mounting plate, and the X-row structure formed by the two diagonal rods is similar to a scissors-type structure. The scissors-type mechanical structure enables it to have higher stability and synchronization when opening and closing, and can more symmetrically drive the connecting rods on both sides of the connecting port and the semicircular screen plate to rotate symmetrically.

[0021] Preferably, a first sliding groove matching the first sliding block is opened at the top of the outer surface of the two mounting plates, a second sliding groove matching the sliding block is opened at the middle of the outer surface of the two oblique rods, and a third sliding groove matching the second sliding block is opened at the top of the outer surface of a single support rod.

[0022] Preferably, the interior of the grinding machine box is a hollow structure, and a partition is fixedly connected to the inner wall of the grinding machine box, a servo motor is fixedly installed on the upper surface of the partition, and the output shaft of the servo motor is fixedly connected to a permanent magnetic disc that matches the grinding groove.

[0023] Preferably, a door panel is symmetrically hinged on one side of the outer surface of the grinding machine box, and a handle is fixedly connected to one side of the outer surface of the two door panels.

[0024] Preferably, a support base is fixedly connected to the upper surface of the support platform, a control panel is fixedly installed on one side of the outer surface of the support base, and the control panel is electrically connected to the servo motor, the air pump and the electromagnetic relay.

[0025] A magnetic grinding method for a polycrystalline silicon wafer magnetic grinding device comprises the following specific steps:

[0026] Step 1: Connect the whole equipment to a standard power supply with reliable grounding, place the grinding barrel in the middle of the grinding tank, put the magnetic needle into the grinding barrel, and then place the polycrystalline silicon wafer on the surface of the supporting disc;

[0027] Step 2: Pour water into the grinding barrel, preferably enough to cover the workpiece. Set the grinding time through the control panel and start the machine to grind the polycrystalline silicon wafer. After the set time is up, turn the polycrystalline silicon wafer over, grind it again and take it out.

[0028] Step 3: When the magnetic needle needs to be taken out from the grinding barrel, first start the servo motor again to gradually reduce the magnetic force of the permanent magnetic disc and increase the magnetic force of the electromagnetic relay at the same time, so that the magnetic needle is gradually collected into the inside of the screen frame through the connecting pipe during the rotation and rolling process;

[0029] Step 4: Open the sealing plate and turn the handle upward to make the two connecting rods rotate around the hinge shaft, so that the connecting port can be blocked with the semicircular screen plate. Then, the screen frame can be lifted up to remove the magnetic needle for recycling and cleaning for reuse.

[0030] (III) Beneficial effects

[0031] The present invention provides a multi-crystalline silicon wafer magnetic grinding device and method, which has the following beneficial effects:

[0032] 1. The polysilicon wafer magnetic grinding device and method, through the design of the storage box, electromagnetic relay, screen frame and plugging assembly, when the magnetic needle needs to be salvaged, the permanent magnetic disc and the servo motor can be started again, and the magnetic force of the permanent magnetic disc can be gradually reduced, and the magnetic force of the electromagnetic relay can be increased at the same time, so that the magnetic needle is gradually collected into the inside of the screen frame through the connecting pipe during the rotation and rolling process, and the magnetic needle can be taken out by taking out the screen frame, thereby efficiently collecting the magnetic needle, without the need for staff to salvage, which can reduce the trouble of workers in cleaning at a later stage, and at the same time improve the efficiency of cleaning the grinding barrel and even the entire polysilicon wafer grinding operation, and the next grinding can be quickly carried out after the cleaning is completed.

[0033] 2. The polycrystalline silicon wafer magnetic grinding equipment and method, by designing an air pump, an annular tube, a conduit and a one-way valve, the air pump can finally pass the external air into the interior of the grinding barrel through the annular tube, the conduit, the storage box and the connecting pipe. The input gas can drive the rolling of the magnetic needle, making it roll more disorderly when rotating, which is convenient for the grinding operation of the polycrystalline silicon wafer and makes the grinding more complete. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0035] Figure 2 It is a schematic diagram of the internal structure of the grinding machine box of the present invention;

[0036] Figure 3 It is a schematic diagram of the connection structure between the grinding barrel and the annular circular tube of the present invention;

[0037] Figure 4 is a side cross-sectional view of the storage box of the present invention;

[0038] Figure 5 is a front cross-sectional view of the storage box of the present invention;

[0039] Figure 6 It is a structural schematic diagram of the plugging assembly of the present invention;

[0040] Figure 7 It is a schematic diagram of the connection structure between the grinding barrel and the supporting disc of the present invention;

[0041] Figure 8 It is a schematic diagram of the connection structure of the screw rod and the rotary handle of the present invention.

[0042] Among them, 1. support platform; 2. support seat; 3. control panel; 4. grinding machine box; 5. door panel; 6. handle; 7. partition; 8. servo motor; 9. permanent magnet disc; 10. placement platform; 11. grinding groove; 12. air pump; 13. air pipe; 14. annular pipe; 15. catheter; 16. storage box; 17. electromagnetic relay; 18. sealing plate; 19. screen frame; 20. connecting pipe; 21. connecting port; 22. hinge shaft; 23. semicircular screen plate; 24. connecting rod; 25. mounting plate; 26. first slide groove; 27. first slider; 28. hinge seat; 29. ​​inclined rod; 30. second slide groove; 31. slider; 32. second slider; 33. third slide groove; 34. support rod; 35. screw; 36. one-way valve; 37. grinding barrel; 38. support disc; 39. rotary handle. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Examples, such as Figure 1 - Figure 8 As shown, the embodiment of the present invention provides a multi-crystalline silicon wafer magnetic grinding device and method, including a support platform 1 and a grinding machine box 4, the upper surface of the grinding machine box 4 is fixedly connected with a placement platform 10, the upper surface of the placement platform 10 is provided with a grinding groove 11, the upper surface of the grinding groove 11 abuts against a grinding barrel 37, the inner wall bottom of the grinding barrel 37 is fixedly connected with a support disc 38, the support disc can be used to place the polycrystalline silicon wafer, and the outer surface of the grinding barrel 37 is symmetrically fixedly connected with connecting pipes 20 on both sides, one end of the two connecting pipes 20 is fixedly connected with a storage box 16, and the two storage boxes 16 are fixedly installed with an electromagnetic relay 17 on the side away from the outer surface of the grinding barrel 37;

[0045] Among them, the electromagnetic relay 17 is an electrical device that uses input signals (voltage, current) to generate electromagnetic force in the electromagnet core to attract the armature. As long as a certain voltage is applied to both ends of the coil, a certain current will flow through the coil, thereby generating an electromagnetic effect. In this application, the electromagnetic relay 17 can also attract the magnetic needle for grinding polycrystalline silicon wafers;

[0046] like Figure 4 and Figure 5As shown, the tops of the two storage boxes 16 are hinged with sealing plates 18, and screen frames 19 are placed on the inner sides of the two storage boxes 16. A connecting port 21 is opened on one side of the two screen frames 19 close to the connecting pipe 20, and a sealing component matching the connecting port 21 is installed on the inner sides of the two screen frames 19.

[0047] like Figure 1 and Figure 3 As shown, an annular circular tube 14 is sleeved on the bottom of the outer surface of the grinding barrel 37, and a conduit 15 is symmetrically fixedly connected to the upper surface of the annular circular tube 14. One end of the two conduits 15 is fixedly connected to the bottom of the storage box 16, and a one-way valve 36 is fixedly installed on the end of the conduit 15 close to the storage box 16. The main function of the one-way valve 36 is to prevent the reverse flow or backflow of the fluid, ensuring that the fluid can only flow in one direction, which can protect the system, control the flow, and improve safety. Accordingly, during use, it needs to be regularly inspected and maintained to ensure its normal operation and avoid system failures caused by blockage or damage;

[0048] Correspondingly, an air pump 12 is fixedly installed on one end of the upper surface of the grinding machine case 4, and the air supply pipe of the air pump 12 is fixedly connected to the air delivery pipe 13. One end of the air delivery pipe 13 is fixedly connected to one side of the outer surface of the annular tube 14. The air pump 12 can transport external air to the inside of the air delivery pipe 13 through the air supply pipe, and then enter the inside of the annular tube 14 through the air delivery pipe 13 and finally pass into the inside of the storage box 16 from the conduit 15, and then enter the inner bottom of the grinding barrel 37 through the connecting pipe 20 on one side of the storage box 16. The input gas can drive the magnetic needle to roll, so that the magnetic needle inside the grinding barrel 37 can grind the polysilicon wafer.

[0049] like Figure 5 and Figure 6 As shown, the blocking assembly includes a hinge shaft 22 fixedly connected to the inner side of the screen frame 19, and the outer surface of the hinge shaft 22 is symmetrically sleeved with a connecting rod 24 that is rotatably connected. One end of the two connecting rods 24 is fixedly connected to a mounting plate 25, and the other end of the two connecting rods 24 is fixedly connected to a semicircular screen plate 23. The diameter of the semicircular screen plate 23 is larger than the diameter of the connecting port 21. Therefore, when the two semicircular screen plates 23 are brought together, the connecting port 21 can be blocked, so that the screen frame 19 and the semicircular screen plate 23 form a closed structure around the magnetic needle, so that the magnetic needle can be taken out conveniently using the screen frame 19;

[0050] At the same time, the apertures of the semicircular sieve plate 23 and the sieve frame 19 are smaller than the diameter of the magnetic needle. When the magnetic needle enters the sieve frame 19 inside the storage box 16 through the connecting tube 20, it will not leak outward.

[0051] The blocking assembly further includes hinged seats 28 respectively fixedly connected to the bottom of the opposite sides of the two mounting plates 25 and a support rod 34 sleeved and fixedly connected to the outer surface of the hinge shaft 22. One end of the two hinged seats 28 is hinged with an inclined rod 29. The middle of the outer surfaces of the two inclined rods 29 are slidably connected with a slide rod 31. The middle of the outer surface of the support rod 34 is slidably connected with a second slider 32, and the slide rod 31 is fixedly connected to the bottom of the second slider 32. The upper surface of the second slider 32 is rotatably connected with a screw rod 35. One end of the screw rod 35 is threadedly connected to the top of the support rod 34, and the top of the screw rod 35 is fixedly connected with a rotary handle 39.

[0052] When the handle 39 is turned, the handle 39 will drive the screw rod 35 to move vertically along the threaded connection with the top of the support rod 34, thereby changing the position of the second slider 32 relative to the support rod 34 (wherein, the screw rod 35 and the second slider 32 are connected in a rotating manner, so as to avoid the problem of motion interference when the screw rod 35 drives the second slider 32 to rotate). For example, when the screw rod 35 moves upward, it will drive the second slider 32 to move upward along the support rod 34;

[0053] The tops of the opposite sides of the two mounting plates 25 are slidably connected with first sliders 27, and one end of the two first sliders 27 is respectively hinged to one end of the corresponding inclined rods 29, and the two inclined rods 29 are in an X-shaped structure, wherein the first slider 27 enables one end of the inclined rod 29 to form a sliding structure with the mounting plate 25, thereby changing the position of one end of the inclined rod 29 relative to the mounting plate 25, and the X-shaped structure formed by the two inclined rods 29 is similar to a scissors-type structure. The scissors-type mechanical structure enables it to have higher stability and synchronization when opening and closing, and can more symmetrically drive the connecting rods 24 on both sides of the connecting port 21 and the semicircular screen plate 23 to rotate symmetrically.

[0054] The top of the outer surface of the two mounting plates 25 is provided with a first slide groove 26 matching the first slider 27, the middle of the outer surface of the two oblique rods 29 is provided with a second slide groove 30 matching the slide rod 31, and the top of the outer surface of the single support rod 34 is provided with a third slide groove 33 matching the second slider 32. When the second slider 32 slides on the inner wall of the third slide groove 33, it can drive the slide rod 31 to slide along the second slide groove 30 in the middle of the outer surface of the two oblique rods 29, thereby changing the angle of the X-shaped structure presented by the two oblique rods 29, thereby changing the relative distance between the two mounting plates 25 (wherein, when the angle of the two oblique rods 29 changes, the position of one end thereof connected to the first slider 27 will change, so that the first slider 27 can slide on the inner wall of the first slide groove 26 at the top of the mounting plate 25, thereby avoiding motion interference affecting the operation of the entire blocking component, thereby improving the reliability and safety of the equipment);

[0055] When the distance between the two mounting plates 25 changes, the angle formed between the two connecting rods 24 around the hinge shaft 22 will change, so that the two semicircular screen plates 23 can approach each other around the hinge shaft 22 (similar to the principle of opening and closing of scissors in the prior art) to achieve the above-mentioned blocking effect on the connecting port 21.

[0056] like Figure 2 As shown, the interior of the grinding machine box 4 is a hollow structure, and a partition 7 is fixedly connected to the inner wall of the grinding machine box 4, a servo motor 8 is fixedly installed on the upper surface of the partition 7, and the output shaft of the servo motor 8 is fixedly connected to a permanent magnetic disc 9 matched with the grinding groove 11, wherein the permanent magnetic disc 9 generates a magnetic field after being energized, and the magnetic material or current in the magnetic field will feel the magnetic force due to the effect of the magnetic field, thereby showing the existence of the magnetic field, and the magnetic needle will be attracted by the magnetic force and move to the top of the permanent magnetic disc 9 when the permanent magnetic disc 9 is energized, and the magnetic force disappears after the power is turned off, so that the magnetic needle can move freely;

[0057] Furthermore, the decrease in the current flowing through the permanent magnetic disk 9 will lead to a decrease in magnetic force: the magnetic force of the permanent magnetic disk 9 mainly comes from the current. When the current decreases, the magnetic field strength of the magnetic head will weaken, resulting in a decrease in the magnetic force of the disk. In addition, the magnetic force of the disk is also affected by other factors. For example, frequent use of the magnetic suction cup will lead to a decrease in its magnetism, which is mainly due to factors such as environmental hygiene, temperature changes, and interference from other magnetic or electric fields. In order to control the decrease in the magnetic force of the magnetic suction cup, a re-magnetization method can be adopted to restore its magnetism;

[0058] When the servo motor 8 is started and drives the output shaft to rotate, thereby driving the permanent magnetic disc 9 to rotate, the magnetic force of the permanent magnetic disc 9 can drive the magnetic needle to rotate, flow, vibrate, and tumble at a high frequency, and pass through the surface of the workpiece, and rub against the inner hole, inner and outer teeth, and surface, and concave and convex surfaces of the workpiece to achieve the effects of cleaning, removing grease and impurities, removing burrs, grinding, and other precision polishing. Applied to the present application, the magnetic needle can grind the upper surface of the polycrystalline silicon wafer placed on the surface of the support disc 38, thereby achieving the effect of polishing;

[0059] like Figure 1 As shown, a door panel 5 is symmetrically hinged on one side of the outer surface of the grinding machine case 4, and a handle 6 is fixedly connected to one side of the outer surface of the two door panels 5. The door panel 5 can be opened outward by holding the handle 6, so that maintenance tools or some small parts can be placed under the partition 7, which plays a certain storage function and is more convenient for practical application.

[0060] like Figure 1As shown, the upper surface of the support platform 1 is fixedly connected to a support base 2, and a control panel 3 is fixedly installed on one side of the outer surface of the support base 2. The control panel 3 is electrically connected to the servo motor 8, the air pump 12 and the electromagnetic relay 17. Among them, controlling the mechanical operation by using the control panel 3 has the advantages of high work efficiency, few operating errors and good safety. Specifically, the control panel is intuitively designed and user-friendly to operate, which enables operators to easily master equipment operating skills, thereby improving work efficiency. At the same time, through precise button and switch design, the control panel can reduce operating errors and ensure the accuracy of mechanical operation. Moreover, the waterproof design of the control panel can effectively prevent water from entering the control panel, avoiding equipment failures caused by water immersion, thereby enhancing overall safety. What's more, modern control panel technology is constantly developing, including advanced technologies such as touch screens, voice control and gesture recognition, allowing users to operate the machine more directly and intelligently, improving the flexibility and accuracy of operation.

[0061] A magnetic grinding method for a polycrystalline silicon wafer magnetic grinding device comprises the following specific steps:

[0062] Step 1: Connect the whole device to a standard power supply with reliable grounding, and place the grinding barrel 37 in the middle of the grinding tank 11, put the magnetic needle into the grinding barrel 37, and then place the polycrystalline silicon wafer on the surface of the supporting disc 38;

[0063] Step 2: Pour water into the grinding barrel 37, preferably enough to cover the workpiece, and set the grinding time through the control panel 3 and start the machine to grind the polycrystalline silicon wafer. After the set time is up, turn the polycrystalline silicon wafer over, grind it again and take it out;

[0064] Step 3: When the magnetic needle needs to be taken out from the grinding barrel 37, the servo motor 8 is started again to gradually reduce the magnetic force of the permanent magnetic disc 9 and increase the magnetic force of the electromagnetic relay 17 at the same time, so that the magnetic needle is gradually collected into the screen frame 19 through the connecting pipe 20 during the rotation and rolling process;

[0065] When the second slider 32 slides on the inner wall of the third slide groove 33, the second slider 32 can drive the slide bar 31 to slide along the second slide groove 30 in the middle of the outer surface of the two inclined rods 29, thereby changing the angle of the X-shaped structure presented by the two inclined rods 29, thereby changing the relative distance between the two mounting plates 25, so that the two connecting rods 24 rotate around the hinge shaft 22, so that the two semicircular sieve plates 23 can approach each other around the hinge shaft 22, and the connecting port 21 can be blocked by the semicircular sieve plates 23. Then, the sieve frame 19 can be lifted up to take out the magnetic needle for recycling, cleaning and drying, so as to prepare for reuse next time when needed. The liquid in the grinding barrel 37 can be pumped out by an external water pump and collected for unified treatment.

[0066] In summary, during the whole process, by designing the air pump 12, the annular tube 14, the conduit 15 and the one-way valve 36, the air pump 12 can finally pass the external air into the grinding barrel 37 through the annular tube 14, the conduit 15, the storage box 16 and the connecting pipe 20, and the input gas can promote the rolling of the magnetic needle, making it roll more disorderly when rotating, which is convenient for grinding the polycrystalline silicon wafer and grinding more fully. At the same time, when the magnetic needle needs to be salvaged, the permanent magnetic disk 9 and the servo motor 8 can be started again, and the magnetic force of the permanent magnetic disk 9 can be gradually reduced, and the magnetic force of the electromagnetic relay 17 can be increased at the same time, so that the magnetic needle is gradually collected into the inside of the screen frame 19 through the connecting pipe 20 during the rotation and rolling process, and the magnetic needle can be taken out by taking out the screen frame 19, thereby efficiently realizing the collection of the magnetic needle, without the need for staff to salvage, which can reduce the trouble of workers cleaning in the later stage, and at the same time improve the efficiency of cleaning the grinding barrel and even the entire polycrystalline silicon wafer grinding operation, and the next grinding can be carried out quickly after the cleaning is completed.

[0067] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polycrystalline silicon wafer magnetic grinding device, comprising a support platform (1) and a grinding machine box (4), characterized in that: The upper surface of the grinding machine box (4) is fixedly connected to a placement platform (10), the upper surface of the placement platform (10) is provided with a grinding groove (11), the upper surface of the grinding groove (11) is in contact with a grinding barrel (37), the inner wall bottom of the grinding barrel (37) is fixedly connected to a support disc (38), the outer surface of the grinding barrel (37) is symmetrically fixedly connected to connecting pipes (20) on both sides, one end of the two connecting pipes (20) is fixedly connected to a storage box (16), and the two storage boxes (16) are fixedly installed with an electromagnetic relay (17) on one side of the outer surface away from the grinding barrel (37); The tops of the two storage boxes (16) are hinged with sealing plates (18), and the inner sides of the two storage boxes (16) are provided with screen frames (19), and the two screen frames (19) are provided with communication ports (21) on one side close to the connecting pipe (20), and the inner sides of the two screen frames (19) are provided with blocking components that match the communication ports (21); The bottom of the outer surface of the grinding barrel (37) is sleeved with an annular circular tube (14), the upper surface of the annular circular tube (14) is symmetrically fixedly connected with a conduit (15), one end of each of the two conduits (15) is fixedly connected with the bottom of the storage box (16), and a one-way valve (36) is fixedly installed at one end of the conduit (15) close to the storage box (16); An air pump (12) is fixedly mounted on one end of the upper surface of the grinding machine box (4); an air supply pipe of the air pump (12) is fixedly connected to an air delivery pipe (13); and one end of the air delivery pipe (13) is fixedly connected to one side of the outer surface of the annular circular pipe (14); The plugging assembly comprises a hinge shaft (22) fixedly connected to the inner side of the screen frame (19); the outer surface of the hinge shaft (22) is symmetrically sleeved with connecting rods (24) rotatably connected; one end of the two connecting rods (24) is fixedly connected to a mounting plate (25); the other ends of the two connecting rods (24) are fixedly connected to a semicircular screen plate (23); the diameter of the semicircular screen plate (23) is larger than the diameter of the connecting port (21); The blocking assembly further comprises hinged seats (28) respectively fixedly connected to the bottom of opposite sides of the two mounting plates (25) and a support rod (34) sleeved and fixedly connected to the outer surface of the hinge shaft (22), one end of each of the two hinged seats (28) being hingedly connected to an inclined rod (29), the middle portions of the outer surfaces of the two inclined rods (29) being slidably connected to a sliding rod (31), the middle portion of the outer surface of the support rod (34) being slidably connected to a second sliding block (32), and the sliding rod (31) is passed through and fixedly connected to the bottom of the second sliding block (32), the upper surface of the second sliding block (32) is rotatably connected to a screw rod (35), one end of the screw rod (35) is threadedly connected to the top of the support rod (34), and the top of the screw rod (35) is fixedly connected to a rotary handle (39); The tops of the two mounting plates (25) on opposite sides are slidably connected to first sliders (27), one end of the two first sliders (27) is hinged to one end of a corresponding inclined rod (29), and the two inclined rods (29) are in an X-shaped structure; The top of the outer surface of the two mounting plates (25) is provided with a first slide groove (26) matching the first slide block (27), the middle of the outer surface of the two oblique rods (29) is provided with a second slide groove (30) matching the slide block (31), and the top of the outer surface of the single support rod (34) is provided with a third slide groove (33) matching the second slide block (32).

2. The multicrystalline silicon wafer magnetic grinding device according to claim 1, characterized in that: The interior of the grinding machine box (4) is a hollow structure, and a partition (7) is fixedly connected to the inner wall of the grinding machine box (4), a servo motor (8) is fixedly mounted on the upper surface of the partition (7), and an output shaft of the servo motor (8) is fixedly connected to a permanent magnetic disc (9) that matches the grinding groove (11).

3. The multicrystalline silicon wafer magnetic grinding device according to claim 2, characterized in that: A door panel (5) is symmetrically hinged on one side of the outer surface of the grinding machine box (4), and a handle (6) is fixedly connected to one side of the outer surface of the two door panels (5).

4. The multicrystalline silicon wafer magnetic grinding device according to claim 3, characterized in that: The upper surface of the support platform (1) is fixedly connected to a support base (2), and a control panel (3) is fixedly mounted on one side of the outer surface of the support base (2). The control panel (3) is electrically connected to the servo motor (8), the air pump (12) and the electromagnetic relay (17).

5. A magnetic grinding method for a polycrystalline silicon wafer magnetic grinding device according to any one of claims 1 to 4, characterized in that: The specific steps include: Step 1: Connect the whole device to a standard power supply with reliable grounding, place the grinding barrel (37) in the middle of the grinding tank (11), insert the magnetic needle into the grinding barrel (37), and then place the polycrystalline silicon wafer on the surface of the supporting disc (38); Step 2: Pour water into the grinding barrel (37) so that the water volume covers the workpiece, and at the same time set the grinding time through the control panel (3) and start the machine to grind the polycrystalline silicon wafer. After the set time is up, turn the polycrystalline silicon wafer over, grind it again, and then take it out; Step 3: When it is necessary to remove the magnetic needle from the grinding barrel (37), firstly start the servo motor (8) again to gradually reduce the magnetic force of the permanent magnetic disc (9) and at the same time increase the magnetic force of the electromagnetic relay (17), so that the magnetic needle is gradually collected into the inside of the screen frame (19) through the connecting pipe (20) during the process of rotation and rolling; Step 4: Open the sealing plate (18), turn the handle (39) upward to rotate the two connecting rods (24) around the hinge shaft (22), so that the semicircular screen plate (23) can be used to block the connecting port (21), and then the screen frame (19) can be lifted upward to remove the magnetic needle for recycling and cleaning for reuse.

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