Silicon wafer processing mechanism and method for improving silicon wafer edge collapse

Abstract

The invention discloses a silicon wafer processing mechanism and method for improving the edge collapse of silicon wafers, and relates to the technical field of silicon wafer processing, comprising a base plate, wherein a grinding assembly for grinding silicon wafers is arranged at the center of the top of the base plate, and driving assemblies for providing power for loading and unloading silicon wafers are symmetrically arranged at both ends of the top of the base plate, and the driving assembly comprises a U-shaped mounting frame and a movable plate, and a material holding assembly connected to the base plate for placing silicon wafers is arranged below the U-shaped mounting frame, and a transport assembly for loading and unloading silicon wafers is arranged at the end of the movable plate; the invention arranges the driving assembly, the transport assembly and the material holding assembly, so that the driving assembly and the material holding assembly are operated, and the transport assembly is driven to work, thereby realizing automatic loading and unloading of silicon wafers, and the process is simple, less manual participation is required, and the grinding efficiency is improved; the grinding assembly is arranged so that the grinding assembly works, and the silicon wafer can be ground continuously, and the grinding efficiency is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and in particular to a silicon wafer processing mechanism and method for improving the edge collapse of a silicon wafer. Background Art

[0002] Silicon wafers generally refer to thin slices cut from single crystal silicon. The diameters of silicon wafers are 6 inches, 8 inches, 12 inches and other specifications. They are mainly used to produce integrated circuits. Silicon wafers are only raw materials, and chips are finished products. Silicon wafers are an important material for making integrated circuits. Various semiconductor devices can be made by photolithography, ion implantation and other methods. Silicon wafer edge collapse is a defect that occurs during the silicon wafer processing process. Specifically, it is a slope-shaped processing defect formed at the edge of the silicon wafer. Silicon wafer edge collapse generally occurs in the cutting and grinding processes of single crystal silicon. Existing grinding processing equipment can improve the phenomenon of silicon wafer edge collapse by controlling process parameter settings and standardized operations, for example, avoiding excessive abrasive particles and controlling polishing pressure.

[0003] When the existing silicon wafer grinding device is in use, the silicon wafer to be ground is generally placed in the opening on the surface of the clamping gear to achieve the purpose of limiting the silicon wafer. However, after the silicon wafer grinding is completed, it is often necessary to manually remove the clamping gear first, then remove the ground silicon wafer, and then replace it with a new clamping gear, and then put a new silicon wafer to be ground. The process is complicated and the grinding efficiency is low. Moreover, when the existing grinding device is in use, it is often necessary to stop and wait when unloading the ground silicon wafer, which further reduces the grinding efficiency. In view of the above problems, a silicon wafer processing mechanism and method for improving the collapse of silicon wafers are proposed to solve the above problems. Summary of the invention

[0004] In order to solve the problem that when the existing silicon wafer grinding device is used, the silicon wafer waiting to be ground is generally placed in the opening on the surface of the clamping gear to achieve the purpose of limiting the silicon wafer, but after the silicon wafer grinding is completed, it is often necessary to manually remove the clamping gear first, then remove the ground silicon wafer, and then replace it with a new clamping gear, and then put a new silicon wafer waiting to be ground. The process is complicated and the grinding efficiency is low; and when the existing grinding device is used, it is often necessary to stop and wait when unloading the ground silicon wafer, further reducing the grinding efficiency. The purpose of the present invention is to provide a silicon wafer processing mechanism and method for improving the collapse of silicon wafer edges.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: a silicon wafer processing mechanism for improving the collapsed edge of silicon wafers, comprising a base plate, a grinding assembly for grinding silicon wafers is arranged at the top center of the base plate, and driving assemblies for providing power for loading and unloading silicon wafers are symmetrically arranged at both ends of the top of the base plate, and the driving assembly also includes four L-shaped support plates fixedly matched with the outer ring of the top of the base plate, one end of the four L-shaped support plates are respectively fixedly matched with the two ends of both sides of the U-shaped mounting frame, a second motor is fixedly installed at one end of the U-shaped mounting frame, and a first screw rod that is rotatably matched with one end of the inner wall of the U-shaped mounting frame is fixedly provided at the output end of the second motor through the U-shaped mounting frame, a first moving block is threadedly arranged on the surface of the first screw, and the top of the first moving block is connected by The connecting block is fixedly matched with the other end of the bottom of the movable plate, and the connecting block is slidably matched with the square hole opened in the top of the U-shaped mounting frame. The driving assembly includes a U-shaped mounting frame and a movable plate. A material holding assembly connected to the bottom plate for placing silicon wafers is provided below the U-shaped mounting frame. The material holding assembly includes a groove wheel, a third motor fixedly matched with the inner ring at the top of the bottom plate, and a plurality of support rods. The output end of the third motor is fixedly provided with a notched disk through a third rotating shaft, and a cylindrical pin is fixedly provided on the top of the notched disk through a rotating arm. The cylindrical pin is slidably matched with the notch on the groove wheel, and the groove wheel is mounted on a fourth rotating shaft. The connection between the bottom plate and the third motor is rotatably matched with the bottom end of the fourth rotating shaft, and a first rotating disk is fixedly provided on the top of the fourth rotating shaft, and a first rotating disk is fixedly provided on the outer wall of the first rotating disk. Four connecting strips, one end of which is fixedly provided with a second rotating disk, four grooves are provided on the top of the second rotating disk, a plurality of blocks which are fixedly provided at the bottom of the grooves and engage with the card holes, a supporting ring which is fixedly provided at the top of the second rotating disk and engages with the top of the supporting rod for sliding, a transport assembly for loading and unloading silicon wafers is provided at the end of the movable plate, and the transport assembly comprises a first cylinder which is fixedly provided with a first fixed disk at the output end of the first cylinder through a U-shaped fixing frame, four evenly distributed fixing plates are fixedly provided on the outer wall of the first fixing plate, a first motor is fixedly installed on the top of the first fixing plate, a first rotating shaft is fixedly provided at the output end of the first motor through the first fixed plate, and a surface of the first rotating shaft is fitted with There is a first spur gear, a second rotating shaft is rotatably provided at the bottom of the fixed plate, a plurality of second spur gears with four evenly distributed perforations on the top are mounted on the surface of the second rotating shaft, and one of the second spur gears is meshed with the first spur gear, U-shaped connecting frames are symmetrically fixed on both sides of the fixed plate, a second fixed plate rotatably matched with the bottom end of the second rotating shaft is fixed between the two U-shaped connecting frames, four evenly distributed sliding grooves are opened on the outer wall of the second fixed plate, a slider is slidably provided with the sliding groove, a moving rod slidably matched with the sliding groove and the perforations is fixedly provided on the top of the slider, a clamping strip slidably matched with the sliding groove is fixedly provided at the bottom of the slider, a polishing machine gear is clamped between the four clamping strips, and a plurality of placement holes are opened on the top inner ring of the polishing machine gear.The outer ring of the top of the polishing machine gear is provided with a plurality of clamping holes connected to the material holding assembly, the bottom of the second fixed plate is fixed with a third fixed plate through a second cylinder, and the bottom of the third fixed plate is fixed with a plurality of suction cups arranged opposite to the placement holes.

[0006] Preferably, the grinding assembly includes a bottom block fixedly matched with the top center of the bottom plate, vertical plates are symmetrically fixedly provided at both ends of one side of the top of the bottom block, a fourth motor is fixedly installed on one side of one of the vertical plates, a second screw rod that is fixedly provided with rotationally matched with one side of the other vertical plate through the vertical plate at the output end of the fourth motor, a second moving block that is threadedly matched with the surface of the bottom block is provided with a top plate fixedly provided on the top of the second moving block through a straight plate, a third cylinder is fixedly provided on the bottom of the top plate, a first intermediate block is fixedly provided on the output end of the third cylinder, a second intermediate block is rotatably provided at the bottom of the first intermediate block through a cylindrical rod, and the outer wall of the second intermediate block is fixedly provided with a plurality of intermediate rods An annular groove is fixedly provided, an intermediate ring is fixedly provided at the bottom corner of the annular groove through multiple connecting columns, multiple limit blocks are fixedly provided on the inner wall of the intermediate ring, a mounting ring is fixedly provided at the bottom of the intermediate ring, a first grinding ring is fixedly provided at the bottom of the mounting ring, a hose is provided between the annular groove and the first grinding ring, an L-shaped mounting frame is fixedly provided on the top of the first intermediate block, a rack is fixedly provided on the top of the inner wall of the L-shaped mounting frame through a fourth cylinder, fixed blocks are symmetrically fixedly provided at both ends of one side of the first intermediate block, a first connecting shaft is rotatably provided between the two fixed blocks, a third spur gear meshing with the rack is mounted on the surface of the first connecting shaft, and L-shaped stabilizing plates are symmetrically fixedly provided on both sides of the first intermediate block The first intermediate block is rotatably provided with a second connecting shaft at the connection between the first intermediate block and the L-shaped stable plate, and the second connecting shaft is driven and matched with the first connecting shaft through a synchronous belt and a synchronous wheel. One end of the second connecting shaft is fixedly provided with a third screw that is rotatably matched with one side of the inner wall of the L-shaped stable plate, and the surface of the third screw is provided with a third moving block that is slidably matched with the top of the inner wall of the L-shaped stable plate. The bottom of the third moving block is fixedly provided with an arc-shaped limit plate that contacts the surface of the cylindrical rod through an L-shaped fixed rod. The top two ends of the bottom block are symmetrically fixed with mounting seats, and the top of the mounting seat is fixedly provided with an annular box, and the center of the annular box is fixedly provided with a cylindrical box, and the inner wall of the cylindrical box is fixedly provided with a fifth motor, and the fifth A third connecting shaft is fixedly provided at the output end of the motor through the cylindrical box, and a fourth spur gear meshing with the polishing machine gear is mounted on the surface of the third connecting shaft. A first rotating ring is rotatably provided on the surface of the cylindrical box, and a second rotating ring rotatably cooperates with the inner wall of the annular box when rotatably provided on the outer wall of the first rotating ring, and a gear ring is fixedly provided on the top of the second rotating ring, and a plurality of fifth spur gears rotatably cooperate with the top of the first rotating ring are meshed between the gear ring and the fourth spur gear, and a third rotating ring is rotatably provided on the top of the fifth spur gear, a second grinding ring is fixedly provided on the top of the third rotating ring, and a limit ring is fixedly provided on the top of the fourth spur gear, and a plurality of limit grooves which are engaged with the limit block are provided on the outer wall of the limit ring.

[0007] A method for using a silicon wafer processing mechanism to improve the edge collapse of a silicon wafer comprises the following steps:

[0008] S1: Grinding the silicon wafer on one side, through the fifth motor and the third connecting shaft, the fifth motor rotates to drive the third connecting shaft to rotate, and then drives the first grinding ring and the second grinding ring to rotate in opposite directions, so as to grind the silicon wafer on one side;

[0009] S2: Grinding the silicon wafer on the other side, through the fourth motor and the second moving block, the fourth motor rotates to drive the second moving block to move, and then drives the first grinding ring to move above another second grinding ring, and the fifth motor rotates again to drive the third connecting shaft to rotate, so as to achieve continuous grinding of the silicon wafer on the other side;

[0010] S3: unloading the silicon wafer on one side, using the second motor and the clamping bar, so that the second motor drives the clamping bar to move above the polished silicon wafer, and the polishing machine gear is clamped by the clamping bar, so as to realize unloading of the silicon wafer;

[0011] S4: Loading the silicon wafers on one side, through the third motor and the second rotating disk, the third motor rotates to drive the second rotating disk with the silicon wafers to be polished to move under the clamping bar, and then the silicon wafers are clamped by the clamping bar, so as to realize the loading of the silicon wafers on one side.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. The present invention sets a driving component, a transport component and a material holding component, so that the driving component and the material holding component are in operation, driving the transport component to work, thereby realizing automatic loading and unloading of silicon wafers, with a simple process, less manual participation, and improved grinding efficiency; by setting a grinding component, the grinding component is operated, and the silicon wafer can be ground continuously, further improving the grinding efficiency;

[0014] 2. The present invention utilizes the first screw to rotate and drive the clamping bar to move, and then utilizes the first spur gear to rotate and drive the four clamping bars to move toward the center of the second fixed plate to clamp the polishing machine gear, thereby realizing automatic loading and unloading of silicon wafers;

[0015] 3. The present invention utilizes the rotation of the third connecting shaft to drive the second grinding ring and the first grinding ring to rotate in opposite directions, and then utilizes the rotation of the second screw to drive the second moving block toward the mounting seat close to the right side, repeatedly starts the fifth motor to rotate it, and grinds the silicon wafer, thereby realizing continuous grinding processing of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention from the first viewing angle.

[0018] Figure 2 It is a schematic diagram of the overall second viewing angle structure of the present invention.

[0019] Figure 3 It is a schematic diagram of the overall cross-sectional structure of the present invention.

[0020] Figure 4 It is a schematic diagram of the structure of the transport component of the present invention.

[0021] Figure 5 It is a schematic diagram of the connection structure of the second fixed plate, the sliding block and the moving rod of the present invention.

[0022] Figure 6 It is a schematic diagram of the structure of the grinding assembly of the present invention.

[0023] Figure 7 It is a schematic diagram of the connection structure of the fourth spur gear, the fifth spur gear and the gear ring of the present invention.

[0024] Figure 8 It is a schematic diagram of the structure of the driving component of the present invention.

[0025] Fig. 9 It is a schematic diagram of the structure of the material holding component of the present invention.

[0026] Fig.10 For the present invention Figure 1 Schematic diagram of the local enlarged structure of A.

[0027] Fig.11 For the present invention Figure 3 Schematic diagram of the local B structure.

[0028] Fig.12 For the present invention Figure 3 Schematic diagram of the local C structure.

[0029] Fig.13 For the present invention Figure 3 Schematic diagram of the local D structure.

[0030] In the figure: 1, bottom plate; 2, grinding assembly; 201, bottom block; 202, vertical plate; 203, fourth motor; 204, second screw; 205, second moving block; 206, straight plate; 207, top plate; 208, third cylinder; 209, first intermediate block; 210, cylindrical rod; 211, intermediate rod; 212, annular groove; 213, connecting column; 214, intermediate ring; 215, limit block; 216, mounting ring; 217, first grinding ring; 218, hose; 219, L-shaped mounting mounting frame; 220, fourth cylinder; 221, rack; 222, fixed block; 223, first connecting shaft; 224, third spur gear; 225, L-shaped stabilizing plate; 226, second connecting shaft; 227, third screw rod; 228, arc-shaped limit plate; 229, mounting seat; 230, annular box; 231, cylindrical box; 232, fifth motor; 233, third connecting shaft; 234, fourth spur gear; 235, first rotating ring; 236, second rotating ring; 237, gear ring; 238, first Five spur gears; 239, third rotating ring; 240, second grinding ring; 241, limit ring; 3, drive assembly; 301, U-shaped mounting frame; 302, moving plate; 303, L-shaped support plate; 304, second motor; 305, first screw; 306, first moving block; 4, material holding assembly; 401, third motor; 402, third rotating shaft; 403, groove wheel; 404, fourth rotating shaft; 405, first rotating disk; 406, second rotating disk; 407, block; 408, support Rod; 409, support ring; 5, transport assembly; 501, first cylinder; 502, U-shaped fixing frame; 503, first fixing plate; 504, fixing plate; 505, first motor; 506, first rotating shaft; 507, first spur gear; 508, second rotating shaft; 509, second spur gear; 510, U-shaped connecting frame; 511, second fixing plate; 512, moving rod; 513, clamping strip; 514, second cylinder; 515, third fixing plate; 516, suction cup; 6, polishing machine gear. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] Example: Figure 1-13 As shown, the present invention provides a silicon wafer processing mechanism for improving the edge collapse of silicon wafers, comprising a base plate 1:

[0033] A grinding assembly 2 for grinding silicon wafers is provided at the top center of the bottom plate 1. The grinding assembly 2 includes a bottom block 201 fixedly matched with the top center of the bottom plate 1. Vertical plates 202 are symmetrically fixedly provided at both ends of one side of the top of the bottom block 201. A fourth motor 203 is fixedly installed on one side of one of the vertical plates 202. A second screw 204 that is rotatably matched with one side of another vertical plate 202 is fixedly provided at the output end of the fourth motor 203 through the vertical plate 202. A second moving block 205 that is slidably matched with the surface of the bottom block 201 is threadedly provided on the surface of the second screw 204. A top plate 207 is fixedly provided on the top of the second moving block 205 through a straight plate 206, so that the rotation of the second screw 204 can drive the top plate 207 to move, so that the movement of the first intermediate block 209 can bring The first grinding ring 217 is driven to move, an L-shaped mounting frame 219 is fixed on the top of the first intermediate block 209, a rack 221 is fixed on the top of the inner wall of the L-shaped mounting frame 219 through a fourth cylinder 220, fixed blocks 222 are symmetrically fixed at both ends of one side of the first intermediate block 209, a first connecting shaft 223 is rotatably provided between the two fixed blocks 222, a third spur gear 224 meshing with the rack 221 is mounted on the surface of the first connecting shaft 223, L-shaped stabilizing plates 225 are symmetrically fixed on both sides of the first intermediate block 209, a second connecting shaft 226 is rotatably provided at the connection between the first intermediate block 209 and the L-shaped stabilizing plate 225, the second connecting shaft 226 is matched with the first connecting shaft 223 through a synchronous belt and a synchronous wheel, and one end of the second connecting shaft 226 is fixedly provided with a There is a third screw 227 that rotates with one side of the inner wall of the L-shaped stabilizing plate 225. The surface of the third screw 227 is threaded with a third moving block that slides with the top of the inner wall of the L-shaped stabilizing plate 225. The bottom of the third moving block is fixed with an arc-shaped limit plate 228 that contacts the surface of the cylindrical rod 210 through an L-shaped fixing rod, so that the movement of the rack 221 can drive the arc-shaped limit plate 228 to move. The two ends of the top of the bottom block 201 are symmetrically fixed with mounting seats 229, and the top of the mounting seat 229 is fixed with an annular box 230. The center of the annular box 230 is fixed with a cylindrical box 231. The inner wall of the cylindrical box 231 is fixedly installed with a fifth motor 232. The output end of the fifth motor 232 passes through the cylindrical box 231 and is fixed with a third connecting shaft 233. The third connecting shaft 2 The surface of the cylindrical box 231 is provided with a fourth spur gear 234 meshing with the polishing machine gear 6, a first rotating ring 235 is rotatably provided on the surface of the cylindrical box 231, a second rotating ring 236 rotatably provided on the outer wall of the first rotating ring 235 rotatably cooperates with the inner wall of the annular box 230, a gear ring 237 is fixedly provided on the top of the second rotating ring 236, a plurality of fifth spur gears 238 rotatably cooperate with the top of the first rotating ring 235 are meshed between the gear ring 237 and the fourth spur gear 234, a third rotating ring 239 is rotatably provided on the top of the fifth spur gear 238, a second grinding ring 240 is fixedly provided on the top of the third rotating ring 239, a limiting ring 241 is fixedly provided on the top of the fourth spur gear 234, a plurality of limiting grooves engaged with the limiting block 215 are provided on the outer wall of the limiting ring 241,The rotation of the third connecting shaft 233 can drive the limiting ring 241 to rotate;

[0034] The driving components 3 for providing power for loading and unloading silicon wafers are symmetrically arranged at both ends of the top of the bottom plate 1. The driving components 3 also include four L-shaped support plates 303 fixedly matched with the outer ring of the top of the bottom plate 1. One end of the four L-shaped support plates 303 are respectively fixedly matched with the two ends of both sides of the U-shaped mounting frame 301. A second motor 304 is fixedly installed at one end of the U-shaped mounting frame 301. The output end of the second motor 304 passes through the U-shaped mounting frame 301 and is fixedly provided with a first screw rod 305 that is rotatably matched with one end of the inner wall of the U-shaped mounting frame 301. The surface of the first screw rod 305 is threadedly provided with a first moving block 306. The top of the first moving block 306 is fixedly matched with the other end of the bottom of the moving plate 302 through a connecting block. The connecting block is slidably matched with the square hole opened in the top of the U-shaped mounting frame 301, so that the rotation of the first screw rod 305 can drive the moving plate 302 to move.

[0035] The driving assembly 3 includes a U-shaped mounting frame 301 and a moving plate 302. A material holding assembly 4 for placing silicon wafers connected to the bottom plate 1 is provided below the U-shaped mounting frame 301. The material holding assembly 4 includes a groove wheel 403, a third motor 401 fixedly matched with the inner ring at the top of the bottom plate 1, and a plurality of support rods 408. A notched disc is fixedly provided at the output end of the third motor 401 through a third rotating shaft 402. A cylindrical pin is fixedly provided at the top of the notched disc through a rotating arm. The cylindrical pin is slidably matched with the notch on the groove wheel 403. The groove wheel 403 is sleeved on the fourth rotating shaft 404. The bottom plate 1 and the third The connection of the motor 401 is rotatably matched with the bottom end of the fourth rotating shaft 404. A first rotating disk 405 is fixedly provided at the top of the fourth rotating shaft 404. Four connecting strips are fixedly provided on the outer wall of the first rotating disk 405. A second rotating disk 406 is fixedly provided at one end of the connecting strip. Four grooves are provided at the top of the second rotating disk 406. A plurality of clamping blocks 407 that are engaged with the clamping holes are fixedly provided at the bottom of the grooves. A supporting ring 409 that is fixedly matched with the top end of the supporting rod 408 is slidably provided at the top of the second rotating disk 406. The rotation of the third rotating shaft 402 can drive the second rotating disk 406 to rotate.

[0036] A transport assembly 5 for loading and unloading silicon wafers is provided at the end of the movable plate 302. The transport assembly 5 includes a first cylinder 501 fixedly matched with one end of the bottom of the movable plate 302. A first fixed plate 503 is fixedly provided at the output end of the first cylinder 501 through a U-shaped fixed frame 502. Four evenly distributed fixed plates 504 are fixedly provided on the outer wall of the first fixed plate 503. A first motor 505 is fixedly installed on the top of the first fixed plate 503. A first rotating shaft 506 is fixedly provided at the output end of the first motor 505 through the first fixed plate 503. A first spur gear 507 is mounted on the surface of the first rotating shaft 506. A second rotating shaft 508 is rotatably provided at the bottom of the fixed plate 504. A plurality of second spur gears 509 with four evenly distributed perforations on the top are mounted on the surface of the second rotating shaft 508, and one of the second spur gears 509 is meshed with the first spur gear 507. U-shaped connecting frames 510 are symmetrically fixedly provided on both sides of the fixed plate 504. A second fixed plate 511 rotatably matched with the bottom end of the second rotating shaft 508 is fixedly provided between the two U-shaped connecting frames 510, and four evenly distributed sliding grooves are opened on the outer wall of the second fixed plate 511, and a slider is slidingly provided in the sliding groove, and a moving rod 512 is fixedly provided on the top of the slider for sliding cooperation with the sliding groove and the perforation, and a clamping strip 513 slidably matched with the sliding groove is fixedly provided at the bottom of the slider, and a polishing machine gear 6 is clamped between the four clamping strips 513, and a plurality of placement holes are opened on the inner ring of the top of the polishing machine gear 6, and the placement holes are used to limit the silicon wafer, and a plurality of clamping holes connected with the material holding component 4 are opened on the outer ring of the top of the polishing machine gear 6, so that the rotation of the first rotating shaft 506 can drive the clamping strip 513 to move, and a third fixed plate 515 is fixedly provided on the bottom of the second fixed plate 511 through a second cylinder 514, and a plurality of suction cups 516 arranged opposite to the placement holes are fixedly provided on the bottom of the third fixed plate 515, so that the suction cups 516 can adsorb the silicon wafer.

[0037] A method for using a silicon wafer processing mechanism to improve the edge collapse of a silicon wafer comprises the following steps:

[0038] S1: Grinding the silicon wafer on one side, through the fifth motor 232 and the third connecting shaft 233, the fifth motor 232 rotates to drive the third connecting shaft 233 to rotate, and then drives the first grinding ring 217 and the second grinding ring 240 to rotate in opposite directions, so as to grind the silicon wafer on one side;

[0039] S2: Grinding the silicon wafer on the other side, through the fourth motor 203 and the second moving block 205, the fourth motor 203 rotates to drive the second moving block 205 to move, and then drives the first grinding ring 217 to move above another second grinding ring 240, and the fifth motor 232 rotates again to drive the third connecting shaft 233 to rotate, thereby realizing continuous grinding of the silicon wafer on the other side;

[0040] S3: unloading the silicon wafer on one side, using the second motor 304 and the clamping bar 513, so that the second motor 304 drives the clamping bar 513 to move above the polished silicon wafer, and the polishing machine gear 6 is clamped by the clamping bar 513, so as to realize unloading of the silicon wafer;

[0041] S4: Load the silicon wafers on one side by using the third motor 401 and the second rotating disk 406. The third motor 401 rotates to drive the second rotating disk 406 with the silicon wafers to be polished to move to the bottom of the clamping bar 513, and then the clamping bar 513 is used to clamp the silicon wafers, thereby achieving the loading of the silicon wafers on one side.

[0042] Working principle: When the silicon wafer needs to be ground, at this time, four polishing machine gears 6 are placed on the second grinding ring 240 on the left, and the silicon wafer waiting to be ground is stuck in the placement hole, and the fifth motor 232 is started to drive the third connecting shaft 233 to rotate, thereby driving the fourth spur gear 234 and the limit ring 241 to rotate with the third connecting shaft 233 as the axis, thereby driving the fifth spur gear 238 to roll along the surface of the fourth spur gear 234, thereby driving the gear ring 237 to rotate with the third connecting shaft 233 as the axis, thereby driving the third rotating shaft 233 to rotate. The ring 239 and the second grinding ring 240 rotate with the third connecting shaft 233 as the axis, thereby driving the polishing machine gear 6 to roll along the fourth spur gear 234. At the same time, the limiting ring 241 rotates to drive the first grinding ring 217 and the mounting ring 216 to rotate in the direction opposite to the rotation direction of the second grinding ring 240, and the polishing liquid in the annular groove 212 continuously enters between the first grinding ring 217 and the second grinding ring 240 through the hose 218, so that the first grinding ring 217 and the second grinding ring 240 grind both sides of the silicon wafer at the same time;

[0043] When the grinding process of the silicon wafer on the left side is completed and the silicon wafer waiting to be ground on the right side needs to be ground, the fourth cylinder 220 is started to extend or shorten it, driving the rack 221 to move in the vertical direction, thereby driving the first connecting shaft 223 to rotate, thereby driving the third spur gear 224 to rotate with the first connecting shaft 223 as the axis, and through the transmission effect of the synchronous belt and the synchronous wheel, driving the third screw rod 227 to rotate with the second connecting shaft 226 as the axis, thereby driving the third moving block to move toward the direction close to the cylindrical rod 210, thereby driving the arc The limiting plate 228 moves toward the direction close to the cylindrical rod 210 until it moves in contact with the cylindrical rod 210 and exerts a certain force on the cylindrical rod 210, so that the cylindrical rod 210 stops rotating and keeps the structure stable. The third cylinder 208 is started to shorten it, driving the first intermediate block 209 and the second intermediate block to move upward, thereby driving the mounting ring 216 and the first grinding ring 217 to move upward, so that the first grinding ring 217 no longer contacts the ground silicon wafer. The fourth motor 203 is then started to rotate, thereby driving the second screw 204 to rotate. Then, the second moving block 205 is driven toward the mounting seat 229 close to the right side, and then the first grinding ring 217 is driven to move to the top of the second grinding ring 240 on the right side. At this time, the polishing machine gear 6 and the silicon wafer to be ground are already placed on the second grinding ring 240 on the right side. The third cylinder 208 is started to extend it, and the mounting ring 216 and the first grinding ring 217 are driven to move downward until the first grinding ring 217 contacts the silicon wafer to be ground on the right side. The fifth motor 232 is repeatedly started to rotate it to grind the silicon wafer, thereby realizing continuous grinding of the silicon wafer.

[0044] When the silicon wafer on the right side is being ground, when the ground silicon wafer on the left side needs to be unloaded, the second motor 304 is started to rotate, driving the first screw 305 to rotate, thereby driving the first moving block 306, the connecting block and the moving plate 302 to move away from the second motor 304, thereby driving the first cylinder 501 and the clamping bar 513 to move toward the mounting seat 229 on the left side, until the clamping bar 513 moves to the top of the second grinding ring 240, and the first cylinder 501 is started to extend, driving the first fixed plate 506 to rotate. 3 and the fixing plate 504 move downward, thereby driving the first spur gear 507, the second spur gear 509 and the second fixing plate 511 to move downward, thereby driving the clamping bar 513 to move downward until it contacts the surface of the second grinding ring 240. At this time, the four polishing machine gears 6 on the top of the second grinding ring 240 are respectively located between the four groups of clamping bars 513, and the bottom of the suction cup 516 contacts the top of the polished silicon wafer and firmly absorbs the silicon wafer. The first motor 505 (which can be reversed) is started to rotate it to a set angle, thereby driving the first spur gear 5 07 rotates the first rotating shaft 506 as the axis to set the angle, thereby driving the second spur gear 509 to rotate with the second rotating shaft 508 as the axis, thereby driving the moving rod 512 to move toward the center of the second fixed plate 511, thereby driving the slider to move, thereby driving the four clamping bars 513 to move toward the center of the second fixed plate 511 to clamp the polisher gear 6, and then starting the first cylinder 501 again to shorten it, driving the polisher gear 6 and the polished silicon wafer to leave the surface of the second grinding ring 240, and then starting the second motor 304 to reverse The first cylinder 501 is turned to drive the first cylinder 501 and the clamping bar 513 to return to their original positions, and the first cylinder 501 is started again to extend, driving the clamping bar 513, the polishing machine gear 6 and the polished silicon wafer to move downward until the bottom end of the clamping bar 513 contacts the bottom of the groove below the clamping bar 513. At this time, the clamping hole on the polishing machine gear 6 is clamped on the clamping block 407, temporarily limiting the polishing machine gear 6. At this time, the suction cup 516 no longer absorbs the polished silicon wafer, and the clamping bar 513 no longer clamps the polishing machine gear 6, thereby realizing automatic unloading of the silicon wafer;

[0045] When the silicon wafer on the right side is being ground and the silicon wafer on the left side needs to be reloaded, the first cylinder 501 is started again to shorten it, driving the clamping bar 513 to leave the groove. At this time, the third motor 401 is started to rotate one circle, driving the cylindrical pin to rotate one circle with the third rotating shaft 402 as the axis, and then driving the groove wheel 403 to rotate a quarter of a circle, and then driving the first rotating disk 405 and the second rotating disk 406 to rotate a quarter of a circle with the fourth rotating shaft 404 as the axis, and at this time move to the groove on the second rotating disk 406 below the clamping bar 513. A new polishing machine gear 6 and a silicon wafer to be polished are clamped, and the first cylinder 501 is started again to extend it, driving the clamping bar 513 to move downward to the bottom of the groove. The suction cup 516 adsorbs the unpolished silicon wafer, and the clamping bar 513 clamps the polishing machine gear 6 again. The second motor 304 is started again to rotate it, and the polishing machine gear 6 and the silicon wafer to be polished are moved to the second grinding ring 240 on the left. At the same time, the staff removes the polished silicon wafer on the second rotating disk 406 and replaces it with the silicon wafer to be polished, thereby realizing automatic loading of silicon wafers.

[0046] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A silicon wafer processing mechanism for improving the edge collapse of a silicon wafer, comprising a base plate (1), characterized in that: A grinding assembly (2) for grinding silicon wafers is provided at the center of the top of the bottom plate (1); drive assemblies (3) for providing power for loading and unloading silicon wafers are symmetrically provided at both ends of the top of the bottom plate (1); the drive assembly (3) comprises a U-shaped mounting frame (301) and a movable plate (302); a material holding assembly (4) for placing silicon wafers connected to the bottom plate (1) is provided below the U-shaped mounting frame (301); and a transport assembly (5) for loading and unloading silicon wafers is provided at the end of the movable plate (302); The transport component (5) comprises a first cylinder (501) fixedly matched with one end of the bottom of the moving plate (302); a first fixed plate (503) is fixedly provided at the output end of the first cylinder (501) via a U-shaped fixed frame (502); four evenly distributed fixed plates (504) are fixedly provided on the outer wall of the first fixed plate (503); a first motor (505) is fixedly installed on the top of the first fixed plate (503); a first rotating shaft (506) is fixedly provided at the output end of the first motor (505) through the first fixed plate (503); a first spur gear (507) is sleeved on the surface of the first rotating shaft (506); a second rotating shaft (508) is rotatably provided at the bottom of the fixed plate (504); a plurality of second spur gears (509) with four evenly distributed through holes on the top are sleeved on the surface of the second rotating shaft (508); and wherein A second spur gear (509) is meshed with the first spur gear (507); U-shaped connecting frames (510) are symmetrically fixed on both sides of the fixing plate (504); a second fixing plate (511) is fixed between the two U-shaped connecting frames (510) and is rotatably matched with the bottom end of the second rotating shaft (508); four evenly distributed sliding grooves are provided on the outer wall of the second fixing plate (511); a sliding block is slidably provided on the sliding groove; a moving rod (512) slidably matched with the sliding groove and the perforation is fixedly provided on the top of the sliding block; a clamping strip (513) slidably matched with the sliding groove is fixedly provided on the bottom of the sliding block; a polishing machine gear (6) is clamped between the four clamping strips (513); a plurality of placement holes are provided on the top inner ring of the polishing machine gear (6); and a plurality of clamping holes connected to the material holding component (4) are provided on the top outer ring of the polishing machine gear (6); The grinding assembly (2) comprises a bottom block (201) fixedly matched with the top center of the bottom plate (1), vertical plates (202) are symmetrically fixedly provided at both ends of one side of the top of the bottom block (201), a fourth motor (203) is fixedly installed on one side of one of the vertical plates (202), an output end of the fourth motor (203) passes through the vertical plate (202) and is fixedly provided with a second screw rod (204) that is rotatably matched with one side of the other vertical plate (202), a second moving block (205) that is slidably matched with the surface of the bottom block (201) is threadedly provided on the surface of the second screw rod (204), and a top plate (207) is fixedly provided on the top of the second moving block (205) via a straight plate (206); The top two ends of the bottom block (201) are symmetrically fixed with mounting seats (229), the top of the mounting seat (229) is fixed with an annular box (230), the center of the annular box (230) is fixed with a cylindrical box (231), the inner wall of the cylindrical box (231) is fixed with a fifth motor (232), the output end of the fifth motor (232) is fixed with a third connecting shaft (233) passing through the cylindrical box (231), the surface of the third connecting shaft (233) is sleeved with a fourth spur gear (234) meshing with the polishing machine gear (6), the surface of the cylindrical box (231) is rotatably provided with a first rotating ring (235), the outer wall of the first rotating ring (235) is rotatably provided with a third connecting shaft (233). A second rotating ring (236) is provided to be rotatably matched with the inner wall of the annular box (230); a gear ring (237) is fixedly provided on the top of the second rotating ring (236); a plurality of fifth spur gears (238) are meshed between the gear ring (237) and the fourth spur gear (234) and are rotatably matched with the top of the first rotating ring (235); a third rotating ring (239) is rotatably provided on the top of the fifth spur gear (238); a second grinding ring (240) is fixedly provided on the top of the third rotating ring (239); a limiting ring (241) is fixedly provided on the top of the fourth spur gear (234); and a plurality of limiting grooves for engaging with the limiting block (215) are provided on the outer wall of the limiting ring (241).

2. A silicon wafer processing mechanism for improving silicon wafer edge collapse as claimed in claim 1, characterized in that: A third fixed plate (515) is fixedly provided at the bottom of the second fixed plate (511) via a second cylinder (514), and a plurality of suction cups (516) arranged opposite to the placement holes are fixedly provided at the bottom of the third fixed plate (515).

3. A silicon wafer processing mechanism for improving silicon wafer edge collapse as claimed in claim 2, characterized in that: The driving assembly (3) further comprises four L-shaped support plates (303) fixedly matched with the outer ring at the top of the bottom plate (1); one end of the four L-shaped support plates (303) are respectively fixedly matched with the two ends of both sides of the U-shaped mounting frame (301); a second motor (304) is fixedly mounted on one end of the U-shaped mounting frame (301); an output end of the second motor (304) passes through the U-shaped mounting frame (301) and is fixedly provided with a first screw rod (305) rotatably matched with one end of the inner wall of the U-shaped mounting frame (301); a first moving block (306) is threadedly provided on the surface of the first screw rod (305); a top of the first moving block (306) is fixedly matched with the other end of the bottom of the moving plate (302) through a connecting block; and the connecting block is slidably matched with a square hole opened at the top of the U-shaped mounting frame (301).

4. A silicon wafer processing mechanism for improving silicon wafer edge collapse as claimed in claim 3, characterized in that: The material holding assembly (4) comprises a groove wheel (403), a third motor (401) fixedly matched with the inner ring at the top of the bottom plate (1), and a plurality of support rods (408); a notched disc is fixedly provided at the output end of the third motor (401) via a third rotating shaft (402); a cylindrical pin is fixedly provided at the top of the notched disc via a rotating arm; the cylindrical pin is slidably matched with a notch on the groove wheel (403); the groove wheel (403) is sleeved on a fourth rotating shaft (404); the connection between the bottom plate (1) and the third motor (401) is connected to the fourth rotating shaft (404); The bottom end of the shaft (404) is rotatably engaged, a first rotating disk (405) is fixedly provided at the top of the fourth rotating shaft (404), four connecting strips are fixedly provided on the outer wall of the first rotating disk (405), a second rotating disk (406) is fixedly provided at one end of the connecting strip, four grooves are opened at the top of the second rotating disk (406), a plurality of clamping blocks (407) that are engaged with the clamping holes are fixedly provided at the bottom of the grooves, and a support ring (409) that is slidably engaged with the top of the support rod (408) is provided at the top of the second rotating disk (406).

5. A silicon wafer processing mechanism for improving silicon wafer edge collapse as claimed in claim 4, characterized in that: A third cylinder (208) is fixedly mounted on the bottom of the top plate (207); a first intermediate block (209) is fixedly mounted on the output end of the third cylinder (208); a second intermediate block is rotatably mounted on the bottom of the first intermediate block (209) via a cylindrical rod (210); an annular groove (212) is fixedly mounted on the outer wall of the second intermediate block via a plurality of intermediate rods (211); an intermediate ring (214) is fixedly mounted on the bottom corner of the annular groove (212) via a plurality of connecting columns (213); a plurality of limit blocks (215) are fixedly mounted on the inner wall of the intermediate ring (214); a mounting ring (216) is fixedly mounted on the bottom of the intermediate ring (214); a first grinding ring (217) is fixedly mounted on the bottom of the mounting ring (216); and a hose (218) is provided to connect the annular groove (212) and the first grinding ring (217).

6. A silicon wafer processing mechanism for improving silicon wafer edge collapse as claimed in claim 5, characterized in that: An L-shaped mounting frame (219) is fixedly provided on the top of the first intermediate block (209), a rack (221) is fixedly provided on the top of the inner wall of the L-shaped mounting frame (219) via a fourth cylinder (220), fixed blocks (222) are symmetrically fixedly provided at both ends of one side of the first intermediate block (209), a first connecting shaft (223) is rotatably provided between the two fixed blocks (222), a third spur gear (224) meshing with the rack (221) is sleeved on the surface of the first connecting shaft (223), L-shaped stabilizing plates (225) are symmetrically fixedly provided on both sides of the first intermediate block (209), and the first intermediate block ( A second connecting shaft (226) is rotatably provided at the connection between the second connecting shaft (226) and the L-shaped stabilizing plate (209) and the L-shaped stabilizing plate (225). The second connecting shaft (226) is transmission-matched with the first connecting shaft (223) through a synchronous belt and a synchronous wheel. A third screw rod (227) is fixedly provided at one end of the second connecting shaft (226) and is rotatably matched with one side of the inner wall of the L-shaped stabilizing plate (225). A third movable block is threadedly provided on the surface of the third screw rod (227) and is slidably matched with the top of the inner wall of the L-shaped stabilizing plate (225). The bottom of the third movable block is fixedly provided with an arc-shaped limit plate (228) that contacts the surface of the cylindrical rod (210) through an L-shaped fixing rod.

7. A method for using a silicon wafer processing mechanism for improving the edge collapse of a silicon wafer as claimed in any one of claim 6, characterized in that: The steps include: S1: grinding the silicon wafer on one side, using the fifth motor (232) and the third connecting shaft (233), so that the fifth motor (232) rotates to drive the third connecting shaft (233) to rotate, thereby driving the first grinding ring (217) and the second grinding ring (240) to rotate in opposite directions, thereby achieving grinding of the silicon wafer on one side; S2: grinding the silicon wafer on the other side, by means of the fourth motor (203) and the second moving block (205), so that the fourth motor (203) rotates to drive the second moving block (205) to move, thereby driving the first grinding ring (217) to move above another second grinding ring (240), and then driving the third connecting shaft (233) to rotate again via the fifth motor (232), thereby achieving continuous grinding of the silicon wafer on the other side; S3: unloading the silicon wafer on one side, using the second motor (304) and the clamping bar (513), so that the second motor (304) drives the clamping bar (513) to move above the polished silicon wafer, and the polishing machine gear (6) is clamped by the clamping bar (513), thereby realizing unloading of the silicon wafer; S4: Loading the silicon wafers on one side, by means of the third motor (401) and the second rotating disk (406), so that the third motor (401) rotates and drives the second rotating disk (406) loaded with the silicon wafers to be polished to move below the clamping bar (513), and then the clamping bar (513) is used to clamp the silicon wafers, thereby achieving loading of the silicon wafers on one side.

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