A cleaning auxiliary device applied to vacuum sputtering coating

Abstract

The application provides a cleaning auxiliary device applied to vacuum sputtering coating, which comprises a process coating cavity, a transition cavity is arranged on one side of the process coating cavity, a wafer or a shutter inlet and outlet is further arranged on the side of the process coating cavity adjacent to the transition cavity, a working gas input channel is arranged at the bottom of the process coating cavity, the transition cavity is communicated with the process coating cavity, a rotating shielding mechanism and a jacking mechanism are arranged in the process coating cavity, when the process coating cavity needs to be cleaned, the rotating mechanism rotates the shutter to the upper part of the working gas input channel for shielding the working gas input channel, so that the target material or the gas material is prevented from falling into the working gas input channel in the cleaning process, when the process coating is carried out, the rotating mechanism rotates the shutter to the transition cavity, so that the shutter is prevented from affecting the input of the working gas and causing uneven sputtering coating, and when the shutter needs to be replaced, the shutter is lifted by the jacking claw of the lifting device and then outputted to the wafer or the shutter inlet and outlet for automatic replacement.

Description

Technical Field

[0001] This invention relates to the field of sputtering coating technology, and more specifically, to a cleaning auxiliary device for vacuum sputtering coating. Background Technology

[0002] Sputter deposition is a physical vapor deposition (PVD) process widely used in thin film preparation. The principle of sputter deposition is to bombard a target material with high-energy particles, ejecting target particles and causing them to deposit into a thin film. However, after bombardment, high-energy particles adhere to the target, meaning that when the target is bombarded again with different types of particles, the resulting film may be doped with other particles, affecting the reliability of sputter deposition.

[0003] Therefore, it is necessary to clean other particles on the target material during the next coating process. However, during the cleaning process, since the working gas input channel is always connected, the target material or gas material falls into the working gas input channel, causing contamination of the working gas input channel. Summary of the Invention

[0004] In view of this, in order to solve the above problems, the present invention proposes a cleaning auxiliary device for vacuum sputtering coating, including a process coating chamber 10, a transition chamber 20 provided on one side of the process coating chamber 10, a wafer or shielding plate 60 inlet / outlet provided on the side adjacent to the transition chamber 20 of the process coating chamber 10, a working gas input channel 30 provided at the bottom of the process coating chamber 10, the transition chamber 20 communicating with the process coating chamber 10, and a rotating shielding mechanism 40 and a lifting mechanism 100 provided inside the process coating chamber 10. When cleaning of the process coating chamber 10 is required, the rotating mechanism 40... 1. The shield 60 is rotated to the upper part of the working gas input channel 30 to shield the working gas input channel 30 and prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When performing process coating, the rotating mechanism 41 rotates the shield 60 to the transition cavity 20 to prevent the shield 60 from affecting the input of working gas in the working gas input channel 30 and causing uneven sputtering coating. When the shield 60 needs to be replaced, the lifting claw 103 of the lifting device 101 lifts the shield 60 and outputs the wafer or the inlet and outlet of the shield 60 are automatically replaced.

[0005] A cleaning auxiliary device for vacuum sputtering coating includes a process coating chamber 10, characterized in that: a transition chamber 20 is provided on one side of the process coating chamber 10, and a wafer or shielding plate 60 inlet / outlet is provided on one side of the adjacent transition chamber 20; a working gas input channel 30 is provided at the bottom of the process coating chamber 10; the transition chamber 20 is connected to the process coating chamber 10; and a rotating shielding mechanism 40 and a lifting mechanism 100 are provided inside the process coating chamber 10. The system includes a cover plate 60, a support plate 70, and a rotating mechanism 41. The cover plate 60 is engaged with the support plate 70. The rotating mechanism 41 is located on the lower part of one side of the support plate 70. The rotating mechanism 41 causes the support plate to rotate, thereby allowing the support plate 70 to carry the cover plate 60. The support plate 70 has an irregular structure and includes a main support plate 72 and outwardly extending first support claws 73 and second support claws 74. The first support claws 73 and second support claws 74 are integrally formed with the main support plate 72. The connection between the two support claws 74 and the main support plate 72 is provided with a clearance. The lifting mechanism 100 includes a lifting device 101 and a lifting ring 102. The lifting device 101 is connected to the lower part of the lifting ring 102. The lifting ring 102 is located at the lower part of the support plate 70, and multiple lifting claws 103 are spaced apart on the lifting ring 102. The lifting claws 103 can pass through the clearance and move up and down. When cleaning of the process coating chamber 10 is required, the rotating mechanism 41 rotates the shield 60 to the upper part of the working gas input channel 30 for shielding. The working gas input channel 30 is designed to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, thus preventing contamination of the working gas input channel 30. When performing process coating, the rotating mechanism 41 rotates the shield 60 to the transition cavity 20 to prevent the shield 60 from affecting the input of working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the lifting claw 103 of the lifting device 101 lifts the shield 60 and outputs the wafer or the inlet and outlet of the shield 60 are automatically replaced.

[0006] Furthermore, a position detection mechanism 21 is provided at the transition cavity 20. When the rotating mechanism 41 rotates the shield 60 to the transition cavity 20, the position detection mechanism 21 detects the shield 60 and sends a signal to the process coating cavity 10 to enable the coating process.

[0007] Furthermore, the area of ​​the shield 60 is larger than the diameter of the working gas input channel 30, and it is used to completely block the working gas input channel 30.

[0008] Furthermore, the top of the working gas input channel 30 is connected to a wafer carrier disk, and the wafer carrier disk is provided with a plurality of vent holes 31. The working gas input channel 30 is connected to the vent holes 31. When the process coating chamber 10 needs to be cleaned, the shield 60 covers the vent holes 31.

[0009] Furthermore, the shield 60 has a disc-shaped structure, with an annular limiting boss 61 protruding from the outer circle of the lower surface of the disc-shaped structure. The upper surface of the support plate 70 is provided with multiple limiting posts 71. The outer diameter of the circle formed by the limiting posts 71 matches the inner diameter of the annular limiting boss 61. The outer sides of the multiple limiting posts 71 contact the inner wall of the annular limiting boss 61, so that when the support plate 70 rotates, the shield 60 and the support plate 70 are in a relatively stationary state.

[0010] In some embodiments, the rotating mechanism 41 includes a magnetic fluid 42 and a rotating shaft 44, a connecting rod 46, and a cylinder 48 sleeved inside the magnetic fluid 42. One end of the rotating shaft 44 is locked to the support plate 70 via a support plate mounting column 90, and the other end is rotatably connected to one end of the connecting rod 46 via a first connecting rod shaft clamp 45. The other end of the connecting rod 46 is connected to the cylinder shaft 49 of the cylinder 48 via a second connecting rod shaft clamp 47. The body of the magnetic fluid 42 is locked to the bottom of the outer shell of the process coating cavity 10. The cylinder 48 drives the rotating shaft 44 of the magnetic fluid 42 to rotate, thereby driving the support plate 70 to rotate.

[0011] Furthermore, a photoelectric switch mounting bracket 52 is locked to the lower part of the cylinder 48 body. A photoelectric switch 53 is provided at both ends of the photoelectric switch mounting bracket 52. The two photoelectric switches 53 are set on the outer ring of the cylinder shaft 49. A limit block 51 is provided on one side of the cylinder shaft 49. When the limit block 51 rotates into the groove of one of the photoelectric switches 53, the photoelectric switch 53 receives the signal and transmits the signal to the cylinder 48 controller to stop the rotation of the cylinder shaft 49. The photoelectric switch 53 plays a role in precise positioning.

[0012] Furthermore, one photoelectric switch 53 is positioned so that the cylinder 48 can rotate the baffle 60 to the transition cavity 20, and the other photoelectric switch 53 is positioned so that the cylinder 48 can rotate the baffle 60 to the upper part of the working gas input channel 30.

[0013] Furthermore, the magnetic fluid 42 is provided with a first water cooling mechanism 43. Since the processing technology of the process coating cavity 10 requires heating, in order to avoid damage to the magnetic fluid 42 due to heat, the body of the magnetic fluid 42 needs to be cooled.

[0014] Furthermore, a second water-cooling mechanism 80 is provided on the upper part of the cylinder 48. Since the processing technology of the process coating cavity 10 requires heating, the bottom of the cylinder 48 is relatively close to the bottom of the process coating cavity 10. To avoid damage to the cylinder 48 due to heat, it is necessary to water-cool and isolate the cylinder 48 from the bottom of the process coating cavity 10.

[0015] The beneficial effects of this invention: This invention proposes a cleaning auxiliary device for vacuum sputtering coating, including a process coating chamber 10. A transition chamber 20 is provided on one side of the process coating chamber 10. A wafer or shielding plate 60 inlet / outlet is also provided on one side of the adjacent transition chamber 20. A working gas input channel 30 is provided at the bottom of the process coating chamber 10. The transition chamber 20 is connected to the process coating chamber 10. A rotating shielding mechanism 40 and a lifting mechanism 100 are provided inside the process coating chamber 10. When cleaning of the process coating chamber 10 is required, the rotating mechanism 40 will shield the wafer. The plate 60 is rotated to the upper part of the working gas input channel 30 to block the working gas input channel 30 and prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is performed, the rotating mechanism 41 rotates the shielding plate 60 to the transition cavity 20 to prevent the shielding plate 60 from affecting the input of working gas in the working gas input channel 30 and causing uneven sputtering coating. When the shielding plate 60 needs to be replaced, the lifting claw 103 of the lifting device 101 lifts the shielding plate 60 and outputs the wafer or the inlet and outlet of the shielding plate 60 are automatically replaced. Attached Figure Description

[0016] Figure 1 This is an overall structural diagram of the sputtering coating machine of the present invention.

[0017] Figure 2 This is a perspective view of the cleaning auxiliary device of the present invention applied to vacuum sputtering coating.

[0018] Figure 3 This is a top view of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0019] Figure 4 This is a connection structure diagram of the support plate and the rotating mechanism of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0020] Figure 5 This is a structural diagram of the rotating mechanism of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0021] Figure 6 This is a connection structure diagram of the support plate and lifting mechanism of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0022] Figure 7 This is a structural diagram of the lifting mechanism of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0023] Figure 8 This is a connection structure diagram of the working gas input channel, rotating shielding mechanism, and lifting mechanism of the cleaning auxiliary device for vacuum sputtering coating of the present invention.

[0024] Figure 9 This is a partially enlarged view of the working gas input channel and the rotating shielding mechanism of the cleaning auxiliary device for vacuum sputtering coating according to the present invention.

[0025] Explanation of main component symbols

[0026] Process coating chamber 10, transition chamber 20, position detection mechanism 21, working gas input channel 30, vent 31, rotating shielding mechanism 40, rotating mechanism 41, magnetic fluid 42, first water cooling mechanism 43, rotating shaft 44, first connecting rod shaft clamping block 45, connecting rod 46, second connecting rod shaft clamping block 47, cylinder 48, cylinder shaft 49, limit block 51, photoelectric switch mounting bracket 52, photoelectric switch 53, shielding plate 60, annular limit boss 61, support plate 70, limit post 71, main bearing plate 72, first support claw 73, second support claw 74, second water cooling mechanism 80, support plate mounting column 90, lifting mechanism 100, lifting device 101, lifting ring 102, lifting claw 103.

[0027] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation Example 1:

[0028] like Figure 1 , Figure 2 , Figure 6 , Figure 7 , Figure 8As shown, a cleaning auxiliary device for vacuum sputtering coating includes a process coating chamber 10. The process coating chamber 10 is characterized by: a transition chamber 20 on one side; a wafer or shielding plate 60 inlet / outlet on one side of the adjacent transition chamber 20; a working gas input channel 30 at the bottom of the process coating chamber 10; the transition chamber 20 communicating with the process coating chamber 10; and a rotating shielding mechanism 40 and a lifting mechanism 100 within the process coating chamber 10. The 40 includes a cover plate 60, a support plate 70, and a rotating mechanism 41. The cover plate 60 is engaged with the support plate 70. The rotating mechanism 41 is provided on the lower part of one side of the support plate 70. The rotating mechanism 41 causes the support plate to rotate, thereby allowing the support plate 70 to carry the cover plate 60. The support plate 70 has an irregular structure and includes a main support plate 72 and outwardly extending first support claws 73 and second support claws 74. The first support claws 73 and second support claws 74 are integrally formed with the main support plate 72. The connection between the second support claw 74 and the main support plate 72 is provided with a clearance. The lifting mechanism 100 includes a lifting device 101 and a lifting ring 102. The lifting device 101 is connected to the lower part of the lifting ring 102. The lifting ring 102 is located at the lower part of the support plate 70, and multiple lifting claws 103 are spaced apart on the lifting ring 102. The lifting claws 103 can pass through the clearance and move up and down. When cleaning of the process coating chamber 10 is required, the rotating mechanism 41 rotates the shield 60 to the upper part of the working gas input channel 30 for shielding. The working gas input channel 30 is designed to prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, thus preventing contamination of the working gas input channel 30. When performing process coating, the rotating mechanism 41 rotates the shield 60 to the transition cavity 20 to prevent the shield 60 from affecting the input of working gas into the working gas input channel 30, causing uneven sputtering coating. When the shield 60 needs to be replaced, the lifting claw 103 of the lifting device 101 lifts the shield 60 and outputs the wafer or the inlet and outlet of the shield 60 are automatically replaced.

[0029] A position detection mechanism 21 is provided at the transition cavity 20. When the rotating mechanism 41 rotates the shield 60 to the transition cavity 20, the position detection mechanism 21 detects the shield 60 and sends a signal to the process coating cavity 10 to enable the coating process. The area of ​​the shield 60 is larger than the diameter of the working gas input channel 30 and is used to completely block the working gas input channel 30.

[0030] like Figure 9As shown, the top of the working gas input channel 30 is connected to the wafer carrier disk, and the wafer carrier disk is provided with multiple vent holes 31. The working gas input channel 30 is connected to the vent holes 31. When the process coating chamber 10 needs to be cleaned, the shield 60 covers the vent holes 31.

[0031] like Figure 3 As shown, the shield 60 has a disc-shaped structure. The lower surface of the disc-shaped structure has an annular limiting boss 61 protruding from the outer circle. The upper surface of the support plate 70 is provided with multiple limiting posts 71. The outer diameter of the circle formed by the limiting posts 71 matches the inner diameter of the annular limiting boss 61. The outer sides of the multiple limiting posts 71 are in contact with the inner wall of the annular limiting boss 61, so that when the support plate 70 rotates, the shield 60 and the support plate 70 are in a relatively stationary state.

[0032] like Figure 3-4 As shown, the rotating mechanism 41 includes a magnetic fluid 42 and a rotating shaft 44, a connecting rod 46, and a cylinder 48 sleeved inside the magnetic fluid 42. One end of the rotating shaft 44 is locked to the support plate 70 via a support plate mounting column 90, and the other end is rotatably connected to one end of the connecting rod 46 via a first connecting rod shaft clamp 45. The other end of the connecting rod 46 is connected to the cylinder shaft 49 of the cylinder 48 via a second connecting rod shaft clamp 47. The body of the magnetic fluid 42 is locked to the bottom of the outer shell of the process coating cavity 10. The cylinder 48 drives the rotating shaft 44 of the magnetic fluid 42 to rotate, thereby driving the support plate 70 to rotate.

[0033] The magnetic fluid 42 is provided with a first water cooling mechanism 43. Since the processing of the coating chamber 10 requires heating, the magnetic fluid 42 needs to be cooled to prevent damage caused by heat. The cylinder 48 is provided with a second water cooling mechanism 80. Since the processing of the coating chamber 10 requires heating, the cylinder 48 is close to the bottom of the coating chamber 10. To prevent damage caused by heat, the cylinder 48 needs to be water-cooled and isolated from the bottom of the coating chamber 10.

[0034] like Figure 5As shown, a photoelectric switch mounting bracket 52 is locked to the lower part of the cylinder 48 body. A photoelectric switch 53 is provided at both ends of the photoelectric switch mounting bracket 52. The two photoelectric switches 53 are set on the outer ring of the cylinder shaft 49. A limit block 51 is provided on one side of the cylinder shaft 49. When the limit block 51 rotates into the groove of one of the photoelectric switches 53, the photoelectric switch 53 receives the signal and transmits the signal to the cylinder 48 controller to stop the rotation of the cylinder shaft 49. The photoelectric switch 53 plays a role in precise positioning. One photoelectric switch 53 is set in a position where the cylinder 48 can rotate with the baffle 60 to the position of the transition cavity 20, and the other photoelectric switch 53 is set in a position where the cylinder 48 can rotate with the baffle 60 to the position of the upper part of the working gas input channel 30.

[0035] The beneficial effects of this invention: This invention proposes a cleaning auxiliary device for vacuum sputtering coating, including a process coating chamber 10. A transition chamber 20 is provided on one side of the process coating chamber 10. A wafer or shielding plate 60 inlet / outlet is also provided on one side of the adjacent transition chamber 20. A working gas input channel 30 is provided at the bottom of the process coating chamber 10. The transition chamber 20 is connected to the process coating chamber 10. A rotating shielding mechanism 40 and a lifting mechanism 100 are provided inside the process coating chamber 10. When cleaning of the process coating chamber 10 is required, the rotating mechanism 40 will shield the wafer. The plate 60 is rotated to the upper part of the working gas input channel 30 to block the working gas input channel 30 and prevent the target material or gas material from falling into the working gas input channel 30 during the cleaning process, causing contamination of the working gas input channel 30. When the process coating is performed, the rotating mechanism 41 rotates the shielding plate 60 to the transition cavity 20 to prevent the shielding plate 60 from affecting the input of working gas in the working gas input channel 30 and causing uneven sputtering coating. When the shielding plate 60 needs to be replaced, the lifting claw 103 of the lifting device 101 lifts the shielding plate 60 and outputs the wafer or the inlet and outlet of the shielding plate 60 are automatically replaced.

[0036] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A cleaning auxiliary device applied to vacuum sputtering coating, comprising a process coating cavity (10), characterized in that: The process plating cavity (10) is provided with a transition cavity (20) on one side, and the adjacent transition cavity (20) of the process plating cavity (10) is also provided with a wafer or shutter (60) inlet and outlet on one side. The bottom of the process plating cavity (10) is provided with a working gas input channel (30). The transition cavity (20) is communicated with the process plating cavity (10). The process plating cavity (10) is provided with a rotating shielding mechanism (40) and a jacking mechanism (100). The rotating shielding mechanism (40) comprises a shutter (60), a supporting plate (70) and a rotating mechanism (41). The shutter (60) is clamped with the supporting plate (70). The shutter (60) is a disc type structure. The lower surface of the disc type structure is provided with an annular limiting boss (61) which is protruded outward. The upper surface of the supporting plate (70) is provided with a plurality of limiting columns (71). The outer diameter of the circle formed by the limiting columns (71) is matched with the inner diameter of the annular limiting boss (61). The outer side of the plurality of limiting columns (71) is in contact with the inner wall of the annular limiting boss (61), so that the shutter (60) and the supporting plate (70) are in a relatively static state when the supporting plate (70) rotates. The one side of the supporting plate (70) is provided with a rotating mechanism (41). The rotating mechanism (41) comprises a magnetic fluid (42), a rotating shaft (44) which is sleeved in the magnetic fluid (42), a connecting rod (46) and a gas cylinder (48). One end of the rotating shaft (44) is locked with the supporting plate (70) through a supporting plate mounting column (90). The other end is rotatably connected with one end of the connecting rod (46) through a first connecting rod shaft clamp (45). The other end of the connecting rod (46) is connected with the cylinder shaft (49) of the gas cylinder (48) through a second connecting rod shaft clamp (47). The body of the magnetic fluid (42) is locked with the bottom of the shell of the process plating cavity (10). The rotating shaft (44) of the magnetic fluid (42) is driven to rotate by the gas cylinder (48) to drive the supporting plate (70) to rotate. The supporting plate is driven to rotate by the rotating mechanism (41), so that the supporting plate (70) carries the shutter (60). The supporting plate (70) is a special-shaped structure. The supporting plate (70) comprises a main supporting plate (72) and a first supporting claw (73) and a second supporting claw (74) which extend outward. The first supporting claw (73) and the second supporting claw (74) are integrally formed with the main supporting plate (72). The connection part of the first supporting claw (73) and the second supporting claw (74) with the main supporting plate (72) is provided with an avoidance position. The jacking mechanism (100) comprises a lifting device (101) and a jacking ring (102). The lifting device (101) is connected with the lower part of the jacking ring (102). The jacking ring (102) is located at the lower part of the supporting plate (70) and is provided with a plurality of jacking claws (103) which are spaced apart on the jacking ring (102). The jacking claws (103) can pass through the avoidance position and move up and down. When the process plating cavity (10) needs to be cleaned,The rotating mechanism (41) rotates the shutter (60) to the upper part of the working gas input channel (30) for shielding the working gas input channel (30) to prevent the target material or the gas material from falling into the working gas input channel (30) during the cleaning process, thereby causing the pollution of the working gas input channel (30). The top of the working gas input channel (30) is connected to the wafer carrier disc, and a plurality of air holes (31) are arranged on the wafer carrier disc. The working gas input channel (30) is communicated with the air holes (31). When the process of cleaning the film coating cavity (10) is needed, the shutter (60) covers the air holes (31). When the process of film coating is carried out, the rotating mechanism (41) rotates the shutter (60) to the transition cavity (20) to prevent the shutter (60) from affecting the input of the working gas of the working gas input channel (30), thereby causing the non-uniformity of the sputtering film coating. When the shutter (60) needs to be replaced, the top lifting claw (103) of the lifting device (101) lifts the shutter (60) to output the wafer or the shutter (60) import and export automatic replacement.

2. The cleaning aid for vacuum sputter coating according to claim 1, characterized in that The position detection mechanism (21) is arranged at the transition cavity (20), and detects the shutter (60) when the rotating mechanism (41) rotates the shutter (60) to the transition cavity (20), and sends a signal to the process coating cavity (10) to start the coating process.

3. The cleaning aid for vacuum sputter coating according to claim 1, characterized in that: The area of the shutter (60) is greater than the diameter of the working gas input channel (30), so that the working gas input channel (30) is completely blocked.

4. The cleaning aid for vacuum sputter coating according to claim 1, characterized in that: The body of the cylinder (48) is locked with a photoelectric switch mounting bracket (52), both ends of the photoelectric switch mounting bracket (52) are provided with a photoelectric switch (53), and the two photoelectric switches (53) are arranged outside the cylinder shaft (49). One side of the cylinder shaft (49) is provided with a limiting block (51), when the limiting block (51) rotates to the slot of one of the photoelectric switches (53), the photoelectric switch (53) receives a signal and transmits the signal to the cylinder controller, so as to stop the rotation of the cylinder shaft (49). The photoelectric switch (53) plays a role in accurate positioning.

5. The cleaning aid for vacuum sputter coating according to claim 4, characterized in that One of the photoelectric switches (53) is arranged at a position where the cylinder (48) can rotate the shutter (60) to the transition cavity (20), and the other photoelectric switch (53) is arranged at a position where the cylinder (48) can rotate the shutter (60) to the upper part of the working gas input channel (30).

6. The cleaning aid for vacuum sputter coating according to claim 1, characterized in that The body of the magnetic fluid (42) is provided with a first water cooling mechanism (43), because the process coating cavity (10) needs to be heated during processing, to avoid damage to the magnetic fluid (42) caused by heating, the body of the magnetic fluid (42) needs to be cooled.

7. The cleaning aid for vacuum sputter coating according to claim 1, characterized in that: The upper part of the cylinder (48) is provided with a second water cooling mechanism (80), because the process coating cavity (10) needs to be heated during processing, the cylinder (48) is close to the bottom of the process coating cavity (10), to avoid damage to the cylinder (48) caused by heating, the bottom of the cylinder (48) and the process coating cavity (10) need to be water-cooled and isolated.

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