Plasma-enhanced atomic layer deposition equipment
By independently introducing process gas and plasma into the plasma enhanced atomic layer deposition equipment, the process gas ionization problem is solved, uniform film formation and diversified treatment of powder surface are achieved, and the flexibility and effect of powder processing are improved.
Patent Information
- Application Number
- CN202411330698.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2044-09-23
AI Technical Summary
In existing plasma-enhanced atomic layer deposition equipment, process gas entering the powder reaction chamber requires ionization through an ion source, affecting the powder surface coating, and intermittent injection of process gas cannot achieve simultaneous deposition of plasma and process gas.
A plasma-enhanced atomic layer deposition device is designed to directly pass process gas and plasma into the reaction chamber through independent air inlet and plasma entry holes to prevent process gas from ionizing in the plasma generation chamber, and to rotate the powder processing assembly through a motor to ensure uniform film formation.
The process gas and plasma are realized to pass into the powder reaction chamber at the same time or alternately, meeting the needs of diversified powder processing processes, avoiding the impact of process gas ionization, and ensuring uniform film formation on the surface of the powder.
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Figure CN119144944B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chemical vapor deposition equipment, and in particular to a plasma enhanced atomic layer deposition equipment. Background Art
[0002] Plasma enhanced atomic layer deposition (PEALD) is an energy-enhanced atomic layer deposition method. When applied to powder surface treatment, it utilizes the self-limiting principle of atomic layer deposition to form a dense functional film layer with atomic-level thickness on the powder surface, giving the powder more powerful new physical properties. It has great prospects in the field of solid-state batteries for new energy.
[0003] The plasma-enhanced atomic layer deposition equipment currently on the market has the following defects: the process gas needs to pass through the ion source to enter the powder reaction chamber, which will cause the process gas to be ionized and change its chemical properties, thereby affecting the coating on the powder surface; if the process gas is injected intermittently, although the ionization of the process gas can be avoided, it will cause the plasma to be shut down, making it impossible to achieve the process of simultaneous deposition of plasma and process gas, which limits the selection of powder treatment technology. Summary of the Invention
[0004] The main purpose of the present invention is to provide a plasma enhanced atomic layer deposition device, which aims to solve the technical problem in the prior art that process gas needs to pass through an ion source to enter a powder reaction chamber and is ionized.
[0005] To achieve the above-mentioned objectives, the present invention provides a plasma-enhanced atomic layer deposition device, comprising a plasma generating device and a powder processing device, wherein the plasma generating device is provided with a plasma generating chamber, and the powder processing device is connected to the plasma generating device, wherein a reaction chamber and an air inlet, a plasma inlet hole, and an exhaust hole respectively connected to the reaction chamber are formed in the powder processing device, and the plasma inlet hole is connected to the plasma generating chamber, wherein the air inlet hole is used to introduce a first process gas, and the plasma inlet hole is used to introduce plasma.
[0006] Optionally, the powder processing device includes a shell, a motor and a powder processing assembly, the shell is connected to the plasma generating device, an exhaust chamber and an air inlet chamber sealed to each other are formed in the shell, the shell is provided with an exhaust hole connected to the exhaust chamber, the shell is provided with a first air injection hole and the air inlet hole connected to the air inlet chamber, and the shell is provided with the plasma entrance hole; the motor is connected to the shell, and the motor has an output shaft; the powder processing assembly is arranged in the shell, the reaction chamber is formed in the powder processing assembly, and the part of the powder processing assembly where the reaction chamber is formed is located in the air inlet chamber, one end of the powder processing assembly is connected to the output shaft of the motor, and the other end of the powder processing assembly is rotatably connected to the shell, the powder processing assembly is provided with the exhaust hole, and the exhaust hole connects the reaction chamber and the exhaust chamber.
[0007] Optionally, the shell includes a first shell, a second shell and a cover body, one end of the first shell is connected to the motor, the first shell is provided with the exhaust chamber, the air suction hole and the first connecting through-hole, one end of the first connecting through-hole is connected to the exhaust chamber, and the powder processing component is rotatable and sealed through the first connecting through-hole; one end of the second shell is connected to the first shell, the second shell is provided with the air inlet chamber and the first air injection hole, and the other end of the first connecting through-hole is connected to the air inlet chamber; the cover body is connected to the second shell, the cover body is provided with the plasma inlet hole, the cover body protrudes toward the direction of the motor to form a first rotating connection part, the first rotating connection part is provided with a second connecting through-hole connecting the plasma inlet hole and the reaction chamber, the first rotating connection part is provided with the air inlet hole connecting the first connecting through-hole and the air inlet chamber, and the end of the powder processing component facing away from the motor is rotatable and sealedly connected to the second connecting through-hole of the first rotating connection part.
[0008] Optionally, the powder processing assembly includes a powder reaction cylinder and a rotating shaft, the powder reaction cylinder is located in the air inlet chamber, the powder reaction cylinder forms the reaction chamber, the powder reaction cylinder is provided with a second rotating connection part at one end facing the cover body, the second rotating connection part can be rotatably and sealingly inserted into the second connecting through-hole, the second rotating connection part is provided with an air vent connecting the reaction chamber and the second connecting through-hole; one end of the rotating shaft is connected to the powder reaction cylinder, and the other end is connected to the motor, the rotating shaft can be rotatably and sealingly passed through the first connecting through-hole, the rotating shaft is provided with the exhaust hole and a hollow hole connecting the exhaust hole and the exhaust chamber, the exhaust hole is extended axially along the rotating shaft, and the hollow hole is extended radially along the rotating shaft.
[0009] Optionally, the first connecting through-hole is provided with a first mounting step, and the plasma enhanced atomic layer deposition equipment further includes a first bearing, a pressure ring and a fixing ring, the first bearing is sleeved on the rotating shaft, the inner ring wall of the first bearing is sealed and connected to the rotating shaft, the outer peripheral wall of the first bearing at one end facing the motor is protruded along the radial direction of the rotating shaft to form a lap joint, and the lap joint is sealed and connected to the first mounting step; the pressure ring is sleeved on the first bearing, and the pressure ring is pressed against the side of the lap joint away from the motor; the fixing ring is sleeved outside the rotating shaft and has a gap between it and the rotating shaft, the fixing ring is at least partially inserted into the first connecting through-hole and is interference fit with the first connecting through-hole, and the fixing ring is pressed against the pressure ring at one end facing the motor.
[0010] Optionally, the second connecting through hole is provided with a second mounting step and a slot, and the plasma enhanced atomic layer deposition equipment further includes a second bearing and a retaining ring, the second bearing is sleeved on the second rotating connecting part, the inner annular wall of the second bearing is sealed with the outer peripheral wall of the second rotating connecting part, the outer annular wall of the second bearing is sealed with the hole wall of the second connecting through hole, and the end of the second rotating connecting part facing away from the motor abuts against the second mounting step; the retaining ring is sleeved on the second rotating connecting part, the retaining ring is clamped in the slot, and the retaining ring presses the end of the second bearing toward the motor.
[0011] Optionally, the cover is detachably connected to the second shell, and one end of the rotating shaft is detachably connected to the powder reaction cylinder.
[0012] Optionally, a first sealing member is provided at the connection between the first shell and the second shell, and / or a second sealing member is provided at the connection between the second shell and the cover.
[0013] Optionally, the plasma generating device includes a microwave source, a dielectric tube and a connecting seat, the microwave source is provided with a microwave resonant cavity, and an antenna is provided in the microwave resonant cavity; the dielectric tube is provided with the plasma generating cavity and a second gas injection hole connected to the plasma generating cavity, the dielectric tube has a closed end and an open end, and the closed end of the dielectric tube extends into the microwave resonant cavity; one end of the connecting seat is connected to the open end of the dielectric tube, and the other end is connected to the powder processing device, and the connecting seat is provided with a connecting hole connecting the plasma generating cavity and the plasma entrance hole.
[0014] Optionally, the plasma generating device further includes a cooling element, which is arranged around the outer peripheral wall of the medium tube.
[0015] In the technical solution of the present invention, the gas inlet hole and the plasma inlet hole are independently connected to the reaction chamber, so that the first process gas does not need to pass through the plasma generating chamber when entering the reaction chamber to avoid the first process gas being ionized. Therefore, a powder processing process can be selected to simultaneously introduce the first process gas and plasma into the reaction chamber to meet the diverse needs of the powder processing process. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic structural diagram of a powder processing device provided by the present invention;
[0017] Figure 2 yes Figure 1 A cross-sectional view of a powder processing device in FIG.
[0018] Figure 3 yes Figure 2 A partial enlarged view of point A in the middle;
[0019] Figure 4 This is a structural schematic diagram of a plasma generating device provided by the present invention;
[0020] Figure 5 yes Figure 4 Cross-sectional view of the plasma generator. DETAILED DESCRIPTION
[0021] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a central component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0022] like Figure 1-Figure 5 As shown, an embodiment of the present invention provides a plasma enhanced atomic layer deposition device, including a plasma generating device 200 and a powder processing device 100, the plasma generating device 200 is provided with a plasma generating chamber 51, the powder processing device 100 is connected to the plasma generating device 200, and a reaction chamber 321 and an air inlet 131, a plasma inlet hole 132, and an exhaust hole 311 respectively connected to the reaction chamber 321 are formed in the powder processing device 100, and the plasma inlet hole 132 is connected to the plasma generating chamber 51.
[0023] In this embodiment, plasma is generated in the plasma generating chamber 51; the plasma inlet hole 132 is used to pass plasma into the reaction chamber 321; the air inlet hole 131 is used to connect with the gas source of the first process gas and pass the first process gas into the reaction chamber 321; the reaction chamber 321 is used to accommodate the powder to be processed; the exhaust hole 311 is used to connect with the air pump, and the air pump extracts the gas after reacting with the powder out of the reaction chamber 321.
[0024] In this embodiment, a first process gas and plasma are introduced into the reaction chamber 321 to perform atomic layer deposition with the powder material, thereby forming a thin film on the surface of the powder material and improving the physical properties of the powder material. To form different thin films on the surface of the powder material, different powder material processing techniques are required, such as introducing the first process gas and plasma into the reaction chamber 321 simultaneously or alternately.
[0025] In this embodiment, the air inlet hole 131 and the plasma inlet hole 132 are independently connected to the reaction chamber 321, so that the first process gas does not need to pass through the plasma generating chamber 51 when entering the reaction chamber 321 to avoid the first process gas being ionized. Therefore, the plasma enhanced atomic layer deposition equipment of this embodiment can simultaneously or alternately introduce the first process gas and plasma into the reaction chamber 321 to meet the diverse needs of the powder processing process.
[0026] In one embodiment, if Figure 1-Figure 2 As shown, the powder processing device 100 includes a housing 10, a motor 20 and a powder processing assembly 30. The housing 10 is connected to the plasma generating device 200. An exhaust chamber 111 and an air inlet chamber 121 are formed in the housing 10 and are sealed with each other. The housing 10 is provided with an air extraction hole 112 communicating with the exhaust chamber 111, the housing 10 is provided with a first air injection hole 122 communicating with the air inlet chamber 121 and the air inlet hole 131, and the housing 10 is provided with the plasma inlet hole 132. The motor 20 is connected to the housing 10. The motor 20 is connected to the housing 10. The machine 20 has an output shaft; the powder processing component 30 is arranged in the outer shell 10, and the reaction chamber 321 is formed in the powder processing component 30. The part of the powder processing component 30 where the reaction chamber 321 is formed is located in the air inlet chamber 121. One end of the powder processing component 30 is connected to the output shaft of the motor 20, and the other end of the powder processing component 30 is rotatably connected to the outer shell 10. The powder processing component 30 is provided with the exhaust hole 311, and the exhaust hole 311 connects the reaction chamber 321 and the exhaust chamber 111.
[0027] Because powder materials, especially nanopowder materials, are prone to agglomeration and adhesion to each other, during atomic layer deposition, as the film thickness grows, adjacent powder particles will stick together. Especially when the powder accumulation is thick, uneven film formation and adhesion are likely to occur, making it difficult to achieve the goal of uniform film formation on the powder surface. Therefore, in this embodiment, the motor 20 drives the powder processing assembly 30 to rotate, so that the reaction chamber 321 is in a rotating state, thereby causing the powder material in the reaction chamber 321 to move continuously, thereby achieving uniform film formation on the powder material surface.
[0028] In this embodiment, first gas injection hole 122 is connected to the gas source of the first process gas. The first process gas is introduced into reaction chamber 321 in this order through first gas injection hole 122, gas inlet chamber 121, and gas inlet hole 131. Plasma is introduced into reaction chamber 321 from the plasma generation chamber through plasma inlet hole 132. Gas extraction hole 112 is connected to an air pump. Gas in reaction chamber 321 is extracted by the air pump in this order through exhaust hole 311, exhaust chamber 111, and gas extraction hole 112. In this embodiment, the gas inlet chamber 121 is vacuumed by the air pump to meet the vacuum requirements of the powder processing process.
[0029] It is understandable that during the powder processing process, it is not desirable for the plasma generator 200 to rotate. In this embodiment, the plasma generator 200 is connected to the housing 10, and the housing 10 is fixed, so the plasma generator 200 will not rotate accordingly.
[0030] In one embodiment, if Figure 1-Figure 3As shown, the housing 10 includes a first shell 11, a second shell 12 and a cover 13, one end of the first shell 11 is connected to the motor 20, the first shell 11 is provided with the exhaust chamber 111, the air extraction hole 112 and the first connecting through-hole 113, one end of the first connecting through-hole 113 is connected to the exhaust chamber 111, and the powder processing assembly 30 is rotatably and sealedly penetrated by the first connecting through-hole 113; one end of the second shell 12 is connected to the first shell 11, the second shell 12 is provided with the air inlet chamber 121 and the first air injection hole 122, the other end of the first connecting through-hole 113 is connected to the air inlet chamber 121 The cover body 13 is connected to the second shell body 12, and the cover body 13 is provided with the plasma entrance hole 132. The cover body 13 protrudes toward the direction of the motor 20 to form a first rotating connection part 133. The first rotating connection part 133 is provided with a second connecting through hole 135 connecting the plasma entrance hole 132 and the reaction chamber 321. The first rotating connection part 133 is provided with the air inlet hole 131 connecting the first connecting through hole 113 and the air inlet chamber 121. The end of the powder processing component 30 facing away from the motor 20 is rotatably and sealingly connected to the second connecting through hole 135 of the first rotating connection part 133.
[0031] In this embodiment, the housing 10 is divided into three parts: the first housing 11 , the second housing 12 and the cover 13 , which are processed and formed separately and then assembled into the housing 10 . This reduces the processing difficulty compared to directly processing the housing 10 .
[0032] In this embodiment, the first connecting hole 113 and the powder processing component 30 are sealed, and gas cannot pass through, so as to ensure the air tightness between the exhaust chamber 111 and the air inlet chamber 121, and will not affect the rotation of the powder processing component 30 relative to the first connecting hole 113, so as to ensure that the rotation function of the powder processing component 30 can operate normally.
[0033] In this embodiment, the second connecting hole 135 and the powder processing assembly 30 are sealed, and gas cannot pass through, so as to ensure the airtightness between the plasma entrance hole 132 and the air inlet cavity 121, and prevent plasma from entering the air inlet cavity 121 and causing plasma leakage.
[0034] In one embodiment, if Figure 1-Figure 3As shown, the powder processing assembly 30 includes a powder reaction barrel 32 and a rotating shaft 31. The powder reaction barrel 32 is located in the air inlet chamber 121. The powder reaction barrel 32 forms the reaction chamber 321. The powder reaction barrel 32 is provided with a second rotating connection portion 322 at one end facing the cover body 13. The second rotating connection portion 322 is rotatably and sealingly inserted into the second connecting through hole 135. The second rotating connection portion 322 is provided with an air vent 323 connecting the reaction chamber 321 and the second connecting through hole 135; one end of the rotating shaft 31 is connected to the powder reaction barrel 32, and the other end is connected to the motor 20. The rotating shaft 31 is rotatably and sealingly passed through the first connecting through hole 113. The rotating shaft 31 is provided with the exhaust hole 311 and a hollow hole 312 connecting the exhaust hole 311 and the exhaust chamber 111. The exhaust hole 311 is axially extended along the rotating shaft 31, and the hollow hole 312 is radially extended along the rotating shaft 31.
[0035] In this embodiment, the motor 20 drives the rotating shaft 31 to rotate, causing the powder reaction cylinder 32 connected to the rotating shaft 31 to rotate, thereby causing the powder in the reaction chamber 321 to continuously move; the gas in the reaction chamber 321 enters the exhaust chamber 111 through the exhaust hole 311 and the hollow hole 312 in sequence.
[0036] In this embodiment, a plurality of hollow holes 312 are provided, and the plurality of hollow holes 312 are arranged in an array along the circumferential direction and the axial direction of the rotating shaft 31 to increase the exhaust area.
[0037] In this embodiment, screens that allow gas to pass but block powder material are provided between the reaction chamber 321 and the exhaust hole 311 and between the reaction chamber 321 and the vent hole 323 to prevent leakage of the powder material.
[0038] In one embodiment, if Figure 1-Figure 3As shown, the first connecting through hole 113 is provided with a first mounting step 114, and the plasma enhanced atomic layer deposition equipment further includes a first bearing 115, a pressure ring 117 and a fixed ring 118. The first bearing 115 is sleeved on the rotating shaft 31, and the inner ring wall of the first bearing 115 is sealed and connected to the rotating shaft 31. The outer peripheral wall of the first bearing 115 facing the end of the motor 20 is protruded along the radial direction of the rotating shaft 31 to form a lap portion 116, and the lap portion 116 is sealed and connected to the first mounting step 114; the pressure ring 117 is sleeved on the first bearing 115, and the pressure ring 117 is pressed against the side of the lap portion 116 away from the motor 20; the fixed ring 118 is sleeved outside the rotating shaft 31 and has a gap between it and the rotating shaft 31, the fixed ring 118 is at least partially inserted into the first connecting through hole 113 and is interference fit with the first connecting through hole 113, and the fixed ring 118 is pressed against the pressure ring 117 toward one end of the motor 20.
[0039] In this embodiment, the first bearing 115 is sealedly connected to the rotating shaft 31, so that gas cannot pass between the first bearing 115 and the rotating shaft 31, and the fixing ring 118 presses the overlapping portion 116 of the first bearing 115 against the first installation step 114 by pressing the pressure ring 117 (at the same time completing the limiting installation of the first bearing 115), so that gas cannot pass between the first bearing 115 and the first connecting through hole 113, thereby ensuring the air tightness between the air intake chamber 121 and the exhaust chamber 111, and preventing the gas in the two chambers from leaking into each other.
[0040] In this embodiment, there are multiple pressure rings 117 , which are stacked axially along the rotating shaft 31 . The pressure rings 117 can be made of rubber material to avoid excessive extrusion stress on the first bearing 115 .
[0041] In one embodiment, if Figure 1-Figure 2 As shown, the second connecting through hole 135 is provided with a second mounting step and a slot, and the plasma enhanced atomic layer deposition equipment also includes a second bearing 134 and a retaining ring. The second bearing 134 is sleeved on the second rotating connection part 322, and the inner ring wall of the second bearing 134 is sealed with the outer peripheral wall of the second rotating connection part 322, and the outer ring wall of the second bearing 134 is sealed with the hole wall of the second connecting through hole 135. The end of the second rotating connection part 322 facing away from the motor 20 abuts against the second mounting step; the retaining ring is sleeved on the second rotating connection part 322, and the retaining ring is clamped in the slot, and the retaining ring presses the second bearing 134 toward one end of the motor 20.
[0042] In this embodiment, the second bearing 134 and the second rotating connection part 322 are sealedly connected so that gas cannot pass between the second bearing 134 and the second rotating connection part 322, and the second bearing 134 and the second connecting through hole 135 are sealedly connected so that gas cannot pass between the second bearing 134 and the second connecting through hole 135, thereby ensuring the air tightness between the air inlet chamber 121 and the plasma entrance hole 132 and preventing gas leakage from each other.
[0043] In this embodiment, the second bearing 134 is pressed against the second installation step by the snap ring to complete the position-limiting installation of the second bearing 134 .
[0044] In one embodiment, if Figure 1-Figure 3 As shown, the cover 13 is detachably connected to the second shell 12 , and one end of the rotating shaft 31 is detachably connected to the powder reaction cylinder 32 .
[0045] In this embodiment, when powder material needs to be put in or taken out, the cover 13 is first removed from the second shell 12, and then the powder reaction cylinder 32 is removed from the rotating shaft 31. The powder reaction cylinder 32 is opened to put in or take out the powder material, and then the powder reaction cylinder 32 is closed, and the powder reaction cylinder 32 is reinstalled on the rotating shaft 31, and then the cover 13 is installed back on the second cover 13.
[0046] In this embodiment, the rotating shaft 31 and the powder reaction cylinder 32 are connected by a key to achieve detachable connection between the rotating shaft 31 and the powder reaction cylinder 32. Of course, in other embodiments, the rotating shaft 31 and the powder reaction cylinder 32 can be connected by other detachable connection structures, which are not limited here.
[0047] In this embodiment, a first fixing member and a second fixing member are provided at the connection between the second housing 12 and the cover 13. A snap is formed on each of the first fixing member and the second fixing member. The snap of the first fixing member abuts against the cover 13, and the snap of the second fixing member abuts against the second housing 12. The first and second fixing members are provided with a common bolt, which is threadedly engaged with the first and second fixing members. By adjusting the bolt, the first and second fixing members can be moved closer to or further away from each other, thereby completing the disassembly of the second housing 12 and the cover 13. Of course, in other embodiments, the connection between the second housing 12 and the cover 13 can be other detachable connection structures, which are not limited here.
[0048] In one embodiment, if Figure 1-Figure 3 As shown, a first sealing member 123 is provided at the connection between the first shell 11 and the second shell 12 , and / or a second sealing member 124 is provided at the connection between the second shell 12 and the cover 13 .
[0049] In this embodiment, the first seal 123 and the second seal 124 are both rubber sealing rings. The first seal 123 is clamped at the connection between the first shell 11 and the second shell 12, and the second seal 124 is clamped at the connection between the second shell 12 and the cover 13. In this embodiment, the provision of the first seal 123 and the second seal 124 ensures the airtightness of the air inlet cavity 121, thereby meeting the vacuum requirement of the air inlet cavity 121.
[0050] In one embodiment, if Figure 4-Figure 5 As shown, the plasma generating device 200 includes a microwave source 40, a dielectric tube 50 and a connecting seat 60. The microwave source 40 is provided with a microwave resonant cavity 41, and an antenna 42 is provided in the microwave resonant cavity 41; the dielectric tube 50 is provided with the plasma generating cavity 51 and a second gas injection hole 52 connected to the plasma generating cavity 51, and the dielectric tube 50 has a closed end and an open end, and the closed end of the dielectric tube 50 extends into the microwave resonant cavity 41; one end of the connecting seat 60 is connected to the open end of the dielectric tube 50, and the other end is connected to the powder processing device 100. The connecting seat 60 is provided with a connecting hole 61 connecting the plasma generating cavity 51 and the plasma entry hole 132.
[0051] In this embodiment, the second gas injection hole 52 is used to introduce the second process gas, the antenna 42 can generate a microwave electric field, and the second process gas is ionized in the plasma generating cavity 51 of the dielectric tube 50 to generate plasma.
[0052] In this embodiment, the end of the antenna 42 is the position where the field strength is the largest. The closed end of the dielectric tube 50 is arranged opposite to the end of the antenna 42 and is located close to the end of the antenna 42 to facilitate the ionization of the second process gas to generate plasma.
[0053] In this embodiment, the cross section of the dielectric tube 50 is annular and the dielectric tube 50 is made of quartz or ceramic material, which is conducive to uniform generation of plasma in the plasma generating chamber 51 .
[0054] In this embodiment, a first flange is formed on one end of the connecting seat 60 facing the powder processing device 100, and a second flange is formed on one end of the cover body 13 of the powder processing device 100 facing the plasma generating device 200. The first flange is connected to the second flange to connect the plasma generating device 200 to the powder processing device 100.
[0055] In one embodiment, if Figure 4-Figure 5 As shown, the plasma generating device 200 further includes a cooling member 70 , which is disposed around the outer peripheral wall of the medium pipe 50 .
[0056] In this embodiment, the cooling element 70 uses liquid cooling to dissipate heat from the dielectric tube 50 to ensure the service life of the plasma generator 200. Specifically, the cooling element 70 includes a cooling cavity and a liquid inlet and outlet communicating with the cooling cavity. The cooling cavity surrounds the dielectric tube 50 and is used to pass coolant into the cooling cavity to dissipate heat from the dielectric tube 50.
[0057] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.
Claims
1. A plasma enhanced atomic layer deposition device, characterized in that: include: A plasma generating device is provided with a plasma generating chamber; as well as, a powder processing device connected to the plasma generating device, wherein a reaction chamber and an air inlet, a plasma inlet, and an exhaust hole respectively connected to the reaction chamber are formed in the powder processing device, and the plasma inlet is connected to the plasma generating chamber; The gas inlet hole is used to introduce the first process gas, and the plasma inlet hole is used to introduce the plasma; The powder processing device comprises: a housing connected to the plasma generating device, wherein an exhaust cavity and an air inlet cavity sealed from each other are formed in the housing, the housing is provided with an air extraction hole communicating with the exhaust cavity, the housing is provided with a first air injection hole communicating with the air inlet cavity and the air inlet hole, and the housing is provided with the plasma inlet hole; a motor connected to the housing, the motor having an output shaft; and a powder processing assembly disposed in the housing, the reaction chamber being formed in the powder processing assembly, the portion of the powder processing assembly where the reaction chamber is formed being located in the air inlet chamber, one end of the powder processing assembly being connected to the output shaft of the motor, the other end of the powder processing assembly being rotatably connected to the housing, the powder processing assembly being provided with the exhaust hole, the exhaust hole communicating with the reaction chamber and the exhaust chamber; The plasma generating device comprises: A microwave source is provided with a microwave resonant cavity, wherein an antenna is provided in the microwave resonant cavity; a dielectric tube, provided with the plasma generating cavity and a second gas injection hole communicating with the plasma generating cavity, the dielectric tube having a closed end and an open end, the closed end of the dielectric tube extending into the microwave resonant cavity; and A connecting seat has one end connected to the open end of the medium tube and the other end connected to the powder processing device. The connecting seat is provided with a connecting hole communicating with the plasma generating chamber and the plasma inlet hole.
2. The plasma enhanced atomic layer deposition apparatus according to claim 1, characterized in that: The housing comprises: a first shell, one end of which is connected to the motor; the first shell is provided with the exhaust cavity, the air extraction hole, and a first connecting through-hole; one end of the first connecting through-hole is connected to the exhaust cavity; the powder processing assembly is rotatably and sealingly passed through the first connecting through-hole; A second shell, one end of which is connected to the first shell, the second shell is provided with the air inlet cavity and the first air injection hole, and the other end of the first connecting through hole is connected to the air inlet cavity; and The cover body is connected to the second shell body, the cover body is provided with the plasma entrance hole, the cover body protrudes toward the direction of the motor to form a first rotating connection part, the first rotating connection part is provided with a second connecting through hole connecting the plasma entrance hole and the reaction chamber, the first rotating connection part is provided with the air inlet hole connecting the first connecting through hole and the air inlet chamber, and the end of the powder processing component facing away from the motor is rotatably and sealingly connected to the second connecting through hole of the first rotating connection part.
3. The plasma enhanced atomic layer deposition apparatus according to claim 2, characterized in that: The powder processing component includes: a powder reaction cylinder located in the air inlet chamber, the powder reaction cylinder forming the reaction chamber, a second rotating connection portion being provided at one end of the powder reaction cylinder facing the cover, the second rotating connection portion being rotatably and sealingly plugged into the second connecting through hole, the second rotating connection portion being provided with an air vent connecting the reaction chamber and the second connecting through hole; and A rotating shaft, one end of which is connected to the powder reaction cylinder, and the other end of which is connected to the motor. The rotating shaft is rotatable and sealingly passes through the first connecting through hole. The rotating shaft is provided with the exhaust hole and a hollow hole connecting the exhaust hole and the exhaust cavity. The exhaust hole is extended axially along the rotating shaft, and the hollow hole is extended radially along the rotating shaft.
4. The plasma enhanced atomic layer deposition apparatus according to claim 3, characterized in that: The first connecting through hole is provided with a first mounting step, and the plasma enhanced atomic layer deposition apparatus further comprises: a first bearing, sleeved on the rotating shaft, the inner ring wall of the first bearing being sealedly connected to the rotating shaft, the outer peripheral wall of one end of the first bearing facing the motor protruding along the radial direction of the rotating shaft to form a lap portion, the lap portion being sealedly connected to the first mounting step; a pressure ring, sleeved on the first bearing, the pressure ring pressing against a side of the overlap portion facing away from the motor; and A fixing ring is sleeved outside the rotating shaft and has a gap between the fixing ring and the rotating shaft. The fixing ring is at least partially inserted into the first connecting through hole and has an interference fit with the first connecting through hole. The fixing ring is pressed against the pressure ring at one end facing the motor.
5. The plasma enhanced atomic layer deposition apparatus according to claim 3, characterized in that: The second connecting through hole is provided with a second mounting step and a slot, and the plasma enhanced atomic layer deposition apparatus further comprises: a second bearing, sleeved on the second rotating connection portion, the inner annular wall of the second bearing being sealedly connected to the outer circumferential wall of the second rotating connection portion, the outer annular wall of the second bearing being sealedly connected to the hole wall of the second connecting through hole, and the end of the second rotating connection portion facing away from the motor being in contact with the second mounting step; and A snap ring is sleeved on the second rotating connection portion, the snap ring is clamped in the clamping groove, and the snap ring presses one end of the second bearing toward the motor.
6. The plasma enhanced atomic layer deposition apparatus according to claim 3, characterized in that: The cover is detachably connected to the second shell, and one end of the rotating shaft is detachably connected to the powder reaction cylinder.
7. The plasma enhanced atomic layer deposition apparatus according to claim 2, characterized in that: A first sealing member is provided at the connection between the first shell and the second shell, and / or a second sealing member is provided at the connection between the second shell and the cover.
8. The plasma enhanced atomic layer deposition apparatus according to claim 1, characterized in that: The plasma generating device further includes a cooling element, which is arranged around the outer peripheral wall of the medium tube.
Citation Information
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