A control system for drying and processing glass fiber mesh for wafer cutting grinding wheels

Abstract

The present invention belongs to the technical field of glass fiber mesh drying control, and specifically discloses a glass fiber mesh drying control system for wafer cutting grinding wheels, comprising: by detecting the wear stress coefficient and mechanical bearing coefficient of the glass fiber mesh after the cutting operation, analyzing the residual stress coefficient of the glass fiber mesh after the wafer cutting operation, reflecting the residual stress state of the glass fiber mesh after the cutting operation; by analyzing the material stability coefficient of each partition on the surface of the glass fiber mesh, combined with the residual stress state after the cutting operation of the glass fiber mesh, evaluating the tolerance drying auxiliary temperature of the glass fiber mesh surface, and determining the corresponding wind temperature of the glass fiber mesh surface drying operation; by calibrating the partition points of each sub-area of ​​the glass fiber mesh, detecting the moisture distribution state of each partition on the surface of the glass fiber mesh, determining the corresponding wind speed at each partition position on the surface of the glass fiber mesh, and achieving a more uniform drying effect.

Description

Technical Field

[0001] The invention belongs to the technical field of glass fiber mesh drying process control and relates to a glass fiber mesh drying process control system for a wafer cutting grinding wheel. Background Art

[0002] With the rapid development of the semiconductor industry, wafer cutting technology has become an indispensable part of the semiconductor manufacturing process. As the basic raw material for manufacturing semiconductor devices, wafers need to go through a series of complex process steps such as crystal pulling and slicing to eventually form a tiny circuit structure, and then through processes such as cutting, packaging, and testing, they become chips widely used in various electronic devices.

[0003] In the wafer cutting process, the grinding wheel is a key tool, and its quality and performance directly affect the cutting efficiency and cutting quality. As an important component of the grinding wheel, the performance stability, heat resistance and wear resistance of the glass fiber mesh have an important impact on the overall performance of the grinding wheel. However, in the manufacturing process of the grinding wheel, the glass fiber mesh often contains a certain amount of moisture after processing, which not only affects the dryness and stability of the grinding wheel, but also generates additional heat and stress during the cutting process, thereby affecting the cutting effect and the service life of the grinding wheel. In order to solve this problem and improve the quality and performance of the wafer cutting grinding wheel, the glass fiber mesh drying and processing control system for wafer cutting grinding wheels came into being.

[0004] Some existing solutions for controlling the drying process of glass fiber mesh still have the following limitations, specifically: 1. When setting data before the drying process, the existing technology is limited to detecting the moisture data on the surface of the glass fiber mesh, and lacks analysis of the residual stress state of the glass fiber mesh. Furthermore, the tolerance temperature of the glass fiber mesh is not analyzed in combination with the residual stress state of the glass fiber mesh, which makes the setting of the drying temperature lack of accuracy.

[0005] 2. The existing technology mostly fixes the air outlet of the drying equipment at a central point of the glass fiber mesh to control the airflow, and does not carry out targeted drying of the moisture on the surface of the glass fiber mesh in different areas. The distribution of the airflow on the surface of the mesh may be uneven. This uneven drying effect will affect the overall quality and performance of the mesh, and then cause the moisture in some areas to be quickly removed, while other areas may still have more moisture remaining, which limits the flexibility and adaptability of the drying equipment. Summary of the invention

[0006] In view of this, in order to solve the problems raised in the above background technology, a control system for drying and processing a glass fiber mesh for a wafer cutting grinding wheel is now proposed.

[0007] The purpose of the present invention can be achieved through the following technical scheme: The present invention provides a glass fiber mesh drying processing control system for wafer cutting grinding wheels, the system comprising: a drying instruction determination module: used to extract the operation times of the drying operation instruction, observe the wetting state of the glass fiber mesh, and then judge and send the drying operation instruction.

[0008] Residual data detection module: used to analyze the residual stress coefficient of the glass fiber mesh after the wafer cutting operation.

[0009] Residual temperature analysis module: used to divide the glass fiber mesh into sub-areas, detect the calorific value temperature of each partition on the surface of the glass fiber mesh, and combine the stress residual coefficient of the glass fiber mesh after the wafer cutting operation , analyze the residual temperature persistence of each partition on the glass fiber mesh surface after wafer cutting operation , Indicates the partition number. .

[0010] Wind temperature control module: used to obtain the material properties of the glass fiber mesh, including the shaping material and the coating material, analyze the material stability coefficient of each partition on the surface of the glass fiber mesh, and determine the tolerable drying temperature of each partition on the surface of the glass fiber mesh based on the corresponding residual temperature persistence of each partition on the surface of the glass fiber mesh after the wafer cutting operation.

[0011] Drying equipment airflow control module: used to identify the moisture distribution of each partition on the surface of the glass fiber mesh and control the airflow distribution of the drying equipment.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention analyzes the residual stress coefficient of the glass fiber mesh after the wafer cutting operation by detecting the wear stress coefficient and the mechanical bearing coefficient of the glass fiber mesh after the wafer cutting operation, thereby evaluating the performance of the glass fiber mesh after the wafer cutting operation, and further reflecting the residual stress state of the glass fiber mesh after the wafer cutting operation.

[0013] (2) The present invention identifies the corresponding mottled scales of each sub-area of ​​the surface wear deformation of the glass fiber mesh, identifies the material property characteristics of the glass fiber mesh, and analyzes the material stability coefficient of each partition on the surface of the glass fiber mesh, which helps to have a more comprehensive understanding of the essential characteristics of the material and provide a scientific basis for evaluating its temperature tolerance. Combined with the residual stress state of the glass fiber mesh after the cutting operation, the surface of the glass fiber mesh is evaluated to withstand the auxiliary drying temperature, and the corresponding wind temperature of the glass fiber mesh surface drying operation is determined accordingly, thereby ensuring the drying effect.

[0014] (3) The present invention calibrates the partition points of each sub-area of ​​the glass fiber mesh and detects the moisture distribution state of each partition on the surface of the glass fiber mesh to determine the corresponding wind speed of each partition position on the surface of the glass fiber mesh, and performs targeted drying in each area, which can ensure that each area on the surface of the mesh is fully dried, avoiding the problems of residual moisture and insufficient drying, thereby achieving a faster and more uniform drying effect, which helps to improve the overall quality and performance of the product. At the same time, the drying parameters can be adjusted according to actual needs by drying in different areas, avoiding unnecessary energy consumption and waste, which helps to reduce production costs and improve economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the connection of the system modules of the present invention.

[0017] Figure 2 It is a schematic diagram of the contents of the drying operation instruction of the present invention. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] See also Figure 1 As shown, the present invention provides a glass fiber mesh drying processing control system for wafer cutting grinding wheels, the system comprising: a drying instruction determination module, a residual data detection module, a residual temperature analysis module, a wind temperature control module, and a drying equipment airflow control module.

[0020] The drying instruction determination module is connected to the residual data detection module, the residual data detection module is connected to the residual temperature analysis module, the residual temperature analysis module is connected to the wind temperature control module, and the wind temperature control module is connected to the drying equipment airflow control module.

[0021] The drying instruction determination module is used to extract the operation times of the drying operation instruction, observe the wetting state of the glass fiber mesh, and then determine and send the drying operation instruction.

[0022] In a preferred embodiment, the drying instruction determination module includes: detecting the moisture content of the gap between the wafer cutting wheel and the glass fiber mesh in real time by infrared spectroscopy, and detecting the residual amount of water droplets on the surface of the glass fiber mesh in real time, and accumulating the corresponding amount of water infiltration of the glass fiber mesh. .

[0023] The infrared spectroscopy is a molecular absorption spectroscopy analysis method that utilizes the characteristic vibration and rotation of material molecules within the infrared spectrum to identify and quantitatively analyze chemical substances. Therefore, by measuring the absorption of infrared light by the glass fiber mesh, the moisture content of the glass fiber mesh can be indirectly inferred.

[0024] Extract the corresponding infiltration water volume of the glass fiber mesh after each cutting operation, obtain the cumulative water volume of the corresponding infiltration water volume of the glass fiber mesh after each cutting operation compared with the corresponding infiltration water volume of the previous time, and calculate the cumulative trend of residual moisture in the glass fiber mesh by average calculation. .

[0025] Analyzing the degree of wetting of glass fiber mesh , where Indicates the preset reference infiltration water volume, It represents a preset reference cumulative trend, and compares the wetness of the glass fiber mesh with the preset wetness threshold corresponding to the drying operation instruction. When it exceeds the preset wetness threshold corresponding to the drying operation instruction, a drying operation instruction is sent to the drying equipment.

[0026] The present invention can accurately grasp the moisture content and the distribution of the impregnating agent of the glass fiber mesh by real-time monitoring of the impregnation state of the glass fiber mesh, and judge whether to send a drying operation instruction accordingly, thereby avoiding drying too early or too late and improving the drying efficiency.

[0027] The residual data detection module is used to analyze the residual stress coefficient of the glass fiber mesh after the wafer cutting operation.

[0028] The number of operations of the drying operation instruction is specifically the total number of cutting operations of the wafer cutting grinding wheel between the current detection time and the last drying operation time.

[0029] In a preferred embodiment, the analysis of the residual stress coefficient of the glass fiber mesh after the wafer cutting operation includes: detecting the surface wear deformation of the glass fiber mesh after each cutting operation, and converting it into the corresponding wear stress coefficient of each cutting operation of the glass fiber mesh. , Indicates the number of cutting operations. .

[0030] Exemplarily, the surface wear deformation refers to deformation types such as scratches, depressions or coating material shedding on the surface. When the surface of the glass fiber mesh is worn and deformed, the material near the deformation area will be squeezed or stretched, resulting in stress concentration, which may cause changes in the microstructure inside the material, such as fiber breakage, matrix damage, etc. Therefore, through the interaction mechanism, the surface wear deformation of the glass fiber mesh after each cutting operation can be converted into the corresponding wear stress of each cutting operation of the glass fiber mesh. The specific conversion method is: the area where there is wear deformation on the surface of the glass fiber mesh is taken as a sub-area, and each sub-area of ​​the surface wear deformation after each cutting operation and its corresponding deformation type are detected, and the corresponding deformation type of each sub-area of ​​the surface wear deformation after each cutting operation is matched with the preset corresponding stress concentration of each deformation type to obtain the corresponding stress concentration of each sub-area of ​​the surface wear deformation after each cutting operation, and obtain the corresponding deformation scale of each sub-area of ​​the surface wear deformation after each cutting operation, and multiply it with the corresponding stress concentration of the corresponding sub-area of ​​the surface wear deformation after the corresponding cutting operation, and accumulate it to obtain the corresponding wear stress coefficient of each cutting operation of the glass fiber mesh.

[0031] Among them, the deformation scales include the corresponding ratio of the scratch length of the scratch deformation type to the preset reference length, the corresponding ratio of the depression area of ​​the depression deformation type to the preset reference area, and the corresponding ratio of the shedding amount of the coating material shedding deformation type to the preset reference shedding amount.

[0032] By detecting the corresponding cutting parameters of each cutting operation of the wafer cutting wheel, the corresponding mechanical bearing coefficient of each cutting operation of the glass fiber mesh is analyzed. .

[0033] Specifically, the mechanical bearing coefficient indicates the stress load borne by the component during operation. The greater the stress load borne by the glass fiber mesh during operation, the greater the stress borne by its internal fiber structure. At this time, if the drying temperature is too high, it may accelerate the release of internal fiber stress, resulting in changes in the fiber structure, and even causing deformation or rupture of the mesh.

[0034] Analysis of residual stress coefficient of glass fiber mesh after wafer dicing operation , Indicates the total number of cutting operations.

[0035] In a further preferred embodiment, the mechanical bearing coefficient corresponding to each cutting operation of the glass fiber mesh is analyzed by installing a stress sensor on the grinding wheel spindle to record the shaft wheel stress of the wafer cutting grinding wheel in real time when it is in use, and then extracting the shaft wheel stress of each cutting operation of the wafer cutting grinding wheel, and comparing it with the preset reference shaft wheel stress to obtain the shaft wheel stress coefficient of each cutting operation of the wafer cutting grinding wheel. .

[0036] Detect the corresponding cutting parameters of each cutting operation of the wafer cutting wheel, including rotation speed, feed speed, and cutting depth, compare them with the preset reference value of the corresponding cutting parameter, and then multiply them with the preset unit cutting parameter indicator corresponding thermal stress to obtain the corresponding thermal stress coefficient of each cutting operation of the wafer cutting wheel .

[0037] Analyze the mechanical bearing coefficients of each cutting operation of the wafer cutting wheel , They represent the preset influence weights of the shaft wheel stress coefficient and thermal stress coefficient respectively. Since the glass fiber mesh is placed at an appropriate position inside or outside the grinding wheel, the glass fiber mesh coincides with the rotation center of the corresponding shaft wheel of the wafer cutting grinding wheel. Based on the stress equivalence principle, the stress load on the wafer cutting grinding wheel is converted into an equivalent stress load on the glass fiber mesh, and the corresponding shaft wheel rotation dispersion compensation of the glass fiber mesh and the wafer cutting grinding wheel is obtained. , calculate the corresponding mechanical bearing coefficients for each cutting operation of the glass fiber mesh .

[0038] In a further preferred embodiment, the corresponding shaft rotation dispersion compensation of the glass fiber mesh and the wafer cutting grinding wheel refers to the difference relationship between the corresponding mechanical bearings of the two components of the glass fiber mesh and the wafer cutting grinding wheel, and the specific acquisition method is: obtain the structural design of the glass fiber mesh and the wafer cutting grinding wheel, extract the difference in performance parameters such as the corresponding elastic modulus and strength limit of the glass fiber mesh and the wafer cutting grinding wheel, compare it with the benchmark difference of the corresponding parameters, and sum to obtain the corresponding shaft rotation dispersion compensation of the glass fiber mesh and the wafer cutting grinding wheel.

[0039] The present invention analyzes the residual stress coefficient of the glass fiber mesh after the wafer cutting operation by detecting the wear stress coefficient and the mechanical bearing coefficient of the glass fiber mesh after the wafer cutting operation. The performance of the glass fiber mesh after the wafer cutting operation, including key indicators such as its strength and toughness, can be evaluated, thereby reflecting the residual stress state of the glass fiber mesh after the wafer cutting operation.

[0040] The residual temperature analysis module is used to divide the glass fiber mesh into sub-areas, detect the calorific value temperature of each sub-area on the surface of the glass fiber mesh, and combine the residual stress coefficient of the glass fiber mesh after the wafer cutting operation. , analyze the residual temperature persistence of each partition on the glass fiber mesh surface after wafer cutting operation , Indicates the partition number. .

[0041] In a preferred embodiment, the analysis of the corresponding residual temperature persistence of each partition on the surface of the glass fiber mesh after the wafer cutting operation includes: obtaining the maximum value from the corresponding deformation scale of each sub-area of ​​the surface wear deformation after each cutting operation as the corresponding mottled scale of each sub-area of ​​the surface wear deformation of the glass fiber mesh, calibrating the partition points of each sub-area of ​​the glass fiber mesh based on the mottled scale, obtaining the corresponding transition points of each partition on the surface of the glass fiber mesh, and then identifying the calorific value temperature of each partition on the surface of the glass fiber mesh by thermal imaging scanning technology to obtain the temperature distribution on the surface of the glass fiber mesh.

[0042] Get the calorific value temperature of each partition on the surface of the glass fiber mesh , combined with the residual stress coefficient of the glass fiber mesh after the wafer cutting operation , analyze the residual temperature persistence of each partition on the glass fiber mesh surface after wafer cutting operation ,in Indicates the preset reference heating value temperature.

[0043] In a further preferred embodiment, the calibrating of the partition points of each sub-region of the glass fiber mesh based on the mottled scale includes: evenly dividing the glass fiber mesh into a plurality of local regions at a fixed interval.

[0044] Obtain each sub-region of wear deformation in each local region of the glass fiber mesh, identify the number of wear deformation sub-regions in each local region of the glass fiber mesh, when the number of wear deformation sub-regions in a local region is 0, mark the center position of the local region as the partition point of the local region; when the number of wear deformation sub-regions in the local region is 1, mark the center position of the wear deformation sub-region in the local region as the partition point of the local region; when the number of wear deformation sub-regions in the local region is greater than 1, obtain the corresponding mottled scale of each sub-region of wear deformation in the local region, compare and select the center position of the sub-region to which the maximum mottled scale belongs is marked as the partition point of the local region.

[0045] Obtain the corresponding partition points of each local area of ​​the glass fiber mesh, and use the partition points as the airflow distribution transition points of the drying equipment, that is, the corresponding transition points of each partition on the surface of the glass fiber mesh.

[0046] See also Figure 2 As shown, the wind temperature control module is used to obtain the material properties of the glass fiber mesh, including shaping materials and coating materials, analyze the material stability coefficient of each partition on the surface of the glass fiber mesh, and determine the tolerable drying temperature of each partition on the surface of the glass fiber mesh based on the corresponding residual temperature persistence of each partition on the surface of the glass fiber mesh after the wafer cutting operation.

[0047] In a preferred embodiment, the corresponding method for analyzing the material stability coefficient of each partition on the surface of the glass fiber mesh is: obtaining the shaping material and coating material of the glass fiber mesh, and then obtaining the thermal conductivity, specific heat capacity and other thermal physical properties of the shaping material, and establishing a thermal conduction model of the glass fiber mesh.

[0048] Through the heat conduction model, the temperature change rate of the glass fiber mesh under different temperature conditions was experimentally recorded, and it was compared with the calorific value temperature of each partition on the surface of the glass fiber mesh to obtain the corresponding temperature change rate of the calorific value temperature of each partition on the surface of the glass fiber mesh. .

[0049] Obtain the properties of the coating material such as adhesion, flexibility and alkali resistance, compare them with the preset reference values ​​of the corresponding property characteristics, and sum them to obtain the temperature tolerance indicator of the coating material .

[0050] Analysis of material stability coefficients of various zones on the surface of glass fiber mesh , e is a natural constant.

[0051] In a further preferred embodiment, the determination of the drying tolerance temperature of the glass fiber mesh is specifically calculated as follows: the drying tolerance auxiliary temperature of each partition on the surface of the glass fiber mesh is calculated. , where It indicates that the preset unit residual stability coefficient can withstand the auxiliary drying temperature.

[0052] The tolerable drying auxiliary temperature of each zone on the surface of the glass fiber mesh is compared with each other to obtain the average difference, which is the corresponding progressive difference of the tolerable drying auxiliary temperature of all zones on the surface of the glass fiber mesh. If the progressive difference exceeds the preset progressive difference threshold, the tolerable drying auxiliary temperature is used as the wind temperature of the drying equipment for each zone of the glass fiber mesh. Otherwise, the corresponding average of the tolerable drying auxiliary temperature of each zone on the surface of the glass fiber mesh is obtained as the fixed wind temperature of the drying equipment for the glass fiber mesh.

[0053] Specifically, the tolerable drying temperature is the wind temperature controlled by the drying equipment. Under the appropriate wind temperature, the glass fiber mesh can more thoroughly remove the internal and external moisture and maintain its good physical and chemical properties; if the wind temperature is too low, the drying effect is not good, which may cause the glass fiber mesh to absorb water, swell or deform during use; if the wind temperature is too high, the fibers may fuse with each other, resulting in increased fiber separation.

[0054] The present invention identifies the corresponding mottled scales of each sub-area of ​​the surface wear deformation of the glass fiber mesh, identifies the material property characteristics of the glass fiber mesh, and analyzes the material stability coefficient of each partition on the surface of the glass fiber mesh, which helps to have a more comprehensive understanding of the essential characteristics of the material, provides a scientific basis for evaluating its temperature tolerance, and combines the residual stress state of the glass fiber mesh after the cutting operation to evaluate the auxiliary drying temperature of the surface of the glass fiber mesh. Based on this, the corresponding wind temperature of the drying operation on the surface of the glass fiber mesh is determined, thereby ensuring the drying effect.

[0055] The drying equipment airflow control module is used to identify the moisture distribution of each partition on the surface of the glass fiber mesh sheet and control the airflow distribution of the drying equipment.

[0056] In a preferred embodiment, the control of the airflow distribution of the drying equipment includes: obtaining corresponding transition points of each partition of the glass fiber mesh surface, and rotating and controlling corresponding air outlets of the drying equipment according to the adjacent order of corresponding transition points of the partitions.

[0057] Detection of moisture distribution in each zone on the surface of glass fiber mesh by infrared spectroscopy The content of each water component type , A number indicating the type of water component. .

[0058] Obtain the preset evaporation points corresponding to each type of moisture component in each partition of the glass fiber mesh surface , determine the corresponding wind speed at each partition position on the surface of the fiberglass mesh , where Indicates the preset unit moisture content coefficient corresponding to the adaptive wind speed, Indicates the preset reference moisture distribution. Indicates the preset The corresponding reference content of each moisture component type, The preset reference evaporation point is represented, and the wind direction distribution path of the drying equipment is obtained, and then the wind speed is changed at each transition point of the wind direction distribution path.

[0059] The present invention calibrates the partition points of each sub-area of ​​the glass fiber mesh and detects the moisture distribution state of each partition on the surface of the glass fiber mesh to determine the corresponding wind speed of each partition position on the surface of the glass fiber mesh, and performs targeted drying in different regions, which can ensure that each area on the surface of the mesh is fully dried, avoid the problems of residual moisture and insufficient drying, and thus achieve a faster and more uniform drying effect, which helps to improve the overall quality and performance of the product. At the same time, the drying parameters can be adjusted according to actual needs by drying in different regions, avoiding unnecessary energy consumption and waste, which helps to reduce production costs and improve economic benefits.

[0060] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. A control system for drying and processing glass fiber mesh for wafer cutting grinding wheels, characterized in that: The system includes: Drying instruction determination module: used to extract the operation times of the drying operation instruction, observe the infiltration state of the glass fiber mesh, and then judge and send the drying operation instruction; Residual data detection module: used to analyze the residual stress coefficient of the glass fiber mesh after the wafer cutting operation; Residual temperature analysis module: used to divide the glass fiber mesh into sub-areas, detect the calorific value temperature of each partition on the surface of the glass fiber mesh, and combine the stress residual coefficient of the glass fiber mesh after the wafer cutting operation , analyze the residual temperature persistence of each partition on the glass fiber mesh surface after wafer cutting operation , Indicates the partition number. ; Wind temperature control module: used to obtain the material properties of the glass fiber mesh, including the shaping material and the coating material, analyze the material stability coefficient of each partition on the surface of the glass fiber mesh, and determine the tolerable drying temperature of each partition on the surface of the glass fiber mesh based on the corresponding residual temperature persistence of each partition on the surface of the glass fiber mesh after the wafer cutting operation; Drying equipment airflow control module: used to identify the moisture distribution of each partition on the surface of the glass fiber mesh and control the airflow distribution of the drying equipment; The analysis of the residual stress coefficient of the glass fiber mesh after the wafer cutting operation includes: Detect the surface wear deformation of the glass fiber mesh after each cutting operation and convert it into the corresponding wear stress coefficient of each cutting operation of the glass fiber mesh , Indicates the number of cutting operations. ; By detecting the corresponding cutting parameters of each cutting operation of the wafer cutting wheel, the corresponding mechanical bearing coefficient of each cutting operation of the glass fiber mesh is analyzed. ; Analysis of residual stress coefficient of glass fiber mesh after wafer dicing operation , Indicates the total number of cutting operations; The analysis of the residual temperature persistence of each partition on the surface of the glass fiber mesh after the wafer cutting operation includes: Identify the corresponding mottled scale of each sub-area of ​​the surface wear deformation of the glass fiber mesh, calibrate the partition points of each sub-area of ​​the glass fiber mesh based on the mottled scale, obtain the corresponding transition points of each partition on the surface of the glass fiber mesh, and then identify the thermal value temperature of each partition on the surface of the glass fiber mesh through thermal imaging scanning technology; Get the calorific value temperature of each partition on the surface of the glass fiber mesh , combined with the residual stress coefficient of the glass fiber mesh after the wafer cutting operation , analyze the residual temperature persistence of each partition on the glass fiber mesh surface after wafer cutting operation ,in Indicates the preset reference heating value temperature.

2. A control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 1, characterized in that: The drying instruction determination module includes: The moisture content in the gap between the wafer cutting wheel and the glass fiber mesh is detected in real time by infrared spectroscopy, and the residual water droplets on the surface of the glass fiber mesh are detected in real time, and the corresponding infiltration water volume of the glass fiber mesh is accumulated; Extract the corresponding infiltration water volume of the glass fiber mesh after each cutting operation, obtain the cumulative water volume of the corresponding infiltration water volume of the glass fiber mesh after each cutting operation compared with the corresponding infiltration water volume of the previous time, and calculate the average value to obtain the cumulative trend of residual moisture in the glass fiber mesh; The infiltration degree of the glass fiber mesh is analyzed and compared with the preset infiltration degree threshold value corresponding to the drying operation instruction. When it exceeds the preset infiltration degree threshold value corresponding to the drying operation instruction, a drying operation instruction is sent to the drying equipment.

3. A control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 1, characterized in that: The analysis method for analyzing the corresponding mechanical bearing coefficients of each cutting operation of the glass fiber mesh is as follows: A stress sensor is installed on the grinding wheel spindle to record the shaft wheel stress of the wafer cutting grinding wheel in real time when it is in use, and then the shaft wheel stress of each cutting operation of the wafer cutting grinding wheel is extracted, and the shaft wheel stress coefficient of each cutting operation of the wafer cutting grinding wheel is obtained by comparing it with the preset reference shaft wheel stress; Detecting the corresponding cutting parameters of each cutting operation of the wafer cutting grinding wheel, and obtaining the corresponding thermal stress coefficient of each cutting operation of the wafer cutting grinding wheel; Based on the above coefficients, the corresponding mechanical bearing coefficients of each cutting operation of the wafer cutting wheel are analyzed. , obtain the corresponding shaft wheel rotation dispersion compensation of glass fiber mesh and wafer cutting wheel , calculate the corresponding mechanical bearing coefficients for each cutting operation of the glass fiber mesh .

4. A control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 3, characterized in that: The glass fiber mesh and the wafer cutting grinding wheel corresponding shaft wheel rotation dispersion compensation are specifically obtained by obtaining the structural design of the glass fiber mesh and the wafer cutting grinding wheel, extracting the difference in corresponding performance parameters of the glass fiber mesh and the wafer cutting grinding wheel, comparing it with the benchmark difference of the corresponding parameters, and summing them to obtain the glass fiber mesh and the wafer cutting grinding wheel corresponding shaft wheel rotation dispersion compensation.

5. The control system for drying and processing a glass fiber mesh for wafer cutting grinding wheels according to claim 1, characterized in that: The partition points of each sub-area of ​​the glass fiber mesh are calibrated based on the mottled scale, including: The glass fiber mesh is evenly divided into several local areas at fixed intervals; Obtain each sub-region of wear deformation in each local region of the glass fiber mesh, identify the number of wear deformation sub-regions in each local region of the glass fiber mesh, and when the number of wear deformation sub-regions in a local region is 0, mark the central position of the local region as the partition point of the local region; when the number of wear deformation sub-regions in the local region is 1, mark the central position of the wear deformation sub-region in the local region as the partition point of the local region; when the number of wear deformation sub-regions in the local region is greater than 1, obtain the corresponding mottled scale of each sub-region of wear deformation in the local region, compare and select the central position of the sub-region to which the maximum mottled scale belongs to be marked as the partition point of the local region; Obtain the corresponding partition points of each local area of ​​the glass fiber mesh, and use the partition points as the airflow distribution transition points of the drying equipment, that is, the corresponding transition points of each partition on the surface of the glass fiber mesh.

6. A control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 1, characterized in that: The corresponding method for analyzing the material stability coefficient of each partition on the surface of the glass fiber mesh is: Obtain the shaping material and coating material of the glass fiber mesh, and then obtain the thermophysical properties of the shaping material, and establish a thermal conduction model of the glass fiber mesh; Through the heat conduction model, the temperature change rate of the glass fiber mesh under different temperature conditions was experimentally recorded, and compared with the calorific value temperature of each partition on the surface of the glass fiber mesh, the corresponding temperature change rate of the calorific value temperature of each partition on the surface of the glass fiber mesh was obtained; Obtain the property characteristics of the coating material, obtain the temperature tolerance indication of the coating material, and then analyze the material stability coefficient of each partition on the surface of the glass fiber mesh .

7. A control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 6, characterized in that: The specific calculation method for determining the drying temperature tolerance of each partition on the surface of the glass fiber mesh is: Calculate the drying temperature of each zone on the surface of the glass fiber mesh , where Indicates the preset unit residual stability coefficient corresponding to the tolerance drying auxiliary temperature; The corresponding progressive difference of the tolerable drying auxiliary temperature of all partitions on the surface of the glass fiber mesh is obtained. If the progressive difference exceeds the preset progressive difference threshold, the tolerable drying auxiliary temperature is used as the wind temperature of the drying equipment for each partition of the glass fiber mesh. Otherwise, the corresponding average of the tolerable drying auxiliary temperature of each partition on the surface of the glass fiber mesh is obtained as the fixed wind temperature of the drying equipment for the glass fiber mesh.

8. The control system for drying and treating glass fiber mesh for wafer cutting grinding wheel according to claim 5, characterized in that: The control of air flow distribution of the drying equipment includes: Obtain corresponding transition points of each partition on the surface of the glass fiber mesh sheet, and perform rotation control on corresponding air outlets of the drying equipment according to the adjacent order of corresponding transition points of the partitions; Detection of moisture distribution in each zone on the surface of glass fiber mesh by infrared spectroscopy The content of each water component type , A number indicating the type of water component. ; Obtain the preset evaporation points corresponding to each type of moisture component in each partition of the glass fiber mesh surface , determine the corresponding wind speed at each partition position on the surface of the fiberglass mesh , where Indicates the preset unit moisture content coefficient corresponding to the adaptive wind speed, Indicates the preset reference moisture distribution. Indicates the preset The corresponding reference content of each moisture component type, It represents the preset reference evaporation point, and e is a natural constant.

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