Ball holding type structure test seat

Abstract

The invention provides a ball-holding type structure test seat, which is characterized in that a connecting terminal is of a Y-shaped structure, the upper end of the connecting terminal is forked to form two elastic buckling sheets, the opposite surfaces of the upper ends of the elastic buckling sheets are of arc-shaped structures, and an upper cover is provided with arrayed limiting holes corresponding to the elastic buckling sheets; the elastic buckling piece penetrates through the limiting hole, the upper cover drives the two arc-shaped structures of the connecting terminal to be separated or buckled through the limiting hole in the downward pressing or upward bouncing process, and the two arc-shaped structures are tightly attached to and electrically connected with a welding tin ball of the chip to be tested. The technical problems that in the prior art, a connecting terminal is prone to fatigue in the long-term repeated downward pressing process, and electric contact cannot be formed between the connecting terminal and a welding tin ball when the elastic force is insufficient are solved.

Description

Technical Field

[0001] The invention relates to the technical field of chip testing, and in particular to a press-down test socket for chip testing. Background Art

[0002] Integrated circuit chips are the core of hardware circuits of various electronic products. During the chip processing and production process and after processing, the chips need to be tested for various performance and chip quality. For automated chip testing equipment, the chip test socket is a key component for placing, fixing and electrically connecting the chip to be tested. How to reliably and stably connect the test equipment to the chip to be tested is a key technology in this field.

[0003] The patent document with announcement number CN217931942U discloses a push-down test socket for chip testing, including an upper cover and a base. The upper cover is arranged as a square frame structure with upper and lower openings. The upper cover and the base are connected by sliding up and down. The upper side of the base is provided with a mounting groove aligned with the opening of the upper cover. A probe assembly is installed in the mounting groove. The base is rotatably connected with fasteners for pressing the chip on the upper side of the probe assembly at opposite sides of the mounting groove. The rotation of the fasteners is driven by the upper and lower movement of the upper cover. An active cavity is arranged in the probe assembly. A stamped spring needle is installed in the active cavity. The upper and lower ends of the stamped spring needle pass through the active cavity through the upper connecting hole and the lower connecting hole respectively, and are placed above and below the probe assembly. The middle part of the upper end of the stamped spring needle is recessed downward to form a claw head.

[0004] In the above scheme, the claw of the stamped spring needle is electrically connected to the solder ball of the chip to be tested, which improves the stability of the connection to a certain extent. However, there is a problem: the stamped spring needle forms an elastic force through the curved portion in the middle, so that the claw at the upper end does not bring a strong impact force when it contacts the solder ball. However, there is a problem that the curved portion in the middle of the stamped spring needle is prone to fatigue during long-term repeated pressure. When the elastic force is insufficient, the stamped spring needle cannot form electrical contact with the solder ball. On the other hand, each claw and each solder ball need to be accurately aligned to achieve a good electrical connection. Since the chip test socket itself is very small, it is limited by the processing accuracy of the chip test socket itself, and the alignment of the claw and the solder ball is prone to deviation, which affects the stability of the electrical connection. Summary of the invention

[0005] In order to solve the above-mentioned technical problems existing in the prior art, the present invention provides a ball-holding structure test socket with higher stability.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: The present invention provides a ball-holding structure test socket, comprising an upper cover, a base, a plurality of arrays of connection terminals, and a fixing mechanism for fixing a chip to be tested, wherein the upper cover and the base are connected by sliding up and down, the lower end of the connection terminal is fixed in the base and the lower top end thereof is electrically connected to a test device, the connection terminal is a Y-shaped structure, the upper end of the connection terminal is forked to form two elastic buckling pieces, the opposite surface of the upper end of the elastic buckling piece is an arc-shaped structure, the upper cover is provided with an array of limiting holes corresponding to the elastic buckling piece, and the upper cover drives the two arc-shaped structures of the connection terminal to be separated or buckled through the limiting holes during the process of pressing down or springing up, and the two arc-shaped structures are tightly attached to and electrically connected to the solder balls of the chip to be tested.

[0007] Specifically, the upper cover is square in shape as a whole, the limiting hole is a rectangular hole, and the long side of the limiting hole is arranged obliquely to the straight side of the upper cover.

[0008] Specifically, the long side of the limiting hole is arranged at an angle of 45 degrees to the straight side of the upper cover.

[0009] Specifically, the fixing mechanism includes two fasteners, the front end of the fastener is a fixing part, the middle part has a rotating shaft, and the rear end is a pressing part. The fastener is fixed in the base through the rotating shaft. The fixing part is used to fix the chip to be tested. The upper cover has a lower pressing plate. After the lower pressing plate moves downward with the upper cover, it contacts the pressing part and causes the fixing part to open.

[0010] Specifically, a guide groove is provided on the side of the base, and a guide sheet is provided on the side of the upper cover, and the guide sheet is embedded in the guide groove.

[0011] Specifically, the base is composed of an upper shell and a lower shell, and the upper shell and the lower shell are combined to form a receiving cavity for receiving the fastener, the connecting terminal and the chip to be tested.

[0012] Specifically, a return spring is arranged between the upper cover and the base.

[0013] The beneficial effects of the present invention are as follows: the present invention makes the connecting terminal into a Y-shaped structure, the upper end of the connecting terminal is forked to form two elastic buckling pieces, the opposite surface of the upper end of the elastic buckling piece is an arc-shaped structure, the upper cover is provided with an array of limiting holes corresponding to the elastic buckling piece, the elastic buckling piece passes through the limiting hole, and the upper cover drives the two arc-shaped structures of the connecting terminal to separate or buckle through the limiting hole during the pressing down or springing up process, and the two arc-shaped structures are tightly attached to and electrically connected with the solder balls of the chip to be tested. The technical problem that the connecting terminal in the prior art is prone to fatigue during long-term repeated pressing, and the insufficient elastic force will lead to the inability to form electrical contact with the solder balls is overcome. On the other hand, the two arc-shaped structures of the connecting terminal and the solder balls are mutually buckled in the connection contact mode, which makes it easier to achieve accurate alignment, thereby ensuring good electrical connection, and overcomes the disadvantage that the alignment of the claw head and the solder ball in the prior art is prone to deviation, thereby affecting the stability of the electrical connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 This is a first-view overall structural diagram of a ball-holding structure test stand according to an embodiment; Figure 2 This is a second perspective overall structural diagram of the ball-holding structure test stand of the embodiment; Figure 3 This is a first-person perspective structural exploded view of a ball-holding structure test socket in an embodiment; Figure 4 This is a structural exploded view of the ball-holding structure test socket of the embodiment from a second viewing angle; Figure 5 It is the connection terminal structure diagram; Figure 6 is a combined structural diagram of a connection terminal and a solder ball of an embodiment; Figure 7 is a structural diagram of a fastener of an embodiment; In the figure: 1. upper cover; 11. limiting hole; 12. lower pressing plate; 13. guide plate; 2. base; 21. guide groove; 22. upper shell; 23. lower shell; 3. connecting terminal; 31. arc-shaped structure; 4. chip to be tested; 41. solder ball; 5. movable plate; 6. fastener; 61 fixing part; 62. rotating shaft; 63 pressing part, 7. reset spring. DETAILED DESCRIPTION

[0015] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0016] The overall structure diagram of the ball-holding structure test stand of this embodiment from the first perspective is shown in the attached Figure 1 , the overall structure diagram of the second perspective is shown in the attached Figure 2 , see the attached diagram for the first-person perspective structural decomposition. Figure 3 , the second perspective structural decomposition diagram is shown in the attached Figure 4 , see the attached diagram of the connection terminal structure. Figure 5 For the structural cross-sectional view of the ball-holding structure test seat, see the attached Figure 6 , specifically including an upper cover 1, a base 2, a plurality of arrays of connection terminals 3, and a fixing mechanism for fixing a chip to be tested 4. The upper cover 1 and the base 2 are connected by sliding up and down, the lower end of the connection terminal 3 is fixed in the base 2 and the lower top thereof is electrically connected to the test equipment, the connection terminal 3 is a Y-shaped structure, the upper end of the connection terminal 3 is forked to form two elastic buckling pieces, the opposite surface of the upper end of the elastic buckling piece is an arc-shaped structure 31, the upper cover 1 is provided with an array of limiting holes 11 corresponding to the elastic buckling piece, the upper cover 1 drives the two arc-shaped structures 31 of the connection terminal 3 to separate or buckle through the limiting holes 11 during the process of pressing down or springing up, and the two arc-shaped structures 31 are tightly attached to and electrically connected to the solder balls 41 of the chip to be tested 4 In this embodiment, the upper cover 1 and the base 2 are of a square frame structure, and the elastic buckle piece passes through the limiting hole 11. During the upper and lower movement of the upper cover 1, the two arc-shaped structures 31 of the connecting terminal 3 are driven to separate or buckle through the limiting hole 11. The limiting hole 11 is rectangular, and the long side of the limiting hole 11 is at a 45-degree angle with the straight side of the upper cover 1. The advantage of setting the 45-degree angle is that since the chip to be tested is very small and the volume of the solder ball is also very small, the processing accuracy of the internal components of the ball-holding structure test seat is very high. Compared with moving in the same direction along the straight side of the upper cover 1, the long side of the limiting hole 11 is at a 45-degree angle with the straight side of the upper cover 1, which can increase the movement stroke of the limiting hole and the elastic buckle piece, reduce the processing accuracy, and thus improve the stability and yield rate.

[0017] In this embodiment, the fixing mechanism includes two fasteners 6. The structural diagram of the fasteners is shown in the attached Figure 7 The front end of the fastener 6 is a fixed part 61, the middle part has a rotating shaft 62, and the rear end is a pressing part 63. The fastener 6 is fixed in the base 2 through the rotating shaft 62. The fixing part 63 is used to fix the chip to be tested 4. The upper cover 1 has a lower pressing piece 12. After the lower pressing piece 12 moves downward with the upper cover 1, it contacts the pressing part 63 and opens the fixing part 63. As a specific embodiment, a torsion spring (not shown in the figure) is arranged on the outside of the rotating shaft 62. When the upper cover 1 moves upward under the action of the reset spring 7, the fixing part 63 closes under the action of the torsion spring and then fixes the chip to be tested 4 in the base.

[0018] In this embodiment, a guide groove 21 is provided on the side of the base 2, and a guide piece 13 is provided on the side of the upper cover 1, and the guide piece 13 is embedded in the guide groove 21. The arrangement of the guide piece 13 and the guide groove 21 can improve the stability and fatigue resistance of the upper cover 1 when repeatedly pressed down, and prevent dislocation.

[0019] In this embodiment, the base 2 is composed of an upper shell 22 and a lower shell 23, which are combined to form a receiving cavity for receiving the fastener 6, the connecting terminal 3 and the chip to be tested 4. Specifically, four reset springs 7 are arranged at the four corners between the upper cover 1 and the base 2 to realize the reset of the upper cover 1 after being pressed down.

[0020] The working principle of the test socket of this embodiment is as follows: first, the upper cover 1 is pressed down by a manipulator or manual operation, and the lower pressing piece 12 thereof contacts the pressing part 63 of the fastener 6. After the pressing part 63 is pressed down, the fixing part 61 is driven to open, and the chip to be tested 4 is placed on the top of the movable plate 2. At the same time, the upper cover 1 drives the elastic snap-fitting piece of the connecting terminal 3 to open through the movement of the limiting hole 11 during the pressing process. After the chip to be tested 4 is placed, the upper cover 1 is reset under the action of the reset spring 7, and the elastic snap-fitting piece is reset after the limiting hole 11 rises. The two arc-shaped structures 31 of the elastic snap-fitting piece are snapped and tightly fitted with the soldering tin ball 41 of the chip to be tested 4 to achieve electrical connection. Compared with the method of the prior art that the top of the connecting terminal moves upward to contact the soldering tin ball, the method of snapping the soldering tin ball from the side of this embodiment is more stable. Through the limiting of the limiting hole 11, the connecting terminal and the soldering tin ball are not easily misaligned.

[0021] The beneficial effects of the present invention are as follows: the present invention makes the connecting terminal into a Y-shaped structure, the upper end of the connecting terminal is forked to form two elastic buckling pieces, the opposite surface of the upper end of the elastic buckling piece is an arc-shaped structure, the upper cover is provided with an array of limiting holes corresponding to the elastic buckling piece, the elastic buckling piece passes through the limiting hole, and the upper cover drives the two arc-shaped structures of the connecting terminal to separate or buckle through the limiting hole during the pressing down or springing up process, and the two arc-shaped structures are tightly attached to and electrically connected with the solder balls of the chip to be tested. The technical problem that the connecting terminal in the prior art is prone to fatigue during long-term repeated pressing, and the insufficient elastic force will lead to the inability to form electrical contact with the solder balls is overcome. On the other hand, the two arc-shaped structures of the connecting terminal and the solder balls are mutually buckled in the connection contact mode, which makes it easier to achieve accurate alignment, thereby ensuring good electrical connection, and overcomes the disadvantage that the alignment of the claw head and the solder ball in the prior art is prone to deviation, thereby affecting the stability of the electrical connection.

[0022] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A ball-holding structure test socket, comprising an upper cover (1), a base (2), a plurality of arrays of connection terminals (3), and a fixing mechanism for fixing a chip to be tested (4), wherein the upper cover (1) and the base (2) are connected by sliding up and down, the lower end of the connection terminal (3) is fixed in the base (2) and the lower top end thereof is electrically connected to a test device, and is characterized in that: The connecting terminal (3) is a Y-shaped structure, the upper end of the connecting terminal (3) is forked to form two elastic buckling pieces, the opposite surface of the upper end of the elastic buckling piece is an arc-shaped structure (31), the upper cover (1) is provided with an array of limiting holes (11) corresponding to the elastic buckling piece, the elastic buckling piece passes through the limiting holes (11), and the upper cover (1) drives the two arc-shaped structures (31) of the connecting terminal (3) to separate or buckle through the limiting holes (11) during the process of pressing down or springing up, and the two arc-shaped structures (31) are tightly attached to and electrically connected to the solder balls (41) of the chip to be tested (4).

2. The ball-holding structure test seat according to claim 1, characterized in that: The upper cover (1) is square in shape as a whole, the limiting hole (11) is a rectangular hole, and the long side of the limiting hole (11) is arranged obliquely with the straight side of the upper cover (1).

3. The ball-holding structure test seat according to claim 2, characterized in that: The long side of the limiting hole (11) is arranged at an angle of 45 degrees to the straight side of the upper cover (1).

4. A ball-holding structure test socket according to any one of claims 1 to 3, characterized in that: The fixing mechanism comprises two fasteners (6), the front end of the fastener (6) being a fixing portion (61), the middle portion being provided with a rotating shaft (62), and the rear end being a pressing portion (63), the fastener (6) being fixed in the base (2) via the rotating shaft (62), the fixing portion (61) being used to fix the chip to be tested (4), and the upper cover (1) being provided with a lower pressing plate (12), the lower pressing plate (12) abutting against the pressing portion (63) after the upper cover (1) moves downward and causes the fixing portion (61) to open.

5. A ball-holding structure test socket according to any one of claims 1 to 3, characterized in that: A guide groove (21) is provided on the side of the base (2), and a guide sheet (13) is provided on the side of the upper cover (1), wherein the guide sheet (13) is nested in the guide groove (21).

6. A ball-holding structure test socket according to any one of claims 1 to 3, characterized in that: The base (2) is composed of an upper shell and a lower shell, and the upper shell and the lower shell are combined to form a receiving cavity for receiving the fastener (6), the connecting terminal (3) and the chip to be tested (4).

7. A ball-holding structure test socket according to any one of claims 1 to 3, characterized in that: A return spring is provided between the upper cover (1) and the base (2).

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